Semiconductor device

Abstract

This invention ensures sufficient insulation space. The semiconductor device of this invention includes: a base plate; a semiconductor module including control terminals and disposed on the upper surface of the base plate; a control substrate disposed above the semiconductor module and connected to the control terminals; and a terminal guide having a through hole for the control terminals to pass through, an upper guide surface disposed opposite to the lower surface of the control substrate and at least partially in contact with the lower surface of the control substrate, a lower guide surface at least partially disposed on or below the upper surface of the semiconductor module, and a main body connecting the upper guide surface and the lower guide surface. Therefore, sufficient insulation space is ensured.

Description

Technical Field

[0001] This disclosure relates to a semiconductor device having terminals connected to a control substrate. Background Technology

[0002] In the prior art, semiconductor devices with a terminal housing formed at the location of a control terminal for a control signal are disclosed (for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2006-165499 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] However, in existing terminal housings, since the distance from the semiconductor module to the control substrate cannot be determined, there is a problem that sufficient insulation space may not be guaranteed.

[0008] This disclosure was made to solve the problems mentioned above, and its purpose is to provide a semiconductor device that can ensure sufficient insulation space distance.

[0009] Technical means for solving technical problems

[0010] The semiconductor device disclosed herein includes: a base plate; a semiconductor module including control terminals and disposed on the upper surface of the base plate; a control substrate disposed on the upper side of the semiconductor module and connected to the control terminals; and a terminal guide having a through hole for the control terminals to pass through, an upper guide surface disposed opposite to the lower surface of the control substrate and at least a portion of which contacts the lower surface of the control substrate, a lower guide surface at least a portion disposed on the upper surface of the semiconductor module or at a position lower than the upper surface of the semiconductor module, and a main body portion connecting the upper guide surface and the lower guide surface.

[0011] Invention Effects

[0012] The semiconductor device disclosed herein can ensure sufficient insulation space distance. Attached Figure Description

[0013] Figure 1 This is a perspective view of the semiconductor device according to Embodiment 1 of this disclosure.

[0014] Figure 2 This is a perspective view of the semiconductor device according to Embodiment 1 of this disclosure.

[0015] Figure 3 This is a perspective view of the semiconductor device according to Embodiment 1 of this disclosure.

[0016] Figure 4 This is a side view of the semiconductor device according to Embodiment 1 of this disclosure.

[0017] Figure 5 This is a perspective view of the terminal guide according to Embodiment 1 of this disclosure.

[0018] Figure 6 This is a side view of the terminal guide according to Embodiment 1 of this disclosure.

[0019] Figure 7 This is a top view of the terminal guide according to Embodiment 1 of this disclosure.

[0020] Figure 8 This is a cross-sectional view of the terminal guide according to Embodiment 1 of this disclosure.

[0021] Figure 9 This is a top view of the terminal guide according to Embodiment 2 of this disclosure.

[0022] Figure 10 This is a side view of the semiconductor device according to Embodiment 3 of this disclosure.

[0023] Figure 11 This is a perspective view of the semiconductor device according to Embodiment 4 of this disclosure.

[0024] Figure 12 This is a perspective view of the semiconductor device according to Embodiment 5 of this disclosure.

[0025] Figure 13 This is a side view of the semiconductor device according to Embodiment 5 of this disclosure.

[0026] Figure 14 This is a perspective view of the semiconductor device according to Embodiment 6 of this disclosure.

[0027] Figure 15 This is a side view of the semiconductor device according to Embodiment 6 of this disclosure. Detailed Implementation

[0028] The embodiments of this disclosure will now be described with reference to the accompanying drawings. It should be noted that the drawings are schematic diagrams, and the dimensions and positions shown in different drawings are not limited to those described and can be appropriately modified. Furthermore, in the following description, the same reference numerals are used to illustrate the same structural elements, and their names and functions are the same or equivalent. Therefore, detailed descriptions of them are sometimes omitted.

[0029] Implementation Method 1

[0030] Regarding the semiconductor device 101 in Embodiment 1, using Figures 1 to 8 Let me explain. Figure 1 This is a perspective view of the semiconductor device 101 according to Embodiment 1. Figure 1 As shown, the semiconductor device 101 involved in this embodiment includes a water cooling jacket 1, a base plate 2, screws 3 and a control substrate 4.

[0031] The base plate 2 is disposed on the upper surface of the water-cooling jacket 1. The control board 4 is disposed on the upper side of the base plate 2. Based on the base plate 2, the side on which the control board 4 is disposed is designated as the upper side, and the side on which the water-cooling jacket 1 is disposed is designated as the lower side. Furthermore, the upper surface is designated as the upper surface, and the lower surface is designated as the lower surface. Additionally, the upper side, lower side, upper surface, and lower surface are defined without depending on the direction of gravity when the semiconductor device 101 is disposed. Furthermore, the direction penetrating the upper and lower surfaces is designated as the height direction. Furthermore, the surfaces other than the upper and lower surfaces are designated as side surfaces. The following description follows the same principle.

[0032] The base plate 2 is fastened to the water-cooling jacket 1 by screws 3. The control base plate 4 includes through holes 5. Control terminals, described later, are inserted into the through holes 5. For example, multiple through holes 5 are provided. Control terminals are inserted into each of the multiple through holes 5.

[0033] Figure 2 This is a perspective view of the semiconductor device 101 according to Embodiment 1. Figure 2 The description of the control board 4 and the terminal guide, which will be discussed later, is omitted here. Figure 2 As shown, the semiconductor device 101 includes a semiconductor module 6, a DC input main terminal 9, and a DC bus bar 10.

[0034] Semiconductor module 6 is disposed on the upper surface of base plate 2. Semiconductor module 6 includes control terminal 11, AC output main terminal 7, and AC busbar 8. Control terminal 11 is connected to control substrate 4 via through-hole 5. Control terminal 11 is electrically connected to control substrate 4. Control terminal 11 is bonded to control substrate 4 by solder or the like. Semiconductor module 6 is, for example, sealed with resin, with a portion of control terminal 11 exposed through the resin. Semiconductor module 6 is, for example, a power module. Multiple semiconductor modules 6 may be provided. Alternatively, only one semiconductor module 6 may be provided.

[0035] The control terminal 11 includes a protrusion 12, an upright portion 13, and a bent portion 14. The protrusion 12 protrudes in a direction parallel to the upper surface of the base plate 2. Furthermore, the protrusion 12 protrudes in a direction parallel to the lower surface of the control substrate 4.

[0036] The upright portion 13 rises upwards toward the base plate 2. The upright portion 13 is, for example, arranged in a direction perpendicular to the upper surface of the base plate 2. The upright portion 13 is, for example, arranged in a direction perpendicular to the lower surface of the control substrate 4. The upright portion 13 passes through a through-hole 5 in the control substrate 4. The upright portion 13 is electrically connected to the control substrate 4.

[0037] The bent portion 14 connects the protrusion 12 and the upright portion 13. The control terminal 11 is bent at the bent portion 14. The protrusion 12, the upright portion 13, and the bent portion 14 are formed integrally, for example.

[0038] A portion of the AC output main terminal 7 is exposed from the resin of the sealed semiconductor module 6. The AC output main terminal 7 is electrically connected to the AC busbar 8. A portion of the DC input main terminal 9 is exposed from the resin of the sealed semiconductor module 6. The DC input main terminal 9 is electrically connected to the DC busbar 10.

[0039] Figure 3 This is a perspective view of the semiconductor device 101 according to Embodiment 1. Figure 3 The description of control board 4 is omitted. For example... Figure 3 As shown, the semiconductor device 101 according to this embodiment includes a terminal guide 15.

[0040] Terminal guide 15 covers control terminals 11. A portion of the control terminals 11 may protrude from the terminal guide 15. The terminal guide 15 includes a through hole 16 through which the control terminals 11 pass. The terminal guide 15 is configured to cover a plurality of control terminals 11 protruding from one side of the semiconductor module 6. The semiconductor module 6 is configured to cover the plurality of control terminals 11 respectively. Multiple terminal guides 15 are provided to cover control terminals 11 protruding from different sides of the semiconductor module 6 respectively. That is, terminal guides 15 are provided on each side of the semiconductor module 6. Terminal guides 15 are respectively provided in each of the multiple semiconductor modules 6. Alternatively, the terminal guides 15 need not cover all of the control terminals 11, but may only cover a portion.

[0041] Figure 4 This is a side view of the semiconductor device 101 according to Embodiment 1. (As shown...) Figure 4 As shown, a terminal guide 15 is disposed between the base plate 2 and the control substrate 4. The terminal guide 15 determines the distance from the protrusion 12 of the control terminal 11 to the lower surface of the control substrate 4. The terminal guide 15 includes an upper guide surface 17, a lower guide surface 18, and a main body 21.

[0042] The upper surface 17 of the guide member is disposed opposite to the lower surface of the control substrate 4. At least a portion of the upper surface 17 of the guide member is configured to contact the lower surface of the control substrate 4. The lower surface 18 of the guide member is disposed opposite to the upper surface of the base plate 2. At least a portion of the lower surface 18 of the guide member is positioned at or below the upper surface of the semiconductor module 6. The main body 21 connects the upper surface 17 and the lower surface 18 of the guide member.

[0043] like Figure 4 As shown, in this embodiment, the lower surface 18 of the guide member of the semiconductor device 101 is configured to contact at least a portion of the protrusion 12 of the control terminal 11. The length from the portion of the lower surface 18 of the guide member that contacts the protrusion 12 of the control terminal 11 to the portion of the upper surface 17 of the guide member that contacts the lower surface of the control substrate 4 is the distance from the protrusion 12 to the lower surface of the control substrate 4. That is, the distance from the protrusion 12 to the lower surface of the control substrate 4 can be determined by the terminal guide member 15. By determining the distance from the protrusion 12 to the lower surface of the control substrate 4, i.e., ensuring the distance from the protrusion 12 to the lower surface of the control substrate 4, sufficient insulation space distance can be ensured.

[0044] Figure 4 The length d indicated by the middle arrow is the length from the portion of the lower surface 18 of the guide member that contacts the protrusion 12 to the portion of the upper surface 17 of the guide member that contacts the control substrate 4. This length is the same as the height of the control substrate 4 relative to the protrusion 12, i.e., the distance from the protrusion 12 to the lower surface of the control substrate 4. In other words, the terminal guide 15 includes a portion having the same dimension as the distance from the protrusion 12 to the lower surface of the control substrate 4.

[0045] Furthermore, the terminal guide 15 contacts the protrusion 12 via the lower surface 18 of the guide, and the height of the control substrate 4 is determined with reference to the protrusion 12. By having the lower surface 18 of the guide contact the protrusion 12, the required insulation space distance from the protrusion 12 to the lower surface of the control substrate 4 can be ensured more accurately.

[0046] Figure 5 This is a perspective view of the terminal guide 15 according to Embodiment 1. Figure 5 As shown, the terminal guide 15 includes, for example, a plurality of through holes 16. (As...) Figure 3 As shown, multiple control terminals 11 pass through multiple through holes 16. Alternatively, the terminal guide 15 may have only one through hole 16. Furthermore, multiple control terminals 11 can pass through a single through hole 16. Figure 5 As shown, the terminal guide 15 includes a fixing part 19.

[0047] The terminal guide 15 is fixed to the control substrate 4 by clamping the control substrate 4 between the upper surface 17 of the guide and the fixing part 19. However, the method of fixing the terminal guide 15 is not limited to the method described above.

[0048] Figure 6 This is a side view of the terminal guide 15 according to Embodiment 1. Figure 6 As shown, the terminal guide 15 extends, for example, at a position opposite to the fixing portion 19. The terminal guide 15 may, for example, have a T-shaped side surface. Alternatively, the terminal guide 15 may not extend at a position opposite to the fixing portion 19. Furthermore, the side surface shape of the terminal guide 15 may be rectangular or the like.

[0049] Figure 7 This is a top view of the terminal guide 15 according to Embodiment 1. Figure 7 As shown, the terminal guide 15 has, for example, an upper surface recess 20 around the through hole 16. By providing the upper surface recess 20, the terminal guide 15 can be easily inserted into the terminal guide 15.

[0050] Figure 8 This is a cross-sectional view of the terminal guide 15 according to Embodiment 1. Figure 8 As shown, the through hole 16 of the terminal guide 15 is, for example, conical. The through hole 16 has, for example, a shape where the diameter on the lower side (the side of the base plate 2) is larger than the diameter on the upper side (the side of the control substrate 4). The through hole 16 also has a shape where the diameter gradually increases from the upper side (the side of the control substrate 4) to the lower side (the side of the base plate 2). Because the through hole 16 has a smaller diameter on the upper side and a larger diameter on the lower side, it facilitates the insertion of multiple control terminals 11 into the terminal guide 15.

[0051] The semiconductor device 101 according to this embodiment includes: a base plate; a semiconductor module including control terminals and disposed on the upper surface of the base plate; and a terminal guide having a through hole for the control terminals to pass through, an upper guide surface disposed opposite to the lower surface of a control substrate and at least partially in contact with the lower surface of the control substrate, a lower guide surface at least partially disposed on the upper surface of the semiconductor module or at a position lower than the upper surface of the semiconductor module, and a main body portion connecting the upper guide surface and the lower guide surface. Therefore, sufficient insulation space distance can be ensured.

[0052] Implementation Method 2

[0053] Regarding the terminal guide 22 involved in Embodiment 2, using Figure 9 A description will be provided. Descriptions of structures identical to those in Embodiment 1 will be omitted. Furthermore, in Figure 9 In, with Figures 1 to 8The same reference numerals indicate the same or equivalent parts. The terminal guide 22 according to this embodiment is divided into multiple parts, which differs from the terminal guide 15 according to Embodiment 1. The following description focuses on the differences from Embodiment 1.

[0054] Figure 9 This is a top view of the terminal guide 22 according to Embodiment 2. The terminal guide 22 includes a first guide component 23 and a second guide component 24. The terminal guide 22 is provided by dividing it into the first guide component 23 and the second guide component 24. The terminal guide 22 is divided along a direction parallel to the control terminal 11. The terminal guide 22 is divided on the surface including the through hole 16. The terminal guide 22 is configured to be divided along a direction parallel to the height direction.

[0055] The first guide component 23 and the second guide component 24 clamp and fix the control terminal 11. The control terminal 11 is configured to be clamped by the first guide component 23 and the second guide component 24 through the through hole 16.

[0056] The first guide component 23 includes an inner guide surface 26. The second guide component 24 includes an inner guide surface 27. The terminal guide 22 includes an engaging protrusion 25 and an engaging recess (not shown) that engages with the engaging protrusion 25.

[0057] The first guide component 23 includes an engaging protrusion 25. The engaging protrusion 25 is disposed on the inner surface 26 of the guide component. The first guide component 23 may include multiple engaging protrusions 25. The first guide component 23 may include two engaging protrusions 25. The first guide component 23 may include three or more engaging protrusions 25. Furthermore, the first guide component 23 may include only one engaging protrusion 25. The first guide component 23 may also not include any engaging protrusions 25. The engaging protrusion 25 may be disposed on the inner surface 27 of the guide component.

[0058] The second guide component 24 includes an engaging recess. The engaging recess is disposed on the inner surface 27 of the guide component. The second guide component 24 may include, for example, multiple engaging recesses. The second guide component 24 may include, for example, two engaging recesses. The second guide component 24 may include three or more engaging recesses. Furthermore, the second guide component 24 may include only one engaging recess. The second guide component 24 may also not include any engaging recesses. The engaging recess may be disposed on the inner surface 26 of the guide component. For example, the first guide component 23 and the second guide component 24 may each include an engaging protrusion 25 and an engaging recess.

[0059] The first guide component 23 includes an upper guide surface 28 and a lower guide surface (not shown). The second guide component 24 includes an upper guide surface 29 and a lower guide surface (not shown). The upper guide surface is disposed opposite to the lower surface of the control substrate 4. Similar to the terminal guide 15 according to Embodiment 1, the upper guide surface of the terminal guide 22 is configured to contact at least a portion of the lower surface of the control substrate 4. That is, the upper guide surface 28 of the first guide component 23 and the upper guide surface 29 of the second guide component 24 may both be configured to contact the lower surface of the control substrate 4, or either one of them may be configured to contact the lower surface of the control substrate 4. Furthermore, it may be configured that a portion of the upper guide surface 28 or the upper guide surface 29 contacts the lower surface of the control substrate 4.

[0060] The lower surface of the terminal guide 22 is disposed opposite to the upper surface of the base plate 2. Similar to the terminal guide 15 described in Embodiment 1, at least a portion of the lower surface of the terminal guide 22 is disposed at a position on or below the upper surface of the semiconductor module 6. That is, the lower surfaces of the guide included in the first guide component 23 and the second guide component 24 can both be configured to contact the lower surface of the control substrate 4, or either one of them can be configured to contact the lower surface of the control substrate 4. Furthermore, a portion of the lower surface of the guide included in the first guide component 23 or the lower surface of the guide included in the second guide component 24 can be disposed at a position on or below the upper surface of the semiconductor module 6. The first guide component 23 includes an upper surface recess 30. The second guide component 24 includes an upper surface recess 31. The lower surface of the guide is configured, for example, to contact at least a portion of the protrusion 12 of the control terminal 11.

[0061] The terminal guide 22 is divided along a direction parallel to the control terminal 11 on the surface containing the through hole 16. Therefore, the terminal guide 22 can be mounted to the control terminal 11 in a clamping manner, thereby reducing the deviation between the control terminal 11 and the control substrate 4 even when the positional tolerance of the control terminal 11 is large.

[0062] Implementation Method 3

[0063] Regarding the semiconductor device 103 involved in Embodiment 3, using Figure 10 A description will be provided. Descriptions of structures identical to those in Embodiment 1 will be omitted. Furthermore, in Figure 10 In, with Figures 1 to 9The same reference numerals indicate the same or equivalent parts. The semiconductor device 103 according to this embodiment differs from the semiconductor device 101 according to Embodiment 1 in that the lower surface 33 of the terminal guide 32 contacts the base plate 2. Hereinafter, the description will focus on the differences from Embodiment 1.

[0064] Figure 10 This is a side view of the semiconductor device 103 according to Embodiment 3. The semiconductor device 103 includes a terminal guide 32. The terminal guide 32 includes an upper guide surface 17 and a lower guide surface 33. The upper guide surface 17 is disposed opposite to the lower surface of the control substrate 4. The upper guide surface 17 is configured to contact the lower surface of the control substrate 4 with at least a portion thereof.

[0065] The lower surface 33 of the guide member is disposed opposite to the upper surface of the base plate 2. At least a portion of the lower surface 33 of the guide member is positioned at or below the upper surface of the semiconductor module 6. Figure 10 As shown, the lower surface 33 of the guide includes a first lower surface 34 and a second lower surface 35 that are positioned differently from each other in the height direction. That is, the terminal guide 32 includes a shape such as a step or a notch.

[0066] The first lower surface 34 is configured to contact the protrusion 12 of the control terminal 11. The second lower surface 35 is configured to contact the upper surface of the base plate 2. By configuring the second lower surface 35, which is included in the lower surface 33 of the guide member, to contact the base plate 2, the required insulating space distance between the protrusion 12 and the control substrate 4 can be indirectly ensured.

[0067] Furthermore, by setting the first lower surface 34 of the guide lower surface 33 to contact the protrusion 12, and setting the second lower surface 35 of the guide lower surface 33 to contact the upper surface of the base plate 2, the insulation space distance that should be ensured between the protrusion 12 and the control substrate 4 can be ensured. At the same time, the load borne by the protrusion 12 due to the gravity applied to the terminal guide 32 and the control substrate 4 can be reduced.

[0068] Furthermore, the first lower surface 34 may not contact the protrusion 12. Even if the first lower surface 34 does not contact the protrusion 12, by setting the second lower surface 35 to contact the upper surface of the base plate 2, the required insulating space distance between the protrusion 12 and the control substrate 4 can be indirectly ensured. Moreover, since the first lower surface 34 does not contact the protrusion 12, the protrusion 12 is spared from the load generated by the gravity applied to the terminal guide 32 and the control substrate 4, thereby preventing the control terminal 11 from deforming due to the load.

[0069] Furthermore, the first lower surface 34 can be configured to contact the upper surface of the semiconductor module 6. By making the first lower surface 34 contact the upper surface of the semiconductor module 6, the height of the control substrate 4 can be adjusted with reference to the upper surface of the semiconductor module 6. Even when the first lower surface 34 is configured to contact the upper surface of the semiconductor module 6, the distance from the protrusion 12 to the lower surface of the control substrate 4 can be indirectly ensured, thereby ensuring the required insulation space distance.

[0070] Implementation Method 4

[0071] Regarding the semiconductor device 104 involved in Embodiment 4, using Figure 11 A description will be provided. Descriptions of structures identical to those in Embodiment 1 will be omitted. Furthermore, in Figure 11 In, with Figures 1 to 10 The same reference numerals indicate the same or equivalent parts. The semiconductor device 104 according to this embodiment differs from the semiconductor device 101 according to Embodiment 1 in that it connects the terminal guides covering the control terminals 11 of adjacent semiconductor modules 6. Hereinafter, the description will focus on the differences from Embodiment 1.

[0072] Figure 11 This is a perspective view of the semiconductor device 104 according to Embodiment 4. Figure 11 The description of the control substrate 4 is omitted. The semiconductor device 104 includes a plurality of semiconductor modules 6, terminal guides 46 and 47. Terminal guides 46 and 47 cover control terminals 11 protruding from different semiconductor modules 6. The control terminals 11 protruding from the plurality of semiconductor modules 6 pass through through holes 16 provided in the terminal guides 46 and 47. For example, one control terminal 11 passes through each through hole 16. The terminal guides 46 and 47 are an integral structure formed by connecting the terminal guides of the terminal guides 15 according to Embodiment 1 that cover the control terminals 11 of adjacent semiconductor modules 6. In addition, the terminal guides 46 and 47 do not need to cover all of the control terminals 11, or they may only cover a portion of them.

[0073] Semiconductor module 6 includes a first side disposed on one side of AC busbar 8 and a second side disposed on one side of DC busbar 10. Terminal guide 46 is configured to cover control terminals 11 protruding from the respective first side of the plurality of semiconductor modules 6. Terminal guide 47 covers control terminals 11 protruding from the respective second side of the plurality of semiconductor modules 6. That is, terminal guide 46 and terminal guide 47 are configured to cover control terminals 11 protruding from the sides of the plurality of semiconductor modules 6 arranged in the same direction.

[0074] By setting the terminal guides 46 and 47 to cover the control terminals 11 that protrude from the sides of the plurality of semiconductor modules 6 in the same direction, and aligning the positions of the terminal guides 46 and 47, the position of the control substrate 4 in the height direction can be easily determined, and the control substrate 4 can be easily installed onto the semiconductor module 6.

[0075] Alternatively, terminal guide 46 or terminal guide 47 can be combined with terminal guide 15 according to embodiment 1 for installation.

[0076] Implementation Method 5

[0077] Regarding the semiconductor device 105 involved in Embodiment 5, using Figure 12 and Figure 13 A description will be provided. Descriptions of structures identical to those in Embodiment 4 will be omitted. Furthermore, in Figure 12 and Figure 13 In, with Figures 1 to 11 The same reference numerals indicate the same or equivalent parts. The semiconductor device 105 according to this embodiment differs from the semiconductor device 104 according to embodiment 4 in that a relay section 39 is provided in the terminal guide 36. Hereinafter, the description will focus on the differences from embodiment 1.

[0078] Figure 12 This is a perspective view of the semiconductor device 105 according to Embodiment 5. Figure 12 The description of the control board 4 is omitted. The semiconductor device 105 includes a terminal guide 36. The terminal guide 36 includes a first terminal guide portion 37, a second terminal guide portion 38, and a relay portion 39.

[0079] The first terminal guide portion 37 corresponds to the terminal guide 46 according to Embodiment 4. That is, the first terminal guide portion 37 covers the control terminal 11 protruding from one side of the semiconductor module 6. The second terminal guide portion 38 corresponds to the terminal guide 47 according to Embodiment 4. That is, the second terminal guide portion 38 covers the control terminal 11 protruding from the opposite side of one side.

[0080] The relay section 39 connects to the first terminal guide section 37 and the second terminal guide section 38. The first terminal guide section 37, the second terminal guide section 38, and the relay section 39 can be formed as a single unit, for example. Alternatively, the first terminal guide section 37, the second terminal guide section 38, and the relay section 39 can also be formed as separate components and connected by screws or the like.

[0081] The first terminal guide portion 37 and the second terminal guide portion 38 are connected by the relay portion 39, thereby facilitating the insertion of the control terminal 11 into the first terminal guide portion 37 and the second terminal guide portion 38. That is, it is easy to insert the control terminal 11 into the terminal guide 36.

[0082] Figure 13 This is a side view of the semiconductor device 105 according to Embodiment 5. (As shown) Figure 13 As shown, the relay unit 39 is, for example, disposed on the upper side of the semiconductor module 6. The relay unit 39 is, for example, disposed at a position opposite to the upper surface of the semiconductor module 6. Alternatively, the relay unit 39 does not need to be disposed at a position opposite to the upper surface of the semiconductor module 6; it can be disposed on the upper side of the semiconductor module 6 but not opposite to the upper surface of the semiconductor module 6. That is, in Figure 13 In this configuration, the relay unit 39 can be disposed on the upper side of the semiconductor module 6, and further forward or inward than the semiconductor module 6. Alternatively, the relay unit 39 can be disposed not on the upper side of the semiconductor module 6, but on the lower side of the upper surface of the semiconductor module 6. That is, in... Figure 13 In the middle, the relay part 39 can be arranged in front of or inside the semiconductor module 6, and in a position that overlaps with the semiconductor module 6.

[0083] The terminal guide 36 includes a lower guide surface 40. The lower guide surface 40 includes a first lower surface 34, a second lower surface 35, and a third lower surface 41. The relay section 39 includes a portion of the lower guide surface 40, namely the third lower surface 41. The third lower surface 41 can be configured to contact the upper surface of the semiconductor module 6. By making the third lower surface 41 contact the upper surface of the semiconductor module 6, the height of the control substrate 4 can be adjusted with reference to the upper surface of the semiconductor module 6.

[0084] Even when the third lower surface 41 is configured to contact the upper surface of the semiconductor module 6, the distance from the protrusion 12 to the lower surface of the control substrate 4 can be indirectly ensured, thereby ensuring the required insulation space distance. Therefore, even when neither the first lower surface 34 nor the second lower surface 35 contacts either the protrusion 12 of the control terminal 11 or any one of the base plate 2, the required insulation space distance can be ensured. Furthermore, since the first lower surface 34 does not contact the protrusion 12, the protrusion 12 is spared from the load generated by the gravity applied to the terminal guide 36 and the control substrate 4, thereby preventing the control terminal 11 from deforming due to the load.

[0085] Implementation Method 6

[0086] Regarding the semiconductor device 106 involved in Embodiment 6, using Figure 14 and Figure 15 A description will be provided. Descriptions of structures identical to those in Embodiment 1 will be omitted. Furthermore, in Figure 14 and Figure 15 In, with Figures 1 to 13 The same reference numerals indicate the same or equivalent parts. In the semiconductor device 106 according to this embodiment, the control terminal 42 is provided on the upper surface of the semiconductor module 6 and the terminal guide 43 covers the control terminal 42, which is different from the semiconductor device 104 according to embodiment 4. Hereinafter, the description will focus on the differences from embodiment 1.

[0087] Figure 14 This is a perspective view of the semiconductor device 106 according to Embodiment 6. Figure 14 The description of the control substrate 4, terminal guide 43, and terminal guide 44 is omitted. The semiconductor device 106 includes a control terminal 42 disposed on the upper surface of the semiconductor module 6. The control terminal 42 is electrically connected to the control substrate 4.

[0088] Figure 15 This is a side view of the semiconductor device 106 according to Embodiment 6. The semiconductor device 106 includes a terminal guide 43 and a terminal guide 44. The terminal guide 43 corresponds to the terminal guide 15 according to Embodiment 1. The terminal guide 44 covers the control terminal 42. Alternatively, the terminal guide 44 does not need to cover all of the control terminal 42, or it may only cover a portion of the control terminal 42.

[0089] The terminal guide 44 includes a lower guide surface 45. The lower guide surface 45 is configured to contact the upper surface of the semiconductor module 6. By making the lower guide surface 45 contact the upper surface of the semiconductor module 6, the height of the control substrate 4 can be adjusted with reference to the upper surface of the semiconductor module 6. Even when the lower guide surface 45 is configured to contact the upper surface of the semiconductor module 6, the distance from the protrusion 12 to the lower surface of the control substrate 4 can be indirectly ensured, thereby ensuring the required insulation space distance.

[0090] The preferred embodiments have been described in detail above, but are not limited to the embodiments described above. Various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0091] Furthermore, while the materials, dimensions, shapes, relative configurations, or implementation conditions of each component are sometimes described in the embodiments described herein, these are merely examples and are not limited to the contents described in each embodiment. Therefore, numerous variations not illustrated can be contemplated within the scope of each embodiment. For example, these include variations, additions, or omissions of any component, as well as the extraction of at least one component from at least one embodiment and its combination with components from other embodiments.

[0092] The various methods disclosed herein are summarized below as appendices.

[0093] (Postscript 1)

[0094] The semiconductor device of the present invention includes: a base plate;

[0095] A semiconductor module, including control terminals, is disposed on the upper surface of the base plate;

[0096] A control substrate, disposed on the upper side of the semiconductor module and connected to the control terminals; and

[0097] A terminal guide has a through hole through which the control terminal passes, an upper guide surface disposed opposite to the lower surface of the control substrate and at least partly in contact with the lower surface of the control substrate, a lower guide surface at least partly disposed at a position on or below the upper surface of the semiconductor module, and a main body portion connecting the upper guide surface and the lower guide surface.

[0098] (Postscript 2)

[0099] In the semiconductor device as described in Appendix 1, the control terminal has a protrusion extending in a direction parallel to the upper surface of the base plate, an upright portion rising towards the upper side of the base plate, and a bent portion connecting the protrusion and the upright portion.

[0100] The lower surface of the guide member is in contact with the protrusion.

[0101] (Note 3)

[0102] In the semiconductor device as described in Appendix 2, the lower surface of the guide has a first lower surface and a second lower surface.

[0103] The first lower surface is in contact with the protrusion.

[0104] The second lower surface is in contact with the base plate.

[0105] (Note 4)

[0106] In the semiconductor device as described in Appendix 1, the lower surface of the guide is in contact with the upper surface of the base plate.

[0107] (Note 5)

[0108] In the semiconductor device as described in Appendix 1, the lower surface of the guide is in contact with the upper surface of the semiconductor module.

[0109] (Note 6)

[0110] In any of the semiconductor devices described in any one of Appendices 1 to 5, the semiconductor module has a plurality of the terminals.

[0111] The terminal guide has multiple through holes.

[0112] The multiple control terminals pass through the multiple through holes respectively.

[0113] (Note 7)

[0114] In any one of Appendix 1 to 6, the terminal guide is configured to be divided on the surface containing the through hole in a direction parallel to the control terminal.

[0115] (Note 8)

[0116] In any one of Appendices 1 to 7, a plurality of said semiconductor modules are included.

[0117] The terminal guide covers the control terminals that protrude from the sides of the plurality of semiconductor modules in the same direction.

[0118] (Note 9)

[0119] In any one of Appendix 1 to 8, the terminal guide includes a first terminal guide portion covering a control terminal protruding from one side of the semiconductor module, a second terminal guide portion covering a control terminal protruding from another side located opposite to one side, and a relay portion connecting the first terminal guide portion and the second terminal guide portion.

[0120] (Postscript 10)

[0121] In the semiconductor device as described in Appendix 9, the relay section has a third lower surface.

[0122] The third lower surface is in contact with the upper surface of the semiconductor module.

[0123] (Postscript 11)

[0124] In the semiconductor device as described in Appendix 1, the terminal guide covers the control terminals disposed on the upper surface of the semiconductor module.

[0125] (Postscript 12)

[0126] In any of the semiconductor devices described in Appendix 1 to 11, the through-hole is a shape in which the diameter on one side of the base plate is larger than the diameter on the side of the control substrate.

[0127] Label Explanation

[0128] 1 Water cooling jacket, 2 Base plate, 3 Screw, 4 Control board, 5 Through hole, 6 Semiconductor module, 7 Main terminal section for AC output, 8 AC busbar, 9 Main terminal section for DC input, 10 DC busbar, 11, 42 Control terminals, 12 Protrusion, 13 Vertical part, 14 Bending part, 15, 22, 32, 36, 43, 44, 46, 47 Terminal guide, 16 Through hole, 17, 28, 29 Upper surface of guide, 18, 33, 40, 45 Lower surface of guide, 23 First component of guide, 24 Second component of guide, 34 First lower surface, 35 Second lower surface, 37 First terminal guide section, 38 Second terminal guide section, 39 Relay section, 41 Third lower surface, 101, 103, 104, 105, 106 Semiconductor device.

Claims

1. A semiconductor device, characterized in that, include: Base plate; A semiconductor module, including control terminals, is disposed on the upper surface of the base plate; A control substrate is disposed on the upper side of the semiconductor module and connected to the control terminals; as well as A terminal guide has a through hole through which the control terminal passes, an upper guide surface disposed opposite to the lower surface of the control substrate and at least partly in contact with the lower surface of the control substrate, a lower guide surface at least partly disposed at a position on or below the upper surface of the semiconductor module, and a main body portion connecting the upper guide surface and the lower guide surface.

2. The semiconductor device as claimed in claim 1, characterized in that, The control terminal has a protrusion extending in a direction parallel to the upper surface of the base plate, an upright portion rising towards the upper side of the base plate, and a bent portion connecting the protrusion and the upright portion. The lower surface of the guide member is in contact with the protrusion.

3. The semiconductor device as claimed in claim 2, characterized in that, The lower surface of the guide member has a first lower surface and a second lower surface. The first lower surface is in contact with the protrusion. The second lower surface is in contact with the base plate.

4. The semiconductor device as claimed in claim 1, characterized in that, The lower surface of the guide member is in contact with the upper surface of the base plate.

5. The semiconductor device as claimed in claim 1, characterized in that, The lower surface of the guide is in contact with the upper surface of the semiconductor module.

6. The semiconductor device according to any one of claims 1 to 5, characterized in that, The control terminal includes multiple control terminals. The through hole includes multiple through holes. The plurality of control terminals pass through the corresponding through holes in the plurality of through holes respectively.

7. The semiconductor device according to any one of claims 1 to 6, characterized in that, The terminal guide is configured to be divided on the surface containing the through hole in a direction parallel to the control terminal.

8. The semiconductor device according to any one of claims 1 to 7, characterized in that, The semiconductor module includes multiple semiconductor modules. The terminal guide covers the control terminals that protrude from the sides of the plurality of semiconductor modules in the same direction.

9. The semiconductor device according to any one of claims 1 to 8, characterized in that, The control terminals include a first type of control terminal and a second type of control terminal. The first type of control terminal protrudes from one side of the semiconductor module. The second type of control terminal protrudes from another side of the semiconductor module. The other side is the side located opposite to the first side. The terminal guide includes a first terminal guide portion covering the first type of control terminal, a second terminal guide portion covering the second type of control terminal, and a relay portion connecting the first terminal guide portion and the second terminal guide portion.

10. The semiconductor device as claimed in claim 9, characterized in that, The relay unit has a third lower surface. The third lower surface is in contact with the upper surface of the semiconductor module.

11. The semiconductor device as claimed in claim 1, characterized in that, The terminal guide covers the control terminals disposed on the upper surface of the semiconductor module.

12. The semiconductor device according to any one of claims 1 to 11, characterized in that, The through hole is a shape in which the diameter on one side of the base plate is larger than the diameter on the other side of the control substrate.

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