Communication equipment

Abstract

The invention relates to the field of heat dissipation of electronic equipment, in particular to communication equipment which comprises a case, a circuit mainboard, a high-power-consumption chip, a flexible connecting piece and a heat dissipation device, the circuit mainboard, the high-power-consumption chip, the flexible connecting piece and the heat dissipation device are arranged in the case, and a memory piece, a power module, a hard disk interface and a network card chip are embedded in the circuit mainboard. The high-power-consumption chip is electrically connected with the circuit mainboard through a flexible connecting piece and used for enabling the high-power-consumption chip to be independent from the surface of the circuit mainboard, and the high-power-consumption chip is detachably installed in the heat dissipation area of the heat dissipation device and used for heat dissipation. According to the heat dissipation equipment, rapid heat dissipation of the high-power-consumption chip in the communication equipment is improved, the energy consumption cost is reduced, and the problems that noise is generated by an existing heat dissipation mode, and the circuit mainboard is prone to short circuit and corrosion are effectively solved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation in electronic devices, and more particularly to a communication device. Background Technology

[0002] With the continuous innovation and rapid development of information technology, communication equipment is increasingly widely and deeply applied in various fields. The circuit board of a communication device, as the nerve center of the hardware system, integrates five core components—memory, power module, hard disk interface, network card chip, and high-power chip—through a high-density printed circuit board (PCB), forming a closed-loop system for high-speed data flow and precise energy allocation. Its design follows a four-dimensional collaborative model of "computing-storage-transmission-power supply," with each module achieving low-latency interaction through a standardized bus. Among these, the high-power chip, as one of the core components of communication equipment, is constantly improving its computing speed and processing power, enabling it to complete more complex tasks in a shorter time. However, this also brings a serious problem: the heat generated by the high-power chip increases dramatically during operation. Excessive temperature can severely affect the performance and stability of the high-power chip, and may even lead to equipment crashes or damage. Therefore, effective heat dissipation has become a key factor in ensuring the stable operation of communication equipment.

[0003] To address the heat dissipation issue of high-power chips in communication equipment, the industry primarily employs the following conventional methods. One is air cooling, which involves installing a heatsink on the motherboard of the communication equipment, directly facing the high-power chips. The heatsink typically has a large surface area, quickly absorbing the heat generated by the high-power chips. A high-power fan then blows air across the heatsink, accelerating airflow and carrying the heat away from its surface, thus achieving heat transfer and dissipation. Another method is immersion liquid cooling, where the entire motherboard of the communication equipment is directly immersed in coolant. Coolant has excellent thermal conductivity, rapidly absorbing the heat generated by the equipment, thus achieving good heat dissipation. A third method is cold-plate liquid cooling, which involves placing several cold plates on the circuit board, bringing them in close contact with the heat-generating components of the high-power chips. The cold plates typically have coolant channels inside, allowing heat generated by the high-power chips to be transferred to the cold plates through thermal conduction, and then carried away by the coolant within the cold plates. All of these solutions achieve heat dissipation for high-power chips to a certain extent.

[0004] However, these existing heat dissipation solutions still have significant drawbacks in practical applications. On the one hand, air cooling generates considerable noise from high-powered fans operating at high speeds, causing noise pollution to the surrounding environment and affecting the working environment and health of staff. Furthermore, the operation of high-powered fans consumes a large amount of electricity, increasing the energy consumption of data centers. On the other hand, immersion liquid cooling requires a large amount of working fluid, and the coolant is expensive, undoubtedly increasing the operating costs of the equipment. Moreover, the entire circuit board is immersed in the working fluid environment, which can affect electrical performance and reliability, easily leading to problems such as short circuits and corrosion. In addition, using cold plate liquid cooling requires the extensive use of copper materials and precision machining processes, significantly increasing its manufacturing costs. Summary of the Invention

[0005] In order to improve the rapid heat dissipation of high-power chips in communication equipment and reduce energy consumption costs, effectively avoid the noise generated by existing heat dissipation methods, and prevent problems such as short circuits and corrosion on the circuit board, this application provides a communication device.

[0006] This application provides a communication device, including a chassis and a circuit board disposed in the chassis, at least two high-power chips, a flexible connector and a heat dissipation device. The high-power chips are electrically connected to the circuit board through the flexible connector, which is used to separate the high-power chips from the surface of the circuit board. The high-power chips can be installed and removed from the heat dissipation area of ​​the heat dissipation device for heat dissipation.

[0007] By adopting the above technical solution, the circuit board embeds memory components, a power module, a hard drive interface, and a network card chip. The high-power chip is electrically connected to the circuit board via a flexible connector, allowing it to be independently mounted on the circuit board surface. This flexible connector facilitates selective mounting of the high-power chip in the heat dissipation area of ​​the heat sink. This independent design avoids the mutual heat interference caused by the high-power chip being too tightly attached to other components on the circuit board, reducing the transfer of heat generated by other components on the circuit board to the high-power chip, and also preventing the heat generated by the high-power chip from interfering with the performance of other components on the circuit board. Furthermore, the high-power chip can be detachably mounted in the heat dissipation area of ​​the heat sink, facilitating flexible replacement of the heat sink according to actual cooling needs. This allows for more targeted cooling of the high-power chip, significantly improving its heat dissipation efficiency, ensuring stable operation, and extending its service life.

[0008] Preferably, the flexible connector includes a flexible signal cable and a flexible power cable.

[0009] By adopting the above technical solution, the flexible connector is configured to include a flexible signal cable and a flexible power cable. The flexible signal cable can transmit signals, and the flexible power cable can transmit power. The flexibility of both allows for more flexible adaptation to different installation positions and angles when connecting high-power chips and circuit boards, reducing space limitations and mechanical stress during connection. At the same time, the flexible material also reduces the risk of loosening or damage to the connection due to vibration and other factors, thereby ensuring the stability and reliability of signal and power transmission between high-power chips and circuit boards.

[0010] Preferably, a sealing structure is provided at the connection points between the high-power chip and the flexible connector, and between the circuit board and the flexible connector.

[0011] By adopting the above technical solution, a sealing structure is set at the connection between the high-power chip and the flexible connector, and between the circuit board and the flexible connector, effectively preventing dust, moisture, and other impurities from entering the connection. If these impurities enter, they may cause poor contact of the connector, affecting the stability of signal transmission and power supply. The sealing structure provides a good seal, improving the stability and reliability of the electrical connection between the high-power chip and the circuit board, thereby ensuring the normal operation of the entire communication equipment, reducing equipment failures and damage caused by connection problems, and extending the equipment's service life.

[0012] Preferably, the high-power chip is mounted on the side wall of the chassis or disposed outside the chassis, and there is a heat dissipation isolation gap between the high-power chip and the chassis.

[0013] By adopting the above technical solution, the high-power chip is installed on the side wall of the chassis or in a position away from the outside of the chassis, so that there is a heat dissipation isolation gap between the high-power chip and the chassis. On the one hand, the high-power chip is independent of the circuit motherboard, avoiding the influence of the heat generated by the circuit motherboard on the high-power chip. On the other hand, the heat dissipation isolation gap can form an air circulation channel. The air flowing in the gap can carry away the heat generated by the high-power chip, accelerate the heat dissipation speed of the high-power chip, effectively reduce the temperature of the high-power chip, and thus improve the working stability and service life of the high-power chip.

[0014] Preferably, the heat dissipation device includes a liquid-cooled storage tank, which is disposed on the side wall of the chassis, and the high-power chip is disposed in the liquid-cooled storage tank.

[0015] By adopting the above technical solution, the liquid cooling tank is placed on the side wall of the chassis, and only the high-power chips are placed in the liquid cooling tank for centralized heat dissipation. This achieves precise heat dissipation of the heat source, reduces the amount of working fluid used, and improves heat dissipation efficiency. The coolant in the liquid cooling tank can directly contact the high-power chips. The coolant has a large specific heat capacity and can absorb a large amount of heat. After absorbing the heat generated by the high-power chips, the coolant can dissipate the heat through heat exchange and other means, thereby effectively reducing the temperature of the high-power chips and ensuring that they operate stably in a suitable temperature environment. It eliminates the need to immerse the entire circuit board in the coolant in the liquid cooling tank, effectively avoiding problems such as short circuits and corrosion on the circuit board.

[0016] Preferably, the heat dissipation device includes a heat sink, a fan, and a liquid cooling tank. The heat sink and the fan are both mounted on the circuit board, the liquid cooling tank is mounted on the side wall of the chassis or located outside the chassis, and the high-power chip is mounted in the liquid cooling tank.

[0017] By adopting the above technical solution, the heat dissipation device includes a heat sink, a fan, and a liquid cooling tank. The heat sink and fan are mounted on the main circuit board, dissipating heat from the main circuit board and its surroundings, reducing the heat generated during operation and maintaining stable operation. The liquid cooling tank is located on the side wall of the chassis or away from the exterior. High-power chips are housed on the inner wall of the liquid cooling tank, and the coolant inside directly absorbs the large amount of heat generated by the high-power chips. Compared to simple air cooling, liquid cooling is more efficient. Furthermore, the heat sink and fan work together with the liquid cooling tank to form a multi-dimensional heat dissipation system, providing more comprehensive and efficient cooling for high-power chips and the entire device, thus improving the heat dissipation performance of the communication equipment.

[0018] Preferably, the heat dissipation device includes a cold plate containing coolant, the cold plate is disposed on the main circuit board, and the high-power chip is disposed on the side of the cold plate away from the main circuit board.

[0019] By adopting the above technical solution, the cold plate is simply placed on the circuit board, and the high-power chip is placed on the side of the cold plate away from the circuit board, with coolant inside the cold plate. The coolant has excellent heat absorption properties; when the high-power chip generates heat during operation, the heat is transferred to the cold plate, where the coolant absorbs this heat, effectively reducing the temperature of the high-power chip. This eliminates the need for densely packed cold plates on the circuit board, significantly reducing energy consumption and enabling efficient operation of the entire communication device.

[0020] Preferably, the heat dissipation device includes a heat sink, a fan, and a cold plate, all disposed on the circuit motherboard. The heat sink and the fan are both disposed on the circuit motherboard, the cold plate is disposed on the circuit motherboard, and coolant is disposed inside the cold plate. The high-power chip is disposed on the side of the cold plate away from the circuit motherboard.

[0021] By adopting the above technical solution, a heat sink, fan, and cold plate are installed on the circuit board. The heat sink directly dissipates heat from the circuit board and its surroundings, while the fan accelerates airflow and enhances the heat dissipation effect. The cold plate contains coolant, which has a high specific heat capacity and can absorb a large amount of heat. The high-power chip is placed on the side of the cold plate away from the circuit board, allowing the heat generated by the high-power chip to be quickly transferred to the coolant within the cold plate. After absorbing the heat, the coolant dissipates the heat through the heat sink and fan. These three components work together to form a highly efficient heat dissipation system, significantly improving the heat dissipation efficiency of the high-power chip, effectively reducing its operating temperature, ensuring stable operation, extending its lifespan, and improving the reliability and stability of the entire communication equipment.

[0022] Preferably, the heat dissipation device includes a liquid cooling tank and a cold plate. The liquid cooling tank is disposed on the side wall of the chassis or outside the chassis. The cold plate is disposed on the circuit board and contains coolant. The high-power chip is disposed in the liquid cooling tank.

[0023] By adopting the above technical solution, the liquid-cooled reservoir is located on the side wall of the chassis or externally away from the chassis. A cold plate is mounted on the main circuit board and contains coolant. The high-power chip is housed within the liquid-cooled reservoir. The liquid-cooled reservoir effectively absorbs the heat generated by the high-power chip by utilizing the heat exchange characteristics of the coolant, thus reducing the chip's temperature. Simultaneously, the cold plate on the main circuit board dissipates heat from other heat-generating components, reducing heat accumulation within the chassis. Furthermore, this layout allows the high-power chip to be in direct contact with the liquid-cooled reservoir, enabling more efficient transfer of heat from the chip to the coolant, which then dissipates the heat through circulation, thereby improving the overall heat dissipation efficiency of the communication equipment.

[0024] Preferably, the heat dissipation device further includes an external cooling circulation system, and the cold plate is connected to the external cooling circulation system through a pipe.

[0025] By employing the above technical solution, a coolant is installed inside the cold plate, allowing it to directly contact the high-power chip and absorb the heat it generates. An external cooling circulation system is connected to the cold plate via pipes, enabling the coolant to circulate between the cold plate and the external system. When the coolant, having absorbed heat from the high-power chip, flows to the external cooling circulation system, it is cooled and dissipated. The cooled coolant then flows back to the cold plate to continue absorbing heat from the high-power chip. This circulation process ensures that the cold plate maintains a consistently low temperature in contact with the high-power chip, significantly improving the heat dissipation efficiency.

[0026] Preferably, the number of high-power chips is greater than or equal to two, and at least two of the high-power chips are disposed in different planar spaces.

[0027] By adopting the above technical solution, when there are at least two high-power chips in the communication device, the at least two high-power chips are set in different planar spaces, the heat of each chip is relatively independent and will not interfere with each other, avoiding heat concentration, and the air can flow more smoothly up and down or back and forth in the chip, accelerating the dissipation of heat.

[0028] In summary, this application includes at least one of the following beneficial technical effects: 1. By using flexible connectors to separate the high-power chip from the surface of the circuit board, the high-power chip is no longer in close contact with the circuit board, reducing the impact of heat generated by the circuit board and other components on the high-power chip. The flexible connectors facilitate the removal and installation of the high-power chip on the heat dissipation device, allowing the heat dissipation device to dissipate heat from the high-power chip more directly, improving the heat dissipation efficiency of the high-power chip, and preventing the high-power chip from overheating and affecting its performance and stability. 2. A sealing structure is set at the connection between the high-power chip and the flexible connector, and between the circuit board and the flexible connector. Since the sealing structure has a sealing function, it can prevent external dust, moisture and other substances from entering the connection, avoiding problems such as loose connection or short circuit caused by dust accumulation or moisture erosion, thus ensuring the stability and reliability of the connection. 3. Various heat dissipation device configurations are available, such as radiators, fans, liquid-cooled reservoirs, and cold plates. Different heat dissipation devices have different heat dissipation principles and characteristics. A combination of radiators and fans can dissipate heat by increasing the heat dissipation area and accelerating airflow. Liquid-cooled reservoirs and cold plates can efficiently absorb and transfer heat using coolant. Users can choose the appropriate heat dissipation method according to different needs, such as heat dissipation efficiency requirements, cost budget, and installation space. This effectively solves the problems of limited heat dissipation efficiency, high cost, and leakage risk associated with traditional heat dissipation technologies. Attached Figure Description

[0029] Figure 1 This is a structural diagram of the communication device in Example 1; Figure 2 This is a structural diagram of the communication device in Example 2; Figure 3 This is a structural diagram of the communication device in Example 3; Figure 4 This is a structural diagram of the communication device in Example 4; Figure 5 This is a structural diagram of the communication device in Example 5; Figure 6 This is a structural diagram of the communication device in Example 6; Figure 7 This is a structural diagram of the communication device in Example 7.

[0030] Explanation of reference numerals in the attached diagram: 1. Chassis; 2. Circuit board; 3. High-power chip; 4. Flexible connector; 5. Heat dissipation device; 21. Memory module; 22. Power module; 23. Hard disk interface; 24. Network card chip; 41. Flexible signal cable; 42. Flexible power cable; 43. Sealing structure; 51. Heat sink; 52. Fan; 53. Liquid cooling tank; 54. Cold plate. Detailed Implementation

[0031] The following is in conjunction with the appendix Figure 1-7 This application will be described in further detail.

[0032] Example 1

[0033] This application provides a communication device, which is described in an embodiment. Figure 1 The system includes a chassis 1, a mainboard 2, a high-power chip 3, a flexible connector 4, and a heat dissipation device 5. The mainboard 2, high-power chip 3, flexible connector 4, and heat dissipation device 5 are all housed within the chassis 1. The heat dissipation device 5 is located on the mainboard 2. The high-power chip 3, with a power rating greater than 100W, is connected to the mainboard 2 via the flexible connector 4 and is mounted on the side wall of the chassis 1 in a location with good ventilation. The high-power chip 3 is electrically connected to the mainboard 2 via the flexible connector 4, thus isolating it from the surface of the mainboard 2. The high-power chip 3 can be detachably mounted on the heat dissipation area of ​​the heat dissipation device 5 for heat dissipation. This structural design allows the heat generated by the high-power chip 3 to be more efficiently dissipated by the heat dissipation device 5, preventing heat accumulation near the mainboard 2 and improving heat dissipation efficiency. In this embodiment, the number of high-power chips 3 is at least two. The number of flexible connectors 4 and heat dissipation devices 5 is adaptively adjusted according to the number of high-power chips 3. When the number of high-power chips 3 is greater than or equal to two, at least two high-power chips 3 are set in different planar spaces to facilitate better heat dissipation between each high-power chip 3.

[0034] Specifically, in this embodiment, the circuit motherboard 2 is embedded with components such as memory 21, power module 22, hard disk interface 23 and network card chip 24. The memory 21 is used to store data when the computer is running, the power module 22 provides power support for the entire device, the hard disk interface 23 is used to connect the hard disk, and the network card chip 24 realizes the network connection function of the computer.

[0035] Specifically, in this embodiment, the flexible connector 4 includes a flexible signal cable 41 and a flexible power cable 42. The flexible signal cable 41 transmits signals between the high-power chip 3 and the circuit board 2. It has good flexibility, adapting to different installation positions and angles, facilitating the connection between the high-power chip 3 and the circuit board 2. The flexible signal cable 41 typically employs a multi-core structure to ensure the stability and reliability of signal transmission. The flexible power cable 42 provides power to the high-power chip 3. It also possesses flexibility, enabling a flexible connection between the high-power chip 3 and the circuit board 2. The flexible power cable 42 generally has a large cross-sectional area to meet the high power requirements of the high-power chip 3. In this embodiment, the flexible power cable 42 is made of copper. Copper has good conductivity, effectively transmitting power. The surface of the copper flexible power cable 42 is tin-plated to improve its oxidation and corrosion resistance.

[0036] Sealing structures 43 are provided at the connections between the high-power chip 3 and the flexible signal cable 41, between the circuit board 2 and the flexible signal cable 41, between the high-power chip 3 and the flexible power cable 42, and between the circuit board 2 and the flexible power cable 42. The function of the sealing structure 43 is to prevent dust, moisture, and other impurities from entering the connection, ensuring the stability and reliability of the connection. The sealing structure 43 is made of elastic materials such as rubber and has good sealing performance. When installing the sealing structure 43, it is necessary to ensure that it fits tightly against the connection to achieve the best sealing effect. Specifically, during installation, a layer of sealant can be applied to the connection first, then the sealing structure 43 can be accurately placed in the corresponding position, and then appropriate pressure can be applied to ensure a tight fit with the connection.

[0037] Specifically, in this embodiment, the heat dissipation device 5 consists of a heat sink 51 and a fan 52. Both the heat sink 51 and the fan 52 are mounted on the circuit board 2 for rapid heat dissipation of the circuit board and other components. The high-power chip 3 is mounted on the side wall of the chassis 1 or located away from the outside of the chassis 1. In this embodiment, the high-power chip 3 is mounted on the side wall of the chassis 1. During installation, a heat dissipation isolation gap is ensured between the high-power chip 3 and the chassis 1. This prevents the hot air inside the chassis 1 from affecting the high-power chip 3 and also facilitates air circulation, further improving the heat dissipation effect. The size of the heat dissipation isolation gap can be adjusted according to the specific dimensions of the chassis 1 and the heat dissipation requirements. A heat dissipation isolation gap between 1 and 3 centimeters is more suitable. The heat sink 51 is usually made of a metal material with high thermal conductivity, such as copper or aluminum, and its surface has a large number of heat dissipation fins, which can increase the heat dissipation area and accelerate heat dissipation. The fan 52 is installed near the heat sink 51 and accelerates airflow by blowing air onto the heat sink 51, thereby improving the heat dissipation efficiency. Fan 52 can be an axial fan, which features a large air volume and high air pressure, effectively removing heat. The axial fan 52 works by using a motor to rotate the fan blades, causing air to flow axially. Specifically, the high-power chip 3 is installed on the side wall of the chassis 1, facing the fan 52 inlet, to facilitate the removal of heat generated by the high-power chip 3, improving heat dissipation efficiency. In this way, the power consumption of fan 52 can be reduced to 50% of its original value, saving energy and effectively reducing noise.

[0038] The implementation principle of this embodiment is as follows: By separating the high-power chip 3 from the circuit board 2 through the flexible connector 4, the heat from the high-power chip 3 is prevented from affecting other components on the circuit board 2. Simultaneously, the high-power chip 3 is mounted on the side wall of the chassis 1 away from the outside of the chassis 1, and is cooled by a heat sink 51 and a fan 52. The heat dissipation gap ensures airflow, improving heat dissipation efficiency. Furthermore, the sealing structure 43 ensures the stability and reliability of the connection, reducing the probability of failure caused by external impurities. Compared to traditional high-power chip 3 heat dissipation methods, this embodiment significantly improves both heat dissipation performance and stability.

[0039] Example 2 The difference between this embodiment and Embodiment 1 is that: (Refer to...) Figure 2The heat dissipation device 5 consists of a liquid-cooled storage tank 53, which is located on the side wall of the chassis 1 or externally away from the chassis 1. In this embodiment, the liquid-cooled storage tank 53 is located on the side wall of the chassis 1, and the high-power chip 3 is located on the inner wall of the liquid-cooled storage tank 53. The liquid-cooled storage tank 53 contains coolant, which has good thermal conductivity and specific heat capacity, and can efficiently absorb the heat generated by the high-power chip 3. The coolant is a mixture of water and antifreeze. Water has a high specific heat capacity and can absorb a large amount of heat, while antifreeze can prevent the coolant from freezing in low-temperature environments. The liquid-cooled storage tank 53 is usually sealed to prevent coolant leakage. The mixture inside the liquid-cooled storage tank 53 can be easily replaced by opening the sealed cover. The liquid-cooled storage tank 53 is provided with a clearance hole for the flexible power cable 42 and the flexible signal cable 41 to pass through, and a sealing structure is provided between the clearance hole and the cable. The high-power chip 3 is disposed on the inner wall of the liquid-cooled storage tank 53, allowing it to directly contact the coolant and enabling rapid heat transfer. In this embodiment, the number of high-power chips 3 is at least one. The number of flexible connectors 4 and heat dissipation devices 5 is adaptively adjusted according to the number of high-power chips 3. When the number of high-power chips 3 is greater than or equal to two, at least two high-power chips 3 are disposed in different planar spaces to facilitate better heat dissipation between the high-power chips 3.

[0040] The implementation principle of this embodiment is as follows: the coolant in the liquid cooling tank 53 dissipates heat from the high-power chip 3. The coolant can efficiently absorb the heat generated by the high-power chip 3, and the liquid cooling tank 53 is located on the side wall of the chassis 1, which is conducive to heat dissipation. Compared with traditional heat dissipation methods, liquid cooling has higher heat dissipation efficiency, can better meet the heat dissipation requirements of the high-power chip 3 under high load operation, improves the stability and performance of the computer, and eliminates the need to immerse the entire circuit motherboard 2 in coolant.

[0041] Example 3 The difference between this embodiment and Embodiment 2 is that: (Refer to...) Figure 3The heat dissipation device 5 consists of a heat sink 51, a fan 52, and a liquid cooling tank 53. The heat sink 51 and fan 52 are both mounted on the main circuit board 2, while the liquid cooling tank 53 is mounted on the side wall of the chassis 1 or located away from the chassis 1. In this embodiment, the liquid cooling tank 53 is mounted on the side wall of the chassis 1, and the high-power chip 3 is mounted on the inner wall of the liquid cooling tank 53. This combined heat dissipation method integrates the advantages of air cooling and liquid cooling, further improving heat dissipation efficiency. The heat sink 51 and fan 52 can dissipate heat from other components on the main circuit board 2, while the liquid cooling tank 53 efficiently dissipates heat from the high-power chip 3. The heat sink 51 increases the heat dissipation area through its heat dissipation fins, the fan 52 accelerates airflow to remove heat, and the coolant in the liquid cooling tank 53 directly absorbs the large amount of heat generated by the high-power chip 3. In this embodiment, the number of high-power chips 3 is at least one. The number of flexible connectors 4 and heat dissipation devices 5 is adaptively adjusted according to the number of high-power chips 3. When the number of high-power chips 3 is greater than or equal to two, at least two high-power chips 3 are set in different planar spaces to facilitate better heat dissipation between each high-power chip 3.

[0042] The implementation principle of this embodiment is as follows: by combining the heat sink 51, fan 52, and liquid cooling tank 53, comprehensive heat dissipation is achieved for the circuit board 2 and the high-power chip 3. The heat sink 51 and fan 52 initially dissipate heat from the circuit board 2, while the liquid cooling tank 53 specifically and efficiently dissipates heat from the high-power chip 3. This effectively reduces the temperature of the high-power chip 3 and the circuit board 2, improving the overall stability and performance of the computer. Compared to a single heat dissipation method, the combined heat dissipation can better cope with the large amount of heat generated by the high-power chip 3 under high load.

[0043] Example 4 The difference between this embodiment and Embodiment 1 is that: (Refer to...) Figure 4The heat dissipation device 5 includes a cold plate 54 and an external cooling circulation system. The cold plate 54 is connected to the external cooling circulation system via pipes. Coolant is stored inside the cold plate 54. The cold plate 54 is mounted on the main circuit board 2, and the high-power chip 3 is located on the side of the cold plate 54 furthest from the main circuit board 2. The cold plate 54 is a highly efficient heat dissipation device. The coolant inside it can quickly absorb the heat generated by the high-power chip 3 and dissipate the heat through the surface of the cold plate 54. The external cooling circulation system continuously cools the coolant inside the cold plate 54 after it has absorbed heat, and then returns it to the cold plate 54, forming a cyclical heat dissipation process. The cold plate 54 is typically made of aluminum alloy or other metal materials. Aluminum alloy has good thermal conductivity, is lightweight, and has a relatively low cost. Specifically, by using a cold plate 54 with a microchannel structure, the coolant inside can flow rapidly within the microchannels, improving heat exchange efficiency. The microchannel structure increases the contact area between the coolant and the inner wall of the cold plate 54, allowing heat to be transferred more quickly from the high-power chip 3 to the coolant. In this embodiment, the number of high-power chips 3 is at least one. The number of flexible connectors 4 and heat dissipation devices 5 is adaptively adjusted according to the number of high-power chips 3. When the number of high-power chips 3 is greater than or equal to two, at least two high-power chips 3 are set in different planar spaces to facilitate better heat dissipation between each high-power chip 3.

[0044] The implementation principle of this embodiment is as follows: the coolant inside the cold plate 54 dissipates heat from the high-power chip 3. The cold plate 54 is in direct contact with the high-power chip 3, which can quickly transfer heat to the coolant, and then dissipate the heat through the surface of the cold plate 54. This heat dissipation method has the advantages of high heat dissipation efficiency and simple structure, and can effectively reduce the temperature of the high-power chip 3, thereby improving the stability and performance of the computer.

[0045] Example 5 The difference between this embodiment and embodiment 4 is that: (Refer to...) Figure 5 The heat dissipation device 5 includes a heat sink 51, a fan 52, a cold plate 54, and an external cooling circulation system, all mounted on the circuit board 2. Coolant is contained within the cold plate 54. The high-power chip 3 is positioned on the side of the cold plate 54 furthest from the circuit board 2. The cold plate 54 is connected to the external cooling circulation system via pipes. The external cooling circulation system continuously cools the coolant within the cold plate 54 after it has absorbed heat, and then returns it to the cold plate 54, forming a cyclical heat dissipation process. In this embodiment, the number of high-power chips 3 is at least one. The number of flexible connectors 4 and the heat dissipation device 5 is adaptively adjusted according to the number of high-power chips 3. When the number of high-power chips 3 is greater than or equal to two, at least two high-power chips 3 are positioned in different planar spaces to facilitate better heat dissipation between the high-power chips 3.

[0046] The implementation principle of this embodiment is as follows: High-efficiency heat dissipation of the high-power chip 3 is achieved through the combination of heat sink 51, fan 52, cold plate 54, and external cooling circulation system. Heat sink 51 and fan 52 dissipate heat from the circuit board 2, while cold plate 54 directly contacts the high-power chip 3, absorbing the heat generated by it. The external cooling circulation system continuously cools the coolant within cold plate 54, ensuring its heat dissipation effect. This combined heat dissipation method better copes with the large amount of heat generated by the high-power chip 3 under high load, improving the stability and performance of the computer. Compared to traditional heat dissipation methods, it has higher heat dissipation efficiency and better heat dissipation effect.

[0047] Example 6 The difference between this embodiment and embodiment 4 is that: (Refer to...) Figure 6 The system comprises two high-power chips. The heat dissipation device 5 includes a liquid-cooled storage tank 53, a cold plate 54, and an external cooling circulation system. The liquid-cooled storage tank 53 is located on the side wall of the chassis 1 or externally away from the chassis 1. In this embodiment, the liquid-cooled storage tank 53 is located on the side wall of the chassis 1, and one high-power chip 3 is located on the inner wall of the liquid-cooled storage tank 53. The cold plate 54 contains coolant, and the other high-power chip 3 is located on the side of the cold plate 54 away from the main circuit board 2. The cold plate 54 is connected to the external cooling circulation system via pipes. The external cooling circulation system continuously cools the coolant in the cold plate 54 after it has absorbed heat, and then returns it to the cold plate 54, forming a cyclical heat dissipation process. In this embodiment, the number of high-power chips 3 is at least one. The number of flexible connectors 4 and heat dissipation devices 5 is adaptively adjusted according to the number of high-power chips 3. When the number of high-power chips 3 is greater than or equal to two, at least two high-power chips 3 are located in different planar spaces to facilitate better heat dissipation between the high-power chips 3.

[0048] The implementation principle of this embodiment is as follows: Efficient heat dissipation of the two high-power chips 3 is achieved through the combination of a liquid cooling tank 53, a cold plate 54, and an external cooling circulation system. The liquid cooling tank 53 is specifically designed for efficient heat dissipation of the high-power chips 3. The cold plate 54 directly contacts the high-power chips 3, absorbing the heat generated by them. The external cooling circulation system continuously cools the coolant within the cold plate 54, ensuring its effective heat dissipation. For cases with multiple high-power chips, the heat dissipation method can be freely chosen. This combined heat dissipation method better copes with the large amount of heat generated by the high-power chips 3 under high load, improving the stability and performance of the computer. Compared to traditional heat dissipation methods, it has higher heat dissipation efficiency and better heat dissipation effect.

[0049] Example 7 The difference between this embodiment and embodiment 5 is that: (Refer to...) Figure 7 The heat dissipation device 5 includes a heat sink 51, a fan 52, a liquid cooling tank 53, a cold plate 54, and an external cooling circulation system, all mounted on the circuit board 2. The heat sink 51 and fan 52 are both mounted on the circuit board 2 for rapid heat dissipation from the circuit board and other components. The high-power chip 3 is mounted on the side wall of the chassis 1. The liquid cooling tank 53 is located on the side wall of the chassis 1 or externally away from the chassis 1. In this embodiment, the liquid cooling tank 53 is located on the side wall of the chassis 1, and the high-power chip 3 is located on the inner wall of the liquid cooling tank 53. The liquid cooling tank 53 contains coolant with good thermal conductivity and specific heat capacity, enabling it to efficiently absorb the heat generated by the high-power chip 3. The cold plate 54 is mounted on the circuit board 2 in close contact with other components and contains coolant. The cold plate 54 is connected to the external cooling circulation system via pipes. The external cooling circulation system continuously cools the coolant in the cold plate 54 after it has absorbed heat, and then returns it to the cold plate 54, forming a cyclical heat dissipation process. In this embodiment, the number of high-power chips 3 is at least one. The number of flexible connectors 4 and heat dissipation devices 5 is adaptively adjusted according to the number of high-power chips 3. When the number of high-power chips 3 is greater than or equal to two, at least two high-power chips 3 are set in different planar spaces to facilitate better heat dissipation between each high-power chip 3.

[0050] The implementation principle of this embodiment is as follows: High-efficiency heat dissipation of the high-power chip 3 is achieved through the combination of a heat sink 51, a fan 52, a liquid cooling tank 53, a cold plate 54, and an external cooling circulation system. The heat sink 51 and fan 52 dissipate heat from the circuit board 2, while the high-power chip 3, housed in the liquid cooling tank 53, receives efficient heat dissipation. The cold plate 54 is in direct contact with other components, absorbing heat generated by the circuit board 2 and other components, while the external cooling circulation system continuously cools the coolant within the cold plate 54, ensuring its heat dissipation effect. This combined heat dissipation method better copes with the large amount of heat generated by the high-power chip 3 under high load, improving the stability and performance of the computer. Compared to traditional heat dissipation methods, it has higher heat dissipation efficiency and better heat dissipation effect.

[0051] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A communication device, characterized in that, The device includes a chassis (1) and a circuit board (2) disposed on the chassis (1), at least two high-power chips (3), a flexible connector (4) and a heat dissipation device (5). The high-power chips (3) are electrically connected to the circuit board (2) through the flexible connector (4) to separate the high-power chips (3) from the surface of the circuit board (2). The high-power chips (3) can be installed and removed from the heat dissipation area of ​​the heat dissipation device (5) for heat dissipation.

2. The communication device according to claim 1, characterized in that, The flexible connector (4) includes a flexible signal cable (41) and a flexible power cable (42).

3. The communication device according to claim 1, characterized in that, A sealing structure (43) is provided at the connection between the high-power chip (3) and the flexible connector (4), and at the connection between the circuit board (2) and the flexible connector (4).

4. The communication device according to claim 1, characterized in that, The high-power chip (3) is installed on the side wall of the chassis (1) or located outside the chassis (1), and there is a heat dissipation isolation gap between the high-power chip (3) and the chassis (1).

5. The communication device according to claim 1, characterized in that, The heat dissipation device (5) includes a liquid-cooled storage tank (53), and the high-power chip (3) is disposed in the liquid-cooled storage tank (53).

6. The communication device according to claim 1, characterized in that, The heat dissipation device (5) includes a heat sink (51), a fan (52) and a liquid cooling tank (53). The heat sink (51) and the fan (52) are both located on the circuit board (2). The liquid cooling tank (53) is located on the side wall of the chassis (1) or outside the chassis (1). The high-power chip (3) is located in the liquid cooling tank (53).

7. The communication device according to claim 1, characterized in that, The heat dissipation device (5) includes a cold plate (54) containing coolant. The cold plate (54) is disposed on the main circuit board (2), and the high-power chip (3) is disposed on the side of the cold plate (54) away from the main circuit board (2).

8. The communication device according to claim 1, characterized in that, The heat dissipation device (5) includes a heat sink (51), a fan (52) and a cold plate (54) both disposed on the circuit motherboard (2). The heat sink (51) and the fan (52) are both disposed on the circuit motherboard (2). The cold plate (54) is disposed on the circuit motherboard (2). Coolant is disposed inside the cold plate (54). The high-power chip (3) is disposed on the side of the cold plate (54) away from the circuit motherboard (2).

9. The communication device according to claim 1, characterized in that, The heat dissipation device (5) includes a liquid cooling tank (53) and a cold plate (54). The liquid cooling tank (53) is located on the side wall of the chassis (1) or outside the chassis (1). The cold plate (54) is located on the circuit board (2). Coolant is provided inside the cold plate (54). The high-power chip (3) is located in the liquid cooling tank (53).

10. The communication device according to any one of claims 7-9, characterized in that, The heat dissipation device also includes an external cooling circulation system, and the cold plate is connected to the external cooling circulation system through pipes.

11. The communication device according to claim 1, characterized in that, The number of the high-power chips (3) is greater than or equal to two, and at least two of the high-power chips (3) are disposed in different planar spaces.

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