A silicon photonics module packaging device

Abstract

This invention relates to the field of optoelectronic module packaging technology, specifically a silicon photonics module packaging device. A transparent sealing cover is mounted on a base, forming a sealed cavity with the base. The material suction assembly includes a suction bracket, a rotating disk, a material suction nozzle, and a driving mechanism. The lifting assembly includes a lifting box, a multi-layer material trough, and a lifting mechanism for driving the material trough's movement. A feeding trough for the multi-layer material trough's entry and exit is installed at the bottom of the lifting box. The packaging working assembly includes a pair of opposing constant-temperature extrusion tables, a positioning plate, a top packaging mechanism, and a packaging adjustment plate. A driving component is connected to the bottom of the constant-temperature extrusion tables. The top packaging mechanism includes a lifting mechanism and a packaging plate, with a pressure sensor on the packaging surface of the packaging plate. The lifting assembly, the material suction assembly, and the packaging working assembly are linked by signals. This application achieves automated collaborative operation, overcoming the shortcomings of traditional step-by-step operation modes and significantly improving the accuracy, reliability, and production efficiency of silicon photonics module packaging.

Description

Technical Field

[0001] This application relates to the field of optoelectronic module packaging technology, and in particular to a silicon photonics module packaging device. Background Technology

[0002] Silicon-based optoelectronics (Silicon Photonics), which integrates multiple optical devices onto a single silicon substrate, is a photonic integrated circuit that achieves optical signal transmission and processing through the deep integration of silicon semiconductor technology and optical communication technology. Compared with traditional integrated circuits, silicon photonic modules have advantages such as high transmission rate, low power consumption, and high integration, and have become core components in high-speed communication, data centers, and other fields. The packaging quality of silicon photonics modules directly determines their optical performance, reliability, and lifespan, placing stringent requirements on environmental cleanliness, positioning accuracy, temperature and pressure control, and automation coordination during the packaging process. Currently, mainstream packaging equipment, such as the optoelectronic module production and processing packaging equipment disclosed in patent CN119730516A, while achieving basic lifting, material feeding, and packaging functions, still employs a traditional step-by-step operation mode. This makes it difficult to meet the high-precision packaging requirements of silicon photonics modules and exhibits the following key technical defects.

[0003] Existing silicon photonics module packaging equipment suffers from several problems, including a lack of environmental control, insufficient transfer and positioning accuracy, poor material supply continuity and stability, defects in packaging process control, and low levels of system coordination and automation. Specifically, the open processing environment easily leads to oxidation of optical devices and defects at the packaging interface; poor adsorption force and positioning control of the material suction component; insufficient precision in the matching of single-layer or multi-layer material supply structures and a lack of heat dissipation design; uncontrollable packaging temperature and pressure and poor versatility of the positioning plate; and no linkage feedback between the independent actions of each component. These problems prevent existing equipment from meeting the requirements of high precision, high reliability, and large-scale production of silicon photonics modules. The technical solution corresponding to the claims of this invention aims to specifically solve the above problems, achieve sealed environmental protection, high-precision collaborative operation, and multi-specification adaptation, and break through the key bottlenecks in the promotion and application of silicon photonics technology. Summary of the Invention

[0004] In order to overcome the problems of insufficient environmental control, low transfer and feeding accuracy, defects in packaging process, and weak system coordination of various components in existing silicon photonics module packaging equipment, this application provides a silicon photonics module packaging device.

[0005] The silicon photonics module packaging device provided in this application adopts the following technical solution: A silicon photonics module packaging device includes a base and a lifting assembly, a material suction assembly, and a packaging working assembly integrated on the base. A transparent sealing cover is fitted onto the base, and the transparent sealing cover has a nitrogen purging port. The sealing cover and the base form a sealed cavity. The material suction assembly includes a material suction bracket, a rotating disk, at least four sets of material suction nozzles symmetrically arranged circumferentially along the rotating disk, and a drive mechanism for the material suction bracket along a Z-axis. The shaft lifting drive mechanism; the lifting assembly includes a lifting box, a multi-layer material trough inside the box, and a lifting mechanism for driving the material trough to lift and lower. The bottom of the lifting box is equipped with a feeding trough for the multi-layer material trough to enter and exit, and both ends of the feeding trough are equipped with sealed transfer windows communicating with the outside; the packaging working assembly includes a pair of opposing constant-temperature extrusion tables, a positioning plate positioned between the pair of constant-temperature extrusion tables for receiving and packaging silicon photonic modules, a top packaging mechanism, and a packaging adjustment plate; the bottom of the constant-temperature extrusion tables is connected to a drive component that drives them to move closer to each other; the top packaging mechanism includes a lifting mechanism and a packaging plate, wherein a pressure sensor is provided on the packaging surface of the packaging plate; the lifting assembly, the material suction assembly, and the packaging working assembly are linked by signals to achieve fully automated operation of silicon photonic module material handling, transfer, and packaging.

[0006] Furthermore, the adsorption end face of the material suction nozzle is provided with a porous ceramic structure, the suction nozzle is connected to the vacuum pump through a pipe, and a vacuum filter is connected in series on the pipe between the vacuum pump and the air pressure precision regulating valve.

[0007] Furthermore, the multi-layer material trough of the lifting assembly is driven to rise and fall within the lifting housing by a lifting mechanism; the multi-layer material trough moves within the feeding trough by a feeding mechanism, and both the feeding trough and the lifting housing have sliding grooves on their sides that are adapted to the sliders on both sides of the multi-layer material trough. The lifting mechanism includes a cylinder and a lifting connector mounted on the free end of the cylinder output shaft. The lifting connector is located within the trough at the bottom of the feeding trough, and its top surface is flush with the bottom surface of the feeding trough. The lifting connector includes an annular cavity and connecting clips that penetrate the annular cavity. The connecting clips are arranged in a circumferential array at the free end of the cylinder output shaft, and the connecting clips rise and fall through the annular cavity and can be adapted to the connecting clip slots at the bottom of the multi-layer material trough.

[0008] Furthermore, the feeding mechanism includes mounting slots on both sides of the bottom along the length of the feeding trough. A screw mechanism is installed in the mounting slot, wherein the top of the screw in the screw mechanism is higher than the top opening of the mounting slot. The two ends of the screw are rotatably connected to the bearing seats, and the screw is driven by a servo motor. The screw is threadedly engaged with the arc-shaped threaded grooves distributed along the length of the feeding trough on the bottom surface of the multi-layer material trough. The rotation of the screw can drive the multi-layer material trough to move along the feeding trough.

[0009] Furthermore, the drive mechanism includes a sleeve that passes through the suction bracket and is fixedly connected to the rotating disk. The outer surface of the portion of the sleeve located below the base has a gear surface. The sleeve is driven to rotate by a rotary motor of the base. The output shaft of a lifting cylinder is fitted inside the bottom opening of the sleeve. The material suction nozzle on the rotating disk is installed at the output end of an adjusting cylinder, which can drive the material suction nozzle to rise and fall on the rotating disk.

[0010] Furthermore, the encapsulation plate is connected to the buffer plate via a buffer rod and a buffer spring mounted on the buffer rod. The output end of the lifting mechanism is fixedly mounted on the buffer plate. The positioning plate includes a center plate and a first set of plates, a second set of plates, and a third set of plates that are sequentially mounted on the outer ring of the center plate with decreasing thickness. Two sets of symmetrically arranged encapsulation adjustment plates with stepped tops are installed at the bottom of the positioning plate. The adjustment plates adjust the outer diameter of the center plate under the action of the driving component. The driving component includes a bracket and a first motor and a second motor mounted on the bracket. The output end of the first motor passes through two sets of threaded sleeves inside the constant temperature extrusion table via a first lead screw, and the output end of the second motor passes through symmetrically distributed threaded sleeves of the encapsulation adjustment plates via a second lead screw.

[0011] In summary, this application includes at least one of the following beneficial technical effects: This application sets up a transparent sealing cover with a nitrogen purging interface to form a sealed cavity with the base, which effectively isolates the outside air, avoids oxidation of optical devices and defects at the packaging interface, and ensures the cleanliness of the packaging environment. The material suction assembly in this application uses at least four sets of material suction nozzles arranged circumferentially, combined with an adsorption end face with a porous ceramic structure, a vacuum filter and a precision pressure regulating valve, a sleeve for driving the rotation and lifting of the rotating disk, a rotary motor and a lifting cylinder, and an adjusting cylinder for adjusting the lifting of the material suction nozzles, to achieve precise control of adsorption force and positioning. The lifting assembly in this application adopts a multi-layer material trough structure, combined with a feeding trough with a sealed transfer window, a screw-driven feeding mechanism, and a cylinder-driven lifting connector. This ensures the continuity and stability of the material supply, maintains a sealed cavity environment through the sealed transfer window, and improves the accuracy of the material trough movement through the cooperation of the chute and the slider. The packaging assembly in this application uses a packaging board with a pressure sensor, a buffer structure with a buffer spring and a buffer rod, and a constant temperature extrusion table to achieve precise control of packaging temperature and pressure. The positioning plate adopts a combination structure of a center plate and multi-specification sleeves, combined with a packaging adjustment plate and a lead screw drive component, which can be adapted to different specifications of silicon photonics module packaging, thus improving versatility. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a silicon photonics module packaging device; Figure 2This is a schematic diagram of a silicon photonics module packaging device with the transparent sealing cover removed; Figure 3 yes Figure 2 Enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the explosion of a multi-layer material tank and a lifting mechanism in a silicon photonics module packaging device. Figure 5 yes Figure 4 Enlarged view at point B in the middle; Figure 6 This is a schematic diagram of the specific structure connecting the multi-layer material trough and the lifting mechanism. Figure 7 yes Figure 2 A schematic diagram of the structure on the other side; Figure 8 yes Figure 7 Enlarged view at point C; Figure 9 yes Figure 2 A schematic diagram of the top side structure; Figure 10 yes Figure 9 Enlarged view of point D in the middle.

[0013] Explanation of reference numerals in the attached drawings: 1. Base; 2. Lifting assembly; 21. Lifting box; 22. Multi-layer material trough; 221. Slider; 222. Slide groove; 223. Arc-shaped threaded groove; 23. Lifting mechanism; 231. Lifting connector; 2311. Annular cavity; 2312. Connecting clip; 2313. Connecting slot; 24. Feeding trough; 25. Sealed transfer window; 26. Feeding mechanism; 261. Mounting slot; 262. Screw mechanism; 2611. Screw; 2612. Bearing seat; 2613. Servo motor; 3. Suction assembly; 31. Suction bracket; 32. Rotary disk; 33. Material suction nozzle; 34. Drive mechanism; 341. Sleeve; 342. Rotary motor; 3 43. Lifting cylinder; 35. Vacuum pump; 36. Precision pressure regulating valve; 37. Vacuum filter; 4. Encapsulation working components; 41. Constant temperature extrusion table; 42. Positioning plate; 421. Center plate; 422. First set plate; 423. Second set plate; 424. Third set plate; 43. Top encapsulation mechanism; 431. Lifting mechanism; 432. Encapsulation plate; 4321. Buffer rod; 4322. Buffer plate; 4323. Buffer spring; 44. Encapsulation adjustment plate; 45. Drive component; 451. Bracket; 452. First motor; 4521. First lead screw; 453. Second motor; 4531. Second lead screw; 5. Transparent sealing cover; 51. Nitrogen purging interface. Detailed Implementation

[0014] The following is in conjunction with the appendix Figure 1-10 This application will be described in further detail.

[0015] This application discloses a silicon photonics module packaging device.

[0016] Reference Figures 1 to 10 A silicon photonics module packaging device includes a base 1 and a lifting assembly 2, a material suction assembly 3, and a packaging working assembly 4 integrated on the base 1. A transparent sealing cover 5 is mounted on the base 1, and the transparent sealing cover 5 has a nitrogen purging port 51. The sealing cover and the base 1 form a sealed cavity. The material suction assembly 3 includes a material suction bracket 31, a rotating disk 32, at least four sets of material suction nozzles 33 symmetrically arranged circumferentially along the rotating disk 32, and a drive mechanism for the material suction bracket 31 along a Z-axis. The shaft lifting drive mechanism 34; the lifting assembly 2 includes a lifting box 21, a multi-layer material trough 22 disposed inside the box, and a lifting mechanism 23 for driving the material trough to lift. The bottom of the lifting box 21 is equipped with a feeding trough 24 for the multi-layer material trough 22 to enter and exit. Both ends of the feeding trough 24 are provided with sealed transfer windows 25 communicating with the outside; the packaging working assembly 4 includes a pair of opposing constant temperature extrusion tables 41, a positioning plate 42 disposed between the pair of constant temperature extrusion tables 41 for receiving and packaging silicon photonic modules, a top packaging mechanism 43, and a packaging adjustment plate 44; the bottom of the constant temperature extrusion tables 41 is connected to a drive component 45 for driving them to move closer to each other; the top packaging mechanism 43 includes a lifting mechanism 431 and a packaging plate 432, wherein a pressure sensor is provided on the packaging surface of the packaging plate 432; the lifting assembly 2, the suction assembly 3, and the packaging working assembly 4 are linked by signals to realize the fully automated operation of silicon photonic module material picking, transfer, and packaging. During operation, nitrogen gas is first introduced into the sealed cavity formed by the transparent sealing cover 5 and the base 1 to create a clean and oxygen-free environment. The silicon photonics module to be packaged is fed into the lifting component 2 through the sealed transfer windows 25 at both ends of the feeding trough 24. The lifting mechanism 23 drives the multi-layer material trough 22 to rise to the designated position. After the feeding mechanism 26 drives the multi-layer material trough 22 to move to the material picking position, the driving mechanism 34 of the suction component 3 drives the rotating disk 32 to descend. The circumferentially symmetrically arranged material suction nozzles 33 adsorb the silicon photonics module. Then, the driving mechanism 34 drives the rotating disk 32 to rotate and transfer the material to the positioning plate 42 of the packaging working component 4. Subsequently, the constant temperature extrusion table 41 clamps the material under the action of the driving component 45. The packaging plate 432 of the top packaging mechanism 43 presses down to complete the packaging. Throughout the process, the three major components of lifting, suction and packaging are linked to realize the fully automated operation of silicon photonics module picking, transfer and packaging.

[0017] Reference Figures 1 to 10The material suction nozzle 33 has a porous ceramic structure on its adsorption end face. The nozzle is connected to the vacuum pump 35 through a pipe, and a vacuum filter 37 is connected in series on the pipe between the vacuum pump 35 and the air pressure precision regulating valve 36. During operation, when a silicon photonic module needs to be adsorbed, the vacuum pump 35 is started. After the airflow is filtered by the vacuum filter 37, the adsorption pressure is precisely regulated by the air pressure precision regulating valve 36. Then, the gas flows through the pipe to the material suction nozzle 33. The porous ceramic structure on the adsorption end face of the nozzle generates a uniform and stable adsorption force, thereby achieving precise and non-destructive adsorption of the silicon photonic module.

[0018] Reference Figures 1 to 10 The multi-layer material trough 22 of the lifting assembly 2 is driven to rise and fall in the lifting box 21 by the lifting mechanism 23; the multi-layer material trough 22 is driven to move in the feeding trough 24 by the feeding mechanism 26. The sides of the feeding trough 24 and the lifting box 21 are provided with sliding grooves 222 that are adapted to the sliders 221 on both sides of the multi-layer material trough 22. The lifting mechanism 23 includes a cylinder and a lifting connector 231 installed at the free end of the cylinder output shaft. The lifting connector 231 is located in the groove at the bottom of the feeding trough 24, and the top surface of the lifting connector 231 is flush with the bottom surface of the feeding trough 24. The lifting connector 231 includes an annular cavity 2311 and a connecting clip 2312 that penetrates the annular cavity 2311. The connecting clips 2312 are arranged in a circumferential array at the free end of the cylinder output shaft. The connecting clips 2312 rise and fall through the annular cavity 2311 and can be adapted to the connecting clip slot 2313 at the bottom of the multi-layer material trough 22. When the height of the multi-layer material trough 22 needs to be adjusted, the cylinder drive output shaft of the lifting mechanism 23 rises, driving the lifting connector 231 to rise synchronously, so that the connecting clips 2312 of the circumferential array are precisely matched with the connecting slots 2313 at the bottom of the multi-layer material trough 22, thereby pulling the multi-layer material trough 22 to rise and fall smoothly along the slide grooves 222 on the side of the lifting box 21; when the multi-layer material trough 22 needs to be transferred to the feeding trough 24, the connecting clips 2312 disengage from the connecting slots 2313, and the multi-layer material trough 22 slides along the slide grooves 222 on the side of the feeding trough 24 through the sliders 221 on both sides, realizing the smooth transfer of the material trough between the lifting box 21 and the feeding trough 24.

[0019] Reference Figures 1 to 10The feeding mechanism 26 includes mounting slots 261 on both sides of the bottom along the length of the feeding trough 24. A lead screw mechanism 262 is installed in the mounting slots 261. The top of the lead screw 2611 in the lead screw mechanism 262 is higher than the top opening of the mounting slot 261. The two ends of the lead screw 2611 are rotatably connected to the bearing seats 2612. The lead screw 2611 is driven by a servo motor 2613. The lead screw 2611 is threadedly engaged with the arc-shaped threaded grooves 223 distributed along the length of the feeding trough 24 on the bottom surface of the multi-layer material trough 22. The rotation of the lead screw 2611 can drive the multi-layer material trough 22 to move along the feeding trough 24. When it is necessary to drive the multi-layer material trough 22 to move along the feeding trough 24, the servo motor 2613 starts and drives the lead screw 2611 to rotate on the bearing seat 2612. Since the lead screw 2611 is threadedly engaged with the arc-shaped threaded groove 223 on the bottom surface of the multi-layer material trough 22, and the top of the lead screw 2611 is higher than the opening of the mounting groove 261, the rotational motion of the lead screw 2611 is converted into the linear motion of the multi-layer material trough 22 along the length direction of the feeding trough 24, thereby accurately driving the material trough to the designated material picking position.

[0020] Reference Figures 1 to 10 The drive mechanism 34 includes a sleeve 341 that passes through the suction bracket 31 and is fixedly connected to the rotating disk 32. The outer surface of the portion of the sleeve 341 located below the base 1 is provided with a gear surface. The sleeve 341 is driven to rotate by a rotary motor 342 of the base 1. The output shaft of a lifting cylinder 343 is fitted inside the bottom opening of the sleeve 341. The material suction nozzle 33 on the rotating disk 32 is installed at the output end of an adjusting cylinder, which can drive the material suction nozzle 33 to rise and fall on the rotating disk 32. When it is necessary to transfer the silicon photonics module, the lifting cylinder 343 drives the sleeve 341 to rise and fall along the Z-axis, causing the suction bracket 31 and the rotating disk 32 to rise and fall synchronously to a specified height. The adjusting cylinder drives the material suction nozzle 33 to make fine-tuning adjustments to the height to accurately align the material. After the suction is completed, the rotary motor 342 drives the sleeve 341 with the gear surface to rotate, thereby driving the rotating disk 32 to rotate, realizing the precise transfer of material between the picking position and the packaging position.

[0021] Reference Figures 1 to 10The encapsulation plate 432 passes through the buffer plate 4322 via the buffer rod 4321 and is connected to the buffer plate 4322 via the buffer spring 4323 fitted on the buffer rod 4321. The output end of the lifting mechanism 431 is fixedly installed on the buffer plate 4322. The positioning plate 42 includes a center plate 421 and a first set of plates 422, a second set of plates 423, and a third set of plates 424 that are sequentially fitted around the outer ring of the center plate 421 with decreasing thickness. Two sets of symmetrically arranged encapsulation adjustment plates 44 with stepped tops are installed at the bottom of the positioning plate 42. The adjustment plates adjust the outer diameter of the center plate 421 under the action of the driving component 45. The driving component 45 includes a bracket 451 and a first motor 452 and a second motor 453 mounted on the bracket 451. The output end of the first motor 452 passes through the thread sleeves in the two sets of constant temperature extrusion tables 41 via the first lead screw 4521. The output end of the second motor 453 passes through the thread sleeves of the symmetrically distributed encapsulation adjustment plates 44 via the second lead screw 4531. During the encapsulation process, the lifting mechanism 431 drives the buffer plate 4322 to descend, and the buffer spring 4323 on the buffer rod 4321 provides buffering and shock absorption for the encapsulation plate 432. The pressure sensor monitors the encapsulation pressure in real time. At the same time, the second motor 453 drives the second lead screw 4531 to rotate, which moves the encapsulation adjustment plate 44 and adjusts the outer diameter of the center plate 421 of the positioning plate 42 to accommodate silicon photonics modules of different specifications. The first motor 452 drives the first lead screw 4521 to rotate, which moves a pair of constant temperature extrusion tables 41 closer to each other to achieve stable clamping of the silicon photonics module and ensure encapsulation accuracy.

[0022] Working Principle: This silicon photonics module packaging device forms a sealed cavity with a transparent sealing cover 5 and a base 1 through a nitrogen purging interface 51, effectively isolating external air, preventing oxidation of photonic devices and defects at the packaging interface, and ensuring the cleanliness of the packaging environment. The material suction component 3 uses at least four sets of material suction nozzles 33 arranged circumferentially, combined with an adsorption end face with a porous ceramic structure, a vacuum filter 37, and a precision pressure regulating valve 36. Combined with a sleeve 341 that drives the rotating disk 32 to rotate and lift, a rotary motor 342, and a lifting cylinder 343, as well as an adjusting cylinder for adjusting the lifting of the material suction nozzles 33, it achieves precise control of adsorption force and positioning. The lifting component 2 adopts a multi-layer material trough 22 structure, combined with a feeding trough 24 with a sealed transfer window 25, a feeding mechanism 26 driven by a lead screw 2611, and a lifting connector 231 driven by a cylinder. This ensures both the continuity and stability of the material supply, and also allows for the smooth flow of material through the sealed transfer window 25. Maintaining a sealed cavity environment, the cooperation between the slide 222 and the slider 221 improves the accuracy of the material tray movement. The packaging working component 4 adopts a buffer structure with a packaging plate 432 with a pressure sensor, a buffer spring 4323, and a buffer rod 4321, combined with a constant temperature extrusion table 41, to achieve precise control of packaging temperature and pressure. The positioning plate 42 adopts a combination structure of a center plate 421 and multi-specification sleeve plates, combined with the packaging adjustment plate 44 and the drive component 45 driven by the lead screw 2611, which can be adapted to different specifications of silicon photonics module packaging, improving versatility. In addition, the signal linkage design of the lifting component 2, the suction component 3, and the packaging working component 4 realizes the fully automated collaborative operation of silicon photonics module picking, transfer, and packaging, effectively solving the defects of the traditional step-by-step operation mode, and greatly improving the accuracy, reliability, and production efficiency of silicon photonics module packaging, meeting its high-precision, high-reliability, and large-scale production requirements.

[0023] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A silicon photonics module packaging device, characterized in that, Includes a base (1) and a lifting assembly (2), a suction assembly (3) and a packaging assembly (4) integrated on the base (1). The base (1) is covered with a transparent sealing cover (5), which is provided with a nitrogen purging port (51). The transparent sealing cover (5) and the base (1) form a sealed cavity. The material suction assembly (3) includes a material suction bracket (31), a rotating disk (32), at least four sets of material suction nozzles (33) arranged symmetrically around the rotating disk (32), and a drive mechanism (34) for driving the material suction bracket (31) to rise and fall along the Z-axis. The lifting assembly (2) includes a lifting box (21), a multi-layer material trough (22) disposed inside the box, and a lifting mechanism (23) for driving the material trough to rise and fall. The bottom of the lifting box (21) is equipped with a feeding trough (24) for the multi-layer material trough (22) to enter and exit. Both ends of the feeding trough (24) are provided with sealed transfer windows (25) communicating with the outside. The encapsulation assembly (4) includes a pair of opposing thermostatic extrusion tables (41), a positioning plate (42) disposed between the pair of thermostatic extrusion tables (41) for receiving the encapsulated silicon photonic module, a top encapsulation mechanism (43), and an encapsulation adjustment plate (44); the bottom of the thermostatic extrusion tables (41) is connected to a driving component (45) that drives them to move closer to each other. The top packaging mechanism (43) includes a lifting mechanism (431) and a packaging plate (432), wherein a pressure sensor is provided on the packaging surface of the packaging plate (432); the lifting component (2), the suction component (3) and the packaging working component (4) are linked by signals to realize the fully automated operation of silicon photonics module material picking, transfer and packaging.

2. The silicon photonics module packaging device according to claim 1, characterized in that: The material suction nozzle (33) has a porous ceramic structure on its adsorption end face. The material suction nozzle (33) is connected to the vacuum pump (35) through a pipe. A vacuum filter (37) is also connected in series on the pipe between the vacuum pump (35) and the air pressure precision regulating valve (36).

3. The silicon photonics module packaging device according to claim 1, characterized in that: The multi-layer material trough (22) of the lifting assembly (2) is driven to rise and fall in the lifting box (21) by the lifting mechanism (23); the multi-layer material trough (22) is driven to move in the feeding trough (24) by the feeding mechanism (26); the feeding trough (24) and the lifting box (21) are both provided with sliding grooves (222) that are adapted to the sliders (221) on both sides of the multi-layer material trough (22).

4. The silicon photonics module packaging device according to claim 3, characterized in that: The lifting mechanism (23) includes a cylinder and a lifting connector (231) installed at the free end of the cylinder output shaft. The lifting connector (231) is located in the groove at the bottom of the feeding trough (24), and the top surface of the lifting connector (231) is flush with the bottom surface of the feeding trough (24). The lifting connector (231) includes an annular cavity (2311) and a connecting clip (2312) that penetrates the annular cavity (2311). The connecting clip (2312) is arranged in a circumferential array at the free end of the cylinder output shaft. The connecting clip (2312) moves up and down through the annular cavity (2311) and can be adapted to the connecting slot (2313) at the bottom of the multi-layer material trough (22).

5. The silicon photonics module packaging device according to claim 3, characterized in that: The feeding mechanism (26) includes mounting slots (261) opened on both sides of the bottom along the length of the feeding groove (24). A screw mechanism (262) is installed in the mounting slot (261). The top of the screw (2611) in the screw mechanism (262) is higher than the top opening of the mounting slot (261). The two ends of the screw (2611) are rotatably connected to the bearing seat (2612). The screw (2611) is driven by a servo motor (2613). The screw (2611) is threadedly engaged with the arc-shaped threaded groove (223) distributed along the length of the feeding groove (24) on the bottom surface of the multi-layer material trough (22). The rotation of the screw (2611) can drive the multi-layer material trough (22) to move along the feeding groove (24).

6. The silicon photonics module packaging device according to claim 1, characterized in that: The drive mechanism (34) includes a sleeve (341) that is fixedly connected to the suction bracket (31) and the rotating disk (32). The outer surface of the sleeve (341) located below the base (1) is provided with a gear surface. The sleeve (341) is driven to rotate by the rotating motor (342) of the base (1). The output shaft of the lifting cylinder (343) is installed inside the bottom opening of the sleeve (341).

7. The silicon photonics module packaging device according to claim 6, characterized in that: The material suction nozzle (33) on the rotating disk (32) is installed at the output end of the regulating cylinder (321), which can drive the material suction nozzle (33) to rise and fall on the rotating disk (32).

8. The silicon photonics module packaging device according to claim 1, characterized in that: The encapsulation plate (432) passes through the buffer plate (4322) via the buffer rod (4321) and is connected to the buffer plate (4322) via the buffer spring (4323) fitted on the buffer rod (4321). The output end of the lifting mechanism (431) is fixedly installed on the buffer plate (4322).

9. The silicon photonics module packaging device according to claim 8, characterized in that: The positioning plate (42) includes a center plate (421) and a first set of plates (422), a second set of plates (423) and a third set of plates (424) that are sequentially fitted around the outer ring of the center plate (421) with decreasing thickness. Two sets of symmetrically arranged encapsulation adjustment plates (44) with steps on the top are installed at the bottom of the positioning plate (42). The adjustment plates adjust the outer diameter of the center plate (421) under the action of the driving component (45).

10. The silicon photonics module packaging device according to claim 9, characterized in that: The drive component (45) includes a bracket (451) and a first motor (452) and a second motor (453) mounted on the bracket (451). The output end of the first motor (452) passes through the thread sleeves in two sets of constant temperature extrusion tables (41) through the first lead screw (4521), and the output end of the second motor (453) passes through the thread sleeves of the symmetrically distributed packaging adjustment plates (44) through the second lead screw (4531).

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