Semiconductor device manufacturing method, semiconductor device identity determination method, and semiconductor device manufacturing system

Abstract

The present invention provides a method for manufacturing a semiconductor device, comprising: a substrate layer forming step, wherein a substrate layer formed of a curable resin composition is formed on a semiconductor substrate; an ink marking step, wherein an ink is used to impart an identity determination mark for determining the identity of the semiconductor device onto the substrate layer; and a curing step, wherein the substrate layer is cured after the ink marking step.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a semiconductor device, a method for determining the identity of a semiconductor device, and a system for manufacturing a semiconductor device. Background Technology

[0002] In the field of semiconductor devices, the circulation of counterfeit goods has become a problem. Therefore, a technology is needed to determine whether a circulated product is the same as a genuine product. To determine identity, it is possible to pre-attach a unique mark (hereinafter referred to as an identity determination mark) to the semiconductor device.

[0003] In this regard, Patent Document 1 (Japanese Patent Application Publication No. 2007-242973) discloses a semiconductor device, which is a semiconductor device with a structure in which a semiconductor circuit is sealed with a sealing resin, having a semiconductor circuit and a sealing resin, wherein the sealing resin has at least one individual pattern on its surface.

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2007-242973 Summary of the Invention

[0005] Therefore, the inventors of this application have studied the following: using marks formed using ink as marks for determining identity. Marks formed using ink may appear to have the same shape when viewed with the naked eye, but upon magnification, each mark retains its inherent shape. Based on this phenomenon, the inventors of this application have studied the following: using magnified images of marks formed using ink for determining identity.

[0006] On the other hand, there is a problem with the adhesion of marks formed using ink.

[0007] Therefore, the object of the present invention is to provide a technique that can improve the adhesion of an identity determination mark attached by ink in a semiconductor device.

[0008] The inventors of this application have discovered that by focusing on the sequence of the additional marking processes in the manufacturing process of semiconductor devices, the aforementioned technical problem can be solved.

[0009] That is, in one aspect, the present invention relates to a method for manufacturing a semiconductor device. The manufacturing method includes: a foundation layer forming step, forming a foundation layer of a curable resin composition on a semiconductor substrate; an ink marking step, applying an ink mark to the foundation layer for determining the identity of the semiconductor device; and a curing step, curing the foundation layer after the ink marking step.

[0010] On the other hand, the present invention relates to a method for determining the identity of a semiconductor device. This method includes: a step of manufacturing a genuine semiconductor device using the aforementioned manufacturing method; a step of photographing an identity determination mark during or after the manufacturing of the genuine device to generate genuine device data displaying the identity determination mark; a step of photographing an identity determination mark on a semiconductor device that is the object of determination to generate object data displaying the identity determination mark; and a step of determining whether the object of determination is the same item as the genuine device based on the genuine device data and the object data.

[0011] Furthermore, the present invention relates to a semiconductor device manufacturing system.

[0012] The manufacturing system includes: a substrate forming apparatus for forming a substrate layer made of a curable resin composition on a semiconductor substrate; and an ink marking apparatus for applying an ink mark to the substrate layer for identifying the identity of a semiconductor device. Attached Figure Description

[0013] Figure 1 A schematic diagram of the semiconductor device for illustrating the implementation scheme.

[0014] Figure 2 A diagram showing an instance of a marker used for identity determination.

[0015] Figure 3 A flowchart illustrating a method for manufacturing a semiconductor device according to an embodiment.

[0016] Figure 4 This is a schematic diagram illustrating an example of a method for manufacturing a semiconductor device.

[0017] Figure 5 This is a structural diagram illustrating an example of a semiconductor device manufacturing system. Detailed Implementation

[0018] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0019] (1) Semiconductor devices Figure 1 This is a schematic diagram of the semiconductor device 1 according to this embodiment. The semiconductor device 1 includes a semiconductor substrate 2 and a base layer 3 disposed on the semiconductor substrate 2. An identity determination mark 4 is attached to the base layer 3. The semiconductor device 1 is, for example, a semiconductor chip.

[0020] Figure 2A diagram showing an example of label 4 used for identity determination. Additionally, a magnified view of a portion of label 4 used for identity determination is also provided. Figure 1 And displayed Figure 2 middle.

[0021] The identity determination mark 4 is an ink-applied mark. The identity determination mark 4 is used to determine whether the semiconductor device 1 is the same item as the genuine product. As mentioned above, even if the ink-applied mark appears to be the same shape to the naked eye, it will still have different shapes under magnification. For example, if ink is supplied to a substrate, the supplied ink will wet and spread to a certain extent. The wetting and spreading of the ink is random. Furthermore, for example, when using the inkjet method to apply the mark, the ink is supplied to the substrate in the form of droplets. In this case, the landing position of the droplets also appears random under magnification.

[0022] The aforementioned randomness can be used for identity determination. For example, during the manufacturing of semiconductor device 1, an enlarged image of the identity determination mark 4 is obtained in advance and saved as genuine product data. After semiconductor device 1 enters the market, when it is necessary to confirm whether the circulating product is the same as the genuine product, an enlarged image of the circulating product using the identity determination mark 4 is obtained. Then, the image of the circulating product is compared with the previously saved genuine product data as the determination object data. Thus, it is possible to determine whether the circulating product is the same as the genuine product. Furthermore, although the genuine product data and the determination object data can be image data themselves, they do not necessarily have to be image data themselves. For example, the genuine product data and the determination object data can also be data used to display feature quantities extracted from the image data.

[0023] Furthermore, the irregularity of the shape of the identity determination mark 4 is not the only factor that can be used to determine identity. For example, if the ink contains particulate pattern-forming substances, when the identity determination mark 4 is observed under magnification, irregular bright spot patterns may sometimes appear due to reflected light from the pattern-forming substances. Therefore, the irregularity of the bright spot patterns can also be used to determine identity.

[0024] Furthermore, when observed with the naked eye, the identity determination mark 4 can be a mark containing any information such as a batch number, or it can be a mark that does not display any meaning. That is, the identity determination using the identity determination mark 4 is not performed by the identification marks themselves, but by comparing the information obtained from the inherent image of the mark on the genuine article with the information obtained from the image of the mark on the object being determined.

[0025] (2) Manufacturing methods of semiconductor devices and methods for determining their similarity Next, the manufacturing method of the semiconductor device of this embodiment and the method for determining its identity will be described. Figure 3 A flowchart is provided to illustrate the manufacturing method of the semiconductor device 1 according to this embodiment.

[0026] As described above, in this embodiment, the identity determination mark 4 is formed using ink to obtain randomness. However, there is a technical problem regarding the adhesion of the identity determination mark 4 attached using ink. In particular, when using magnified images for identity determination, the identity determination mark 4 needs to have high adhesion so that peeling is not observed even when viewing magnified images. Here, the inventors of this application have explored ways to improve the adhesion of the identity determination mark 4. As a result, the following solution was found: forming a curable base layer 3, and then applying the ink mark before the base layer 3 cures, thereby improving adhesion. As long as it is before the base layer 3 cures, the base layer 3 will have a certain degree of fluidity. Therefore, if ink is supplied to the base layer 3 before curing, it is easy for the ink and the base layer 3 to permeate each other. As a result, it can be considered that the ink becomes easier to bond with the base layer 3, thereby improving the adhesion of the identity determination mark 4.

[0027] That is, such as Figure 3 As shown, the manufacturing method of the semiconductor device 1 according to this embodiment includes a substrate layer formation step (step S1), an ink marking step (step S2), and a curing step (step S3). In the substrate layer formation step (S1), a substrate layer 3 is formed on a semiconductor substrate 2 using a curable resin composition. In the ink marking step (S2), an identity determination mark 4 is applied to the substrate layer 3 using ink. In the curing step (S3), the substrate layer 3 is cured. The curing step (S3) is performed after the ink marking step (S2). According to this method, since the curing step (S3) is performed after the ink marking step (S2), the adhesion of the identity determination mark 4 to the substrate layer 3 can be improved.

[0028] The above is a summary of this implementation plan. Next, the details of this implementation plan will be explained with reference to specific examples. Figure 4 A figure showing a specific example of a method for manufacturing semiconductor device 1.

[0029] (Step S1) Formation of the basal layer First, such as Figure 4 As shown in (a), a semiconductor substrate 2 is prepared. For example, the semiconductor substrate 2 is a semiconductor wafer after back-side grinding.

[0030] Next, as Figure 4As shown in (b), a base layer 3 is formed on the semiconductor substrate 2. The base layer 3 can be any layer that can serve as the substrate for the identity determination mark 4. In this embodiment, the base layer 3 is a resin layer (back resin layer) disposed on the back side (the side opposite to the circuit formation surface) of the semiconductor substrate 2.

[0031] The substrate 3 is formed from a curable resin composition. For example, a substrate forming film (a back resin layer film) containing a curable resin composition is laminated onto the back side of the semiconductor substrate 2. Thus, the substrate 3 can be formed.

[0032] The curing type of the curable resin composition used to form the substrate 3 can be thermosetting, energy-curable (e.g., ultraviolet (UV) curing), or both. For films used to form substrates from energy-curable resin compositions, it is sometimes necessary to have both energy-curable transmittance and the optical properties required by the substrate; therefore, thermosetting resin compositions are suitable.

[0033] Furthermore, the detailed composition of the basal layer 3 will be illustrated with examples later.

[0034] (Step S2) Ink Marking Next, as Figure 4 As shown in (c), an identity determination mark 4 is applied to the substrate layer 3. As previously explained, the identity determination mark 4 is formed by ink. That is, the identity determination mark 4 is formed by applying ink to the substrate layer 3.

[0035] The method of assigning the mark 4 for identity determination is not particularly limited. For example, inkjet printing and gravure coating can be listed as methods of assignment. Among these methods, inkjet printing is preferred. Figure 4 As shown in (c), when using the inkjet method, ink droplets 6 are sprayed onto the substrate layer 3. When viewed under magnification, the landing positions of the droplets 6 sometimes appear regular and sometimes irregular. Furthermore, the ink spreads and wets in an irregular shape after landing. Therefore, the shape of the identity determination mark 4, observed under magnification, tends to become its inherent shape. This makes it easier to perform identity determination using the identity determination mark 4.

[0036] As the ink, a curable ink is preferred. The ink can be thermosetting or ray-curable. Ray-curable ink is preferred. UV-curable ink is even more preferred. Additionally, particulate pattern-forming substances can be added to the ink as needed.

[0037] When using curable inks, it is advisable to cure the ink immediately after application (before the curing of the base layer 3).

[0038] In a more suitable manner, the curable resin composition constituting the substrate layer 3 is a thermosetting resin composition. On the other hand, the ink is an energy-curable composition. Furthermore, the curing of the ink is performed earlier than the curing of the substrate layer 3 (step S3).

[0039] (Photography) Next, as Figure 4 As shown in (d), the identity determination mark 4 is photographed. The identity determination mark 4 is photographed using a microscope. The size of the photographed area is not particularly limited. For example, the size of the photographed area may be, for example, an area containing a single side of 10 μm to 1000 μm.

[0040] The microscopes used for photography are typically optical microscopes. For example, the magnification when using an optical microscope ranges from 20x to 500x.

[0041] The identification of the genuine article is determined by taking an image of the image with the identification mark 4, and the feature values ​​extracted from the image are stored on an unmarked server as genuine article data for identification of the genuine article.

[0042] (Step S3) Curing Next, as Figure 4 As shown in (e), the substrate layer 3 is cured. The substrate layer 3 is cured by a method corresponding to the curing type of the curable resin composition. That is, if the curing type of the substrate layer 3 is thermosetting, a thermosetting process is performed. If the curing type of the substrate layer 3 is energy ray curing, a curing process using energy ray irradiation is performed.

[0043] Furthermore, when the curing type of the base layer 3 is thermosetting, the heating temperature in this step is, for example, 80°C to 200°C, preferably 100°C to 160°C. For example, the heating time is 30 minutes to 50 hours, preferably 1 to 3 hours.

[0044] (Cutting, etc.) After the substrate layer 3 is cured, the necessary processing is performed to obtain the semiconductor device 1. Figure 4 In the example shown, such as Figure 4 As shown in (f), a dicing process is performed. In the dicing process, a semiconductor substrate 2 is disposed on a dicing die 10. For example, the semiconductor substrate 2 is attached to the dicing die 10 with the substrate layer 3 facing the dicing die 10. That is, it is attached to the dicing die 10 in such a way that the identity determination mark 4 contacts the dicing die 10. Then, the semiconductor substrate 2 is individually diced (diced) using a blade 9.

[0045] After monolithization, such as Figure 4 As shown in (g), each semiconductor chip 11 is picked up from the dicing die 10. When the adhesion of the identity determination mark 4 is low, there is a possibility that the identity determination mark 4 may adhere to the dicing die 10 and peel off from the substrate layer 3 during picking. However, according to this embodiment, the identity determination mark 4 has high adhesion. Therefore, even when the semiconductor substrate 2 is attached in a manner that the identity determination mark 4 contacts the dicing die 10, the identity determination mark 4 is not easily peeled off during picking.

[0046] After being picked up, reliability tests are conducted as needed. Following these reliability tests, the semiconductor chip is then distributed in the market as a semiconductor device.

[0047] After a semiconductor device enters the market, when you want to verify its authenticity, such as... Figure 4 As shown in (h), the identification mark for the circulating article (object to be determined) is photographed. The identification mark for the circulating article is photographed using a microscope in the same manner as the genuine article. Then, based on the data from the image displaying the identification mark for the circulating article or the feature quantities extracted from the image (object to be determined data), and the pre-generated data for the genuine article, it is determined whether the circulating article is the same article as the genuine article.

[0048] The above describes the manufacturing method of the semiconductor device and the method for determining semiconductor identity according to this embodiment. According to this embodiment, ink marking is performed before the substrate layer 3 is cured, thus improving the adhesion of the identity determination mark 4. Therefore, identity determination can be performed with high reliability.

[0049] (3) Semiconductor device manufacturing system Furthermore, for example, the above-described method for manufacturing a semiconductor device can be implemented using a semiconductor device manufacturing system. Figure 5 This is a configuration diagram showing an example of a semiconductor device manufacturing system 20. The semiconductor device manufacturing system includes a substrate forming apparatus 21, an ink marking apparatus 22, an imaging apparatus 23, and a curing apparatus 24.

[0050] The substrate forming apparatus 21 is configured to form a substrate 3 on a semiconductor substrate 2. For example, the substrate forming apparatus 21 is a lamination apparatus configured to laminate a substrate forming film (a back resin layer film) onto the back side of the semiconductor substrate 2.

[0051] The ink marking device 22 is configured to attach an identity determination mark to the substrate layer 3 using ink. For example, the ink marking device 22 is an inkjet printing device.

[0052] The imaging device 23 is equipped with a microscope and is configured to photograph a small area marked 4 for identity determination using the microscope. For example, the imaging device 23 is a digital imaging device with an optical microscope.

[0053] Furthermore, the semiconductor device manufacturing system of this embodiment may include a feature quantity calculation device (not shown) that calculates predetermined feature quantities from an image captured by the imaging device 23. For example, as feature quantities calculated by the feature quantity calculation device, coordinates of the outline representing the shape of the identity determination mark 4 magnified by a microscope, coordinates of each bright spot in the bright spot pattern displayed by the identity determination mark 4, etc. Such feature quantities can be used as feature quantities extracted from the image of the aforementioned genuine product.

[0054] The curing apparatus 24 is configured to cure the substrate layer 3. When the curing type of the substrate layer 3 is thermosetting, the curing apparatus 24 is a heating device. When the curing type of the substrate layer 3 is energy beam curing (e.g., UV curing), the curing apparatus 24 is an energy beam irradiation device (e.g., a UV irradiation device).

[0055] Several of the devices included in the manufacturing system 20 described above can be provided in an integrated manner. For example, the substrate forming apparatus 21 and the ink marking apparatus 22 can be provided in an integrated manner. If such a manufacturing system is used, the process from substrate formation to ink marking can be carried out in-line, which can improve productivity. In addition, the substrate forming apparatus 21, the ink marking apparatus 22 and the imaging apparatus 23 can be provided in an integrated manner, and the substrate forming apparatus 21, the ink marking apparatus 22, the imaging apparatus 23 and the feature quantity calculation apparatus can also be provided in an integrated manner.

[0056] When the curable resin composition forming the substrate layer 3 is thermosetting, the heating in the heating device of the curing apparatus 24 usually takes about 30 minutes to 5 hours. Therefore, considering the relatively short processing time of the substrate layer forming apparatus 21 and the ink marking apparatus 22, it is difficult to integrate the curing apparatus 24 with the substrate layer forming apparatus 21 and the ink marking apparatus 22. Therefore, when the substrate layer 3 is cured earlier than the ink marking, there is a possibility that the semiconductor substrate 2 will become offline through the curing apparatus 24 between the substrate layer forming apparatus 21 and the ink marking apparatus 22, making it impossible to keep the substrate layer forming apparatus 21 and the ink marking apparatus 22 online. On the other hand, when the substrate layer 3 is cured later than the ink marking, the substrate layer can be formed and the ink marking can be performed online, and then the substrate layer 3 can be cured offline, making it easier to integrate the substrate layer forming apparatus 21 and the ink marking apparatus 22.

[0057] (4) Other Furthermore, regarding the ink marking process (step S2) in this embodiment: Figure 4 (c) in the middle and curing process (step S3: Figure 4 The identification of genuine articles between (e) and (see) is performed using photographs of marked items (refer to) Figure 4 The situation described in (d) will be explained. However, it is not necessary to take the photo of mark 4 for identity determination before the curing process (step S3). It can also be done during the curing process (step S3). Figure 4 The identity determination mark 4 is photographed at any stage after (e) in the above process. When the substrate 3 is thermosetting, by photographing the identity determination mark 4 before the curing process, the curing process, which is difficult to be carried out online, is not sandwiched between processes. Therefore, in the above semiconductor device manufacturing system, the substrate forming apparatus 21, the ink marking apparatus 22 and the photographing apparatus 23 can be easily integrated.

[0058] Furthermore, in this embodiment, the case where the substrate layer 3 is a back resin layer formed on the back side of the semiconductor substrate 2 has been described. However, the substrate layer 3 is not limited to a back resin layer. For example, the substrate layer 3 may also be a so-called sealing resin layer used as a sealing resin.

[0059] On the other hand, as described in the above embodiments, the substrate 3 is preferably a back resin layer. More preferably, the back resin layer is a resin layer formed by laminating a substrate forming film (a back resin layer film). In the following description, the back resin layer will be described in detail in the case where the substrate 3 is a back resin layer formed by a substrate forming film.

[0060] (5) Base layer (back resin layer) Although there are no particular limitations, for example, the thickness of the resin layer on the back is 1μm to 100μm, preferably 5μm to 50μm.

[0061] As explained, the curing type of the backing resin layer can be either thermosetting or energy-cured, with thermosetting being more suitable. Below, an example of the composition of the backing resin layer in the case of thermosetting will be described. In this case, the backing resin layer is formed from a thermosetting curable resin composition.

[0062] When the curable resin composition is thermosetting, the curable resin composition may include, for example, a polymer component (A), a thermosetting component (B), a curing accelerator (C), a silane coupling agent (D), and a colorant (E).

[0063] (A) Polymer composition As polymer component (A), examples include acrylic resins (e.g., resins obtained by addition polymerization of monomers containing at least acrylate monomers), polyesters, urethane resins (e.g., resins having urethane bonds), urethane acrylic resins, silicone resins (e.g., resins having siloxane bonds), rubber resins (e.g., resins having a rubber structure), and phenoxy resins, with acrylic resins being preferred.

[0064] For example, the content of polymer component (A) is 5% to 50% by mass, preferably 10% to 40% by mass, and more preferably 15% to 35% by mass, relative to the total mass of the curable resin composition excluding the solvent.

[0065] (B) Thermosetting components Examples of thermosetting components (B) include epoxy thermosetting resins, thermosetting polyimide resins, thermosetting polyurethanes, unsaturated polyesters, and silicone rubbers. Epoxy thermosetting resins are preferred.

[0066] As an epoxy thermosetting resin, for example, an epoxy thermosetting resin composed of epoxy resin (B1) and thermosetting agent (B2) can be used.

[0067] Examples of epoxy resins (B1) include, for example, multifunctional epoxy resins, biphenyl compounds, bisphenol A diglycidyl ether and its hydrides, o-cresol phenolic varnish epoxy resins, dicyclopentadiene type epoxy resins, biphenyl type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenylene skeleton type epoxy resins, and other epoxy compounds with dual or higher functionality. Among these resins, bisphenol A type epoxy resins are preferred.

[0068] The thermosetting agent (B2) is a substance that acts as a curing agent for epoxy resin. Examples of thermosetting agents include compounds having at least two functional groups in one molecule capable of reacting with epoxy groups. Examples of such functional groups include phenolic hydroxyl groups, alcoholic hydroxyl groups, amino groups, carboxyl groups, and groups that have undergone dehydration to form anhydrides from acid groups. Preferably, the thermosetting agent comprises an amine-based curing agent having an amino group. Examples of amine-based curing agents include dicyandiamine.

[0069] The content of thermosetting component (B) (e.g., the content of epoxy resin (B1) and thermosetting agent (B2) is, for example, 5% to 30% by mass, preferably 15% to 20% by mass, relative to the total mass of the curable resin composition excluding solvent.

[0070] (C) Curing accelerator Examples of curing accelerators (C) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; imidazoles (imidazoles in which at least one hydrogen atom is substituted by a group other than a hydrogen atom) such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organophosphines (phosphines in which at least one hydrogen atom is substituted by an organic group) such as tributylphosphine, diphenylphosphine, and triphenylphosphine; and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. Preferably, the curing accelerator (C) comprises 2-phenyl-4,5-dihydroxymethylimidazole.

[0071] For example, the content of curing accelerator (C) is 0.1% to 1% by mass relative to the total mass of the curable resin composition excluding the solvent.

[0072] (D) Silane coupling agent Examples of silane coupling agents (D) include 3-glycidyl etheroxypropyltrimethoxysilane, 3-glycidyl etheroxypropylmethyldiethoxysilane, 3-glycidyl etheroxypropyltriethoxysilane, 3-glycidyl etheroxymethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, and 3-(2-aminoethylamino)propyltrimethoxysilane. Oxykrylyl silanes, 3-(2-aminoethylamino)propylmethyldiethoxysilane, 3-(phenylamino)propyltrimethoxysilane, 3-anilinopropyltrimethoxysilane, 3-ureapropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfide, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazole silanes, etc. Preferably, the silane coupling agent (D) comprises 3-glycidyl etheroxypropyltrimethoxysilane.

[0073] For example, the content of silane coupling agent (D) is 0.1% to 1% by mass relative to the total mass of the curable resin composition excluding solvent.

[0074] (E) Coloring agent Inorganic pigments, organic pigments, and organic dyes can be used as colorants (E). Among these, inorganic pigments are preferred because they fade less. Examples of inorganic pigments include carbon black, cobalt-based pigments, iron-based pigments, chromium-based pigments, titanium-based pigments, vanadium-based pigments, zirconium-based pigments, molybdenum-based pigments, ruthenium-based pigments, platinum-based pigments, ITO (indium tin oxide) pigments, and ATO (antimony tin oxide) pigments. Carbon black is a preferred colorant (E).

[0075] The content of colorant (E) is, for example, 0.1% to 10% by mass, preferably 0.5% to 5% by mass, relative to the total mass of the curable resin composition excluding the solvent.

[0076] Example Next, to illustrate the invention in more detail, embodiments implemented by the inventors of this application will be described. However, the invention should not be construed as limited to the following embodiments.

[0077] (Example) <Manufacturing of the film for the back resin layer> (Preparation of the composition for the back resin layer) The following raw materials were mixed with methyl ethyl ketone solvent and stirred at 23°C for 60 minutes to prepare a backing resin layer composition with an active ingredient (excluding the solvent) content of 52% by mass. Furthermore, in the following description, the amounts of each component represent the amount of the active ingredient.

[0078] (1) Acrylic polymer (20 parts by weight): an acrylic polymer (weight average molecular weight: 600,000) formed by copolymerizing 15 parts by weight of n-butyl acrylate, 10 parts by weight of methyl methacrylate, 60 parts by weight of methyl acrylate and 15 parts by weight of 2-hydroxyethyl acrylate. (2) Bisphenol A type liquid epoxy resin (15 parts by weight): "BPA328" manufactured by NIPPON SHOKUBAI CO., LTD. (3) Bisphenol A type epoxy resin (1.8 parts by weight): "jER1055" manufactured by Mitsubishi Chemical Corporation. (4) Dicyandiamine (0.45 parts by weight): a heat-reactive latent epoxy resin curing agent; "ADEKA HARDENER EH-3636AS" manufactured by ADEKA CORPORATION. (5) 2-Phenylon-4,5-Dihydroxymethylimidazolium (0.45 parts by weight): "CUREZOL 2PHZ" manufactured by SHIKOKU CHEMICALSCORPORATION (6) Spherical silica filler (60 parts by weight): “SC105G-MMQ: Spherical silica” (average particle size 0.3 μm) manufactured by ADMATECHS. (7) Silane coupling agent: 3-glycidyl etheroxypropyltrimethoxysilane (0.4 parts by weight), "KBM403" manufactured by SHIN-ETSU CHEMICAL CO.,LTD. (8) Colorant: Carbon black (1.9 parts by weight), "MA600B" manufactured by Mitsubishi Chemical Corporation (average particle size 28 nm). (Formation of the film used for the resin layer on the back) Prepare a release film with a release-treated surface. Then, apply the prepared back resin layer composition to the release-treated surface using a doctor blade coater. After coating, dry the back resin layer composition at 110°C for 2 minutes. The thickness of the dried back resin layer composition is 25 μm. Further, attach the release-treated surface of another release film to the back resin layer composition to create a back resin layer film (wafer back protective tape) consisting of the back resin layer composition sandwiched between two release films.

[0079] (Manufacturing of silicon chips with a back resin layer) A six-inch silicon wafer (350 μm thick) with a #2000 polished surface was prepared as the semiconductor substrate. A release film was peeled off from the back resin layer film, and the back resin layer film was attached to the silicon wafer to form a back resin layer (uncured base layer) on the semiconductor substrate. Specifically, the back resin layer film was attached by hot lamination at a roller temperature of 70°C and a roller speed of 0.3 m / min. Another release film contained in the back resin layer film was then peeled off. A 5 μm thick layer of white ink (Agfa, Wh04) was applied to the exposed back resin layer using a coating machine. Further, a UV irradiation machine (CSN2-40, GS Yuasa International Ltd.) was used at a UV irradiation of 360 mJ / cm². 2 The white ink was cured by irradiating it with ultraviolet light at an irradiation speed of 13 m / min. Further, a thermal curing process (130°C, 2 hours) was performed to cure the resin layer on the back side. Through this sequence, a semiconductor wafer with white ink was fabricated.

[0080] (Comparative Example) A comparative example semiconductor wafer was fabricated using the same sequence as in the embodiment. However, the order of the white ink coating and the thermal curing process (130°C, 2 hours) was reversed. Specifically, a back resin layer (base layer) was formed on the semiconductor substrate, and after removing another release film remaining on the back resin layer, a thermal curing process (130°C, 2 hours) was performed. Then, after the thermal curing process, the white ink was coated and UV cured.

[0081] (Adhesion test) Regarding the embodiments and comparative examples, adhesion tests were conducted on the white ink. Specifically, firstly, the shape of the white ink was photographed using a 20x microscope (KEYENCE, digital microscope VHX-7000) to obtain an initial image. Furthermore, the image was taken under side illumination (total illumination). Next, a dicing tape (manufactured by LINTEC Corporation, D-485H) was laminated onto the side opposite to the side where the white ink was formed. Then, a dicing machine (DISCOCORPORATION, DFD6362) was used to make cuts on the semiconductor wafer from the opposite side of the dicing tape (the side with the white ink) in a checkerboard pattern (100 squares in 10 columns and 10 rows) without reaching the back side. That is, the semiconductor wafer was half-diced. After half-dicing, dicing tape (manufactured by LINTEC Corporation, D-686H) was attached to the side where the white ink was formed. The semiconductor wafer was then left to stand for 10 minutes. After settling, the side of the dicing tape opposite to the side facing the semiconductor wafer is irradiated with UV light to allow for tape peeling. Following UV irradiation, the dicing tape is peeled from the side of the semiconductor wafer containing white ink at a perpendicular peeling angle. After peeling, an image of the white ink is obtained using a microscope and compared with the initial image to observe for any ink defects. Cases where no ink defects are observed are marked "○", and cases where ink defects are observed are marked "×".

[0082] (Results and Investigation) The results are shown in Table 1.

[0083] [Table 1]

[0084] As shown in Table 1, the Examples exhibit higher adhesion compared to the Comparative Examples. Since the Comparative Examples were in a cured state when the ink was applied, the ink peeled off from the substrate. In contrast, the Examples applied the ink to an uncured substrate (back resin layer). This resulted in higher adhesion.

[0085] (Postscript) The main components of this invention are summarized below as an appendix.

[0086] (Postscript 1) A method for manufacturing a semiconductor device includes: a substrate layer forming step (S1) in which a substrate layer 3 formed of a curable resin composition is formed on a semiconductor substrate 2; an ink marking step (S2) in which an identity determination mark 4 for determining the identity of a semiconductor device 1 is applied to the substrate layer 3 using ink; and a curing step (S3) in which the substrate layer 3 is cured after the ink marking step.

[0087] (Postscript 2) According to the semiconductor device manufacturing method described in Appendix 1, the substrate layer formation step (S1) includes the step of forming a substrate layer 3 on the back side of the semiconductor substrate 2.

[0088] (Note 3) According to the semiconductor device manufacturing method described in Appendix 1 or 2, the substrate layer formation step (S1) includes the step of forming a substrate layer 3 by laminating a substrate layer forming film containing a curable resin composition onto the back side of a semiconductor substrate.

[0089] (Postscript 4) The method for manufacturing a semiconductor device according to any one of Appendices 1 to 3, wherein the curable resin composition is thermosetting; the curing step (S3) includes a step of curing the substrate layer 3 by thermal curing.

[0090] (Note 5) According to any one of the appendices 1 to 4, in the method for manufacturing a semiconductor device, the ink has curability; the ink marking step (S2) includes: a step of coating ink on a substrate layer 3; and a step of curing the coated ink.

[0091] (Note 6) A method for determining the identity of a semiconductor device includes: a step of manufacturing a genuine semiconductor device using the manufacturing method described in any one of Appendices 1 to 5; a step of photographing an identity determination mark during or after the manufacturing of the genuine device to generate genuine device data displaying the identity determination mark; a step of photographing an identity determination mark of a semiconductor device that is the object of determination to generate object data displaying the identity determination mark; and a step of determining whether the object of determination is the same article as the genuine device based on the genuine device data and the object data.

[0092] (Note 7) According to the identity determination method described in Appendix 6, the steps of generating genuine product data and generating object data for determination each include the step of photographing the identity determination mark using a microscope.

[0093] (Postscript 8) A semiconductor device manufacturing system includes: a substrate forming apparatus 21 for forming a substrate layer formed of a curable resin composition on a semiconductor substrate; and an ink marking apparatus 22 for applying an ink mark to the substrate layer for determining the identity of the semiconductor device.

[0094] (Note 9) The semiconductor device manufacturing system according to Appendix 8 further includes a curing apparatus 24 for curing a substrate layer endowed with an identity determination mark.

[0095] (Postscript 10) The semiconductor device manufacturing system according to Appendix 8 or 9 further includes a photographing device 23 for photographing a mark for identity determination.

[0096] (Postscript 11) The semiconductor device manufacturing system according to Appendix 10 further includes a feature quantity calculation device for calculating feature quantities from an image captured by the imaging device 23.

[0097] (Postscript 12) The semiconductor device manufacturing system according to any one of Appendices 8 to 11, wherein the substrate layer forming apparatus 21 and the ink marking apparatus 22 are integrated.

[0098] (Postscript 13) According to the semiconductor device manufacturing system described in Appendix 10, the substrate layer forming apparatus 21, the ink marking apparatus 22, and the imaging apparatus 23 are integrated.

[0099] (Postscript 14) According to the semiconductor device manufacturing system described in Appendix 12 or 13, the curable resin composition has thermosetting properties.

[0100] (Reference-based citation) This application claims priority based on Japanese Patent Application No. 2023-185889 (filed on October 30, 2023) and Japanese Patent Application No. 2023-185890 (filed on October 30, 2023), the contents of which are incorporated herein by reference.

[0101] Explanation of reference numerals in the attached figures 1: Semiconductor device; 2: Semiconductor substrate; 3: Substrate layer; 4: Identification mark; 5: Semiconductor wafer; 6: Ink; 7: Imaging device; 9: Blade; 10: Cutting tape; 11: Semiconductor chip; 20: Semiconductor device manufacturing system; 21: Substrate layer forming apparatus; 22: Ink marking device; 23: Imaging device; 24: Curing apparatus.

Claims

1. A method for manufacturing a semiconductor device, comprising: The substrate formation process forms a substrate layer made of a curable resin composition on a semiconductor substrate; In the ink marking process, ink is used to apply an identity determination mark for identifying the identity of semiconductor devices to the substrate layer; and The curing process is performed after the ink marking process to cure the substrate layer.

2. The method for manufacturing a semiconductor device according to claim 1, wherein, The substrate formation process includes the process of forming the substrate layer on the back side of the semiconductor substrate.

3. The semiconductor device according to claim 1 or 2, wherein, The substrate formation process includes the following steps: forming the substrate by laminating a substrate forming film containing the curable resin composition onto the back side of a semiconductor substrate.

4. The manufacturing method according to claim 1 or 2, wherein, The curable resin composition has thermosetting properties. The curing process includes a step of curing the substrate layer by heat curing.

5. The manufacturing method according to claim 1 or 2, wherein, The ink has curable properties. The ink marking process includes: The process of coating the ink onto the substrate layer; and The process of curing the applied ink.

6. A method for determining the identity of a semiconductor device, comprising: The process of manufacturing a genuine semiconductor device using the manufacturing method described in claim 1 or 2; The process of photographing the identity determination mark during or after the manufacture of the genuine article, and generating genuine article data displaying the identity determination mark of the genuine article; The steps of photographing the identity determination mark of the semiconductor device, which is the object of determination, and generating object data displaying the identity determination mark of the object of determination; and The process of determining whether the object to be determined is the same item as the genuine product based on the data of the genuine product and the data of the object to be determined.

7. The identity determination method according to claim 6, wherein, The process of generating the data on the genuine product and the process of generating the data on the object to be determined each include the process of photographing the mark used for identity determination using a microscope.

8. A semiconductor device manufacturing system comprising: A substrate forming apparatus for forming a substrate layer on a semiconductor substrate, comprising a substrate layer formed of a curable resin composition; and An ink marking device that uses ink to apply an identity determination mark to the substrate layer for determining the identity of semiconductor devices.

9. The semiconductor device manufacturing system according to claim 8, further comprising a curing apparatus for curing a substrate layer to which the identity determination mark is applied.

10. The semiconductor device manufacturing system according to claim 8, further comprising an imaging device for imaging the identity determination mark.

11. The semiconductor device manufacturing system according to claim 10, further comprising a feature quantity calculation device for calculating feature quantities from an image captured by the imaging device.

12. The semiconductor device manufacturing system according to claim 8, wherein, The substrate forming apparatus and the ink marking apparatus are integrated.

13. The semiconductor device manufacturing system according to claim 10, wherein, The substrate forming device, the ink marking device, and the imaging device are integrated into one unit.

14. The semiconductor device manufacturing system according to claim 12 or 13, wherein, The curable resin composition is thermosetting.

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