Display device

Abstract

A display device according to an embodiment of the present disclosure includes: a substrate, the substrate including: a display area and a non-display area surrounding the display area, the display area including a plurality of sub-pixels; a first electrode disposed in each of the sub-pixels on the substrate; a dam overlapping the periphery of an upper surface of the first electrode; an organic layer located on the first electrode and the dam; and a second electrode located on the organic layer, wherein the dam includes a core material and a black-based dye combined with the core material.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 2024-0169420, filed on November 25, 2024, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] This disclosure relates to a display device. Background Technology

[0004] With the development of the information society, the demand for display devices for displaying images is increasing, and various types of display devices are being adopted, such as liquid crystal display (LCD) devices and organic light-emitting diode (OLED) display devices.

[0005] The display device includes multiple pixels and multiple switching elements for driving and controlling the pixels. Summary of the Invention

[0006] Embodiments of this disclosure relate to providing a display device in which no volatile additive reacts with the first electrode in the pin hole of the first electrode, thereby preventing a decrease in the brightness intensity of the display panel.

[0007] Embodiments of this disclosure also relate to providing a display device that has structural stability when a black bank is applied.

[0008] Embodiments of this disclosure also relate to providing a display device in which the ratio of black dye in the dam can be high, thereby reducing surface reflection (or external light reflection).

[0009] Embodiments of this disclosure also relate to providing a low-reflection and low-power display device, wherein surface reflection of external light can be prevented.

[0010] Embodiments of this disclosure relate to providing a display device that can have improved flexibility by omitting a polarization unit and can be applied to foldable products in which the display area is folded.

[0011] The purpose of this disclosure is not limited to the above-described purposes, and other technical purposes can be inferred from the following embodiments.

[0012] According to one embodiment, a display device is provided, the display device comprising: a substrate including a display area and a non-display area, the display area including a plurality of sub-pixels, the non-display area surrounding the display area; a first electrode disposed in each of the sub-pixels on the substrate; a dam overlapping the periphery of an upper surface of the first electrode; an organic layer located on the first electrode and the dam; and a second electrode located on the organic layer, wherein the dam includes a core material and a black-based dye respectively combined with the core material.

[0013] According to another embodiment, a display device is provided, the display device comprising: a substrate including a display area and a non-display area, the display area including a plurality of sub-pixels, the non-display area surrounding the display area; a first electrode disposed in each of the sub-pixels on the substrate, and including a first conductive layer, a second conductive layer located on the first conductive layer, and a third conductive layer located on the second conductive layer; a dam overlapping the periphery of the upper surface of the first electrode; an organic layer located on the first electrode and the dam; and a second electrode located on the organic layer, wherein the third conductive layer includes a hole penetrating therethrough in the thickness direction, and the dam includes a black base dye.

[0014] Details of other embodiments are included in the detailed description and the accompanying drawings. Attached Figure Description

[0015] Figure 1 This is a plan view of a display device according to one embodiment.

[0016] Figure 2 It shows the basis Figure 1 A cross-sectional view of the display panel in a bent state.

[0017] Figure 3 It is along Figure 1 The cross-sectional view of line AA′ in the diagram.

[0018] Figure 4 yes Figure 3 A detailed cross-sectional view of the light-emitting component.

[0019] Figure 5 This is a specific cross-sectional view of the light-emitting component based on the modified example.

[0020] Figure 6 It is based on Figure 3 A cross-sectional view of the touch component.

[0021] Figure 7 yes Figure 3 An enlarged cross-sectional view of region Q1 in the image.

[0022] Figure 8A It is a graph showing the loss of brightness intensity of the display device in the first environment.

[0023] Figure 8B This is a graph showing the loss of brightness intensity of the display device in the second environment.

[0024] Figure 9 This is a cross-sectional view showing the effect of a dam according to one embodiment.

[0025] Figure 10 This is a cross-sectional view of a display device according to another embodiment.

[0026] Figure 11 This is a cross-sectional view of a display device according to yet another embodiment.

[0027] Figure 12 This is a cross-sectional view of a display device according to another embodiment.

[0028] Figure 13 This is a perspective view of a display device according to yet another embodiment.

[0029] Figure 14 It is along Figure 13 A cross-sectional view of line BB′ in the diagram. Detailed Implementation

[0030] In the following description, embodiments will be illustrated with reference to the accompanying drawings.

[0031] The same reference numerals denote the same parts. Furthermore, in the accompanying drawings, the thickness, scale, and dimensions of parts may be enlarged for effective description of the technical content. For ease of description, the scale of the parts shown in the drawings differs from the actual scale, and is therefore not limited to the scale shown in the drawings.

[0032] In this disclosure, when a first component (or region, layer, portion, etc.) is described as being "on", "connected" or "coupled" to a second component, it means that the first component may be directly connected to / coupled to the second component, or that a third component may be disposed between them.

[0033] The term "and / or" includes all of one or more combinations that can be defined by the associated configuration.

[0034] Terms such as "first" and "second" may be used to describe various components, but components are not limited by the terms. These terms are used only for the purpose of distinguishing one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. Unless the context clearly specifies otherwise, the singular includes the plural.

[0035] Terms such as “below,” “on the lower side,” “above,” and “on the upper side” are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative concepts and are described relative to the directions marked in the drawings. For example, one or more other parts may be located between two parts, provided that “immediately” or “directly” is not used. Spatially relative terms such as “below or below,” “lower,” “above,” “upper,” etc., can be used to readily describe the relationship between one or more elements and another one or more elements as shown in the figures. Spatially relative terms should be understood to include different orientations of elements in use or operation in addition to the orientations shown in the figures. For example, if the elements shown in the figures are reversed, an element described as being located “below” or “below” another element may be located “above” another element. Thus, the exemplary term “below” can include both downward and upward directions.

[0036] It should be understood that terms such as “comprising” or “having” are intended to specify the presence of the features, figures, steps, operations, components, parts or combinations thereof described in this disclosure, and do not exclude the possibility of the presence or addition of one or more other features, figures, steps, operations, components, parts or combinations thereof.

[0037] Features of the various embodiments of this disclosure may be partially or completely coupled or combined, various technical collaborations and drivers are possible, and embodiments may be implemented independently of each other or together in an associated relationship.

[0038] The display device of this disclosure will be described below with reference to the accompanying drawings and embodiments.

[0039] Figure 1 This is a plan view of a display device according to one embodiment.

[0040] refer to Figure 1According to one embodiment, the display device 1 may include a display panel 100. The display panel 100 may include a display area DA having a plurality of pixels PX and a non-display area NDA surrounding the display area DA. The flat surface shape of the display area DA may be rectangular. However, embodiments of the present disclosure are not limited thereto, and the flat surface shape of the display area DA may be square, circular, elliptical, or other polygonal shapes. For example, the display area DA may have a rectangular shape with rounded corners, but is not limited thereto, and may also have a rectangular shape with angled corners.

[0041] In this embodiment, the first direction DR1 and the second direction DR2 are different directions and intersect each other; for example, in a plan view, they are perpendicularly intersecting directions. Figure 1 In this embodiment, the first direction DR1 may be substantially the same as the extension direction of the short side of the display panel 100, and the second direction DR2 may be the same as the extension direction of the long side of the display panel 100. However, the directions described in the embodiments should be understood as indicating relative directions, and the embodiments are not limited to the described directions.

[0042] The display area DA may include a short side extending in the first direction DR1 and a long side extending in the second direction DR2. The non-display area NDA may surround the display area DA. The non-display area NDA may be located on one side and the other side of the display area DA in the first direction DR1, and on one side and the other side of the display area DA in the second direction DR2.

[0043] The display panel 100 may further include a sensor non-display area NDA_S and sensor holes SH1 and SH2 surrounded by the sensor non-display area NDA_S. In a plan view, the display area DA may surround the sensor holes SH1 and SH2. The sensor holes SH1 and SH2 may be, for example, as shown in the diagram. Figure 1 The two sensor holes are shown, but the embodiments of this disclosure are not limited to this. For example, the sensor hole can be set to a single sensor hole. The two sensor holes SH1 and SH2 can respectively include a sensor hole in which an infrared sensor is disposed and a sensor hole in which a camera sensor is disposed, but the embodiments of this disclosure are not limited to this. The sensor non-display area NDA_S can be disposed between the sensor holes SH1 and SH2 and the display area DA. The sensor non-display area NDA_S can completely surround the sensor holes SH1 and SH2. Pixel PX can be not disposed in the sensor non-display area NDA_S.

[0044] The gate driving unit (GIP) can be disposed in the non-display area NDA located on one side and the other side of the display area DA in the first direction DR1. The low-potential voltage line VSSL can be disposed outside the gate driving unit GIP on the non-display area NDA. For example, as... Figure 1 As shown, the low-potential voltage line VSSL can extend from the printed circuit board FPCB, pass through the sub-region SR and the bend region BR, be located outside the gate drive unit GIP on the non-display region NDA, and be configured to surround the display region DA.

[0045] The non-display area NDA located on the other side of the display area DA in the second direction DR2 can extend further from the center portion of that other side toward the other side of the display area DA in the second direction DR2. The width of the non-display area NDA extending further from the center portion of the display area DA on the other side in the second direction toward that other side in the first direction DR1 can be smaller than the width of the non-display area NDA adjacent to the other side of the display area DA in the second direction DR2 in the first direction DR1.

[0046] Display device 1 may include a main region MR, a sub-region SR, and a bent region BR located between the main region MR and the sub-region SR. A display region DA and a non-display region NDA surrounding the four surfaces of the display region DA may form the main region MR, and a portion extending from the center of the display region DA on the other side of a second direction DR2 towards that other side may form the bent region BR and the sub-region SR. The bent region BR may be disposed between the sub-region SR and the main region MR. The sub-region SR may include a first pad region PA1 and a second pad region PA2 located at the ends of the sub-region SR on the other side of the second direction DR2. Display device 1 may also include a data driver unit DIC and a printed circuit board FPCB. The data driver unit DIC may be disposed in the first pad region PA1, and the printed circuit board FPCB may be attached to the second pad region PA2. A plurality of pads connected to the data driver unit DIC and the printed circuit board FPCB may be disposed in each of the first pad region PA1 and the second pad region PA2. The data driver unit DIC may be configured, for example, in the form of a driver chip (IC), but is not limited thereto. In one embodiment, a case is described in which the data driving unit DIC is set by a chip-on-plastic method, wherein the data driving unit DIC is directly mounted on the display panel 100. However, the embodiments of this disclosure are not limited to this, and the data driving unit DIC can be set by a chip-on-glass method or a chip-on-film method.

[0047] According to one embodiment, the display panel 100 may further include a crack sensing pattern (CSP) surrounding a low-potential voltage line VSSL. The crack sensing pattern CSP may be configured to completely surround the display area DA, such as... Figure 1 As shown. For example, the crack sensing pattern CSP can be disposed outside the low-potential voltage line VSSL. However, embodiments of this disclosure are not limited thereto, and the crack sensing pattern CSP may not be disposed in the non-display area NDA on the other side of the display area DA in the second direction DR2.

[0048] Figure 2 It shows the basis Figure 1 A cross-sectional view of the display panel in a bent state.

[0049] refer to Figure 2 According to one embodiment, the bending region BR of the display panel 100 of the display device 1 can be bent in the thickness direction (or the third direction DR3). Therefore, the main region MR and the sub-region SR can overlap each other in the thickness direction. The display panel 100 can be bent such that the lower surface of the main region MR faces the upper surface of the sub-region SR. A printed circuit board FPCB can be attached to the end of the sub-region SR.

[0050] Figure 3 It is along Figure 1 The cross-sectional view of line AA′ in the diagram.

[0051] refer to Figure 3 The pixel count (PX) of the display panel 100 (see...) Figure 1 The pixel PX can include multiple sub-pixels PX1, PX2, and PX3. The first sub-pixel PX1 can be a red sub-pixel, the second sub-pixel PX2 can be a green sub-pixel, and the third sub-pixel PX3 can be a blue sub-pixel, but embodiments of this disclosure are not limited thereto. In some embodiments, the pixel PX further includes a fourth sub-pixel, and the fourth sub-pixel can be a white sub-pixel, but embodiments of this disclosure are not limited thereto. In some embodiments, the pixel can include one red sub-pixel, two green sub-pixels, and one blue sub-pixel, but embodiments of this disclosure are not limited thereto. For example, the multiple sub-pixels PX1, PX2, and PX3 can be arranged in a striped pattern on the first direction DR1, but are not limited thereto, and can be arranged in a pentile pattern.

[0052] The display panel 100 may include a substrate 101, a first thin-film transistor 120, a second thin-film transistor 130, a light-emitting component 150, an encapsulation component 170, a touch component 180, a color filter insulating layer 114, a black matrix BM, color filters 191, 192, and 193, and a planarization layer OC. The display panel 100 may include at least one panel insulating layer and at least one touch insulating layer located between the substrate 101 and the light-emitting component 150. The at least one panel insulating layer may include at least one of a buffer layer 102, a first insulating layer 103, a second insulating layer 104, a 3-1 insulating layer 105-1, a 3-2 insulating layer 105-2, a fourth insulating layer 106, a fifth insulating layer 108, a sixth insulating layer 109, a first protective layer 111, and a second protective layer 112, and the at least one touch insulating layer may include at least one of a touch buffer layer 181, a first touch insulating layer 183, and a second touch insulating layer 184.

[0053] The substrate 101 may include one or more plastic materials. For example, the substrate 101 may be a multilayer substrate comprising a variety of plastic materials (such as polyimide). For example, the substrate 101 may include a first substrate portion 101a and a second substrate portion 101b, each comprising a plastic material, and a third substrate portion 101c comprising an inorganic insulating material between the first substrate portion 101a and the second substrate portion 101b, but the embodiments of this disclosure are not limited thereto.

[0054] A buffer layer 102 can be disposed on the substrate 101. The buffer layer 102 can minimize or delay the diffusion of moisture or oxygen into the substrate 101. The buffer layer 102 can be constructed by alternating stacks of silicon nitride (SiN). x ) and silicon dioxide (SiO) x It may be formed at least once, but the embodiments disclosed herein are not limited thereto.

[0055] A first light-blocking layer 126 may be disposed on the buffer layer 102. The first light-blocking layer 126 can prevent light from passing through the first semiconductor layer 123 of the first thin-film transistor 120. For example, the first semiconductor layer 123 may be configured to overlap with the first light-blocking layer 126. The first light-blocking layer 126 may be formed of a single layer or multiple layers, which may be formed of one of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy of the above materials, but the embodiments of this disclosure are not limited thereto.

[0056] A first insulating layer 103 may be disposed on the buffer layer 102 and the first light-blocking layer 126. The first insulating layer 103 prevents short circuits between components of the first thin-film transistor 120 and the first light-blocking layer 126. The first insulating layer 103 may be formed of the same material as the buffer layer 102, but embodiments of this disclosure are not limited thereto. For example, the first insulating layer 103 may be formed of an inorganic insulating material, such as silicon nitride (SiN). x ) or silicon dioxide (SiO) x However, the embodiments disclosed herein are not limited thereto.

[0057] The first thin-film transistor 120 may be disposed on the first insulating layer 103. The first thin-film transistor 120 may include a first source electrode 121, a first gate electrode 122, a first semiconductor layer 123, and a first drain electrode 124.

[0058] The first semiconductor layer 123 may be disposed on the first insulating layer 103. The first semiconductor layer 123 may include metal oxide semiconductors (such as indium gallium zinc oxide (IGZO)) and silicon-based semiconductor materials (such as amorphous silicon, polycrystalline silicon, etc.), but the embodiments of this disclosure are not limited thereto. The first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0059] Because polycrystalline semiconductor layers have higher mobility than amorphous semiconductor layers and oxide semiconductor layers, power consumption can be lower and reliability can be excellent. Therefore, driving transistors can be formed from polycrystalline semiconductor layers.

[0060] The second insulating layer 104 may be disposed on the first semiconductor layer 123. The second insulating layer 104 may be formed of the same material as the first insulating layer 103 and may prevent short circuits between the first semiconductor layer 123 and another component of the first thin-film transistor 120.

[0061] The first gate electrode 122 may be disposed on the second insulating layer 104. The first gate electrode 122 may be disposed on the second insulating layer 104 to overlap with the channel region of the first semiconductor layer 123. The first gate electrode 122 may be formed of a single layer or multiple layers, wherein the single layer or multiple layers are formed of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or compounds thereof, but the embodiments of this disclosure are not limited thereto. The first gate electrode 122 may be disposed together with the gate line.

[0062] The third insulating layers 105-1 and 105-2 can be disposed on the first gate electrode 122. The third insulating layers 105-1 and 105-2 can be disposed on the first gate electrode 122 by alternating stacking of silicon nitride (SiN). x ) and silicon dioxide (SiO) xThe insulating layer 3-1 is formed at least once, but embodiments of this disclosure are not limited thereto. For example, the insulating layer 105-1 may include silicon oxide (SiO2). x Furthermore, the 3-2 insulating layer 105-2 may include silicon nitride (SiN). x However, the embodiments disclosed herein are not limited thereto.

[0063] The first source electrode 121 and the first drain electrode 124 can be disposed on the third insulating layers 105-1 and 105-2.

[0064] The first source electrode 121 and the first drain electrode 124 can be electrically connected to the first semiconductor layer 123 through contact holes. The first source electrode 121 and the first drain electrode 124 may comprise a metallic material. For example, the first source electrode 121 and the first drain electrode 124 may be formed of a single layer or multiple layers, which may be formed of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy of the above materials, but the embodiments of this disclosure are not limited thereto.

[0065] The first source electrode 121 and the first drain electrode 124 can be disposed together with the data line. For example, the data line can be made of the same material as the first source electrode 121 and the first drain electrode 124, and can be formed coplanarly with them, but the embodiments of this disclosure are not limited thereto.

[0066] The storage electrode 140 may be configured to be spaced apart from the first thin-film transistor 120. The storage electrode 140 may include a first storage electrode 141 and a second storage electrode 142.

[0067] The first storage electrode 141 may be formed of the same material as the first gate electrode 122 and disposed on the same layer as the first gate electrode 122, but the embodiments disclosed herein are not limited thereto.

[0068] The second storage electrode 142 may be disposed on the first storage electrode 141. The second storage electrode 142 may be disposed on the third insulating layers 105-1 and 105-2, and the third insulating layers 105-1 and 105-2 between the first storage electrode 141 and the second storage electrode 142 may serve as a dielectric to generate capacitance. The second storage electrode 142 may be formed of the same material as the first storage electrode 141, but the embodiments of this disclosure are not limited thereto.

[0069] The second thin-film transistor 130 may be configured to be spaced apart from the first thin-film transistor 120 and the storage electrode 140. The second thin-film transistor 130 may include a second source electrode 131, a second gate electrode 132, a second semiconductor layer 133, and a second drain electrode 134.

[0070] The second light-blocking layer 136 can be disposed on the same layer as the second storage electrode 142.

[0071] Similar to the first light-blocking layer 126, the second light-blocking layer 136 can prevent light from traveling to the second semiconductor layer 133, thereby extending the lifetime of the second thin-film transistor 130. For example, the second semiconductor layer 133 can be configured to overlap with the second light-blocking layer 136.

[0072] The fourth insulating layer 106 may be disposed on the second light-blocking layer 136. The fourth insulating layer 106 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, or the third insulating layers 105-1 and 105-2, but the embodiments disclosed herein are not limited thereto.

[0073] The second semiconductor layer 133 may be disposed on the fourth insulating layer 106. The second semiconductor layer 133 may include a source region, a drain region, and a channel region between the source region and the drain region.

[0074] The second semiconductor layer 133 may include metal oxide semiconductors (such as indium gallium zinc oxide (IGZO)) and silicon-based semiconductor materials (such as amorphous silicon, polycrystalline silicon, etc.), but the embodiments of this disclosure are not limited thereto.

[0075] The fifth insulating layer 108 may be disposed on the second semiconductor layer 133. The fifth insulating layer 108 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layers 105-1 and 105-2 or the fourth insulating layer 106, but the embodiments of this disclosure are not limited thereto.

[0076] The second gate electrode 132 can be disposed on the fifth insulating layer 108.

[0077] The second gate electrode 132 may be formed of the same material as the first gate electrode 122. For example, the second gate electrode 132 may be formed of a single layer or multiple layers of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd) or compounds thereof, but the embodiments disclosed herein are not limited thereto.

[0078] The sixth insulating layer 109 may be disposed on the second gate electrode 132. The sixth insulating layer 109 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layers 105-1 and 105-2, the fourth insulating layer 106 or the fifth insulating layer 108, but the embodiments of this disclosure are not limited thereto.

[0079] The first source electrode 121, the first drain electrode 124, the second source electrode 131, and the second drain electrode 134 can be disposed on the sixth insulating layer 109.

[0080] The second source electrode 131 and the second drain electrode 134 may be formed of the same material as the first source electrode 121 and the first drain electrode 124, and disposed on the same layer as the first source electrode 121 and the first drain electrode 124, but the embodiments of this disclosure are not limited thereto. For example, the second source electrode 131 and the second drain electrode 134 may be formed of a single layer or multiple layers, which may be formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy of the above materials, but the embodiments of this disclosure are not limited thereto. For example, the second source electrode 131 may be electrically connected to the second storage electrode 142. The second source electrode 131 may pass through the sixth insulating layer 109, the fifth insulating layer 108, and the fourth insulating layer 106, and may be electrically connected to the second storage electrode 142.

[0081] The first thin-film transistor 120 may be a driving transistor, and the second thin-film transistor 130 may be a switching transistor, but the embodiments of this disclosure are not limited thereto.

[0082] The first protective layer 111 can be disposed on the first source electrode 121 and the first drain electrode 124.

[0083] The first protective layer 111 can planarize the upper portion of the first thin-film transistor 120 and protect the first thin-film transistor 120. The first protective layer 111 can be formed of an organic material. For example, the first protective layer 111 can be formed of an organic material including acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, but the embodiments of this disclosure are not limited thereto.

[0084] The second protective layer 112 may be disposed on the first protective layer 111. The second protective layer 112 may include the same material as the first protective layer 111, but the embodiments of this disclosure are not limited thereto.

[0085] In some embodiments, a third protective layer may be further disposed on the upper surface of the second protective layer 112, but the embodiments disclosed herein are not limited thereto.

[0086] The connecting electrode 145 can be disposed between the first protective layer 111 and the second protective layer 112.

[0087] The connection electrode 145 can electrically connect the first thin-film transistor 120 to the light-emitting component 150. The connection electrode 145 can be formed of the same material as the first source electrode 121 and the first drain electrode 124, but the embodiments of this disclosure are not limited thereto.

[0088] The connecting electrode 145 may be formed of a single layer or multiple layers, which may be formed of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or an alloy of the above materials, but the embodiments of this disclosure are not limited thereto.

[0089] The light-emitting component 150 may be disposed on the second protective layer 112. The light-emitting component 150 may include a first electrode 151, an organic layer 152, and a second electrode 153. The first electrode 151 may be used as an anode, and the second electrode 153 may be used as a cathode.

[0090] The first electrode 151 may be disposed on the second protective layer 112. The first electrode 151 may be electrically connected to the first thin-film transistor 120 through a contact hole formed in the second protective layer 112. The first electrode 151 may be a reflective electrode that reflects light, but the embodiments of this disclosure are not limited thereto. The first electrode 151 may comprise a metallic material with high reflectivity, such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and indium tin oxide (ITO) (ITO / Al / ITO), or an APC alloy, and may be formed from a single layer or multiple layers, but the embodiments of this disclosure are not limited thereto.

[0091] An organic layer 152 may be disposed on the first electrode 151. The organic layer 152 may include one or more light-emitting structures (or light-emitting elements) stacked on the first electrode 151 in a sequence or reverse order of hole transfer layers and electron transfer layers. For example, the hole transfer layer may include a hole transport layer, a hole injection layer, an electron blocking layer, a p-type charge generation layer, etc., but the embodiments of this disclosure are not limited thereto. For example, the electron transfer layer may include an electron transport layer, an electron injection layer, a hole blocking layer, an n-type charge generation layer, etc., but the embodiments of this disclosure are not limited thereto. The organic layer 152 may be an organic light-emitting layer, an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro-light-emitting diode, a miniature light-emitting diode, etc., but the embodiments of this disclosure are not limited thereto. For example, the organic layer 152 of a display panel 100 according to one embodiment of this disclosure may include an organic light-emitting layer. The organic layer 152 may include a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer. The organic layer 152 may also include a white light-emitting layer, but the embodiments of this disclosure are not limited thereto. The specific structure of the organic layer 152 according to one embodiment will be described below.

[0092] Figure 4 yes Figure 3 A detailed cross-sectional view of the light-emitting component.

[0093] refer to Figure 4 The light-emitting component 150 may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3.

[0094] The thickness of the light-emitting component 150 in each sub-pixel PX1, PX2 or PX3 may be different, but the embodiments disclosed herein are not limited thereto, and the thickness of the light-emitting component 150 in each sub-pixel PX1, PX2 or PX3 may be the same.

[0095] The organic layer 152 may include a first organic layer 152a disposed in the first sub-pixel PX1, a second organic layer 152b disposed in the second sub-pixel PX2, and a third organic layer 152c disposed in the third sub-pixel PX3. The light-emitting layers EML1, EML2, and EML3 of the organic layers 152a, 152b, and 152c may be physically separated, but the lower and upper layers of the light-emitting layers EML1, EML2, and EML3 may be integrally formed on the sub-pixels PX1, PX2, and PX3. The thickness of each light-emitting layer EML1, EML2, or EML3 may be different. For example, the thickness of the first light-emitting layer EML1 may be the largest, the thickness of the second light-emitting layer EML2 may be the second largest, and the thickness of the third light-emitting layer EML3 may be the smallest, but the embodiments disclosed herein are not limited to this.

[0096] A hole injection layer HIL can be disposed on the first electrode 151. The hole injection layer HIL can be located between the first electrode 151 and the light-emitting layers EML1, EML2, and EML3. The hole injection layer HIL can be integrally disposed on the sub-pixels PX1, PX2, and PX3. For example, the hole injection layer HIL can be formed of a hole injection material, which is selected from MTDATA, CuPc, TCTA, NPB (NPD), HATCN, TDAPB, PEDOT / PSS, F4TCNQ, N-(biphenyl-4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazol-3-yl)phenyl)-9H-fluoren-2-amine, etc., but the embodiments of this disclosure are not limited thereto.

[0097] The hole transport layer (HTL) can be disposed on the hole injection layer (HIL). The hole transport layer (HTL) can be located between the hole injection layer (HIL) and the light emission layers (EML1, EML2, and EML3). The hole transport layer (HTL) can be integrally disposed on sub-pixels (PX1, PX2, and PX3). The hole transport layer (HTL) can be formed of one or more materials selected from the group consisting of: aromatic amine materials, such as NPB (N,N-naphthyl-N,N'-phenyl benzidine), TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine), PPD, TTBND, FFD, p-dmDPS, and TAPC; starburst-type aromatic amine materials, such as TCTA, PTDATA, TDAPB, TDBA, 4-a, and TCTA; and spirocyclic and ladder-type materials, such as Spiro-TPD, Spiro-mTTB, and Spiro-2, NPD (N,N-dinaphthylN,N'-diphenylbenzidine), s-TAD, and MTDATA (4,4',4”-Tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine), but the embodiments of this disclosure are not limited thereto.

[0098] The light-emitting layers EML1, EML2, and EML3 can be disposed on the hole transport layer HTL. The first light-emitting layer EML1 can be disposed in the first sub-pixel PX1, the second light-emitting layer EML2 can be disposed in the second sub-pixel PX2, and the third light-emitting layer EML3 can be disposed in the third sub-pixel PX3.

[0099] The thickness of each light-emitting layer EML1, EML2, or EML3 can be different. For example, the first light-emitting layer EML1 can be formed with a thickness of 60 to 80 nm, the second light-emitting layer EML2 can be formed with a thickness of 30 to 50 nm, and the third light-emitting layer EML3 can be formed with a thickness of 10 to 30 nm, but the embodiments disclosed herein are not limited thereto.

[0100] Each of the first luminescent layer EML1, the second luminescent layer EML2, and the third luminescent layer EML3 may include a material that can emit light in the visible light range by receiving and combining holes and electrons.

[0101] An electron blocking layer (EBL) can be disposed on each emissive layer (EML1, EML2, or EML3). Alternatively, the EBL can be integrally disposed on sub-pixels PX1, PX2, and PX3.

[0102] An electron transport layer (ETL) can be disposed on an electron blocking layer (EBL). The ETL can be integrally disposed on sub-pixels PX1, PX2, and PX3. The ETL can be formed from anthracene derivatives and lithium quinoline (Liq), or from one or more selected from oxadiazole, triazole, phenanthrene, benzoxazole, benzothiazole, or benzimidazole (e.g., 2-[4-(9,10-Di-2-naphthalenyl-2-anthracenyl)phenyl]-1-phenyl-1H-benzimidazole), but the embodiments disclosed herein are not limited thereto.

[0103] The second electrode 153 can be disposed on the electron transport layer (ETL).

[0104] Figure 5 This is a specific cross-sectional view of the light-emitting component based on the modified example.

[0105] refer to Figure 4 and Figure 5 The organic layer 152_1 may include a first organic layer 152a_1 disposed in the first sub-pixel PX1, a second organic layer 152b_1 disposed in the second sub-pixel PX2, and a third organic layer 152c_1 disposed in the third sub-pixel PX3.

[0106] like Figure 4 and Figure 5 The illustration shows an example of forming the luminescent layer as one or two stacks of organic layers 152 and 152_1 for each sub-pixel PX1, PX2 or PX3, but the embodiments of this disclosure are not limited thereto, and the luminescent layer may be formed as three or more stacks.

[0107] The light-emitting layers of each organic layer 152a_1, 152b_1, or 152c_1 can be physically separated, but the lower and upper light-emitting layers can be integrally formed on sub-pixels PX1, PX2, and PX3. The thickness of each light-emitting layer can be different. For example, the thickness of the first light-emitting layer of the first sub-pixel can be the largest, the thickness of the second light-emitting layer of the second sub-pixel can be the second largest, and the thickness of the third light-emitting layer of the third sub-pixel can be the smallest, but the embodiments of this disclosure are not limited thereto. Furthermore, the light-emitting layers of each organic layer 152a_1, 152b_1, or 152c_1 can be provided as two or more light-emitting layers.

[0108] A hole injection layer HIL can be disposed on the first electrode 151. The hole injection layer HIL can be located between the first electrode 151 and the light-emitting layers EML1a, EML2a, and EML3a. The hole injection layer HIL can be integrally disposed on the sub-pixels PX1, PX2, and PX3. For example, the hole injection layer HIL can be formed of a hole injection material, which is selected from MTDATA, CuPc, TCTA, NPB (NPD), HATCN, TDAPB, PEDOT / PSS, F4TCNQ, N-(biphenyl-4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazol-3-yl)phenyl)-9H-fluoren-2-amine, etc., but the embodiments of this disclosure are not limited thereto.

[0109] The first hole transport layer HTL1 can be disposed on the hole injection layer HIL. The first hole transport layer HTL1 can be located between the hole injection layer HIL and the light emission layers EML1a, EML2a and EML3a. The first hole transport layer HTL1 can be integrally disposed on the sub-pixels PX1, PX2 and PX3. The first hole transport layer HTL1 may be formed of one or more materials selected from the group consisting of: aromatic amine materials, such as NPB (N,N-naphthyl-N,N'-phenylbenzidine), TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine), PPD, TTBND, FFD, p-dmDPS and TAPC; starburst-type aromatic amine materials, such as TCTA, PTDATA, TDAPB, TDBA, 4-a and TCTA; and spirocyclic and ladder-type materials, such as Spiro-TPD, Spiro-mTTB and Spiro-2, NPD (N,N-dinaphthylN,N'-diphenyl benzidine), s-TAD, and MTDATA (4,4',4”-Tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine), but the embodiments of this disclosure are not limited thereto.

[0110] Emitting layers EML1a, EML2a, and EML3a can be disposed on the first hole transport layer HTL1. Emitting layer EML1a (1-1) can be disposed in the first sub-pixel PX1, emitting layer EML2a (2-1) can be disposed in the second sub-pixel PX2, and emitting layer EML3a (3-1) can be disposed in the third sub-pixel PX3. Each of the emitting layers EML1a, EML2a, and EML3a can be coupled with… Figure 4 Each of the light-emitting layers EML1, EML2 and EML3 is the same.

[0111] The thickness of each light-emitting layer EML1a, EML2a, or EML3a can be different. For example, 1-1 light-emitting layer EML1a can be formed with a thickness of 60 to 80 nm, 2-1 light-emitting layer EML2a can be formed with a thickness of 30 to 50 nm, and 3-1 light-emitting layer EML3a can be formed with a thickness of 10 to 30 nm, but the embodiments disclosed herein are not limited thereto.

[0112] The hole blocking layer HBL can be disposed on each emissive layer EML1a, EML2a, or EML3a. The hole blocking layer HBL can be disposed integrally on sub-pixels PX1, PX2, and PX3.

[0113] The first electron transport layer ETL1 can be disposed on the hole blocking layer HBL. The first electron transport layer ETL1 can be integrally formed on sub-pixels PX1, PX2, and PX3. The first electron transport layer ETL1 can be formed from anthracene derivatives and lithium quinoline (Liq), or from one or more selected from oxadiazole, triazole, phenanthrene, benzoxazole, benzothiazole, or benzimidazole (e.g., 2-[4-(9,10-Di-2-naphthalenyl-2-anthracenyl)phenyl]-1-phenyl-1H-benzimidazole), but the embodiments of this disclosure are not limited thereto.

[0114] A common charge layer CGL may be disposed on the first electron transport layer ETL1. The common charge layer CGL may be disposed between the first electron transport layer ETL1 and the second hole transport layer HTL2. The common charge layer CGL may include a conductive material, but the embodiments of this disclosure are not limited thereto.

[0115] The second hole transport layer HTL2 can be disposed on the common charge layer CGL. The second hole transport layer HTL2 can be disposed between the hole blocking layer HBL and the light-emitting layers EML1b, EML2b, and EBL3b. The second hole transport layer HTL2 can be integrally disposed on sub-pixels PX1, PX2, and PX3. The material of the second hole transport layer HTL2 can be the same as the material of the first hole transport layer HTL1, but the embodiments disclosed herein are not limited thereto.

[0116] Emitting layers EML1b, EML2b, and EML3b can be disposed on the second hole transport layer HTL2. Emitting layer 1-2 EML1b can be disposed in the first sub-pixel PX1, emitting layer 2-2 EML2b can be disposed in the second sub-pixel PX2, and emitting layer 3-2 EML3b can be disposed in the third sub-pixel PX3. Each of emitting layers EML1b, EML2b, and EML3b can be identical to each of emitting layers EML1a, EML2a, and EML3a.

[0117] The thickness of each light-emitting layer EML1b, EML2b, or EML3b can be different. For example, one or two light-emitting layers EML1b can be formed with a thickness of 600 to... The thickness of the 2-2 light-emitting layer EML2b can be formed to 300 to The thickness, and the 3-2 light-emitting layer EML3b can be formed to 100 to The thickness is not limited to the embodiments disclosed herein.

[0118] The electron blocking layer (EBL) can be disposed on each emissive layer (EML1b, EML2b, or EML3b). The electron blocking layer (EBL) can also be integrally disposed on sub-pixels PX1, PX2, and PX3.

[0119] The second hole transport layer ETL2 can be disposed on the electron blocking layer EBL. The second electron transport layer ETL2 can be integrally formed on sub-pixels PX1, PX2, and PX3. The second electron transport layer ETL2 can be formed from anthracene derivatives and lithium quinoline (Liq), or from one or more selected from oxadiazole, triazole, phenanthrene, benzoxazole, benzothiazole, or benzimidazole (e.g., 2-[4-(9,10-Di-2-naphthalenyl-2-anthracenyl)phenyl]-1-phenyl-1H-benzimidazole), but the embodiments of this disclosure are not limited thereto.

[0120] The second electrode 153 can be disposed on the second electron transport layer ETL2.

[0121] Return to reference Figure 3 The second electrode 153 may be disposed on the organic layer 152. The second electrode 153 may be a transparent electrode that transmits light, but the embodiments of this disclosure are not limited thereto. For example, the second electrode 153 may include a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO), or the second electrode 153 may include a metal that transmits visible light, but the embodiments of this disclosure are not limited thereto.

[0122] Dike 154 can be configured to expose the first electrode 151. Dike 154 can define the openings (or light-emitting regions EA1, EA2, and EA3) of sub-pixels PX1, PX2, and PX3, and can be configured to cover the edge portion (or periphery) of the first electrode 151. That is, the first sub-pixel PX1 may include a first light-emitting region EA1 and a first non-light-emitting region NEA1 surrounding the first light-emitting region EA1, the second sub-pixel PX2 may include a second light-emitting region EA2 and a second non-light-emitting region NEA2 surrounding the second light-emitting region EA2, and the third sub-pixel PX3 may include a third light-emitting region EA3 and a third non-light-emitting region NEA3 surrounding the third light-emitting region EA3. That is, each non-light-emitting region NEA1, NEA2, or NEA3 may correspond to the boundary between adjacent sub-pixels PX1, PX2, and PX3.

[0123] The dam 154 may include a black base material. For example, the dam 154 may be formed of a material containing black pigment or an organic material (e.g., benzocyclobutene resin, polyimide resin, acrylic resin, photosensitive polymer, etc.), but the embodiments of this disclosure are not limited thereto. When the dam 154 is formed of a material containing black pigment or black dye, the dam 154 may be a black dam. When the dam 154 is formed of a material containing black pigment or black dye, it can shield external light or light reflected from the outside, thereby preventing a decrease in the brightness intensity of the display device.

[0124] The barrier RAS can be further installed on dike 154. For example... Figure 3 As shown, the barrier RAS can be disposed at all boundaries NEA1, NEA2, and NEA3 between sub-pixels PX1, PX2, and PX3, but embodiments of this disclosure are not limited thereto. The barrier RAS can be disposed directly on the upper surface of the dam 154, but embodiments of this disclosure are not limited thereto. The barrier RAS can be used to separate the organic layer 152 from the boundaries of adjacent sub-pixels PX1, PX2, and PX3. In some embodiments, the barrier RAS can be omitted, and a groove structure recessed from the surface of the dam 154 can be applied.

[0125] Spacer 155 may be further disposed on dam 154. Spacer 155 may be formed of the same material as dam 154, but embodiments of the present disclosure are not limited thereto. For example, spacer 155 may be a transparent dam, but is not limited thereto, and spacer 155 may be formed of the same material as dam 154. For example, spacer 155 may be disposed on at least one of the boundaries of first sub-pixel PX1, second sub-pixel PX2, and third sub-pixel PX3, but embodiments of the present disclosure are not limited thereto. Dam 154 and spacer 155 may be formed of the same material and simultaneously formed by a halftone mask, but embodiments of the present disclosure are not limited thereto.

[0126] The organic layer 152 can be disposed on the first electrode 151, the dam 154, and the spacer 155. The second electrode 153 can be disposed on the organic layer 152.

[0127] Encapsulation component 170 may be disposed on the second electrode 153. Encapsulation component 170 may include one or more insulating layers. For example, encapsulation component 170 may include a first encapsulation layer 171, a second encapsulation layer 172 disposed on the first encapsulation layer 171, and a third encapsulation layer 173 disposed on the second encapsulation layer 172. Encapsulation component 170 may include one or more inorganic insulating material layers and one or more organic material layers. For example, the first encapsulation layer 171 and the third encapsulation layer 173 may include inorganic insulating materials, and the second encapsulation layer 172 may include organic materials, but the embodiments of this disclosure are not limited thereto.

[0128] Touch component 180 may be disposed on encapsulation component 170. Touch component 180 may include touch buffer layer 181, first touch conductive layer, first touch insulating layer 183, second touch insulating layer 184, and second touch conductive layer. In some embodiments, one or more touch organic layers may be further disposed on the second touch conductive layer, but the embodiments of this disclosure are not limited thereto.

[0129] Figure 6 It is based on Figure 3 A cross-sectional view of the touch component.

[0130] Please refer to Figure 3 and Figure 6 Touch buffer layer 181 may be disposed on encapsulation member 170. For example, touch buffer layer 181 may be disposed on third encapsulation layer 173. Touch buffer layer 181 may be formed of the same material as buffer layer 102, but embodiments of this disclosure are not limited thereto.

[0131] A first touch conductive layer may be disposed on the touch buffer layer 181. The first touch conductive layer may include a bridging electrode 182. The bridging electrode 182 and sensor electrode 185, which will be described below, may be disposed at each boundary between adjacent sub-pixels PX1, PX2, and PX3. For example, the bridging electrode 182 and sensor electrode 185 may be disposed in non-light-emitting areas NEA1, NEA2, and NEA3. The bridging electrode 182 and sensor electrode 185 may overlap with the black matrix BM, which will be described below, in the thickness direction. The black matrix BM may cover the bridging electrode 182 and sensor electrode 185. Therefore, the bridging electrode 182 and sensor electrode 185 may be prevented from being externally visible.

[0132] A first touch insulating layer 183 and a second touch insulating layer 184 disposed on the first touch insulating layer 183 can be disposed on the first touch conductive layer. The first touch insulating layer 183 and the second touch insulating layer 184 disposed on the first touch insulating layer 183 can prevent short circuits between the first touch conductive layer and the second touch conductive layer. The first touch insulating layer 183 can be made of silicon oxide (SiO2). x ), silicon nitride (SiN) x The second touch insulating layer 184 may be formed in multiple layers, but the embodiments of this disclosure are not limited thereto. The second touch insulating layer 184 may include an organic insulating material, but the embodiments of this disclosure are not limited thereto, and the second touch insulating layer 184 may include the same material as the first touch insulating layer 183.

[0133] The second touch conductive layer may be disposed on the second touch insulating layer 184. The second touch conductive layer may include a first sensor electrode 185a and a second sensor electrode 185b. The sensor electrode 185a may be disposed in a first direction DR1 (see...). Figure 1 The first sensor electrode 185a extends on the first direction DR1 and in the second direction DR2 (see...) Figure 1 The second sensor electrode 185b extends from the top.

[0134] The bridging electrode 182 can be electrically connected to the first sensor electrode 185a through contact holes formed in the first contact insulating layer 183 and the second contact insulating layer 184. For example, the first sensor electrode 185a and the bridging electrode 182 can extend in the first direction DR1 (see...). Figure 1 ).

[0135] The sensor electrode 185 and the bridging electrode 182 may comprise metallic materials. For example, the first touch conductive layer 182 may be formed of titanium (Ti), nickel (Ni), aluminum (Al), or alloys thereof, and may be formed of three layers, such as titanium (Ti) / aluminum (Al) / titanium (Ti), but embodiments of this disclosure are not limited thereto.

[0136] Return to reference Figure 3 The color filter insulating layer 114 can be disposed on the second touch conductive layer. The color filter insulating layer 114 can be made of materials such as silicon nitride (SiN). x ) or silicon dioxide (SiO) x Inorganic insulating materials such as ) are formed, but the embodiments of this disclosure are not limited thereto.

[0137] A black matrix BM can be disposed on the color filter insulating layer 114. The black matrix BM may include a black base material. For example, the black matrix BM may include a light-blocking material or a light-absorbing material. For example, the black matrix BM may be formed of a material including black pigments, black dyes, etc. The black matrix BM may cover the bridging electrode 182 and the sensor electrode 185. Therefore, the bridging electrode 182 and the sensor electrode 185 can be prevented from being externally visible. For example, the width of the black matrix BM may be smaller than the width of the dam 154.

[0138] For example, the distance between the end of the black matrix BM and the boundary between the luminous areas EA1, EA2, and EA3 and the non-luminous areas NEA1, NEA2, and NEA3 can be longer than the distance between the end of the dam 154 and the boundary between the luminous areas EA1, EA2, and EA3 and the non-luminous areas NEA1, NEA2, and NEA3. The end of the dam 154 can be aligned with the boundary between the luminous areas EA1, EA2, and EA3 and the non-luminous areas NEA1, NEA2, and NEA3, but the embodiments of this disclosure are not limited thereto. In a display panel 100 according to one embodiment, since the dam 154 may include a black base material, and the spacing between the ends of the black matrix BM and the boundaries between the light-emitting regions EA1, EA2, and EA3 and the non-light-emitting regions NEA1, NEA2, and NEA3 can be longer than the spacing between the ends of the dam 154 and the boundaries between the light-emitting regions EA1, EA2, and EA3 and the non-light-emitting regions NEA1, NEA2, and NEA3, light emitted from the light-emitting regions EA1, EA2, and EA3 can be emitted upwards with an upward viewing angle as wide as the spacing between the ends of the black matrix BM and the boundaries between the light-emitting regions EA1, EA2, and EA3 and the non-light-emitting regions NEA1, NEA2, and NEA3. Therefore, a decrease in brightness intensity can be prevented depending on the viewing angle. However, when the distance between the ends of the black matrix BM and the boundaries between the light-emitting areas EA1, EA2, and EA3 and the non-light-emitting areas NEA1, NEA2, and NEA3 can be longer than the distance between the ends of the dam 154 and the boundaries between the light-emitting areas EA1, EA2, and EA3 and the non-light-emitting areas NEA1, NEA2, and NEA3, and the dam 154 is formed only of transparent material, external incident light can be reflected by the dam 154, thereby producing visible ring spots. However, in the display panel 100 according to one embodiment, external incident light can be absorbed or shielded by the dam 154, which includes a black base material, thereby preventing the occurrence of ring spots.

[0139] Color filters 191, 192, and 193 can be disposed on the black matrix BM. Color filters 191, 192, and 193 can be disposed on the first to third sub-pixels PX1, PX2, and PX3 respectively, and can block specific colors of light emitted from the light-emitting regions EA1, EA2, and EA3 of sub-pixels PX1, PX2, and PX3. A first color filter 191 can be provided to block light of colors other than red (R). In this case, the first color filter 191 can be provided as a red color filter. A second color filter 192 can be provided to block light of colors other than green (G). In this case, the second color filter 192 can be provided as a green color filter. A third color filter 193 disposed in the third sub-pixel PX3 can be provided to block light of colors other than blue (B). In this case, the third color filter 193 can be provided as a blue color filter. However, embodiments of this disclosure are not limited thereto.

[0140] For example, each color filter 191, 192, or 193 may be in direct contact with the side and top surfaces of the black matrix BM. For example, each color filter 191, 192, or 193 may be spaced apart from the boundaries of adjacent sub-pixels PX1, PX2, and PX3, but embodiments of this disclosure are not limited thereto, and color filters 191, 192, and 193 may overlap each other in the thickness direction.

[0141] A planarization layer OC can be disposed on color filters 191, 192, and 193. The planarization layer OC can be used to planarize the steps formed by color filters 191, 192, and 193. For example, the planarization layer OC may include an organic insulating material.

[0142] Figure 7 yes Figure 3 An enlarged cross-sectional view of region Q1 in the image.

[0143] refer to Figure 3 and Figure 7According to one embodiment, the first electrode 151 may have a stacked structure of multiple conductive layers. For example, the first electrode 151 may include a first conductive layer 151a, a second conductive layer 151b on the first conductive layer 151a, and a third conductive layer 151c on the second conductive layer 151b. For example, the reactivity of the first conductive layer 151a, the third conductive layer 151c, and the second conductive layer 151b may be different. For example, the reactivity of the first conductive layer 151a and the third conductive layer 151c may be lower than that of the second conductive layer 151b. In this disclosure, reactivity may be ionic reactivity, and may be, for example, the reactivity of ions of the material forming the third conductive layer 151c with ions of the surrounding material. For example, when the dike includes a black base pigment, an additive may be included in the dike. The additive may volatilize to the outside of the dike. The volatilized additive may be in ionic form, and the volatilized additive may include chloride ions, ozone ions, sulfide ions, bromide ions, etc.

[0144] Furthermore, during the manufacturing process of the display panel 100, the third conductive layer 151c disposed on the uppermost part of the first electrode 151 may include pinholes due to physical stimulation. As described above, since the second conductive layer 151b is relatively highly reactive, ions of the material forming the second conductive layer 151b (e.g., silver ions) and ions of volatile additives can react with each other within the pinholes, thereby generating salts. The generated salts may degrade the function of the anode or reflective electrode of the first electrode 151, thereby reducing the brightness intensity of the display panel 100.

[0145] However, according to one embodiment of the display panel 100, the embankment 154 may be composed of shell SPs comprising an additive-free black base dye and core material CPs combined with multiple shell SPs. Therefore, the brightness intensity of the display panel 100 can be prevented from being reduced by volatile additives. More specifically, the multiple shell SPs may be combined with multiple core materials CPs respectively. The core material CPs and shell SPs may be combined to form a core-shell structure. The core material CP may include a transparent conductive material or a metal oxide. Transparent conductive materials may include ITO, ITZO, IZGO, etc., but embodiments of this disclosure are not limited thereto. Metal oxides may include TiO2, etc., but embodiments of this disclosure are not limited thereto. The core material CP may include a material with a large surface area to form a core-shell structure with multiple shell SPs. For example, the core material CP may be formed from TiO2 with a large surface area, but embodiments of this disclosure are not limited thereto. The shell SPs may include a black base dye. The core material CPs and the black base dye (or shell SPs) may not react with the first electrode 151. For example, the core material CP and the black-based dye (or the shell SP) may not chemically react with the second conductive layer 151b of the first electrode 151. For example, the core material CP and the black-based dye (or the shell SP) may not react with silver (Ag).

[0146] According to one embodiment, the dam 154 may have multiple shells SP combined with multiple core materials CP, thereby ensuring the structural stability of the dam 154 without additives.

[0147] Furthermore, the dam 154 can form a core-shell structure with a large surface area of ​​black base dye (or shell SP), allowing more shell SPs to be combined with or coated on a core material CP, thereby increasing the ratio of black base dye within the dam 154 and preventing surface reflection (or external light reflection).

[0148] Because the shell SP surrounds the edge of the core material CP, the shell SP can directly contact the upper and side surfaces of the second protective layer 112 or the first electrode 151, such as... Figure 9 As shown. The core material CP or shell SP can be in direct contact with the organic layer 152 disposed above it. The core material CP or shell SP can be in direct contact with the second protective layer 112 or the first electrode 151 disposed below it.

[0149] Figure 8A It is a graph showing the loss of brightness intensity of the display device in the first environment. Figure 8B This is a graph showing the loss of brightness intensity of the display device in the second environment.

[0150] Figure 8A and Figure 8BThe brightness intensity of the display device in different environments is shown. Figure 8A and Figure 8B In the diagram, the horizontal axis represents time (t), and the vertical axis represents the brightness intensity of the display device. The first environment is a harsh environment, such as a temperature of 110°C, humidity of 85%, and pressure of 1.2 atm. The second environment is a high-temperature and high-humidity environment, such as a temperature of 110°C and humidity of 85%. Applied to... Figure 8A and Figure 8B The display device used in the experiment may include a black-based pigment or additives. In both the first and second environments, the brightness intensity of the display device may decrease over time (t). (As described above...) Figure 7 This is because, during the manufacturing process of the display panel 100, pinholes are formed in the uppermost third conductive layer 151c of the first electrode 151 due to physical stimulation, and because the second conductive layer 151b has relatively high reactivity, the ions of the material forming the second conductive layer 151b (e.g., silver ions) and the ions of the volatile additives react with each other in the pinholes, thereby producing salt.

[0151] However, in one embodiment of the display device, in the display panel 100 according to one embodiment, the dam 154 may be composed of a shell SP comprising an additive-free black base dye and a core material CP combined with multiple shell SPs. Therefore, even if a pinhole is generated in the first electrode 151 of the stacked structure having a conductive layer during the manufacturing process of the display panel, the dam will not chemically react with the components of the first electrode 151 (the conductive layer constituting the first electrode, such as 151b), thus preventing a decrease in the brightness intensity of the display panel.

[0152] Figure 9 This is a cross-sectional view showing the effect of a dam according to one embodiment.

[0153] refer to Figure 9 As mentioned above Figure 7 and Figures 8A-8B The first electrode 151 may include a plurality of pinholes PH. Specifically, the third conductive layer 151c of the first electrode 151 may include a plurality of pinholes PH, and the pinholes PH may penetrate the third conductive layer 151c in the thickness direction. In the pinholes PH, the organic layer 152 may be in direct contact with the second conductive layer 151b.

[0154] According to one embodiment, since the dam 154 is composed of a shell SP including an additive-free black base dye and a core material CP combined with multiple shell SPs, the dam 154 may not contain volatile additives. Therefore, even when multiple pinholes PH are formed in the third conductive layer 151c, it is possible to prevent the second conductive layer 151b exposed by the pinholes PH from chemically reacting with the dam 154 and reducing the brightness intensity of the display panel.

[0155] Furthermore, since the display panel 100 according to one embodiment does not require high-temperature processes such as hard baking, damage to the components on the substrate can be prevented.

[0156] In the following description, a display device according to other embodiments will be described. In the following embodiments, details regarding... Figures 1 to 9 The detailed description of the component has already been described, or its repeated description will be omitted.

[0157] Figure 10 This is a cross-sectional view of a display device according to another embodiment.

[0158] refer to Figure 10 The display panel 100_1 of the display device according to this embodiment and the display panel 100_1 according to this embodiment Figure 7 The difference in the display panel 100 is that the shell SP may not be bonded to the core material CP adjacent to the first electrode 151 or the second protective layer 112.

[0159] More specifically, the core material CP can be in direct contact with the first electrode 151 or the second protective layer 112.

[0160] A dam 154_1 can be formed according to this embodiment because during the process of coating the core material CP on the first non-luminescent region NEA1 with ink, the black base dye (or shell) of the ink does not reach the core material CP at its lowest point.

[0161] Figure 11 This is a cross-sectional view of a display device according to yet another embodiment.

[0162] refer to Figure 11 The display panel 100_2 of the display device according to this embodiment and the display panel 100_2 according to this embodiment Figure 3 The difference of the display panel 100 is that the display panel 100_2 may also include a third protective layer 113 on the second protective layer 112.

[0163] More specifically, the display panel 100_2 according to this embodiment may further include a third protective layer 113 between the second protective layer 112 and the first electrode 151. The material of the third protective layer 113 may include at least one of the materials exemplified as the material of the second protective layer 112, but the embodiments of this disclosure are not limited thereto.

[0164] Since the above has already been combined Figure 3 The rest has been described, so its detailed description will be omitted.

[0165] Figure 12 This is a cross-sectional view of a display device according to another embodiment.

[0166] refer to Figure 12 According to this embodiment, the color filters 191_1, 192_1, and 193_1 of the display panel 100_3 of the display device are consistent with those of the display panel 100_3 of the display device. Figure 3 The difference with the display panels 100 is that they can overlap each other in the non-light-emitting areas NEA1, NEA2 and NEA3.

[0167] Figure 12 It is shown that in the non-luminescent region NEA1 adjacent to the non-luminescent region NEA2, the second color filter 192_1 is located on top, and the first color filter 191_1 is located below the second color filter 192_1. In the non-luminescent region NEA3 adjacent to the non-luminescent region NEA2, the third color filter 193_1 is located on top, and the second color filter 192_1 is located below the third color filter 193_1. However, the stacking order of color filters 191_1, 192_1 and 193_1 in the non-luminescent regions NEA1, NEA2 and NEA3 can vary according to the process sequence.

[0168] Since the above has already been combined Figure 3 The rest has been described, so its detailed description will be omitted.

[0169] Figure 13 This is a perspective view of a display device according to yet another embodiment. Figure 14 It is along Figure 13 A cross-sectional view of line BB′ in the diagram.

[0170] refer to Figure 13 and Figure 14 The display device 2 according to this embodiment and the display device 2 according to this embodiment Figure 1 The difference between display device 1 and display device 2 is that display device 2 is a foldable display device.

[0171] In this disclosure, the folding axis A1 along which the display device 2 is folded can be the same as the second direction DR2.

[0172] The top frame TF is located at the top of the display device 2. Relative to the folding axis A1, the top frame TF includes a first top frame TF1 located on one side and a second top frame TF2 located on the other side. The top frame TF can be configured to cover the edge of the display panel 100_4. The top frame TF can protect the display panel 100_4 from external impacts. The top frame TF can form the bezel of the display device 2.

[0173] The overlay CG can be placed below the top frame TF. The overlay CG can be placed above the display panel 100_4.

[0174] The cover layer CG can be set above the display panel 100_4 to protect the components set below the cover layer CG from external impacts.

[0175] The panel assembly is positioned below the overlay CG. The panel assembly includes a display panel 100_4 and a board PLT. The display panel 100_4 may be substantially the same as one of the aforementioned display panels 100, 100_1, 100_2, and 100_3.

[0176] The plate PLT may include various plates disposed below the display panel 100_4 to support the display panel 100_4. For example, one or more plates may include a back plate for supporting the display panel 100_4; a top plate disposed below the back plate and formed of stainless steel (SUS); a bottom plate disposed below the top plate, having a pattern formed on the folded portion and formed of SUS; a heat sink for performing heat dissipation; an intermediate plate for covering the non-flattened flat surface caused by various components of the hinge assembly; and so on.

[0177] A slit pattern PTN can be formed in the plate PLT. The slit pattern PTN can be formed at a position corresponding to the folding area FA of the display panel 100_4. The slit pattern PTN can be a slit-shaped etched portion formed in the plate PLT. For example, the plate PLT can be formed of a metal such as SUS material, but the rigidity of the metal may cause problems when folding or unfolding the plate PLT. The slit pattern PTN can supplement the flexibility of the plate PLT.

[0178] The intermediate plate MST is positioned below the panel assembly. The intermediate plate MST supports the components mounted thereon. Furthermore, the hinge assembly 200 and the cover frame CF are positioned downwards relative to the intermediate plate MST, and their upper surfaces may be uneven. The intermediate plate MST can flatten the uneven lower surfaces. The intermediate plate MST can be formed of materials such as plastic, polyimide, or metal to increase the rigidity of the display device 2. For example, the intermediate plate MST may include aluminum or SUS, but is not limited to these.

[0179] The intermediate plate MST may include a first intermediate plate portion MSTH1 disposed in the first unfolded region NFA1 and a second intermediate plate portion MSTH2 disposed in the second unfolded region NFA2.

[0180] The hinge assembly 200 is disposed below the panel assembly. The hinge assembly 200 is disposed below the folding area FA. The hinge assembly 200 may have a shape extending along the folding axis A1. The hinge assembly 200 can perform a folding movement, wherein one side and the other side rotate about the folding axis A1.

[0181] A cover frame CF is disposed below the hinge assembly 200. A receiving groove for accommodating a portion of the hinge assembly 200 can be formed in the upper surface of the cover frame CF. Relative to the folding axis A1, the cover frame CF includes a first cover frame CF1 disposed on one side and a second cover frame CF2 disposed on the other side. The cover frame CF can be a housing defining the side and rear surfaces of the display device 2. The cover frame CF protects the display device 2 from external impacts. The cover frame CF can be coupled to the hinge assembly 200. The folding and unfolding of the display device 2 can be performed according to the rotation of the cover frames CF1 and CF2.

[0182] Coupling members BM1, BM2, and BM3 for coupling adjacent members MST, PLT, PTN, and CG can be further disposed between adjacent members. In each unfolded region NFA1 and NFA2, the first coupling member BM1 can couple the intermediate plate portions MSTH1 and MSTH2 to the plate PLT disposed above the intermediate plate portions MSTH1 and MSTH2, the second coupling member BM2 can couple the plate PLT and PTN to the display panel 100_4 disposed above the plate PLT and PTN, and the third coupling member BM3 can couple the display panel 100_4 to the cover layer CG.

[0183] The coupled plate PLT and the intermediate plate MST can be mounted on the cover frames CF1 and CF2. The display device 2 can perform folding and unfolding operations via the hinge assembly 200 provided on the cover frames CF1 and CF2.

[0184] Since display panel 100_4 has already been described above, its detailed description will be omitted below.

[0185] The display apparatus according to various embodiments of the present disclosure can be described as follows.

[0186] According to various embodiments of the present disclosure, a display device is provided, the display device comprising: a substrate including a display area and a non-display area surrounding the display area, the display area including a plurality of sub-pixels; a first electrode disposed in each of the sub-pixels on the substrate; a dam overlapping the periphery of an upper surface of the first electrode; an organic layer located on the first electrode and the dam; and a second electrode located on the organic layer, wherein the dam includes a core material and a black-based dye combined with the core material.

[0187] In the display devices according to various embodiments of the present disclosure, the core material may include a transparent conductive material or a metal oxide.

[0188] In the display devices according to various embodiments of the present disclosure, the black base dye or core material can be in direct contact with the organic layer.

[0189] The display device according to various embodiments of the present disclosure may further include a first transistor located between a substrate and a first electrode, and a second transistor located between the first transistor and the first electrode.

[0190] In the display device according to various embodiments of the present disclosure, the semiconductor layer of the first transistor may include polysilicon, and the semiconductor layer of the second transistor may include oxide.

[0191] The display device according to various embodiments of the present disclosure may further include a first protective layer disposed between the second transistor and the first electrode, and a second protective layer disposed between the first protective layer and the first electrode.

[0192] The display device according to various embodiments of the present disclosure may further include a connection electrode disposed between the second protective layer and the first electrode and connecting the first electrode to the second transistor.

[0193] In the display device according to various embodiments of the present disclosure, the black base dye or core material may be in direct contact with the second protective layer.

[0194] In the display device according to various embodiments of the present disclosure, the dam may be disposed on the first electrode and located at the boundary between adjacent sub-pixels.

[0195] In the display device according to various embodiments of the present disclosure, a plurality of sub-pixels may include a first sub-pixel, a second sub-pixel, and a third sub-pixel, and an organic layer may be disposed on the first sub-pixel, the second sub-pixel, and the third sub-pixel.

[0196] In the display device according to various embodiments of the present disclosure, the organic layer may include a first light-emitting layer located on a first sub-pixel, a second light-emitting layer located on a second sub-pixel, and a third light-emitting layer located on a third sub-pixel.

[0197] In the display device according to various embodiments of the present disclosure, in each sub-pixel, each of the first light-emitting layer, the second light-emitting layer and the third light-emitting layer may be stacked into two or more layers.

[0198] The display device according to various embodiments of the present disclosure may further include a color filter located on the second electrode and a black matrix located at the boundary between adjacent sub-pixels between the second electrode and the color filter, wherein the width of the black matrix may be smaller than the width of the embankment.

[0199] In the display device according to various embodiments of the present disclosure, the ends of the black matrix may be closer to the boundaries between sub-pixels than the ends of the embankment.

[0200] The display device according to various embodiments of the present disclosure may further include a touch portion located between the second electrode and the color filter, wherein the touch portion may include a bridging electrode and a sensor electrode located on the bridging electrode, and the black matrix may overlap with the bridging electrode and the sensor electrode.

[0201] According to various embodiments of this disclosure, a display device is provided, the display device comprising: a substrate, the substrate including a display area and a non-display area surrounding the display area, the display area including a plurality of sub-pixels; a first electrode disposed in each of the sub-pixels on the substrate, and including a first conductive layer, a second conductive layer disposed on the first conductive layer and a third conductive layer disposed on the second conductive layer; a dam overlapping the periphery of an upper surface of the first electrode; an organic layer disposed on the first electrode and the dam; and a second electrode disposed on the organic layer, wherein the third conductive layer includes a hole penetrating therethrough in the thickness direction, and the dam includes a black base dye.

[0202] In the display device according to various embodiments of the present disclosure, the embankment may further include a core material, and the core material and the black base dye may form a core-shell structure.

[0203] In the display device according to various embodiments of the present disclosure, the reactivity of the second conductive layer may be higher than that of the third conductive layer.

[0204] In the display device according to various embodiments of the present disclosure, the first conductive layer and the third conductive layer may include indium tin oxide (ITO), and the second conductive layer may include silver (Ag).

[0205] In the display device according to various embodiments of the present disclosure, the organic layer can be in direct contact with the second conductive layer in the hole.

[0206] In the display device according to the embodiment, since the dam does not contain additives, even if a pinhole is generated in the first electrode with a stacked structure having a conductive layer during the manufacturing process of the display panel, the dam will not chemically react with the components of the first electrode (the conductive layer constituting the first electrode), and thus the reduction in the brightness intensity of the display panel can be prevented.

[0207] In the display device according to the embodiment, the dye of the dam can be a black dye, and the black dye can be used as a shell, so that the dam can have a core-shell structure, wherein the core and the black dye are combined to have structural stability.

[0208] In the display device according to the embodiment, since the dam has a core-shell structure, more black dye can be combined (or coated) on a core to increase the ratio of black dye inside the dam, thereby preventing surface reflection (or external light reflection).

[0209] According to embodiments of this disclosure, since high-temperature processes such as hard baking are not required, damage to components on the substrate can be prevented.

[0210] According to embodiments of this disclosure, a low-reflection display device capable of preventing surface reflection of external light can be provided, thereby achieving low power consumption.

[0211] According to embodiments of this disclosure, by omitting the polarization unit, the display device can have improved flexibility and can be applied to foldable products in which the display area is folded. However, the effects obtainable from this disclosure are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art based on the following description.

[0212] Although embodiments of the present disclosure have been described above with reference to the accompanying drawings, those skilled in the art will understand that the above-described technical configurations of the present disclosure can be implemented in other specific forms without altering its technical spirit or essential characteristics. Therefore, it should be understood that the above embodiments are illustrative and not restrictive in any way. Furthermore, the scope of this disclosure is defined by the appended claims rather than by the detailed description. Moreover, the meaning and scope of the claims, as well as all changes or modifications derived from equivalent concepts, should be construed as being included within the scope of this disclosure.

Claims

1. A display device, comprising: A substrate, the substrate including a display area and a non-display area surrounding the display area, the display area including a plurality of sub-pixels; A first electrode is disposed in each of the sub-pixels on the substrate; A dam that overlaps with the periphery of the upper surface of the first electrode; An organic layer is disposed on the first electrode and the embankment; as well as The second electrode is located on the organic layer. The dike comprises a core material and a black-based dye combined with the core material.

2. The display device according to claim 1, wherein, The core materials include transparent conductive materials or metal oxides.

3. The display device according to claim 1, wherein, The black-based dye or the core material is in direct contact with the organic layer.

4. The display device according to claim 1, further comprising: A first transistor, wherein the first transistor is located between the substrate and the first electrode; And a second transistor, which is located between the first transistor and the first electrode.

5. The display device according to claim 4, wherein, The semiconductor layer of the first transistor comprises polycrystalline silicon, and the semiconductor layer of the second transistor comprises oxide.

6. The display device according to claim 4, further comprising: A first protective layer is disposed between the second transistor and the first electrode; And a second protective layer, which is located between the first protective layer and the first electrode.

7. The display device according to claim 6, further comprising a connection electrode disposed between the second protective layer and the first electrode and connecting the first electrode to the second transistor.

8. The display device according to claim 6, wherein, The black-based dye or the core material is in direct contact with the second protective layer.

9. The display device according to claim 1, further comprising: A color filter, wherein the color filter is located on the second electrode; And a black matrix, which is located at the boundary between adjacent sub-pixels between the second electrode and the color filter, wherein the width of the black matrix is ​​smaller than the width of the embankment.

10. The display device according to claim 9, wherein, The ends of the black matrix are closer to the boundary between the adjacent sub-pixels than the ends of the dike.

11. The display device according to claim 1, wherein, The first electrode includes a first conductive layer, a second conductive layer located on the first conductive layer, and a third conductive layer located on the second conductive layer. The third conductive layer includes a hole extending through it in the thickness direction.

12. The display device according to claim 11, wherein, The reactivity of the second conductive layer is higher than that of the third conductive layer.

13. The display device according to claim 12, wherein, The first conductive layer and the third conductive layer comprise ITO, and The second conductive layer comprises silver (Ag).

14. The display device according to claim 11, wherein, The organic layer is in direct contact with the second conductive layer in the pore.

15. The display device according to claim 1, wherein, The core material includes a transparent conductive material or a metal oxide, wherein the transparent conductive material includes ITO, ITZO or IGZO, and the metal oxide includes TiO2.

16. The display device according to claim 1, wherein, The core material and the black-based dye do not react with the first electrode.

17. The display device according to claim 1, wherein, The core material and the black-based dye do not react with silver (Ag).

Images