A sensor and a sensing assembly

Abstract

The application provides a sensor and a sensing assembly, the sensor comprising a shell, a circuit board assembly and a pressure sensing module, the shell having a bottom surface, the shell being provided with a recess in the axial direction of the sensor, the recess being recessed from the bottom surface towards the shell, the circuit board assembly being fixedly connected with the recess, the circuit board assembly being electrically connected with the pressure sensing module, the pressure sensing module being away from the shell relative to the circuit board assembly in the axial direction of the sensor, the pressure sensing module comprising a pressure sensing surface, at least part of the pressure sensing surface constituting part of the outer surface of the sensor; by adjusting the structure of the sensor shell, the pressure sensing surface is part of the outer surface of the sensor, which is conducive to simplifying the structure of the sensor.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and more particularly to a sensor and sensing component for a vehicle thermal management system. Background Technology

[0002] Sensors are components used to measure physical parameters, such as the temperature and / or pressure of refrigerant in a thermal management system.

[0003] The sensor includes a connector, a pressure-sensing module, a circuit board assembly, and a base. The pressure-sensing module is electrically connected to the circuit board assembly. The base has a channel that connects to a pipe through which the refrigerant flows. The pressure-sensing module is located inside the cavity formed by the connector and the base. It detects the pressure of the refrigerant by contacting it through the channel of the base. Typically, the base is used to cover and fix the electrical components inside the cavity, such as the circuit board assembly. Currently, the design of the sensor base makes the sensor structure relatively complex. Summary of the Invention

[0004] Based on this, and to address the aforementioned problems, this application provides a sensor that simplifies the sensor's structure.

[0005] To achieve the above objectives, one technical solution of this application is as follows:

[0006] A sensor includes a housing, a circuit board assembly, and a pressure-sensing module. The housing has a bottom surface. Along the axial direction of the sensor, a recess is provided on the housing from the bottom surface toward the housing. The circuit board assembly is fixedly connected to the recess and electrically connected to the pressure-sensing module. Along the axial direction of the sensor, the pressure-sensing module is away from the housing relative to the circuit board assembly. The pressure-sensing module includes a pressure-sensing surface, at least a portion of which constitutes part of the outer surface of the sensor.

[0007] This application provides a sensor, which includes a housing, a circuit board assembly, and a pressure-sensing module. The circuit board assembly is fixedly connected to the housing and electrically connected to the pressure-sensing module. The pressure-sensing module includes a pressure-sensing surface, which is part of the outer surface of the sensor. It can be understood that the pressure-sensing module, as part of the outer surface of the sensor, directly contacts the pipe through which the refrigerant flows. Compared with the solutions mentioned in the background art, this technical solution simplifies the sensor structure by adjusting the structure of the housing so that the pressure-sensing surface is part of the outer surface of the sensor.

[0008] A sensing component includes a base having a flow channel and a pressure channel, the flow channel being in communication with the pressure channel. The sensing component also includes a sensor mounted on the base. The sensor includes a housing, a circuit board assembly, and a pressure sensing module. The housing has a bottom surface. Along the axial direction of the sensor, the housing has a recessed portion from the bottom surface toward the housing. The circuit board assembly is fixedly connected to the recessed portion and electrically connected to the pressure sensing module. Along the axial direction of the sensor, the pressure sensing module is located away from the housing relative to the circuit board assembly. The pressure sensing module includes a pressure sensing surface, at least a portion of which constitutes part of the outer surface of the sensor. The pressure sensing surface is exposed to the pressure channel.

[0009] This application also provides a sensing component, which includes a base having a flow channel and a pressure-sensing channel. The sensing component also includes a sensor mounted on the base. The sensor includes a housing, a circuit board assembly, and a pressure-sensing module. The circuit board assembly is fixedly connected to the housing and electrically connected to the pressure-sensing module. The pressure-sensing module includes a pressure-sensing surface, which is part of the outer surface of the sensor. It can be understood that the pressure-sensing module, as part of the outer surface of the sensor, directly contacts the pipe through which the refrigerant flows and is in contact with the refrigerant. Compared with the solutions mentioned in the background art, this technical solution simplifies the structure of the sensing component by adjusting the structure of the housing so that the pressure-sensing surface is part of the outer surface of the sensor and exposed to the pressure-sensing channel. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural schematic diagram of one embodiment of the sensor of this application;

[0011] Figure 2 for Figure 1 A three-dimensional structural diagram of the sensor from another angle;

[0012] Figure 3 for Figure 1 A three-dimensional structural diagram of the sensor from another angle;

[0013] Figure 4 for Figure 1 A schematic diagram of the cross-sectional structure of the sensor;

[0014] Figure 5 for Figure 1 A three-dimensional exploded view of the sensor.

[0015] Figure 6 for Figure 1 A three-dimensional exploded view of the sensor from another angle;

[0016] Figure 7 for Figure 1 A cross-sectional schematic diagram of the exploded three-dimensional structure of the sensor;

[0017] Figure 8 for Figure 1 3D structural diagram of the pressure sensing module in the sensor

[0018] Figure 9 for Figure 1 A three-dimensional structural diagram of the housing in the sensor.

[0019] Figure 10 for Figure 8 A three-dimensional structural diagram of the middle shell from another angle;

[0020] Figure 11 for Figure 8 Schematic diagram of the cross-sectional structure of the middle shell;

[0021] Figure 12 This is a three-dimensional structural diagram of one embodiment of the sensing component of this application. Attached image description:

[0023] 100. Sensors;

[0024] 11. Conductive part; 111. First end; 112. Second end; 113. Middle part;

[0025] 12. Shell; 121. First platform portion; 1211. First platform surface; 1212. Bottom; 1212a. Bottom surface; 122. Second platform portion; 1221. Side wall surface; 1222. Transition portion; 1223. Second platform surface; 123. Recess; 1231. Top surface; 124. Opening groove; 125. Fixing portion; 1251. Through hole; 126. Receiving cavity; 127. Platform portion;

[0026] 13. Circuit board assembly; 131. Connecting piece; 132. Grounding part; 133. Circuit board; 1331. First side; 1332. Second side;

[0027] 14. Pressure-sensing module; 141. Pin part; 142. Main body part; 1421. Groove; 1422. Pressure-sensing port; 1423. Main body surface; 1424. Pressure-sensing surface; 143. Pressure-sensing element;

[0028] 15. Temperature sensing module; 151. Protective housing; 1511. Limiting part; 1512. Support part; 1513. Extension part; 1514. Protective cavity; 152. Lead wire part; 1521. First connecting part; 1522. Second connecting part; 1523. Transition connecting part; 153. Temperature sensing head;

[0029] 20. Sealing part; 201. First sealing part; 202. Second sealing part;

[0030] 21. Sealing surface; 211. First sealing surface; 212. Second sealing surface;

[0031] 300. Sensing component; 301. Base; 302. Flow channel; 303. Pressure channel; 304. Mounting part; 305. Crimping part. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and specific technical solutions:

[0033] The application of heat pump technology in new energy vehicles is becoming a trend. Therefore, real-time monitoring of the refrigerant pressure and temperature in the vehicle's thermal management system is necessary to accurately control the temperature of the battery and passenger compartment, further reducing energy consumption and increasing driving range. The sensors in the following technical solutions are mainly used to collect the pressure and / or temperature of the refrigerant in the containment chambers or pipes of the thermal management system.

[0034] like Figures 1 to 12 As shown, this application provides a sensor 100, which includes a sealing part 20. The sensor 100 is connected to the outside and is used to collect the pressure and / or temperature of the working medium in the containment cavity or pipeline of a thermal management system. The sealing part 20 reduces the risk of working medium leakage during operation. The sensor 100 includes a conductive part 11, a housing 12, a circuit board assembly 13, a pressure sensing module 14, and a temperature sensing module 15. The sealing part 20 has a sealing surface 21. When the pressure sensing module 14 comes into contact with the cold medium, the pressure of the cold medium it receives is converted into an electrical signal. The temperature of the cold medium received by the temperature sensing module 15 is converted into an electrical signal. The circuit board 133 in the circuit board assembly 13 calculates the real-time pressure and temperature of the cold medium based on the electrical signals, thereby realizing real-time monitoring of the temperature and pressure of the cold medium, which is beneficial to the precise control and intelligent design of the sensor 100.

[0035] The inventors discovered that the sensor collects the temperature and / or pressure of the cold medium in the containment cavity or pipe in the thermal management system. Both the pressure sensing module and the temperature sensing module need to be in direct or indirect contact with the cold medium to measure the temperature and / or pressure. Usually, the pressure sensing module is located in the cavity formed by the shell and the base, and detects the pressure of the cold medium by contacting it through the channel of the base. Currently, the structure of the sensor is relatively complex.

[0036] As one implementation method, such as Figures 1 to 12As shown, a sensor 100 is connected to a pipe through which a cold medium flows. It is understood that the sensor 100 is used to measure the temperature and / or pressure of the cold medium in a containment cavity or pipe within a thermal management system. Therefore, the sensor 100 needs to be connected to the outside world so that the sensing element contacts the external cold medium to achieve temperature and / or pressure measurement. However, the cold medium is prone to leaking into the sensor and contacting the circuit board assembly. The sensor 100 uses a sealing part 20 to reduce the risk of cold medium leakage. The sensor 100 includes a housing 12, a circuit board assembly 13, and a pressure sensing module 14. The circuit board assembly 13 is fixedly connected to the housing 12. In this embodiment, the circuit board assembly 13 is bonded to the housing 12. The circuit board assembly 13 is electrically connected to the pressure sensing module 14. The pressure sensing module 14 includes a pressure sensing surface 1424. Specifically, the pressure sensing module 14 also includes a pressure sensing port 1422, which is located on the pressure sensing surface 1424 and is connected to the pipe through which the cold medium flows. At least a portion of the pressure-sensing surface 1424 constitutes part of the outer surface of the sensor 100. It can be understood that the pressure-sensing module 14 is a component of the outer wall of the sensor 100, and the pressure-sensing surface 1424 is a component of the outer surface of the sensor 100, such as... Figure 12 As shown, the pressure-sensing module 14 is directly connected to the flow pipe 302 through the pressure channel 303 during the operation of the sensor 100. In this way, the structure of the sensor housing is adjusted so that the pressure-sensing surface of the pressure-sensing module is part of the sensor surface, which helps to simplify the structure of the sensor.

[0037] Specifically, in this implementation, such as Figures 10 to 11 As shown, the housing 12 has a bottom 1212, which is located at the bottom of the housing 12. It should be noted that the "bottom" mentioned here, and the directional terms used below, are defined relative to the structure shown in the corresponding figures; they are relative concepts and may therefore vary depending on their location and usage. The bottom 1212 has a bottom surface 1212a. Along the axial direction of the sensor 100, the housing 12 has a recess 123 recessed from the bottom surface 1212a towards the housing 12. It should be noted that the axial direction of the sensor 100 here and below refers to the height direction of the sensor 100. See [reference needed]. Figure 3 As shown, the height direction of sensor 100 is the direction of arrow "H", and the radial direction of sensor 100 is the direction perpendicular to the axial direction of sensor 100. At least a portion of the circuit board assembly 13 is located in the recess 123, one side of the circuit board assembly abuts against the top surface 1231, and the other side of the circuit board assembly abuts against the sealing portion 20 and the pressure sensing module 14. More specifically, as shown... Figures 1 to 10 As shown, in this embodiment, the circuit board assembly 13 is bonded to the top surface 1231 of the recess 123. In this way, the circuit board assembly is fixedly installed in the housing.

[0038] More specifically, the circuit board assembly 13 abuts against the top surface 1231 corresponding to the top of the recess 123. It can be understood that placing the sealing part 20 on the axially outer side of the bottom surface 1212a reduces the risk of refrigerant leakage into the sensor. Since the sealing part is located on the outer side of the housing 12, it also avoids the need for a seal inside the sensor, thus simplifying the internal structure. It should be noted that "outer side" here refers to the direction along the axial direction of the sensor and away from the axis of the sensor 100.

[0039] As one implementation method, such as Figures 1 to 7 As shown, the circuit board assembly 13 includes a connecting piece 131, a grounding portion 132, and a circuit board 133. Specifically, in this embodiment, the grounding portion 132 is a grounding spring, but in other embodiments, the grounding portion 132 can also be a grounding pin or a grounding spring. The connecting piece 131 is connected to the circuit board 133 and the temperature sensing module 15. Specifically, one end of the connecting piece 131 is electrically connected to the circuit board 133, and the other end of the connecting piece 131 is electrically connected to the lead portion 152 of the temperature sensing module 15. It should be noted that the connecting piece 131 is made of metal. Since the lead portion 152 of the temperature sensing module 15 is made of copper wire, the connecting piece 131 prevents the lead portion 152 from accidentally contacting other components and causing a short circuit during the connection process to the circuit board 133. Of course, in other embodiments, the lead portion 152 can be directly electrically connected to the circuit board 133. The circuit board 133 includes a first surface 1331 and a second surface 1332. The first surface 1331 abuts against the housing 12, and the second surface 1332 is connected to the pressure sensing module 14. Specifically, the first surface 1331 abuts against the second platform surface of the recess 123, and the second surface 1332 is electrically connected to the pin portion 141 of the pressure sensing module 14 and abuts against the top of the main body portion 142 of the pressure sensing module 14. Along the axial direction of the sensor 100, the first surface 1331 is away from the first sealing portion 201 relative to the second surface 1332, and is grounded. Part 132 is located on the second surface 1332, and the first surface 1331 is provided with several electronic components (not shown in the figure). Specifically, the first surface 1331 and the second surface 1332 are located on opposite sides of the circuit board 133. The first surface 1331 is provided with electronic components and abuts against the housing 12, while the second surface 1332 abuts against the pressure sensing module 14. The first sealing surface 211 of the first sealing part 201 is located on the second surface 1332. It can be understood that the first sealing part 201 seals the pressure sensing module 14 on the second surface 1332. More specifically, as shown... Figure 3 and Figure 7As shown, the grounding part 132 abuts against the second surface 1332 of the circuit board 133. Along the radial direction of the sensor 100, the grounding part 132 is located radially outside the pressure sensing module 14. It can be understood that one end of the grounding part 132 is connected to the circuit board 133, and the other end abuts against the external wall, which helps to reduce electromagnetic interference from the outside to the internal electronic components of the sensor 100. With this arrangement, the electronic components are designed on one side of the circuit board, while the other side of the circuit board abuts against the pressure sensing module, which helps to simplify the space inside the sensor cavity.

[0040] As one implementation method, such as Figures 1 to 11 As shown, the pressure-sensing module 14 includes a pin portion 141, a main body portion 142, and a pressure-sensing element 143. The main body portion 142 is connected to the pin portion 141, and the pin portion 141 is electrically connected to the circuit board 133. The main body portion 142 has a groove 1421, and the pressure-sensing element 143 is located in the groove 1421. The groove 1421 has a pressure-sensing port 1422, which is located on the surface of the main body portion 142. Specifically, the pressure-sensing module 14 is used to sense the pressure of an external cold medium. The pressure-sensing module 14 abuts against the second surface 1332 of the circuit board 133. Along the axial direction of the sensor 100, the pressure-sensing module 14 is closer to the cold medium than the circuit board 133. Figure 4 As shown, since the first sealing surface 211 is located on the second surface 1332, the pressure sensing module 14 will be in direct contact with the refrigerant. Therefore, insulating adhesive is applied to the pin portion 141 to prevent the refrigerant from contacting the pins of the pin portion 141. The pressure sensing port 1422 is connected to the outside of the sensor 100. The pressure sensing element 143 can generate a pressure detection signal based on the external fluid pressure of the sensor 100, and the main body 142 can condition the pressure sensing signal. Specifically, the pressure sensing element 143 is electrically connected to the main body 142, and the main body 142 has a conditioning circuit inside. The housing of the main body 142 is injection molded. It should be noted that the pressure sensing module 14 integrates the functions of the pressure detection chip and the conditioning chip, and the circuit structure for connecting the pressure detection chip and the conditioning chip is also integrated into the pressure sensing module 14. This arrangement avoids placing the conditioning chip on the circuit board 133, which helps to reduce the size of the circuit board 133 and thus the size of the sensor 100.

[0041] Furthermore, as a means of implementation, such as Figures 4 to 8 As shown, the main body 142 includes a main surface 1423 and a pressure-sensing surface 1424. Along the axial direction of the sensor 100, the main surface 1423 and the pressure-sensing surface 1424 are located on both sides of the main body 142, as shown. Figure 4As shown, the main body surface 1423 is closer to the circuit board 133 than the pressure-sensing surface 1424, and the main body surface 1423 abuts against the second surface 1332. The pressure-sensing port 1422 is located on the pressure-sensing surface 1424. It can be understood that the main body surface 1423 and the second surface 1332 are electrically connected, the pressure-sensing surface 1424 is in direct contact with the external cold medium, and the pressure-sensing port 1422 is located in the channel between the pressure-sensing surface 1424 and the external cold medium, guiding the cold medium to the pressure-sensing element 143. The pressure-sensing element 143 generates a pressure detection signal, which is processed by the conditioning circuit within the integrated main body 142, and then transmitted from the pin portion 141 to the circuit board 133 to complete the measurement of the cold medium pressure. This arrangement facilitates the measurement of the cold medium by the pressure-sensing module.

[0042] Furthermore, as a means of implementation, such as Figures 4 to 8 As shown, the pressure sensing module 14 is a single unit, formed by insert injection molding. Specifically, the pressure sensing module 14 includes a pressure sensing element 143 fabricated from a wafer, a main body 142 formed by insert injection molding of the pressure sensing element 143 and signal conditioning circuitry, and a pin portion 141 wrapped with insulating adhesive. Both the main body surface 1423 and the pressure sensing surface 1424 are planar, and the main body surface 1423 is parallel to the pressure sensing surface 1424. It can be understood that the surface of the circuit board 133 is also approximately planar. Mounting the pressure sensing module 14 on the circuit board 133 reduces interference between the two. This arrangement facilitates the mounting of the pressure sensing module 14 on the circuit board 133.

[0043] like Figures 1 to 7As shown, in one implementation, the temperature sensing module 15 protects the protective housing 151, the lead wire 152, and the temperature sensing head 153. The protective housing 151 is connected to the housing 12. Specifically, one end of the protective housing 151 is fixedly connected to the housing 12, and the other end is a closed end. The protective housing 151 has a protective cavity 1514, and at least a portion of the lead wire portion 152 and the temperature sensor 153 are located in the protective cavity 1514. Specifically, in this embodiment, a portion of the lead wire portion 152 is located in the protective cavity 1514. One end of the lead wire portion 152 is connected to the connecting piece 131, and the other end of the lead wire portion 152 is connected to the temperature sensor 153. Specifically, the lead wire portion 152 extends from the temperature sensor 153 and connects to the connecting piece 131. The lead wire portion 152 includes a first connecting portion 1521, a second connecting portion 1522, and a transition connecting portion 1523. Both the first connecting portion 1521 and the second connecting portion 1522 are connected to the transition connecting portion 1523. The other end of the first connecting portion 1521 is electrically connected to the connecting piece 131, and the other end of the second connecting portion 1522 is connected to the temperature sensor 153. More specifically, the protective cavity 1514 corresponding to the temperature sensor 153 is filled with thermally conductive adhesive, and the temperature sensor 153 is located within the thermally conductive adhesive. It can be understood that the thermally conductive adhesive covering the temperature sensor 153 helps improve temperature conduction efficiency and reduce the temperature response time of the sensor 100. The temperature sensor 153 can be an NTC (Negative Temperature Coefficient) temperature sensing element or a PTC (Positive Temperature Coefficient) temperature sensing element. In this way, the sensor's temperature sensing module can effectively measure the temperature of cold media.

[0044] Furthermore, as a means of implementation, such as Figures 4 to 12 As shown, the protective housing 151 includes a limiting part 1511, a supporting part 1512, and an extension part 1513. Specifically, the protective housing 151 is a metal part. Optionally, the protective housing 151 can be an aluminum metal part or a stainless steel metal part. Aluminum metal parts are lighter, which is beneficial to the lightweight design of the sensor 100, thus facilitating the overall lightweight design of the vehicle when the sensor 100 is used in the automotive thermal management system. Although stainless steel metal parts are slightly heavier than aluminum metal parts, stainless steel metal parts have the advantage of being easy to weld. The supporting part 1512 connects the limiting part 1511 and the extension part 1513. The limiting part 1511 is fixedly connected to the housing 12. The extension part 1513 protrudes from the supporting part 1512 in a direction outward along the axial direction of the sensor 100. The supporting part 1512 is sealed to the second sealing part 202. Specifically, as shown... Figure 12As shown, the extension 1513 protrudes from the support 1512 along the axial direction of the sensor 100 and is disposed in the refrigerant channel. The temperature sensing head 153 is located in the protective cavity corresponding to the sealed end of the extension 1513. It can be understood that the extension 1513 covers the temperature sensing head 153 and enters the pipe through which the refrigerant flows to measure the temperature, so that the temperature sensing head 153 does not directly contact the refrigerant, but indirectly senses the temperature of the refrigerant through the thermally conductive adhesive and the shell of the extension 1513. More specifically, the limiting part 1511 and the support 1512 are integral parts. The limiting part 1511 extends from the support 1512 along the protective shell 151 towards the shell 12. The limiting part 1511 is fixedly connected to the shell 12. It can be understood that the limiting part 1511 prevents the protective shell 151 from falling off during the assembly or use of the sensor 100. This design helps to secure the housing 151 to the housing 12. At the same time, it protects the housing 151 from the risk of short circuits caused by metal impurities in the pipe to the temperature sensor 153 and / or the lead wire 152, thus increasing the stability of the sensor 100.

[0045] like Figures 1 to 12 As shown, in one implementation, the housing 12 includes a platform portion 127, which includes a first platform portion 121 and a second platform portion 122. The first platform portion 121 and the second platform portion 122 are integral. Specifically, the housing 12 is an insulating part made of plastic, and the insulating housing 12 encloses the circuit board assembly 13. The first platform portion 121 has a first platform surface 1211, and the second platform portion 122 protrudes from the first platform surface 1211. Specifically, as shown... Figures 5 to 7 As shown, the first platform portion 121 and the second platform portion 122 are cylindrical. Along the axial direction of the sensor 100, the area of ​​the first platform portion 121 is larger than the area of ​​the second platform portion 122. The second platform surfaces of the first platform portion 121 and the second platform surfaces of the second platform portion 122 are approximately concentric circles. The second platform portion 122 protrudes from the middle part of the first platform portion 121. It should be noted that during the installation of the sensor 100 in the sensing assembly 300, the non-protruding part of the first platform portion 121 abuts against the pressing part 305 of the sensing assembly 300. The pressing part 305 of the sensing assembly 300 fixes the sensor 100 in the mounting part 304 of the sensing assembly 300 by abutting against the first platform portion 121. The second platform portion 122 has a through-hole groove 124 extending along its thickness direction. The through-hole groove 124 communicates with the recess 123. The purpose of the through-hole groove 124 is to facilitate the connection of the connecting piece 131 and the application of thermally conductive adhesive into the protective cavity 1514. Therefore, the size of the through-hole groove 124 depends on the distance between the solder joint of the connecting piece 131 on the circuit board 133 and the protective cavity 1514 along the axial direction of the sensor 100. This method helps to increase the overall strength of the sensor and provides insulation.

[0046] Furthermore, as a means of implementation, such as Figures 9 to 11 As shown, the second platform portion 122 includes a side wall surface 1221, a second platform surface 1223, and a transition portion 1222 connecting the side wall surface 1221 and the second platform surface 1223. The side wall surface 1221 is perpendicularly connected to the first platform surface 1211, and the second platform surface 1223 is parallel to the first platform surface 1211. The housing 12 has a fixing portion 125 protruding along the second platform surface 1223. The fixing portion 125 has a through hole 1251 extending through it in the thickness direction. The sensor 100 includes a conductive portion 11, at least a portion of which is located in the through hole 1251. Specifically, the through hole 1251 communicates with the recess 123, and the conductive portion 11 penetrates the through hole 1251 of the second platform portion 122. In this embodiment, as shown... Figure 11 As shown, the conductive part 11 is a coil spring. More specifically, the conductive part 11 includes a first end 111, a second end 112, and an intermediate part 113 connecting the first end 111 and the second end 112. The first end 111 abuts against the first surface 1331 of the circuit board 133. Part of the intermediate part 113 is received within the through hole 1251 of the housing 12. The second end 112 extends upward from the intermediate part 113 beyond the housing 12. It should be noted that the second end 112 of the conductive part 11 is used for electrical connection with external components of the sensor 100. It can be understood that by having the conductive part 11 of the coil spring structure abut against the circuit board inside the sensing assembly, the sensing signal can be transmitted to the sensing assembly, facilitating further control of the sensing assembly. This method is beneficial for the guiding and installation of the conductive part 11 of the sensor 100.

[0047] like Figure 4 As shown, the sealing part 20 also has a sealing surface 21, which is approximately flush with the bottom surface 1212a. It can be understood that in this embodiment, the sealing part 20 is disposed on the axial outer side of the bottom surface 1212a, and the sealing surface 21 of the sealing part 20 is flush with the bottom surface 1212a. However, in other embodiments, the sealing surface 21 of the sealing part 20 is disposed on the axial outer side or axial inner side of the bottom surface 1212a, which can achieve the same effect. It should be noted that the "inner side" here refers to the direction along the axial direction of the sensor and close to the axis of the sensor 100.

[0048] Furthermore, as a means of implementation, such as Figures 1 to 7As shown, the sealing part 20 includes a first sealing part 201 and a second sealing part 202. The first sealing part 201 seals the pressure sensing module 14, and the second sealing part 202 seals the temperature sensing module 15. Specifically, in this embodiment, the first sealing part 201 uses a square sealing ring, and the second sealing part 202 uses an O-ring. It should be noted that the sealing part can also use other sealing methods to seal the pressure sensing module 14 and the temperature sensing module 15. It is understood that the contact points between the pressure sensing module 14 and the temperature sensing module 15 and the refrigerant are prone to refrigerant leakage. The first sealing part 201 and the second sealing part 202 seal the pressure sensing module 14 and the temperature sensing module 15 respectively to prevent the refrigerant from leaking into the sensor 100 and contacting the circuit board assembly 13. The first sealing part 201 has a first sealing surface 211, which is located on the surface of the circuit board assembly 13. The second sealing part 202 has a second sealing surface 212, which is located on the surface of the temperature sensing module 15. Specifically, the first sealing surface 211 is on the same surface as the second surface 1332 of the circuit board 133 in the circuit board assembly 13, and the second sealing surface 212 is on the same surface as the bottom surface of the support part 1512 in the temperature sensing module 15. In this embodiment, the second surface 1332 is parallel to and approximately flush with the bottom surface of the support part 1512. It should be noted that in other embodiments, the sealing surfaces of the pressure sensing module and the temperature sensing module may not be parallel, or they may be on the same surface, which is beneficial to ensuring the effectiveness of the sensor sealing.

[0049] When the pressure-sensing module 14 comes into contact with the cold medium, the pressure it receives from the cold medium is converted into an electrical signal. The temperature-sensing module 15 receives from the cold medium and is converted into an electrical signal. The circuit board 133 calculates the real-time pressure and temperature of the cold medium based on the electrical signals, thereby realizing real-time monitoring of the temperature and pressure of the cold medium, which is beneficial for the precise control and intelligent design of the sensing components.

[0050] This application also provides a sensing component 300, such as Figure 12 As shown, the sensing component 300 includes a base 301, which has a flow channel 302 and a pressure-feeding channel 303. Specifically, both ends of the pressure-feeding channel 303 are connected to the pressure-sensing port 1422 and the flow channel 302. It can be understood that the flow channel 302 is a channel for flowing a cooling medium. The sensing component 300 also includes a sensor 100 as described in the above embodiment, mounted on the base 301. Specifically, the sensor 100 contacts the cooling medium inside the flow channel 302 through the pressure-feeding channel 303, thereby measuring the temperature and pressure inside the channel. As one embodiment, such as... Figure 12As shown, at least a portion of the protective housing 151 is located within the flow channel 302. More specifically, the extension 1513 covers the temperature sensor 153 located within the flow channel 302 to measure the temperature of the cooling medium. The sensing assembly 300 also includes a mounting portion 304 and a crimping portion 305. A portion of the sensor 100 is located in the mounting portion 304, the side of the crimping portion 305 is fixedly connected to the base 301, and the end of the crimping portion 305 abuts against the first platform portion 121. Specifically, as... Figure 12 As shown, in this embodiment, the crimping part 305 is a metal threaded pressure ring. The sidewall of the crimping part 305 is threadedly connected to the base 301. The end of the crimping part 305 abuts against the first platform surface 1211 of the first platform part 121 to fix the sensor 100 and the base 301 together.

[0051] The sensing component 300 may also include a fluid control component, which may be an electronic expansion valve used for flow control of the refrigerant in the thermal management system, thereby achieving throttling of the refrigerant. The fluid control component may include structures such as coil assemblies, which will not be described in detail here. The sensor 100, as an integrated temperature and pressure sensor, can be used to detect the pressure and temperature of the refrigerant passing through the fluid control component. Of course, the fluid control component can also be other control valves or thermal management system components, enabling corresponding control of the refrigerant within the thermal management system components.

[0052] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications without departing from the concept of the present invention, and these modifications all fall within the protection scope of the present invention.

Claims

1. A sensor (100), characterized in that: The sensor (100) includes a housing (12), a circuit board assembly (13), and a pressure-sensing module (14). The housing (12) has a bottom surface (1212a). Along the axial direction of the sensor (100), the housing (12) has a recess (123) recessed from the bottom surface (1212a) toward the housing (12). The circuit board assembly (13) is fixedly connected to the recess (123). The circuit board assembly (13) is electrically connected to the pressure-sensing module (14). Along the axial direction of the sensor (100), the pressure-sensing module (14) is located away from the housing (12) relative to the circuit board assembly (13). The pressure-sensing module (14) includes a pressure-sensing surface (1424), at least a portion of which constitutes part of the outer surface of the sensor (100).

2. The sensor (100) according to claim 1, characterized in that, The housing (12) includes a platform portion (127) and a fixing portion (125). The fixing portion (125) protrudes from the platform portion (127) and has a through hole (1251) extending through it along its thickness direction. The sensor (100) includes a conductive portion (11). At least a portion of the conductive portion (11) is located in the through hole (1251). One end of the conductive portion (11) is electrically connected to an external device, and the other end of the conductive portion (11) is electrically connected to the circuit board assembly (13).

3. The sensor (100) according to claim 2, characterized in that, The platform portion (127) includes a first platform portion (121) and a second platform portion (122). The first platform portion (121) has a first platform surface (1211). The second platform portion (122) protrudes from the first platform surface (1211) and has a second platform surface (1223) that is parallel to the first platform surface (1211). The fixing portion (125) protrudes from the second platform surface (1223).

4. The sensor (100) according to any one of claims 1-3, characterized in that, The circuit board assembly (13) includes a circuit board (133), which includes a first surface (1331) and a second surface (1332). Along the axial direction of the sensor (100), the first surface (1331) is close to the housing (12) relative to the second surface (1332). The first surface (1331) is provided with a plurality of electronic components. At least part of the first surface (1331) abuts against the housing (12). The second surface (1332) is electrically connected to the pressure sensing module (14).

5. The sensor (100) according to any one of claims 1-4, characterized in that, The pressure-sensing module (14) includes a pin portion (141), a main body portion (142), and a pressure-sensing element (143). The main body portion (142) is connected to the pin portion (141), and the pin portion (141) is electrically connected to the circuit board (133). The main body portion (142) has a groove (1421), and the pressure-sensing element (143) is located in the groove (1421). The groove (1421) has a pressure-sensing port (1422), and the pressure-sensing port (1422) is connected to the outside of the sensor (100).

6. The sensor (100) according to claim 5, characterized in that, The main body (142) includes a main surface (1423) and a pressure-sensing surface (1424). Along the axial direction of the sensor (100), the main surface (1423) and the pressure-sensing surface (1424) are located on opposite sides of the main body (142). The main surface (1423) is closer to the circuit board (133) relative to the pressure-sensing surface (1424). The main surface (1423) abuts against the second surface (1332). Along the axial direction of the sensor (100), the groove (1421) is recessed from the pressure-sensing surface (1424) toward the main surface (1423).

7. The sensor (100) according to any one of claims 1-6, characterized in that, The sensor (100) includes a temperature sensing module (15), the circuit board assembly (13) includes a connecting piece (131), one end of the lead part (152) is connected to the connecting piece (131), the other end of the lead part (152) is connected to the temperature sensing head (153), the housing (12) includes an opening groove (124), the opening groove (124) is disposed through the thickness direction of the housing (12), and at least a portion of the connecting piece (131) is located in the opening groove (124).

8. The sensor (100) according to any one of claims 7, characterized in that, The temperature sensing module (15) includes a protective housing (151), a lead wire (152), and a temperature sensing head (153). The protective housing (151) is fixedly connected to the housing (12). The protective housing (151) has a protective cavity (1514), and at least part of the lead wire (152) and the temperature sensing head (153) are located in the protective cavity (1514).

9. The sensor (100) according to claim 8, characterized in that, The protective housing (151) includes a limiting part (1511), a supporting part (1512), and an extension part (1513). The supporting part (1512) connects the limiting part (1511) and the extension part (1513). The limiting part (1511) is fixedly connected to the housing (12). The extension part (1513) protrudes from the supporting part (1512) in a direction outward along the axis of the sensor (100).

10. A sensing component (300) comprising a base (301) having a flow channel (302) and a pressure channel (303) in communication with the pressure channel (303), characterized in that, The sensing assembly (300) further includes a sensor (100) mounted on the base (301). The sensor (100) includes a housing (12), a circuit board assembly (13), and a pressure sensing module (14). The housing (12) has a bottom surface (1212a). Along the axial direction of the sensor (100), the housing (12) is recessed from the bottom surface (1212a) toward the direction close to the housing (12). The circuit board assembly (13) and the sensor (100) are further recessed. The recess (123) is fixedly connected, the circuit board assembly (13) is electrically connected to the pressure sensing module (14), and along the axial direction of the sensor (100), the pressure sensing module (14) is away from the housing (12) relative to the circuit board assembly (13). The pressure sensing module (14) includes a pressure sensing surface (1424), at least a portion of the pressure sensing surface (1424) constitutes part of the outer surface of the sensor (100), and the pressure sensing surface (1424) is exposed to the pressure channel (303).

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