Heat dissipation device, heat dissipation equipment and control method thereof

Abstract

The embodiment of the invention provides a heat dissipation device, heat dissipation equipment and a control method thereof. The heat dissipation device comprises a semiconductor thermoelectric refrigeration assembly, a liquid cooling circulation flow channel and a cooling liquid driving assembly. The semiconductor thermoelectric refrigeration assembly comprises a refrigeration end. Cooling liquid is packaged in the liquid cooling circulation flow channel, the liquid cooling circulation flow channel comprises a first part flow channel and a second part flow channel which are communicated with each other, and the first part flow channel is arranged at the refrigeration end; the cooling liquid driving assembly is connected with the liquid cooling circulation flow channel, and the cooling liquid driving assembly is used for driving cooling liquid to circularly flow through the first part flow channel and the second part flow channel; wherein under the condition that the heat dissipation device is arranged in the heat dissipation equipment, the semiconductor thermoelectric refrigeration assembly and the heat source assembly are arranged at an interval; the second part flow channel is arranged corresponding to the heat source assembly, and the second part flow channel dissipates heat generated by the heat source assembly through the cooling liquid. Therefore, the use reliability of the heat dissipation equipment can be improved.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a heat dissipation device, heat dissipation equipment and control method thereof. Background Technology

[0002] With the rapid development of electronic technology, heat dissipation devices such as mobile phones, computers, portable wearable devices, and servers are becoming increasingly popular and are gradually becoming indispensable tools in people's daily lives. In these related technologies, heat dissipation devices contain heat source components such as the Central Processing Unit (CPU), power management devices, and power devices. Under high load operation, these heat source components generate a large amount of heat. If this heat cannot be dissipated in time, the temperature of the heat source components will rise sharply, thereby reducing their performance and even causing damage, thus reducing the reliability of the heat dissipation device. Summary of the Invention

[0003] This application provides a heat dissipation device, heat dissipation equipment, and control method thereof, which at least helps to improve the reliability of the heat dissipation equipment.

[0004] In a first aspect, embodiments of this application provide a heat dissipation device for dissipating heat from heat source components in a heat dissipation device. The heat dissipation device includes: A semiconductor thermoelectric refrigeration assembly, the semiconductor thermoelectric refrigeration assembly including a refrigeration end; A liquid-cooled circulation channel, wherein a coolant is encapsulated within the liquid-cooled circulation channel, and the liquid-cooled circulation channel includes a first part channel and a second part channel that are interconnected, wherein the first part channel is disposed at the cooling end. A coolant drive assembly is connected to the liquid cooling circulation channel and is used to drive the coolant to circulate through the first part of the channel and the second part of the channel. In the case where the heat dissipation device is disposed within the heat dissipation equipment, the semiconductor thermoelectric cooling component and the heat source component are disposed at intervals; the second part of the flow channel is disposed corresponding to the heat source component, and the second part of the flow channel dissipates the heat generated by the heat source component through the coolant.

[0005] Secondly, embodiments of this application provide a heat dissipation device, including: Heat source components; And a heat dissipation device as described in the first aspect, wherein the semiconductor thermoelectric cooling component of the heat dissipation device is spaced apart from the heat source component of the heat dissipation device, and a second flow channel of the heat dissipation device is provided corresponding to the heat source component, and the second flow channel dissipates the heat generated by the heat source component through a coolant.

[0006] Thirdly, embodiments of this application provide a control method for a heat dissipation device, applied to the heat dissipation device as described in the second aspect, the method comprising: In response to detecting target information of the heat dissipation device, based on the target information, perform any of the following: Adjust the input power of the semiconductor thermoelectric cooling component of the heat dissipation device; The cooling end and heat dissipation end of the semiconductor thermoelectric refrigeration component of the heat dissipation device are switched. Adjust the speed of the fan assembly of the heat dissipation device; Adjust the input power of the coolant drive assembly.

[0007] Fourthly, embodiments of this application provide an electronic device, including: One or more processors; A memory that stores one or more programs, which, when executed by one or more processors, cause the one or more processors to perform the following: The control method for the heat dissipation equipment described in the third aspect.

[0008] Fifthly, embodiments of this application provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the control method for the heat dissipation device as described in the third aspect.

[0009] Sixthly, embodiments of this application provide a computer program product, including a computer program that, when executed by a processor, implements a control method for a heat dissipation device as described in the third aspect.

[0010] In this embodiment, a "liquid cooling medium isolation conduction" design is adopted, meaning that the cooling end of the semiconductor thermoelectric cooling component does not directly contact the heat source component. Instead, indirect heat conduction is achieved through the coolant as the heat transfer medium, thereby spatially isolating the semiconductor thermoelectric cooling component from the heat source component. This prevents the heat generated by the semiconductor thermoelectric cooling component from superimposing with the heat from the heat source component in the same space, effectively solving the thermal short circuit problem and ensuring the stability of the cooling effect of the semiconductor thermoelectric cooling component. Moreover, during the circulation of the liquid cooling medium, it can evenly distribute heat and prevent localized low temperatures from causing condensation. This fundamentally solves the problem of condensation seeping into the core components of the motherboard and causing short circuits and corrosion, significantly improving the reliability of the heat dissipation equipment. Attached Figure Description

[0011] Figure 1 A schematic diagram of the structure of an embodiment of the heat dissipation device provided in this application; Figure 2A schematic diagram of another embodiment of the heat dissipation device provided in this application; Figure 3 A schematic diagram of another embodiment of the heat dissipation device provided in this application; Figure 4 A schematic diagram of the structure of an embodiment of the heat dissipation device provided in this application; Figure 5 A schematic diagram of another embodiment of the heat dissipation device provided in this application; Figure 6 A schematic diagram of the area distribution in another embodiment of the heat dissipation device provided in this application; Figure 7 A schematic flowchart of an embodiment of the control method for the heat dissipation device provided in this application; Figure 8 A schematic diagram of the structure of an embodiment of the electronic device provided in this application. Detailed Implementation

[0012] To enable those skilled in the art to better understand the technical solutions of this application, the technical solutions provided in this application will be described in detail below with reference to the accompanying drawings.

[0013] Exemplary embodiments will be described more fully below with reference to the accompanying drawings; however, the described exemplary embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this application.

[0014] As used herein, the term "and / or" includes any and all combinations of one or more related enumerated purposes.

[0015] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. As used herein, the singular forms “a” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “made of” are used in this specification, the presence of a feature, integral, step, operation, element, and / or component is specified, but the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof is not excluded.

[0016] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0017] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this application, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in the embodiments of this application.

[0018] With the rapid development of electronic technology, heat dissipation devices such as mobile phones, computers, portable wearable devices, and servers are becoming increasingly popular and are gradually becoming indispensable tools in people's daily lives. In these related technologies, heat source components inside heat dissipation devices, such as the central processing unit (CPU), power management devices, and power devices, generate a large amount of heat under high load operation. If this heat cannot be dissipated in time, the temperature of the heat source components will rise sharply, thereby reducing their performance and even causing damage, thus reducing the reliability of the heat dissipation device.

[0019] Some studies have attempted to apply thermoelectric coolers (TECs) directly to the area where heat source components are located for cooling. However, because TECs themselves generate a large amount of heat during operation and are located in the same space as the heat-generating area of ​​the heat source components, the heat cannot be effectively dissipated, resulting in thermal short circuits and ultimately causing TEC cooling failure. At the same time, the low temperature of the TEC cooling surface easily leads to condensation. This condensation can seep into the heat source components, causing problems such as short circuits and corrosion, severely damaging the heat dissipation equipment. As a result, the reliability of heat dissipation equipment has not yet been effectively resolved.

[0020] Based on this, embodiments of this application provide a heat dissipation device, a heat dissipation equipment, and a control method thereof.

[0021] Please refer to the following at the same time Figures 1 to 5 This application provides a heat dissipation device for cooling heat source components in a heat dissipation equipment. The heat dissipation device includes at least a semiconductor thermoelectric cooling component 20, a liquid-cooled circulation channel 30, and a coolant driving component 40.

[0022] The aforementioned semiconductor thermoelectric cooling component 20 can be any semiconductor component capable of thermoelectric cooling. For example, the aforementioned semiconductor thermoelectric cooling component 20 can be a TEC, which is a solid-state cooling device based on the Peltier effect. When a direct current passes through a circuit composed of two different conductors, heat absorption or release will occur at the junction. Of course, the conductor thermoelectric cooling component can also include a TEC and other components, and is not limited here.

[0023] The aforementioned semiconductor thermoelectric cooling component 20 may have a cooling end and a heat dissipation end arranged opposite to each other, wherein the cooling end is used to absorb heat and the heat dissipation end is used to release heat.

[0024] It should be noted that the size and shape of the aforementioned semiconductor thermoelectric cooling component 20 can be customized according to the internal space of the heat dissipation device. For example, when the heat dissipation device is a mobile phone, the size of the aforementioned TEC can be set to 20mm×20mm×3mm; when the heat dissipation device is a tablet computer, the size of the TEC can be set to 30mm×30mm×3mm, and so on.

[0025] The heat dissipation device also includes a liquid cooling circulation channel 30, which contains coolant and includes a first part channel 31 and a second part channel 32 that are interconnected.

[0026] The aforementioned liquid cooling circulation channel 30 can be any channel structure that allows coolant to circulate and has good thermal conductivity. For example, its material can be metal (such as copper, aluminum, stainless steel, etc.) or polymer material (such as silicone, etc.).

[0027] The first flow channel 31 is located at the cooling end and is used to exchange heat with the cooling end of the semiconductor thermoelectric cooling assembly 20 so that the coolant is cooled.

[0028] The first flow channel 31 is disposed at the cooling end. The first flow channel 31 may be in direct or indirect contact with the cooling end. For example, the first flow channel 31 may be attached to the surface of the cooling end of the TEC; or, the first flow channel 31 may be connected to the cooling end through a thermally conductive material (such as thermal grease, thermal pad, etc.) to improve the heat transfer efficiency.

[0029] The aforementioned second flow channel 32 is provided corresponding to the heat source assembly 10, and the second flow channel 32 dissipates the heat generated by the heat source assembly 10 through the coolant. Similarly, the second flow channel 32 can also be in direct or indirect contact with the heat source assembly 10. For example, the second flow channel 32 can be attached to the surface of the heat source assembly 10; or, the second flow channel 32 can be connected to the heat source assembly 10 through a thermally conductive material.

[0030] When the heat dissipation device is installed inside the heat dissipation equipment, the semiconductor thermoelectric cooling component 20 and the heat source component 10 are arranged at intervals, that is, the semiconductor thermoelectric cooling component 20 does not directly contact the heat source component 10, but indirectly conducts heat through the coolant in the liquid cooling circulation channel 30 as the heat transfer medium.

[0031] The coolant can be any liquid with good thermal conductivity, such as water, fluorinated liquid, mineral oil, or aqueous ethylene glycol solution. In some embodiments, the coolant can be deionized water, which has advantages such as high specific heat capacity, high thermal conductivity, and low cost. In other embodiments, the coolant can be electronic fluorinated liquid, which has advantages such as good insulation, high chemical stability, and non-corrosion of electronic devices, making it suitable for scenarios with high insulation requirements.

[0032] The shape of the liquid cooling circulation channel 30 can be designed according to the internal space of the heat dissipation equipment. For example, the liquid cooling circulation channel 30 can be a flat tubular structure with a rectangular, circular, or elliptical cross-section; or, the liquid cooling circulation channel 30 can be a serpentine coil structure to increase the heat exchange area.

[0033] The length, diameter, and shape of the first part of the flow channel 31 and the second part of the flow channel 32 can be designed according to the heat dissipation requirements. For example, the length of the first part of the flow channel 31 can be set to 50mm~100mm, the length of the second part of the flow channel 32 can be set to 80mm~150mm, the inner diameter of the flow channel can be set to 2mm~5mm, and the first part of the flow channel 31 and the second part of the flow channel 32 are serpentine coils, etc.

[0034] The aforementioned heat dissipation device also includes a coolant drive assembly 40, which is connected to the liquid cooling circulation channel 30 and is used to drive the coolant to circulate through the first part of the channel 31 and the second part of the channel 32.

[0035] The coolant drive assembly 40 is connected to the liquid cooling circulation channel 30. The coolant drive assembly 40 can be located inside the pipe of the liquid cooling circulation channel 30 or outside the pipe of the liquid cooling circulation channel 30. It is only necessary to enable the coolant drive assembly 40 to drive the coolant to circulate within the liquid cooling circulation channel 30. It is not limited here.

[0036] The aforementioned coolant drive assembly 40 can be any device capable of providing coolant circulation power, such as a centrifugal pump, gear pump, peristaltic pump, etc.

[0037] In some embodiments, the coolant driving assembly 40 can be a piezoelectric micropump. The piezoelectric micropump utilizes the inverse piezoelectric effect of piezoelectric materials, applying an alternating voltage to cause the piezoelectric element to vibrate, thereby driving the coolant flow. Piezoelectric micropumps have advantages such as small size (below 10mm × 10mm × 2mm), low power consumption (operating current as low as tens of milliamps), fast response speed, and no electromagnetic interference, making them ideal for use in space-constrained heat dissipation devices (such as smartphones).

[0038] The operating parameters of the piezoelectric micropump can be set according to heat dissipation requirements. For example, the driving voltage of the piezoelectric micropump can be set to 3V-12V, the operating frequency can be set to 100Hz-1000Hz, the flow rate can be set to 10mL / min-100mL / min, and the head can be set to 0.1m-1m. By adjusting the driving voltage or operating frequency of the piezoelectric micropump, the circulation flow rate of the coolant can be controlled, thereby adjusting the heat dissipation capacity.

[0039] The working principle of the above-mentioned heat dissipation device can be specifically described as follows: When the temperature of the heat source component 10 (such as the CPU) of the heat dissipation device rises, the coolant drive component 40 is activated, driving the coolant to circulate in the liquid cooling circulation channel 30. When the coolant flows through the first channel 31, it exchanges heat with the cooling end of the semiconductor thermoelectric cooling component 20 and is cooled down. The cooled coolant continues to flow to the second channel 32, where it exchanges heat with the heat source component 10, absorbing the heat generated by the heat source component 10 and lowering its temperature. After absorbing heat, the coolant temperature rises and flows back to the first channel 31 to be cooled again, thus forming a cycle and achieving continuous heat dissipation.

[0040] In this embodiment, a "liquid cooling medium isolation conduction" design is adopted, meaning that the cooling end of the semiconductor thermoelectric cooling component 20 does not directly contact the heat source component 10, but indirectly conducts heat through the coolant as the heat transfer medium. This spatially isolates the semiconductor thermoelectric cooling component 20 from the heat source component 10, preventing the heat generated by the semiconductor thermoelectric cooling component 20 from superimposing with the heat of the heat source component 10 in the same space, effectively solving the thermal short circuit problem and ensuring the stability of the cooling effect of the semiconductor thermoelectric cooling component 20. Moreover, during the circulation of the liquid cooling medium, the heat distribution can be balanced, preventing localized low temperatures from causing condensation. This fundamentally solves the problem of condensation seeping into the motherboard core components and causing short circuits and corrosion, significantly improving the reliability of the heat dissipation equipment.

[0041] In some embodiments, the semiconductor thermoelectric cooling assembly 20 further includes a heat dissipation end disposed opposite to the cooling end; The heat dissipation device also includes: The air duct support assembly 50 has a first air duct 501 that communicates with the outside. The semiconductor thermoelectric cooling assembly 20 is connected to the air duct support assembly 50, and its heat dissipation end is correspondingly arranged with the first air duct 501. At least part of the heat generated by the heat dissipation end is discharged through the first air duct 501.

[0042] In this embodiment, the semiconductor thermoelectric cooling component 20 is connected to the air duct support component 50, and the heat dissipation end is correspondingly arranged with the first air duct 501, so that at least part of the heat generated by the semiconductor thermoelectric cooling component 20 can be discharged through the first air duct 501, accelerating the dissipation of heat generated by the heat dissipation end of the semiconductor thermoelectric cooling component 20, thereby improving the working stability of the semiconductor thermoelectric cooling component 20.

[0043] The aforementioned duct support assembly 50 can be any structure capable of forming an air duct, and its material can be metal (such as aluminum alloy, magnesium alloy, etc.) or plastic. For example, the duct support assembly 50 can be a shell structure made of aluminum alloy material through computer numerical control (CNC) machining or die casting, which has good thermal conductivity and structural strength.

[0044] The aforementioned first air duct 501 is a channel that penetrates the air duct support assembly 50. That is, the first air duct 501 may include an air inlet and an air outlet, which can be respectively located at different positions on the air duct support assembly 50 to form a through air duct. For example, the air inlet may include a side air inlet and / or a front air inlet to adapt to different equipment installation spaces and airflow direction requirements. Of course, the aforementioned first air duct 501 can also be a semi-through channel, that is, the first air duct 501 has only one air outlet, which is not limited here.

[0045] In some embodiments, the heat dissipation end can be attached to the sidewall of the first air duct 501, and the sidewall of the air duct can be made of a material with good thermal conductivity. For example, the heat dissipation end can be tightly attached to the sidewall of the air duct using thermal grease or a thermal pad, so that the heat generated by the heat dissipation end can be conducted through the sidewall of the air duct to the first air duct 501, and then carried away by the airflow passing through the first air duct 501. This arrangement is simple in structure, easy to install, and suitable for scenarios with sufficient space.

[0046] In other embodiments, the heat dissipation end can penetrate the sidewall of the air duct and be located within the first air duct 501. For example, the sidewall of the air duct can have a through hole that matches the shape of the heat dissipation end of the semiconductor thermoelectric cooling component 20, and the heat dissipation end is embedded in the through hole, so that the heat dissipation end is directly exposed to the airflow within the first air duct 501. This arrangement increases the contact area between the heat dissipation end and the airflow, improves the heat dissipation efficiency, and is suitable for scenarios with high requirements for heat dissipation performance.

[0047] It should be noted that the first air duct 501 can be hollow, that is, the first air duct 501 may not contain any material other than the heat dissipation end.

[0048] In some embodiments, the heat dissipation device further includes heat dissipation fins 60, which are located within the first air duct 501 and are disposed corresponding to the heat dissipation end; wherein at least a portion of the heat generated at the heat dissipation end is conducted through the heat dissipation fins 60 to the first air duct 501 for dissipation.

[0049] In this embodiment, by providing heat dissipation fins 60 corresponding to the heat dissipation end in the first air duct 501, the heat dissipation area can be increased, thereby accelerating the dissipation of at least part of the heat generated at the heat dissipation end in the first air duct 501.

[0050] The aforementioned heat dissipation fins 60 can be any sheet-like structure that can increase the heat dissipation area, and their material can be metals with good thermal conductivity such as aluminum and copper.

[0051] The heat dissipation fins 60 may include multiple parallel fins, with gaps formed between adjacent fins to allow airflow. The shape of the heat dissipation fins 60 may be rectangular, wavy, serrated, etc., to increase the heat dissipation area and turbulent airflow, thereby improving heat dissipation efficiency.

[0052] The aforementioned heat sink fins 60 are connected to the heat dissipation end via welding or a thermally conductive interface material. For example, the bottom of the heat sink fins 60 may have a groove that matches the shape of the heat dissipation end of the TEC, and the heat dissipation end is embedded in the groove and fixed by welding to form a good heat conduction path; or, a thermally conductive silicone grease pad may be sandwiched between the heat dissipation end and the heat sink fins 60 to reduce contact thermal resistance.

[0053] The aforementioned heat dissipation fins 60 are correspondingly arranged with the heat dissipation end, meaning that the heat dissipation fins 60 and the heat dissipation end are positioned opposite each other. For example, when the TEC is attached to the side wall of the first air duct 501, the TEC can be attached to the side of the air duct side wall outside the first air duct 501, and the heat dissipation fins 60 can be attached to the side of the air duct side wall inside the first air duct 501, with the contact surface between the heat dissipation fins 60 and the air duct side wall covering the contact surface between the TEC and the air duct side wall.

[0054] Alternatively, the aforementioned heat dissipation fins 60 can be configured correspondingly to the heat dissipation end, or the heat dissipation fins 60 can be directly connected to the heat dissipation end. For example, if the heat dissipation end passes through the side wall of the air duct and is located within the first air duct 501, the heat dissipation fins 60 can be connected to the heat dissipation end.

[0055] The dimensions of the heat dissipation fins 60 can be designed according to heat dissipation requirements and space constraints. For example, the height of the heat dissipation fins 60 can be set to 10mm-30mm, the fin thickness can be set to 0.3mm-1mm, the spacing between adjacent fins can be set to 1mm-3mm, the number of fins can be set to 10-50, and so on.

[0056] In some embodiments, the heat dissipation device may further include a vapor chamber 70 (VC), which and the semiconductor thermoelectric cooling component 20 are disposed on both sides of the air duct support component 50 located in the first air duct 501, and at least a portion of the vapor chamber 70 is correspondingly disposed with the heat dissipation fins 60; at least a portion of the heat generated at the heat dissipation end is conducted to the vapor chamber 70 through the heat dissipation fins 60 for dissipation.

[0057] In this embodiment, the vapor chamber 70 is disposed on the side of the air duct support assembly 50 away from the semiconductor thermoelectric cooling assembly 20, and is in contact with at least a portion of the heat sink fins 60. Thus, some of the heat generated at the heat dissipation end, such as heat conducted by the heat sink fins 60 but not dissipated within the first air duct 501, can be conducted to the vapor chamber 70 through the heat sink fins 60, and the vapor chamber 70 will evenly diffuse the heat over a larger area, thereby further improving the heat dissipation effect at the heat dissipation end.

[0058] The aforementioned vapor chamber 70 is a high-efficiency heat-conducting device that utilizes the principle of phase change heat transfer. It is filled with a working fluid. When heat is input from one side, the working fluid evaporates and vaporizes. The vapor diffuses to the other side, condenses, and releases heat. The condensed liquid then flows back through a capillary structure, forming a circulation and achieving rapid and uniform heat transfer. The vapor chamber 70 has advantages such as high thermal conductivity (up to 10000 W / (m·K) or higher) and uniform temperature distribution.

[0059] The shape and size of the heat spreader 70 can be set according to actual needs. For example, the heat spreader 70 can be flat, L-shaped, U-shaped, etc., to adapt to different installation spaces. The thickness of the heat spreader 70 can be set to 2mm-5mm, and the area can be set to 100mm2-500mm2 according to heat dissipation requirements.

[0060] At least a portion of the heat exchange plate 70 is disposed corresponding to the heat dissipation fins 60. This can be because the at least a portion of the plate and the heat dissipation fins 60 are positioned opposite each other. For example, if one end of the heat dissipation fins 60 is disposed corresponding to the heat dissipation end of the semiconductor thermoelectric cooling component 20, the other end of the heat dissipation fins 60 is attached to one side of another sidewall of the first air duct 501, and the at least a portion of the plate is attached to the other side of the other sidewall of the air duct. The contact surface between the at least a portion of the plate and the other sidewall of the air duct can cover the contact surface between the heat dissipation fins 60 and the other sidewall of the air duct.

[0061] Alternatively, at least a portion of the heat spreader 70 may be correspondingly disposed with the heat dissipation fins 60, or at least a portion of the heat spreader 70 may be in direct contact with the heat dissipation fins 60. For example, the heat dissipation fins 60 may penetrate the sidewall of the other air duct and connect to at least a portion of the heat spreader 70, which may be achieved by using thermal grease or a thermal pad to reduce contact thermal resistance.

[0062] In some embodiments, the heat dissipation device further includes a first fan assembly 80, which is connected to a first air duct 501 and is used to drive airflow within the first air duct 501.

[0063] In this embodiment, by setting the first fan assembly 80, the airflow in the first air duct 501 can be driven, thereby accelerating the dissipation of heat from the heat dissipation end into the first air duct 501.

[0064] The first fan assembly 80 can be any device capable of generating airflow, such as a centrifugal fan, an axial fan, or a mixed-flow fan. Considering the limited internal space of the heat dissipation device, the first fan assembly 80 can be selected with a small size, for example, its external dimensions can be set to 20mm×20mm×4mm, 25mm×25mm×4mm, 30mm×30mm×4mm, etc.

[0065] The first fan assembly 80 can be disposed within the first air duct 501, or it can be disposed at the air outlet of the first air duct 501. For example, the first fan assembly 80 can be fixed within the air duct support assembly 50, with its air outlet facing the heat sink fins 60. When working, the airflow generated blows across the heat sink fins 60, carrying away the heat generated by the heat dissipation end of the semiconductor thermoelectric cooling assembly 20 and dissipating the heat to the outside of the heat dissipation device.

[0066] The speed of the first fan assembly 80 can be adjusted according to the heat dissipation requirements. For example, its speed range can be set to 3000RPM-15000RPM.

[0067] In some embodiments, the air duct support assembly 50 is further provided with a second air duct 502 communicating with the outside; when the heat dissipation device is provided inside the heat dissipation equipment, the heat source component 10 is provided on one side of the air duct support assembly 50 and is provided corresponding to the second air duct 502, and at least part of the heat generated by the heat source component 10 is discharged through the second air duct 502.

[0068] In this embodiment, by correspondingly setting the heat source component 10 with the second air duct 502, at least a portion of the heat from the heat source component 10 can be discharged through the second air duct 502, thereby achieving the dissipation of heat generated by the heat source component 10 by the synergistic liquid cooling circulation channel 30 and further enhancing the heat dissipation performance of the heat dissipation device on the heat source component 10.

[0069] The second air duct 502 can be independent of or connected to the first air duct 501. The second air duct 502 is used to form an airflow channel to directly discharge the heat generated by the heat source component 10, thus preventing heat from accumulating inside the equipment.

[0070] Similarly, the second air duct 502 can be a channel that passes through the air duct support assembly 50, that is, the second air duct 502 can include an air inlet and an air outlet, and the air inlet and air outlet can be respectively set at different positions of the air duct support assembly 50 to form a through air duct; or, the second air duct 502 can also be a semi-through channel, that is, the second air duct 502 is only provided with one air outlet, which is not limited here.

[0071] It should be noted that when the air duct support assembly 50 is also provided with a second air duct 502 that communicates with the outside, the second part of the flow channel 32 is provided corresponding to the heat source assembly 10, and the second part of the flow channel 32 can be sandwiched between the heat source assembly 10 and the side wall of the air duct 502.

[0072] In some embodiments, when the heat dissipation device is disposed within the heat dissipation equipment, the second air duct 502 is located between the second partial flow channel 32 and the heat source component 10. This arrangement makes the heat exchange area between the coolant in the second partial flow channel 32 and the heat source component 10 adjacent to the second air duct 502. The heat generated by the heat source component 10 can be partially discharged directly through the second air duct 502, and then partially absorbed by the coolant in the second partial flow channel 32, forming a dual heat dissipation effect and improving heat dissipation efficiency.

[0073] In some embodiments, the heat dissipation device further includes a second fan assembly, which is connected to the second air duct 502 and is used to drive airflow within the second air duct 502. The structure and specifications of the second fan assembly may be the same as or different from those of the first fan assembly 80, and its placement can be designed according to airflow requirements.

[0074] For example, the second fan assembly can be located in the gap between the semiconductor thermoelectric cooling assembly 20 and the heat source assembly 10. It can not only help to dissipate the heat generated by the heat source assembly 10, but also accelerate the airflow around the heat dissipation end of the semiconductor thermoelectric cooling assembly 20, thereby improving the overall heat dissipation efficiency.

[0075] The second fan assembly and the first fan assembly 80 may be the same fan assembly. For example, when the first air duct 501 and the second air duct 502 are connected, a fan assembly (i.e., the first fan assembly 80 or the second fan assembly) can be provided at the connection between the first air duct 501 and the second air duct 502, and this fan assembly can drive the airflow within the first air duct 501 and the second air duct 502.

[0076] It should be noted that when the airflow in the first air duct 501 and the second air duct 502 is driven by the same fan assembly, the airflow in the first air duct 501 and the second air duct 502 can flow in one direction. For example, the air inlet of the second air duct 502 can be an air inlet and the air outlet of the second air duct 502. The fan assembly drives the airflow to enter from the air inlet and exit from the air outlet. Alternatively, the airflow in the first air duct 501 and the second air duct 502 can be made to flow in opposite directions by a certain configuration. For example, an air inlet can be provided at the connection between the first air duct 501 and the second air duct 502. The fan assembly drives the airflow to flow along the air inlet to the first air duct 501 and the second air duct 502 respectively.

[0077] The second fan assembly and the first fan assembly 80 can be different fan assemblies. For example, if the first air duct 501 and the second air duct 502 are not connected, a fan assembly can be provided in the first air duct 501 and the second air duct 502 respectively.

[0078] In some embodiments, when the heat dissipation device is disposed within the heat dissipation equipment, the second fan assembly is located within the gap between the semiconductor thermoelectric cooling component 20 and the heat source component 10. Thus, isolation between the semiconductor thermoelectric cooling component 20 and the heat source component 10 can be achieved through the second fan assembly and the second air duct 502.

[0079] In some embodiments, the duct support assembly 50 includes a duct support 51 and a duct cover 52, wherein: A first air duct 501 is provided inside the air duct support 51, and a receiving groove 503 is provided on one side of the air duct support 51; the semiconductor thermoelectric cooling component 20 is disposed in the receiving groove 503. The duct cover 52 is connected to the duct support 51, and the duct cover 52 covers the receiving groove 503 and together with the duct support 51 forms the second duct 502.

[0080] In this embodiment, the second air duct 502 can be formed by the cooperation between the air duct support 51 and the air duct cover 52, and the semiconductor thermoelectric cooling component 20 can be housed in the air duct support component 50. The structure is simple and easy to implement.

[0081] The aforementioned air duct support 51 can be a shell structure made of aluminum alloy material through CNC machining or die casting process, etc., with a through first air duct 501 inside, and a receiving groove 503 on one side for accommodating the semiconductor thermoelectric cooling component 20 and forming the second air duct 502.

[0082] The aforementioned duct cover 52 can be a plate-shaped structure made of aluminum or stainless steel through stamping and forming processes. It can be connected to the duct support 51 by means of screws, clips, or glue to close the opening of the receiving groove 503 and form a second duct 502. A sealing gasket can be provided between the duct cover 52 and the duct support 51 to ensure the airtightness of the duct.

[0083] In some embodiments, the first flow channel 31 and the second flow channel 32 are attached to the side of the air duct cover plate 52 away from the air duct support 51, and the air duct cover plate 52 is a heat-conducting cover plate. For example, the liquid cooling circulation channel 30 can be adhered to the surface of the air duct cover plate 52 by thermally conductive adhesive, or it can be integrally formed with the air duct cover plate 52.

[0084] Since the air duct cover plate 52 is made of thermally conductive material, the heat dissipated by the heat source component 10 that does not pass through the second air duct 502 can be conducted to the second flow channel 32 through the air duct cover plate 52, and the heat absorbed by the coolant in the second flow channel 32 can further improve the heat dissipation efficiency.

[0085] It should be noted that the aforementioned receiving groove 503 can be a connected groove, that is, the aforementioned semiconductor thermoelectric cooling component 20 is located within the formed second air duct 502.

[0086] In some embodiments, the receiving groove 503 includes a first sub-groove 5031 and a second sub-groove 5032 that are isolated from each other. The semiconductor thermoelectric cooling component 20 is disposed in the first sub-groove 5031, and the second sub-groove 5032 forms a second air duct 502 under the air duct cover plate 52 covering the air duct support 51.

[0087] In this embodiment, by isolating the housing space of the semiconductor thermoelectric cooling component 20 from the second air duct 502, the heat generated by the heat dissipation end of the semiconductor thermoelectric cooling component 20 and the heat generated by the heat source component 10 are prevented from interfering with each other, and the structure is made more compact.

[0088] In some embodiments, the liquid cooling circulation channel 30 further includes a third channel 33, which is connected to the first channel 31 and the second channel 32. The third channel 33 is used to dissipate the heat carried by the coolant flowing into the second channel 32.

[0089] In this embodiment, by setting a third flow channel 33, the coolant flowing out of the second flow channel 32 first passes through the third flow channel 33, so that the heat carried in the coolant can be partially or completely dissipated in the third flow channel 33, thereby cooling the coolant flowing into the first flow channel 31, and further improving the cooling effect of the semiconductor thermoelectric cooling component 20 on the coolant in the first flow channel 31.

[0090] The aforementioned third flow channel 33 serves as an auxiliary heat dissipation area, used to further dissipate the heat carried by the coolant. When the heat dissipation device is installed within a heat dissipation equipment, the third flow channel 33 can be located in an area within the heat dissipation equipment other than the areas where the semiconductor thermoelectric cooling component 20 and the heat source component 10 are located. For example, the third flow channel 33 can be located in the middle frame of the heat dissipation equipment.

[0091] In some embodiments, when the heat dissipation device is disposed within the heat dissipation equipment, the third flow channel 33 may be disposed within the battery region 90 of the heat dissipation equipment.

[0092] Since the battery area 90 is usually not a core heat source area and has relatively ample space, setting the third flow channel 33 in the battery area 90 can utilize the metal casing (such as the middle frame) of the battery area 90 as a heat dissipation surface to dissipate the heat of the coolant, while avoiding thermal interference to the core heat dissipation area (such as the CPU area).

[0093] The length and shape of the third flow channel 33 can be designed according to the shape of the battery region 90. For example, the third flow channel 33 can be a serpentine coil structure, coiled around or below the battery to increase the heat exchange area. The diameter of the third flow channel 33 can be the same as or different from that of the first flow channel 31 and the second flow channel 32. For example, its inner diameter can be set to 2mm to 5mm, and its length can be set to 100mm to 300mm, etc.

[0094] In some embodiments, the heat dissipation device further includes a control component (not shown), the control component being used for at least one of the following: Adjust the input power of the semiconductor thermoelectric cooling component 20; The switching between the cooling end and the heat dissipation end of the control semiconductor thermoelectric refrigeration component 20 is controlled. Adjust the speed of each fan component in the heat dissipation device; Adjust the input power of the coolant drive assembly 40.

[0095] The aforementioned control components can be the central processing unit (CPU) of the heat dissipation equipment or a dedicated microcontroller (MCU), which are connected to the semiconductor thermoelectric cooling component 20, the fan component and the coolant drive component 40 through corresponding drive circuits to realize intelligent control of the working status of each component.

[0096] The control component can control the cooling power of the semiconductor thermoelectric cooling component 20 by adjusting the voltage or current input to the semiconductor thermoelectric cooling component 20.

[0097] For example, the control component can use PWM (Pulse Width Modulation) to control the input power of the semiconductor thermoelectric cooling component 20. By changing the duty cycle of the PWM signal, the average input power of the semiconductor thermoelectric cooling component 20 can be adjusted. The larger the duty cycle, the greater the cooling power of the semiconductor thermoelectric cooling component 20.

[0098] The aforementioned control component may adjust the input power of the semiconductor thermoelectric cooling component 20 based on the detected target information of the heat dissipation device.

[0099] The aforementioned target information may include at least one of the following: Load scenario information for heat dissipation equipment; The cooling end temperature and the heat dissipation end temperature of the semiconductor thermoelectric cooling component 20; The temperature of heat source component 10; Temperature of the battery area of ​​the heat dissipation device at 90°C, etc.

[0100] The load scenario information of the aforementioned heat dissipation equipment can be determined by monitoring parameters such as CPU utilization, GPU utilization, and the type of application being run. For example, when the CPU utilization is below 30% and ordinary applications are running, it can be determined as a light usage scenario; when the CPU utilization is between 30% and 70% and applications such as video editing or large games are running, it can be determined as a moderate usage scenario; when the CPU utilization is above 70% and high-load tasks such as AI computing or high-definition rendering are running, it can be determined as a heavy usage scenario. For different usage scenarios, the control component can adjust the input power of the semiconductor thermoelectric cooling component 20 to the power value corresponding to the usage scenario.

[0101] The aforementioned thermoelectric cooling component 20 can be equipped with a negative temperature coefficient (NTC) thermistor temperature sensor at both its cooling and heat dissipation ends for real-time monitoring of their temperatures. The control component can dynamically adjust the input power of the thermoelectric cooling component 20 based on the temperature data fed back from the NTC sensors, maintaining the temperature difference between the cooling and heat dissipation ends within a preset range. For example, the temperature difference range can be set to 10℃~40℃. When the temperature difference is below the preset lower limit, the input power of the thermoelectric cooling component 20 is reduced; when the temperature difference is above the preset upper limit, the input power of the thermoelectric cooling component 20 is increased.

[0102] The aforementioned control components can also control the switching between the cooling end and the heat dissipation end of the semiconductor thermoelectric cooling component 20 by changing the direction of the current input to the semiconductor thermoelectric cooling component 20. For example, the current direction can be controlled based on the aforementioned target information (such as the temperature of the battery region 90). When the current direction changes, the functions of the cooling end and the heat dissipation end of the semiconductor thermoelectric cooling component 20 are interchanged, that is, the original cooling end becomes the heat dissipation end, and the original heat dissipation end becomes the cooling end.

[0103] This function is particularly useful when using terminal devices in extremely cold external environments. For example, when the heat dissipation device is in a low-temperature environment below -10°C, the battery performance will significantly decrease, and the capacity will be severely degraded. At this time, the control component can change the current direction of the semiconductor thermoelectric cooling component 20, so that the cold side (original cooling end) of the semiconductor thermoelectric cooling component 20 becomes the hot side, and the hot side (original heat dissipation end) becomes the cold side. The coolant is heated when flowing through the first flow channel 31, and the heated coolant flows to the battery area 90 to heat the battery, so that the battery temperature is maintained within a suitable operating temperature range (such as 0°C~45°C), thereby ensuring the effective energy output of the battery and extending the battery's service life.

[0104] Based on the aforementioned target information, the control component can adjust the fan speed by adjusting the voltage input to the fan component or by using PWM control.

[0105] For example, the control component can dynamically adjust the fan speed according to the temperature of the heat dissipation end of the semiconductor thermoelectric cooling component 20 or the load of the heat dissipation device: when the temperature of the heat dissipation end is low or the load of the device is light, the fan speed is reduced to save power consumption and reduce noise; when the temperature of the heat dissipation end is high or the load of the device is heavy, the fan speed is increased to enhance the heat dissipation capacity.

[0106] Based on the aforementioned target information, the control component can adjust the coolant circulation flow rate by adjusting the drive voltage or operating frequency input to the coolant drive component 40 (such as a piezoelectric micropump).

[0107] For example, the control component can dynamically adjust the driving parameters of the piezoelectric micropump according to the temperature of the heat source component 10 or the temperature of the cooling end of the semiconductor thermoelectric cooling component 20: when the heat source temperature is low, the driving voltage or frequency is reduced and the coolant flow rate is reduced to save power consumption; when the heat source temperature is high, the driving voltage or frequency is increased and the coolant flow rate is increased to enhance heat dissipation capacity.

[0108] To facilitate understanding of the heat dissipation device in the embodiments of this application, an application example of the heat dissipation device is provided here, and the specific description is as follows: The heat dissipation device uses TEC (i.e., semiconductor thermoelectric cooling component 20) as the built-in core cooling source, actively generates cooling capacity and transfers the cooling capacity to the motherboard heating area (i.e., heat source component 10) through the liquid cooling module (i.e., liquid cooling circulation channel 30), which is the "cooling capacity supply center" of the entire system.

[0109] Adopting the technical concept of "artificial intelligence (AI) control of multi-module integration and collaboration", a new integrated built-in heat dissipation and cooling system was designed, consisting of CPU control (i.e. control component), liquid cooling module, fan module, TEC semiconductor cooling module, heat sink 60, VC heat dissipation plate and customized air duct.

[0110] To integrate multi-module synergy into the space-constrained mobile phone (i.e., heat dissipation device), the liquid cooling module is divided into three functional areas (i.e., including the first flow channel 31, the second flow channel 32, and the third flow channel 33), which are connected by the flow channels and driven by a piezoelectric micropump, such as... Figure 6 As shown, the zones are: Cooling (TEC) area → Heat source (motherboard) area → Heat dissipation (battery) area.

[0111] By customizing miniaturized modules such as TEC, fans (i.e., the first fan assembly 80 or the second fan assembly), and fins, combined with airflow design, the motherboard and TEC cooling area are separated and independently laid out. The airflow design isolates the two areas from each other, preventing the TEC cooling area from directly contacting the CPU heat source. It uses cold conduction to make contact with the liquid cooling module, so that the liquid cooling medium is cooled and flows through the flow channel to the heat-generating area of ​​the motherboard, then to the heat-free area in the lower half of the terminal, and then back to the TEC cooling area, achieving precise cooling of the core heat source.

[0112] This design solves the following problems: 1. The TEC (Transfer Controller) is used solely for liquid cooling, allowing for a significantly reduced TEC power consumption and lower heat generation. Furthermore, the TEC, fins, and fan can be miniaturized and placed inside the terminal to meet cooling requirements. This design addresses the issue of overlapping heat sources between the TEC and the motherboard. The combined heat from the TEC and the motherboard CPU results in excessive heat generation. Miniaturized TECs cannot effectively suppress this overlap, and excessive heat from the TEC itself prevents proper heat dissipation, causing the TCE (Transfer Controller) to lose its cooling capacity. This can lead to thermal short circuits and a temperature increase instead of a decrease in temperature.

[0113] 2. When there is a temperature difference between the hot and cold surfaces of the TEC (Transformer Heatsink), condensation can occur. If condensation flows from the TEC to the motherboard area, it can damage components and cause short circuits. The core function is TEC cooling delivery, with independent layouts for the motherboard and TEC + heatsink areas, precisely delivering the cooling generated by the TEC to the motherboard's heat sources.

[0114] The specific implementation path is as follows: The TEC is used as the core cooling unit. Its cooling surface (i.e., the cooling end) is in contact with the liquid cooling module through cold conduction. The piezoelectric micro-pump (i.e., the coolant drive component 40) drives the liquid cooling medium (i.e., coolant, including water, fluorinated liquid, coolant or mineral oil, etc.) to circulate in the flow channel. After the liquid cooling medium is cooled, it flows to the heat-generating area of ​​the motherboard through the flow channel. After the medium carries away the heat source through the heat-generating area, it flows to the heat dissipation and cooling area and then flows back to the cooling area to form a closed loop, thereby achieving precise cooling of the core heat source.

[0115] The heat-generating surface (i.e., the heat dissipation end) of the TEC is connected to the heat dissipation fins 60 through heat conduction. At the same time, the side of the fins is equipped with a release fan module, and the bottom surface is connected to the VC heat dissipation plate, forming a three-in-one active heat dissipation combination of "fins + fan + VC heat dissipation plate". The fan blows the heat generated by the TEC to quickly expel the heat generated by the device to the outside of the device, and then the VC heat dissipation plate is used to evenly distribute the excess heat, avoiding the TEC's cooling efficiency reduction due to heat accumulation. The airflow direction inside the device is optimized by custom air ducts to ensure that the heat dissipation efficiency of each module is maximized. At the same time, the air ducts and the motherboard form an independent space, isolating the TEC and the motherboard in an independent space area, solving problems such as thermal short circuits and condensation damaging motherboard components. Finally, a complete closed loop is formed: "AI control → TEC cooling → liquid cooling medium circulation cooling → motherboard cooling → multi-module collaborative heat dissipation in heat-free areas".

[0116] The customized air duct assembly (i.e., air duct bracket assembly 50) consists of an air duct bracket 51 and an air duct cover 52. The air duct bracket 51 is made of aluminum alloy or other thermally conductive materials using CNC or die-casting processes. The air duct is divided into an air inlet (either a side air inlet or a front air inlet can be selected) and an air outlet. The air duct cover 52 is made of aluminum or stainless steel. Fins are fixedly placed on the air outlet side of the air duct bracket 51. The fins are connected to the bracket by welding or a thermal interface material. A TEC is fixedly placed on the surface of the fins. The hot side of the TEC is connected to the surface of the fins by welding or a thermal interface material. An NTC device is placed on the hot side and the cold side of the TEC for temperature monitoring. The NTC devices are coated with adhesive for waterproofing.

[0117] The fan is mounted on the side of the fins and fixed inside the air duct. To accommodate the entire system module inside the machine, the fan's length and width are selected to be smaller, while the fin width is selected to match the fan's width. An opening is made in the air duct bracket 51 to allow the fan, TEC power, and signal cables to pass through, and then seal them with glue. The air duct cover 52 is sealed to the bracket and fins with glue or foam, creating an isolation space between the fan and the motherboard.

[0118] The TEC (Cooling Device) and fan of the cooling system are connected to the motherboard CPU (i.e., the control component). The TEC's cold and hot sides each have NTCs to monitor the cooling temperature. The CPU detects temperature increases during various load scenarios (such as light use, high AI computing power, heavy gaming, and high-definition rendering), and automatically adjusts the TEC voltage based on CPU computing power to adjust the cooling effect. Simultaneously, it automatically adjusts the fan current to adjust the fan speed, thus regulating the heat dissipation capacity of the fins. This dynamic temperature adjustment balances cooling performance and energy consumption control, achieving intelligent temperature control within a range of 40℃ to -10℃ (and lower), effectively solving the motherboard overheating problem. The process is centered on a software algorithm, with hardware modules (TEC sensor, liquid cooling module, fan module, and main control chip CPU) working collaboratively according to instructions to achieve a closed-loop control of "monitoring-judgment-execution-feedback," ensuring stable cooling performance and safe equipment operation.

[0119] This approach avoids the risks of thermal short circuits and condensation caused by direct contact between the TEC sensor and the motherboard, significantly improving the heat dissipation stability and core performance release capabilities of the terminal equipment. The process uses software algorithms as its core, with hardware modules (TEC sensor, liquid cooling module, fan module, and main control chip) working collaboratively according to instructions to achieve closed-loop control of "monitoring-judgment-execution-feedback," ensuring stable cooling performance and safe equipment operation.

[0120] This application embodiment also provides a heat dissipation device, which includes: Heat source components; The aforementioned heat dissipation device includes a semiconductor thermoelectric cooling component and a heat source component that are spaced apart. The second flow channel of the heat dissipation device is provided corresponding to the heat source component, and the second flow channel dissipates the heat generated by the heat source component through a coolant.

[0121] It should be noted that the heat dissipation device in this application embodiment has the same function as the heat dissipation device described in the corresponding embodiment of the above heat dissipation device, and can achieve the same beneficial effect, so it will not be described again here.

[0122] Please see Figure 7 This is a flowchart illustrating a control method for a heat dissipation device provided in an embodiment of this application. Figure 7 As shown, the method includes the following steps: Step S701: In response to detecting target information of the heat dissipation device, based on the target information, perform any of the following: Adjust the input power of the semiconductor thermoelectric cooling component of the heat dissipation device; The cooling end and heat dissipation end of the semiconductor thermoelectric refrigeration component of the heat dissipation device are switched. Adjust the speed of the fan assembly of the heat dissipation device; Adjust the input power of the coolant drive component of the heat dissipation device.

[0123] In some embodiments, the target information includes at least one of the following: The load scenario information of the heat dissipation equipment; The cooling end temperature and the heat dissipation end temperature of the semiconductor thermoelectric refrigeration component. The temperature of the heat source component; The temperature of the battery area of ​​the heat dissipation device.

[0124] It should be noted that the implementation process of each embodiment of the control method of the heat dissipation device in this application is the same as the implementation process described in the corresponding embodiment of the heat dissipation device above, and can achieve the same beneficial effect, so it will not be repeated here.

[0125] Please see Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 8 As shown, the electronic device 800 also includes: One or more processors 810; The memory 820 stores one or more programs that, when executed by one or more processors 810, cause the one or more processors 810 to implement the control method of the heat dissipation device described in any of the above embodiments.

[0126] The memory 820, as a non-transitory network system, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, the memory 820 may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory 820 may optionally include remotely located memories 820 relative to the processor 810, which can be connected to the processor 810 via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0127] The memory 820 can be implemented as a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 820 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 820 and is called and executed by the processor 810.

[0128] The processor 810 can be implemented using a general-purpose central processing unit (CPU), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0129] In some embodiments, the electronic device further includes: Input / output interfaces are used to implement information input and output; The communication interface is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.). The bus transmits information between various components of the device, such as the processor 810, memory 820, input / output interfaces, and communication interfaces. The processor 810, memory 820, input / output interface, and communication interface can communicate with each other within the device via a bus.

[0130] An embodiment of this application also provides a computer-readable storage medium storing computer-executable instructions for performing a control method for implementing the heat dissipation device described in any of the above embodiments.

[0131] An embodiment of this application also provides a computer program product, including a computer program or computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer program or computer instructions from the computer-readable storage medium and executes the computer program or computer instructions, causing the computer device to perform a control method for implementing the heat dissipation device as described in any of the above embodiments.

[0132] The system architecture and application scenarios described in this application are intended to more clearly illustrate the technical solutions of this application and do not constitute a limitation on the technical solutions provided in this application. Those skilled in the art will understand that as system architectures evolve and new application scenarios emerge, the technical solutions provided in this application are also applicable to similar technical problems.

[0133] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0134] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0135] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0136] The above description, with reference to the accompanying drawings, illustrates some embodiments of this application, but does not limit the scope of the invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and spirit of this invention should be considered within the scope of this application.

Claims

1. A heat dissipation device, the heat dissipation device being used to dissipate heat from heat source components in a heat dissipation equipment, the heat dissipation device comprising: A semiconductor thermoelectric refrigeration assembly, the semiconductor thermoelectric refrigeration assembly including a refrigeration end; A liquid-cooled circulation channel, wherein a coolant is encapsulated within the liquid-cooled circulation channel, and the liquid-cooled circulation channel includes a first part channel and a second part channel that are interconnected, wherein the first part channel is disposed at the cooling end. A coolant drive assembly is connected to the liquid cooling circulation channel and is used to drive the coolant to circulate through the first part of the channel and the second part of the channel. In the case where the heat dissipation device is disposed within the heat dissipation equipment, the semiconductor thermoelectric cooling component and the heat source component are disposed at intervals; the second part of the flow channel is disposed corresponding to the heat source component, and the second part of the flow channel dissipates the heat generated by the heat source component through the coolant.

2. The apparatus according to claim 1, characterized in that, The semiconductor thermoelectric cooling assembly also includes a heat dissipation end disposed opposite to the cooling end; The heat dissipation device also includes: A duct support assembly, wherein a first duct communicating with the outside is provided within the duct support assembly; The semiconductor thermoelectric cooling component is connected to the air duct support component, and the heat dissipation end is correspondingly arranged with the first air duct. At least part of the heat generated by the heat dissipation end is discharged through the first air duct.

3. The apparatus according to claim 2, characterized in that, The heat dissipation end is attached to the side wall of the first air duct; or, The heat dissipation end penetrates the side wall of the air duct and is located inside the first air duct.

4. The apparatus according to claim 2, characterized in that, The heat dissipation device also includes: Heat dissipation fins, which are located within the first air duct and are correspondingly arranged to the heat dissipation end; At least a portion of the heat generated at the heat dissipation end is conducted to the first air duct through the heat dissipation fins and dissipated.

5. The apparatus according to claim 4, wherein the heat dissipation device further comprises: A heat spreader plate is provided, and the heat spreader plate and the semiconductor thermoelectric cooling component are disposed on both sides of the air duct support assembly located in the first air duct, and at least a portion of the heat spreader plate is disposed corresponding to the heat dissipation fins. At least a portion of the heat generated at the heat dissipation end is conducted to the heat dissipation plate through the heat dissipation fins for dissipation.

6. The apparatus according to claim 2, characterized in that, The heat dissipation device also includes: A first fan assembly is connected to the first air duct and is used to drive the airflow within the first air duct.

7. The apparatus according to claim 2, characterized in that, The air duct support assembly also has a second air duct that communicates with the outside. In the case where the heat dissipation device is installed inside the heat dissipation equipment, the heat source component is installed on one side of the air duct support component and is corresponding to the second air duct, and at least part of the heat generated by the heat source component is discharged through the second air duct.

8. The apparatus according to claim 7, characterized in that, When the heat dissipation device is disposed within the heat dissipation equipment, the second air duct is located between the second part of the flow channel and the heat source component.

9. The apparatus according to claim 7, characterized in that, The heat dissipation device also includes: A second fan assembly is connected to the second air duct and is used to drive airflow within the second air duct. The first air duct and the second air duct are connected.

10. The apparatus according to claim 9, characterized in that, When the heat dissipation device is disposed within the heat dissipation equipment, the second fan assembly is located in the interval between the semiconductor thermoelectric cooling assembly and the heat source assembly.

11. The apparatus according to any one of claims 7 to 10, characterized in that, The air duct support assembly includes: A duct support, wherein the first duct is provided inside the duct support and a receiving groove is provided on one side of the duct support; and the semiconductor thermoelectric cooling component is disposed in the receiving groove. A duct cover plate is connected to the duct support, and the duct cover plate covers the receiving groove and together with the duct support forms the second duct.

12. The apparatus according to claim 11, characterized in that, The accommodating slot includes a first sub-slot and a second sub-slot that are isolated from each other. The semiconductor thermoelectric cooling component is disposed in the first sub-slot, and the second sub-slot forms the second air duct by the air duct cover plate covering the air duct support.

13. The apparatus according to claim 1, characterized in that, The liquid cooling circulation channel also includes a third channel, which is connected to the first channel and the second channel. The third channel is used to dissipate the heat carried by the coolant flowing into the second channel.

14. The apparatus according to claim 13, characterized in that, When the heat dissipation device is located inside the heat dissipation equipment, the third flow channel is located within the battery area of ​​the heat dissipation equipment.

15. The apparatus according to claim 1, characterized in that, The heat dissipation device also includes: A control component, wherein the control component is used for at least one of the following: Adjust the input power of the semiconductor thermoelectric cooling component; Control the switching between the cooling end and the heat dissipation end of the semiconductor thermoelectric refrigeration component; Adjust the speed of each fan assembly in the heat dissipation device; Adjust the input power of the coolant drive assembly.

16. A heat dissipation device, comprising: Heat source components; And a heat dissipation device as described in any one of claims 1 to 15, wherein the semiconductor thermoelectric cooling component of the heat dissipation device is spaced apart from the heat source component, and a second flow channel of the heat dissipation device is provided corresponding to the heat source component, and the second flow channel dissipates the heat generated by the heat source component through a coolant.

17. A control method for a heat dissipation device, applied to the heat dissipation device as described in claim 16, the method comprising: In response to the detection of target information for a heat dissipation device, based on the target information, perform any of the following: Adjust the input power of the semiconductor thermoelectric cooling component in the heat dissipation device; Control the switching between the cooling end and the heat dissipation end of the semiconductor thermoelectric refrigeration component; Adjust the speed of the fan assembly in the heat dissipation device; Adjust the input power of the coolant drive component in the heat dissipation device.

18. The method according to claim 17, characterized in that, The target information includes at least one of the following: The load scenario information of the heat dissipation equipment; The cooling end temperature and the heat dissipation end temperature of the semiconductor thermoelectric refrigeration component. The temperature of the heat source component; The temperature of the battery area of ​​the heat dissipation device.

19. An electronic device comprising: One or more processors; A memory that stores one or more programs, which, when executed by one or more processors, cause the one or more processors to perform the following: The control method for the heat dissipation device according to any one of claims 17 or 18.

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