electronic devices

Abstract

This application provides an electronic device including a housing and fins. The housing includes a bottom shell, a top shell, and a sidewall connecting the bottom shell and the top shell, which together form a receiving cavity. The bottom shell has an internal cavity containing a liquid wick containing a heat-absorbing and evaporable liquid cooling medium. Fins are disposed within the receiving cavity and connected to the bottom shell for heat conduction. A heat-dissipating component is disposed within the receiving cavity and in contact with the bottom shell for heat conduction, transferring heat to the fins through the bottom shell. The heat from the heat-dissipating component is transferred to the bottom shell, where the liquid wick absorbs the heat, causing the liquid cooling medium to evaporate into a gas and diffuse within the cavity. Upon encountering the cooler cavity wall, the gas condenses back into a liquid, releasing heat, and then flows back under the action of the liquid wick, completing the cycle and transferring the heat from the heat-dissipating component to the fins for dissipation. This reduces the space occupied by the heat dissipation structure, contributing to the thinner and lighter design of the electronic device.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] In laptops, components such as the central processing unit and graphics processing unit generate a lot of heat when running under high load, and heat dissipation is required to ensure stable operation of the device.

[0003] In related technologies, a cooling module is typically installed inside a laptop computer. This module includes heat pipes, heat sink fins, and a cooling fan. The two ends of the heat pipes are connected to the heat-generating components and the heat sink fins, respectively. The cooling fan drives airflow across the heat sink fins, thereby dissipating heat from the laptop.

[0004] However, as laptops become thinner and lighter, internal space is constantly shrinking, requiring cooling modules to be smaller to fit within the limited space. This results in poor heat dissipation under high loads. Therefore, how to achieve both thinner and lighter designs while maintaining effective heat dissipation has become a technical problem that needs to be solved. Summary of the Invention

[0005] This application provides an electronic device that can achieve a thinner and lighter design while ensuring effective heat dissipation.

[0006] This application provides an electronic device, including:

[0007] The shell includes a bottom shell, a top shell, and side walls connecting the bottom shell and the top shell. The bottom shell, top shell, and side walls together enclose a receiving cavity.

[0008] The bottom shell has a cavity inside, and the cavity contains a liquid wick, which contains a heat-absorbing and evaporable liquid cooling medium.

[0009] Fins are disposed within the receiving cavity and connected to the bottom shell to conduct heat with the bottom shell;

[0010] The heat dissipation component is located inside the receiving cavity and is in contact with the bottom shell to conduct heat with the bottom shell, and the heat is conducted to the fins through the bottom shell.

[0011] In one possible implementation, the cavity is provided with a liquid-absorbing core at the position corresponding to the communication path between the heat-dissipating component and the fins.

[0012] In one possible implementation, the bottom shell includes a bottom plate and a top plate, with the top plate disposed on the bottom plate and together with the bottom plate forming a cavity;

[0013] The heat dissipation component is located on the side of the top plate away from the bottom plate, and the liquid absorption core is located on at least the side of the top plate facing the bottom plate.

[0014] In one possible implementation, the top plate is made of a thermally conductive material, and the bottom plate is made of a non-thermally conductive material.

[0015] In one possible implementation, the electronic device further includes a cooling fan disposed within the receiving cavity, and the cooling fan having an air inlet and a first air outlet.

[0016] The ventilation opening and the first heat dissipation opening are provided. The ventilation opening is located on the bottom shell, and the first heat dissipation opening is located on the side wall. The air inlet is connected to the ventilation opening, and the first air outlet is connected to the first heat dissipation opening.

[0017] The fin includes a first fin, which is located on the connecting path between the first air outlet and the first heat dissipation port and conducts heat with the bottom shell.

[0018] In one possible implementation, there are two cooling fans, and the bottom shell has two vents, with the air inlets of the two cooling fans connected to one of the vents respectively.

[0019] The first air outlets of the two cooling fans are connected to the same first heat dissipation port, or the side wall is provided with a first heat dissipation port at the position corresponding to the two first air outlets.

[0020] In one possible implementation, a first fin is provided on each of the paths connecting the two first air outlets and the first heat dissipation port.

[0021] In one possible implementation, the two first fins are connected to each other, or the two first fins are spaced apart within the receiving cavity.

[0022] In one possible implementation, the liquid-absorbing core includes a first liquid-absorbing part and a second liquid-absorbing part. The first liquid-absorbing part is arranged around the periphery of one of the cooling fans, and the second liquid-absorbing part is arranged around the periphery of the other cooling fan. The second liquid-absorbing part and the first liquid-absorbing part are interconnected between the two cooling fans to form a circulating liquid-absorbing structure.

[0023] The heat dissipation component is located at the connection point between the first liquid absorption section and the second liquid absorption section.

[0024] In one possible implementation, the fins further include a second fin, the second fin and the first fin are disposed on different sides of the cooling fan, and the cooling fan further includes a second air outlet;

[0025] The sidewall has a second heat dissipation vent at the position corresponding to the second fin, and the second heat dissipation vent is connected to the second air outlet.

[0026] In one possible implementation, the vent is located on the bottom shell opposite the air inlet and is not connected to the cavity.

[0027] In one possible implementation, the bottom shell has a groove at the location of the cooling fan, and at least part of the cooling fan is disposed in the groove.

[0028] The electronic device provided in this application includes a housing and fins. The housing includes a bottom shell, a top shell, and a sidewall connecting the bottom shell and the top shell. The bottom shell, top shell, and sidewall together form a receiving cavity. The bottom shell has an internal cavity containing a liquid wick with a heat-absorbing and evaporable liquid cooling medium. The fins are disposed within the receiving cavity and connected to the bottom shell for heat conduction. The heat-dissipating component is disposed within the receiving cavity and in contact with the bottom shell for heat conduction, transferring heat to the fins through the bottom shell.

[0029] The heat generated by the heat-dissipating component during operation is transferred to the bottom shell. The wick absorbs the heat, causing the internal liquid cooling medium to evaporate into a gas. This gas diffuses within the cavity, condenses back into liquid upon encountering the cooler cavity walls, releasing heat, and then flows back under the action of the wick, completing the cycle. This phase change process transfers the heat from the heat-dissipating component to the fins for dissipation. This method of heat transfer and dispersion via the shell and fins, compared to a separate heat dissipation module within the electronic device, eliminates the need for installation space and gaps between the heat-dissipating component and the bottom shell. This reduces the overall space occupied by the heat dissipation structure in the thickness direction of the electronic device, thus ensuring effective heat dissipation while contributing to a thinner and lighter electronic device. Attached Figure Description

[0030] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0031] Figure 1 An assembly diagram of the housing and cooling fan provided in an embodiment of this application;

[0032] Figure 2 This is a schematic diagram of the structure of the main body of the electronic device provided in the embodiments of this application;

[0033] Figure 3 This is an assembly diagram of the cooling fan and fins provided in Embodiment 1 of this application;

[0034] Figure 4 This is an assembly diagram of the cooling fan and fins provided in Embodiment 2 of this application;

[0035] Figure 5 This is an assembly diagram of the cooling fan and fins provided in Embodiment 3 of this application;

[0036] Figure 6 This is an assembly diagram of the cooling fan and fins provided in Embodiment 4 of this application;

[0037] Figure 7 This is an assembly diagram of the cooling fan and fins provided in Embodiment 5 of this application;

[0038] Figure 8 This is an assembly diagram of the cooling fan and fins provided in Embodiment Six of this application;

[0039] Figure 9 for Figure 2 Schematic diagram of the bottom of the middle shell;

[0040] Figure 10 This is a schematic diagram of the liquid suction core provided in Embodiment 7 of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 1-Shell; 11-Bottom shell; 111-Bottom plate; 112-Top plate; 113-Cavity; 114-Ventilation opening; 12-Side wall; 121-Second heat dissipation opening; 13-Top shell; 14-Receiving cavity; 15-Groove;

[0043] 2-Liquid suction core; 21-First liquid suction section; 22-Second liquid suction section;

[0044] 3-Fin; 31-First fin; 32-Second fin;

[0045] 4-Components to be cooled;

[0046] 5-Cooling fan; 51-First air outlet.

[0047] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0049] In laptops, components such as the central processing unit and graphics processing unit generate a lot of heat when running under high load, and heat dissipation is required to ensure stable operation of the device.

[0050] In related technologies, a cooling module is typically installed inside a laptop computer. This module includes heat pipes, heat sink fins, and a cooling fan. The two ends of the heat pipes are connected to the heat-generating components and the heat sink fins, respectively. The cooling fan drives airflow across the heat sink fins, thereby dissipating heat from the laptop.

[0051] However, as laptops become thinner and lighter, internal space is constantly shrinking, requiring cooling modules to be smaller to fit within the limited space. This results in poor heat dissipation under high loads. Therefore, how to achieve both thinner and lighter designs while maintaining effective heat dissipation has become a technical problem that needs to be solved.

[0052] In view of this, embodiments of this application provide an electronic device, including a housing and fins. The housing includes a bottom shell, a top shell, and a sidewall connecting the bottom shell and the top shell, the bottom shell, the top shell, and the sidewall together forming a receiving cavity. The bottom shell has a cavity inside, and a liquid wick is located within the cavity, containing a heat-absorbing and evaporable liquid cooling medium. The fins are disposed within the receiving cavity and connected to the bottom shell for heat conduction with the bottom shell. A heat-dissipating component is disposed within the receiving cavity and contacts the bottom shell for heat conduction with the bottom shell, transferring heat to the fins through the bottom shell.

[0053] The heat generated by the heat-dissipating component during operation is transferred to the bottom shell. The wick absorbs the heat, causing the internal liquid cooling medium to evaporate into a gas. This gas diffuses within the cavity, condenses back into liquid upon encountering the cooler cavity walls, releasing heat, and then flows back under the action of the wick, completing the cycle. This phase change process transfers the heat from the heat-dissipating component to the fins for dissipation. This method of heat transfer and dispersion via the shell and fins, compared to a separate heat dissipation module within the electronic device, eliminates the need for installation space and gaps between the heat-dissipating component and the bottom shell. This reduces the overall space occupied by the heat dissipation structure in the thickness direction of the electronic device, thus ensuring effective heat dissipation while contributing to a thinner and lighter electronic device.

[0054] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0055] Please refer to Figures 1 to 10This embodiment provides an electronic device, including a housing 1 and fins 3. The housing 1 includes a bottom shell 11, a top shell 13, and a side wall 12 connecting the bottom shell 11 and the top shell 13. The bottom shell 11, top shell 13, and side wall 12 together form a receiving cavity 14. The bottom shell 11 has a cavity 113, and the cavity 113 has a liquid wick 2 containing a heat-absorbing and evaporable liquid cooling medium. The heat dissipation component 4 is disposed in the receiving cavity 14 to conduct heat with the bottom shell 11, thereby transferring heat to the bottom shell 11. At the same time, the fins 3 are disposed in the receiving cavity 14 and contact the bottom shell 11 to conduct heat with the bottom shell 11, thereby transferring heat from the bottom shell 11 to the fins 3.

[0056] The liquid cooling medium can be water, alcohols, ketones, or fluorinated liquids, which have low boiling points and high latent heat of vaporization. The liquid wick 2 has a porous capillary structure and can be composed of sintered metal powder, metal mesh, grooves, or sintered fibers. The interior of the liquid wick 2 has interconnected micropores.

[0057] Specifically, the liquid wick 2 is attached to the inner wall surface of the cavity 113. The micropores inside the liquid wick 2 adsorb and retain the liquid cooling medium through capillary action. When the heat dissipation component 4 generates heat, the heat is transferred from the heat dissipation component 4 to the bottom shell 11 through thermal conduction, and further transferred to the cavity wall area where the liquid wick 2 is located opposite the position of the heat dissipation component 4.

[0058] It is understood that the heat-dissipating component 4 is mounted on the bottom shell 11, which is located below the heat-dissipating component 4. Therefore, the cavity wall region with the liquid-absorbing core 2, which is located opposite to the heat-dissipating component 4, is located in the top region of the cavity 113. The liquid coolant stored in the liquid-absorbing core 2 absorbs heat and evaporates, changing from a liquid to a gaseous state, and diffuses into other spaces of the cavity 113 to facilitate the flow of the gaseous coolant, making the temperature of the bottom shell 11 relatively uniform under the action of the gaseous coolant.

[0059] The gaseous cooling medium diffuses within cavity 113. When it comes into contact with the relatively cool cavity wall of cavity 113, the gaseous cooling medium releases heat and re-condenses into a liquid state. The liquid cooling medium flows back to the heat source area of ​​the wicking core 2, where it is re-adsorbed by the wicking core 2, completing the working medium cycle.

[0060] In the electronic device provided in this embodiment, the heat from the heat-dissipating component 4 can be transferred to the bottom shell 11, and heat dissipation is achieved through the phase change cycle of the liquid cooling medium and the liquid wick integrated in the cavity 113. This allows the heat to be evenly distributed within the bottom shell 11 and dissipated outwards through the fins 3. Compared to having an additional independent heat dissipation module above or to the side of the heat-dissipating component 4, the electronic device provided in this embodiment does not require reserving physical space for the heat dissipation module body and its necessary mounting structure.

[0061] It is understandable that the reserved physical space refers to the assembly gap, which is used to accommodate the thickness of the heat dissipation module, ensure the contact pressure between the heat dissipation module and the component to be dissipated 4, provide an airflow channel, or allow for certain assembly tolerances.

[0062] In this embodiment, the heat dissipation function is achieved by the bottom shell 11 itself. The liquid absorber 2 and the cooling medium are both set in the cavity 113. The heat dissipation component 4 and the bottom shell 11 are in contact with each other. There are no independent heat dissipation module components that require additional volume between the three. Therefore, there is no need to reserve assembly gaps, which helps to save space in the thickness direction of electronic devices and helps to achieve the thinness and lightness of electronic devices.

[0063] Furthermore, since the fins 3 are disposed on the base shell 11, heat from the base shell 11 can be transferred to the fins 3, causing the temperature of the fins 3 to rise. When airflow passes over the heated surface of the fins 3, the airflow can exchange heat with the surface of the fins 3, carrying away the heat from the fins 3, thereby removing heat from the base shell 11 and the fins 3 and dissipating it to the surrounding environment or the outside of the electronic device. By incorporating the fins 3, the heat from the base shell 11 can be extended to the fin structure with a larger surface area for dissipation, increasing the heat dissipation area and thus improving heat dissipation efficiency.

[0064] It should be noted that in this embodiment, the electronic device is a laptop computer. The bottom casing 11 is the bottom casing of the laptop computer. The heat-dissipating component 4 is a heat-generating element on the laptop computer's motherboard, such as the central processing unit (CPU) or graphics processing unit (GPU). In addition to the casing 1 and the heat-dissipating component 4, the laptop computer also includes other components such as a screen, keyboard, and battery.

[0065] In other embodiments, the electronic device may also be other types of electronic devices, such as tablet computers, game consoles, or network switches. The description of the heat dissipation structure in this embodiment is also applicable to these electronic devices, requiring only adaptive adjustments based on the specific device's casing structure, internal layout, and heat dissipation requirements.

[0066] Please refer to Figures 1 to 10 In some embodiments, the cavity 113 is provided with a liquid-absorbing core 2 at the position corresponding to the communication path between the heat-dissipating component 4 and the fin 3.

[0067] Specifically, the cavity 113 is located on the inner wall of the bottom shell 11, and the heat dissipation component 4 and the fins 3 are both located on the outside of the bottom shell 11 and above the cavity 113. Therefore, the liquid absorption core 2 is provided on the inner wall of the top surface of the cavity 113, that is, in the area below the position corresponding to the communication path between the heat dissipation component 4 and the fins 3.

[0068] When the heat sink 4 is working, heat is transferred to the fins 3 through the bottom shell 11. During the transfer, the heat is conducted downwards to the top wall of the cavity 113, heating the wick 2 located there. The liquid cooling medium inside the wick 2 evaporates upon heating, forming a gas. The gas diffuses within the cavity 113. When the gas diffuses to the bottom surface or other relatively cooler areas of the side walls of the cavity 113, it can condense and release heat. The condensed liquid cooling medium is transported from the condensation area back to the evaporation area at the top through the capillary action of the wick 2, completing the cycle.

[0069] This allows the phase change evaporation process of the cooling medium to directly absorb heat from the heat conduction path between the heat-dissipating component 4 and the fins 3, thereby partially dissipating the heat before it reaches the fins 3, reducing the amount of heat that ultimately reaches the fins 3, and improving the overall heat dissipation efficiency.

[0070] Please refer to Figures 1 to 10 In some embodiments, the bottom shell 11 includes a bottom plate 111 and a top plate 112. The top plate 112 is disposed on the bottom plate 111 and together with the bottom plate 111, forms a cavity 113. The heat dissipation component 4 is disposed on the side of the top plate 112 away from the bottom plate 111, and the liquid absorption core 2 is disposed at least on the side of the top plate 112 facing the bottom plate 111.

[0071] Specifically, the base plate 111 has a flat plate structure, and the top plate 112 covers the base plate 111. The top plate 112 and the base plate 111 can be connected by welding, bonding or sealing ring pressing, etc. This embodiment does not impose any restrictions on this.

[0072] The top surface of the top plate 112 forms the bottom of the cavity 14, and the heat dissipation component 4 is installed on the top plate 112 for heat conduction. The top surface of the bottom plate 111 forms the bottom wall of the cavity 113, and the liquid absorption core 2 is provided at least on the side of the top plate 112 facing the bottom plate 111, that is, on the top surface of the bottom plate 111.

[0073] The liquid-absorbing core 2 can cover all or part of the inner surface of the top plate 112. The liquid-absorbing core 2 can also be set on the side of the bottom plate 111 facing the top plate 112, or on other side walls of the cavity 113. This embodiment does not impose any restrictions on this.

[0074] When the heat dissipation component 4 is working, heat is transferred to the top plate 112, and the wick 2 absorbs the heat from the top plate 112. The liquid coolant adsorbed in the wick 2 evaporates upon heating and transforms into a gaseous state. The gaseous coolant diffuses within the cavity 113. When the gaseous coolant comes into contact with other inner walls of the cavity 113, which have a relatively lower temperature, it condenses back into a liquid state, releases heat, and is reabsorbed by the wick 2, completing the cycle.

[0075] In some embodiments, at least one end of the wick 2 extends along the top plate 112 to the side of the bottom plate 111 facing the sidewall 12, so that the wick 2 forms an extended liquid cooling medium supply channel in the corner region between the top plate 112 and the bottom plate 111 or on the inner wall of the top plate 112. This allows the liquid cooling medium to be transported to the inner wall region of the top plate 112 closer to the heat-dissipating component 4 through the capillary action of the wick 2, shortening the transport distance of the liquid cooling medium and increasing the supply speed and amount of liquid cooling medium to the heat-dissipating component 4.

[0076] It should be noted that, in this embodiment, the wick 2 can cover the entire inner wall of the cavity 113, thereby expanding the storage and distribution area of ​​the liquid coolant and increasing the heat capacity of the bottom shell 1. Simultaneously, since the wick 2 covers the entire inner wall, liquid coolant condensing from any inner wall region can be immediately adsorbed by the wick 2 at its location and rapidly transported to other regions through the capillary network of the wick 2, shortening the return path and enhancing the efficiency and uniformity of the liquid coolant circulation.

[0077] In some embodiments, the base plate 111 is made of a non-thermal-conducting material, and the top plate 112 is made of a thermally-conducting material.

[0078] Specifically, the base plate 111 is the part of the bottom shell 11 that is away from the internal components and faces the outside of the electronic device, which is the user's hand-held part. Therefore, by making the base plate 111 a non-thermal conductive material with low thermal conductivity, such as plastic or resin, the surface temperature of the base plate 111 during the operation of the electronic device can be reduced, preventing the user from feeling hot when holding the electronic device and improving the safety and comfort of using the electronic device.

[0079] The top plate 112 is the part of the bottom shell 11 facing the interior of the electronic device, used for mounting and contacting the component 4 to be cooled. Therefore, the top plate 112 is made of a metal material with a high thermal conductivity, such as aluminum or copper. In this way, when the component 4 is working, heat can be efficiently conducted to the top plate 112 made of thermally conductive material, so that the top plate 112 can transfer heat to the wick 2 and the fins 3, thereby improving heat dissipation efficiency.

[0080] Please refer to Figures 1 to 10 In some embodiments, the electronic device further includes a cooling fan 5, which is disposed within the receiving cavity 14 and has an air inlet and a first air outlet 51. The bottom shell 11 has a vent 114, and the side wall 12 has a first heat dissipation vent. The air inlet communicates with the vent 114, and the first air outlet 51 communicates with the first heat dissipation vent. The fin 3 includes a first fin 31, which is disposed on the communication path between the air outlet and the first heat dissipation vent and undergoes heat conduction with the bottom shell 11.

[0081] Specifically, through the phase change cycle between the liquid wick 2 in the cavity 113 inside the bottom shell 11 and the liquid cooling medium, the heat generated by the heat dissipation component 4 can be diffused more quickly and evenly inside the bottom shell 11, resulting in a uniform heat distribution within the bottom shell 11. Subsequently, the uniformly distributed heat can be transferred to the first fin 31 connected to the bottom shell 11 through thermal conduction, causing the temperature of the first fin 31 to rise.

[0082] When the cooling fan 5 is working, cooler outside air is drawn in through the vent 114 and flows into the air inlet of the cooling fan 5. After the cooling fan 5 accelerates the air, the airflow flows along the path from the first air outlet 51 to the first heat dissipation port, thereby enabling the airflow to exchange heat with the first fin 31 and remove the heat from the first fin 31.

[0083] Understandably, the airflow generated by the cooling fan 5 continuously flows through the first fin 31, which can quickly remove the heat accumulated on the first fin 31, forming convection cooling, and further enhancing the heat dissipation capability of the electronic device in the bottom shell 11 area.

[0084] The electronic device provided in this embodiment, by providing a first fin 31 that is thermally connected to the bottom shell 11, can extend the heat of the bottom shell 11 to the first fin 31, which has a larger surface area, thereby increasing the heat exchange area with the air. At the same time, since the overall temperature of the bottom shell 11 tends to be uniform during the phase change cycle of the cooling working fluid, the temperature difference between different parts of the first fin 31 is small. This allows the entire surface of the first fin 31 to effectively exchange heat with the flowing low-temperature airflow at a higher temperature difference, thereby maximizing the utilization of the heat dissipation area and airflow cooling capacity of the fin 31.

[0085] Please refer to Figures 1 to 10 In some embodiments, there are two cooling fans 5, and the bottom shell 11 has two vents 114. The air inlets of the two cooling fans 5 are respectively connected to one of the vents 114. The first air outlets 51 of the two cooling fans 5 are connected to the same first heat dissipation port, or the bottom shell 11 is provided with a first heat dissipation port at the position corresponding to the two first air outlets 51.

[0086] Specifically, the two cooling fans 5 can be arranged side-by-side or diagonally within the receiving cavity 14. Each cooling fan 5 independently drives a stream of air. When the two first air outlets 51 are connected to the same first heat dissipation port, the two streams of air merge as they flow towards or reach the first heat dissipation port, forming a single airflow with a larger total flow rate, which is then discharged from the same first heat dissipation port. When the side wall 12 is provided with a first heat dissipation port corresponding to each of the two first air outlets 51, the two streams of air remain independent and are discharged from the two first heat dissipation ports respectively.

[0087] When the two first air outlets 51 converge into one first heat dissipation port, the high-speed airflow after the convergence can more concentratedly scour the first fins 31, thereby generating stronger turbulence and enhancing the heat exchange effect.

[0088] When two independent first heat dissipation vents are set, distributed airflow can be achieved, which helps to balance the pressure inside the electronic equipment.

[0089] Understandably, by setting up two cooling fans 5, a larger total airflow can be provided, thereby generating stronger convection and improving the heat dissipation intensity of the first fin 31. At the same time, if one cooling fan 5 fails, the other cooling fan 5 can still maintain a certain level of active cooling, improving the reliability of the electronic equipment.

[0090] Please refer to Figures 1 to 10 In some embodiments, a first fin 31 is provided on the path connecting the two first air outlets 51 and the first heat dissipation port.

[0091] Specifically, when both cooling fans 5 operate simultaneously, the airflow driven by one cooling fan 5 flows through the corresponding first fin 31, carrying away the heat from that first fin 31. The airflow driven by the other cooling fan 5 flows through its corresponding other first fin 31, carrying away the heat from that first fin 31. The two airflows eventually merge and are discharged from the same first heat dissipation port, or from two separate first heat dissipation ports.

[0092] By setting the first fins 31 on the air ducts corresponding to the two cooling fans 5, the heat conducted by the bottom shell 11 can be distributed, reducing the pressure on the heat exchange capacity of a single first fin 31, avoiding excessive heat concentration on a single fin 3, and achieving better heat dissipation.

[0093] Please refer to Figures 1 to 10 In some embodiments, the two first fins 31 are connected to each other, or the two fins 3 are spaced apart within the receiving cavity 14.

[0094] Specifically, when the two first fins 31 are connected to each other, they form an integral structure, allowing heat to be transferred between them and achieving a heat balance. When the cooling fan 5 corresponding to one of the first fins 31 reduces its airflow for some reason, the other first fin 31 and its corresponding cooling fan 5 can help dissipate heat, thereby enhancing the redundancy and robustness of the heat pipe system.

[0095] When the two first fins 31 are spaced apart within the receiving cavity 14, the two fins 3 are spatially separated and do not directly contact each other. Each first fin 31 and its corresponding cooling fan 5 constitute a relatively independent heat dissipation unit, which facilitates the independent arrangement of the two heat dissipation units and avoids thermal interference between the two first fins 31.

[0096] Please refer to Figures 1 to 10 In some embodiments, the liquid-absorbing core 2 includes a first liquid-absorbing part 21 and a second liquid-absorbing part 22. The first liquid-absorbing part 21 is arranged around the periphery of one of the cooling fans 5, and the second liquid-absorbing part 22 is arranged around the periphery of the other cooling fan 5, and the two liquid-absorbing parts are interconnected with the first liquid-absorbing part 21 between the two cooling fans 5 to form a circulating liquid-absorbing structure. The heat-dissipating component 4 is located at the communication position between the first liquid-absorbing part 21 and the second liquid-absorbing part 22.

[0097] Specifically, the first liquid-absorbing section 21 and the second liquid-absorbing section 22 are different sections formed by bending, coiling, or splicing the same or multiple continuous liquid-absorbing core materials. The first liquid-absorbing section 21 and the second liquid-absorbing section 22 are arranged around the installation areas of the two cooling fans 5, respectively. The first liquid-absorbing section 21 and the second liquid-absorbing section 22 are connected to each other in the area between adjacent cooling fans 5, so that the liquid-absorbing core 2 as a whole forms a structure that is connected end to end. The heat sink 4 is installed at the connection position of the first liquid-absorbing section 21 and the second liquid-absorbing section 22 so as to contact the liquid-absorbing core 2 through the top plate 112.

[0098] When the heat-dissipating component 4 operates, it generates heat, which is conducted to the wick 2 portion opposite to the heat-dissipating component 4. The liquid coolant within this portion of the wick 2 evaporates due to the heat. Since the wick 2 is interconnected, the reduction in liquid coolant in the evaporation area is rapidly replenished by capillary force from the connected first wicking section 21 and second wicking section 22. Simultaneously, gas diffuses within the cavity 113 and condenses in other areas of the wick 2 away from the heat source (e.g., the cooler wicking section surrounding the cooling fan 5). The condensed liquid coolant is adsorbed by the wick 2 at that location and flows back to the heat source area through the interconnected capillary network of the wick 2.

[0099] By connecting the two cooling fans 5 in series and coupling them with the heat-receiving component 4 located between the two cooling fans 5, the heat source can simultaneously utilize the capillary force of the liquid wicks on both sides and the storage of the working fluid, thus enhancing the supply and return capacity of the liquid cooling working fluid. At the same time, the liquid wicks surrounding the cooling fans 5 can more effectively utilize the fan airflow to promote condensation, improving the overall heat dissipation efficiency.

[0100] Furthermore, it should be noted that this embodiment does not limit the communication relationship between the first liquid-absorbing part 21 and the second liquid-absorbing part 22. One end of the first liquid-absorbing part 21 can be connected to one end of the second liquid-absorbing part 22. One end of the first liquid-absorbing part 21 can also be connected to both ends of the second liquid-absorbing part 22 simultaneously. Both ends of the first liquid-absorbing part 21 can also be connected to both ends of the second liquid-absorbing part 22 respectively, forming multi-point communication. The middle position of the first liquid-absorbing part 21 can be connected to the middle position of the second liquid-absorbing part 22. The design and selection can be flexible according to the actual heat dissipation requirements, the shape and position of the heat-dissipating component 4, and the layout of the cooling fan 5.

[0101] Please refer to Figures 1 to 10 In some embodiments, the fin 3 further includes a second fin 32, the second fin 32 and the first fin 31 are disposed on different sides of the cooling fan 5, and the cooling fan 5 further includes a second air outlet. The side wall 12 has a second heat dissipation port 121 at the position corresponding to the second fin 32, and the second heat dissipation port 121 communicates with the second air outlet.

[0102] Similar to the first fin 31, the second fin 32 can also receive heat conducted by the bottom shell 11, which will not be described in detail here. The airflow from the first air outlet 51 can flow to the first heat dissipation port, and the airflow from the second air outlet can flow to the second heat dissipation port 121, thus dissipating heat from both the first fin 31 and the second fin 32.

[0103] Specifically, the airflow driven by the cooling fan 5 can flow through the first heat dissipation port to the first fin 31, dissipating heat from the first fin 31, and simultaneously flow through the second heat dissipation port 121 to the second fin 32, dissipating heat from the second fin 32. In this way, by using the same cooling fan 5 to drive airflow to simultaneously cool the first fin 31 and the second fin 32, active heat dissipation of two different heat dissipation areas on the bottom shell 11 is achieved simultaneously, thereby improving the coverage of the overall heat dissipation area of ​​the bottom shell 11 and enhancing the heat dissipation efficiency and effect of the electronic device.

[0104] Furthermore, it should be noted that this embodiment does not limit the arrangement of the fins 3. In specific implementations, the first fin 31 can be arranged only on one side of the cooling fan 5, or the first fin 31 and the second fin 32 can be arranged on both sides of the same cooling fan 5. When the electronic device includes two cooling fans 5, the first fin 31 and the second fin 32 can be arranged at one cooling fan 5, while only the first fin 31 or only the second fin 32 can be arranged at the other cooling fan 5. The specific number, layout, and correspondence of the fins 3 with the cooling fans 5 can be flexibly configured and optimized according to the actual heat source distribution, spatial layout, and heat dissipation requirements inside the electronic device.

[0105] Please refer to Figures 1 to 10In some embodiments, the vent 114 is located on the bottom shell 11 opposite to the air inlet and is not connected to the cavity 113.

[0106] Specifically, the vent 114 is a hole opened on the bottom shell 11. The vent 114 is positioned directly or nearly directly opposite the air inlet of the cooling fan 5 so that airflow can enter the air inlet of the cooling fan 5 through the vent 114 without flowing into the space and interfering with the cooling medium, thus ensuring the airtightness of the cavity 113.

[0107] Please refer to Figures 1 to 10 In some embodiments, the bottom shell 11 has a groove 15 at the position corresponding to the cooling fan 5, and at least part of the cooling fan 5 is disposed in the groove 15.

[0108] Specifically, the bottom shell 11 is recessed inward to form a groove 15 to accommodate the cooling fan 5. The depth and shape of the groove 15 can be the same as or similar to the thickness and profile of the cooling fan 5, so that the cooling fan 5 can be embedded in the groove 15, reducing the height of the cooling fan 5 protruding from the surface of the bottom shell 11, thereby reducing the net space occupied by the cooling fan 5 in the thickness direction, which is beneficial to achieving a thinner and lighter electronic device. At the same time, by setting the groove 15, the positioning and installation of the cooling fan 5 can be facilitated, which helps to reduce vibration and noise.

[0109] The embodiments or implementation methods in this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0110] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0111] In the description of this application, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, display structure, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are expressly listed, but may include other steps or units that are not expressly listed or that are inherent to such process, method, product, or device.

[0112] The term "and / or" used in this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0113] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, The device includes a main body, which comprises: The housing includes a bottom shell, a top shell, and a side wall connecting the bottom shell and the top shell, wherein the bottom shell, the top shell, and the side wall together enclose a receiving cavity; The bottom shell has a cavity inside, and the cavity contains a liquid-absorbing core, which contains a heat-absorbing and evaporable liquid cooling medium. Fins, which are disposed within the receiving cavity and connected to the bottom shell, so as to conduct heat with the bottom shell; A heat-dissipating component is disposed within the receiving cavity and contacts the bottom shell to conduct heat with the bottom shell, and conducts heat to the fins through the bottom shell.

2. The electronic device according to claim 1, characterized in that, The cavity is provided with the liquid-absorbing core at the position corresponding to the communication path between the heat-dissipating component and the fin.

3. The electronic device according to claim 1, characterized in that, The bottom shell includes a bottom plate and a top plate, the top plate being disposed on the bottom plate and together with the bottom plate forming the cavity; The heat dissipation component is located on the side of the top plate away from the bottom plate, and the liquid absorption core is located at least on the side of the top plate facing the bottom plate.

4. The electronic device according to claim 3, characterized in that, The top plate is made of a thermally conductive material, and the bottom plate is made of a non-thermally conductive material.

5. The electronic device according to any one of claims 1-4, characterized in that, It also includes a cooling fan, which is disposed within the receiving cavity and has an air inlet and a first air outlet; The ventilation opening and the first heat dissipation opening are provided. The ventilation opening is located on the bottom shell, and the first heat dissipation opening is located on the side wall. The air inlet is connected to the ventilation opening, and the first air outlet is connected to the first heat dissipation opening. The fins include a first fin, which is disposed on the communication path between the first air outlet and the first heat dissipation vent, and conducts heat with the bottom shell.

6. The electronic device according to claim 5, characterized in that, The number of cooling fans is two, and the bottom shell has two ventilation ports. The air inlets of the two cooling fans are respectively connected to one of the ventilation ports. The first air outlets of the two cooling fans are connected to the same first heat dissipation port, or the side wall is provided with a first heat dissipation port at the position corresponding to the two first air outlets.

7. The electronic device according to claim 6, characterized in that, Each of the two first air outlets is provided with a first fin on the path connecting the first heat dissipation port to the first air outlet.

8. The electronic device according to claim 7, characterized in that, The two first fins are connected to each other, or the two first fins are spaced apart within the receiving cavity.

9. The electronic device according to claim 6, characterized in that, The liquid-absorbing core includes a first liquid-absorbing part and a second liquid-absorbing part. The first liquid-absorbing part is arranged around the periphery of one of the cooling fans, and the second liquid-absorbing part is arranged around the periphery of the other cooling fan. The first liquid-absorbing part and the second liquid-absorbing part are interconnected between the two cooling fans to form a circulating liquid-absorbing structure. The heat dissipation component is located at the connection point between the first liquid absorption section and the second liquid absorption section.

10. The electronic device according to claim 5, characterized in that, The fins also include a second fin, the second fin and the first fin are disposed on different sides of the cooling fan, and the cooling fan also includes a second air outlet; The sidewall has a second heat dissipation vent at the position corresponding to the second fin, and the second heat dissipation vent is connected to the second air outlet.

11. The electronic device according to claim 5, characterized in that, The ventilation opening is located on the bottom shell opposite to the air inlet, and is not connected to the cavity.

12. The electronic device according to claim 5, characterized in that, The bottom shell has a groove at the position corresponding to the cooling fan, and at least part of the cooling fan is disposed in the groove.

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