Wafer electroplating processing device
By setting up a multi-locking structure in the wafer electroplating processing equipment, the distance of the loading rack can be flexibly adjusted and stability can be guaranteed, which solves the problem that the equipment in the prior art cannot be adapted to wafers of different sizes, and improves production efficiency and equipment reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NANTONG ZHUOLIDA METAL TECH CO LTD
- Filing Date
- 2026-01-18
- Publication Date
- 2026-05-29
AI Technical Summary
Existing wafer electroplating processing equipment cannot flexibly adapt to wafers of different sizes, resulting in high equipment configuration costs, low production efficiency, and insufficient positioning accuracy and stability.
By setting multiple locking structures on the loading rack, including components such as operating sleeves, shifting sleeves, control boards, and support rods, the distance of the loading rack can be flexibly adjusted, and the stability after adjustment is ensured by the multiple locking structures, adapting to the size specifications of different batches of wafers.
This improved the device's adaptability to wafers of different sizes, enhanced production flexibility and equipment stability, and ensured stable wafer loading and processing quality.
Smart Images
Figure CN122105588A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer electroplating technology, and more specifically, to a wafer electroplating apparatus. Background Technology
[0002] In existing technologies, wafer electroplating processing equipment is commonly used in the semiconductor manufacturing field. Electroplating processes deposit metal layers on the surface of wafers to achieve circuit interconnection and functional structure fabrication, which plays an important role in ensuring chip manufacturing quality and production efficiency. As an important component of the electroplating processing equipment, the loading rack undertakes the key function of fixing and supporting the wafers. The positioning accuracy and stability of the wafers in the loading rack directly affect the uniformity of the electroplated layer and the processing quality. However, due to the differences in diameter of wafers of different specifications, the accommodating size of the loading rack in existing technologies is usually a fixed value, which can only accommodate wafers that match its size. It is impossible to flexibly adapt and adjust the accommodating size of the loading rack according to the actual size specifications of different batches of wafers. When it is necessary to process wafers of different sizes, it is often necessary to replace the entire loading rack, which increases equipment configuration costs and production changeover time, affecting production efficiency and equipment utilization.
[0003] In addition, although some improved equipment has achieved flexible and stepless adjustment of wafer loading size through the cooperation of adjustable components, its adjustment and fixing structure design is relatively simple and lacks stability and reliability. During long-term operation, the adjusted fixing structure is prone to loosening or displacement due to factors such as equipment vibration or external force collisions during operation. This causes deviations in the adjusted loading size, which not only affects the positioning accuracy and clamping stability of the wafer in the loading rack, but may also damage the wafer, reduce the reliability of the equipment and the product qualification rate. Summary of the Invention
[0004] (a) Technical problems to be solved In view of the problems existing in the prior art, the present invention provides a wafer electroplating processing apparatus to solve the technical problems mentioned in the background art.
[0005] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: a wafer electroplating processing apparatus, comprising a base frame, a loading frame movably disposed on the inner side of the base frame, a sliding frame fixedly connected to one side of the loading frame, a configuration sleeve fixedly disposed in the sliding frame, a sliding rod fixedly disposed on one side of the loading frame, the configuration sleeve slidably disposed on the outside of the sliding rod, an operating sleeve rotatably disposed on the outside of the configuration sleeve, a movable sleeve disposed on the outside of the configuration sleeve, a displacement sleeve slidably disposed on the outside of the configuration sleeve, the outer wall of the displacement sleeve being movably connected to the inner wall of the operating sleeve by threads, a plurality of displacement grooves being formed on the outer wall of the configuration sleeve, a plurality of configuration grooves being formed on the inner side of the displacement sleeve, a support rod fixedly connected to one side of the movable sleeve, a support plate fixedly disposed on the support rod, and two support plates being fixedly disposed at different locations. The control sleeve is fixedly mounted on a support rod. A control plate is rotatably mounted on the outer side of the control sleeve. The control plate has a control hole and a control groove. The control groove is arc-shaped and located at one end of the control groove. A limiting seat is fixedly mounted on one side of the control sleeve. A moving rod is slidably mounted in the limiting seat. One end of the moving rod is connected to a moving plate. The other end of the moving rod is inserted into a shifting groove. A moving spring is movably mounted on the outer side of the moving rod. Both ends of the moving spring are connected to the moving plate and the limiting seat, respectively. A mating block is slidably mounted in the configuration groove. A transmission block is connected to one side of the mating block. A clamping block is connected to the other end of the transmission block. Multiple elastic springs are connected to the other side of the clamping block. The other ends of the elastic springs are connected to the clamping plate.
[0006] The present invention is further configured such that a slide rail is fixedly provided on the inner side of the loading frame, and slide grooves are adaptively provided on both sides of the loading frame.
[0007] The present invention is further configured such that guide rods are symmetrically provided on both sides of the slide rod, and guide grooves are provided on the loading frame. The loading frame is slidably connected to the guide rods through the guide grooves, and the guide rods are fixedly installed inside the base frame.
[0008] The present invention is further configured such that the displacement sleeve is symmetrically arranged in two places, and the threads on both sides of the inner wall of the operating sleeve are symmetrically arranged.
[0009] The invention is further configured such that a plurality of guide rods are fixedly connected to one side of the clamping plate, and a plurality of guide holes are opened in the clamping block, and the guide rods slide through the guide holes.
[0010] The present invention is further configured such that a friction strip is fixedly connected to one side of the clamping plate.
[0011] The invention is further configured such that the plurality of guide rods are parallel to the transmission block.
[0012] The invention is further configured such that a control spring is movably sleeved on the outside of the support rod, one end of the control spring is connected to the movable sleeve, and the other end of the control spring abuts against one side of the control plate.
[0013] (III) Beneficial Effects Compared with the prior art, the present invention provides a wafer electroplating processing apparatus, which has the following beneficial effects: 1. By setting an operating sleeve on the outside of the configuration sleeve and forming a threaded fit between the inner wall of the operating sleeve and the outer wall of the shift sleeve, the two shift sleeves are symmetrically arranged and the threads on both sides of the inner wall of the operating sleeve are symmetrically arranged. When the operating sleeve is rotated, the two shift sleeves slide separately. The shift sleeve drives the configuration slot opened on the inner side to slide. The mating block moves in the configuration slot and drives the clamping block to slide through the transmission block. The clamping block drives the clamping plate to move synchronously through the elastic spring. When the inner wall of the clamping plate no longer clamps the outer wall of the slide rod, the position of the loading frame can be moved, thereby realizing the flexible adjustment of the distance between the two loading frames. The operator can adjust the appropriate accommodating size according to the size specifications of different batches of wafers, effectively improving the device's adaptability to wafers of different sizes and production flexibility.
[0014] 2. By setting a control plate on the outside of the configuration sleeve and opening control holes and arc-shaped control grooves on the control plate, and cooperating with the support rods connected to one side of the movable sleeve and multiple support plates, after the size adjustment is completed, rotating the control plate will cause the control holes to be misaligned with the support plates. The support rods, in conjunction with the corresponding support plates, will support and limit the movable sleeve to one side of the control plate. The inner wall of the movable sleeve will re-limit the outer wall of the transfer plate, preventing it from moving outward. One end of the transfer rod is inserted into the displacement groove opened on the outer wall of the configuration sleeve and cooperates with the limiting seat to form a rotation limit on the control sleeve. The multiple locking structures cooperate and restrict each other, effectively preventing the problem of loosening and displacement of the adjustment components due to vibration or external collision during equipment operation, and ensuring the stability of the loading frame after position adjustment. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of a wafer electroplating processing apparatus according to the present invention; Figure 2 This is a schematic diagram of the loading frame portion in this invention; Figure 3 This is a cross-sectional view of the configuration sleeve, control sleeve, moving sleeve, and operating sleeve in this invention. Figure 4 This is a schematic diagram of the dispersed structure of the configuration sleeve, control sleeve, moving sleeve and operating sleeve in this invention; Figure 5 This is a schematic diagram of the dispersed structure of the clamping block and clamping plate in this invention.
[0016] In the diagram: 1. Base frame; 2. Loading frame; 3. Sliding frame; 4. Configuration sleeve; 5. Slide rod; 6. Control sleeve; 7. Moving sleeve; 8. Displacement sleeve; 9. Displacement groove; 10. Configuration groove; 11. Support rod; 12. Support plate; 13. Control plate; 14. Control hole; 15. Control groove; 16. Limiting seat; 17. Traveling rod; 18. Traveling plate; 19. Traveling spring; 20. Mating block; 21. Transmission block; 22. Clamping block; 23. Elastic spring; 24. Clamping plate; 25. Slide rail; 26. Slide groove; 27. Guide rod; 28. Guide groove; 29. Guide rod; 30. Guide hole; 31. Friction strip; 32. Control spring. Detailed Implementation
[0017] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0018] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0019] In this invention, unless otherwise stated, the directional terms such as "up" and "down" generally refer to the directions shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" generally refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.
[0020] Please see Figures 1-5A wafer electroplating processing apparatus includes a base frame 1, a loading frame 2 movably mounted inside the base frame 1, a sliding frame 3 fixedly connected to one side of the loading frame 2, a configuration sleeve 4 fixedly mounted in the sliding frame 3, a sliding rod 5 fixedly mounted to one side of the loading frame 2, the configuration sleeve 4 slidably mounted on the outside of the sliding rod 5, an operating sleeve 6 rotatably mounted on the outside of the configuration sleeve 4, a movable sleeve 7 mounted on the outside of the configuration sleeve 4, and a displacement sleeve 8 slidably mounted on the outside of the configuration sleeve 4. The outer wall of the displacement sleeve 8 is movably connected to the inner wall of the operating sleeve 6 by threads. The outer wall of the configuration sleeve 4 has multiple displacement grooves 9, and the inner side of the displacement sleeve 8 has multiple configuration grooves 10. A support rod 11 is fixedly connected to one side of the movable sleeve 7, a support plate 12 is fixedly mounted on the support rod 11, and two support plates 12 are fixedly mounted on the support rod 11. A control plate 1 is rotatably mounted on the outside of the configuration sleeve 4. 3. The control plate 13 is provided with a control hole 14 and a control groove 15. The control groove 15 is arc-shaped and is provided on the control plate 13. The control hole 14 is provided at one end of the control groove 15. A limiting seat 16 is fixedly provided on one side of the operating sleeve 6. A moving rod 17 is slidably provided in the limiting seat 16. A moving plate 18 is connected to one end of the moving rod 17. The other end of the moving rod 17 is inserted into the shifting groove 9. A moving spring 19 is movably sleeved on the outside of the moving rod 17. The two ends of the moving spring 19 are connected to the moving plate 18 and the limiting seat 16, respectively. A mating block 20 is slidably provided in the configuration groove 10. A transmission block 21 is connected to one side of the mating block 20. A clamping block 22 is connected to the other end of the transmission block 21. Multiple elastic springs 23 are connected to the other side of the clamping block 22. A clamping plate 24 is connected to the other end of the elastic springs 23.
[0021] The loading frame 2 is fixedly provided with a slide rail 25 on the inner side, and the loading frame 2 is adapted to have a slide groove 26 on both sides.
[0022] Guide rods 27 are symmetrically arranged on both sides of the slide rod 5, and guide grooves 28 are provided on the loading frame 2. The loading frame 2 is slidably connected to the guide rods 27 through the guide grooves 28, and the guide rods 27 are fixedly arranged inside the base frame 1.
[0023] In this embodiment, when adaptive adjustments are needed based on the size of different batches of wafers, the distance between the two loading racks 2 is adjusted. First, the control plate 13 is rotated clockwise. Then, the control plate 13 drives the control hole 14 and the control slot 15 to rotate clockwise. When the control hole 14 rotates clockwise to a position concentric with the support plate 12, the moving sleeve 7 is pushed, causing the moving sleeve 7 to drive one side of the support rod 11 and the support plate 12 to gradually slide into the control hole 14. The moving sleeve 7 and the control plate 13 cooperate to compress the control spring 32. When the control spring 32 is compressed to its limit, the support plate 12 installed in the middle of the support rod 11 just slides through the control hole 14 and moves to the other side of the control plate 13. At this time, the control plate 12 is rotated counterclockwise. The control plate 13 causes the control hole 14 and control groove 15 to rotate in opposite directions. Then, the support rod 11 enters the control groove 15. When the outer wall of the support rod 11 contacts one end of the inner wall of the control groove 15, the rotation of the control plate 13 stops. At this time, the support rod 11, together with the support plate 12 installed in its middle section, limits the moving sleeve 7 to one side of the control plate 13, so that the inner wall of the moving sleeve 7 no longer limits the outer wall of the transfer plate 18. Then, the operating sleeve 6 is rotated in the forward direction, so that the operating sleeve 6 drives the limiting seat 16 on one side to rotate in the forward direction. Then, the limiting seat 16 drives the transfer rod 17, the transfer plate 18 and the transfer spring 19 to rotate in the forward direction. Then, the inner wall of the transfer groove 9 presses against one end of the transfer rod 17. The rounded corner design at one end of the moving rod 17 and the inner edge of the shifting groove 9 allows one end of the moving rod 17 to gradually slide out of the shifting groove 9, while the other end of the moving rod 17 drives the shifting plate 18 to slide outward, causing the shifting plate 18 to drive the shifting spring 19 to stretch outward. Simultaneously, due to the threaded fit between the inner wall of the operating sleeve 6 and the outer wall of the shifting sleeve 8, and the symmetrical arrangement of the threads on both sides of the inner wall of the operating sleeve 6, the two shifting sleeves 8 will slide separately, increasing the distance between them. The shifting sleeve 8 will then drive the inclined inner mounting groove 10 to slide, causing the mating block 20 to move within the mounting groove 10. The mating block 20 then drives the clamping block 22 outward via the transmission block 21. The sliding motion lengthens the distance between the clamping block 22 and the clamping plate 24, and the clamping block 22 drives the guide hole 30 to slide along the guide rod 29. At the same time, the elastic spring 23 gradually returns to its original position. When the elastic spring 23 is fully returned to its original position, the clamping block 22 drives the clamping plate 24 to slide outward through the elastic spring 23, so that the inner wall of the clamping plate 24 no longer clamps the outer wall of the slide rod 5. Then the position of the loading rack 2 can be moved, so that the loading rack 2 drives the guide groove 28 to slide along the guide rod 27, while driving the two side slide grooves 26 to slide along the slide rail 25. At the same time, the sliding frame 3 drives the inner configuration sleeve 4 and other components to slide along the slide rod 5. Then, the position of the other loading rack can be adjusted according to the above steps.
[0024] Please see Figures 3-5 As a further implementation of the overall equipment: the shift sleeve 8 is symmetrically arranged in two places, and the threads on both sides of the inner wall of the operating sleeve 6 are symmetrically arranged.
[0025] Multiple guide rods 29 are fixedly connected to one side of the clamping plate 24, and multiple guide holes 30 are opened in the clamping block 22, through which the guide rods 29 slide.
[0026] A friction strip 31 is fixedly connected to one side of the clamping plate 24.
[0027] Multiple guide rods 29 are parallel to the transmission block 21.
[0028] A control spring 32 is movably sleeved on the outside of the support rod 11. One end of the control spring 32 is connected to the movable sleeve 7, and the other end of the control spring 32 abuts against one side of the control plate 13.
[0029] More specifically, after the positions of the two loading racks 2 are properly adjusted, the control sleeve 6 is rotated in the opposite direction. This causes the control sleeve 6 to drive the transfer rod 17, transfer plate 18, and transfer spring 19 to rotate and reset in the opposite direction via the limiting seat 16. At the same time, the two shift sleeves 8 are symmetrically arranged with threaded engagement on both sides of the inner wall of the control sleeve 6, causing them to slide and reset in the opposite direction. This shortens the distance between the two shift sleeves 8, and the shift sleeves 8 drive the inner configuration groove 10 to slide and reset. Then, the mating block 20 moves in the opposite direction in the configuration groove 10, causing the mating block 20 to drive the clamping block 22 to converge inward via the transmission block 21. The clamping block 22 then drives the clamping plate 24 to converge inward via the elastic spring 23. Simultaneously, the guide hole 30 and The guide rod 29 will follow and converge inward. When the inner wall of the clamping plate 24 contacts the outer wall of the slide rod 5, the clamping block 22 continues to converge inward, so that the clamping block 22 and the clamping plate 24 cooperate to compress the elastic spring 23 sleeved on the outer side of the guide rod 29. The clamping block 22 will also drive the guide hole 30 to slide along the guide rod 29, so that the clamping block 22 and the clamping plate 24 cooperate to press the elastic spring 23 tightly. The clamping plate 24 presses the multiple friction strips 31 on the inner side against the outer wall of the slide rod 5, thereby fixing the slide rod 5. At the same time, the operating sleeve 6 drives the transfer rod 17 to reverse and reset to the position corresponding to the original transfer groove 9 through the limiting seat 16. Then the transfer spring 19 resets and pulls the transfer plate 18, so that the transfer plate 18 moves... The movable rod 17 slides inward to reset, allowing one end of the movable rod 17 to re-insert into the original displacement slot 9. Then, the control plate 13 is rotated forward again, causing the control plate 13 to drive the control hole 14 and control slot 15 to rotate forward again. When the control hole 14 rotates to the position concentric with the support plate 12, the control spring 32 resets and pushes the moving sleeve 7 to slide in the opposite direction to reset. The moving sleeve 7 will also drive one side of the support rod 11 and the two support plates 12 to slide in the opposite direction to reset. When the control spring 32 is fully reset, one of the support plates 12 installed at the top of the support rod 11 moves back to the original side of the control plate 13. Then, the control plate 13 is rotated in the opposite direction to reset. The control plate 13 will then drive the control hole 14 and control slot 15 to rotate in the opposite direction to reset. The groove 15 is rotated in the opposite direction to reset, thereby causing the control hole 14 and the control groove 15 to be reversed and reset to a position that does not correspond to the support rod 11 and the support plate 12. Then, the support rod 11, together with the top support plate 12, supports the moving sleeve 7 to one side of the control plate 13 to prevent the moving sleeve 7 from sliding easily. Then, the inner wall of the moving sleeve 7 re-limits the outer wall of the transfer plate 18, so that the transfer plate 18 and the transfer rod 17 cannot move outward. Then, the transfer rod 17, the transfer groove 9 and the limiting seat 16 cooperate to limit the operation sleeve 6, so that the operation sleeve 6 cannot rotate accidentally, ensuring the structural stability of the components such as the configuration sleeve 4 after adjustment, thereby ensuring the stability of the loading frame 2 after position adjustment, and ensuring the stable loading and placement of the wafer.
[0030] In summary, during the use or operation of the overall equipment: when adaptive adjustments are needed based on the size of different batches of wafers, i.e., the distance between the two loading racks 2 is adjusted, firstly, the control plate 13 is rotated clockwise. Then, the control plate 13 will drive the control hole 14 and the control slot 15 to rotate clockwise. When the control hole 14 rotates clockwise to a position concentric with the support plate 12, the moving sleeve 7 is pushed, causing the moving sleeve 7 to drive one side of the support rod 11 and the support plate 12 to gradually slide into the control hole 14. The moving sleeve 7 will cooperate with the control plate 13 to compress the control spring 32. When the control spring 32 is compressed to its limit, the support plate 12 installed in the middle of the support rod 11 just slides through the control hole 14 and moves to the other side of the control plate 13. At this point, the control plate 13 is rotated in the reverse direction, causing the control hole 14 and control groove 15 to rotate in the opposite direction. Then, the support rod 11 will enter the control groove 15. When the outer wall of the support rod 11 contacts one end of the inner wall of the control groove 15, the rotation of the control plate 13 stops. At this time, the support rod 11, together with the support plate 12 installed in its middle section, limits the moving sleeve 7 to one side of the control plate 13, so that the inner wall of the moving sleeve 7 no longer limits the outer wall of the transfer plate 18. Then, the operating sleeve 6 is rotated in the forward direction, causing the operating sleeve 6 to drive the limiting seat 16 on one side to rotate in the forward direction. Then, the limiting seat 16 will drive the transfer rod 17, the transfer plate 18 and the transfer spring 19 to rotate in the forward direction. Then, the inner wall of the transfer groove 9 presses against one end of the transfer rod 17. Due to the rounded corner design at one end of the transfer rod 17 and the inner edge of the displacement groove 9, one end of the transfer rod 17 will gradually slide out of the displacement groove 9, and the other end of the transfer rod 17 will drive the transfer plate 18 to slide outward, causing the transfer plate 18 to drive the transfer spring 19 to stretch outward. At the same time, due to the threaded fit between the inner wall of the operating sleeve 6 and the outer wall of the displacement sleeve 8, and the symmetrical arrangement of the threads on both sides of the inner wall of the operating sleeve 6, the two displacement sleeves 8 will slide separately, increasing the distance between the two displacement sleeves 8. Then, the displacement sleeve 8 will drive the inner inclined configuration groove 10 to slide, thereby causing the mating block 20 to move in the configuration groove 10. Then, the mating block 20 drives the clamping block 22 to move through the transmission block 21. The outer sliding causes the distance between the clamping block 22 and the clamping plate 24 to lengthen, and the clamping block 22 will drive the guide hole 30 to slide along the guide rod 29. At the same time, the elastic spring 23 will gradually return to its original position. When the elastic spring 23 is fully returned to its original position, the clamping block 22 will drive the clamping plate 24 to slide outward through the elastic spring 23, so that the inner wall of the clamping plate 24 will no longer clamp the outer wall of the slide rod 5. Then the position of the loading rack 2 can be moved, so that the loading rack 2 drives the guide groove 28 to slide along the guide rod 27, while driving the two side slide grooves 26 to slide along the slide rail 25. At the same time, the sliding frame 3 drives the inner configuration sleeve 4 and other components to slide along the slide rod 5. Then, the position of the other loading rack can be adjusted according to the above steps.
[0031] After the positions of the two loading racks 2 are properly adjusted, the control sleeve 6 is rotated in the opposite direction. This causes the control sleeve 6 to drive the transfer rod 17, transfer plate 18, and transfer spring 19 to rotate and reset in the opposite direction via the limiting seat 16. At the same time, the two shift sleeves 8 are symmetrically arranged with threaded engagement on both sides of the inner wall of the control sleeve 6, causing them to slide and reset in the opposite direction. This shortens the distance between the two shift sleeves 8, and the shift sleeves 8 drive the inner configuration groove 10 to slide and reset. Then, the mating block 20 moves in the opposite direction in the configuration groove 10, causing the mating block 20 to drive the clamping block 22 to converge inward via the transmission block 21. The clamping block 22 then drives the clamping plate 24 to converge inward via the elastic spring 23. Simultaneously, the guide hole 30 and the guide rod... 29 will follow and gather inward. When the inner wall of the clamping plate 24 contacts the outer wall of the slide rod 5, the clamping block 22 continues to gather inward, so that the clamping block 22 and the clamping plate 24 cooperate to squeeze the elastic spring 23 sleeved on the outer side of the guide rod 29. The clamping block 22 will drive the guide hole 30 to slide along the guide rod 29, so that the clamping block 22 and the clamping plate 24 cooperate to press the elastic spring 23. The clamping plate 24 presses the multiple friction strips 31 on the inner side to the outer wall of the slide rod 5, thereby fixing the slide rod 5. At the same time, the operating sleeve 6 drives the transfer rod 17 to reverse and reset to the position corresponding to the original transfer groove 9 through the limiting seat 16. Then the transfer spring 19 resets and pulls the transfer plate 18, so that the transfer plate 18 drives the transfer rod 17 to move. The moving rod 17 slides inward to reset, allowing one end of the moving rod 17 to re-insert into the original shifting slot 9. Then, the control plate 13 is rotated forward again, causing the control plate 13 to drive the control hole 14 and control slot 15 to rotate forward again. When the control hole 14 rotates to the position concentric with the support plate 12, the control spring 32 resets and pushes the moving sleeve 7 to slide in the opposite direction to reset. The moving sleeve 7 will also drive one side of the support rod 11 and the two support plates 12 to slide in the opposite direction to reset. When the control spring 32 is fully reset, one of the support plates 12 installed at the top of the support rod 11 moves back to the original side of the control plate 13. Then, the control plate 13 is rotated in the opposite direction to reset. The control plate 13 will then drive the control hole 14 and control slot 15 to rotate in the opposite direction to reset. The slot 15 is rotated in the opposite direction to reset, thereby causing the control hole 14 and the control slot 15 to be reversed and reset to a position that does not correspond to the support rod 11 and the support plate 12. Then, the support rod 11, together with the top support plate 12, supports the moving sleeve 7 to one side of the control plate 13 to prevent the moving sleeve 7 from sliding easily. Then, the inner wall of the moving sleeve 7 re-limits the outer wall of the transfer plate 18, so that the transfer plate 18 and the transfer rod 17 cannot move outward. Then, the transfer rod 17, the transfer slot 9 and the limiting seat 16 cooperate to limit the operation sleeve 6, so that the operation sleeve 6 cannot rotate accidentally, ensuring the structural stability of the components such as the configuration sleeve 4 after adjustment, thereby ensuring the stability of the loading frame 2 after position adjustment, and ensuring the stable loading and placement of the wafer.
[0032] Of all the solutions mentioned above, those involving the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A wafer electroplating processing apparatus, comprising a base frame (1), characterized in that: The base frame (1) is movably provided with a loading frame (2) on its inner side. A sliding frame (3) is provided on one side of the loading frame (2). A configuration sleeve (4) is provided in the sliding frame (3). A sliding rod (5) is provided on one side of the loading frame (2). An operating sleeve (6) is rotatably provided on the outer side of the configuration sleeve (4). A movable sleeve (7) is fitted on the outer side of the configuration sleeve (4). A displacement sleeve (8) is slidably fitted on the outer side of the configuration sleeve (4). The outer wall of the displacement sleeve (8) is movably connected to the inner wall of the operating sleeve (6) by threads. Multiple displacement grooves (9) are opened on the outer wall of the configuration sleeve (4). Multiple configuration slots (10) are provided on the inner side of the shift sleeve (8). A support rod (11) is provided on one side of the moving sleeve (7). A support plate (12) is provided on the support rod (11). A control plate (13) is rotatably provided on the outer side of the configuration sleeve (4). A control hole (14) and a control slot (15) are provided on the control plate (13). A limiting seat (16) is provided on one side of the operating sleeve (6). A moving rod (17) is slidably provided in the limiting seat (16). A moving plate (18) is provided at one end of the moving rod (17). A moving spring (19) is movably sleeved on the outer side of the moving rod (17).
2. The wafer electroplating processing apparatus according to claim 1, characterized in that: A mating block (20) is slidably provided in the configuration slot (10). A transmission block (21) is provided on one side of the mating block (20). A clamping block (22) is provided at the other end of the transmission block (21). Multiple elastic springs (23) are provided on the other side of the clamping block (22). A clamping plate (24) is connected to the other end of the elastic springs (23).
3. The wafer electroplating processing apparatus according to claim 1, characterized in that: The loading frame (2) is fixedly provided with a slide rail (25) on the inner side, and the loading frame (2) is adapted to have a slide groove (26) on both sides.
4. The wafer electroplating processing apparatus according to claim 3, characterized in that: The slide bar (5) is symmetrically provided with guide rods (27) on both sides, and the loading frame (2) is provided with guide grooves (28). The loading frame (2) is slidably connected to the guide rods (27) through the guide grooves (28), and the guide rods (27) are fixedly installed inside the base frame (1).
5. A wafer electroplating processing apparatus according to any one of claims 1-3, characterized in that: The displacement sleeve (8) is symmetrically arranged in two places, and the threads on both sides of the inner wall of the control sleeve (6) are symmetrically arranged.
6. The wafer electroplating processing apparatus according to claim 5, characterized in that: The clamping plate (24) is fixedly connected to one side with multiple guide rods (29), and the clamping block (22) has multiple guide holes (30) in it. The guide rods (29) slide through the guide holes (30).
7. The wafer electroplating processing apparatus according to claim 1, characterized in that: A friction strip (31) is fixedly connected to one side of the clamping plate (24).
8. The wafer electroplating processing apparatus according to claim 6, characterized in that: The multiple guide rods (29) are parallel to the transmission block (21).
9. The wafer electroplating processing apparatus according to claim 1, characterized in that: A control spring (32) is movably sleeved on the outside of the support rod (11). One end of the control spring (32) is connected to the movable sleeve (7), and the other end of the control spring (32) abuts against one side of the control plate (13).