Electroplating solution processing device and electroplating apparatus

Abstract

The application is suitable for the technical field of electroplating equipment, and provides an electroplating solution treatment device and electroplating equipment. The electroplating solution treatment device comprises a first treatment section and a second treatment section. The first treatment section comprises multiple groups of first spray suction modules. Each group of first spray suction modules comprises a first spraying unit and a first suction unit arranged on two sides of the thickness direction of a to-be-electroplated circuit board. Along the thickness direction, the first spraying unit and the first suction unit on the opposite side correspond to each other to form multiple first directional flow fields penetrating through the through holes. The second treatment section comprises a first spraying module group and a second spraying module group arranged on two sides of the thickness direction of the to-be-electroplated circuit board. The first spraying module group comprises multiple second spraying units, and the second spraying module group comprises multiple third spraying units.

Description

Technical Field

[0001] This application belongs to the field of electroplating equipment technology, and more specifically, relates to an electroplating solution treatment device and electroplating equipment. Background Technology

[0002] In the electroplating process of printed circuit boards, the plating uniformity of high aspect ratio through-holes is a key factor affecting product reliability. Due to the excessively large depth-to-diameter ratio of the through-holes, the plating solution has difficulty effectively penetrating deep into the holes, resulting in a significant difference in plating thickness between the hole opening and the center of the hole, and even defects such as no plating in the center of the hole.

[0003] Existing electroplating equipment typically employs designs such as contralateral jetting, and can partially improve the aforementioned problems by optimizing jetting pressure and adjusting nozzle angles. However, due to the boundary layer effect, existing technologies have always struggled to further improve deep plating capabilities in deep hole electroplating while simultaneously meeting the process requirements for plating efficiency, and equipment performance needs to be improved. Summary of the Invention

[0004] In order to overcome the problems existing in the prior art, the main objective of this application is to provide an electroplating solution treatment device and an electroplating equipment.

[0005] To achieve the above objectives, this application specifically adopts the following technical solution: According to a first aspect of the present application, an electroplating solution treatment apparatus is provided, disposed in an electroplating tank, for electroplating a circuit board with high aspect ratio through holes. The electroplating solution treatment apparatus includes a first treatment section and a second treatment section arranged sequentially along the conveying direction of the circuit board to be electroplated. The first treatment section includes multiple sets of first spray-suction modules arranged at intervals along the conveying direction. Each set of first spray-suction modules includes a first spray unit and a first suction unit disposed on both sides of the thickness direction of the circuit board to be electroplated. Along the thickness direction, the first spray unit corresponds one-to-one with the first suction unit on the opposite side, forming a first directional flow field with multiple through holes. The second treatment section includes a first spray module and a second spray module disposed on both sides of the thickness direction of the circuit board to be electroplated. The first spray module includes multiple second spray units arranged at intervals along the conveying direction, and the second spray module includes multiple third spray units arranged at intervals along the conveying direction. The first spray module and the second spray module are respectively connected to a liquid supply system through independent liquid supply pipelines to independently control their on / off states.

[0006] The first possible scenario is that the first spray unit has a first nozzle, the first suction unit has a first suction nozzle, and within the same first spray-suction module, the central axis of the first nozzle coincides with the central axis of the first suction nozzle and is perpendicular to the surface of the circuit board to be electroplated.

[0007] The second possibility is that the distance between the first nozzle and the corresponding first suction nozzle is 5mm to 50mm.

[0008] The third possibility is that, along the same side of the circuit board to be electroplated, the first spray unit and the first suction unit are arranged alternately, and the adjacent first directional flow fields flow in opposite directions.

[0009] The fourth possible scenario is that the first spray module includes a first spray main pipe extending along the conveying direction, the second spray module includes a second spray main pipe extending along the conveying direction, a plurality of second spray units are arranged at intervals along the length direction of the first spray main pipe, and a plurality of third spray units are arranged at intervals along the length direction of the second spray main pipe; both the first spray main pipe and the second spray main pipe can be slidably installed on the inner wall of the electroplating tank, and can drive the corresponding second spray unit and / or third spray unit to move along the conveying direction to adjust the relative position of the second spray unit and the third spray unit.

[0010] The fifth possibility is that the inner wall of the electroplating tank is provided with a slide rail extending along the conveying direction, and both ends of the first spray main pipe and the second spray main pipe are provided with sliders that cooperate with the slide rail. The sliders are connected to a drive mechanism, which is used to drive the first spray main pipe and the second spray main pipe to slide along the slide rail.

[0011] The sixth possible scenario is that the second processing section has a first working mode: the second spray unit of the first spray module and the third spray unit of the second spray module are staggered along the conveying direction, and all the second and third spray units simultaneously spray electroplating liquid onto the circuit board to be electroplated to form a flow field with an unsteady pressure gradient.

[0012] The seventh possibility is that the second processing section has a second operating mode: the second spray unit and the third spray unit alternately spray the electroplating solution separately to form an alternating unidirectional flow field with an unsteady pressure gradient.

[0013] The eighth possible scenario is that the second spray unit of the first spray module and the third spray unit of the second spray module are arranged facing each other along the conveying direction.

[0014] A ninth possible scenario is that the electroplating solution treatment device further includes a first isolation structure disposed between the first treatment section and the second treatment section to reduce mutual interference of the flow fields between them. The first isolation structure is provided with a first slit for the circuit board to be electroplated to pass through. And / or, the electroplating solution treatment device further includes a second isolation structure disposed between two adjacent first spray-suction modules to reduce mutual interference of the flow fields between them. The second isolation structure is provided with a second slit for the circuit board to be electroplated to pass through. A tenth possible scenario is that the electroplating solution treatment device further includes a third treatment section arranged downstream of the second treatment section along the conveying direction. The structure of the third treatment section is the same as that of the second treatment section. The operating modes of the third treatment section and the second treatment section are mutually exclusive: when the second treatment section is in the first operating mode, the third treatment section is in the second operating mode; when the second treatment section is in the second operating mode, the third treatment section is in the first operating mode.

[0015] The eleventh possibility is that the electroplating solution treatment device further includes a third treatment section arranged downstream of the second treatment section along the conveying direction, and the structure of the third treatment section is the same as that of the first treatment section.

[0016] The twelfth possibility is that at least one turbine assembly is arranged in the first spray unit.

[0017] The thirteenth possibility is that at least one turbine assembly is disposed at the liquid supply input end of the first spray unit for pre-pressurizing the electroplating solution about to enter the first spray unit; and / or, the first spray unit has a plurality of first nozzles arranged at intervals, and at least one turbine assembly is disposed between two adjacent first nozzles on the first spray unit for compensating for the pressure loss along the flow path of the electroplating solution in the first spray unit; and / or, at least one turbine assembly is disposed at the liquid supply end of the first spray unit for eliminating end backflow eddies.

[0018] The fourteenth possibility is that a spiral guide assembly is arranged in the first spray unit, and the spiral guide assembly is arranged along the extension direction of the first spray unit.

[0019] The fifteenth possible scenario is that the first spray unit has a first nozzle, the second spray unit has a second nozzle, and the third spray unit has a third nozzle, wherein the spray angle of the first nozzle is smaller than the spray angle of the second nozzle and smaller than the spray angle of the third nozzle.

[0020] The sixteenth possible scenario is that all the first spray units of the first processing section are connected to the first liquid supply main pipe, all the first suction units are connected to the first liquid return main pipe, and the first liquid supply main pipe and the first liquid return main pipe are connected to the liquid supply system of the electroplating tank to form a circulating liquid supply loop.

[0021] The seventeenth possibility is that the electroplating solution treatment device also includes a control module, which is electrically connected to the switching valves on each supply pipeline to control the on / off sequence of the corresponding switching valves in order to switch the working mode of the second treatment section.

[0022] According to a second aspect of the embodiments of this application, an electroplating apparatus is provided, the electroplating apparatus including an electroplating tank and an electroplating solution treatment device, wherein the electroplating solution treatment device is the aforementioned electroplating solution treatment device.

[0023] The beneficial effects of the electroplating solution treatment device provided in this application are as follows: Compared with the prior art, the electroplating solution treatment device provided in this application, by setting up a first treatment section and a second treatment section arranged sequentially along the conveying direction, can effectively combine deep plating capability, uniformity of the entire plating layer, and high plating efficiency. Specifically, the first treatment section can form a first directional flow field with multiple through holes in the electroplating tank through multiple sets of spaced first spray suction modules. The first directional flow field can form a stable pressure gradient at both ends of the through holes, thereby forcing the electroplating solution to penetrate the through holes at high speed and improving the exchange efficiency of the electroplating solution in the through holes. As the circuit board to be electroplated is conveyed, the multiple first directional flow fields can act on the through holes in sequence, thereby forming a continuous initial plating layer on the circuit board to be electroplated. The second treatment section can rapidly thicken the circuit board to be electroplated with the initial plating layer through the alternating or simultaneous spraying of the first spray module and the second spray module, and further improve the uniformity of the plating layer in the holes and the plating layer on the board surface through the unsteady pressure gradient formed in the through holes. The synergy of the first treatment section and the second treatment section achieves compatibility between deep plating capability and plating efficiency. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A top view of an electroplating apparatus with some components removed, provided as an embodiment of this application; Figure 2 for Figure 1 A magnified view of a portion of region A in the middle; Figure 3 for Figure 1 A magnified view of a portion of region B in the middle; Figure 4 A partial schematic diagram of an electroplating apparatus in a first working mode for a second processing stage provided in an embodiment of this application; Figure 5A front view of an electroplating apparatus with some components removed, provided in an embodiment of this application; Figure 6 This is a schematic diagram of the structure of the first spray section provided in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of the first spray section from another perspective, as provided in an embodiment of this application. Figure 8 A left view of an electroplating apparatus with some components removed, provided as an embodiment of this application; Figure 9 A structural schematic diagram of the first spray section from another perspective provided in an embodiment of this application; Figure 10 This is a schematic diagram of the structure of the second spray section provided in an embodiment of this application; Figure 11 This is a structural schematic diagram of the second spray section from another perspective provided in an embodiment of this application; Figure 12 This is a schematic diagram of the structure of the second spray section having a first slide rail and a first slider, provided in an embodiment of this application. Figure 13 A schematic diagram of the structure of the second spray section having a second slide rail and a second slider from another perspective provided in this application embodiment; Figure 14 The right-hand view of an electroplating apparatus with some components removed, provided as an embodiment of this application; Figure 15 A structural schematic diagram of the second spray section from another perspective provided in an embodiment of this application; Figure 16 A schematic diagram of the structure of the second spray section with a slide rail and a slider from another perspective provided in an embodiment of this application; Figure 17 This is a schematic diagram of the structure of the first spray unit provided in an embodiment of this application; Figure 18 A cross-sectional structural schematic diagram of the first spray unit provided in an embodiment of this application; The details of the reference numerals used in the above figures are as follows: 10. First processing section; 11. First spray suction module; 111. First spray unit; 1111. First spray pipe; 11111. First nozzle; 1112. First sub-circulation filter assembly; 1113. First sub-circulation flow display assembly; 112. First suction unit; 1121. First suction pipe; 11211. First suction nozzle; 1122. Second sub-circulation filter assembly; 1123. Second sub-circulation flow display assembly; 113. First sub-return main pipe; 114. First sub-supply main pipe; 115. Second sub-return main pipe; 116. Second sub-supply main pipe; 20. Second processing section; 21. First spray module; 211. Second spray unit; 2111. Second spray pipe; 21111. Second nozzle; 2112. First sub-supply filtration assembly; 2113. First sub-supply flow display assembly; 2114. First switch valve; 212. First spray main pipe; 22. Second spray module; 221. Third spray unit; 2211. Third spray pipe; 22111. Third nozzle; 2212. Second sub-supply filtration assembly; 2213. Second sub-supply flow display assembly; 2214. Second switch valve; 222. Second spray main pipe; 30. Circuit board to be electroplated; 40. Electroplating tank; 51. First slide rail; 52. First slider; 53. First drive mechanism; 61. Second slide rail; 62. Second slider; 63. Second drive mechanism; 71. Slide rail; 72. Slider; 80. Turbine assembly. Detailed Implementation

[0026] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0027] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly or indirectly on that other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to that other element. Unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0030] As described in the background section, in circuit board electroplating processes, the plating uniformity of high aspect ratio through-holes is a key factor affecting product reliability. Due to the excessively large depth-to-diameter ratio of the through-holes, the plating solution cannot effectively penetrate deep into the hole, resulting in a significant difference in plating thickness between the hole opening and the center, and even defects such as no plating in the center. Existing electroplating equipment typically employs designs such as contralateral jetting, and can partially improve these problems by optimizing jet pressure and adjusting nozzle angles. However, limited by the boundary layer effect, existing technologies have consistently struggled to further improve deep plating capabilities in deep-hole electroplating while simultaneously meeting the process requirements for plating efficiency; therefore, equipment performance needs improvement. It should be noted that the high aspect ratio through-hole in this embodiment is an example of a through-hole with a depth-to-diameter ratio of 50:1.

[0031] See Figures 1 to 18 As shown, in order to solve the above problems, according to the first aspect of the embodiments of this application, an electroplating solution treatment device is provided, which is disposed in an electroplating tank 40 for electroplating a circuit board 30 with high aspect ratio through holes. The electroplating solution treatment device includes a first treatment section 10 and a second treatment section 20 arranged sequentially along the conveying direction of the circuit board 30 to be electroplated; the first treatment section 10 includes a plurality of first spray suction modules 11 arranged at intervals along the conveying direction, and each first spray suction module 11 includes a first spray unit 111 and a first suction unit 112 respectively disposed on both sides of the thickness direction of the circuit board 30 to be electroplated; Along the thickness direction, the first spray unit 111 corresponds one-to-one with the first suction unit 112 on the opposite side, forming a first directional flow field with multiple through holes; the second processing section 20 includes a first spray module 21 and a second spray module 22 respectively disposed on both sides of the circuit board 30 to be electroplated in the thickness direction. The first spray module 21 includes multiple second spray units 211 arranged at intervals along the conveying direction, and the second spray module 22 includes multiple third spray units 221 arranged at intervals along the conveying direction; the first spray module 21 and the second spray module 22 are respectively connected to the liquid supply system through independent liquid supply pipelines so as to independently control the on and off.

[0032] The electroplating solution treatment device provided in this embodiment, by setting up a first treatment section 10 and a second treatment section 20 arranged sequentially along the conveying direction, can effectively combine deep plating capability, full coating uniformity, and high plating efficiency. Specifically, the first treatment section 10 can form a first directional flow field with multiple through holes in the electroplating tank 40 through multiple sets of spaced first spray suction modules 11. The first directional flow field can form a stable pressure gradient at both ends of the through holes, thereby forcing the electroplating solution to penetrate the through holes at high speed and ensuring that the air in the through holes is discharged in real time, thereby improving the efficiency of the plating solution in the through holes. The electroplating solution exchange efficiency is improved. As the circuit board 30 to be electroplated is transported, multiple first directional flow fields can act on the through holes in sequence, thereby forming a continuous initial plating layer on the circuit board 30 to be electroplated. The second processing section 20 can spray alternately or simultaneously through the first spray module 21 and the second spray module 22. Through the flow field with an unsteady pressure gradient formed in the through holes, the initial plating layer of the circuit board 30 to be electroplated is rapidly thickened, and the uniformity of the plating layer in the holes and the plating layer on the board surface is further improved, so as to achieve compatibility between deep plating capability and plating efficiency.

[0033] It is understandable that the flow field with an unsteady pressure gradient formed in the through hole in the second treatment section 20 is equivalent to the first directional flow field with a stable pressure gradient formed in the first treatment section 10. The pressure difference fluctuation range of the flow field with the unsteady pressure gradient is greater than that of the first directional flow field.

[0034] It should be noted that, in this embodiment, the first processing section 10 refers to the section formed by multiple sets of first spray suction modules 11 arranged at intervals along the conveying direction in the electroplating solution treatment device, which is used to form a first directional flow field with multiple through holes in the electroplating tank 40; the second processing section 20 refers to the section formed by the first spray module 21 and the second spray module 22 arranged along the conveying direction in the electroplating solution treatment device.

[0035] The first spray-suction module 11 refers to a basic functional unit consisting of a set of opposing first spray units 111 and first suction units 112, with multiple sets of first spray-suction modules 11 arranged at intervals along the conveying direction; the first spray unit 111 refers to a component in the first processing section 10 located on one side of the circuit board 30 to be electroplated, used to spray electroplating liquid onto the circuit board 30 to be electroplated; the first suction unit 112 refers to a component in the first processing section 10 located on the other side of the circuit board 30 to be electroplated, used to suction electroplating liquid from the circuit board 30 to be electroplated, and is arranged opposite to and at intervals with the first spray unit 111 along the thickness direction of the circuit board 30 to be electroplated; the first directional flow field refers to the directional flow of electroplating liquid formed by the spray and suction cooperation of the first spray unit 111 and the first suction unit 112, pointing from the first spray unit 111 to the first suction unit 112.

[0036] In some embodiments of this example, at least a portion of the first spray-suction modules 11 in the first processing section 10 are arranged in opposite directions to another portion of the first spray-suction modules 11. The specific arrangement depends on the material, thickness, support method, and board size of the circuit board 30 to be electroplated. For circuit boards 30 with low stress resistance, attention should be paid to the stress balance on both sides of the circuit board 30 to be electroplated. For example, the first spray unit 111 and the first suction unit 112 are arranged as follows: In the first processing section 10, the first spray unit 111 in the first half is arranged on the A side of the circuit board to be electroplated, and the corresponding first suction unit 112 is arranged on the B side of the circuit board to be electroplated. In the second half, the first spray unit 111 is arranged on the B side of the circuit board 30 to be electroplated, and the corresponding first suction unit 112 is arranged on the A side of the circuit board 30 to be electroplated. Here, A and B are the two surfaces of the circuit board 30 to be electroplated that have the largest surface area and face opposite directions.

[0037] In addition, it should be noted that in order to maintain the stability of the circuit board 30 to be electroplated transferred by the first processing section 10, the hangers and clamps for transferring the circuit board 30 to be electroplated should stably clamp the circuit board 30 to be electroplated from at least two symmetrical directions. For example, the circuit board 30 to be electroplated is clamped from four sides by a frame-type hanger.

[0038] In some embodiments of this example, the first spray unit 111 and the first suction unit 112 are arranged alternately on the same side of the circuit board 30 to be electroplated; the adjacent first directional flow fields have opposite directions.

[0039] The alternating arrangement of the first spray unit 111 and the first suction unit 112 on the same side of the circuit board 30 to be electroplated means that, in the conveying direction, the first spray unit 111 and the first suction unit 112 located on the same side of the circuit board 30 to be electroplated are arranged alternately, that is, the spray unit, the suction unit, the spray unit, and the suction unit are arranged in sequence at intervals. The opposite flow direction of adjacent first directional flow fields means that, along the conveying direction, the first directional flow fields generated by two adjacent first spray and suction modules 11 are opposite in direction, that is, the first first directional flow field points from the first spray unit 111 to the first suction unit 112, and the second first directional flow field points from the first suction unit 112 to the first spray unit 111, and so on. Because the flow directions of adjacent first directional flow fields are opposite, the electroplating solution can quickly and alternately penetrate the through hole in two opposite directions. On the one hand, this setting helps maintain the consistency of the electroplating solution concentration on both sides, thereby improving the consistency of the plating thickness on both sides of the through hole. During the electroplating process, the electroplating solution spray side deposits faster due to the more sufficient ion supply. By periodically reversing the flow direction, the through hole of the circuit board 30 to be electroplated will be flushed by the bidirectional through flow in both the forward and reverse directions during the transportation process. This can eliminate the stagnant dead zone in the hole and achieve the consistency of the deposition rate at both ends in a time-averaged sense, effectively suppressing the problem of asymmetry aggravation. On the other hand, it helps maintain the stress balance on both sides of the circuit board 30 to be electroplated, which is particularly beneficial for circuit boards 30 with low stress resistance, such as those with brittle substrates (glass).

[0040] The first spray module 21 refers to a spray assembly composed of multiple second spray units 211 arranged at intervals along the conveying direction, located on one side of the circuit board 30 to be electroplated in the thickness direction; the second spray module 22 refers to a spray assembly composed of multiple third spray units 221 arranged at intervals along the conveying direction, located on the other side of the circuit board 30 to be electroplated in the thickness direction, opposite to the first spray module 21; the second spray unit 211 refers to a component in the second processing section 20 located on one side of the circuit board 30 to be electroplated for spraying electroplating solution; the third spray unit 221 refers to a component in the second processing section 20 located on the other side of the circuit board 30 to be electroplated for spraying electroplating solution, which is arranged opposite to and at intervals with the second spray unit 211 along the thickness direction of the circuit board 30 to be electroplated; the second spray unit 211 and the third spray unit 221 are arranged along... The misalignment or direct alignment in the conveying direction refers to the relative positional relationship between the second spray unit 211 and the third spray unit 221 in the conveying direction. When directly aligned, the second spray unit 211 and the third spray unit 221 correspond one-to-one and are aligned in the conveying direction. When misaligned, the second spray unit 211 and the third spray unit 221 are staggered in the conveying direction. The first spray module 21 and the second spray module 22 are connected to the liquid supply system through independent liquid supply pipelines. The independent control of the on / off state means that each of the first spray module 21 and the second spray module 22 has a switch valve on its respective liquid supply pipeline. By controlling the opening and closing of the switch valve, the liquid supply of the first spray module 21 and the second spray module 22 can be controlled independently, thereby realizing simultaneous spraying or alternating spraying of the second spray unit 211 and the third spray unit 221.

[0041] It is understood that in this embodiment, the first processing section 10 and the second processing section 20 are arranged sequentially along the conveying direction of the circuit board 30 to be electroplated, meaning that the first processing section 10 and the second processing section 20 are arranged one after the other in the conveying direction. The circuit board 30 to be electroplated first passes through the first processing section 10 for processing, and then enters the second processing section 20 for processing. Along the thickness direction, the first spray unit 111 and the opposite first suction unit 112 correspond one-to-one, meaning that each first spray unit 111 has a first suction unit 112 directly opposite it in the thickness direction, forming a one-to-one spray-suction pair. The first spray module 21 and the second spray module 22 are respectively located on both sides of the circuit board 30 to be electroplated in the thickness direction, meaning that the first spray module 21 is located on one side of the circuit board 30 to be electroplated, and the second spray module 22 is located on the other side of the circuit board 30 to be electroplated, and the two are arranged opposite each other along the thickness direction.

[0042] When the circuit board 30 to be electroplated is processed by the electroplating solution treatment device, the circuit board 30 to be electroplated passes through the first processing section 10 and the second processing section 20 in sequence along the conveying direction. First, the circuit board 30 to be electroplated enters the first processing section 10. The first processing section 10 forms multiple through-holes in the electroplating tank 40 through multiple sets of spaced first spray suction modules 11. The first directional flow field forms a stable pressure gradient at both ends of the through-hole, forcing the electroplating solution to pass through the through-hole at high speed, improving the electroplating solution exchange efficiency in the through-hole. As the circuit board 30 to be electroplated is transported, the multiple first directional flow fields act on the through-hole in sequence, thereby forming a continuous initial plating deposition in the through-hole (i.e., no plating breakpoint in the middle of the hole). At the same time, disordered fine crystal nuclei are formed on the surface of the circuit board 30 to be electroplated, providing abundant nucleation sites for subsequent electroplating. However, due to the rapid unidirectional decay of the fluid in the hole, the mass transfer in the hole center is limited to a certain extent. At this time, the plating uniformity in the through-hole is slightly poor, and the TP value is generally less than 80% (TP value refers to the ratio of the minimum plating thickness in the hole to the plating thickness at the hole opening, which is used to reflect the deep plating capability of the hole). Subsequently, the circuit board 30 to be electroplated enters the second processing section 20. The second processing section 20 uses alternating or simultaneous spraying by the first spray module 21 and the second spray module 22 to form an unsteady pressure gradient in the through-hole. This prevents the formation of a static "stagnant point" pressure balance on both sides of the circuit board 30 to be electroplated, but instead generates periodic pressure fluctuations, thereby forming enhanced micro-turbulence in the hole. This significantly improves the mass transfer efficiency at the hole center and is more effective than the unidirectional forced penetration of the first processing section 10 in breaking the diffusion boundary layer in the hole center region. It can alternately and rapidly thicken and equalize the thickness of the through-hole and board surface plating on the circuit board 30 with the initial plating layer. Furthermore, the first processing section causes the additive at the hole opening to be consumed too quickly due to the suction tube action, resulting in a better advantage for plating growth at the hole opening. The second processing section uses a gentler and more uniform fluid shear force to make the additive more evenly distributed in the hole, and the leveling agent effectively inhibits the plating growth at the hole opening, thereby increasing the TP value (85%-95%). Additives refer to chemical substances added to the electroplating solution to regulate the deposition behavior of the coating. Additives include, but are not limited to, leveling agents. Leveling agents refer to chemical substances used to preferentially inhibit deposition on protruding parts in order to improve the uniformity of the coating.Furthermore, in the alternating spray mode, the second spray unit 211 and the third spray unit 221 spray in turn, forming a unidirectional overall flow field with alternating directions on both sides of the circuit board 30 to be electroplated. When the electroplating solution flows from the left to the right (from the side where the second spray unit 211 is located to the side where the third spray unit 221 is located), it induces the grains to grow tilted to the right. When the electroplating solution flows from the right to the left (from the side where the third spray unit 221 is located to the side where the second spray unit 211 is located), it induces the grains to grow tilted to the left. The left and right flow segments work alternately, inducing the grains to grow tilted to the left and right in opposite directions on the board surface, respectively. The three different orientations of stress, namely, the isotropic stress generated by the disordered crystal nuclei formed in the first processing segment 10, the directional stress induced by the left flow segment of the second processing segment 20, and the reverse directional stress induced by the right flow segment of the second processing segment 20, can interweave and compensate for each other at the microscopic level, ultimately resulting in a lower macroscopic internal stress, better toughness, and stronger adhesion to the substrate of the formed coating.

[0043] See Figure 8 and Figure 9 As shown, in one embodiment, the first spray unit 111 has a first nozzle 11111, and the first suction unit 112 has a first suction nozzle 11211. Within the same first spray-suction module 11, the central axis of the first nozzle 11111 coincides with the central axis of the first suction nozzle 11211 and is perpendicular to the surface of the circuit board 30 to be electroplated. It should be noted that in this embodiment, the central axis of the first nozzle 11111 and the central axis of the first suction nozzle 11211 coincide means that the spray center line of the first nozzle 11111 and the suction center line of the first suction nozzle 11211 are on the same straight line and are directly opposite each other; the central axis of the first nozzle 11111 being perpendicular to the surface of the circuit board 30 to be electroplated means that the spray direction of the first nozzle 11111 is perpendicular to the main surface of the circuit board 30 to be electroplated, that is, the electroplating liquid is sprayed toward the circuit board 30 to be electroplated in a direction perpendicular to the board surface. By setting the central axis of the first nozzle 11111 and the first suction nozzle 11211 in the same first spray-suction module 11 to coincide and perpendicular to the board surface of the circuit board 30 to be electroplated, the electroplating liquid sprayed by the first spray unit 111 can penetrate the through hole along the shortest path in a direction perpendicular to the board surface, and be directly sucked by the first suction nozzle 11211 after passing through the through hole, thereby forming a large stable pressure gradient at both ends of the through hole and realizing efficient forced penetration of the electroplating liquid.

[0044] See Figure 8 , Figure 9 and Figure 17As shown, in one possible implementation, the first spraying unit 111 includes a first spray pipe 1111, and a first nozzle 11111 is provided on the first spray pipe 1111. The electroplating solution in the first spray pipe 1111 is sprayed onto the circuit board 30 to be electroplated through the first nozzle 11111. The first suction unit 112 includes a first suction pipe 1121, and a first suction nozzle 11211 is provided on the first suction pipe 1121. The electroplating solution in the electroplating tank 40 is suctioned into the first suction pipe 1121 through the first suction nozzle 11211. It should be noted that in this embodiment, the first spray pipe 1111 refers to the tubular component constituting the main structure of the first spray unit 111, and the first nozzle 11111 refers to the perforated structure opened on the tubular component for spraying electroplating liquid or a nozzle component installed on the tubular component and communicating with its interior; the first suction pipe 1121 refers to the tubular component constituting the main structure of the first suction unit 112, and the first suction nozzle 11211 refers to the perforated structure opened on the tubular component for sucking up electroplating liquid or a suction component installed on the tubular component and communicating with its interior. Since tubing has relatively low production costs and good maintainability, using the tubular structure of the first spray pipe 1111 and the first suction pipe 1121 as the main structure of the first spray unit 111 and the first suction unit 112 helps to reduce the production and maintenance costs of the electroplating treatment device.

[0045] In one possible implementation, the first spray pipe 1111 is a mixed-flow nozzle. It should be noted that a mixed-flow nozzle refers to a tubular structure that enables the electroplating solution to produce a mixed flow effect during the spraying process. It is understandable that by using a mixed-flow nozzle as the first spray pipe 1111, additional turbulence or mixing effects can be introduced during the electroplating solution spraying process, allowing the electroplating solution to undergo sufficient mixing and disturbance before leaving the nozzle or during spraying. This breaks down any possible concentration or temperature stratification in the electroplating solution, resulting in a more uniform ion concentration and temperature distribution on the surface of the circuit board 30 to be electroplated, further improving the uniformity and stability of the first directional flow field. At the same time, the turbulence or cross jet generated by the mixed-flow nozzle can enhance the mass transfer efficiency between the electroplating solution and the surface of the circuit board 30 to be electroplated, allowing fresh electroplating solution to be replenished to the board surface and the vicinity of the vias more quickly, avoiding uneven plating caused by excessive local ion consumption. Furthermore, the mixed-flow nozzle can adjust the spray angle and spray range through its internal structure design, enabling the electroplating solution to more effectively cover all parts of the board surface, reducing spray blind spots, thereby further improving the processing effect of the first processing section 10 on high aspect ratio vias.

[0046] In one possible implementation, the first nozzle 11111 in this embodiment is a conical converging focusing nozzle. By setting the first nozzle 11111 as a conical converging focusing nozzle, the divergence angle of the electroplating solution sprayed by the first nozzle 11111 can be reduced from more than 30° to less than 5°, thereby ensuring that it can be accurately focused on the through hole area and reducing the lateral spread of the electroplating solution on the surface of the circuit board 30 to be electroplated.

[0047] See Figure 8 , Figure 9 and Figure 17 As shown, in one possible implementation, there are multiple first nozzles 11111 in this embodiment, and the multiple first nozzles 11111 are arranged at intervals along the length direction of the first spray pipe 1111. By setting multiple first nozzles 11111 and arranging them at intervals along the length direction of the first spray pipe 1111, the first spray pipe 1111 can form a continuous and uniform spray coverage along its length direction, avoiding processing blind spots or local overspray caused by too few spray points, thereby ensuring that the circuit board 30 to be electroplated can obtain a more uniform spray treatment and improving the uniformity of the first directional flow field along the length direction of the first spray pipe 1111.

[0048] See Figure 8 , Figure 9 and Figure 17 As shown, in one possible implementation, there are multiple first suction nozzles 11211 in this embodiment, and the multiple first suction nozzles 11211 are arranged at intervals along the length direction of the first suction tube 1121. By setting multiple first suction nozzles 11211 and arranging them at intervals along the length direction of the first suction tube 1121, the first suction can form a continuous and uniform suction coverage in its length direction, avoiding processing blind spots or local over-suction caused by too few suction points, thereby ensuring that the circuit board 30 to be electroplated can obtain a more uniform suction treatment and improving the uniformity of the first directional flow field in the length direction of the first suction tube 1121.

[0049] See Figure 14 and Figure 15As shown, in one possible implementation, the second spray unit 211 in this embodiment includes a second spray pipe 2111, on which a second nozzle 21111 is provided, and the electroplating solution in the second spray pipe 2111 is sprayed onto the circuit board 30 to be electroplated through the second nozzle 21111; the third spray unit 221 includes a third spray pipe 2211, on which a third nozzle 22111 is provided, and the electroplating solution in the third spray pipe 2211 is sprayed onto the circuit board 30 to be electroplated through the third nozzle 22111. It should be noted that, in this embodiment, the second spray pipe 2111 refers to the tubular component constituting the main structure of the second spray unit 211, and the second nozzle 21111 refers to the perforated structure opened on the tubular component for spraying electroplating liquid or the nozzle component installed on the tubular component and communicating with its interior; the third spray pipe 2211 refers to the tubular component constituting the main structure of the third spray unit 221, and the third nozzle 22111 refers to the perforated structure opened on the tubular component for spraying electroplating liquid or the nozzle component installed on the tubular component and communicating with its interior; since the tubular material has relatively low production cost and good maintainability, it is beneficial to reduce the production and maintenance cost of the electroplating treatment device by using the tubular structure of the second spray pipe 2111 and the third spray pipe 2211 as the main structure of the second spray unit 211 and the third spray unit 221.

[0050] In one possible implementation, the second spray pipe 2111 and the third spray pipe 2211 in this embodiment are mixed-flow spray pipes. It should be noted that a mixed-flow spray pipe refers to a tubular structure capable of generating a mixed flow effect in the electroplating solution during spraying. It is understood that by using mixed-flow spray pipes as the second spray pipe 2111 and the third spray pipe 2211, additional turbulence or mixing effects can be introduced during the electroplating solution spraying process, allowing the electroplating solution to undergo sufficient mixing and disturbance before leaving the nozzle or during spraying. This breaks down any concentration or temperature stratification that may exist in the electroplating solution, resulting in a more uniform electroplating solution sprayed onto the surface of the circuit board 30 to be electroplated. The mixed-flow nozzle provides uniform ion concentration and temperature distribution. Simultaneously, the turbulence or cross-jet generated by the mixed-flow nozzle enhances the mass transfer efficiency between the electroplating solution and the surface of the circuit board 30 to be electroplated, allowing fresh electroplating solution to be replenished to the board surface and near the vias more quickly. This avoids uneven plating caused by excessive local ion consumption. Furthermore, the mixed-flow nozzle can adjust the spray angle and spray range through its internal structure design, enabling the electroplating solution to more effectively cover all parts of the board surface and reduce spray blind spots, thereby further improving the treatment effect of the second processing section 20 on high aspect ratio vias.

[0051] See Figure 14 and Figure 15As shown, in one possible implementation, there are multiple second nozzles 21111 in this embodiment, and the multiple second nozzles 21111 are arranged at intervals along the length direction of the second spray pipe 2111. By setting multiple second nozzles 21111 and arranging them at intervals along the length direction of the second spray pipe 2111, the second spray pipe 2111 can form a continuous and uniform spray coverage along its length direction, avoiding processing blind spots or local overspray caused by too few spray points, thereby ensuring that the circuit board 30 to be electroplated can obtain a relatively uniform spray treatment.

[0052] See Figure 14 and Figure 15 As shown, in one possible implementation, there are multiple third nozzles 22111 in this embodiment, and the multiple third nozzles 22111 are arranged at intervals along the length direction of the third spray pipe 2211. By setting multiple third nozzles 22111 and arranging them at intervals along the length direction of the third spray pipe 2211, the third spray pipe 2211 can form a continuous and uniform spray coverage in its length direction, avoiding processing blind spots or local overspray caused by too few spray points, thereby ensuring that the circuit board 30 to be electroplated can obtain a relatively uniform spray treatment.

[0053] In one embodiment, the distance between the first nozzle 11111 and the corresponding first suction nozzle 11211 is 5mm to 50mm. For example, the distance between the first nozzle 11111 and the corresponding first suction nozzle 11211 can be 5mm, 10mm, 15mm, 20mm, 25mm, 30mm, 35mm, 40mm, 45mm, 50mm, etc. It should be noted that, in this embodiment, the distance between the first nozzle 11111 and the corresponding first suction nozzle 11211 refers to the straight-line distance between the center of the nozzle end face of the first nozzle 11111 and the center of the suction end face of the first suction nozzle 11211 within the same first spray-suction module 11. When the distance between the first nozzle 11111 and the corresponding first suction nozzle 11211 is less than 5mm, the circuit board 30 to be electroplated is prone to collision with the first nozzle 11111 and the first suction nozzle 11211 during the transport process, causing scratches on the circuit board 30 or damage to the equipment. When the distance between the first nozzle 11111 and the corresponding first suction nozzle 11211 is greater than 5mm, the circuit board 30 to be electroplated is prone to collision with the first nozzle 11111 and the first suction nozzle 11211 during the transport process. When the distance is 50mm, the pressure gradient between the first nozzle 11111 and the first suction nozzle 11211 decreases too much, making it difficult to form a large pressure difference at both ends of the through hole, and thus failing to effectively drive the electroplating solution through the through hole. By setting the distance between the first nozzle 11111 and the corresponding first suction nozzle 11211 to 5mm~50mm, it is possible to ensure that the circuit board 30 to be electroplated maintains a safe distance from the nozzle and suction nozzle during the transportation process to avoid collision, and also to keep the nozzle and suction nozzle at a sufficiently close distance to form a large pressure gradient, thereby establishing an effective pressure difference at both ends of the through hole, driving the electroplating solution through the through hole at high speed, and realizing efficient forced exchange of the electroplating solution.

[0054] See Figure 12 , Figure 13 and Figure 16As shown, in one embodiment, the first spray module 21 includes a first spray main pipe 212 extending along the conveying direction, and the second spray module 22 includes a second spray main pipe 222 extending along the conveying direction. A plurality of second spray units 211 are arranged at intervals along the length direction of the first spray main pipe 212, and a plurality of third spray units 221 are arranged at intervals along the length direction of the second spray main pipe 222. The first spray main pipe 212 and the second spray main pipe 222 can be slidably installed on the inner wall of the electroplating tank 40, and can drive the corresponding second spray unit 211 and / or third spray unit 221 to move along the conveying direction to adjust the relative position of the second spray unit 211 and the third spray unit 221. It should be noted that, in this embodiment, the first spray main pipe 212 refers to the main liquid supply pipe extending along the conveying direction in the first spray module 21, used to distribute electroplating solution to multiple second spray units 211; the second spray main pipe 222 refers to the main liquid supply pipe extending along the conveying direction in the second spray module 22, used to distribute electroplating solution to multiple third spray units 221; the multiple second spray units 211 are spaced apart along the length direction of the first spray main pipe 212, meaning that the multiple second spray units 211 are arranged at equal or unequal intervals along the extension direction of the first spray main pipe 212, and each second spray unit 211 is connected to the first spray main pipe 212; the multiple third spray units 221 are spaced apart along the length direction of the second spray main pipe 222, meaning that the multiple third spray units 221 are arranged at equal or unequal intervals along the extension direction of the second spray main pipe 222, and each third spray unit 221 is connected to the second spray main pipe 222; the first spray main pipe 21... 2. Both the first and second spray main pipes 222 can be slidably installed on the inner wall of the electroplating tank 40. This means that the first spray main pipe 212 and the second spray main pipe 222 can be reciprocally installed on the inner wall of the electroplating tank 40 along the conveying direction by means of the cooperation of the slider 72 and the slide rail 71, etc.; driving the corresponding second spray unit 211 and / or third spray unit 221 to move along the conveying direction means that when the first spray main pipe 212 slides, the second spray unit 211 on it moves synchronously, and when the second spray main pipe 222 slides, the third spray unit 221 on it moves synchronously, thereby adjusting the relative position of the second spray unit 211 and the third spray unit 221 in the conveying direction; the relative position includes facing arrangement and staggered arrangement. When facing arrangement, the second spray unit 211 and the third spray unit 221 correspond one-to-one and are aligned in the conveying direction. When staggered arrangement, the second spray unit 211 and the third spray unit 221 are staggered in the conveying direction.

[0055] It is understandable that by setting a first spray pipe 212 and a second spray pipe 222 extending along the conveying direction, and arranging multiple second spray units 211 at intervals on the first spray pipe 212 and multiple third spray units 221 at intervals on the second spray pipe 222, and simultaneously slidably installing the first spray pipe 212 and the second spray pipe 222 on the inner wall of the electroplating tank 40, when the first spray pipe 212 and / or the second spray pipe 222 slides, it can drive the second spray units 211 and / or the third spray units 221 on them to move synchronously along the conveying direction, thereby flexibly adjusting the relative positions of the second spray units 211 and the third spray units 221 in the conveying direction, and realizing a rapid switch between facing arrangement and staggered arrangement. When the second spray unit 211 and the third spray unit 221 are arranged facing each other, the spray units on both sides correspond one-to-one and are aligned. Alternating sprays create an alternating unidirectional flow field with a non-steady-state pressure gradient on the board surface, which can improve the TP value and enhance the uniform plating capability of the circuit board 30 to be electroplated. When the second spray unit 211 and the third spray unit 221 are arranged in a staggered manner, the spray units on both sides are offset from each other. Simultaneous spraying can also create a flow field with a non-steady-state pressure gradient on the board surface, which helps to efficiently thicken the plating layer. The arrangement can be switched by sliding the first spray main pipe 212 and / or the second spray main pipe 222. The structure is simple and easy to operate, requiring no replacement of spray units or rearrangement of pipelines, effectively improving the adaptability of the electroplating solution treatment device to different process requirements.

[0056] In one embodiment, the inner wall of the electroplating tank 40 in this embodiment is provided with a slide rail 71 extending along the conveying direction. Both ends of the first spray pipe 212 and the second spray pipe 222 are provided with sliders 72 that cooperate with the slide rail 71. The sliders 72 are connected to a driving mechanism, which is used to drive the first spray pipe 212 and the second spray pipe 222 to slide along the slide rail 71. It should be noted that, in this embodiment, the slide rail 71 refers to a guide rail that is fixedly installed on the inner wall of the electroplating tank 40 and extends along the conveying direction; the fact that both ends of the first spray main pipe 212 and the second spray main pipe 222 are provided with sliders 72 that cooperate with the slide rail 71 means that each end of the first spray main pipe 212 and the second spray main pipe 222 is provided with a slider 72, and all four sliders 72 are installed on the same slide rail 71 and can slide back and forth along the slide rail 71; the sliders 72 are connected to a driving mechanism, and the driving mechanism is used to drive the first spray main pipe 212 and the second spray main pipe 222 to slide along the slide rail 71 means that the driving mechanism pushes or pulls the sliders 72, so that the corresponding first spray main pipe 212 and / or second spray main pipe 222 move back and forth along the extension direction of the slide rail 71 under the action of driving force. The specific form of the driving mechanism includes, but is not limited to, linear drive devices such as hydraulic cylinders and pneumatic cylinders. When it is necessary to adjust the relative positions of the second spray unit 211 and the third spray unit 221, the first spray main pipe 212 and / or the second spray main pipe 222 can be moved by the drive mechanism so that the second spray unit 211 and the third spray unit 221 are arranged facing each other or staggered in the conveying direction, thereby meeting the spray layout requirements of different electroplating processes. Of course, in other embodiments, the first spray main pipe 212 and the second spray main pipe 222 in this embodiment can also be movably installed in the electroplating tank 40 along the conveying direction by other means such as roller assemblies.

[0057] See Figure 12 and Figure 13As shown, in one possible implementation, in the thickness direction of the circuit board 30 to be electroplated, a first slide rail 51 and a second slide rail 61 are respectively provided on two opposite inner sidewalls of the electroplating tank 40. Both the first slide rail 51 and the second slide rail 61 extend along the conveying direction of the circuit board 30 to be electroplated. A first slider 52 is provided at both ends of the first spray main pipe 212. The first spray main pipe 212 is slidably installed in the electroplating tank 40 through the cooperation of the first slider 52 and the first slide rail 51. A second slider 62 is provided at both ends of the second spray main pipe 222. The second spray main pipe 222 is slidably installed in the electroplating tank 40 through the cooperation of the second slider 62 and the second slide rail 61. A first driving mechanism 53 is connected to the first slider 52, and a second driving mechanism 63 is connected to the second slider 62. The first driving mechanism 53 is used to drive the first spray main pipe 212 to slide along the first slide rail 51, and the second driving mechanism 63 is used to drive the second spray main pipe 222 to slide along the second slide rail 61. The specific forms of the first drive mechanism 53 and the second drive mechanism 63 include, but are not limited to, linear drive devices such as hydraulic cylinders and pneumatic cylinders.

[0058] See Figure 4As shown, in one embodiment, the second processing section 20 in this embodiment has a first working mode: the second spray unit 211 of the first spray module 21 and the third spray unit 221 of the second spray module 22 are staggered along the conveying direction, and all the second spray units 211 and the third spray units 221 simultaneously spray electroplating liquid onto the circuit board 30 to be electroplated, so as to form a flow field with an unsteady pressure gradient. It should be noted that the first working mode in this embodiment refers to a working state of the second processing section 20, in which the second processing section 20 is configured to perform a coating thickening operation; the staggered arrangement of the second spray unit 211 of the first spray module 21 and the third spray unit 221 of the second spray module 22 along the conveying direction means that the second spray unit 211 and the third spray unit 221 are staggered in the conveying direction, that is, the positions of the second spray unit 211 and the third spray unit 221 are not aligned, and each second spray unit 211 is located in the interval area between two adjacent third spray units 221, or each third spray unit 221 is located in the interval area between two adjacent second spray units 211; all the second spray units 211 and the third spray units 221 Simultaneous spraying of electroplating solution onto the circuit board 30 to be electroplated refers to the simultaneous activation of all second spray units 211 of the first spray module 21 and all third spray units 221 of the second spray module 22 within the same time period, spraying electroplating solution onto the board surface from both sides of the circuit board 30 to be electroplated. The flow field with a non-steady-state pressure gradient refers to the flow pattern of the electroplating solution formed by simultaneous spraying from both sides. Under this flow pattern, the electroplating solution sprayed by the second spray unit 211 flows from one side to the circuit board 30 to be electroplated, and the electroplating solution sprayed by the third spray unit 221 flows from the other side to the circuit board 30 to be electroplated. The electroplating solutions from both sides meet near the board surface of the circuit board 30 to be electroplated and form opposing impacts, thereby generating a complex turbulent structure and stagnant flow near the board surface, enhancing the mass transfer efficiency of the electroplating solution near the board surface and orifices.

[0059] It is understandable that by setting the second spray unit 211 and the third spray unit 221 in a staggered arrangement and spraying them simultaneously, the direct collision and cancellation that may occur when the two spray units are set facing each other can be avoided. This allows the electroplating solution to more effectively impact the surface of the circuit board 30 to be electroplated. At the same time, the staggered arrangement makes the impact areas of the electroplating solution sprayed by the two spray units on the board surface intersect and complement each other, thereby forming a more uniform impact coverage. The flow field with an unsteady pressure gradient formed by simultaneous spraying from both sides can generate strong turbulence and stagnation near the surface of the circuit board 30 to be electroplated, effectively destroying the concentration boundary layer near the board surface and breaking the low concentration area formed by the consumption of electrochemical reaction. This allows fresh electroplating solution to directly contact the board surface, thereby enhancing the mass transfer efficiency of the electroplating solution near the board surface and the orifice, improving the rate and uniformity of the electroplating reaction, and achieving efficient coating thickening.

[0060] It is understandable that when the second processing section 20 is in the first working mode, the electroplating solution sprayed at different angles on both sides of the circuit board 30 to be electroplated will form a dynamic and unstable pressure field on both sides of the circuit board 30 to be electroplated. Due to the misalignment of the spray positions, a static "stagnation point" pressure balance will not be formed on both sides of the circuit board 30 to be electroplated, but rather a periodic pressure fluctuation will be generated. This pressure fluctuation will force the electroplating solution to generate high-frequency pressure pulsation in the hole (which can be figuratively called "breathing" or "oscillation" effect). For high aspect ratio through holes, the pressure difference caused by the misaligned spraying on both sides is more effective in breaking the diffusion boundary layer in the hole center region than the unidirectional forced penetration of the first processing section 10. At the same time, the turbulence intensity generated by the misaligned spraying is higher and can reach the depth of the through hole, so that the electroplating ion concentration and additive concentration in the hole center can be maintained at a level close to the board surface, thereby increasing the deposition rate in the hole and significantly increasing the TP value.

[0061] In one embodiment, the second processing section 20 has a second operating mode: the second spray unit 211 and the third spray unit 221 alternately spray the electroplating solution individually to form an alternating unidirectional flow field with an unsteady pressure gradient. It should be noted that the second operating mode in this embodiment refers to a working state of the second processing section 20, in which the second processing section 20 is configured to perform a uniform electroplating operation; the alternating spraying of the electroplating solution by the second spray unit 211 and the third spray unit 221 means that the second spray unit 211 and the third spray unit 221 spray in turn according to a preset time interval. Within the same time period, only the second spray unit 211 sprays while the third spray unit 221 is turned off, or only the third spray unit 221 sprays. The second spray unit 221 sprays while the third spray unit 211 is turned off, and the spray direction is switched periodically. The flow pattern of the electroplating liquid formed by the alternating individual sprays is an alternating unidirectional flow field with an unsteady pressure gradient. Under this flow pattern, when the second spray unit 211 sprays, the electroplating liquid flows from one side of the circuit board 30 to be electroplated to the other side. When the third spray unit 221 sprays, the electroplating liquid flows from the other side of the circuit board 30 to one side. The flow direction of the electroplating liquid changes periodically with time, forming an alternating reverse unidirectional overall flow.

[0062] It is understandable that by having the second spray unit 211 and the third spray unit 221 spray alternately and individually, a reciprocating impact effect can be formed in the through hole of the circuit board 30 to be electroplated. When the electroplating solution flows from one side to the other, it brings fresh electroplating solution into the hole and carries out the consumed electroplating solution. When the direction is switched, the electroplating solution that may have been stuck in some areas of the hole is forced to flow in the opposite direction, thereby improving the electroplating solution exchange efficiency in the depth direction of the high aspect ratio through hole, so that all parts of the through hole can get sufficient electroplating solution replenishment, and improve the coating uniformity in the depth direction of the through hole. Meanwhile, the alternating sprays create an alternating unidirectional flow field with an unsteady pressure gradient. The flow direction remains uniform at a certain moment. The uniform flow pattern of the electroplating solution helps it flow orderly over the surface and through holes of the circuit board 30 to be electroplated, reducing local eddies or stagnant areas that may be formed due to the mutual interference of multidirectional flow. Furthermore, the periodic reversal of the overall flow field direction helps to eliminate the fixed concentration gradient that may be formed due to long-term unidirectional flow, allowing all parts of the surface of the circuit board 30 to be electroplated to receive the direct impact of the electroplating solution alternately, thereby achieving a more uniform electroplating effect.

[0063] It is understandable that when the second processing section 20 is in the second working mode, the flow field with unsteady pressure gradient formed by the alternating individual sprays can provide a gentler and more uniform fluid shear force, making the additives more evenly distributed in the holes, and enabling the leveling agent to effectively inhibit the growth of the coating at the hole opening, thereby improving the TP value.

[0064] See Figure 3 As shown, in one embodiment, the second spray unit 211 of the first spray module 21 and the third spray unit 221 of the second spray module 22 are arranged facing each other along the conveying direction. It should be noted that the "facing each other" arrangement in this embodiment refers to the positional correspondence between the second spray unit 211 of the first spray module 21 and the third spray unit 221 of the second spray module 22 in the conveying direction; specifically, the second spray unit 211 and the third spray unit 221 correspond one-to-one in the conveying direction, meaning that each second spray unit 211 has a third spray unit 221 aligned with its position in the conveying direction, and the two are directly opposite each other, forming a one-to-one pairing relationship. When the second processing section 20 is in the second working mode, the second spray unit 211 of the first spray module 21 and the third spray unit 221 of the second spray module 22 are arranged to face each other along the conveying direction. This can make the two unidirectional flow fields with unsteady pressure gradients symmetrically distributed, thereby ensuring that the two sides of the circuit board 30 to be electroplated can obtain similar or the same electroplating effect.

[0065] In one embodiment, the electroplating solution treatment device further includes a first isolation structure. The first isolation structure is disposed between the first processing section 10 and the second processing section 20 to reduce mutual interference of the flow fields between the two. The first isolation structure is provided with a first slit for the circuit board 30 to be electroplated to pass through. It should be noted that, in this embodiment, the first isolation structure refers to a physical barrier component disposed between the first processing section 10 and the second processing section 20 to separate the flow fields of the two processing sections. The first isolation structure being disposed between the first processing section 10 and the second processing section 20 means that, along the conveying direction of the circuit board 30 to be electroplated, the first isolation structure is located between the first processing section 10 and the second processing section. The boundary area of ​​20 spatially separates the two processing sections at least partially; the first isolation structure is provided with a first slit for the circuit board 30 to be electroplated to pass through, which means that the first isolation structure has a narrow opening extending along the thickness direction of the circuit board 30 to be electroplated. The size of the opening matches the thickness of the circuit board 30 to be electroplated, allowing the circuit board 30 to pass through when entering the second processing section 20 from the first processing section 10, so that the circuit board 30 to be electroplated can pass through continuously without interfering with the isolation structure; wherein, the width of the first slit is slightly larger than the thickness of the circuit board 30 to be electroplated, and the length is not less than the width of the circuit board 30 to be electroplated, to ensure that the circuit board 30 to be electroplated can pass through without obstruction.

[0066] It is understandable that by setting a first isolation structure between the first processing section 10 and the second processing section 20, and opening a first slit on the first isolation structure for the circuit board 30 to be electroplated to pass through, the flow fields of the first processing section 10 and the second processing section 20 can be effectively isolated in space, reducing or even avoiding the mutual interference between the directional flow field formed by the first processing section 10 and the spray flow field formed by the second processing section 20, thereby ensuring that the two processing sections can work independently and stably, and each can achieve its expected processing effect; at the same time, the setting of the first slit allows the circuit board 30 to be electroplated to pass through the two processing sections continuously without affecting the continuity of the electroplating process and production efficiency.

[0067] In one embodiment, the electroplating solution treatment device further includes a second isolation structure, which is disposed between two adjacent first spray suction modules 11 to reduce mutual interference of the flow fields between them. The second isolation structure is provided with a second slit for the circuit board 30 to be electroplated to pass through. It should be noted that, in this embodiment, the second isolation structure refers to a physical barrier component disposed between two adjacent first suction modules 11 to separate the flow fields of adjacent modules; the second isolation structure being disposed between two adjacent first suction modules 11 means that, along the conveying direction of the circuit board 30 to be electroplated, the second isolation structure is located in the boundary area of ​​two adjacent first suction modules 11, spatially separating the two adjacent first suction modules 11 at least partially; the second isolation structure having a second slit for the circuit board 30 to be electroplated to pass through means that the second isolation structure has a narrow opening extending along the thickness direction of the circuit board 30 to be electroplated, the size of which matches the thickness of the circuit board 30 to be electroplated, allowing the circuit board 30 to pass through when entering an adjacent first suction module 11 from one first suction module 11, so that the circuit board 30 to be electroplated can pass through continuously without interfering with the isolation structure; wherein, the width of the second slit is slightly larger than the thickness of the circuit board 30 to be electroplated, and the length is not less than the width of the circuit board 30 to be electroplated, to ensure that the circuit board 30 to be electroplated can pass through without obstruction.

[0068] It is understandable that by setting a second isolation structure between two adjacent first spray suction modules 11 and opening a second slit on the second isolation structure for the circuit board 30 to be electroplated to pass through, the flow fields of adjacent first spray suction modules 11 can be effectively isolated in space, reducing or even avoiding mutual interference between the flow fields of adjacent modules. This ensures that each first spray suction module 11 can independently and stably form its own local directional flow field, so that the spray suction effect of each module does not affect each other. At the same time, the setting of the second slit allows the circuit board 30 to be electroplated to pass through each first spray suction module 11 continuously without affecting the continuity of the electroplating process and production efficiency.

[0069] In one embodiment, the electroplating solution treatment device further includes a third treatment section arranged downstream of the second treatment section 20 along the conveying direction. The structure of the third treatment section is the same as that of the second treatment section 20. The operating modes of the third treatment section and the second treatment section 20 are mutually exclusive: when the second treatment section 20 is in the first operating mode, the third treatment section is in the second operating mode; when the second treatment section 20 is in the second operating mode, the third treatment section is in the first operating mode. It should be noted that the third treatment section in this embodiment refers to an additional treatment section in the electroplating solution treatment device that is located downstream of the second treatment section 20 and has the same structure as the second treatment section 20. The fact that the structure of the third treatment section is the same as that of the second treatment section 20 means that the third treatment section also includes spray modules disposed on both sides of the thickness direction of the circuit board 30 to be electroplated, and each spray module includes multiple spray units arranged at intervals along the conveying direction. Its overall structure, component composition and connection method are consistent with those of the second treatment section 20. The mutually exclusive operating modes of the third treatment section and the second treatment section 20 mean that the third treatment section and the second treatment section 20 are mutually exclusive. The processing sections 20 are configured to operate in different modes, and the two will not operate in the same state simultaneously. When the second processing section 20 is in the first operating mode, the third processing section is in the second operating mode, which means that if the second processing section 20 is in the first operating mode of staggered arrangement and simultaneous spraying, then the third processing section is in the second operating mode of facing arrangement and alternating spraying. When the second processing section 20 is in the second operating mode, the third processing section is in the first operating mode, which means that if the second processing section 20 is in the second operating mode of facing arrangement and alternating spraying, then the third processing section is in the first operating mode of staggered arrangement and simultaneous spraying.

[0070] It is understandable that by adding a third processing section downstream of the second processing section 20 and configuring the third processing section and the second processing section 20 to operate in mutually exclusive modes, the circuit board 30 to be electroplated can undergo two different operating modes sequentially as it passes through the two processing sections. Specifically, when the second processing section 20 is in the first operating mode, the circuit board 30 to be electroplated first undergoes a thickening process to complete most of the plating deposition, and then enters the third processing section to undergo a uniform plating process to homogenize and refine the plating layer. When the second processing section 20 is in the second operating mode, the circuit board 30 to be electroplated first undergoes a uniform plating process to form a uniform initial plating layer, and then enters the third processing section to undergo a thickening process to efficiently complete the plating thickening.

[0071] In one embodiment, the electroplating solution treatment device further includes a third isolation structure, which is disposed between the second treatment section 20 and the third treatment section to reduce the mutual interference of the flow fields between them. The third isolation structure is provided with a third slit for the circuit board 30 to be electroplated to pass through. It is understood that the function of the third isolation structure in this embodiment is similar to that of the first isolation structure, and will not be described in detail here.

[0072] In one embodiment, the electroplating solution treatment device in this embodiment further includes a third treatment section arranged downstream of the second treatment section 20 along the conveying direction, and the structure of the third treatment section is the same as that of the first treatment section 10. It should be noted that, in this embodiment, the third processing section refers to an additional processing section in the electroplating solution treatment device located downstream of the second processing section 20 and having the same structure as the first processing section 10; the fact that the structure of the third processing section is the same as that of the first processing section 10 means that the third processing section also includes multiple sets of spaced-apart spray suction modules. Each spray suction module includes a spray unit and a suction unit arranged opposite each other on both sides of the thickness direction of the circuit board 30 to be electroplated. Its overall structure, component composition, arrangement and connection method are consistent with those of the first processing section 10. Specifically, the third processing section forms a second directional flow field with multiple through holes in the electroplating tank through multiple sets of spaced-apart spray suction modules. Each second directional flow field forms a pressure gradient at both ends of the through hole, forcing the electroplating solution to penetrate the through hole at high speed, so as to perform a second penetration treatment on the circuit board 30 to be electroplated after being treated by the first processing section 10 and the second processing section 20, further consolidating the uniformity of the plating layer in the through hole and improving the electroplating efficiency.

[0073] It is understandable that by adding a third processing section with the same structure as the first processing section 10 downstream of the second processing section 20, the circuit board 30 to be electroplated will undergo the same through-processing as the first processing section 10 after passing through the first processing section 10 (preliminary through-processing) and the second processing section 20 (homogenization processing) in sequence. This will further strengthen the plating layer formed in the second processing section 20, eliminate any possible local uneven deposition, and thus further improve the TP value.

[0074] See Figure 18 As shown, in one embodiment, at least one turbine assembly 80 is arranged in the first spray unit 111. It should be noted that the turbine assembly 80 in this embodiment refers to a fluid dynamic component disposed inside the first spray unit 111, used to apply a swirling effect to the electroplating solution to improve spray uniformity and stirring capability; this turbine assembly 80 can solve problems such as large pressure loss along the flow path of conventional spray pipes, uneven pressure at the beginning and end nozzles, and insufficient stirring capability in deep-hole electroplating. For example, the turbine assembly 80 adopts a passive hydraulically driven mixed-flow turbine, i.e., without electric components, and is made of materials such as PVDF or PTFE, which can eliminate stray current and corrosion risks.

[0075] In addition, a mixed-flow impeller structure can be specifically selected. For example, the blades are 3 to 8 forward-curved streamlined blades, and the inlet and outlet angles are adapted to the viscosity and flow rate of the electroplating solution to achieve the highest hydraulic efficiency. The blade root thickness, blade tip thickness, and edge rounding are set to reduce resistance, prevent material buildup, and prevent stress cracking. The minimum flow width of the blade channel is greater than the maximum orifice diameter of the first nozzle to ensure that impurities that can pass through the first nozzle will never get stuck in the turbine assembly 80, eliminating the risk of blockage.

[0076] In one embodiment, at least one turbine assembly 80 is disposed at the liquid supply input end of the first spray unit 111 to pre-pressurize the electroplating solution about to enter the first spray unit. When the electroplating solution flows axially into the turbine assembly 80, the impeller of the turbine assembly 80 rotates under the drive of the electroplating solution. The rotating impeller can apply centrifugal force and shear force to the passing electroplating solution, so that the electroplating solution superimposes a circumferential flow component on the original axial flow, thereby forming a swirling jet with angular momentum at the outlet of the turbine assembly 80. The circumferential velocity component of the swirling jet can increase the momentum exchange between fluid micro-elements, converting part of the kinetic energy into static pressure energy, thereby compensating for the pressure loss along the flow path and enabling the downstream first nozzle to obtain a more stable liquid supply pressure. The turbine assembly 80 is disposed upstream of the first nozzle. For example, the turbine assembly 80, as a pre-pressurization turbine, can be disposed in a straight pipe section 150~200mm upstream of the first nozzle. The turbine assembly 80 can be an impeller structure, including 3 to 4 fixed guide vanes, which are integrally injection molded with the turbine housing and have an installation angle of 30° to 40°. It rectifies the inlet axial fluid into a pre-swirling fluid that matches the impeller rotation direction, thereby improving impeller drive efficiency and reducing energy loss.

[0077] See Figure 18 As shown, in one embodiment, the first spray unit 111 has a plurality of first nozzles 11111 arranged at intervals, and at least one turbine assembly 80 is disposed between two adjacent first nozzles 11111 on the first spray unit 111 to compensate for the pressure loss along the flow path of the electroplating solution in the first spray unit 111. The position and number of turbine assemblies 80 are determined according to the length and diameter of the first spray pipe in the first spray unit 111 and the number of first nozzles thereon. For example, one turbine assembly 80 is disposed every eight first nozzles along the axial direction of the first spray unit 111. The turbine assembly 80 is located in the non-perforated section between two adjacent first nozzles, and the distance from both ends of the turbine assembly 80 to the nearest first nozzle is greater than or equal to three times the diameter of the first spray pipe. The turbine assembly 80 can be an impeller structure with 5-6 fixed guide vanes and an outlet angle of 0° (pure axial). It completely rectifys the swirling flow generated by the impeller rotation into a stable axial flow, thoroughly eliminating the interference of the swirling flow on the downstream nozzles, and simultaneously converting the kinetic energy of the swirling flow into static pressure, thereby further enhancing the pressurization effect.

[0078] In one embodiment, at least one turbine assembly 80 is disposed at the liquid supply end of the first spray unit 111 to eliminate end backflow eddies. For example, the turbine assembly 80 serves as an end-flow rectifier turbine and is disposed 50-100 mm downstream of the last nozzle, before the pipe plug.

[0079] In addition, a three-stage turbine assembly can be set in the first spray unit 111, that is, multiple turbine components 80 are respectively set at the liquid supply input end of the first spray unit 111, between two adjacent first nozzles 11111 on the first spray unit 111, and at the liquid supply end of the first spray unit 111. By setting the three-stage turbine assembly, the uniformity of the nozzle pressure in the whole pipe can be ≥96%, and the nozzle outlet pressure can be increased by 30%~50%, which can adapt to the electroplating process requirements of the high aspect ratio circuit board 30 to be electroplated.

[0080] It is understood that the second spray unit 211 and the third spray unit 221 can both be arranged with the same or similar turbine assembly 80 as the first spray unit 111.

[0081] It is understandable that the first suction unit 112 may also be equipped with a turbine assembly 80, which is opposite in direction to the turbine assembly 80 in the first spray unit 111, in order to increase the suction negative pressure.

[0082] In another embodiment, a spiral guide assembly is arranged in the first spray unit 111, and the spiral guide assembly is arranged along the extension direction of the first spray unit 111. It should be noted that the spiral guide assembly in this embodiment refers to a static guide component with a spiral flow channel or spiral blades, which is disposed inside the first spray unit 111 (for example, inside the first spray pipe 1111 of the first spray unit 111) and is used to generate a rotating flow of the electroplating liquid. When the electroplating liquid flows through the spiral guide assembly, the electroplating liquid can generate a swirling jet under the guidance of the spiral guide assembly. The circumferential velocity component of the swirling jet enhances the momentum exchange between fluid micro-elements, converting part of the kinetic energy into static pressure energy, thereby compensating for the pressure loss along the flow path and enabling the downstream nozzle to obtain a more stable liquid supply pressure. This spiral guide assembly can solve the problems of large pressure loss along the flow path of conventional spray pipes, uneven pressure at the beginning and end of the nozzles, and insufficient stirring capacity in deep hole electroplating. The extension direction of the first spray unit 111 is the same as the extension direction of the first spray pipe 1111. It is understood that the second spray unit 211 and the third spray unit 221 can both be arranged with the same or similar spiral guide components as the first spray unit 111.

[0083] It is understandable that the first suction unit 112 may also be equipped with a spiral guide component, which is opposite in direction to the spiral guide component in the first spray unit 111, in order to increase the suction negative pressure.

[0084] In one embodiment, the first spray unit 111 has a first nozzle 11111, the second spray unit 211 has a second nozzle 21111, and the third spray unit 221 has a third nozzle 22111. The spray angle of the first nozzle 11111 is smaller than the spray angle of the second nozzle 21111 and smaller than the spray angle of the third nozzle 22111. It should be noted that the spray angle in this embodiment refers to the conical diffusion angle of the electroplating liquid jet after it leaves the nozzle. This angle reflects the degree of convergence or divergence of the electroplating liquid jet. The smaller the spray angle, the more concentrated the jet; the larger the spray angle, the more divergent the jet. The spray angle of the first nozzle 11111 is smaller than that of the second nozzle 21111 and smaller than that of the third nozzle 22111. This means that the conical diffusion angle of the electroplating liquid jet sprayed by the first nozzle 11111 is smaller than that of the electroplating liquid jet sprayed by the second nozzle 21111 and the third nozzle 22111. In other words, the jet of the first nozzle 11111 is more concentrated and focused, while the jets of the second nozzle 21111 and the third nozzle 22111 are more dispersed and have a wider coverage.

[0085] Understandably, by setting the spray angle of the first nozzle 11111 to be smaller than that of the second nozzle 21111 and the third nozzle 22111, the electroplating liquid sprayed by the first nozzle 11111 in the first processing section 10 is more concentrated and the energy is more focused, which can accurately inject into the high aspect ratio through hole, reduce the lateral flow of the electroplating liquid on the board surface, thereby effectively driving the electroplating liquid through the through hole and improving the electroplating liquid exchange efficiency in the hole; while the electroplating liquid jets sprayed by the second nozzle 21111 and the third nozzle 22111 in the second processing section 20 are more dispersed and have a wider coverage area, which can impact the board surface of the circuit board 30 to be electroplated over a large area, achieving uniform spray coverage, which is conducive to the uniform thickening of the plating layer.

[0086] In one embodiment, all the first spray units 111 of the first processing section 10 are connected to the first liquid supply main pipe, and all the first suction units 112 are connected to the first return main pipe. The first liquid supply main pipe and the first return main pipe are connected to the liquid supply system of the electroplating tank 40 to form a circulating liquid supply loop. It should be noted that in this embodiment, the first liquid supply main pipe refers to the main pipe that centrally supplies liquid to all the first spray units 111 in the first processing section 10. One end of the main pipe is connected to the liquid supply system of the electroplating tank 40, and the other end is connected to each of the first spray units 111, used to evenly distribute the electroplating liquid to each of the first spray units 111. The first return main pipe refers to the main pipe that collects the return liquid from all the first suction units 112 in the first processing section 10. One end of the main pipe is connected to each of the first suction units 112. One end is connected to the other end, which is connected to the liquid supply system of the electroplating tank 40. It is used to collect and send the electroplating liquid drawn by each first suction unit 112 back to the liquid supply system. The circulating liquid supply circuit refers to a closed loop path formed by the liquid supply system, the first liquid supply main pipe, the first spray unit 111, the electroplating tank 40, the first suction unit 112, the first return liquid main pipe and the liquid supply system connected in sequence. The electroplating liquid circulates in this circuit and completes the cycle process of liquid supply, spraying, electroplating, suction, return liquid and resupply in sequence.

[0087] It is understandable that by setting up a first liquid supply main pipe to connect all the first spray units 111 in parallel, and setting up a first liquid return main pipe to connect all the first suction units 112 in parallel, the first liquid supply main pipe, the first liquid return main pipe, and the liquid supply system of the electroplating tank 40 together form a circulating liquid supply loop. This allows a single liquid supply and return system to simultaneously meet the spraying needs of multiple first spray units 111 and the suction needs of multiple first suction units 112, eliminating the need for separate systems for each first spray unit 111 and first suction unit 112. Independent supply and return pipelines simplify the overall structure of the electroplating solution treatment device, reduce the number of pipelines, and lower the manufacturing cost of the electroplating solution treatment device. At the same time, the parallel supply method enables each first spray unit 111 to obtain a similar supply pressure, which is conducive to uniform spraying of each first spray unit 111. The parallel return method enables each first suction unit 112 to obtain a similar suction pressure, which is conducive to uniform suction of each first suction unit 112, thereby improving the uniformity and stability of the overall flow field of the first treatment section 10.

[0088] In one possible implementation, the circulating liquid supply circuit in this embodiment is provided with a first total circulating flow display component, a first total circulating filter component, and a first total circulating pump component. It should be noted that, in this embodiment, the first total circulation flow display component refers to a device or instrument installed in the circulation supply circuit for real-time monitoring and display of the electroplating solution flow rate in the circuit. Its specific forms include, but are not limited to, electronic flow meters, rotor flow meters, or flow sensors with display functions. The first total circulation filtration component refers to a device installed in the circulation supply circuit for filtering the electroplating solution flowing in the circuit, used to intercept and remove solid particles, precipitates, or impurities that may be contained in the electroplating solution. Its specific forms include, but are not limited to, bag filters, cartridge filters, mesh filters, or sedimentation filters. The first total circulation pump component refers to a device installed in the circulation supply circuit for providing driving power for the circulation of the electroplating solution. Its specific forms may include, but are not limited to, centrifugal pumps, magnetic pumps, diaphragm pumps, or gear pumps. The first total circulation flow display component, the first total circulation filtration component, and the first total circulation pump component are sequentially connected or arranged in the circulation supply circuit according to process requirements, together constituting the core functional unit of the circulation supply system.

[0089] Understandably, by installing a first main circulation pump assembly in the circulating liquid supply circuit, a continuous and stable power source can be provided for the circulating flow of the electroplating solution, ensuring that the electroplating solution forms a continuous circulation between the main supply pipe, spray unit, electroplating tank 40, suction unit, and return main pipe. By installing a first main circulation filter assembly, solid particles, precipitates, or impurities that may be contained in the electroplating solution can be effectively removed, preventing these impurities from clogging the nozzles or suction tips, while improving the cleanliness of the electroplating solution, which is beneficial to improving the electroplating quality. By installing a first main circulation flow display assembly, operators or the control system can obtain real-time data on the flow rate of the electroplating solution in the circulation circuit. When the flow rate deviates from the preset range, it can be detected in time and corresponding measures can be taken to ensure that the circulating liquid supply circuit always operates under stable flow conditions.

[0090] See Figure 6 and Figure 7As shown, in another embodiment, all the first spray units 111 on one side of the circuit board 30 to be electroplated in the first processing section 10 of this embodiment are connected to the first sub-supply main pipe 114, all the first suction units 112 are connected to the first sub-return main pipe 113, the first sub-supply main pipe 114 and the first sub-return main pipe 113 are connected to the supply system of the electroplating tank 40 to form a first sub-circulation supply loop, all the first spray units 111 on the other side of the circuit board 30 to be electroplated are connected to the second sub-supply main pipe 116, all the first suction units 112 are connected to the second sub-return main pipe 115, the second sub-supply main pipe 116 and the second sub-return main pipe 115 are connected to the supply system of the electroplating tank 40 to form a second sub-circulation supply loop. It should be noted that, in this embodiment, the first sub-supply main pipe 114 refers to the main pipe that centrally supplies liquid to all the first spray units 111 located on the side of the circuit board 30 to be electroplated in the first processing section 10. One end of it is connected to the liquid supply system of the electroplating tank 40, and the other end is connected to each of the first spray units 111 on that side, for uniformly distributing the electroplating liquid to each of the first spray units 111 on that side; the first sub-return main pipe 113 refers to the main pipe that collects the return liquid from all the first suction units 112 located on the side of the circuit board 30 to be electroplated in the first processing section 10. The pipe has one end connected to each of the first suction units 112 on this side, and the other end connected to the liquid supply system of the electroplating tank 40. It is used to centrally send the electroplating liquid sucked by each of the first suction units 112 on this side back to the liquid supply system. The first sub-circulation liquid supply loop refers to the closed loop path formed by the liquid supply system, the first sub-liquid supply main pipe 114, the first spray unit 111 located on the side of the circuit board 30 to be electroplated, the electroplating tank 40, the first suction unit 112 located on the side of the circuit board 30 to be electroplated, the first sub-return liquid main pipe 113 and the liquid supply system connected in sequence.

[0091] The second sub-supply main pipe 116 refers to the main pipe that centrally supplies liquid to all the first spray units 111 located on the other side of the circuit board 30 to be electroplated in the first processing section 10. One end of it is connected to the liquid supply system of the electroplating tank 40, and the other end is connected to each of the first spray units 111 on that side, for uniformly distributing the electroplating liquid to each of the first spray units 111 on that side; the second sub-return main pipe 115 refers to the main pipe that collects the return liquid from all the first suction units 112 located on the other side of the circuit board 30 to be electroplated in the first processing section 10. One end of it is connected to the liquid supply system of the electroplating tank 40, and the other end is connected to each of the first spray units 111 on that side. Each of the first suction units 112 on this side is connected to the other end of the electroplating tank 40, and is used to centrally return the electroplating liquid sucked by each of the first suction units 112 on this side to the liquid supply system. The second sub-circulation liquid supply loop refers to the closed loop path formed by the liquid supply system, the second sub-liquid supply main pipe 116, the first spray unit 111 located on the other side of the circuit board 30 to be electroplated, the electroplating tank 40, the first suction unit 112 located on the other side of the circuit board 30 to be electroplated, the second sub-return liquid main pipe 115 and the liquid supply system connected in sequence.

[0092] It is understandable that by independently forming the first sub-circuit liquid supply circuit and the second sub-circuit liquid supply circuit on both sides of the circuit board 30 to be electroplated, the electroplating liquid circulation on both sides of the circuit board 30 to be electroplated is relatively independent. The independent circulation circuits on both sides can adjust their respective liquid supply pressure, flow rate and filtration accuracy according to process requirements. When the two sides of the circuit board 30 to be electroplated have different requirements for electroplating conditions, differentiated control can be carried out to enhance the flexibility of the electroplating process.

[0093] See Figure 6 and Figure 7 As shown, in one possible implementation, the first sub-circulation supply circuit in this embodiment is provided with a first sub-circulation flow display component 1113, a first sub-circulation filter component 1112, and a first sub-circulation pump component; the second sub-circulation supply circuit is provided with a second sub-circulation flow display component 1123, a second sub-circulation filter component 1122, and a second sub-circulation pump component. It is understood that the functions of the aforementioned sub-circulation flow display component, sub-circulation filter component, and sub-circulation pump component in the corresponding sub-circulation supply circuit are similar to the functions of the total circulation flow display component, total circulation filter component, and total circulation pump component in the corresponding circulation supply circuit, and will not be elaborated upon here.

[0094] In another embodiment, all the first spray units 111 on one side of the circuit board 30 to be electroplated in the first processing section 10 of this embodiment are connected to the third sub-supply main pipe, and all the first suction units 112 are connected to the third sub-return main pipe. The third sub-supply main pipe and the third sub-return main pipe are respectively connected to the supply system of the electroplating tank, forming the third sub-circulation supply loop and the fourth sub-circulation supply loop. All the first spray units 111 on the other side of the circuit board 30 to be electroplated are connected to the fourth sub-supply main pipe, and all the first suction units 112 are connected to the fourth sub-return main pipe. The fourth sub-supply main pipe and the fourth sub-return main pipe are respectively connected to the supply system of the electroplating tank, forming the fifth sub-circulation supply loop and the sixth sub-circulation supply loop. It should be noted that, in this embodiment, the third sub-supply main pipe refers to the main pipe that centrally supplies liquid to all the first spray units 111 located on the side of the circuit board 30 to be electroplated in the first processing section 10. One end of the main pipe is connected to the liquid supply system of the electroplating tank, and the other end is connected to each of the first spray units 111 on that side, for uniformly distributing the electroplating liquid to each of the first spray units 111 on that side; the third sub-return main pipe refers to the main pipe that collects the return liquid from all the first suction units 112 located on the side of the circuit board 30 to be electroplated in the first processing section 10. One end of the main pipe is connected to each of the first suction units 112 on that side. Unit 112 is connected to the first suction unit 112 on each side, and the other end is connected to the liquid supply system of the electroplating tank. It is used to collect and send the electroplating liquid sucked by each first suction unit 112 on this side back to the liquid supply system. The third sub-circulation liquid supply loop refers to the closed loop path formed by the liquid supply system, the third sub-liquid supply main pipe, the first spray unit 111 located on the side of the circuit board 30 to be electroplated, and the electroplating tank connected in sequence. The fourth sub-circulation liquid supply loop refers to the closed loop path formed by the liquid supply system, the third sub-return liquid main pipe, the first suction unit 112 located on the side of the circuit board 30 to be electroplated, and the electroplating tank connected in sequence.

[0095] The fourth sub-supply main pipe refers to the main pipe that centrally supplies liquid to all the first spray units 111 located on the other side of the circuit board 30 to be electroplated in the first processing section 10. One end of the main pipe is connected to the liquid supply system of the electroplating tank, and the other end is connected to each of the first spray units 111 on that side, for uniformly distributing the electroplating liquid to each of the first spray units 111 on that side. The fourth sub-return main pipe refers to the main pipe that collects the return liquid from all the first suction units 112 located on the other side of the circuit board 30 to be electroplated in the first processing section 10. One end of the main pipe is connected to each of the first suction units 112 on that side. The first end is connected to the liquid supply system of the electroplating tank, and the other end is connected to the liquid supply system of the electroplating tank. The first end is used to send the electroplating liquid sucked by each of the first suction units 112 on this side back to the liquid supply system. The fifth sub-circulation liquid supply loop refers to the closed loop path formed by the liquid supply system, the fourth sub-liquid supply main pipe, the first spray unit 111 located on the other side of the circuit board 30 to be electroplated, and the electroplating tank connected in sequence. The sixth sub-circulation liquid supply loop refers to the closed loop path formed by the liquid supply system, the fourth sub-return liquid main pipe, the first suction unit 112 located on the other side of the circuit board 30 to be electroplated, and the electroplating tank connected in sequence.

[0096] It is understandable that by independently forming a third, fourth, fifth, and sixth sub-circuit liquid supply circuit with the spraying and suction units on both sides of the circuit board 30 to be electroplated, the electroplating solution circulation on both sides of the circuit board 30 to be electroplated is relatively independent. The independent circulation circuits on both sides can adjust their respective liquid supply pressure, flow rate, and filtration accuracy according to process requirements. When the two sides of the circuit board 30 to be electroplated have different requirements for electroplating conditions, differentiated control can be carried out to enhance the flexibility of the electroplating process.

[0097] In one possible implementation, the third sub-circulation supply circuit in this embodiment is equipped with a third sub-circulation flow display component, a third sub-circulation filter component, and a third sub-circulation pump component; the fourth sub-circulation supply circuit is equipped with a fourth sub-circulation flow display component, a fourth sub-circulation filter component, and a fourth sub-circulation pump component; the fifth sub-circulation supply circuit is equipped with a fifth sub-circulation flow display component, a fifth sub-circulation filter component, and a fifth sub-circulation pump component; and the sixth sub-circulation supply circuit is equipped with a sixth sub-circulation flow display component, a sixth sub-circulation filter component, and a sixth sub-circulation pump component. It is understood that the functions of the aforementioned sub-circulation flow display components, sub-circulation filter components, and sub-circulation pump components in their respective sub-circulation supply circuits are similar to the functions of the total circulation flow display component, total circulation filter component, and total circulation pump component in their respective circulation supply circuits, and will not be elaborated upon here.

[0098] In another embodiment, within the same first spray-suction module 11, the first spray unit 111 and the first suction unit 112 are connected to the liquid supply system of the electroplating tank 40 to form an independent circulating liquid supply loop. It should be noted that the independent circulating liquid supply loop in this embodiment refers to a closed loop path formed by the first spray unit 111, the first suction unit 112, and the liquid supply system of the electroplating tank 40 within the same first spray-suction module 11. Specifically, this independent circulating liquid supply loop includes a loop path formed by the sequential connection of the liquid supply system, the first spray unit 111, the electroplating tank 40, the first suction unit 112, and the liquid supply system. That is, the electroplating solution is transported from the liquid supply system to the first spray unit 111 of this module, sprayed onto the circuit board 30 to be electroplated by the first spray unit 111, and then flows into the electroplating tank 40. The first suction unit 112 corresponding to this module then suctions the electroplating solution from the electroplating tank 40 and finally returns it to the liquid supply system, completing an independent circulation process.

[0099] Understandably, by setting up an independent circulating liquid supply circuit for each first spray-suction module 11, the liquid supply, spraying, suction, and return of each module are relatively independent. Each module can independently adjust the liquid supply pressure, spray flow rate, and suction intensity according to the process requirements of its own area, achieving zoned and refined control. When a module needs maintenance or malfunctions, the circulation circuit of that module can be stopped independently without affecting the normal operation of other modules, thus improving the maintainability and operational reliability of the electroplating solution treatment device.

[0100] In one possible implementation, the independent circulating liquid supply circuit in this embodiment is equipped with a first circulating flow display component, a first circulating filter component, and a first circulating pump component. It is understood that the functions of the first circulating flow display component, the first circulating filter component, and the first circulating pump component in the corresponding independent circulating liquid supply circuit are similar to the functions of the total circulating flow display component, the total circulating filter component, and the total circulating pump component in the corresponding circulating liquid supply circuit, and will not be elaborated upon here.

[0101] In one embodiment, the electroplating solution treatment device further includes a control module. The control module is electrically connected to the switching valves on each supply pipeline and is used to control the on / off sequence of the corresponding switching valves to switch the working mode of the second processing section 20. It should be noted that the control module in this embodiment refers to an electronic control device electrically connected to the switching valves on each supply pipeline and used to control the opening and closing states of the switching valves. Its specific form includes, but is not limited to, a programmable logic controller, a microcontroller, a timing controller, or an industrial control computer. The switching valve refers to a valve device installed on each supply pipeline and used to control the on / off state of the supply pipeline. Its specific form may include, but is not limited to, a solenoid valve, a pneumatic valve, or an electric valve. The on / off sequence refers to the time sequence of the opening and closing signals sent by the control module to each switching valve, i.e., according to a preset time. The control module sequentially controls the opening and closing states of each switch valve. Switching the operating mode of the second processing section 20 refers to controlling the on / off sequence of the switch valves through the control module, allowing the second processing section 20 to switch between different operating modes. When alternating spray mode is required, the control module alternately opens and closes the switch valves on both sides of the liquid supply pipeline according to a preset time interval, so that the second spray unit 211 and the third spray unit 221 spray in turn. When simultaneous spray mode is required, the control module simultaneously opens the switch valves on both sides of the liquid supply pipeline, so that the second spray unit 211 and the third spray unit 221 spray together. The independent pipeline connecting the first spray module 21 to the liquid supply system is the first pipeline, and the switch valve installed on it is the first switch valve 2114. The independent pipeline connecting the second spray module 22 to the liquid supply system is the second pipeline, and the switch valve installed on it is the second switch valve 2214.

[0102] Understandably, by setting up a control module and electrically connecting it to the switching valves on each liquid supply pipeline, automated control of the spraying mode of the second treatment section 20 can be achieved without manual intervention. The control module can automatically execute the on / off sequence of the switching valves according to preset process parameters. When alternating spraying is required, the control module precisely controls the alternating opening and closing frequency and duty cycle of the switching valves on both sides, forming a unidirectional overall flow field with periodically changing direction, achieving a reciprocating impact effect to improve the exchange efficiency of the electroplating solution within the through-holes. When simultaneous spraying is required, the control module simultaneously opens the switching valves on both sides, forming a convective overall flow field with opposing impacts, achieving the effect of enhanced mass transfer on the plate surface and disruption of the concentration boundary layer. The introduction of the control module makes the switching of the working mode of the second treatment section 20 more precise, stable, and efficient. Simultaneously, the control module can also be linked with flow display components, alarm devices, etc., automatically adjusting the spraying status or executing shutdown protection when abnormal flow is detected, further improving the intelligence level and operational reliability of the electroplating solution treatment device.

[0103] In one embodiment, the control module is electrically connected to the switching valves on each liquid supply line in the third processing section, and is used to control the on / off timing of the corresponding switching valves to switch the operating mode of the third processing section. It is understood that since the structure of the third processing section is the same as that of the second processing section 20, the way the control module controls the third processing section to switch operating modes is similar and will not be elaborated here. Furthermore, when there is a switching valve in the circulating liquid supply circuit of the first processing section 10, the control module is electrically connected to the corresponding switching valve to control the on / off of the corresponding circulating liquid supply circuit.

[0104] For example, when the circulating liquid supply circuits of the first spray unit 111 and the first suction unit 112 located on one side of the circuit board 30 to be electroplated in the first processing section 10 are independent of each other (for example, all the first spray units 111 or all the first suction units 112 located on one side of the circuit board 30 to be electroplated share a circulating liquid supply circuit; or, each first spray unit 111 and each first suction unit 112 have their own independent circuit), and the circulating liquid supply circuit has a switching valve, the circulating liquid supply circuits of the first spray unit 111 and the first suction unit 112 located on the other side of the circuit board 30 to be electroplated in the first processing section 10 are independent of each other (for example, all the first spray units 111 or all the first suction units 112 located on the other ...). When each of the spraying units 111 and each of the first suction units 112 has an independent circuit, and the circulating liquid supply circuit has a switching valve, the first processing section 10 has a third working mode: all the first spraying units 111 on one side of the circuit board 30 to be electroplated spray the electroplating solution onto the circuit board 30 to be electroplated, and all the first suction units 112 on the other side of the circuit board 30 to be electroplated suction the electroplating solution; the first processing section 10 has a fourth working mode: all the first suction units 112 on one side of the circuit board 30 to be electroplated suction the electroplating solution, and all the first spraying units 111 on the other side of the circuit board 30 to be electroplated spray the electroplating solution onto the circuit board 30 to be electroplated; the first processing section 10 has a fifth working mode: all the first spraying units 111 spray the electroplating solution onto the circuit board 30 to be electroplated, and all the first suction units 112 suction the electroplating solution. The control module is electrically connected to the switching valves on each circulating liquid supply circuit and is used to control the on / off sequence of the corresponding switching valves to switch the working mode of the first processing section. Understandably, by setting up a control module and electrically connecting the control module to the switching valves on each circulating liquid supply circuit, automated control of the first processing section 10's operating mode can be achieved without manual intervention.The control module can automatically execute the on / off sequence of the switching valves according to preset process parameters to switch between the third, fourth, or fifth working modes of the first processing section 10. In the third working mode, the control module opens the switching valve of the circulating liquid supply circuit where the first spray unit 111 on one side of the circuit board 30 to be electroplated is located, and opens the switching valve of the circulating liquid supply circuit where the first suction unit 112 on the other side of the circuit board 30 to be electroplated, forming a first directional flow field from one side to the other side, realizing the unidirectional penetration effect of the electroplating solution in the through hole, and improving the electroplating solution exchange efficiency in the through hole. In the fourth working mode, the control module opens the switching valve of the circulating liquid supply circuit where the first suction unit 112 on one side of the circuit board 30 to be electroplated is located. The control module simultaneously opens the valves of the circulating liquid supply circuits of the first spray unit 111 on the other side of the circuit board 30 to be electroplated, forming a first directional flow field opposite to the direction of the third working mode, realizing a reverse penetration effect. In conjunction with the third working mode, it can form an alternating directional flow field, further improving the uniformity of electroplating solution exchange in the through hole. In the fifth working mode, the control module simultaneously opens the valves of the circulating liquid supply circuits of the first spray unit 111 and the first suction unit 112 on both sides of the circuit board 30 to be electroplated. At this time, among the multiple first directional flow fields formed, the direction of some first directional flow fields is opposite to the direction of other first directional flow fields. While improving electroplating efficiency, it also improves the uniformity of electroplating solution exchange in the through hole.

[0105] In one embodiment, all the second spray units 211 of the second processing section 20 in this embodiment are connected to the first spray main pipe 212, and all the third spray units 221 are connected to the second spray main pipe 222. The first spray main pipe 212 and the second spray main pipe 222 are respectively connected to the liquid supply system through independent liquid supply pipelines to form a first liquid supply circuit and a second liquid supply circuit. It should be noted that, in this embodiment, the first liquid supply circuit refers to the liquid supply path formed by the sequential connection of the liquid supply system, the first spray main pipe 212, the second spray unit 211, and the electroplating tank 40. The electroplating liquid is transported from the liquid supply system to the first spray main pipe 212 through an independent liquid supply pipeline, and then distributed by the first spray main pipe 212 to each of the second spray units 211. After being sprayed by the second spray units 211 onto the circuit board 30 to be electroplated, it flows into the electroplating tank 40. The second liquid supply circuit refers to the liquid supply path formed by the sequential connection of the liquid supply system, the second spray main pipe 222, the third spray unit 221, and the electroplating tank 40. The electroplating liquid is transported from the liquid supply system to the second spray main pipe 222 through an independent liquid supply pipeline, and then distributed by the second spray main pipe 222 to each of the third spray units 221. After being sprayed by the third spray units 221 onto the circuit board 30 to be electroplated, it flows into the electroplating tank 40.

[0106] It is understandable that by setting the first spray main pipe 212 to connect all the second spray units 211 in parallel, and setting the second spray main pipe 222 to connect all the third spray units 221 in parallel, and by configuring independent liquid supply pipelines for the first spray main pipe 212 and the second spray main pipe 222 respectively, the first liquid supply circuit and the second liquid supply circuit are relatively independent. The independent configuration of the first liquid supply circuit and the second liquid supply circuit allows for adjustment of the liquid supply pressure, spray flow rate and spray start-stop sequence on both sides according to process requirements. When alternating spraying is required, the on / off state of the liquid supply pipelines on both sides can be independently controlled to achieve alternating spraying; when simultaneous spraying is required, the liquid supply pipelines on both sides can be opened simultaneously to achieve joint spraying.

[0107] See Figures 10 to 13 As shown, in one possible implementation, the first liquid supply circuit in this embodiment is provided with a first sub-liquid supply flow display component 2113, a first sub-liquid supply filter component 2112 and a first sub-liquid supply pump component, and the second liquid supply circuit is provided with a second sub-liquid supply flow display component 2213, a second sub-liquid supply filter component 2212 and a second sub-liquid supply pump component. It should be noted that, in this embodiment, the first sub-supply flow rate display component 2113 refers to a device or instrument installed in the first supply circuit for real-time monitoring and display of the electroplating solution flow rate in the circuit. Its specific forms include, but are not limited to, electronic flow meters, rotor flow meters, or flow sensors with display functions. The first sub-supply filtration component 2112 refers to a device installed in the first supply circuit for filtering the electroplating solution flowing in the circuit, used to intercept and remove solid particles, precipitates, or impurities that may be contained in the electroplating solution. Its specific forms include, but are not limited to, bag filters, cartridge filters, mesh filters, or sedimentation filters. The first sub-supply pump component refers to a device installed in the first supply circuit for providing driving power for supplying the electroplating solution in the circuit. Its specific forms include, but are not limited to, centrifugal pumps, magnetic pumps, diaphragm pumps, or gear pumps. The first sub-supply flow rate display component 2113, the first sub-supply filtration component 2112, and the first sub-supply pump component are sequentially connected or arranged in the first supply circuit according to process requirements, together constituting the supply function unit of the first supply circuit.

[0108] The second sub-supply flow display component 2213 refers to a device or instrument installed in the second supply circuit for real-time monitoring and display of the electroplating solution flow rate in the circuit. Its specific forms include, but are not limited to, electronic flow meters, rotor flow meters, or flow sensors with display functions. The second sub-supply filtration component 2212 refers to a device installed in the second supply circuit for filtering the electroplating solution flowing in the circuit. Its specific forms include, but are not limited to, bag filters, cartridge filters, mesh filters, or sedimentation filters. The second sub-supply pump component refers to a device installed in the second supply circuit for providing driving power for supplying the electroplating solution in the circuit. Its specific forms include, but are not limited to, centrifugal pumps, magnetic pumps, diaphragm pumps, or gear pumps. The second sub-supply flow display component 2213, the second sub-supply filtration component 2212, and the second sub-supply pump component are sequentially connected or arranged in the second supply circuit according to process requirements, together constituting the supply function unit of the second supply circuit.

[0109] Understandably, by independently setting up liquid supply pump assemblies, liquid supply filter assemblies, and liquid supply flow display assemblies for the first and second liquid supply circuits respectively, the two liquid supply circuits are relatively independent, each possessing complete power, filtration, and monitoring functions. The independent liquid supply pump assemblies can adjust the liquid supply pressure and flow rate on both sides according to process requirements, achieving independent control of the spray intensity on both sides; the independent liquid supply filter assemblies can filter the electroplating solutions on both sides separately, avoiding cross-contamination between the two circuits; and the independent liquid supply flow display assemblies can monitor the flow status of both sides separately, enabling timely detection and targeted handling when an abnormal flow occurs on one side of the circuit.

[0110] In another embodiment, the multiple second spray units 211 and multiple third spray units 221 of the second processing section 20 in this embodiment are each connected to the liquid supply system through independent liquid supply pipelines, forming multiple independent liquid supply circuits. The independent liquid supply circuit located on one side of the circuit board 30 to be electroplated is the first independent liquid supply circuit, and the independent liquid supply circuit located on the other side of the circuit board 30 to be electroplated is the second independent liquid supply circuit. It should be noted that, in this embodiment, an independent liquid supply circuit refers to a liquid supply path formed by a single second spray unit 211 or a single third spray unit 221 directly connected to the liquid supply system of the electroplating tank 40 through an independent liquid supply pipeline; multiple second spray units 211 and multiple third spray units 221 connected to the liquid supply system through independent liquid supply pipelines means that each second spray unit 211 and each third spray unit 221 has its own independent pipeline directly supplying liquid from the liquid supply system, and the liquid supply pipelines are independent of each other and not interconnected. The liquid supply on / off and flow rate of each spray unit can be controlled individually; the first independent liquid supply circuit refers to the independent liquid supply circuit corresponding to each of the second spray units 211 located on one side of the circuit board 30 to be electroplated, that is, each second spray unit 211 and its independent liquid supply pipeline together constitute a first independent liquid supply circuit; the second independent liquid supply circuit refers to the independent liquid supply circuit corresponding to each of the third spray units 221 located on the other side of the circuit board 30 to be electroplated, that is, each third spray unit 221 and its independent liquid supply pipeline together constitute a second independent liquid supply circuit.

[0111] Understandably, by setting independent liquid supply lines for each second spray unit 211 and each third spray unit 221, each spray unit has a completely independent liquid supply circuit, achieving unit-level fine adjustment of spray control. Each spray unit can independently adjust the liquid supply pressure and spray flow rate according to the electroplating requirements of its location. When it is necessary to intensify spraying in a specific area or adjust the spray mode, the working status of the corresponding spray unit can be controlled independently. When a spray unit malfunctions, the liquid supply line of that unit can be shut off for maintenance without affecting the normal operation of other spray units.

[0112] In one possible implementation, the first independent liquid supply circuit in this embodiment is equipped with a first liquid supply flow display component, a first liquid supply filter component, and a first liquid supply pump component, while the second independent liquid supply circuit is equipped with a second liquid supply flow display component, a second liquid supply filter component, and a second liquid supply pump component. It is understood that the functions of the aforementioned liquid supply flow display component, liquid supply filter component, and liquid supply pump component in the corresponding independent circulation liquid supply circuit are similar to the functions of the sub-liquid supply flow display component, sub-liquid supply filter component, and sub-liquid supply pump component in the corresponding liquid supply circuit, and will not be elaborated upon here.

[0113] According to a second aspect of the embodiments of this application, an electroplating apparatus is provided, the electroplating apparatus including an electroplating tank 40 and an electroplating solution treatment device, wherein the electroplating solution treatment device is the aforementioned electroplating solution treatment device.

[0114] In some embodiments, the electroplating equipment in this embodiment further includes a movable lifting device and an electroplating power supply. The movable lifting device is installed above the electroplating tank 40 and is used to clamp the circuit board 30 to be electroplated and drive it to move along the length direction of the electroplating tank 40, so that the circuit board 30 to be electroplated can pass through the first processing section 10, the second processing section 20 and other optional processing sections, such as the third processing section, in sequence to achieve continuous and automated electroplating processing. The electroplating power supply is electrically connected to the circuit board 30 to be electroplated, which serves as the cathode, and the anode disposed in the electroplating tank 40, respectively, and is used to apply an electroplating voltage between the circuit board 30 to be electroplated and the anode, so that metal ions in the electroplating solution are deposited on the surface of the circuit board 30 to be electroplated and the inner wall of the through hole under the action of the electric field. By setting up a mobile lifting device, the circuit board 30 to be electroplated can be automatically transferred within the electroplating tank 40, eliminating the need for manual handling or positioning. This improves electroplating production efficiency and ease of operation. Simultaneously, the stable clamping and precise movement of the mobile lifting device ensures that the circuit board 30 maintains the correct posture and position throughout the electroplating process, preventing uneven processing due to offset or shaking. By setting up an electroplating power supply and providing the necessary electric field drive for the electroplating reaction, metal ions in the electroplating solution can migrate and deposit directionally under the influence of the electric field, ensuring the normal progress of the electroplating process. Furthermore, the stable output of the electroplating power supply guarantees the stability of the electroplating current and voltage, preventing uneven plating thickness or reduced adhesion due to power fluctuations. The coordinated operation of the electroplating power supply and the mobile lifting device ensures that the circuit board 30 is continuously subjected to the electric field during movement, achieving continuous electroplating and improving the plating uniformity and efficiency of high aspect ratio through-holes.

[0115] In summary, the electroplating solution treatment apparatus and electroplating equipment provided in this embodiment have at least the following beneficial technical effects: The electroplating solution treatment apparatus provided in this embodiment, by setting a first treatment section 10 and a second treatment section 20 arranged sequentially along the conveying direction, can effectively combine deep plating capability and coating uniformity. Specifically, the first treatment section 10 can form a first directional flow field with multiple through holes and adjacent flow directions opposite in the electroplating tank 40 through multiple sets of spaced first spray suction modules 11. The first directional flow field can form a pressure gradient at both ends of the through holes, thereby forcing the electroplating solution to penetrate the through holes at high speed and improving the electroplating solution in the through holes. In terms of exchange efficiency, as the circuit board 30 to be electroplated is transported, multiple first directional flow fields can act on the through holes in sequence. Since the flow directions of adjacent first directional flow fields are opposite, the electroplating solution can alternately penetrate the through holes in two opposite directions, thereby ensuring that a uniform initial plating layer is formed in the through holes. The second processing section 20 can quickly thicken or alternately unidirectionally plate the circuit board 30 to be electroplated with the initial plating layer through the alternating or simultaneous spraying of the first spray module 21 and the second spray module 22, thereby efficiently completing the plating layer thickening and further improving the uniformity of the plating layer on the board surface, achieving compatibility between deep plating capability and plating layer uniformity.

[0116] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electroplating solution treatment apparatus, disposed within an electroplating tank (40), for electroplating a circuit board (30) having through holes with a high aspect ratio, characterized in that, The electroplating solution treatment device includes a first treatment section (10) and a second treatment section (20) arranged sequentially along the conveying direction of the circuit board (30) to be electroplated. The first processing section (10) includes multiple sets of first spray suction modules (11) arranged at intervals along the conveying direction. Each set of first spray suction modules (11) includes a first spray unit (111) and a first suction unit (112) disposed on both sides of the thickness direction of the circuit board (30) to be electroplated. Along the thickness direction, the first spray unit (111) corresponds one-to-one with the first suction unit (112) on the opposite side, forming multiple first directional flow fields penetrating the through hole. The second processing section (20) includes a first spray module (21) and a second spray module (22) disposed on both sides of the thickness direction of the circuit board (30) to be electroplated. The first spray module (21) includes a plurality of second spray units (211) arranged at intervals along the conveying direction. The second spray module (22) includes a plurality of third spray units (221) arranged at intervals along the conveying direction. The first spray module (21) and the second spray module (22) are respectively connected to the liquid supply system through independent liquid supply pipelines so as to independently control the on and off states.

2. The electroplating solution treatment apparatus according to claim 1, characterized in that, The first spray unit (111) has a first nozzle (11111) and the first suction unit (112) has a first suction nozzle (11211). Within the same first spray and suction module (11), the central axis of the first nozzle (11111) coincides with the central axis of the first suction nozzle (11211) and is perpendicular to the surface of the circuit board (30) to be electroplated.

3. The electroplating solution treatment apparatus according to claim 2, characterized in that, The distance between the first nozzle (11111) and the corresponding first suction nozzle (11211) is 5mm to 50mm.

4. The electroplating solution treatment apparatus according to claim 1, characterized in that, Along the same side of the circuit board (30) to be electroplated, the first spray unit (111) and the first suction unit (112) are arranged alternately, and the adjacent first directional flow fields flow in opposite directions.

5. The electroplating solution treatment apparatus according to claim 1, characterized in that, The first spray module (21) includes a first spray main pipe (212) extending along the conveying direction, the second spray module (22) includes a second spray main pipe (222) extending along the conveying direction, a plurality of second spray units (211) are arranged at intervals along the length direction of the first spray main pipe (212), and a plurality of third spray units (221) are arranged at intervals along the length direction of the second spray main pipe (222). Both the first spray pipe (212) and the second spray pipe (222) can be slidably installed on the inner wall of the electroplating tank (40), and can drive the corresponding second spray unit (211) and / or the third spray unit (221) to move along the conveying direction to adjust the relative position of the second spray unit (211) and the third spray unit (221).

6. The electroplating solution treatment apparatus according to claim 5, characterized in that, The inner wall of the electroplating tank (40) is provided with a slide rail (71) extending along the conveying direction. Both ends of the first spray pipe (212) and the second spray pipe (222) are provided with sliders (72) that cooperate with the slide rail (71). The sliders (72) are connected to a driving mechanism, which is used to drive the first spray pipe (212) and the second spray pipe (222) to slide along the slide rail (71).

7. The electroplating solution treatment apparatus according to claim 1, characterized in that, The second processing section (20) has a first working mode: the second spray unit (211) of the first spray module (21) and the third spray unit (221) of the second spray module (22) are staggered along the conveying direction, and all the second spray units (211) and the third spray unit (221) simultaneously spray electroplating liquid onto the circuit board (30) to be electroplated, so as to form a flow field with an unsteady pressure gradient.

8. The electroplating solution treatment apparatus according to claim 1, characterized in that, The second processing section (20) has a second working mode: the second spray unit (211) and the third spray unit (221) alternately spray the electroplating solution separately to form an alternating unidirectional flow field with an unsteady pressure gradient.

9. The electroplating solution treatment apparatus according to claim 8, characterized in that, The second spray unit (211) of the first spray module (21) and the third spray unit (221) of the second spray module (22) are arranged opposite each other along the conveying direction.

10. The electroplating solution treatment apparatus according to claim 1, characterized in that, The electroplating solution treatment device further includes a first isolation structure, which is disposed between the first treatment section (10) and the second treatment section (20) to reduce the mutual interference of the flow fields between the two. The first isolation structure is provided with a first slit for the circuit board (30) to be electroplated to pass through. And / or, the electroplating solution treatment device further includes a second isolation structure, which is disposed between two adjacent first spray suction modules (11) to reduce mutual interference of the flow fields between them. The second isolation structure is provided with a second slit for the circuit board (30) to be electroplated to pass through.

11. The electroplating solution treatment apparatus according to any one of claims 1 to 10, characterized in that, The electroplating solution treatment device further includes a third treatment section arranged downstream of the second treatment section (20) along the conveying direction. The structure of the third treatment section is the same as that of the second treatment section (20). The working modes of the third treatment section and the second treatment section (20) are mutually exclusive: when the second treatment section (20) is in the first working mode, the third treatment section is in the second working mode; when the second treatment section (20) is in the second working mode, the third treatment section is in the first working mode.

12. The electroplating solution treatment apparatus according to any one of claims 1 to 10, characterized in that, The electroplating solution treatment device further includes a third treatment section arranged downstream of the second treatment section (20) along the conveying direction, and the structure of the third treatment section is the same as that of the first treatment section (10).

13. The electroplating solution treatment apparatus according to claim 1, characterized in that, At least one turbine assembly (80) is arranged in the first spray unit (111).

14. The electroplating solution treatment apparatus according to claim 13, characterized in that, At least one of the turbine components (80) is disposed at the liquid supply input end of the first spray unit (111) for pre-pressurizing the electroplating solution that is about to enter the first spray unit; And / or, the first spray unit (111) has a plurality of first nozzles (11111) spaced apart, and at least one of the turbine components (80) is disposed between two adjacent first nozzles (11111) on the first spray unit (111) to compensate for the pressure loss along the flow path of the electroplating solution of the first spray unit (111). And / or, at least one of the turbine components (80) is disposed at the liquid supply end of the first spray unit (111) to eliminate end backflow eddies.

15. The electroplating solution treatment apparatus according to claim 1, characterized in that, A spiral guide assembly is arranged in the first spray unit (111), and the spiral guide assembly is arranged along the extension direction of the first spray unit (111).

16. The electroplating solution treatment apparatus according to claim 10, characterized in that, The first spray unit (111) has a first nozzle (11111), the second spray unit (211) has a second nozzle (21111), and the third spray unit (221) has a third nozzle (22111). The spray angle of the first nozzle (11111) is smaller than the spray angle of the second nozzle (21111) and smaller than the spray angle of the third nozzle (22111).

17. The electroplating solution treatment apparatus according to claim 1, characterized in that, All the first spray units (111) of the first processing section (10) are connected to the first liquid supply main pipe, and all the first suction units (112) are connected to the first liquid return main pipe. The first liquid supply main pipe and the first liquid return main pipe are connected to the liquid supply system of the electroplating tank (40) to form a circulating liquid supply loop.

18. The electroplating solution treatment apparatus according to any one of claims 1 to 10, characterized in that, The electroplating solution treatment device also includes a control module, which is electrically connected to the switching valves on each of the supply pipelines and is used to control the on / off sequence of the corresponding switching valves to switch the working mode of the second processing section (20).

19. An electroplating device, characterized in that, The electroplating equipment includes an electroplating tank (40) and an electroplating solution treatment device, wherein the electroplating solution treatment device is the electroplating solution treatment device according to any one of claims 1 to 18.

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