Display module and display device

Abstract

The invention relates to the technical field of display, in particular to a display module and a display device. The display module comprises a display panel and a heat dissipation assembly. The display panel comprises a light emitting surface and a backlight surface which are opposite. The heat dissipation assembly is located on the side, away from the light-emitting face, of the backlight face of the display panel. The heat dissipation assembly includes a first region and a second region surrounding the first region. The heat dissipation assembly comprises a heat dissipation structure and a buffer structure. The heat dissipation structure comprises a first heat dissipation layer, and the first heat dissipation layer is located in the first area. The buffer structure comprises a first part which is located in the second area. The elastic modulus A of the buffer structure is larger than or equal to 0.1 Mpa and smaller than or equal to 10 Mpa. The buffer structure in the display module provided by the invention can effectively buffer the impact of external force on the display panel and reduce the probability of color points on the display panel.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the continuous development of display technology, the application of display panels is becoming increasingly widespread. For example, display panels are used in products such as mobile phones, computers, tablets, and e-readers. Thin and light design has become the current mainstream trend. At the same time, while meeting the requirements of thin and light design, end consumers are placing more stringent demands on the heat dissipation efficiency and structural reliability of the thermal condenser film (SCF) of the display module. Summary of the Invention

[0003] To address the aforementioned technical problems, this disclosure provides a display module and a display device.

[0004] In a first aspect, this disclosure provides a display module. The display module includes a display panel and a heat dissipation assembly. The display panel includes a light-emitting surface and a backlight surface facing each other. The heat dissipation assembly is located on the backlight surface of the display panel away from the light-emitting surface. The heat dissipation assembly includes a first region and a second region surrounding the first region. The heat dissipation assembly includes a heat dissipation structure and a buffer structure. The heat dissipation structure includes a first heat dissipation layer located in the first region. The buffer structure includes a first portion located in the second region. The elastic modulus of the buffer structure is A, where 0.1 MPa ≤ A ≤ 10 MPa.

[0005] Secondly, this disclosure provides a display device. The display device includes the display module provided in any of the first aspects.

[0006] Compared with the prior art, the technical solution provided in this disclosure has the following advantages: The heat dissipation component in the display module provided in this disclosure has a buffer structure with an elastic modulus ranging from 0.1 MPa to 10 MPa, and the first part of the buffer structure is located on the periphery of the first heat dissipation layer. The buffer structure can fix and limit the first heat dissipation layer, thereby improving the overall structural stability of the heat dissipation component in the display module. Furthermore, when the display module is slightly dropped or bumped, the buffer structure can effectively buffer the instantaneous external force on the display module, thereby reducing the impact of the instantaneous external force on the edge of the first heat dissipation layer, and thus reducing the probability of color spots appearing on the display panel. Attached Figure Description

[0007] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0008] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 A schematic diagram of the structure of a display module provided in the prior art; Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present disclosure; Figure 3 This is a schematic diagram of another display module provided in an embodiment of the present disclosure; Figure 4 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 5 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 6 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 7 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 8 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 9 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 10 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 11 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 12 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 13 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 14 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 15 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure; Figure 16 This is a schematic diagram of the structure of a display device provided in an embodiment of the present disclosure. Detailed Implementation

[0010] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0011] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0012] This disclosure provides a display module. The display module includes a display panel.

[0013] For example, the display panel 10 may be one of an OLED (Organic Light Emitting Diode) display panel, a QLED (Quantum Dot Light Emitting Diodes) display panel, or a microLED (including MiniLED or MicroLED, where LED is a light-emitting diode) display panel.

[0014] For example, the display panel 10 includes an opposing light-emitting surface A1 and a backlight surface A2.

[0015] Figure 1 A schematic diagram of the structure of a display module provided by the prior art.

[0016] In existing technologies, such as Figure 1 As shown, the display module 100 also includes a heat dissipation film (SCF) 01. The heat dissipation film 01 is located on the side of the backlight surface A2 of the display panel 10 that faces away from the light-emitting surface A1. In other words, the heat dissipation film 01 is located on the backlight surface A2 of the display panel 10.

[0017] The heat dissipation film 01 includes a first heat dissipation layer 011 and a plastic film layer 012. The plastic film layer 012 can be disposed around the first heat dissipation layer 011. Based on this, the display panel 10 can be cooled by the first heat dissipation layer 011 in the heat dissipation film 01, and the structural stability of the heat dissipation film 01 can be improved by the plastic film layer 012.

[0018] For example, the elastic modulus of the plastic film layer 012 ranges from 2 to 5 GPa.

[0019] For example, the plastic film layer 012 material can be polyethylene terephthalate (PET).

[0020] Research has revealed that in the event of a minor drop or collision to the display module 100, the plastic film layer 012 exhibits poor impact resistance and cannot provide effective cushioning. The impact force is directly transmitted to the edge of the first heat dissipation layer 011, causing localized cracking or film peeling at the joints and compromising structural integrity. This structural anomaly directly affects the optical signal transmission and uniformity at the edges of the display panel 10, ultimately resulting in "colored dots" appearing at the edges of the display panel 10.

[0021] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present disclosure.

[0022] Based on this, this disclosure provides a display module 100. For example... Figure 2 As shown, the display module 100 also includes a heat dissipation assembly 20. The heat dissipation assembly 20 is located on the side of the backlight surface A2 of the display panel 10 that faces away from the light-emitting surface A1. The heat dissipation assembly 20 includes a first region B1 and a second region B2 surrounding the first region B1.

[0023] For example, the outer boundary of the first heat dissipation layer 210 coincides with the boundary of the first region B1. The area of ​​the heat dissipation assembly 20 other than the first region B1 is the second region B2. In other words, the outer boundary of the first heat dissipation layer 210 coincides with the boundary line between the first region B1 and the second region B2.

[0024] The heat dissipation assembly 20 includes a heat dissipation structure 21 and a buffer structure 22. The heat dissipation structure 21 includes a first heat dissipation layer 210, which is located in a first region B1. The buffer structure 22 includes a first portion 221, which is located in a second region B2. In other words, the first portion 221 of the buffer structure 22 is disposed around the first heat dissipation layer 210, and can protect and limit the first heat dissipation layer 210.

[0025] The elastic modulus A of the buffer structure 22 satisfies: 0.1 MPa ≤ A ≤ 10 MPa. Setting the elastic modulus A of the buffer structure 22 in the range of 0.1 MPa to 10 MPa ensures that the buffer structure 22 has good resistance to deformation and impact, meeting the buffering performance requirements of the heat dissipation component 20; it also ensures that the buffer structure 22 has good supporting performance, meeting the structural stability requirements of the heat dissipation component 20.

[0026] In some examples, the elastic modulus A of the buffer structure 22 satisfies: 0.1 MPa ≤ A ≤ 1 MPa.

[0027] For example, the elastic modulus A of the buffer structure 22 can be any one of 0.2 MPa, 0.4 MPa, 0.5 MPa, 0.6 MPa or 0.8 MPa. However, the embodiments of this disclosure do not limit the elastic modulus A of the buffer structure 22 to this.

[0028] Based on this, the buffer structure 22 can have better resistance to deformation and better resistance to impact while meeting the structural stability requirements of the heat dissipation component 20.

[0029] In summary, the heat dissipation component 20 in the display module 100 provided in this embodiment includes a buffer structure 22 with an elastic modulus ranging from 0.1 MPa to 10 MPa, and the first portion 221 of the buffer structure 22 is located on the periphery of the first heat dissipation layer 210. Therefore, when the display module 100 experiences a slight drop or impact, the first portion 221 of the buffer structure 22 can effectively buffer the instantaneous external force acting on the display module 100, reducing the impact of the instantaneous external force on the edge of the first heat dissipation layer 210, thereby reducing the probability of color spots appearing on the display panel 10. Furthermore, the heat dissipation component 20 in the display module 100 provided in this embodiment replaces the existing PET with the buffer structure 22, without adding a new film layer, thus meeting the requirement for a thinner and lighter display module 100.

[0030] like Figure 2 As shown, in some embodiments, the material of the buffer structure 22 includes one or both of silicone gel and foam adhesive.

[0031] For example, the elastic modulus of foam adhesive is approximately 0.48 MPa.

[0032] For example, the elastic modulus of silicone gel is approximately 0.262 MPa.

[0033] Since both silicone gel and foam adhesive have adhesive and cushioning properties, when silicone gel or foam adhesive is used to construct the cushioning structure 22, the cushioning structure 22 can serve both as a cushioning and protective function and as a fixing and limiting function.

[0034] like Figure 2 As shown, in some embodiments, the adhesive strength of the buffer structure 22 ranges from 1500gf to 2000gf.

[0035] With this configuration, the buffer structure 22 can further fix and limit the first heat dissipation layer 210, and further improve the overall structural stability of the heat dissipation component 20.

[0036] like Figure 2 As shown, in some embodiments, the first heat dissipation layer 210 may be a graphite heat dissipation layer. In some examples, the graphite heat dissipation layer may include graphite particles.

[0037] Because graphite has a high thermal conductivity, the graphite heat dissipation layer has strong heat dissipation performance, which is beneficial to improving the heat dissipation effect of the heat dissipation component 20, so as to facilitate heat dissipation of the display panel 10 through the heat dissipation component.

[0038] like Figure 2 As shown, in some embodiments, the first portion 221 includes a first sub-portion Q1, which is disposed around the first heat dissipation layer 210. In other words, the first sub-portion Q1 is disposed circumferentially along the first heat dissipation layer 210.

[0039] Based on this, the first sub-part Q1 can provide protection for the edge of the first heat dissipation layer 210 from multiple directions. When the display module 100 encounters a minor collision or drop, it can buffer the instantaneous external force from all directions, reducing the probability of the instantaneous external force directly acting on the edge of the first heat dissipation layer 210, and further reducing the probability of edge color spots appearing on the display panel 10. Furthermore, the first sub-part Q1, with its surrounding structure, can be positioned and fixed on the side of the first heat dissipation layer 210, which also helps to improve the overall stability of the heat dissipation assembly 20. In addition, the first sub-part Q1 can also prevent powder from falling off the edge of the first heat dissipation layer 210.

[0040] In some examples, the first sub-part Q1 can be a ring-shaped structure. This allows the first sub-part Q1 to be arranged circumferentially along the first heat dissipation layer 210, surrounding the first heat dissipation layer 210. Furthermore, the first sub-part Q1 is equivalent to being located in the area corresponding to the edge of the display panel 10.

[0041] Based on this, the first sub-part Q1 can buffer instantaneous external forces in all directions, reducing the probability that instantaneous external forces will directly act on the edge of the first heat dissipation layer 210, and further reducing the probability of edge color spots appearing on the edge of the display panel 10.

[0042] like Figure 2 As shown, in some embodiments, the first sub-part Q1 covers the first heat dissipation layer 210 along the direction (first direction) X from the second region B2 to the first region B1.

[0043] Understandably, the fact that the first sub-part Q1 completely covers the side of the first heat dissipation layer 210 can further enhance the protective effect of the first sub-part Q1 on the first heat dissipation layer 210, thereby further reducing the probability of edge color spots appearing on the display panel 10.

[0044] In some examples, along the second direction Z, the thickness of the first sub-part Q1 is equal to the thickness of the first heat dissipation layer 210.

[0045] The surface of the first sub-part Q1 near the display panel 10 is flush with the surface of the first heat dissipation layer 210 near the display panel 10, and the surface of the first sub-part Q1 away from the display panel 10 is flush with the surface of the first heat dissipation layer 210 away from the display panel 10.

[0046] This configuration facilitates the improvement of the flatness of each film layer in the heat dissipation assembly 20, and makes it easier to form adhesive layers on the surfaces of the first sub-part Q1 and the first heat dissipation layer 210 near the display panel 10, as well as on the surfaces of the first sub-part Q1 and the first heat dissipation layer 210 away from the display panel 10. Furthermore, the equal thickness and flush arrangement of the first sub-part Q1 and the first heat dissipation layer 210 prevent localized stress concentration during external impacts, reducing the risk of edge cracking of the first heat dissipation layer 210.

[0047] like Figure 2 As shown, in some embodiments, along the first direction X, the length d1 of the first sub-part Q1 satisfies: 7mm≤d1≤10mm.

[0048] Based on this, the length d1 of the first sub-part Q1 in the first direction X is set to be in the range of 7mm~10mm. This can both buffer external stress through the first sub-part Q1 to protect the display panel 10, and avoid taking up too much space in the display module 100 for setting the first heat dissipation layer 210 in the heat dissipation structure 21, so as to ensure that the size of the first heat dissipation layer 210 meets the heat dissipation requirements of the heat dissipation structure 21 for the display panel 10.

[0049] In some examples, the length d1 of the first sub-part Q1 along the first direction X can be any one of 7mm, 8mm, 9mm, or 10mm. However, the embodiments of this disclosure do not limit the size of d1 to this and can be adjusted according to actual conditions.

[0050] Figure 3 This is a schematic diagram of another display module provided in an embodiment of the present disclosure.

[0051] like Figure 3 As shown, in some embodiments, along the thickness direction (second direction) Z of the display panel 10, the first sub-part Q1 includes a plurality of buffer sub-parts Q11, and in any two adjacent buffer sub-parts Q11: the elastic modulus of the buffer sub-part Q11 closer to the display panel 10 is greater than the elastic modulus of the buffer sub-part Q11 farther away from the display panel 10.

[0052] Based on this, any two adjacent buffer sub-sections Q11 among multiple buffer sub-sections Q11 are configured such that the buffer sub-section Q11 closer to the display panel 10 has a relatively larger elastic modulus, while the buffer sub-section Q11 farther from the display panel 10 has a relatively smaller elastic modulus. Thus, the buffer sub-section Q11 with a smaller elastic modulus on the outer side (away from the display panel 10) provides better resistance to deformation and impact, better absorbing the instantaneous external force generated during collisions and drops. Simultaneously, the buffer sub-section Q11 with a larger elastic modulus on the inner side (closer to the display panel 10) improves support performance and enhances the overall stability of the heat dissipation assembly 20.

[0053] In other words, the outer buffer sub-section Q11 has a smaller elastic modulus, which can preferentially buffer the instantaneous external force generated by collisions and drops, reducing the transmission of impact force to the inward side. The inner buffer sub-section Q11 has a larger elastic modulus and stronger support, which can effectively maintain the structural stability of the heat dissipation component 20.

[0054] As can be seen, the first sub-section Q1 adopts the above-mentioned "soft on the outside and hard on the inside" gradient design to form a layered buffer protection, which can further reduce the impact of external forces on the display panel 10 and further reduce the probability of edge color spots appearing on the display panel 10.

[0055] In some examples, the elastic modulus of multiple buffer sub-parts Q11 gradually increases along the direction from the heat dissipation component 20 to the display panel 10.

[0056] Based on this, by gradually increasing the elastic modulus of the buffer sub-section Q11 from the outside to the inside, the first heat dissipation layer 210 and the display panel 10 can be better protected, thereby further reducing the probability of edge color spots appearing on the display panel 10.

[0057] Figure 4 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0058] like Figure 4 As shown, in some embodiments, the heat dissipation structure 21 further includes a first adhesive layer 211, which is located between the first heat dissipation layer 210 and the display panel 10. The first adhesive layer 211 may be located in the first region B1 and the second region B2, that is, the orthographic projection of the first adhesive layer 211 on the display panel 10 covers the orthographic projection of the first heat dissipation layer 210 and the first sub-part Q1 on the display panel 10.

[0059] Therefore, the first adhesive layer 211 can fix and bond the first heat dissipation layer 210 and the first sub-part Q1 to their adjacent film layers, thereby improving the stability of the heat dissipation assembly 20.

[0060] In some examples, the first adhesive layer 211 can be any of pressure-sensitive adhesive (PSA), silicone gel, or foam adhesive.

[0061] Based on this, the first heat dissipation layer 210 and the first sub-part Q1 and their adjacent film layers can be fixedly bonded by the first adhesive layer 211.

[0062] like Figure 4 As shown, in some embodiments, the heat dissipation structure 21 further includes a foam layer 214. The foam layer 214 is located on the side of the first adhesive layer 211 near the display panel 10. The foam layer 214 may be located in the first region B1 and the second region B2, that is, the orthographic projection of the foam layer 214 on the display panel 10 covers the orthographic projection of the first heat dissipation layer 210 and the first sub-part Q1 on the display panel 10.

[0063] Therefore, the foam layer 214 has a certain degree of elasticity, which can buffer impacts and protect the display panel 10. In addition, when the heat dissipation structure 21 also includes the foam layer 214, the first adhesive layer 211 can fix and bond the first heat dissipation layer 210 and the first sub-part Q1 to the foam layer 214, thereby improving the stability of the heat dissipation assembly 20.

[0064] In some examples, the heat dissipation structure 21 also includes an adhesive layer for securing the foam layer 214 to the display panel 10. The materials of this adhesive layer are not specifically limited in this embodiment; any material that performs the aforementioned function can be used.

[0065] Figure 5 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0066] like Figure 5 As shown, in some embodiments, the heat dissipation structure 21 further includes a first adhesive layer 211, which is located between the first heat dissipation layer 210 and the display panel 10. The first adhesive layer 211 is located in the first region B1.

[0067] The first adhesive layer 211 can fix and bond the first heat dissipation layer 210 to its adjacent film layer (e.g., foam layer 214) to improve the stability of the heat dissipation assembly 20.

[0068] The first portion 221 of the buffer structure 22 includes a second sub-portion Q2, which is disposed around the first adhesive layer 211. In other words, the second sub-portion Q2 is disposed circumferentially along the first adhesive layer 211.

[0069] Based on this, the orthographic projection of the second sub-part Q2 on the display panel 10 is set around the first heat dissipation layer 210, which can also protect the edge of the first heat dissipation layer 210 from multiple directions. When the display module 100 encounters a slight collision or drop, it can buffer the instantaneous external force in all directions, reduce the probability of the instantaneous external force directly acting on the edge of the first heat dissipation layer 210, and further reduce the probability of edge color spots appearing on the display panel 10.

[0070] like Figure 5 As shown, in some embodiments, the second sub-part Q2 and the first adhesive layer 211 are disposed in the same layer.

[0071] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0072] It should be noted that "same layer" refers to a layer structure formed using the same film deposition process to create a specific pattern, and then using the same photomask to form a single patterning process. Depending on the specific pattern, a single patterning process may include multiple exposure, development, or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses.

[0073] In some examples, when the second sub-part Q2 and the first adhesive layer 211 are disposed in the same layer, the materials of the second sub-part Q2 and the first adhesive layer 211 are the same. In this case, the materials can be foam adhesive or silicone gel, which have both adhesive and cushioning properties. In this case, the second sub-part Q2 and the first adhesive layer 211 can both serve as adhesive fixation and provide a certain degree of cushioning, thereby improving the cushioning performance of the heat dissipation assembly 20.

[0074] Figure 6 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0075] like Figure 6 As shown, in some embodiments, the first portion 221 of the buffer structure 22 includes a first sub-part Q1 and a second sub-part Q2, with the second sub-part Q2 located between the first sub-part Q1 and the foam layer 214 (display panel 10).

[0076] The first part 221 of the buffer structure 22 can both buffer external forces to reduce the probability of edge color spots appearing on the display panel 10 and provide support to improve the overall stability of the heat dissipation component 20.

[0077] In some examples, such as Figure 6 As shown, when the first part 221 of the buffer structure 22 includes a first sub-part Q1 and a second sub-part Q2, the first sub-part Q1 and the second sub-part Q2 are arranged in the same layer.

[0078] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0079] In other examples, where the first portion 221 of the buffer structure 22 includes a first sub-part Q1 and a second sub-part Q2, the second sub-part Q2 and the first adhesive layer 211 are disposed in the same layer.

[0080] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0081] Figure 7 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0082] like Figure 7 As shown, in some embodiments, the buffer structure 22 further includes a second portion 222 located in the first region B1. Along the first direction (the direction from the second region B2 to the first region B1) X, the second portion 222 is located between the second sub-part Q2 and the first adhesive layer 211. As shown above, the buffer structure 22 can extend from the second area B2 into the first area B1. The buffer structure 22 can not only use its first part 221 to protect the edge area of ​​the display module 100 corresponding to the second area B2, but also use its second part 222 to protect the area of ​​the display module 100 corresponding to the first area B1 near the second area B2.

[0083] Based on this, the buffer structure 22 extends the buffer protection range of the display panel 10 in the display module 100 from the edge area of ​​the display module 100 inward, which can form a larger buffer protection range for the area of ​​the display module 100 near the edge that is susceptible to external stress, thereby further improving the overall structural stability and impact resistance of the display module 100 and reducing the probability of edge color spots appearing on the display panel 10.

[0084] like Figure 7 As shown, in some embodiments, the second part 222 and the second sub-part Q2 are on the same layer.

[0085] This design simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0086] like Figure 8 As shown, in some embodiments, the first part 221, the second part 222, and the second sub-part Q2 are arranged on the same layer.

[0087] Therefore, the fabrication process of the buffer structure 22 can be further simplified, and the fabrication process of the display module 100 can be simplified.

[0088] Figure 8 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0089] like Figure 8 As shown, in some embodiments, the buffer structure 22 further includes a second portion 222, which is located between the display panel 10 and the first heat dissipation layer 210. The boundary of the orthographic projection of the second portion 222 onto the display panel 10 coincides with the boundary of the orthographic projection of the first heat dissipation layer 210 onto the display panel 10, and the second portion 222 is reused as the first adhesive layer 211.

[0090] Therefore, the first adhesive layer 211 does not require additional processing to be fabricated separately, which simplifies the overall fabrication process of the display module 100. Furthermore, by reusing the second portion 222 as the first adhesive layer 211, the structural compactness and integration of the display module 100 are improved, meeting the requirement for a thinner and lighter display module 100. Additionally, as described above, along the second direction Z, the buffer structure 22 can completely cover the display panel 10, providing comprehensive buffer protection for all areas of the display panel 10, further reducing the probability of edge color spots appearing on the display panel 10.

[0091] Figure 9 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0092] like Figure 9 As shown, in some embodiments, the heat dissipation structure 21 includes a first adhesive layer 211, a first heat dissipation layer 210, a second adhesive layer 212, and a second heat dissipation layer 213, which are sequentially stacked on the backlight surface A2 of the display panel 10.

[0093] The second adhesive layer 212 can be used to fix and bond the first heat dissipation layer 210 and the second heat dissipation layer 213 together, so as to improve the overall structural stability of the heat dissipation structure 21. Thus, the heat dissipation structure 21 can dissipate heat from the display module 10 through its first heat dissipation layer 210, and can also dissipate heat from the display module 10 through its second heat dissipation layer 213, so as to further improve the heat dissipation effect of the heat dissipation component 20.

[0094] In some examples, except for the first heat dissipation layer 210 which is located only in the first region B1, all other film layers in the heat dissipation structure 21 extend from the first region B1 to the second region B2. In other words, along the second direction Z, the first adhesive layer 211, the second adhesive layer 212, and the second heat dissipation layer 213 all cover the display panel 10.

[0095] At this time, the first heat dissipation layer 210, the first adhesive layer 211, and the second adhesive layer 212 are recessed, and the first sub-part Q1 can fill the area recessed in the first heat dissipation layer 210. That is, the first sub-part Q1 is arranged circumferentially along the first heat dissipation layer 210, and the first sub-part Q1 is located between the first adhesive layer 211 and the second adhesive layer 212.

[0096] Based on this, the first sub-part Q1 can not only serve as a buffer and protection, but also support the first adhesive layer 211 and the second adhesive layer 212, thereby improving the overall structural stability of the heat dissipation assembly 20.

[0097] In some examples, the second heat dissipation layer 213 can be a metal heat dissipation layer. Metals generally have a high thermal conductivity, so metal heat dissipation layers have strong heat dissipation performance, which is beneficial to improving the heat dissipation effect of heat dissipation component 20.

[0098] For example, the metal heat dissipation layer can be a copper foil layer. Copper foil has advantages such as good electrical conductivity, good thermal conductivity, strong processability, and excellent ductility. As a heat dissipation film layer structure in the heat dissipation structure 21, it can play a role in rapid heat dissipation.

[0099] In some examples, the second adhesive layer 212 can be any of pressure-sensitive adhesive (PSA), silicone gel, or foam adhesive.

[0100] Based on this, the first heat dissipation layer 210 and the second heat dissipation layer 213 can be fixedly bonded by the second adhesive layer 212.

[0101] Figure 10 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0102] like Figure 10 As shown, in some embodiments, the heat dissipation structure 21 includes a first adhesive layer 211, a first heat dissipation layer 210, a second adhesive layer 212, and a second heat dissipation layer 213 sequentially stacked on the backlight surface A2 of the display panel 10. The second adhesive layer 212 is located in the first region B1. The first portion 221 of the buffer structure 22 includes a third sub-portion Q3, which is disposed around the second adhesive layer 212. In other words, the third sub-portion Q3 is disposed along the circumference of the second adhesive layer 212.

[0103] Based on this, the orthographic projection of the third sub-part Q3 on the display panel 10 is set around the first heat dissipation layer 210, which can also protect the edge of the first heat dissipation layer 210 from multiple directions. When the display module 100 encounters a slight collision or drop, it can buffer the instantaneous external force in all directions, reduce the probability of the instantaneous external force directly acting on the edge of the first heat dissipation layer 210, and further reduce the probability of edge color spots appearing on the display panel 10.

[0104] In some examples, the second adhesive layer 212 is not only located on the side surface of the first heat dissipation layer 210 facing away from the display panel 10, but also on two opposite sides of the first heat dissipation layer 210 in the first direction X. In other words, the second adhesive layer 212 covers the first heat dissipation layer 210.

[0105] This configuration increases the contact area between the second adhesive layer 212 and the first heat dissipation layer 210 and the second heat dissipation layer 213, allowing for better fixation and bonding of the first heat dissipation layer 210 and the second heat dissipation layer 213, and further improving the overall structural stability of the heat dissipation component 20.

[0106] It should be noted that the second heat dissipation layer 213 is located entirely within the first region B1. The second heat dissipation layer 213 is relatively thin, and the portion of the second heat dissipation layer 213 located on the side of the first heat dissipation layer 210 can also be considered as being within the first region B1.

[0107] The third sub-part Q3 is located between the first adhesive layer 211 and the second adhesive layer 212, and is disposed circumferentially along the second adhesive layer 212. This can be understood as the portion of the second heat dissipation layer 213 on the side of the first heat dissipation layer 210 that is away from the first heat dissipation layer 210, and the third sub-part Q3 is located between the second heat dissipation layer 213 and the first adhesive layer 211.

[0108] Based on this, the third sub-part Q3 can be positioned close to the edge of the first heat dissipation layer 210, which can protect the edge of the first heat dissipation layer 210 from multiple directions. When the display module 100 encounters a slight collision or drop, it can buffer the instantaneous external force in all directions and reduce the probability of edge color spots appearing on the display panel 10.

[0109] like Figure 10 As shown, in some embodiments, the third sub-part Q3 and the second adhesive layer 212 are disposed in the same layer.

[0110] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0111] In some examples, when the third sub-part Q3 and the second adhesive layer 212 are disposed in the same layer, the materials of the third sub-part Q3 and the second adhesive layer 212 are the same. In this case, the materials can be foam adhesive or silicone gel, which have both adhesive and cushioning properties. In this case, the third sub-part Q3 and the second adhesive layer 212 can both serve as adhesive fixation and provide a certain degree of cushioning, thereby improving the cushioning performance of the heat dissipation assembly 20.

[0112] Figure 11 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0113] like Figure 11 As shown, in some embodiments, the first portion 221 of the buffer structure 22 includes a first sub-part Q1 and a third sub-part Q3, with the third sub-part Q3 located between the first sub-part Q1 and the second heat dissipation layer 213.

[0114] The first part 221 of the buffer structure 22 can both buffer external forces to reduce the probability of edge color spots appearing on the display panel 10 and provide support to improve the overall stability of the heat dissipation component 20.

[0115] In some examples, such as Figure 11 As shown, when the first part 221 of the buffer structure 22 includes a first sub-part Q1 and a third sub-part Q3, the first sub-part Q1 and the third sub-part Q3 are arranged in the same layer.

[0116] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0117] In some other examples, where the first part 221 of the buffer structure 22 includes a first sub-part Q1 and a third sub-part Q3, the third sub-part Q3 may also be disposed in the same layer as the second adhesive layer 212.

[0118] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0119] Figure 12 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0120] like Figure 12 As shown, in some embodiments, the first portion 221 of the buffer structure 22 includes a second sub-part Q2 and a third sub-part Q3.

[0121] The third sub-section Q3 is located between the second sub-section Q2 and the second heat dissipation layer 213.

[0122] The first part 221 of the buffer structure 22 can both buffer external forces to reduce the probability of edge color spots appearing on the display panel 10 and provide support to improve the overall stability of the heat dissipation component 20.

[0123] In some examples, the second sub-component Q2 and the third sub-component Q3 can be set on the same level.

[0124] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0125] In other examples, the second sub-part Q2 is disposed in the same layer as the first adhesive layer 211, and the third sub-part Q3 may also be disposed in the same layer as the second adhesive layer 212.

[0126] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0127] Figure 13 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0128] like Figure 13 As shown, in some embodiments, the first portion 221 of the buffer structure 22 includes a first sub-part Q1, a second sub-part Q2 and a third sub-part Q3, with the third sub-part Q3 located between the first sub-part Q1 and the second heat dissipation layer 213.

[0129] The first part 221 of the buffer structure 22 can both buffer external forces to reduce the probability of edge color spots appearing on the display panel 10 and provide support to improve the overall stability of the heat dissipation component 20.

[0130] In some examples, such as Figure 13 As shown, when the first part 221 of the buffer structure 22 includes a first sub-part Q1, a second sub-part Q2 and a third sub-part Q3, the first sub-part Q1, the second sub-part Q2 and the third sub-part Q3 are arranged in the same layer.

[0131] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0132] In some other examples, where the first part 221 of the buffer structure 22 includes a first sub-part Q1, a second sub-part Q2 and a third sub-part Q3, the third sub-part Q3 may also be disposed in the same layer as the second adhesive layer 212.

[0133] This simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0134] Figure 14 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0135] like Figure 14 As shown, in some embodiments, the buffer structure 22 further includes a third portion 223 located in the first region B1. Along the first direction (the direction from the second region B2 to the first region B1) X, the third portion 223 is located between the third sub-part Q3 and the second adhesive layer 212. As shown above, the buffer structure 22 can extend from the second area B2 into the first area B1. The buffer structure 22 can not only use its first part 221 to protect the edge area of ​​the display module 100 corresponding to the second area B2, but also use its third part 223 to protect the area of ​​the display module 100 corresponding to the first area B1 near the second area B2.

[0136] Based on this, the buffer structure 22 extends the buffer protection range of the display panel 10 in the display module 100 from the edge area of ​​the display module 100 inward, which can form a larger buffer protection range for the area of ​​the display module 100 near the edge that is susceptible to external stress, thereby further improving the overall structural stability and impact resistance of the display module 100 and reducing the probability of edge color spots appearing on the display panel 10.

[0137] like Figure 14 As shown, in some embodiments, the third part 223 and the third sub-part Q3 are on the same layer.

[0138] This design simplifies the fabrication process of the buffer structure 22 and the fabrication process of the display module 100.

[0139] Figure 15 This is a schematic diagram of the structure of another display module provided in an embodiment of the present disclosure.

[0140] like Figure 15 As shown, in some embodiments, the buffer structure 22 further includes a third portion 223, which is located between the first heat dissipation layer 210 and the second heat dissipation layer 213. The boundary of the orthographic projection of the third portion 223 onto the display panel 10 coincides with the boundary of the orthographic projection of the first heat dissipation layer 210 onto the display panel 10. The third portion 223 is reused as the second adhesive layer 212.

[0141] Therefore, the second adhesive layer 212 does not require additional processing to be fabricated separately, which simplifies the overall fabrication process of the display module 100. Furthermore, by reusing the third part 223 as the second adhesive layer 212, the structural compactness and integration of the display module 100 are improved, meeting the requirement for a thinner and lighter display module 100. Additionally, as described above, along the second direction Z, the buffer structure 22 can completely cover the display panel 10, providing comprehensive buffer protection for all areas of the display panel 10, further reducing the probability of edge color spots appearing on the display panel 10.

[0142] Based on the above embodiments, it can be seen that the buffer structure 22 may include the following situations: The first type: the buffer structure 22 may consist of only the first part 221.

[0143] The second type: the buffer structure 22 may include either the first part 221, or either the second part 222 or the third part 223.

[0144] The third type: the buffer structure 22 may include a first part 221, a second part 222 and a third part 223.

[0145] The first part 221 of the buffer structure 22 can include the following cases: The first type: The first part 221 includes only one of the first sub-parts Q1, the second sub-parts Q2, or the third sub-parts Q3.

[0146] The second type: The first part 221 includes any two of the first sub-parts Q1, the second sub-parts Q2, or the third sub-parts Q3.

[0147] The third type: Part 221 includes a first sub-part Q1, a second sub-part Q2, and a third sub-part Q3.

[0148] Regardless of the structure described above, the buffer structure 22 can be used to buffer external forces to protect the display panel 10. In addition, it can also fix and limit the first heat dissipation layer 210 to improve the overall structural stability of the heat dissipation component 20.

[0149] Furthermore, regardless of the aforementioned structure, the material of the buffer structure 22 can be uniformly either silicone gel or foam adhesive. Alternatively, the materials of different parts or sub-parts can be different, such as silicone gel and foam adhesive respectively.

[0150] For example, the material of the first sub-section Q1 of the first portion 221 in the buffer structure 22 can be silicone gel or foam adhesive. The material of the second sub-section Q2, which is located in the same layer as the first adhesive layer 211, can be the same as the first adhesive layer 211, so that they can be formed in one process; that is, the material of the second sub-section Q2 can be foam adhesive. Similarly, the material of the third sub-section Q3, which is located in the same layer as the second adhesive layer 212, can be the same as the second adhesive layer 212, so that they can be formed in one process; that is, the material of the third sub-section Q3 can be silicone gel.

[0151] The material of the second part 222 in the buffer structure 22, which is located in the same layer as the first adhesive layer 211, can be the same as the first adhesive layer 211, so that the two can be formed in one process. That is, the material of the second part 222 can be foam adhesive.

[0152] The material of the third part 223 in the buffer structure 22, which is located in the same layer as the second adhesive layer 212, can be the same as the second adhesive layer 212 so that the two can be formed in one process. That is, the material of the third part 223 can be silicone gel.

[0153] However, the buffer structure 22 provided in this embodiment is not limited to this. The above is just an example. Other structures that can satisfy the elastic modulus of the buffer structure 22 can also be applied here.

[0154] Some embodiments of this disclosure provide a display device. Figure 16 This is a schematic diagram of the structure of a display device provided in an embodiment of the present disclosure.

[0155] like Figure 16 As shown, the display device 200 is a product with image display capabilities (including still images or moving images, where moving images can be video). For example, the display device 200 can be any of the following: monitor, television set, billboard, digital photo frame, laser printer with display function, telephone, mobile phone, personal digital assistant (PDA), digital camera, portable camcorder, viewfinder, navigator, vehicle, large-area wall display, home appliance, information query equipment (such as business query equipment for e-government, banks, hospitals, power companies, etc.), monitor, etc.

[0156] like Figure 16 As shown, the display device 200 includes the display module 100 provided in any of the above embodiments. Therefore, the display device 200 provided by the present invention has all the beneficial effects of the display module 100 provided in any of the above embodiments, which will not be elaborated here.

[0157] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0158] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized by The display module comprises: a display panel comprising opposite light-emitting and back surfaces; a heat dissipation assembly located on a side of the back surface of the display panel facing away from the light-emitting surface; the heat dissipation assembly comprises a first region and a second region surrounding the first region; the heat dissipation assembly comprises: a heat dissipation structure comprising a first heat dissipation layer located in the first region; a buffer structure comprising a first part located in the second region; the buffer structure has an elastic modulus A, and 0.1 Mpa≤A≤10 Mpa.

2. The display module of claim 1, wherein, The first part comprises a first sub-part, which is arranged around the first heat dissipation layer.

3. The display module of claim 2, wherein, In a direction of the second region pointing to the first region, the first sub-part covers the first heat dissipation layer.

4. The display module of claim 2, wherein, In a thickness direction of the display panel, the first sub-part comprises a plurality of buffer sub-parts, and in any two adjacent buffer sub-parts: the buffer sub-part closer to the display panel has a greater elastic modulus than the buffer sub-part farther away from the display panel.

5. The display module of claim 1, wherein, The heat dissipation structure further comprises a first adhesive layer located between the first heat dissipation layer and the display panel; the first adhesive layer is located in the first region; The first part comprises a second sub-part, which is arranged around the first adhesive layer.

6. The display module of claim 5, wherein, The buffer structure further comprises a second part located in the first region; In a direction of the second region pointing to the first region, the second part is located between the second sub-part and the first adhesive layer.

7. The display module of claim 6, wherein, The second part and the second sub-part are in the same layer.

8. The display module of claim 5, wherein, The buffer structure further comprises a second part located in the first region; the second part is multiplexed as the first adhesive layer.

9. The display module of claim 1, wherein, The heat dissipation structure comprises a first adhesive layer, the first heat dissipation layer, a second adhesive layer and a second heat dissipation layer stacked in sequence on the back surface of the display panel; the second adhesive layer is located in the first region; The first part comprises a third sub-part, which is arranged around the second adhesive layer.

10. The display module of claim 9, wherein, The buffer structure further comprises a third part located in the first region; In a direction of the second region pointing to the first region, the third part is located between the third sub-part and the second adhesive layer.

11. The display module of claim 10, wherein, The third part and the third sub-part are in the same layer.

12. The display module of claim 9, wherein, The buffer structure further comprises a third part located in the first region; the third part is multiplexed as the second adhesive layer.

13. The display module of claim 1, wherein, The material of the buffer structure comprises one or both of silicone gel and foam rubber.

14. A display device comprising: The display module comprises: The display module according to any one of claims 1-13.

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