Electrolytic polishing device for semiconducting stainless steel tubes

Abstract

The application belongs to the technical field of electrolytic polishing, and particularly relates to an electrolytic polishing device for semiconductor stainless steel pipes, which comprises an electrolytic cell, a collecting disc is placed in the electrolytic cell, two bearing seats are arranged in the collecting disc, and the bearing seats are fixedly connected with the collecting disc. In the electrolytic polishing operation of the semiconductor stainless steel pipe, the electrolyte continuously flows from the inner and outer sides of the steel pipe, hydrogen bubbles generated in the electrolytic reaction can be timely flushed and removed, the bubbles are prevented from adhering to the pipe wall to form a gas film, the electrolyte can be kept in continuous and uniform contact with the inner and outer surfaces of the steel pipe, the electrolyte on the surface of the pipe can be quickly renewed, a stable electrolytic environment can be maintained, local unpolished, uneven bright and dark and other problems can be effectively eliminated, the polishing uniformity and surface quality are improved, and the electrolyte can be reduced in the pipe and the gap between pipe fittings during batch processing, and the risk of subsequent corrosion and pollution is reduced.

Description

Technical Field

[0001] This invention belongs to the field of electropolishing technology, and in particular relates to an electropolishing apparatus for semiconductor stainless steel tubes. Background Technology

[0002] In the semiconductor manufacturing field, semiconductor stainless steel tubes are key fluid transport components, mainly used to transport core media such as high-purity gases and pharmaceutical solutions. The surface quality of their inner and outer walls directly determines the cleanliness of the transported media, which in turn affects the production precision and product yield of semiconductor chips. Due to the extremely high requirements for impurity contamination in semiconductor manufacturing, ordinary mechanical polishing methods are difficult to achieve ultra-high precision surface roughness and are prone to generating defects such as micro-scratches and residual abrasives on the surface, which cannot meet the stringent standards of the semiconductor industry. Therefore, electrolytic polishing equipment has become an indispensable key equipment in the processing of semiconductor stainless steel tubes. Through electrolytic chemical reaction, the microscopic protrusions on the surface of stainless steel tubes can be preferentially dissolved, thereby obtaining a flat, smooth, and clean surface, effectively reducing the adsorption and retention of impurities during the media transport process, and ensuring the stability and reliability of semiconductor production.

[0003] During the electrolytic polishing process of semiconductor stainless steel tubes, the electrolytic reaction is accompanied by the generation of a large number of hydrogen bubbles. These hydrogen bubbles are small in size and have strong adhesion, making them easy to adhere to the inner and outer surfaces of the stainless steel tubes, forming a dense gas film. This gas film will isolate the electrolyte from the surface of the stainless steel tube, causing the normal electrolytic polishing reaction to not occur in the area covered by the gas film. This results in local unpolished defects, manifested as uneven spots and streaks on the surface of the tube, which seriously affects the surface flatness and cleanliness, failing to meet the surface quality requirements of the semiconductor industry for stainless steel tubes. Furthermore, the residual impurities in the unpolished areas may pose a risk of contamination to the subsequent semiconductor dielectric transport.

[0004] In addition, in actual production, to improve production efficiency, multiple semiconductor stainless steel tubes are usually subjected to batch electrolytic polishing. However, after batch polishing, due to the large number of tubes, they often need to be densely stacked during unloading and transfer. This makes it difficult for the rinsing water to evenly cover the inner and outer walls of each tube during the rinsing process, especially at the contact points where tubes are stacked and the inner wall areas of slender tubes. These areas are prone to rinsing dead corners. Incomplete rinsing will result in residual electrolytic polishing solution on the surface of the tubes, especially on the inner wall. This residual electrolyte will undergo a slow corrosion reaction during subsequent storage or use, causing defects such as discoloration and rust on the surface of the tubes. This not only reduces the service life of the stainless steel tubes, but also contaminates the conveying medium due to impurities generated by corrosion, affecting the production quality of semiconductor chips.

[0005] To address this issue, an electropolishing apparatus for semiconductor stainless steel tubes is proposed. Summary of the Invention

[0006] The purpose of this invention is to address the above-mentioned problems by providing an electrolytic polishing apparatus for semiconductor stainless steel tubes.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: an electrolytic polishing apparatus for semiconductor stainless steel tubes, comprising an electrolytic cell, a collecting tray placed inside the electrolytic cell, two support seats provided inside the collecting tray, the support seats and the collecting tray being fixedly connected, a plurality of placement grooves for placing stainless steel tubes being formed on the side wall of the support seats, ball bearings being provided in the placement grooves, and further comprising:

[0008] Two connecting components are respectively disposed on the upper sidewalls of the two bearing seats. The connecting components are connected to the stainless steel pipe and are used to transport liquid into the stainless steel pipe.

[0009] An electrolyte delivery assembly is disposed below the electrolytic cell and is used to deliver electrolyte into the stainless steel tube.

[0010] A lifting assembly is located above the electrolytic cell and is used to control the up and down movement of multiple stainless steel tubes.

[0011] A rinsing assembly, disposed on the surface of the lifting assembly, is used to rinse the electrolyte from the surface of the stainless steel tube.

[0012] In the aforementioned electrolytic polishing apparatus for semiconductor stainless steel tubes, the connecting component includes two hydraulic cylinders fixedly connected to the upper side wall of a support base. The moving ends of the two hydraulic cylinders are fixedly connected to the same moving base. Multiple connecting pipes are rotatably connected to the side wall of the moving base. A hollow conical plug is connected to the end of each connecting pipe near the steel pipe. A drive motor is fixedly connected to the upper side wall of the left side of the moving base. The output end of the drive motor is connected to the multiple connecting pipes on the left side via a belt pulley transmission mechanism. A vertical plate is fixedly connected to the side wall of the moving base via a bracket. Multiple fixed pipes are fixedly inserted into the side wall of the vertical plate. The end of each connecting pipe away from the steel pipe is rotatably connected to a fixed pipe. A square tube connected to a fixed pipe is fixedly connected to the side of the vertical plate away from the connecting pipe.

[0013] In the above-mentioned electrolytic polishing device for semiconductor stainless steel tubes, the electrolyte delivery assembly includes a delivery pump fixedly connected to the lower side wall of the electrolytic cell. The inlet end of the delivery pump is connected to the lower side wall of the electrolytic cell, and the outlet end of the delivery pump is fixedly connected to an outlet pipe. A bend is fixedly connected to the upper side wall of the square tube on the left side. The left end of the bend is inserted into the upper port of the outlet pipe, and a first control valve is provided inside the bend.

[0014] In the aforementioned electrolytic polishing apparatus for semiconductor stainless steel tubes, the lifting assembly includes a lifting frame disposed outside the electrolytic cell. Connecting plates are connected to the four corners of the upper sidewall of the lifting frame. A winding rod is rotatably connected to the sidewalls of two connecting plates on the same side. A winding motor is fixedly connected to the sidewall of the connecting plate. The output end of the winding motor is connected to the winding rod. Two pull ropes are sleeved on the rod wall of the winding rod. A through hole matching the pull rope is opened on the sidewall of the lifting frame. The lower end of the pull rope passes through the through hole and is connected to the support seat.

[0015] In the aforementioned electrolytic polishing apparatus for semiconductor stainless steel tubes, the rinsing assembly includes a rinsing box fixedly connected to the upper side wall of a lifting frame. A rinsing pump is connected to the side wall of the rinsing box. The outlet end of the rinsing pump passes through the lifting frame. The wall of the bent pipe is connected to a short pipe that matches the outlet end of the rinsing pump. A second control valve is provided inside the short pipe. Multiple water spray pipes are fixedly connected to the lower side wall of the lifting frame via a bracket. Multiple water spray heads are fixedly connected to the wall of each water spray pipe. The left ends of the multiple water spray pipes are fixedly connected to the same discharge pipe. The discharge pipe and the outlet end of the rinsing pump are connected by the same horizontal pipe.

[0016] In the above-mentioned electrolytic polishing device for semiconductor stainless steel tubes, a recovery box is fixedly connected to the upper side wall of the lifting frame, and a recovery pump is fixedly connected to the side wall of the recovery box. The inlet end of the recovery pump passes through the lifting frame, and a wastewater pipe that is inserted into the inlet end of the recovery pump is fixedly connected to the right side wall of the collection tray. The wastewater pipe has an inverted L-shaped structure, and a return pipe is connected to the wall of the wastewater pipe. A third control valve is provided inside the return pipe.

[0017] In the electrolytic polishing apparatus for a semiconductor stainless steel tube described above, a drain pipe is fixedly connected to the wall of the square tube located on the right side, and the opening of the drain pipe is set downward.

[0018] In the above-mentioned electrolytic polishing device for semiconductor stainless steel tubes, a guide block is fixedly connected to the inner wall of the collection tray, and the support seat is connected to the guide block through a bracket.

[0019] Compared with existing technologies, the advantages of an electrolytic polishing apparatus for semiconductor stainless steel tubes are:

[0020] 1. Through the established connecting components and electrolyte delivery components, the electrolyte flows synchronously and continuously from the inside and outside of the steel pipe during the electrolytic polishing operation of semiconductor stainless steel pipes. This allows for timely flushing and removal of hydrogen bubbles generated by the electrolytic reaction, preventing bubbles from adhering to the pipe wall and forming a gas film. This ensures continuous and uniform contact between the electrolyte and the inner and outer surfaces of the steel pipe. At the same time, it can quickly refresh the electrolyte on the pipe surface, maintain a stable electrolytic environment, effectively eliminate problems such as local unpolished areas and uneven brightness, improve polishing uniformity and surface quality, and can also be used in conjunction with the rinsing process during batch processing to reduce electrolyte residue inside the pipe and in the gaps between pipes, thereby reducing the risk of subsequent corrosion and contamination.

[0021] 2. With the lifting assembly, the structure can simultaneously place multiple semiconductor stainless steel tubes into the electrolytic cell and remove them uniformly. This can significantly improve the processing efficiency of batch electrolytic polishing, shorten the loading and unloading and overall operation cycle, ensure that multiple tubes react synchronously in the same electrolytic environment, improve polishing consistency, reduce the process time and human error caused by frequent single-tube operations, and facilitate subsequent centralized rinsing, transfer and storage, thus meeting the large-scale and high-efficiency production needs of the semiconductor industry.

[0022] 3. Through the set rinsing components, after the batch polishing is completed, multiple semiconductor stainless steel tubes are taken out of the electrolytic cell and thoroughly rinsed on the inner and outer walls. This can quickly remove the electrolyte adhering to the surface and inner wall of the tubes, avoiding electrolyte residue that may cause discoloration, rust and secondary corrosion of the tubes. At the same time, it can eliminate the rinsing dead corners between the tubes and the inner wall, ensuring that the inner and outer surfaces of each steel tube are clean and consistent. This effectively prevents residual electrolyte from contaminating the high-purity medium and ensures that the surface quality and cleanliness of the stainless steel tubes are stable and meet the standards. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of an electrolytic polishing device for a semiconductor stainless steel tube provided by the present invention;

[0024] Figure 2 This is a schematic diagram of the electrolyte delivery assembly in an electrolytic polishing apparatus for semiconductor stainless steel tubes provided by the present invention.

[0025] Figure 3 This is a schematic diagram of the surface structure of the lifting frame in an electrolytic polishing device for semiconductor stainless steel tubes provided by the present invention.

[0026] Figure 4 This is a schematic diagram showing the positional relationship between the electrolytic cell and the collection tray in an electrolytic polishing apparatus for semiconductor stainless steel tubes provided by the present invention.

[0027] Figure 5 This is a schematic diagram of the connecting component in an electrolytic polishing apparatus for a semiconductor stainless steel tube provided by the present invention;

[0028] Figure 6 This is a schematic diagram of the arrangement of multiple connecting tubes in an electrolytic polishing apparatus for semiconductor stainless steel tubes provided by the present invention.

[0029] Figure 7 This is a schematic diagram of the shape and structure of the guide block in an electrolytic polishing device for a semiconductor stainless steel tube provided by the present invention;

[0030] Figure 8 This is a schematic diagram of the surface structure of the support base in an electrolytic polishing device for semiconductor stainless steel tubes provided by the present invention.

[0031] In the diagram: 1 Electrolytic cell, 2 Collection tray, 3 Support base, 4 Placement trough, 5 Connecting assembly, 51 Hydraulic cylinder, 52 Moving base, 6 Connecting pipe, 7 Hollow cone plug, 8 Drive motor, 9 Vertical plate, 10 Fixed pipe, 11 Square tube, 12 Electrolyte conveying assembly, 121 Conveying pump, 122 Discharge pipe, 13 Bend, 14 First control valve, 15 Lifting assembly, 151 Lifting frame, 152 Connecting plate, 16 Winding rod, 17 Winding motor, 18 Pull rope, 19 Flushing assembly, 191 Flushing box, 192 Flushing pump, 20 Short pipe, 21 Second control valve, 22 Spray pipe, 23 Spray head, 24 Discharge pipe, 25 Horizontal pipe, 26 Recovery box, 27 Recovery pump, 28 Wastewater pipe, 29 Third control valve, 30 Drain pipe, 31 Guide block, 32 Return pipe. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0033] like Figures 1-8 As shown, an electrolytic polishing apparatus for semiconductor stainless steel tubes includes an electrolytic cell 1, a collecting tray 2 placed inside the electrolytic cell 1, two support seats 3 inside the collecting tray 2, the support seats 3 and the collecting tray 2 being fixedly connected, and multiple placement grooves 4 for placing stainless steel tubes being opened on the side walls of the support seats 3, with ball bearings installed in the placement grooves 4. The apparatus also includes:

[0034] Two connecting components 5 are respectively set on the upper sidewalls of the two bearing seats 3. The connecting components 5 are connected to the stainless steel pipe. The connecting components 5 include two hydraulic cylinders 51 fixedly connected to the upper sidewall of the bearing seat 3. The moving ends of the two hydraulic cylinders 51 are fixedly connected to the same moving seat 52. Multiple connecting pipes 6 are rotatably connected to the sidewall of the moving seat 52. A hollow cone plug 7 is connected to the end of the connecting pipe 6 near the steel pipe. A drive motor 8 is fixedly connected to the upper sidewall of the left moving seat 52. The output end of the drive motor 8 is connected to the multiple connecting pipes 6 on the left side through a belt pulley transmission mechanism. A vertical plate 9 is fixedly connected to the sidewall of the moving seat 52 through a bracket. Multiple fixed pipes 10 are fixedly inserted into the sidewall of the vertical plate 9. The end of the connecting pipe 6 away from the steel pipe is rotatably connected to the fixed pipe 10. A square pipe 11 connected to the fixed pipe 10 is fixedly connected to the side of the vertical plate 9 away from the connecting pipe 6, which is used to transport liquid into the stainless steel pipe.

[0035] An electrolyte delivery assembly 12 is disposed below the electrolytic cell 1. The electrolyte delivery assembly 12 includes a delivery pump 121 fixedly connected to the lower side wall of the electrolytic cell 1. The inlet end of the delivery pump 121 is connected to the lower side wall of the electrolytic cell 1. The outlet end of the delivery pump 121 is fixedly connected to an outlet pipe 122. A bend pipe 13 is fixedly connected to the upper side wall of the left square tube 11. The left end of the bend pipe 13 is inserted into the upper port of the outlet pipe 122. A first control valve 14 is provided inside the bend pipe 13 for delivering electrolyte into the stainless steel tube.

[0036] The lifting assembly 15 is located above the electrolytic cell 1. The lifting assembly 15 includes a lifting frame 151 located outside the electrolytic cell 1. Each of the four corners of the upper side wall of the lifting frame 151 is connected to a connecting plate 152. The side walls of two connecting plates 152 located on the same side are rotatably connected to the same winding rod 16. The side wall of the connecting plate 152 is fixedly connected to a winding motor 17. The output end of the winding motor 17 is connected to the winding rod 16. Two pull ropes 18 are sleeved on the rod wall of the winding rod 16. The side wall of the lifting frame 151 is provided with through holes that match the pull ropes 18. The lower end of the pull rope 18 passes through the through hole and is connected to the bearing seat 3 for controlling the up and down movement of multiple stainless steel pipes.

[0037] A rinsing assembly 19 is disposed on the surface of the lifting assembly 15. The rinsing assembly 19 includes a rinsing box 191 fixedly connected to the upper side wall of the lifting frame 151. A rinsing pump 192 is connected to the side wall of the rinsing box 191. The outlet end of the rinsing pump 192 passes through the lifting frame 151. The pipe wall of the bend 13 is connected to a short pipe 20 that matches the outlet end of the rinsing pump 192. A second control valve 21 is provided inside the short pipe 20. Multiple water spray pipes 22 are fixedly connected to the lower side wall of the lifting frame 151 by a bracket. Multiple water spray heads 23 are fixedly connected to the pipe wall of the water spray pipes 22. The left end of the multiple water spray pipes 22 is fixedly connected to the same discharge pipe 24. The discharge pipe 24 and the outlet end of the rinsing pump 192 are connected by the same horizontal pipe 25 for rinsing the electrolyte on the surface of the stainless steel pipe.

[0038] A recovery box 26 is fixedly connected to the upper side wall of the lifting frame 151. A recovery pump 27 is fixedly connected to the side wall of the recovery box 26. The inlet end of the recovery pump 27 passes through the lifting frame 151. A wastewater pipe 28 is fixedly connected to the right side wall of the collection tray 2 and is inserted into the inlet end of the recovery pump 27. The wastewater pipe 28 has an inverted L-shaped structure. A return pipe 32 is connected to the pipe wall of the wastewater pipe 28. A third control valve 29 is provided in the return pipe 32.

[0039] A drain pipe 30 is fixedly connected to the wall of the square tube 11 on the right side, and the opening of the drain pipe 30 is set downward.

[0040] The inner wall of the collection tray 2 is fixedly connected to the guide block 31, and the support seat 3 is connected to the guide block 31 through the bracket.

[0041] The operating principle of the present invention is explained as follows: Multiple stainless steel pipes are placed sequentially into the placement slots 4 on the surfaces of two bearing seats 3. Then, the operator sends an electrical signal to the external controller via an external remote control switch. After receiving the electrical signal, the controller controls the hydraulic cylinders 51 on both sides to work. The hydraulic cylinders 51 on both sides drive the moving seat 52 to move. The moving seat 52 drives the connecting pipe 6 and the hollow cone plug 7 to move, so that the hollow cone plug 7 on both sides is inserted into the stainless steel pipe, thus limiting the left and right position of the stainless steel pipe. Then, the controller controls the winding motors 17 on both sides to work. The winding motors 17 drive the winding rod 16 to rotate, so that the pull rope 18 on the surface of the winding rod 16 is released. Under the action of gravity, the collection tray 2 and the bearing seat 3 will fall into the electrolytic cell 1, and the bent pipe 13 will be inserted into the discharge end of the conveying pump 121 during the descent.

[0042] When the winding motor 17 operates for the set time, the controller will control the delivery pump 121 to operate and control the first control valve 14 to open. The delivery pump 121 delivers the electrolyte in the electrolytic cell 1 to the left square tube 11 through the bent pipe 13, and then delivers it to multiple stainless steel tubes through the fixed pipe 10, the connecting pipe 6, and the hollow cone plug 7 to perform electrolytic polishing on the inner wall of the stainless steel tubes. At the same time, the electrolyte in the electrolytic cell 1 will perform electrolytic polishing on the outer wall of the immersed stainless steel tubes. The electrolyte in the stainless steel tubes will be delivered to the right square tube 11 through the right fixed pipe 10, the connecting pipe 6, and the hollow cone plug 7. Then, it will be discharged into the collection tray 2 through the drain pipe 30, and then discharged back into the electrolytic cell 1 for reuse through the wastewater pipe 28 and the return pipe 32.

[0043] After the electrolytic polishing of the stainless steel pipe is completed, the controller will move the collection tray 2 and the support seat 3 upward to the set position through the lifting component 15, so that the short pipe 20 is inserted into the outlet end of the flushing pump 192 and the wastewater pipe 28 is inserted into the inlet end of the recovery pump 27. Then, the controller controls the flushing pump 192 to work. The flushing pump 192 delivers the flushing liquid to the left square pipe 11 through the short pipe 20 (the second control valve 21 is in the open state). According to the above principle, the inner wall of the stainless steel pipe will be flushed. The waste liquid will be pumped into the recovery tank 26 by the recovery pump 27 through the wastewater pipe 28. Part of the flushing liquid is delivered to the spray pipe 22 through the horizontal pipe 25 and the discharge pipe 24 and sprayed out through the spray head 23 to flush the outer surface of the stainless steel pipe, ensuring that the inner and outer surfaces of each steel pipe are clean and consistent, effectively preventing residual electrolyte from contaminating the high-purity medium, and ensuring that the surface quality and cleanliness of the stainless steel pipe are stable and up to standard.

[0044] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electrolytic polishing apparatus for semiconductor stainless steel tubes, comprising an electrolytic cell (1), wherein a collection tray (2) is placed inside the electrolytic cell (1), and two support seats (3) are provided inside the collection tray (2), the support seats (3) and the collection tray (2) are fixedly connected, and a plurality of placement grooves (4) for placing stainless steel tubes are opened on the side wall of the support seats (3), wherein ball bearings are provided in the placement grooves (4), characterized in that, Also includes: Two connecting components (5) are respectively disposed on the upper sidewalls of the two bearing seats (3). The connecting components (5) are connected to the stainless steel pipe and are used to transport liquid into the stainless steel pipe. An electrolyte delivery assembly (12) is disposed below the electrolytic cell (1) and is used to deliver electrolyte into the stainless steel tube; A lifting assembly (15) is disposed above the electrolytic cell (1) and is used to control the up and down movement of multiple stainless steel tubes; A rinsing assembly (19) is disposed on the surface of the lifting assembly (15) for rinsing the electrolyte on the surface of the stainless steel tube.

2. The electrolytic polishing apparatus for a semiconductor stainless steel tube according to claim 1, characterized in that, The connecting component (5) includes two hydraulic cylinders (51) fixedly connected to the upper side wall of the bearing seat (3). The moving ends of the two hydraulic cylinders (51) are fixedly connected to the same moving seat (52). The side wall of the moving seat (52) is rotatably connected to multiple connecting pipes (6). The end of the connecting pipe (6) near the steel pipe is connected to a hollow cone plug (7). The upper side wall of the moving seat (52) on the left side is fixedly connected to a drive motor (8). The output end of the drive motor (8) is connected to the multiple connecting pipes (6) on the left side through a belt pulley transmission mechanism. The side wall of the moving seat (52) is fixedly connected to a vertical plate (9) through a bracket. The side wall of the vertical plate (9) is fixedly inserted with multiple fixed pipes (10). The end of the connecting pipe (6) away from the steel pipe is rotatably connected to the fixed pipe (10). The side of the vertical plate (9) away from the connecting pipe (6) is fixedly connected to a square tube (11) connected to the fixed pipe (10).

3. The electrolytic polishing apparatus for a semiconductor stainless steel tube according to claim 2, characterized in that, The electrolyte delivery assembly (12) includes a delivery pump (121) fixedly connected to the lower side wall of the electrolytic cell (1). The feed end of the delivery pump (121) is connected to the lower side wall of the electrolytic cell (1). The discharge end of the delivery pump (121) is fixedly connected to a discharge pipe (122). A bend pipe (13) is fixedly connected to the upper side wall of the square tube (11) on the left side. The left end of the bend pipe (13) is inserted into the upper port of the discharge pipe (122). A first control valve (14) is provided in the bend pipe (13).

4. The electrolytic polishing apparatus for a semiconductor stainless steel tube according to claim 3, characterized in that, The lifting assembly (15) includes a lifting frame (151) disposed outside the electrolytic cell (1). The four corners of the upper side wall of the lifting frame (151) are connected to connecting plates (152). The side walls of the two connecting plates (152) on the same side are rotatably connected to the same winding rod (16). The side wall of the connecting plate (152) is fixedly connected to a winding motor (17). The output end of the winding motor (17) is connected to the winding rod (16). The rod wall of the winding rod (16) is fitted with two pull ropes (18). The side wall of the lifting frame (151) is provided with through holes that match the pull ropes (18). The lower end of the pull rope (18) passes through the through hole and is connected to the bearing seat (3).

5. The electrolytic polishing apparatus for a semiconductor stainless steel tube according to claim 4, characterized in that, The flushing assembly (19) includes a flushing box (191) fixedly connected to the upper side wall of the lifting frame (151). The side wall of the flushing box (191) is connected to a flushing pump (192). The outlet end of the flushing pump (192) passes through the lifting frame (151). The wall of the bend (13) is connected to a short pipe (20) that matches the outlet end of the flushing pump (192). A second control valve (21) is provided in the short pipe (20). The lower side wall of the lifting frame (151) is fixedly connected to multiple water spray pipes (22) by a bracket. The wall of the water spray pipes (22) is fixedly connected to multiple water spray heads (23). The left ends of the multiple water spray pipes (22) are fixedly connected to the same discharge pipe (24). The discharge pipe (24) and the outlet end of the flushing pump (192) are connected by the same horizontal pipe (25).

6. The electrolytic polishing apparatus for a semiconductor stainless steel tube according to claim 4, characterized in that, The upper side wall of the lifting frame (151) is fixedly connected to a recycling box (26), and the side wall of the recycling box (26) is fixedly connected to a recycling pump (27). The inlet end of the recycling pump (27) passes through the lifting frame (151). The right side wall of the collection tray (2) is fixedly connected to a wastewater pipe (28) that is inserted into the inlet end of the recycling pump (27). The wastewater pipe (28) has an inverted L-shaped structure. The pipe wall of the wastewater pipe (28) is connected to a return pipe (32). A third control valve (29) is provided inside the return pipe (32).

7. The electrolytic polishing apparatus for a semiconductor stainless steel tube according to claim 2, characterized in that, The wall of the square tube (11) located on the right side is fixedly connected to a drain pipe (30), and the opening of the drain pipe (30) is set downward.

8. The electrolytic polishing apparatus for a semiconductor stainless steel tube according to claim 1, characterized in that, The inner wall of the collection tray (2) is fixedly connected to a guide block (31), and the support seat (3) is connected to the guide block (31) through a bracket.

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