A fluid-driven magnetically coupled vacuum-isolated heat redistribution system and method

Abstract

This invention discloses a fluid-driven magnetically coupled vacuum-isolated heat redistribution system and method, relating to the technical field of high heat flux density thermal management systems for electronic platforms. The system includes a main cooling circuit, a coolant bypass branch, a vacuum-sealed secondary closed circuit, a magnetically coupled drive assembly, a cold plate for a first heat dissipation area, a secondary cooling assembly for a second heat dissipation area, and a heat dissipation assembly. This invention utilizes the kinetic energy of the fluid flowing through the main cooling circuit to drive the circulation of a high thermal conductivity secondary coolant within the vacuum-sealed secondary closed circuit via magnetic coupling. This eliminates the need for mechanical shaft penetration or external power. The secondary coolant actively transfers heat energy between different thermal regions of the electronic device and achieves extended-area heat dissipation through a common-wall coupling structure. This system integrates with existing main cooling infrastructure and is suitable for high heat flux density electronic platforms.

Description

Technical Field

[0001] This invention relates to the field of high heat flux density thermal management system technology for electronic platforms, and specifically to a fluid-driven magnetic coupling vacuum isolation heat redistribution system and method. Background Technology

[0002] Modern high-performance electronic platforms, including high-performance computing systems, graphics processing units (GPUs), artificial intelligence accelerators, and data center processors, generate extremely high local heat flux densities within a limited substrate area.

[0003] Traditional cooling methods attempt to dissipate heat only within the geometric region where it is generated, resulting in localized heat density bottlenecks and underutilization of adjacent areas with low heat flux. Passive heat exchange solutions such as vapor chambers and loop heat pipes lack active, controlled circulation across different thermal zones. In some implementations, a secondary circulation system is introduced; however, such systems typically rely on electrically driven auxiliary pumps (such as electromagnetic pumps) or mechanical shaft penetration into the sealed cavity. Electrically driven auxiliary pumps require additional power supplies, and mechanical shaft penetration introduces leakage risks, sealing complexity, and long-term reliability issues.

[0004] Therefore, a heat redistribution architecture is still needed, which utilizes the existing fluid kinetic energy in the main cooling loop to actively circulate a high thermal conductivity secondary coolant in a vacuum-isolated sealed loop, and redistributes heat to different hot areas while simultaneously dissipating heat. The applicant previously disclosed a "dual-medium layered cascaded liquid cooling system" (application number 202511203134.8), which establishes a dual-medium layered heat transfer framework for the main and secondary cooling loops, and achieves multi-region heat transfer and cascaded dissipation through a common-wall coupling structure.

[0005] However, this system does not address a structural solution that utilizes the existing fluid kinetic energy in the main cooling circuit to achieve active circulation in the vacuum-sealed secondary circuit via magnetic coupling, without mechanical shaft penetration and without the need for external power. In other words, while the existing dual-medium layered architecture provides a thermal stratification path, it does not solve the problem of power input in the vacuum-sealed secondary circuit. Summary of the Invention

[0006] The main objective of this invention is to provide a fluid-driven magnetic coupling vacuum isolation heat redistribution system and method, which enables the auxiliary coolant to actively circulate without the need for an independent power supply and shaft seal structure, thereby forming a complete cross-regional heat redistribution system to overcome the problems existing in the prior art.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A fluid-driven magnetically coupled vacuum-isolated heat redistribution system includes a main cooling circuit, a coolant bypass branch, a vacuum-sealed secondary closed circuit, a magnetically coupled drive assembly, a cold plate for a first heat dissipation area, a secondary cooling assembly for a second heat dissipation area, and a heat dissipation assembly. The main cooling circuit is used to circulate the main coolant. The coolant bypass branch is connected to the main cooling circuit and diverts part of the main coolant. The vacuum-sealed secondary closed circuit is used to circulate the secondary coolant, and it includes a secondary coolant push pipe and a secondary coolant delivery pipe. The magnetically coupled drive assembly includes an external drive element, an internal driven element, and a solid isolation boundary. The external drive element is disposed in the coolant bypass branch and rotates under the hydrodynamic action of the main coolant in the branch flow. The internal driven element is disposed in the vacuum-sealed secondary closed loop and is magnetically coupled to the external drive element. The solid isolation boundary is used to separate the external drive element from the internal driven element. The first heat dissipation area cold plate is thermally coupled to the high heat flux density area of ​​the electronic device and is connected to the auxiliary coolant pushing pipe. The second heat dissipation area auxiliary cooling component is thermally coupled to the low heat flux density area of ​​the electronic device and is connected to the auxiliary coolant delivery pipe. The heat dissipation component includes the first heat dissipation area main cooling component and the second heat dissipation area water cooling plate. The first heat dissipation area main cooling component is coupled to the first heat dissipation area cold plate, and the second heat dissipation area water cooling plate is coupled to the second heat dissipation area auxiliary cooling component. The rotating external driving element drives the internal driven element to rotate synchronously across the solid isolation boundary by transmitting magnetic torque. The rotating internal driven element causes the auxiliary coolant to circulate within the vacuum-sealed secondary closed loop. The circulation of the auxiliary coolant transports heat energy from the high heat flux density region of the electronic device to the low heat flux density region, and then the heat energy is dissipated by the main cooling loop.

[0008] Furthermore, the main cooling circuit includes a coolant circuit connected to the electronic platform cooling infrastructure, wherein the main coolant inside is provided with thrust circulation by a coolant distribution unit, and the main coolant generates fluid kinetic energy during normal operation.

[0009] Furthermore, the thermal conductivity of the secondary coolant is higher than that of the primary coolant.

[0010] Furthermore, the main coolant is a water-based or glycol-based coolant, and the secondary coolant is a liquid metal.

[0011] Furthermore, the liquid metal is a gallium-based alloy.

[0012] Furthermore, the coolant bypass branch is connected to the main cooling circuit through the main coolant inlet and outlet pipes. A portion of the main coolant diverted by the coolant bypass branch flows to the magnetic coupling drive assembly. After driving the external drive element, the diverted main coolant returns to the main cooling circuit.

[0013] Furthermore, the vacuum-sealed secondary closed loop is physically isolated from the main cooling loop. The vacuum-sealed secondary closed loop is an airtight, vacuum-operated closed fluid loop made of vacuum-sealing material with a corrosion-resistant coating on its inner surface. It operates under a vacuum sufficient to eliminate gas inclusions. The auxiliary coolant delivery pipe is used to transport the heat-carrying auxiliary coolant from the cold plate of the first heat dissipation area to the auxiliary cooling component of the second heat dissipation area, and the magnetic coupling drive component sends the cooled auxiliary coolant back to the cold plate of the first heat dissipation area through the return path.

[0014] Furthermore, the vacuum-sealed secondary closed loop includes multiple independent sub-vacuum-sealed secondary closed loops, each of which is associated with a discrete heat source.

[0015] Furthermore, the magnetic coupling drive assembly also includes an outer magnetic turntable and a permanent magnet assembly. The outer magnetic turntable is coaxially fixed with the external drive element. The permanent magnet assembly includes a plurality of permanent magnets with magnetic field strength. The plurality of permanent magnets are respectively embedded in the outer magnetic turntable and the internal driven element, and are separated by the solid isolation boundary to form a magnetic coupling interface. The internal driven element is located inside the sealed drive cavity and is coupled to the external magnetic disk by magnetic force. The sealed drive cavity is connected to the vacuum sealing secondary closed loop to ensure vacuum sealing. The diverted main coolant causes the external drive element to rotate, and the external magnetic disk rotates accordingly. The magnetic torque passes through the solid isolation boundary and drives the internal driven element to rotate synchronously. The internal driven element pushes the secondary coolant to circulate in the vacuum sealing secondary closed loop.

[0016] Furthermore, the external drive element is an impeller, gear, or turbine.

[0017] Furthermore, the effective thermal surface area of ​​the water-cooled plate in the second heat dissipation area is larger than that of the cold plate in the first heat dissipation area, and the main cooling component in the first heat dissipation area and the water-cooled plate in the second heat dissipation area are connected to the main cooling circuit in series or in parallel. Part of the heat is dissipated through the main cooling component in the first heat dissipation area, while the other part is actively transported to the secondary cooling component in the second heat dissipation area for redistribution, and then finally dissipated through common wall coupling to the water-cooled plate in the second heat dissipation area.

[0018] Furthermore, the main cooling component of the first heat dissipation area is coupled to the cold plate of the first heat dissipation area through a common wall coupling plate, and the common wall coupling plate is provided with a liquid cooling manifold and a heat dissipation microchannel for the main coolant of the first heat dissipation area. The first heat dissipation area cold plate includes a first heat dissipation area substrate, a first heat dissipation area secondary cold plate heat conduction pillars arrayed on the first heat dissipation area substrate, a first heat dissipation area secondary cold plate flow channel formed around the first heat dissipation area secondary cold plate heat conduction pillars, and a first heat dissipation area cold plate cover plate covering the first heat dissipation area secondary cold plate flow channel and the first heat dissipation area secondary cold plate heat conduction pillars.

[0019] Furthermore, the secondary cooling component of the second heat dissipation area and the water-cooled plate of the second heat dissipation area are thermally connected by a common wall coupling structure. The common wall coupling structure is an integrated physical partition. One side of the partition faces the vacuum-sealed secondary closed loop and is provided with a secondary cold plate confluence channel and a secondary cold plate heat conduction column of the second heat dissipation area. The other side of the partition faces the main cooling loop and is provided with a main coolant heat dissipation microchannel of the second heat dissipation area.

[0020] A fluid-driven magnetically coupled vacuum-isolated heat redistribution method includes the following steps: S1. The main coolant is circulated through the main cooling circuit; S2. A portion of the main coolant is diverted to the coolant bypass branch to drive the external drive element to rotate under hydrodynamic action; S3. The torque is magnetically transmitted from the rotating external drive element through the solid isolation boundary to the internal driven element located within the closed loop of the vacuum-sealed pair; S4. The internal driven element is used to drive the auxiliary coolant to circulate within the vacuum-sealed auxiliary closed loop; S5. The heat energy from the high heat flux density area of ​​the electronic device is absorbed into the auxiliary coolant through the cold plate of the first heat dissipation area. S6. The absorbed heat energy is transferred to the low heat flux density area of ​​the electronic equipment through the circulating auxiliary coolant. S7. The delivered heat energy is then redistributed through the secondary cooling component of the second heat dissipation area. S8. The redistributed heat energy is transferred from the secondary cooling component of the second heat dissipation area to the water-cooled plate of the second heat dissipation area coupled to the main cooling circuit for final dissipation. At the same time, a portion of the heat energy from the high heat flux density area is dissipated directly by the main cooling circuit through the main cooling component of the first heat dissipation area.

[0021] Compared with the prior art, the present invention has the following beneficial effects: The system of this invention is integrated with existing main cooling infrastructure and is suitable for high heat flux density electronic platforms. It utilizes the kinetic energy of the fluid diverted from the main cooling circuit to convert the fluid kinetic energy from the existing main cooling circuit into magnetic torque. The high thermal conductivity secondary coolant is driven to circulate in the vacuum-sealed secondary closed circuit through magnetic coupling. No mechanical shaft penetration or external power is required. The secondary coolant actively transports heat energy between different thermal regions of the electronic device and achieves extended area heat dissipation through a common wall coupling structure. A portion of the fluid kinetic energy from the main cooling circuit is diverted through the coolant bypass branch to drive the external drive element of the magnetically coupled drive assembly to rotate. The magnetic torque is transmitted through the solid isolation boundary via the magnetic coupling interface, thereby driving the internal driven element located in the vacuum-sealed secondary circuit to rotate. As a result, the secondary coolant circulates within the vacuum-sealed secondary circuit, redistributing heat without the need for mechanical shaft penetration or a separate electric drive source. The circulating secondary coolant actively transports heat energy from the high heat flux density area of ​​the electronic device to the low heat flux density area. Some of the heat is redistributed to the main cooling circuit's first heat dissipation area (main cooling assembly) and the second heat dissipation area (water-cooled plate), and is carried away by the main coolant for final dissipation. Attached Figure Description

[0022] Figure 1 This is a schematic diagram showing the distribution of high heat flux density regions and adjacent low heat flux density regions in the high-performance data processing area of ​​the electronic device of the present invention.

[0023] Figure 2 This is a schematic diagram of the overall structure of the fluid-driven magnetic coupling vacuum dual-loop, dual-medium heat redistribution system of the present invention.

[0024] Figure 3 For the present invention Figure 2 Top view of the system structure.

[0025] Figure 4 For the present invention Figure 2 Side view of the system structure.

[0026] Figure 5 This is a schematic diagram of the internal structure of the cold plate in the first heat dissipation area of ​​the present invention.

[0027] Figure 6 This is a top view of the cold plate in the first heat dissipation area of ​​the present invention.

[0028] Figure 7 This is a schematic diagram of the structure of the cold plate cover of the first heat dissipation area and the main cooling component of the first heat dissipation area being coupled together on the same wall.

[0029] Figure 8 This is a schematic diagram of the structure of the cold plate cover plate in the first heat dissipation area of ​​the present invention.

[0030] Figure 9This is a schematic diagram of the structure at the common-wall coupling plate of the present invention.

[0031] Figure 10 This is a schematic diagram of the heat dissipation microchannel and liquid cooling confluence channel on the common wall coupling surface of the main cooling component in the first heat dissipation area of ​​the present invention.

[0032] Figure 11 This is a schematic diagram showing the co-wall coupling between the secondary cooling component of the second heat dissipation area and the water-cooled plate of the second heat dissipation area in this invention.

[0033] Figure 12 This is a front view of the shared-wall coupling between the secondary cooling component of the second heat dissipation area and the water-cooled plate of the second heat dissipation area according to the present invention.

[0034] Figure 13 This is a schematic diagram of the heat dissipation microchannel in the reverse structure of the secondary cooling component in the second heat dissipation area of ​​the present invention.

[0035] Figure 14 This is a schematic diagram of the structure of the base plate of the second heat dissipation area of ​​the present invention.

[0036] Figure 15 This is a schematic diagram of the overall structure of the magnetic coupling drive component of the present invention.

[0037] Figure 16 This is an exploded structural diagram of the magnetic coupling drive component of the present invention.

[0038] Explanation of reference numerals in the attached figures: 100-Heat redistribution system, 110-Main cooling circuit, 120-Coolant bypass branch, 200-Vacuum-sealed secondary closed circuit, 210-Secondary coolant push pipe, 220-Secondary coolant delivery pipe, 300-Magnetic coupling drive assembly, 310-External drive element, 320-External magnetic turntable, 330-Bearing, 340-Permanent magnet assembly, 350-Internal driven element, 360-Sealed drive cavity, 370-Solid isolation boundary, 400-Cold plate of the first heat dissipation area, 410-Heat source interface of the first heat dissipation area, 420-Flow channel of the secondary cold plate of the first heat dissipation area, 430-Secondary cold plate of the first heat dissipation area. Heat-conducting pillars, 440 - cold plate cover plate of the first heat dissipation area, 450 - periphery of the cold plate of the first heat dissipation area, 500 - water-cooled plate of the second heat dissipation area, 510 - heat source interface of the substrate of the second heat dissipation area, 520 - substrate of the second heat dissipation area, 530 - heat dissipation microchannel of the main coolant of the second heat dissipation area, 540 - bottom plate of the second heat dissipation area, 600 - main cooling component of the first heat dissipation area, 610 - common wall coupling plate, 620 - liquid cooling manifold, 630 - heat dissipation microchannel of the main coolant of the first heat dissipation area, 700 - secondary cooling component of the second heat dissipation area, 710 - secondary cold plate manifold of the second heat dissipation area, 720 - heat-conducting pillar of the secondary cold plate of the second heat dissipation area. Detailed Implementation

[0039] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0040] Example 1

[0041] Combination Figures 1 to 16 This embodiment provides a fluid-driven magnetic coupling vacuum isolation heat redistribution system, including a main cooling circuit 110, a coolant bypass branch 120, a vacuum-sealed secondary closed circuit 200, a magnetic coupling drive assembly 300, a first heat dissipation area cold plate 400, a second heat dissipation area secondary cooling assembly 700, and a heat dissipation assembly. The main cooling circuit 110 is used to circulate the main coolant. The coolant bypass branch 120 is connected to the main cooling circuit 110 and diverts part of the main coolant. The vacuum-sealed secondary closed circuit 200 is used to circulate the secondary coolant. The first heat dissipation area cold plate 400 is thermally coupled to the high heat flux density area of ​​the electronic device and is connected to the auxiliary coolant pushing pipe 210. The second heat dissipation area auxiliary cooling component 700 is thermally coupled to the low heat flux density area of ​​the electronic device and is connected to the auxiliary coolant delivery pipe 220. The heat dissipation component includes the first heat dissipation area main cooling component 600 and the second heat dissipation area water cooling plate 500. The first heat dissipation area main cooling component 600 is coupled to the first heat dissipation area cold plate 400, and the second heat dissipation area water cooling plate 500 is coupled to the second heat dissipation area auxiliary cooling component 700. The rotating external drive element 310 drives the internal driven element 350 to rotate synchronously across the solid isolation boundary 370 by transmitting magnetic torque. The rotating internal driven element 350 causes the auxiliary coolant to circulate within the vacuum-sealed secondary closed loop 200. The circulation of the auxiliary coolant transfers heat energy from the high heat flux density area of ​​the electronic device to the low heat flux density area, and then the heat energy is dissipated by the main cooling loop 110.

[0042] The system in this embodiment is a dual-loop, dual-medium heat redistribution architecture that follows two core design principles. The first is fluid-magnetic energy conversion: without external power and without mechanical shaft penetration, torque is transmitted purely through magnetic force passing through the hermetically sealed solid isolation boundary 370. The magnetically coupled drive component 300 is driven solely by the fluid kinetic energy from the main cooling circuit 110, without any independent electric drive device.

[0043] Secondly, there is vacuum-isolated cross-regional heat transfer: the vacuum-sealed closed loop 200 is vacuum-sealed to enhance heat transfer efficiency, and heat energy is actively transferred from the first region to the second region before final heat dissipation.

[0044] In this embodiment, the main cooling circuit 110 is the power source and final heat dissipation path of the system, including a coolant circuit connected to the cooling infrastructure of the electronic platform. The main coolant inside is provided with thrust circulation by the coolant distribution unit, and the main coolant generates fluid kinetic energy during normal operation.

[0045] In this embodiment, the thermal conductivity of the secondary coolant is higher than that of the primary coolant. Specifically, the primary coolant is a water-based or glycol-based coolant, and the secondary coolant is a liquid metal (thermal conductivity approximately 40 W / m·K). Preferably, the liquid metal is a gallium-based alloy.

[0046] In another embodiment, the secondary coolant may be a two-phase medium or a vapor chamber working fluid.

[0047] In this embodiment, the coolant bypass branch 120 is a parallel fluid branch that is fluidly connected to the main cooling circuit 110. It is connected to the main cooling circuit 110 through the main coolant inlet and outlet pipes. A portion of the main coolant diverted by the coolant bypass branch 120 flows to the magnetic coupling drive assembly 300. After driving the external drive element 310, the diverted main coolant returns to the main cooling circuit 110.

[0048] The coolant bypass branch 120 is sized to divert sufficient secondary coolant flow to drive the external drive element 310, while minimizing the impact on the main loop flow characteristics. An optional flow control valve can be integrated to adjust the diversion ratio.

[0049] like Figure 2-4 As shown, in this embodiment, the vacuum-sealed secondary closed loop 200 includes a secondary coolant pushing pipe 210 and a secondary coolant conveying pipe 220; it is the cross-regional heat transfer path of the system, and is an airtight, vacuum-operated closed fluid loop made of vacuum-sealed material with a corrosion-resistant coating on the inner surface, and is physically isolated from the main cooling loop 110; wherein, the secondary coolant conveying pipe 220 is used to convey the heat-carrying secondary coolant from the cold plate 400 of the first heat dissipation area to the secondary cooling assembly 700 of the second heat dissipation area, and the magnetic coupling drive assembly 300 sends the cooled secondary coolant back to the cold plate 400 of the first heat dissipation area through the return path.

[0050] Specifically, the vacuum-sealed closed loop 200 is evacuated during manufacturing to eliminate gas inclusions, prevent oxidation, and enhance heat transfer efficiency. The vacuum-sealed closed loop operates at a vacuum level sufficient to eliminate gas inclusions.

[0051] For electronic devices with multiple discrete high heat flux density sources, the vacuum-sealed secondary closed loop can be configured as multiple independent vacuum-sealed secondary closed loops, each with its own magnetic coupling drive assembly and coolant bypass branch.

[0052] like Figure 5-14 As shown, in this embodiment, the effective thermal surface area of ​​the water-cooled plate 500 in the second heat dissipation area is larger than that of the cold plate 400 in the first heat dissipation area. The main cooling component 600 in the first heat dissipation area and the water-cooled plate 500 in the second heat dissipation area are connected to the main cooling circuit 110 in series or in parallel. Part of the heat is dissipated by the main cooling component 600 in the first heat dissipation area, and the other part of the heat is actively transported to the auxiliary cooling component 700 in the second heat dissipation area for redistribution. The heat is then coupled to the water-cooled plate 500 in the second heat dissipation area through a common wall for final dissipation.

[0053] The main cooling component 600 of the first heat dissipation area is coupled to the cold plate 400 of the first heat dissipation area through a common wall coupling plate 610. The common wall coupling plate 610 is provided with a liquid cooling manifold 620 and a heat dissipation microchannel 630 for the main coolant of the first heat dissipation area. The cold plate 400 of the first heat dissipation area includes a first heat dissipation area substrate, a first heat dissipation area secondary cold plate heat conduction pillars 430 arranged in an array on the first heat dissipation area substrate, a first heat dissipation area secondary cold plate flow channel 420 formed around the first heat dissipation area secondary cold plate heat conduction pillars 430, and a first heat dissipation area cold plate cover plate 440 covering the first heat dissipation area secondary cold plate flow channel 420 and the first heat dissipation area secondary cold plate heat conduction pillars 430.

[0054] Specifically, in order to reduce thermal resistance, the main cooling plate and the auxiliary cooling plate adopt a common wall structure: the cold plate cover plate 440 of the first heat dissipation area is also the common wall coupling plate 610 of the main cooling component 600 of the first heat dissipation area.

[0055] The secondary cooling component 700 of the second heat dissipation area and the water-cooled plate 500 of the second heat dissipation area are thermally connected by a common wall coupling structure. The common wall coupling structure is an integrated physical partition. One side of the partition faces the vacuum-sealed secondary closed loop 200 and is provided with the secondary cold plate confluence channel 710 and the secondary cold plate heat conduction column 720 of the second heat dissipation area. The other side of the partition faces the main cooling loop 110 and is provided with the main coolant heat dissipation microchannel 530 of the second heat dissipation area.

[0056] Specifically, the second heat dissipation area water-cooled plate 500 includes a second heat dissipation area substrate 520 and a second heat dissipation area main coolant heat dissipation microchannel 530 with internal channels for the flow of main coolant.

[0057] like Figure 15-16As shown, in this embodiment, the magnetic coupling drive assembly 300 includes an external drive element 310, an external magnetic turntable 320, a bearing 330, a permanent magnet assembly 340, an internal driven element 350, and a solid isolation boundary 370. The external drive element 310 is disposed in the coolant bypass branch 120 and rotates under the hydrodynamic action of the main coolant. The internal driven element 350 is disposed in the vacuum-sealed closed loop 200 and is magnetically coupled to the external drive element 310. The solid isolation boundary 370 is used to separate the external drive element 310 from the internal driven element 350. The external magnetic turntable 320 is coaxially fixed with the external drive element 310. The permanent magnet assembly 340 includes a plurality of permanent magnets with magnetic field strength. The plurality of permanent magnets are respectively embedded in the external magnetic turntable 320 and the internal driven element 350 and are separated by the solid isolation boundary 370 to form a magnetic coupling interface. The internal driven element 350 is located inside the sealed drive cavity 360 and is coupled to the external magnetic disk 320 by magnetic force. The sealed drive cavity 360 is connected to the vacuum sealing secondary closed loop 200 to ensure vacuum sealing. The diverted main coolant causes the external drive element 310 to rotate, and the external magnetic disk 320 rotates accordingly. The magnetic torque passes through the solid isolation boundary 370 to drive the internal driven element 350 to rotate synchronously. The internal driven element 350 pushes the secondary coolant to circulate in the vacuum sealing secondary closed loop 200.

[0058] Specifically, the external drive element 310 is a rotating fluid element disposed within the coolant bypass branch 120. The diverted secondary coolant causes the element 310 to rotate at a speed proportional to the flow rate of the main circuit. It can be selected from impellers, gears, or turbines. The solid isolation boundary 370 is an airtight, non-magnetic, vacuum-sealed solid barrier that physically and fluidly separates the outer magnetic disk 320 from the internal driven element 350. No mechanical shafts, rods, or other components penetrate the solid isolation boundary 370, thereby maintaining the vacuum integrity of the vacuum-sealed secondary closed loop 200. The internal driven element 350 is coupled to the outer magnetic disk 320 by magnetic force to achieve synchronous rotation, thereby acting as a pump to drive the flow of secondary coolant. The sealed drive cavity 360 is used to accommodate the internal driven element 350 and communicates with the vacuum-sealed secondary closed loop 200, thereby ensuring a vacuum seal.

[0059] Example 2

[0060] This embodiment provides a fluid-driven magnetic coupling vacuum isolation heat redistribution method. The method is implemented based on the system described in this embodiment and specifically includes the following steps: S1. Allow the main coolant to circulate through the main cooling circuit 110; S2. A portion of the main coolant is diverted to the coolant bypass branch 120 to drive the external drive element 310 to rotate under hydrodynamic action. S3. The torque is magnetically transmitted from the rotating external drive element 310 through the solid isolation boundary 370 to the internal driven element 350 located in the vacuum-sealed closed loop 200. S4. The internal driven element 350 drives the auxiliary coolant to circulate within the vacuum-sealed auxiliary closed loop 200. S5. The heat energy from the high heat flux density area of ​​the electronic device is absorbed into the auxiliary coolant through the cold plate 400 of the first heat dissipation area. S6. The absorbed heat energy is transferred to the low heat flux density area of ​​the electronic equipment through the circulating auxiliary coolant. S7. The delivered heat energy is then redistributed through the secondary cooling component 700 in the second heat dissipation area. S8. The redistributed heat energy is transferred from the secondary cooling component 700 of the second heat dissipation area to the water-cooled plate 500 of the second heat dissipation area coupled to the main cooling circuit 110 for final dissipation. At the same time, a portion of the heat energy from the high heat flux density area is dissipated directly by the main cooling circuit 110 through the main cooling component 600 of the first heat dissipation area.

[0061] Working principle: The complete system operation cycle is as follows

[0062] Heat from the high heat flux density area in the high-performance processing zone is transferred to the cold plate 400 of the first heat dissipation zone through the heat source interface of the first heat dissipation zone. Part of the heat is transferred to the main cooling component 600 of the first heat dissipation zone through the heat conduction column 430 of the secondary cold plate of the first heat dissipation zone and carried away by the main coolant to the heat dissipation CDU (coolant distribution unit) of the system. Another part of the heat is transferred to the secondary cooling component 700 of the second heat dissipation zone through the secondary coolant, and then coupled to the water-cooled plate 500 of the second heat dissipation zone through the common wall. It is then carried away by the main coolant to the heat dissipation CDU of the system and finally dissipated.

[0063] The main coolant in the main cooling circuit 110 is propelled by the CDU for circulation. The kinetic energy of the flow in the coolant bypass branch 120 is obtained by diverting the flow from the main cooling circuit 110. The flow rate of the coolant bypass branch 120 drives the magnetically coupled drive assembly 300. The main coolant that is diverted drives the external drive element 310 to rotate, which in turn drives the internal driven element 350 to rotate synchronously through magnetic coupling. Subsequently, the internal driven element 350 drives the auxiliary coolant to circulate within the vacuum-sealed closed auxiliary circuit 200; The secondary coolant absorbs heat from the high-density heat source 410 in the first region through the heat-conducting column 430 and the flow channel 420 of the secondary cold plate in the first heat dissipation area of ​​the cold plate 400. The heat from the heat source interface 410 of the first heat dissipation zone is transferred to the main cooling component 600 of the first heat dissipation area through the heat conduction column 430 of the auxiliary cold plate of the first heat dissipation zone. The main coolant carries away this heat to the CDU in the liquid cooling manifold and the main coolant heat dissipation microchannel 630 of the first heat dissipation area. The heat-carrying secondary coolant is transported to the secondary cooling component 700 in the second heat dissipation area via the secondary coolant delivery pipe 220. Through the common wall coupling design, the heat carried by the secondary coolant is transferred to the main coolant heat dissipation microchannel 530 in the second heat dissipation area of ​​the water-cooled plate 500 in the second heat dissipation area via the heat-conducting column 720 and the secondary cold plate confluence channel 710 in the second heat dissipation area, thereby distributing the heat to a larger water-cooled area in the second heat dissipation area. After passing through the main coolant heat dissipation microchannel in the second heat dissipation area of ​​the water-cooled plate 500, the main coolant carries away heat to the system's heat dissipation CDU for final dissipation.

[0064] The cooled secondary coolant returns to the cold plate 400 in the first heat dissipation area via the return path, forming a cycle of heat redistribution.

[0065] The above description is merely a preferred embodiment of the present invention and does not constitute any limitation on the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A fluid-driven magnetically coupled vacuum-isolated heat redistribution system, characterized in that, It includes a main cooling circuit (110), a coolant bypass branch (120), a vacuum-sealed secondary closed circuit (200), a magnetic coupling drive assembly (300), a cold plate for the first heat dissipation area (400), a secondary cooling assembly for the second heat dissipation area (700), and a heat dissipation assembly; The main cooling circuit (110) is used to circulate the main coolant. The coolant bypass branch (120) is connected to the main cooling circuit (110) and diverts part of the main coolant. The vacuum-sealed secondary closed circuit (200) is used to circulate the secondary coolant, and includes a secondary coolant pushing pipe (210) and a secondary coolant conveying pipe (220). The magnetically coupled drive assembly (300) includes an external drive element (310), an internal driven element (350), and a solid isolation boundary (370). The external drive element (310) is disposed in the coolant bypass branch (120) and rotates under the hydrodynamic action of the main coolant. The internal driven element (350) is disposed in the vacuum-sealed secondary closed loop (200) and is magnetically coupled to the external drive element (310). The solid isolation boundary (370) is used to separate the external drive element (310) from the internal driven element (350). The first heat dissipation area cold plate (400) is thermally coupled to the high heat flux density area of ​​the electronic device and is connected to the auxiliary coolant pushing pipe (210). The second heat dissipation area auxiliary cooling component (700) is thermally coupled to the low heat flux density area of ​​the electronic device and is connected to the auxiliary coolant delivery pipe (220). The heat dissipation component includes a first heat dissipation area main cooling component (600) and a second heat dissipation area water cooling plate (500). The first heat dissipation area main cooling component (600) is coupled to the first heat dissipation area cold plate (400), and the second heat dissipation area water cooling plate (500) is coupled to the second heat dissipation area auxiliary cooling component (700). The rotating external drive element (310) drives the internal driven element (350) to rotate synchronously by transmitting magnetic torque across the solid isolation boundary (370). The rotating internal driven element (350) causes the auxiliary coolant to circulate within the vacuum-sealed secondary closed loop (200). The circulation of the auxiliary coolant transports heat energy from the high heat flux density region of the electronic device to the low heat flux density region, and then the heat energy is dissipated by the main cooling loop (110).

2. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 1, characterized in that, The main cooling circuit (110) includes a coolant circuit connected to the cooling infrastructure of the electronic platform, wherein the main coolant inside is provided with thrust circulation by a coolant distribution unit, and the main coolant generates fluid kinetic energy during normal operation.

3. The fluid-driven magnetic coupling vacuum isolation heat redistribution system as described in claim 2, characterized in that, The thermal conductivity of the secondary coolant is higher than that of the primary coolant.

4. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 3, characterized in that, The main coolant is a water-based or glycol-based coolant, and the auxiliary coolant is a liquid metal.

5. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 4, characterized in that, The liquid metal is a gallium-based alloy.

6. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 1, characterized in that, The coolant bypass branch (120) is connected to the main cooling circuit (110) through the main coolant inlet and outlet pipes. A portion of the main coolant diverted by the coolant bypass branch (120) flows to the magnetic coupling drive assembly (300). After driving the external drive element (310), the diverted main coolant returns to the main cooling circuit (110).

7. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 1, characterized in that, The vacuum-sealed secondary closed loop (200) is physically isolated from the main cooling loop (110). The vacuum-sealed secondary closed loop (200) is an airtight, vacuum-operated closed fluid loop made of vacuum-sealed material and coated with a corrosion-resistant coating on its inner surface. It operates under a vacuum sufficient to eliminate gas inclusions. The auxiliary coolant delivery pipe (220) is used to transport the heat-carrying auxiliary coolant from the cold plate (400) of the first heat dissipation area to the auxiliary cooling assembly (700) of the second heat dissipation area, and the magnetic coupling drive assembly (300) sends the cooled auxiliary coolant back to the cold plate (400) of the first heat dissipation area through the return path.

8. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 1, characterized in that, The vacuum-sealed secondary closed loop (200) includes multiple independent sub-vacuum-sealed secondary closed loops, each of which is associated with a separate heat source.

9. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 1, characterized in that, The magnetic coupling drive assembly (300) further includes an outer magnetic turntable (320) and a permanent magnet assembly (340). The outer magnetic turntable (320) is coaxially fixed with the external drive element (310). The permanent magnet assembly (340) includes a plurality of permanent magnets with magnetic field strength. The plurality of permanent magnets are respectively embedded in the outer magnetic turntable (320) and the internal driven element (350), and are separated by the solid isolation boundary (370) to form a magnetic coupling interface. The internal driven element (350) is located inside the sealed drive cavity (360) and is coupled to the external magnetic disk (320) by magnetic force. The sealed drive cavity (360) is connected to the vacuum sealing secondary closed loop (200) to ensure vacuum sealing. The diverted main coolant causes the external drive element (310) to rotate, and the external magnetic disk (320) rotates accordingly. The magnetic torque passes through the solid isolation boundary (370) and drives the internal driven element (350) to rotate synchronously. The internal driven element (350) pushes the secondary coolant to circulate in the vacuum sealing secondary closed loop (200).

10. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 9, characterized in that, The external drive element (310) is an impeller, gear or turbine.

11. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 1, characterized in that, The effective thermal surface area of ​​the second heat dissipation area water-cooled plate (500) is greater than that of the first heat dissipation area cold plate (400). The first heat dissipation area main cooling assembly (600) and the second heat dissipation area water-cooled plate (500) are connected to the main cooling circuit (110) in series or in parallel. Part of the heat is dissipated through the main cooling component (600) of the first heat dissipation area, while the other part of the heat is actively transported to the secondary cooling component (700) of the second heat dissipation area for redistribution, and then finally dissipated through common wall coupling to the water-cooled plate (500) of the second heat dissipation area.

12. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 11, characterized in that, The main cooling component (600) of the first heat dissipation area is coupled to the cold plate (400) of the first heat dissipation area through a common wall coupling plate (610). The common wall coupling plate (610) is provided with a liquid cooling manifold (620) and a heat dissipation microchannel (630) for the main coolant of the first heat dissipation area. The first heat dissipation area cold plate (400) includes a first heat dissipation area substrate, a first heat dissipation area secondary cold plate heat conduction pillars (430) arranged in an array on the first heat dissipation area substrate, a first heat dissipation area secondary cold plate flow channel (420) formed around the first heat dissipation area secondary cold plate heat conduction pillars (430), and a first heat dissipation area cold plate cover plate (440) covering the first heat dissipation area secondary cold plate flow channel (420) and the first heat dissipation area secondary cold plate heat conduction pillars (430).

13. The fluid-driven magnetically coupled vacuum-isolated heat redistribution system as described in claim 11, characterized in that, The secondary cooling component (700) of the second heat dissipation area and the water-cooled plate (500) of the second heat dissipation area are thermally connected by a common wall coupling structure. The common wall coupling structure is an integrated physical partition. One side of the partition faces the vacuum-sealed secondary closed loop (200) and is provided with a secondary cold plate confluence channel (710) and a secondary cold plate heat conduction column (720) of the second heat dissipation area. The other side of the partition faces the main cooling loop (110) and is provided with a main coolant heat dissipation microchannel (530) of the second heat dissipation area.

14. A fluid-driven magnetically coupled vacuum-isolated heat redistribution method, based on the system according to any one of claims 1-13, characterized in that, Includes the following steps: S1. The main coolant is circulated through the main cooling circuit (110); S2. A portion of the main coolant is diverted to the coolant bypass branch (120) to drive the external drive element (310) to rotate under hydrodynamic action; S3. The torque is magnetically transmitted from the rotating external drive element (310) through the solid isolation boundary (370) to the internal driven element (350) disposed within the vacuum-sealed secondary closed loop (200). S4. The internal driven element (350) is used to drive the auxiliary coolant to circulate within the vacuum-sealed auxiliary closed loop (200); S5. The heat energy from the high heat flux density area of ​​the electronic device is absorbed into the auxiliary coolant through the cold plate (400) of the first heat dissipation area; S6. The absorbed heat energy is transferred to the low heat flux density area of ​​the electronic equipment through the circulating auxiliary coolant. S7. The delivered heat energy is then redistributed through the secondary cooling assembly (700) in the second heat dissipation area; S8. The redistributed heat energy is transferred from the secondary cooling component (700) of the second heat dissipation area to the water-cooled plate (500) of the second heat dissipation area coupled to the main cooling circuit (110) for final dissipation. At the same time, a portion of the heat energy from the high heat flux density area is dissipated directly by the main cooling circuit (110) through the main cooling component (600) of the first heat dissipation area.

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