Wafer automatic loading and unloading semiconductor vacuum coating device

Abstract

The application discloses a kind of semiconductor vacuum coating device of wafer automatic feeding and discharging, belong to vacuum coating equipment technical field, by pushing sliding seat up, rotating shaft drives dial, swing rod and wafer up, upper dial contact slide after being pressed and rotated, rotating shaft and wafer are rotated, dial passes through the clearance between slide after, swing rod is positioned by the elastic force of tension spring, wafer completes one hundred and eighty degrees turnover and makes the surface to be coated upward, multi-stage electric push rod is retracted, sliding seat is lowered and reset, after completing one side coating, multi-stage electric push rod is elongated again, and similarly, wafer is turned over one hundred and eighty degrees and makes the coating surface downward, then multi-stage electric push rod is retracted, wafer is lowered and contacted with the sealing ring of supporting plate, wafer coating surface is isolated by upper sealing ring, lower sealing ring and supporting plate, supporting plate, to ensure protection and fixation, prevent the tiny particles generated in the process of film material gasification and the heat generated act on wafer on other stations, ensure the uniformity of film thickness when subsequent coating.

Description

Technical Field

[0001] This invention relates to the field of vacuum coating equipment technology, specifically to a semiconductor vacuum coating device for automatic wafer loading and unloading. Background Technology

[0002] As the core engine of modern technological development, the precision of the semiconductor manufacturing process directly determines the performance boundaries and market competitiveness of electronic products. Vacuum coating technology, as a key core process in wafer manufacturing, vaporizes film materials into atoms, molecules or ions and deposits them on the wafer surface in a highly controllable vacuum environment. This process constructs microscale conductive, insulating and functional layers for semiconductor devices and is an essential step in achieving high performance and high reliability of chips.

[0003] In the vacuum coating process of wafers, multi-station vacuum coating equipment is often used to improve coating efficiency. When multiple stations are feeding wafers simultaneously, the coating mechanism is in operation. During the operation, the tiny particles generated during the vaporization of the film material will directly affect other stations that are feeding or waiting to be fed. This will cause the heat and tiny particles generated by the coating mechanism to diffuse to the surface of the wafer in the feeding station, affecting the temperature stability of the wafer to be fed, and thus leading to uneven film thickness and abnormal performance during subsequent coating. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor vacuum coating apparatus for automatic wafer loading and unloading, in order to solve the problem mentioned in the background art that when multiple workstations are simultaneously performing wafer feeding operations, the coating mechanism is in operation, and the tiny particles generated during the vaporization of the film material during its operation directly affect other workstations that are feeding or waiting to be fed, causing the heat and tiny particles generated by the coating mechanism during operation to diffuse to the wafer surface in the feeding workstation.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A semiconductor vacuum coating apparatus for automatic wafer loading and unloading includes a vacuum coating machine. A housing is mounted on the vacuum coating machine, and a sealed door is located at the front of the housing. A coating mechanism is installed through the top of the vacuum coating machine. A work frame is installed inside the vacuum coating machine, and a support bearing is inserted through the middle of the work frame. A turntable is rotated inside the support bearing, and a support column is fixed to the middle of the turntable. The top of the support column is rotatably connected to the top of the inner wall of the housing via a bushing. A drive assembly is fixed at the bottom center of the turntable and is installed at the bottom of the work frame. Three support assemblies are fixedly connected to the turntable, and each support assembly has an adsorption device on its top. The device includes a limiting component, one end of which penetrates the turntable and is installed at the bottom edge of the turntable. The other end of the limiting component is fixedly connected to an automatic flipping component. Reset components are fixed on both sides of the automatic flipping component. The bottom of the reset component is fixed to the turntable. A sliding component is attached to the end of the automatic flipping component near the limiting component. A horizontal groove is provided on the turntable corresponding to the position of the sliding component. The bottom of the sliding component is slidably connected in the horizontal groove. An annular groove is provided on the bottom of the turntable. An ejection component is slidably installed in the annular groove. Sliding holes are provided on the three ends of the ejection component in the turntable, and all three sliding holes are connected to the annular groove.

[0007] As a further embodiment of the present invention, the drive assembly includes a motor and a deflection frame. The motor is fixed to the bottom of the inner wall of the work frame. A sector-shaped disk is fixedly connected to the output shaft of the motor. An extension rod is fixed in the middle of the sector-shaped disk. The extension rod consists of a vertical section and an inclined section. A sliding column is fixed to the inclined section at the top of the extension rod. A fixed shaft is fixed to the top of the deflection frame. The top end of the fixed shaft is fixed to the bottom of the turntable. Three sliding grooves and three arc-shaped grooves are provided on the outside of the deflection frame. The sliding grooves and arc-shaped grooves are staggered. The outer arc surface of the sector-shaped disk is in contact with the inner wall of one of the arc-shaped grooves. The sliding column is slidably connected in one of the sliding grooves.

[0008] As a further embodiment of the present invention, the support assembly includes a slide cylinder, the bottom end of which is fixedly connected to a turntable, a rectangular slide block is slidably connected inside the slide cylinder, a support plate is fixed to the top of the rectangular slide block, an upper and lower sealing ring is provided on the support plate, and a buffer spring is fixed between the bottom of the rectangular slide block and the bottom of the inner wall of the slide cylinder.

[0009] As a further embodiment of the present invention, the adsorption limiting component includes a support plate, an adsorption cover is provided at the bottom of the support plate, a rotary joint is installed through one side of the adsorption cover through the support plate, a rotatable air guide tube is sleeved in the rotary joint, a sleeve is slidably sleeved on the outside of the air guide tube, and the bottom end of the air guide tube is connected to the inside of the sleeve, the bottom end of the sleeve passes through the turntable and is connected to a micro pump, the micro pump is installed at the bottom of the turntable, and an upper sealing ring is installed at the bottom of the support plate corresponding to the position of the lower sealing ring.

[0010] As a further embodiment of the present invention, the automatic flipping assembly includes a sliding seat, a rotating shaft rotatably extending through the middle of the sliding seat, one end of the rotating shaft being fixed to one side of a support plate, two extended ends of the rotating shaft being respectively equipped with dials, the included angle between the two dials being 90 degrees, a swing rod being fixed to the end of the rotating shaft away from the support plate, a tension spring being sleeved between the other end of the swing rod and the extended end of the bottom of the sliding seat, and stop posts being fixed to both sides of the sliding seat near the swing rod, the swing rod resting on one of the stop posts.

[0011] As a further embodiment of the present invention, the reset assembly includes a fixed frame, the bottom of which is fixedly connected to a turntable. Slide tracks are respectively provided on both sides of the fixed frame, and guide blocks are slidably connected within the slide tracks. Two guide blocks are respectively fixed to both sides of a sliding seat. A slide rod slides through the middle of each guide block, and the two ends of the slide rod are fixed to the upper and lower sides inside the slide track. A reset spring is sleeved on the slide rod, and the reset spring is fixed between the top of the guide block and the top of the inner wall of the slide track.

[0012] As a further embodiment of the present invention, the sliding assembly includes two carriages, each carriage having an inverted L-shaped design and a damping slide plate fixed at its bottom. The damping slide plate is slidably connected within a horizontal groove, and both the damping slide plate and the horizontal groove have a T-shaped cross-section. A vertical plate is fixed on the damping slide plate, and a push block is fixed on the vertical plate. The two sides of the push block are inclined, and a lower dial wheel overlaps with one of the inclined surfaces of the push block. The gap between the tops of the two carriages provides space for the rotating shaft and the two dial wheels to move.

[0013] As a further embodiment of the present invention, the ejection assembly includes a bracket, the bottom of which is fixed to the bottom of the inner wall of the work frame, and three multi-stage electric push rods are fixed on the bracket at positions corresponding to the annular groove, the top ends of which correspond to the positions of the sliding holes.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention activates a multi-stage electric push rod below the coating station, which extends through the sliding hole to contact the sliding seat and push it upward. This, in turn, drives the dial wheel, swing arm, and wafer upward via a rotating shaft. A micro pump continues to operate, and the air duct slides within the sleeve to ensure ventilation. The adsorption hood securely adsorbs the wafer. The upper dial wheel, upon contacting the slide, rotates under pressure, causing the rotating shaft and wafer to rotate. After the dial wheel passes through the slide gap, the swing arm is positioned by the tension spring, causing the wafer to complete a 180-degree rotation so that the surface to be coated faces upward. The multi-stage electric push rod then retracts, and the return spring drives each component downward. The wafer is moved back to its original position, and the dial wheel pushes the slide to move in preparation for flipping again. After the coating mechanism is activated and coating is completed on one side, the multi-stage electric push rod extends again, similarly causing the wafer to rotate 180 degrees so that the coating surface faces down. Then the multi-stage electric push rod retracts, and the wafer moves down to contact the support plate sealing ring. The coating surface of the wafer is isolated by the upper sealing ring, the lower sealing ring, the support plate, and the support plate to ensure protection and fixation. This prevents the tiny particles and heat generated during the vaporization of the film material from acting on the wafers at other stations, ensuring the uniformity of the film thickness during subsequent coating processes. 2. This invention activates the adsorption limiting component. A micro-pump draws air from the adsorption hood through a sleeve and an air guide tube. The air guide tube connects to the adsorption hood via a rotary joint, preventing it from winding around the rotating shaft. This creates a negative pressure adsorption hood on the wafer, achieving initial fixation. The upper sealing ring adheres to the upper surface of the wafer, preventing vacuum leakage and limiting the circumferential movement of the wafer to prevent horizontal displacement. Furthermore, the air guide tube can slide within the sleeve during its upward movement, ensuring proper connection between the air guide tube and the sleeve. After the limiting is complete, the motor... The output shaft drives the sector disk and the central extension rod to rotate. The inclined section of the extension rod drives the slide column to slide in the deflection frame groove, pushing the deflection frame and the turntable at the top of the fixed shaft to rotate. The turntable is supported by bearings and bushings to ensure stable rotation. When the outer arc surface of the sector disk fits the arc groove, the turntable completes a 120-degree intermittent rotation, causing the coated wafer to leave the workstation and the wafer to be coated to be moved to the bottom of the coating mechanism for processing. The intermittent switching design of the three workstations allows other workstations to perform loading or flipping operations simultaneously, improving overall production efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0017] Figure 2 This is a partial structural schematic diagram of the vacuum coating machine of the present invention;

[0018] Figure 3 This is a schematic diagram of the structure of the work frame of the present invention;

[0019] Figure 4 This is a schematic diagram of the cross-sectional structure of the work frame of the present invention;

[0020] Figure 5 This is a schematic diagram of the structure of the turntable, horizontal groove, and sliding hole of the present invention;

[0021] Figure 6 This is a schematic diagram of the structure of the driving component of the present invention;

[0022] Figure 7 This is a schematic diagram of the cross-sectional structure of the turntable of the present invention;

[0023] Figure 8 This is a schematic diagram of the ejector assembly of the present invention;

[0024] Figure 9 This is a schematic diagram of a partial cross-section of the support component of the present invention;

[0025] Figure 10 This is a schematic diagram of the structure of the adsorption limiting component of the present invention;

[0026] Figure 11 This is a schematic diagram of the structure of the sliding component of the present invention;

[0027] Figure 12 This is a schematic diagram of the automatic flipping component of the present invention;

[0028] Figure 13 This is a schematic diagram of the structure of the reset component of the present invention.

[0029] The attached diagram lists the components represented by each number as follows:

[0030] 1. Vacuum coating machine; 2. Machine housing; 3. Sealing door; 4. Coating mechanism; 5. Work frame; 6. Support bearing; 7. Turntable; 8. Support column; 9. Drive assembly; 901. Motor; 902. Sector-shaped disk; 903. Extension rod; 904. Sliding column; 905. Deflection frame; 906. Slide groove; 907. Arc groove; 908. Fixed shaft; 10. Support assembly; 101. Slide cylinder; 102. Rectangular slide; 103. Support plate; 104. Lower sealing ring; 105. Buffer spring; 11. Adsorption limiting assembly; 111. Support plate; 112. Adsorption hood; 113. Rotary joint; 114. Air guide pipe; 115. Sleeve; 116. Micro pump; 117. Upper sealing ring; 12. Automatic flipping assembly; 121. Sliding seat; 122. Rotating shaft; 123. Dial wheel; 124. Swing rod; 125. Tension spring; 126. Stop post; 13. Reset assembly; 131. Fixing bracket; 132. Slide rail; 133. Guide block; 134. Slide rod; 135. Reset spring; 14. Sliding assembly; 141. Carriage; 142. Damping slide plate; 143. Vertical plate; 144. Push block; 15. Sliding hole; 16. Horizontal groove; 17. Annular groove; 18. Ejection assembly; 181. Bracket; 182. Multi-stage electric push rod. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Please see Figures 1-13 The present invention provides a technical solution:

[0033] A semiconductor vacuum coating apparatus for automatic wafer loading and unloading includes a vacuum coating machine 1, a housing 2 mounted on the vacuum coating machine 1, a sealed door 3 at the front of the housing 2, and a coating mechanism 4 installed through the top of the vacuum coating machine 1. A work frame 5 is installed inside the vacuum coating machine 1, a support bearing 6 is inserted through the middle of the work frame 5, a turntable 7 is rotated inside the support bearing 6, a support column 8 is fixed in the middle of the turntable 7, and the top of the support column 8 is rotatably connected to the top of the inner wall of the housing 2 via a bushing. The middle of the turntable 7 is engaged with the work frame 5 via the support bearing 6, and the top of the turntable 7 is rotatably connected to the top of the inner wall of the housing 2 via a bushing. This, combined with the rotatable connection between the top of the support column 8 and the housing 2, ensures the stability of the turntable 7's rotation.

[0034] As a further embodiment of the present invention, a drive assembly 9 is fixed at the bottom center of the turntable 7. The drive assembly 9 is installed at the bottom of the work frame 5. The drive assembly 9 includes a motor 901 and a deflection frame 905. The motor 901 is fixed at the bottom of the inner wall of the work frame 5. A sector disk 902 is fixedly connected to the output shaft of the motor 901. An extension rod 903 is fixed in the middle of the sector disk 902. The extension rod 903 consists of a vertical section and an inclined section. A sliding column 904 is fixed at the inclined section at the top of the extension rod 903. A fixed shaft 908 is fixed at the top of the deflection frame 905. The top end of the fixed shaft 908 is fixed to the bottom of the turntable 7. Three sliding grooves 906 and three arc grooves 907 are opened on the outside of the deflection frame 905. The sliding grooves 906 and arc grooves 907 are staggered. The outer arc surface of the sector disk 902 is in contact with the inner wall of one of the arc grooves 907. The sliding column 904 is slidably connected in one of the sliding grooves 906.

[0035] During operation, the output shaft of motor 901 drives the sector disk 902 to rotate, and the extension rod 903 in the middle of the sector disk 902 rotates synchronously. When the sector disk 902 rotates, the inclined section in the extension rod 903 drives the slide column 904 to slide in the slide groove 906, pushing the deflection frame 905 to rotate synchronously, which in turn drives the turntable 7 at the top of the fixed shaft 908 to rotate. When the outer arc surface of the sector disk 902 is completely in contact with the inner wall of the arc groove 907, the outer arc surface of the sector disk 902 is in contact with the inner wall of the arc groove 907 of the deflection frame 905, which plays a role in limiting and positioning the deflection frame 905. The slide column 904 disengages from the current slide groove 906, and the deflection frame 905 stops rotating. At this time, the turntable 7 completes one intermittent rotation with a rotation angle of 120 degrees, which can intermittently switch between three workstations, ensuring adjustment accuracy while improving the degree of automation.

[0036] As a further embodiment of the present invention, three support components 10 are fixedly connected to the turntable 7. Each support component 10 includes a slide cylinder 101. The bottom end of the slide cylinder 101 is fixedly connected to the turntable 7. A rectangular slide block 102 is slidably connected inside the slide cylinder 101. A support plate 103 is fixedly attached to the top end of the rectangular slide block 102. A lower sealing ring 104 is provided on the support plate 103. A buffer spring 105 is fixed between the bottom of the rectangular slide block 102 and the bottom of the inner wall of the slide cylinder 101.

[0037] During operation, the edge of the coating surface under the wafer is close to the support assembly 10 and contacts the lower sealing ring 104 on the tray 103. When the tray 103 is pressed, it will squeeze the buffer spring 105 below through the rectangular slide 102. The buffer spring 105 provides a reverse support force to the rectangular slide 102, which plays a role in buffering and protecting the wafer and preventing the coating surface of the wafer from being damaged by compression.

[0038] As a further embodiment of the present invention, the top of the support assembly 10 is provided with an adsorption limiting assembly 11. One end of the adsorption limiting assembly 11 passes through the turntable 7 and is installed at the bottom edge of the turntable 7. The adsorption limiting assembly 11 includes a support plate 111. The bottom of the support plate 111 is provided with an adsorption cover 112. One side of the adsorption cover 112 passes through the support plate 111 and is provided with a rotary joint 113. A rotatable air guide tube 114 is sleeved in the rotary joint 113. A sleeve 115 is slidably sleeved on the outside of the air guide tube 114. The bottom end of the air guide tube 114 is connected to the inside of the sleeve 115. The bottom end of the sleeve 115 passes through the turntable 7 and is connected to a micro pump 116. The micro pump 116 is installed at the bottom of the turntable 7. An upper sealing ring 117 is installed at the bottom of the support plate 111 corresponding to the position of the lower sealing ring 104.

[0039] During operation, the micro pump 116 draws air from inside the adsorption hood 112 through the sleeve 115 and the air guide pipe 114. The air guide pipe 114 is connected to the adsorption hood 112 through the rotary joint 113. The rotary joint 113 ensures that the air guide pipe 114 does not become entangled as the rotating shaft 122 rotates, thus creating a negative pressure inside the adsorption hood 112, which in turn adsorbs the wafer on the support plate 103, achieving initial fixation of the wafer. Since the support plate 111 has an upper sealing ring 117 installed at the position corresponding to the sealing ring 117 on the support plate 103, the upper sealing ring 117 can fit against the upper surface of the wafer during adsorption, preventing vacuum leakage and circumferentially limiting the wafer to prevent it from shifting in the horizontal direction.

[0040] As a further embodiment of the present invention, the other end of the adsorption limiting component 11 is fixedly connected to an automatic flipping component 12. The automatic flipping component 12 includes a sliding seat 121. A rotating shaft 122 is rotatably passed through the middle of the sliding seat 121. One end of the rotating shaft 122 is fixed to one side of the support plate 111. Two extended ends of the rotating shaft 122 are respectively equipped with dials 123. The included angle between the two dials 123 is 90 degrees. A swing rod 124 is fixed to one end of the rotating shaft 122 away from the support plate 111. A tension spring 125 is sleeved between the other end of the swing rod 124 and the extended end of the bottom of the sliding seat 121. Two stop posts 126 are fixed to the two sides of the sliding seat 121 near the swing rod 124. The swing rod 124 overlaps one of the stop posts 126.

[0041] The automatic flipping component 12 is fixed with reset components 13 on both sides. The reset components 13 include a fixed frame 131. The bottom of the fixed frame 131 is fixedly connected to the turntable 7. The fixed frame 131 has slide rails 132 on both sides. The slide rails 132 are slidably connected with guide blocks 133. The two guide blocks 133 are fixed on both sides of the sliding seat 121. The guide block 133 has a slide rod 134 sliding through the middle. The two ends of the slide rod 134 are fixed to the upper and lower sides inside the slide rail 132. The slide rod 134 is sleeved with a reset spring 135. The reset spring 135 is fixed between the top of the guide block 133 and the top of the inner wall of the slide rail 132.

[0042] The bottom of the reset assembly 13 is fixed to the turntable 7. A sliding assembly 14 is attached to one end of the automatic flipping assembly 12 near the adsorption limiting assembly 11. A horizontal groove 16 is provided on the turntable 7 corresponding to the position of the sliding assembly 14. The bottom of the sliding assembly 14 is slidably connected within the horizontal groove 16. The sliding assembly 14 includes two carriages 141, each with an inverted L-shaped design and a damping slide plate 142 fixed to its bottom. The damping slide plate 142 is slidably connected within the horizontal groove 16. Both the damping slide plate 142 and the horizontal groove 16 have a T-shaped cross-section, improving the stability of the horizontal movement of the carriages 141 driven by the damping slide plate 142 and ensuring that the damping slide plate 142 does not detach from the horizontal groove 16.

[0043] A vertical plate 143 is fixed on the damping slide plate 142, and a push block 144 is fixed on the vertical plate 143. The two sides of the push block 144 are inclined. The lower dial wheel 123 overlaps with one of the inclined surfaces of the push block 144. The gap between the tops of the two slides 141 provides space for the rotation shaft 122 and the two dial wheels 123 to move.

[0044] During operation, as the sliding seat 121 moves upward, it drives two dial wheels 123 and a swing arm 124 to move upward via the rotating shaft 122. The rotating shaft 122 then drives the wafer to move vertically upward via the support plate 111. When the dial wheel 123 above the rotating shaft 122 contacts the top of the inner wall of one of the slides 141, the dial wheel 123 is pressed and rotates in the opposite direction, driving the rotating shaft 122 to rotate. The rotating shaft 122 then drives the wafer to continue moving upward via the support plate 111, while simultaneously driving the lower dial wheel 123 to rotate synchronously. As the rotating shaft 122 rotates, the swing arm 124 disengages from the original overlapping stop post 126. The tension spring 125 is stretched to generate elastic force. When the rotating shaft 122 drives the two dials 123 to completely pass through the gap between the tops of the two slides 141, the dials 123 are no longer under the pressure of the slides 141. At this time, under the elastic force of the tension spring 125, the swing arm 124 quickly overlaps on the other side stop post 126, realizing the precise positioning of the rotating shaft 122, thereby enabling the wafer to complete a 180-degree flip, which facilitates the coating process on the wafer surface to be coated.

[0045] As the guide blocks 133 on both sides of the sliding seat 121 slide along the slide rod 134, under the elastic force of the return spring 135, the guide blocks 133 are pushed downward, causing the sliding seat 121 to move down and reset synchronously. At the same time, the sliding seat 121 drives the rotating shaft 122, the dial wheel 123, the swing rod 124 and the support plate 111 to move down, and the wafer also moves vertically down until the wafer returns to the initial adsorption height. At this time, the lower dial wheel 123 presses the inclined surface of the push block 144 on the damping slide plate 142. After the push block 144 is pressed, it can drive the damping slide plate 142 to slide in the horizontal groove 16. The damping slide plate 142 drives the slide 141 to move horizontally a certain distance, so that the top of the other slide 141 corresponds to the position of the dial wheel 123, which makes it convenient for the dial wheel 123 to move up again and push the slide 141 to move horizontally and perform the flipping operation synchronously.

[0046] As a further embodiment of the present invention, an annular groove 17 is provided at the bottom of the turntable 7, and an ejector assembly 18 is slidably installed in the annular groove 17. Sliding holes 15 are respectively provided at the three ends of the ejector assembly 18 in the turntable 7, and all three sliding holes 15 communicate with the annular groove 17. The ejector assembly 18 includes a bracket 181, the bottom of which is fixed to the bottom of the inner wall of the work frame 5. Three multi-stage electric push rods 182 are fixed on the bracket 181 at positions corresponding to the annular groove 17, and the top ends of the multi-stage electric push rods 182 correspond to the positions of the sliding holes 15.

[0047] During operation, as the turntable 7 rotates, the annular groove 17 slides on the top of the three multi-stage electric push rods 182, which will not interfere with the rotation of the upper wafer driven by the turntable 7. Furthermore, the top of the multi-stage electric push rods 182 corresponds to the position of the sliding hole 15, which facilitates pushing the sliding seat 121 upward through the sliding hole 15.

[0048] Working principle of this invention:

[0049] By opening the sealing door 3 at the front of the housing 2, the wafer to be coated is placed on the tray 103 of the support assembly 10, with the coating side of the wafer facing down. The sealing door 3 is then closed, and the device is started. The vacuum coating machine 1 begins to evacuate, creating a vacuum environment inside the housing 2 that meets the coating requirements. Next, the adsorption limiting assembly 11 is activated. During operation, the micro pump 116 draws air from inside the adsorption hood 112 through the sleeve 115 and the air guide pipe 114. The air guide pipe 114 is connected to the adsorption hood 112 via a rotary joint 113. The rotary joint 113 can... To ensure that the gas guide tube 114 does not get tangled as the rotating shaft 122 rotates, a negative pressure is formed inside the adsorption hood 112, which in turn adsorbs the wafer on the tray 103, thus achieving the initial fixation of the wafer. Since the bottom of the support plate 111 is equipped with an upper sealing ring 117 corresponding to the position of the sealing ring 117 on the tray 103, during the adsorption process, the upper sealing ring 117 can fit against the upper surface of the wafer to prevent vacuum leakage. At the same time, it can circumferentially limit the wafer to prevent the wafer from shifting in the horizontal direction. At this time, the bottom surface of the wafer to be coated is separated from the lower support component 10.

[0050] After the wafer is positioned, the motor 901 in the drive assembly 9 is started. The output shaft of the motor 901 drives the sector disk 902 to rotate. The extension rod 903 in the middle of the sector disk 902 rotates synchronously. When the sector disk 902 rotates, the inclined section in the extension rod 903 drives the slide column 904 to slide in the slide groove 906, pushing the deflection frame 905 to rotate synchronously, which in turn drives the turntable 7 at the top of the fixed shaft 908 to rotate. The middle part of the turntable 7 is engaged with the work frame 5 through the support bearing 6, and the top of the turntable 7 is rotatably connected to the top of the inner wall of the housing 2 through the bushing to ensure the stability of the rotation. When the outer arc surface of the sector disk 902 is completely in contact with the inner wall of the arc groove 907, the slide column 904 disengages from the current slide groove 906, and the deflection frame 905 stops rotating. At this time, the turntable 7 completes one intermittent rotation with a rotation angle of 120 degrees, so that one of the support components 10, the adsorption and positioning components 11, and the wafer are precisely rotated to directly below the coating mechanism 4.

[0051] Since the wafer is currently facing downwards with the coating surface down, during the wafer flipping coating process, the multi-stage electric push rod 182 below the current workstation is activated. The multi-stage electric push rod 182 extends and passes through the corresponding sliding hole 15 on the turntable 7, so that the top of the multi-stage electric push rod 182 contacts the bottom of the sliding seat 121 in the automatic flipping assembly 12. As the sliding seat 121 is pushed upwards, it drives the two dial wheels 123 and the swing rod 124 upwards via the rotating shaft 122. The rotating shaft 122 then drives the wafer to move vertically upwards via the support plate 111. At this time, the micro pump 116 remains operational, and the air duct 114 slides within the sleeve 115 during its synchronous upward movement, ensuring normal connection between the air duct 114 and the sleeve 115. The adsorption hood 112 continuously adsorbs the upper surface of the wafer, ensuring that the wafer does not deviate during its upward movement. The wafer moves without falling off. When the upper dial 123 of the rotating shaft 122 contacts the top of the inner wall of one of the slides 141, the dial 123 will rotate in the opposite direction under pressure and drive the rotating shaft 122 to rotate. The rotating shaft 122 will then drive the wafer to continue to move upward through the support plate 111, and at the same time drive the lower dial 123 to rotate synchronously. The swing rod 124 will disengage from the original overlapping stop 126 as the rotating shaft 122 rotates. The tension spring 125 will be stretched to generate elastic force. When the rotating shaft 122 drives the two dials 123 to completely pass through the gap between the tops of the two slides 141, the dial 123 will no longer be under the pressure of the slide 141. At this time, under the elastic force of the tension spring 125, the swing rod 124 will quickly overlap on the other side stop 126 to achieve precise positioning of the rotating shaft 122, thereby enabling the wafer to complete a 180-degree flip. At this time, the wafer to be coated is facing upward, and the flipping action is completed.

[0052] Secondly, the multi-stage electric push rod 182 at the current workstation is controlled to retract. As the guide blocks 133 on both sides of the sliding seat 121 slide along the slide rod 134, the upward movement of the sliding seat 121 compresses the return spring 135. During the retraction process of the multi-stage electric push rod 182, under the elastic force of the return spring 135, the guide blocks 133 are pushed downward, causing the sliding seat 121 to move downward synchronously and return to its original position. At the same time, the sliding seat 121 drives the rotating shaft 122, the dial wheel 123, the swing rod 124, and the support plate 111 to move downward, and the wafer also moves vertically downward until the wafer returns to its initial adsorption height. At this time, the lower dial wheel 123 presses the inclined surface on one side of the push block 144 on the damping slide plate 142. After being pressed, the push block 144 can drive the damping slide plate 142 in the horizontal groove 1. 6. The sliding mechanism 142 drives the slide 141 to move horizontally a certain distance, so that the top of the other slide 141 corresponds to the position of the dial wheel 123. Then, the coating mechanism 4 is activated. In a vacuum environment, the coating mechanism 4 vaporizes the film material into atoms, molecules or ions. These particles are deposited on the wafer-facing surface to be coated, forming the required conductive layer, insulating layer or functional layer. After the coating work is completed, the multi-stage electric push rod 182 continues to extend and drives the wafer on the sliding seat 121 and the support plate 111 to move upward, so that the dial wheel 123 squeezes the slide 141 on the same side. Similarly, the rotating shaft 122, the swing rod 124 and the two dial wheels 123, together with the action of the tension spring 125, rotate 180 degrees again, so that the coated surface of the wafer faces downward.

[0053] Next, the multi-stage electric push rod 182 retracts again, and with the elastic force of the reset spring 135, the support plate 111 moves the wafer down until the edge of the coating surface below the wafer approaches the support assembly 10 and contacts the lower sealing ring 104 on the support plate 103. After the support plate 103 is pressed, it will squeeze the lower buffer spring 105 through the rectangular slide 102. The buffer spring 105 provides a reverse support force to the rectangular slide 102, which plays a role in buffering and protecting the wafer, and preventing the coating surface of the wafer from being damaged by compression. At this time, the coating surface of the wafer is located between the upper sealing ring 117 and the lower sealing ring 104, and is isolated from the external space by the support plate 111 and the support plate 103, which not only prevents the coating surface from being contaminated, but also further ensures the fixed stability of the wafer.

[0054] Secondly, the turntable 7 continues to rotate all the wafers 180 degrees through the adsorption limiting component 11, so that the coated wafers are removed from the coating station. When the coated wafers are moved to the bottom of the coating mechanism 4, the coating process is carried out. When the wafers are taken out, the micro pump 116 stops working, the negative pressure inside the adsorption cover 112 disappears, and the adsorption on the wafers is released. The operator can open the sealing door 3 and take out the coated wafers, thus completing a complete coating process and realizing the purpose of automatic wafer loading and unloading.

Claims

1. A semiconductor vacuum coating apparatus for automatic wafer loading and unloading, comprising a vacuum coating machine (1), characterized in that: The vacuum coating machine (1) is equipped with a housing (2), and a sealing door (3) is provided in front of the housing (2). A coating mechanism (4) is installed through the top of the vacuum coating machine (1). A work frame (5) is installed in the vacuum coating machine (1). A support bearing (6) is inserted through the middle of the work frame (5). A turntable (7) is rotated inside the support bearing (6). A support column (8) is fixed in the middle of the turntable (7). The top of the support column (8) is rotatably connected to the top of the inner wall of the housing (2) through a bushing. A drive assembly (9) is fixed at the bottom center of the turntable (7). The drive assembly (9) is installed at the bottom of the work frame (5). Three support assemblies (10) are fixedly connected to the turntable (7). An adsorption limiting assembly (11) is provided at the top of the support assembly (10). One end of the adsorption limiting assembly (11) penetrates the turntable (7). And installed at the bottom edge of the turntable (7), the other end of the adsorption limiting component (11) is fixedly connected to the automatic flipping component (12), the two sides of the automatic flipping component (12) are fixed with the reset component (13), the bottom of the reset component (13) is fixed to the turntable (7), the end of the automatic flipping component (12) near the adsorption limiting component (11) is connected to the sliding component (14), the turntable (7) is provided with a horizontal groove (16) corresponding to the position of the sliding component (14), the bottom of the sliding component (14) is slidably connected in the horizontal groove (16), the bottom of the turntable (7) is provided with an annular groove (17), the ejection component (18) is slidably installed in the annular groove (17), the three ends of the turntable (7) corresponding to the ejection component (18) are respectively provided with sliding holes (15), and the three sliding holes (15) are all connected to the annular groove (17).

2. The semiconductor vacuum coating apparatus for automatic wafer loading and unloading according to claim 1, characterized in that: The drive assembly (9) includes a motor (901) and a deflection frame (905). The motor (901) is fixed to the bottom of the inner wall of the work frame (5). A sector-shaped disk (902) is fixedly connected to the output shaft of the motor (901). An extension rod (903) is fixed in the middle of the sector-shaped disk (902). The extension rod (903) consists of a vertical section and an inclined section. A sliding column (904) is fixed to the inclined section at the top of the extension rod (903). The deflection frame (905) A fixed shaft (908) is fixed at the top of the rotating disk (7), and the top end of the fixed shaft (908) is fixed to the bottom of the rotating disk (7). The deflection frame (905) has three sliding grooves (906) and three arc grooves (907) on its outside. The sliding grooves (906) and arc grooves (907) are arranged alternately. The outer arc surface of the fan-shaped disk (902) is in contact with the inner wall of one of the arc grooves (907). The sliding column (904) is slidably connected in one of the sliding grooves (906).

3. The semiconductor vacuum coating apparatus for automatic wafer loading and unloading according to claim 1, characterized in that: The support assembly (10) includes a slide cylinder (101), the bottom end of which is fixedly connected to the turntable (7). A rectangular slide block (102) is slidably connected inside the slide cylinder (101). A support plate (103) is fixed at the top of the rectangular slide block (102). A lower sealing ring (104) is provided on the support plate (103). A buffer spring (105) is fixed between the bottom of the rectangular slide block (102) and the bottom of the inner wall of the slide cylinder (101).

4. The semiconductor vacuum coating apparatus for automatic wafer loading and unloading according to claim 3, characterized in that: The adsorption limiting component (11) includes a support plate (111), and an adsorption cover (112) is provided at the bottom of the support plate (111). A rotary joint (113) is installed on one side of the adsorption cover (112) through the support plate (111). A gas guide tube (114) is sleeved and rotated in the rotary joint (113). A sleeve (115) is slidably sleeved on the outside of the gas guide tube (114), and the bottom end of the gas guide tube (114) is connected to the inside of the sleeve (115). The bottom end of the sleeve (115) passes through the turntable (7) and is connected to a micro pump (116). The micro pump (116) is installed at the bottom of the turntable (7). An upper sealing ring (117) is installed at the bottom of the support plate (111) corresponding to the position of the lower sealing ring (104).

5. A semiconductor vacuum coating apparatus for automatic wafer loading and unloading according to claim 4, characterized in that: The automatic flipping assembly (12) includes a sliding seat (121), through which a rotating shaft (122) rotates. One end of the rotating shaft (122) is fixed to one side of a support plate (111). Two extension ends of the rotating shaft (122) are respectively equipped with dials (123), and the included angle between the two dials (123) is 90 degrees. A swing rod (124) is fixed to one end of the rotating shaft (122) away from the support plate (111). A tension spring (125) is sleeved between the other end of the swing rod (124) and the extension end at the bottom of the sliding seat (121). Two stops (126) are fixed to the two sides of the sliding seat (121) near the swing rod (124), and the swing rod (124) rests on one of the stops (126).

6. The semiconductor vacuum coating apparatus for automatic wafer loading and unloading according to claim 5, characterized in that: The reset assembly (13) includes a fixed frame (131), the bottom of which is fixedly connected to the turntable (7). Slides (132) are provided on both sides of the fixed frame (131). Guide blocks (133) are slidably connected in the slides (132). The two guide blocks (133) are fixed on both sides of the sliding seat (121). A slide rod (134) slides through the middle of the guide block (133). The two ends of the slide rod (134) are fixed on the upper and lower sides inside the slide (132). A reset spring (135) is sleeved on the slide rod (134). The reset spring (135) is fixed between the top of the guide block (133) and the top of the inner wall of the slide (132).

7. A semiconductor vacuum coating apparatus for automatic wafer loading and unloading according to claim 6, characterized in that: The sliding assembly (14) includes two slides (141), each slide (141) is an inverted L-shaped design and has a damping slide plate (142) fixed at the bottom. The damping slide plate (142) is slidably connected in a horizontal groove (16), and both the damping slide plate (142) and the horizontal groove (16) have a T-shaped cross-section. A vertical plate (143) is fixed on the damping slide plate (142), and a push block (144) is fixed on the vertical plate (143). The two sides of the push block (144) are inclined, and the dial wheel (123) located below overlaps with one of the inclined surfaces of the push block (144). The gap between the tops of the two slides (141) is used to provide space for the rotating shaft (122) and the two dial wheels (123).

8. The semiconductor vacuum coating apparatus for automatic wafer loading and unloading according to claim 1, characterized in that: The ejection assembly (18) includes a bracket (181), the bottom of which is fixed to the bottom of the inner wall of the work frame (5). Three multi-stage electric push rods (182) are fixed on the bracket (181) at the position corresponding to the annular groove (17), and the top of the multi-stage electric push rods (182) corresponds to the position of the sliding hole (15).

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