A polishing fixed adhesive tape with a buffer structure and a preparation method thereof

Abstract

The present application relates to the field of adhesive tape, in particular to a grinding fixed adhesive tape with a buffer structure and a preparation method thereof, the preparation method comprising the following steps: preparing a substrate layer, and pretreating the substrate layer; preparing a functional buffer layer on one surface of the substrate layer, and coating an adhesive on the other surface of the substrate layer, so as to obtain the adhesive tape. The adhesive tape can not only provide dynamic vibration buffering performance to protect ultra-thin wafers, but also realize quick, clean and non-destructive separation between the adhesive tape and a vacuum chuck, so as to meet the high yield and high reliability requirements of ultra-thin wafer processing in advanced semiconductor manufacturing.

Description

Technical Field

[0001] This invention relates to the field of adhesive tapes, and more specifically, to an abrasive fixing tape with a buffer structure and a method for preparing the same. Background Technology

[0002] As integrated circuits evolve towards higher density, smaller size, and three-dimensional integration, wafer stacking technology is becoming increasingly widely used, which places extremely high demands on wafer thickness. To achieve stacking, wafers need to be thinned to below 100 micrometers (μm), or even to an ultra-thin state of 50 μm or less. In this ultra-thinning process, the wafer needs to be attached to a rigid support ring using temporary fixing tape (commonly known as a thinning film or UV film), and then mounted on the rotary table of the thinning equipment for grinding and polishing.

[0003] However, when the wafer thickness is reduced to 50 μm or less, its mechanical strength decreases significantly, its rigidity weakens drastically, and it becomes extremely brittle. Existing temporary fixing tapes are clearly inadequate in dealing with the high-speed shear vibrations generated during the thinning process, leading to a series of technical problems: 1. Wafer loss due to insufficient vibration damping capacity: Thinning equipment, especially high-speed rotating grinding heads, generates high-frequency mechanical vibrations and shear stresses during processing. These vibrations are transmitted to the ultrathin wafer through support rings and temporary fixing tapes. While existing tapes generally possess some viscoelasticity, their dynamic buffering and energy dissipation capabilities are limited, failing to effectively absorb and isolate these high-frequency vibrations. As a result, the vibration energy acts directly on the wafer, causing defects such as microcracks and edge chipping at the wafer edges, or even overall wafer breakage, leading to decreased product yield and cost losses. Some existing technologies attempt to improve buffering by increasing the thickness of the adhesive layer, but this often results in unsatisfactory vibration absorption due to the poor damping properties of the material itself. Furthermore, excessively thick adhesive layers may introduce other process problems, such as positional displacement caused by adhesive layer rheology.

[0004] 2. Separation issue after the back of the tape adheres to the vacuum suction cup: After the thinning process is complete, the tape containing the wafer needs to be removed from the vacuum chuck of the thinning equipment. Currently, most tapes have a smooth, flat back side (non-adhesive side) to ensure reliable airtight adhesion with the vacuum chuck. However, after the vacuum is released, atmospheric pressure cannot act instantaneously and uniformly between the tape and the chuck, easily creating a localized negative pressure zone at the interface. This causes the tape to "adhere" to the chuck, making it difficult to peel off smoothly. This phenomenon not only affects production efficiency but may also cause secondary stress damage to the already thinned, fragile wafer during forced separation. Summary of the Invention

[0005] The purpose of this invention is to provide a grinding and fixing tape with a buffer structure, which can provide excellent dynamic vibration buffering performance to protect ultrathin wafers, and can also achieve rapid, clean and non-destructive separation from vacuum chucks, so as to meet the high yield and high reliability requirements of ultrathin wafer processing in advanced semiconductor manufacturing.

[0006] Another object of the present invention is to provide a method for preparing an abrasive fixing tape with a buffer structure, wherein the buffer layer is composed of thermally expandable microspheres uniformly coated on the surface. These microspheres are solid particles before being heated. The microspheres form a microscopic air cushion array on the surface of the buffer layer.

[0007] The technical problem solved by this invention is achieved by the following technical solution.

[0008] On one hand, embodiments of the present invention provide a method for preparing an abrasive fixing tape with a buffer structure, comprising the following steps: Prepare the substrate layer and pretreat the substrate layer; Preparation of functional buffer layer: Methacrylic acid, n-butyl acrylate, 2-2-ethylhexyl acrylate, acrylic acid and toluene are mixed, heated to 60°C and kept at that temperature for 1 hour. An initiator is added, the temperature is raised to 65°C and reacted for 7 hours. Then the temperature is raised to 75°C and cured for 2 hours to obtain the adhesive for the buffer layer. The foamed microspheres and toluene were mixed and dispersed evenly to obtain a pre-dispersion. The pre-dispersed liquid and adhesive are mixed and stirred at 1000 rpm, while epoxy curing agent is added at the same time to disperse evenly and obtain buffer layer coating. The buffer layer coating is applied to one surface of the substrate layer and heated to cause the buffer layer coating to foam and expand, forming a functional buffer layer with an air cushion structure. The adhesive is then applied to the other surface of the substrate layer to obtain the tape.

[0009] In some embodiments of the present invention, the functional buffer layer comprises, by weight, the following raw materials: 20-30 parts methacrylic acid, 40-50 parts n-butyl acrylate, 10-20 parts 2-2 ethylhexyl acrylate, 10-20 parts acrylic acid, 0.5-1 parts initiator, 20-40 parts foamed microspheres, and 0.5-1 parts epoxy curing agent.

[0010] In some embodiments of the present invention, the functional buffer layer comprises, by weight, the following raw materials: 30 parts methacrylic acid, 50 parts n-butyl acrylate, 10 parts 2-2 ethylhexyl acrylate, 10 parts acrylic acid, 1 part initiator, 40 parts foamed microspheres, and 1 part epoxy curing agent.

[0011] In some embodiments of the present invention, the substrate layer is made of one of PET, PE, PVC, and PO. In some embodiments of the present invention, the adhesive is a heat-resistant adhesive or a UV-resistant adhesive.

[0012] In some embodiments of the present invention, the foamed microspheres include a shell and a core. The shell is formed by suspension polymerization of at least one of acrylonitrile monomer, methyl methacrylate monomer, and acrylate monomer. The shell has a thickness of about 2-15 micrometers and has excellent mechanical properties and thermoplastic characteristics.

[0013] The core is a C4-C12 alkane blowing agent. It mainly uses low-boiling-point hydrocarbons such as isopentane, isobutane, and n-pentane. These blowing agents are liquid at room temperature and are sealed inside the polymer shell.

[0014] In some embodiments of the present invention, the initiator is azobisisobutyronitrile.

[0015] In some embodiments of the present invention, the thickness of the functional buffer layer after drying is 30-100 μm, and more preferably, the thickness after drying is 30-60 μm.

[0016] On the other hand, embodiments of the present invention provide an abrasive fixing tape with a buffer structure, which is prepared by the above method.

[0017] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects: The tape provided by this invention has both excellent vibration damping performance and easy peeling characteristics, thereby effectively absorbing mechanical vibration during the ultra-thin wafer thinning process and achieving rapid and non-destructive separation from the vacuum tray after the process is completed.

[0018] Specifically, during the tape manufacturing process, by heating to a specific temperature, the foamed microspheres expand, forming a hollow, closed-cell "balloon" structure. These uniformly distributed microspheres constitute a microscopic air cushion array on the surface of the buffer layer. When vibrations and stresses occur during the thinning process, this air cushion array can effectively absorb and dissipate energy through the elastic deformation of the microspheres, thus providing excellent buffer protection for the ultrathin wafer below. Simultaneously, the uneven microscopic surface structure formed by the expanded microspheres creates numerous microscopic exhaust channels between the tape and the vacuum tray. When vacuum adsorption is released, external air can quickly enter the interface through these channels, balancing the pressure and completely avoiding vacuum adsorption, achieving rapid and non-destructive separation of the tape and tray. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a SEM image of the functional buffer layer in Embodiment 1 of the present invention; Figure 2 This is a physical image of the grinding and fixing tape with a buffer structure according to Embodiment 1 of the present invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other. The present invention will now be described in detail with reference to specific embodiments.

[0023] Example 1 Prepare the raw materials for the functional buffer layer according to the following proportions: 30 parts methacrylic acid, 50 parts n-butyl acrylate, 10 parts 2-2 ethylhexyl acrylate, 10 parts acrylic acid, 1 part initiator, 20 parts foamed microspheres, and 1 part epoxy curing agent.

[0024] The epoxy curing agent is hyperbranched bisphenol A epoxy resin produced by Shanghai Huayi Resin Co., Ltd., model AG-602.

[0025] Prepare the tape by following these steps: Prepare the substrate layer (PET) and pre-treat the substrate layer by cleaning surface stains, etc. Preparation of functional buffer layer: Methacrylic acid, n-butyl acrylate, 2-2-ethylhexyl acrylate, acrylic acid and toluene (60% of the total volume of the remaining raw materials) are mixed, heated to 60°C and kept at that temperature for 1 hour. An initiator (azobisisobutyronitrile) is added, the temperature is raised to 65°C and reacted for 7 hours. Then the temperature is raised to 75°C and cured for 2 hours to obtain the adhesive for the buffer layer. The adhesive polymerized in this embodiment was subjected to frequency conversion testing at 25°C using a rotational rheometer. The elastic modulus at 35Hz was 5 x 10⁻⁶. 6 MPa.

[0026] 20 parts of foamed microspheres and toluene were mixed in a 1:1 weight ratio and dispersed evenly to obtain a pre-dispersion. The pre-dispersed liquid and the above-mentioned adhesive are mixed and stirred at a speed of 1000 rpm, while epoxy curing agent is added at the same time to disperse evenly and obtain a buffer layer coating. Based on wet weight 150g / m 2 A buffer layer coating is applied to one surface of the substrate layer and heated to 120°C, causing the coating to foam and expand, forming a functional buffer layer with an air cushion structure. The microstructure of the functional buffer layer is then observed. Figure 1 As shown.

[0027] The adhesive is then applied to the other surface of the substrate layer to obtain the tape, such as... Figure 2 As shown.

[0028] This adhesive is a UV tack reducer, manufactured by Sanwa Coatings Industry Co., Ltd., model GD05-5. The mixing ratio of GD05-5 with initiator TPO and curing agent SC-5EX is 100:2.5:0.35. The application rate is 100g / m² of wet adhesive. 2 .

[0029] Example 2 The buffer layer adhesive in this embodiment is the same as that in Embodiment 1.

[0030] The main difference is that 25 parts of foamed microspheres and toluene are mixed in a 1:1 weight ratio and dispersed evenly to obtain a pre-dispersion. The remaining steps are the same as in Example 1.

[0031] Example 3 The adhesive used for the buffer layer of this structure is the same as that used in Example 1.

[0032] The main difference is that 40 parts of foamed microspheres and toluene are mixed in a 1:1 weight ratio and dispersed evenly to obtain a pre-dispersion; the remaining steps are the same as in Example 1.

[0033] Example 4 Prepare the raw materials for the functional buffer layer according to the following proportions: 30 parts methacrylic acid, 50 parts n-butyl acrylate, 10 parts 2-2 ethylhexyl acrylate, 10 parts acrylic acid, 0.4 parts initiator, 25 parts foamed microspheres, and 1 part epoxy curing agent.

[0034] Methacrylic acid, n-butyl acrylate, 2-2-ethylhexyl acrylate, acrylic acid and toluene are mixed, heated to 60°C and kept at that temperature for 1 hour. An initiator (azobisisobutyronitrile) is added, the temperature is raised to 65°C and reacted for 7 hours. Then the temperature is raised to 75°C and cured for 2 hours to obtain the adhesive for the buffer layer. The adhesive polymerized in this embodiment was subjected to frequency conversion testing at 25°C using a rotational rheometer. The elastic modulus at 35Hz was 8*10. 6 MPa.

[0035] 25 parts of foamed microspheres and toluene were mixed in a 1:1 weight ratio and dispersed evenly to obtain a pre-dispersion. The pre-dispersed liquid and adhesive are mixed and stirred at 1000 rpm, while epoxy curing agent is added at the same time to disperse evenly and obtain buffer layer coating. The buffer layer coating is applied to one surface of the substrate layer and heated to cause the buffer layer coating to foam and expand, forming a buffer layer with an air cushion structure. The adhesive is then applied to the other surface of the substrate layer to obtain the tape.

[0036] The adhesive is a UV tack reducer, manufactured by Sanwa Coatings Industry Co., Ltd., model GD05-5. The mixing ratio of GD05-5 with initiator TPO and curing agent SC-5EX is 100:2.5:0.35. The coating amount is 100g / m² of wet adhesive. 2 .

[0037] Comparative Example 1 Prepare the raw materials for the functional buffer layer according to the following proportions: 30 parts methacrylic acid, 50 parts n-butyl acrylate, 10 parts 2-2 ethylhexyl acrylate, 10 parts acrylic acid, 1.5 parts initiator, 25 parts foamed microspheres, and 1 part epoxy curing agent.

[0038] Methacrylic acid, n-butyl acrylate, 2-2-ethylhexyl acrylate, acrylic acid and toluene (60% of the total volume of the remaining raw materials) are mixed, heated to 60°C and kept at that temperature for 1 hour. An initiator (azobisisobutyronitrile) is added, the temperature is raised to 65°C and reacted for 7 hours. Then the temperature is raised to 75°C and cured for 2 hours to obtain the adhesive for the buffer layer. The adhesive polymerized in this embodiment was subjected to frequency conversion testing at 25°C using a rotational rheometer. The elastic modulus at 35Hz was 4*10. 6 MPa.

[0039] 25 parts of foamed microspheres and toluene were mixed in a 1:1 weight ratio and dispersed evenly to obtain a pre-dispersion. The pre-dispersed liquid and adhesive are mixed and stirred at 1000 rpm, while epoxy curing agent is added at the same time to disperse evenly and obtain buffer layer coating. The buffer layer coating is applied to one surface of the substrate layer and heated to cause the buffer layer coating to foam and expand, forming a buffer layer with an air cushion structure. The adhesive is then applied to the other surface of the substrate layer to obtain the tape.

[0040] The adhesive is a UV tack reducer, manufactured by Sanwa Coatings Industry Co., Ltd., model GD05-5. The mixing ratio of GD05-5 with initiator TPO and curing agent SC-5EX is 100:2.5:0.35. The coating amount is 100g / m² of wet adhesive. 2 .

[0041] Comparative Example 2 Prepare the raw materials for the functional buffer layer according to the following proportions: 30 parts methacrylic acid, 50 parts n-butyl acrylate, 10 parts 2-2 ethylhexyl acrylate, 10 parts acrylic acid, 0.1 parts initiator, 25 parts foamed microspheres, and 1 part epoxy curing agent.

[0042] Methacrylic acid, n-butyl acrylate, 2-2-ethylhexyl acrylate, acrylic acid and toluene are mixed, heated to 60°C and kept at that temperature for 1 hour. An initiator (azobisisobutyronitrile) is added, the temperature is raised to 65°C and reacted for 7 hours. Then the temperature is raised to 75°C and cured for 2 hours to obtain the adhesive for the buffer layer. The adhesive polymerized in this embodiment was subjected to frequency conversion testing at 25°C using a rotational rheometer. The elastic modulus at 35Hz was 8*10. 6 MPa.

[0043] 25 parts of foamed microspheres and toluene were mixed in a 1:1 weight ratio and dispersed evenly to obtain a pre-dispersion. The pre-dispersed liquid and adhesive are mixed and stirred at 1000 rpm, while epoxy curing agent is added at the same time to disperse evenly and obtain buffer layer coating. The buffer layer coating is applied to one surface of the substrate layer and heated to cause the buffer layer coating to foam and expand, forming a buffer layer with an air cushion structure. The adhesive is then applied to the other surface of the substrate layer to obtain the tape.

[0044] The adhesive is a UV tack reducer, manufactured by Sanwa Coatings Industry Co., Ltd., model GD05-5. The mixing ratio of GD05-5 with initiator TPO and curing agent SC-5EX is 100:2.5:0.35. The wet application rate is 100 g / m². 2 .

[0045] Comparative Example 3 The difference from Example 4 is that 60 parts of foamed microspheres were added to the functional buffer layer, while the remaining raw material ratios and tape preparation methods are the same as in Example 4.

[0046] Comparative Example 4 The difference from Example 4 is that the drying temperature of the buffer layer is 140°C, while the remaining raw material ratios and tape preparation methods are the same as in Example 4.

[0047] Experimental Example The testing methods for each data point are as follows: 1. Test the elastic modulus of the adhesive at a frequency of 35Hz. Sample preparation: The sample needs to be made into a round disc with a diameter of 20 / 25 / 60mm and a thickness of 1-3mm; ensure that the sample is uniform and free of air bubbles.

[0048] Instrument settings: Select parallel plate or conical plate clamp (common diameter 25mm); Set temperature: usually 25℃ (adjust according to the adhesive's operating temperature); Set strain: usually 0.05% (must be within the linear viscoelastic region); Set frequency: 35Hz; Set gap: parallel plate gap is adjustable, conical plate is 1° taper.

[0049] Test mode: Select dynamic oscillation mode; Frequency scan range: 0.1-100 rad / s (including the corresponding frequency of 35Hz); Test time: set according to the characteristics of the sample, usually a few minutes to tens of minutes.

[0050] Data acquisition: The instrument automatically records parameters such as elastic modulus G', viscous modulus G'', and phase angle δ; the elastic modulus at 35Hz frequency is directly read from the frequency scanning curve.

[0051] 2. Buffer layer thickness The thickness of the dried buffer layer was measured using a thickness gauge. Five values ​​were taken at each test point, and the average value was used to obtain the thickness data.

[0052] 3. Acceleration transmissibility Acceleration transmissibility = Mass block acceleration / Vibration table surface acceleration.

[0053] According to the national standard GB / T 8169-2008 "Test Method for Vibration Transmission Characteristics of Packaging Cushioning Materials", the test method is as follows: The testing system consists of a mass block, a buffer material, a fixing device, and a vibration table, simulating the stress state of the buffer material under sinusoidal vibration. By measuring the acceleration signals of the vibration table surface (excitation end) and the mass block (response end), the acceleration transmissibility at different frequencies is calculated, and finally, data is selected at a frequency of 35Hz.

[0054] 4. Vacuum peeling state Test method: The buffer surface of the material is attached to the vacuum stage, and then 10... -6Fix the vacuum degree at Pa, and press a 2 Kg weight on the buffer surface during the fixing process. After 2 Hr, remove the weight and evacuate the vacuum. Then flip the vacuum table to observe whether the material will peel off due to its own weight. If it can peel off, it is in a qualified state; otherwise, it is unqualified.

[0055] 5. Compression deformation rate Initial thickness measurement: Measure the initial thickness h0 at the center position of the specimen; measure 3 points for each specimen and take the average value.

[0056] Compress the specimen: Place the specimen in the compression fixture; press it with a 5 Kg weight above the specimen to keep the specimen in a compressed state.

[0057] Constant temperature treatment: Place the compression fixture in the constant temperature oven; keep it at the specified temperature for the specified time; common conditions: 70°C × 24 h.

[0058] Recovery: Take out the compression fixture and remove the weight; take out the specimen and freely recover it at the standard laboratory temperature for 30 ± 3 min.

[0059] Final thickness measurement: Measure the thickness h1 of the specimen after recovery; the measurement position is the same as the initial thickness; Compression permanent deformation rate = [(h0 - h1) / (h0)] × 100%.

[0060] 6. Abrasion resistance test Friction testing machine: Rotary friction testing machine; Friction head: Steel ball with a diameter of 6 mm; Load range: Adjustable from 0.1 - 10 N; Friction stroke: Adjustable from 10 - 50 mm; Frequency: Adjustable from 1 - 5 Hz.

[0061] Fixing fixture: Used to fix the buffer layer specimen to ensure that the specimen does not move during the test; The surface of the fixture is flat and has a sufficient contact area with the specimen.

[0062] Observation equipment: Digital camera (used to record the surface topography).

[0063] Specimen size: 50 mm × 50 mm × thickness; The thickness is determined according to the actual buffer layer thickness, usually 2 mm; The surface of the specimen should be flat and defect-free. At least 3 specimens are required for each group.

[0064] Adjust at the standard laboratory temperature (23 ± 2°C) for at least 24 hours; Relative humidity 50 ± 5%.

[0065] Specimen installation: Fix the specimen on the working table of the testing machine to ensure the surface is flat; Adjust the position of the friction head so that it is perpendicular to the surface of the specimen.

[0066] Load: 2 N; Friction stroke: 25 mm; Frequency: 2 Hz; Number of friction times: 100 times; Start the testing machine and begin the friction test; observe the changes on the sample surface during the test. Stop the test after the set number of friction cycles has been reached; remove the sample and clean the surface.

[0067] 7. Result Evaluation No damage (qualified): No visible wear marks on the surface; no peeling, fuzzing, or bubbling of the foam layer; no obvious change in surface color.

[0068] Surface damage (unacceptable): Obvious wear marks appear on the surface; the foam layer peels off, frays, or bubbles; the surface color becomes significantly darker or lighter; wear debris or powder appears.

[0069] The test results are shown in Table 1.

[0070] Table 1

[0071] Comparative Examples 1-2 show that the elastic modulus of the adhesive used for the buffer layer needs to be 5*10 at a frequency of 35Hz. 6 Up to 8*10 6 If the elastic modulus is too small, the compression deformation rate after grinding will be too large, affecting the thickness of the ground product. If it is too large, it will affect the acceleration transmission rate, thus failing to provide a buffering effect.

[0072] Comparative Example 3 shows that the amount of foamed microspheres added should be less than 60% by weight. Too much will cause the buffer layer to fall off after drying, affecting the buffering effect.

[0073] Comparative Example 4 shows that the product's heating temperature needs to be less than 140℃. Excessive temperature will cause unevenness on the cushioning surface, affecting the appearance and reducing the cushioning effect.

[0074] The embodiments described above are some, but not all, embodiments of the present invention. The detailed description of the embodiments of the present invention is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

Claims

1. A method for preparing an abrasive fixing tape with a buffer structure, characterized in that, Includes the following steps: Prepare the substrate layer and pretreat the substrate layer; Preparation of functional buffer layer: Methacrylic acid, n-butyl acrylate, 2-2-ethylhexyl acrylate, acrylic acid and toluene are mixed, heated to 60°C and kept at that temperature for 1 hour. An initiator is added, the temperature is raised to 65°C and reacted for 7 hours. Then the temperature is raised to 75°C and cured for 2 hours to obtain the adhesive for the buffer layer. The foamed microspheres and toluene were mixed and dispersed evenly to obtain a pre-dispersion. The pre-dispersed liquid and adhesive are mixed and stirred at 1000 rpm, while epoxy curing agent is added at the same time to disperse evenly and obtain a buffer layer coating. The buffer layer coating is applied to one surface of the substrate layer and heated to cause the buffer layer coating to foam and expand, forming a functional buffer layer with an air cushion structure. The adhesive is then applied to the other surface of the substrate layer to obtain the tape.

2. The method for preparing the grinding and fixing tape with a buffer structure according to claim 1, characterized in that, The functional buffer layer comprises, by weight, the following raw materials: 20-30 parts methacrylic acid, 40-50 parts n-butyl acrylate, 10-20 parts 2-2 ethylhexyl acrylate, 10-20 parts acrylic acid, 0.5-1 parts initiator, 20-40 parts foamed microspheres, and 0.5-1 parts epoxy curing agent.

3. The method for preparing the grinding and fixing tape with a buffer structure according to claim 2, characterized in that, The functional buffer layer comprises, by weight, the following raw materials: 30 parts methacrylic acid, 50 parts n-butyl acrylate, 10 parts 2-2 ethylhexyl acrylate, 10 parts acrylic acid, 1 part initiator, 40 parts foamed microspheres, and 1 part epoxy curing agent.

4. The method for preparing the grinding and fixing tape with a buffer structure according to claim 1, characterized in that, The substrate layer is made of one of PET, PE, PVC, or PO.

5. The method for preparing the grinding and fixing tape with a buffer structure according to claim 1, characterized in that, The adhesive is a heat-resistant adhesive or a UV-resistant adhesive.

6. The method for preparing the grinding and fixing tape with a buffer structure according to claim 1, characterized in that, The foamed microspheres include a shell and a core. The shell is formed by suspension polymerization of at least one of acrylonitrile monomer, methyl methacrylate monomer, and acrylate monomer. The core is a C4-C12 alkane foaming agent.

7. The method for preparing the grinding and fixing tape with a buffer structure according to claim 2, characterized in that, The initiator is azobisisobutyronitrile.

8. The method for preparing the grinding and fixing tape with a buffer structure according to claim 1, characterized in that, The thickness of the functional buffer layer after drying is 30-100 μm.

9. A grinding and fixing tape with a buffer structure, characterized in that, It is prepared by the preparation method according to any one of claims 1-8.

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