DCDC converter automatic aging test equipment with heat dissipation structure
By combining an automatic alignment component and a stepped cleaning component with a miniature ultrasonic transducer, the problem of probe cleaning is solved, achieving efficient oxide removal, extending probe life, and improving testing accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN YACHUANG XINHAN ELECTRONIC TECH CO LTD
- Filing Date
- 2026-03-04
- Publication Date
- 2026-05-29
AI Technical Summary
Existing automated aging test equipment for DC-DC converters struggles to effectively remove tightly adhered oxides using static cleaning methods with putty when cleaning probes, leading to shortened probe lifespan and decreased test accuracy.
An automatic alignment component drives the test probe into the wave softening cleaning component. Combined with a stepped cleaning component and a micro ultrasonic transducer, the oxides are peeled off and cleaned through cleaning putty and high-frequency vibration.
It effectively removes oxides from the probe surface, extends probe life, improves testing accuracy and efficiency, and avoids probe surface damage and wasted cleaning time.
Smart Images
Figure CN122109674A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of automatic aging test technology, specifically to an automatic aging test device for a DC-DC converter with a heat dissipation structure. Background Technology
[0002] The automatic aging test equipment for DC-DC converters is an industrial automation device specifically designed for the verification and quality screening of DC-DC voltage converters. It simulates a working environment (typically high temperature) and simultaneously operates the DC-DC converter at full load for a period of time to detect any malfunctions or performance degradation. During the aging process, the equipment automatically monitors input voltage, output voltage, current, power, and ripple parameters to determine product qualification. For smaller modular power supplies, multiple DC-DC converters are typically first plugged into a dedicated aging test board, and then the entire board is inserted into the equipment's test slots, similar to plugging and unplugging a circuit board. The probes on the equipment's test rack automatically rise and fall, precisely contacting the input and output pins of the DC-DC converter. This method eliminates the need for manual wiring, avoiding wiring errors and reducing contact resistance. The internal heating device activates, raising the temperature of the test area to the set aging temperature. Temperature sensors monitor this in real time, and the temperature control system controls the heater to stabilize the temperature within the set range. If the temperature becomes too high, a fan will intervene to cool it down.
[0003] In the aging test environment of DC-DC converters, the metal surface of the probes is gold-plated. This gold plating contains pores and reacts chemically with oxygen, moisture, and residual flux on the converter pins to form an oxide film. Under the mechanical stress of repeated probe insertion and removal, these oxides peel off from the surface, forming debris. The oxides are insulating, leading to increased contact resistance. Unstable contact resistance introduces additional noise, causing the measured ripple and noise values to be inaccurate. As the contact resistance increases, the internal temperature of the test equipment also rises, easily melting the solder on the DC-DC converter pins and causing device damage. Some equipment uses rough pads to repeatedly contact and rub the probes during probe idle periods to physically scrape off the oxide layer. However, this process easily damages the gold plating on the probe surface, shortening the probe life. With a large number of probes, cleaning the probe surface multiple times is time-consuming and labor-intensive. Some equipment uses putty for static cleaning of the probes. When the probe is embedded in the putty, the main force is the vertical positive pressure that wraps the probe. For very tightly attached oxides, the adhesive force of the putty alone is often insufficient to remove them from the probe surface. Summary of the Invention
[0004] The purpose of this invention is to provide an automatic aging test device for DC-DC converters with a heat dissipation structure, in order to solve the problem mentioned in the background art that some devices use putty to statically clean the probe. When the probe is stuck into the fixed putty, the main force is the positive pressure in the vertical direction to wrap the probe. For oxides that are attached very tightly, the adhesive force of the putty alone is often insufficient to pull them off the probe surface.
[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic aging test device for a DC-DC converter with a heat dissipation structure, comprising; The test chamber has an internal plug-in backplate for connecting DC-DC converters to perform automatic aging tests. An automatic alignment assembly is installed inside the test chamber. The automatic alignment assembly includes a lifting block and multiple test probes. The lifting block moves up and down at one end of a lead screw mounted on the automatic alignment assembly. The lifting block is used to drive the multiple test probes to perform synchronous operations. Each test probe corresponds to a different pin mounted on a DC-DC converter. A wave-softening cleaning assembly is installed inside the test chamber. The wave-softening cleaning assembly includes a straight rack, a gear, and multiple cleaning putties. The meshing of the straight rack and the gear is used to drive the multiple cleaning putties to move synchronously to directly below multiple test probes to clean oxides. A stepped cleaning component is disposed inside a wave softening cleaning component. The stepped cleaning component includes multiple micro ultrasonic transducers, multiple upper large-pore membranes, multiple middle medium-pore membranes, and multiple lower small-pore membranes. The pore sizes of the upper large-pore membranes, middle medium-pore membranes, and lower small-pore membranes decrease sequentially from top to bottom, and each of the three is respectively formed on the surface of the cleaning putty. The tip of the test probe is inserted sequentially into the upper large-pore membrane, middle medium-pore membrane, and lower small-pore membrane. Through frictional contact between the stepped-pore membranes and the test probe, the softened oxide on the surface of the test probe is scraped off.
[0006] Preferably, the automatic alignment assembly further includes an alignment frame, a servo motor, an L-shaped plate, a penetration rod, and multiple bosses. The alignment frame is disposed on one side of the insertion back plate, the servo motor is disposed on the top of the alignment frame, and the output shaft of the servo motor is connected to one end of a lead screw for driving the lifting block to move up and down. The L-shaped plate is disposed on one side of the lifting block, and the multiple bosses are respectively inserted into multiple test probes. The penetration rods are respectively connected to the multiple bosses.
[0007] Preferably, the automatic alignment assembly further includes multiple detection shells, multiple first wires and second wires, the multiple detection shells are respectively disposed on the top of multiple bosses, the multiple first wires are respectively inserted and connected to one side of the multiple detection shells, the multiple first wires are connected to each other, and the second wire is connected to one of the first wires.
[0008] Preferably, the wave softening cleaning assembly further includes multiple parallel placement platforms, multiple vertical plates, multiple embedded rods, multiple displacement blocks, and multiple support plates. The multiple parallel placement platforms are respectively disposed on one side of the plug-in back plate, the multiple vertical plates are respectively disposed on one side of the multiple parallel placement platforms, the multiple embedded rods are respectively disposed inside the multiple vertical plates, and the multiple displacement blocks are respectively movably sleeved on one end of the multiple embedded rods.
[0009] Preferably, one of the support plates is disposed on top of one of the displacement blocks, and the straight rack is connected to one side of one of the support plates.
[0010] Preferably, the wave softening cleaning assembly further includes a shelf, a micro motor, multiple U-shaped boxes, and a through strip. The shelf is disposed on one side of the plug-in back plate, the micro motor is disposed on the top of the shelf, and the output shaft of the micro motor is connected to the top of the gear for transmission.
[0011] Preferably, the plurality of U-shaped boxes are respectively disposed on one side of the plurality of support plates, the plurality of support plates are connected by a through strip, the plurality of cleaning putty are respectively filled inside the plurality of U-shaped boxes, and the surfaces of the plurality of U-shaped boxes are provided with a plurality of through holes for a plurality of test probes to be inserted into the interior of the stepped cleaning component through the through holes for deep cleaning, and the top of the plurality of U-shaped boxes is provided with an anti-movement cover.
[0012] Preferably, the stepped cleaning assembly further includes multiple processing boxes, multiple auxiliary shells, and cleaning fluid. The multiple processing boxes are respectively disposed at the bottom of multiple U-shaped boxes, and the multiple auxiliary shells are respectively movable inside the multiple processing boxes. The interior of each of the multiple auxiliary shells is filled with cleaning clay. The multiple micro ultrasonic transducers are respectively disposed at the bottom of the multiple processing boxes for driving the cleaning fluid and the cleaning clay inside to vibrate.
[0013] Preferably, the stepped cleaning assembly further includes multiple pull plates, which are respectively disposed on one side of multiple auxiliary shells, for the auxiliary shells to be pulled out from the inside of the processing box for replacement of the cleaning putty.
[0014] Preferably, a sealed door is provided on one side of the test chamber, a control panel is provided on the other side of the test chamber, multiple heat dissipation slots are provided on one side of the test chamber, multiple storage platforms are provided on one side of the plug-in back plate, and multiple plug-in slots are provided on one side of the plug-in back plate.
[0015] Compared with the prior art, the beneficial effects of the present invention are: In this invention, when the servo motor is activated and the lead screw rotates forward, the lifting block moves downward. Under the connection between the L-shaped plate and the insertion rod, multiple bosses move downward, which in turn moves multiple test probes downward. During this movement, the test probes gradually insert into the anti-displacement cover, then into the cleaning putty, and finally through the through-hole. The anti-displacement cover serves as a guide and limiter; when the test probe is inserted, it guides it to accurately enter the cleaning putty and prevents the putty from being pulled out when the probe is withdrawn. The through-hole is mainly to bring the test probe into the stepped cleaning assembly for further cleaning of the cleaning putty. The adhesive force peels off oxides and stains from the surface of the test probe, and the cleaning is completed. The servo motor lifts the test probe, causing it to detach from the cleaning clay. The transmission mechanism pulls the U-shaped box horizontally back to its initial standby position, and the equipment returns to its original state, ready for the next test and cleaning. By setting up a wave softening cleaning component, the cleaning clay inside the U-shaped box is moved laterally, which in turn moves multiple test probes vertically, causing them to fall into the cleaning clay for softening and cleaning. A miniature ultrasonic transducer drives the cleaning clay to vibrate. The high-frequency vibration transmits the cleaning fluid to the surface of the test probe, generating a cavitation effect that breaks down and peels off stubborn oxides and carbides.
[0016] In this invention, when the miniature ultrasonic transducer is activated, both the cleaning clay inside the auxiliary shell and the cleaning clay inside the U-shaped box vibrate at high frequency. The cleaning fluid, being a liquid medium, is responsible for transmitting the vibration and generating a cavitation effect. The stepped pore structure of the upper large-pore membrane, the middle medium-pore membrane, and the lower small-pore membrane is responsible for physically scraping off oxides and providing isolation. The test probe first passes through the upper large-pore membrane, the middle medium-pore membrane, and the lower small-pore membrane to enter the ultrasonic cleaning fluid for deep cleaning. When it is lifted, it is then cleaned by the upper large-pore membrane, the middle medium-pore membrane, and the lower small-pore membrane. The large-pore membrane and the lower small-pore membrane scrape away the residue. The whole process is accompanied by high-frequency vibration to achieve physical peeling. Through the stepped design of the upper large-pore membrane, the middle medium-pore membrane, and the lower small-pore membrane, progressive scraping is achieved, which not only ensures the cleaning effect, but also avoids the test probe insertion resistance or damage caused by the small pore size of a single membrane. The activation of the micro ultrasonic transducer can mainly remove stubborn oxides, while the cleaning putty above is responsible for absorbing the shaken-off stains and residual liquids, realizing deep cleaning by first shaking and then suction. Attached Figure Description
[0017] Figure 1 This is a three-dimensional structural diagram of an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 2This is a schematic diagram of the main body of an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 3 This is a partial front view of the structure of an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 4 This is a schematic diagram of the automatic alignment component in an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 5 This is a partial exploded view of an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 6 This invention relates to an automatic aging test device for a DC-DC converter with a heat dissipation structure. Figure 5 A magnified structural diagram at point B; Figure 7 This is a partial side view of the structure of an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 8 This is a front view schematic diagram of a portion of the detection shell in an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 9 This is a partial side view of the through-bar structure in an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 10 This is a schematic diagram of the stepped cleaning component in an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 11 This is a partial front cross-sectional view of an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention. Figure 12 This is a partial side view of the anti-shift cover in an automatic aging test device for a DC-DC converter with a heat dissipation structure according to the present invention.
[0018] In the diagram: 100. Test chamber; 101. Sealed door; 102. Control panel; 103. Storage platform; 104. Connector slot; 105. Connector backplate; 106. Heat dissipation slot; 2. Automatic alignment assembly; 201. Alignment frame; 202. Lead screw; 203. Servo motor; 204. Lifting block; 205. L-shaped plate; 206. Penetration rod; 207. Boss; 208. Detection shell; 209. Test probe; 210. First lead wire; 211. Second lead wire; 3. Wave softening and cleaning assembly; 301. Parallel placement platform; 3 02. Vertical plate; 303. Embedded rod; 304. Displacement block; 305. Support plate; 306. Straight rack; 307. Shelf; 308. Micro motor; 309. Gear; 310. U-shaped box; 311. Cleaning putty; 312. Anti-movement cover; 313. Through strip; 4. Stepped cleaning assembly; 401. Treatment box; 402. Auxiliary shell; 403. Micro ultrasonic transducer; 404. Upper large-pore membrane; 405. Middle medium-pore membrane; 406. Lower small-pore membrane; 407. Cleaning fluid; 408. Pull plate. Detailed Implementation
[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0020] To address the problem that some existing automated aging test equipment for DC-DC converters with heat dissipation structures uses adhesive for static cleaning of probes during operation, and when the probe is embedded in the adhesive, the main force is the vertical positive pressure that wraps the probe. For tightly adhered oxides, the adhesive force alone is often insufficient to remove them from the probe surface. This invention provides an automated aging test equipment for DC-DC converters with a heat dissipation structure. (Refer to...) Figure 1 and Figure 2 As shown: including: The test chamber 100 has an internal plug-in backplate 105 for plugging in the DC-DC converter to perform automatic aging tests. The automatic alignment component 2 is located inside the test chamber 100. The automatic alignment component 2 includes a lifting block 204 and multiple test probes 209. The lifting block 204 moves up and down at one end of the lead screw 202 installed in the automatic alignment component 2. The lifting block 204 is used to drive the multiple test probes 209 to perform synchronous operation. Each test probe 209 corresponds to a different pin installed in the DC-DC converter. The wave softening cleaning component 3 is located inside the test chamber 100. The wave softening cleaning component 3 includes a straight rack 306, a gear 309 and multiple cleaning putty 311. The meshing of the straight rack 306 and the gear 309 is used to drive the multiple cleaning putty 311 to move synchronously to directly below the multiple test probes 209 to clean the oxides. The stepped cleaning component 4 is disposed inside the wave softening cleaning component 3. The stepped cleaning component 4 includes multiple micro ultrasonic transducers 403, multiple upper large-pore membranes 404, multiple middle medium-pore membranes 405, and multiple lower small-pore membranes 406. The pore sizes of the upper large-pore membranes 404, the middle medium-pore membranes 405, and the lower small-pore membranes 406 decrease sequentially from top to bottom, and the three are respectively opened on the surface of the cleaning putty 311. The tip of the test probe 209 is inserted into the upper large-pore membrane 404, the middle medium-pore membrane 405, and the lower small-pore membrane 406 in sequence. Through the frictional contact between the stepped pore membranes and the test probe 209, the softened oxide on the surface of the test probe 209 is scraped off.
[0021] First, after opening the test chamber 100, multiple DC-DC converters are manually placed inside. The entire DC-DC converter is inserted into the connector slot 104. By activating the automatic alignment component 2, the test probes 209 automatically rise and fall, precisely contacting the input and output pins of the DC-DC converter. The heating device inside the test chamber 100 starts working, raising the temperature of the test area to the set aging temperature. The temperature sensor monitors in real time, and the temperature control system controls the heater to stabilize the temperature within the set range. If the temperature is too high, the fan will intervene to cool it down. The test chamber 100 is prepared to test the DC-DC converters according to the preset values. The converter provides input voltage, and the test chamber 100 simultaneously powers on all the DC-DC converters under test. The electronic load inside the test chamber 100 starts working, simulating the actual circuit and consuming the electrical energy output by the DC-DC converter. It causes the load to periodically jump between light and heavy loads, simulating the drastic current changes in real use. The test chamber 100 monitors whether the input current and input power are abnormal. The test chamber 100 will collect the output voltage, output current, and ripple noise. If the DC-DC converter burns out at high temperature, causing an open circuit or short circuit, the test chamber 100 will instantly cut off the power supply to that channel to prevent fire or damage to the test equipment.
[0022] To address the issue of the large number of test probes 209 requiring multiple cleanings of their surfaces, which is time-consuming and labor-intensive, an automatic alignment component 2 is set up to drive multiple test probes 209 into the interior of the wave softening cleaning component 3 for oxide cleaning.
[0023] Preferably, the specific working process of the automatic alignment component 2 is as follows: Figure 3 and Figure 4 As shown, the automatic alignment assembly 2 also includes an alignment frame 201, a servo motor 203, an L-shaped plate 205, a penetration rod 206, and multiple bosses 207. The alignment frame 201 is located on one side of the insertion back plate 105, the servo motor 203 is located on top of the alignment frame 201, and the output shaft of the servo motor 203 is connected to one end of the lead screw 202 for driving the lifting block 204 to move up and down. The L-shaped plate 205 is located on one side of the lifting block 204, and the multiple bosses 207 are respectively inserted into multiple test probes 209. The penetration rods 206 are respectively inserted into multiple bosses 207. The automatic alignment assembly 2 also includes multiple detection housings 208, multiple first wires 210, and second wires 211. The multiple detection housings 208 are respectively disposed on the tops of multiple bosses 207. The multiple first wires 210 are respectively inserted and connected to one side of the multiple detection housings 208, and the multiple first wires 210 are connected to each other. The second wire 211 is connected to one of the first wires 210. The alignment frame 201 is fixedly installed on one side of the plug-in back plate 105. The servo motor 203 is fixedly installed on the top of the alignment frame 201. The lead screw 202 is disposed inside the alignment frame 201. Bearings are installed at both ends of the device. By starting the servo motor 203, the lead screw 202, which is connected to its output shaft, rotates in place. The lifting block 204 is threaded onto one end of the lead screw 202. One side of the L-shaped plate 205 is fixedly connected to one side of the lifting block 204. A penetrating rod 206 is fixedly inserted into the interior of the L-shaped plate 205. Multiple bosses 207 are fixedly sleeved onto the ends of the penetrating rods 206. Multiple detection shells 208 are fixedly installed on the tops of the multiple bosses 207. Multiple test probes 209 are fixedly inserted into the multiple detection shells 208. Inside, multiple first wires 210 are interwoven and connected to multiple detection housings 208 respectively. Each of the multiple first wires 210 and second wires 211 has a spring inside. The spring is welded to the first wires 210 and the second wires 211. The spring itself is both a conductor and a buffer. When the test probe 209 contacts the pin of the DC-DC converter, the spring is compressed and a contact pressure is generated. The electrical signals collected by these test probes 209 are collected through the cables inside the test housing 100 and finally transmitted to the back-end data acquisition and control system.
[0024] After the pins of the DC-DC converter fall onto the top of the parallel placement platform 301, the servo motor 203 is first started, driving the lead screw 202, which is connected to its output shaft, to rotate. Since the outer surface of the lifting block 204 is tightly fitted to the inner wall of the alignment frame 201, and the lead screw 202 rotates in place inside the alignment frame 201, the lifting block 204 will move up and down at one end of the lead screw 202 during this process. When the lead screw 202 rotates forward, the lifting block 204 moves downward, and under the connection of the L-shaped plate 205 and the insertion rod 206, it drives multiple bosses 207 to move downward. This causes multiple test probes 209 to move downwards. During their movement, they gradually approach the pins of the DC-DC converter. After they come into contact with each other, the spring is compressed, generating contact pressure. Then, the electrical signal is transmitted to the data acquisition and control system through the first wire 210 and the second wire 211. The test box 100 supplies power to the converter and applies a load, while continuing to monitor its output voltage, current, and ripple parameters. By analyzing the changes in these parameters, such as voltage drop, ripple increase, or slowed response, it is determined whether the internal components have aged or failed.
[0025] After the DCDC converter aging test is completed, the servo motor 203 is started again, which drives the lead screw 202 to rotate in the opposite direction. This causes the lifting block 204 to move upward at one end of the lead screw 202. With the connection of the L-shaped plate 205 and the penetration rod 206, multiple test probes 209 are moved upward. As the test probes 209 move upward, they gradually move away from the pins of the DCDC converter. Then, the wave softening cleaning component 3 is started to clean the oxides left on the surface of the test probes 209 after the test.
[0026] To address the issue of damage to the gold plating layer caused by repeated contact and friction between the rough pads and the test probe 209, which physically scrapes away the oxide layer, a soft cleaning putty 311 is used to wrap around the test probe 209 to clean the oxide layer.
[0027] Preferably, the specific working process of the wave softening cleaning component 3 is as follows: Figure 5 , Figure 6 and Figure 12As shown, the wave-softening cleaning assembly 3 also includes multiple parallel placement platforms 301, multiple vertical plates 302, multiple embedded rods 303, multiple displacement blocks 304, and multiple support plates 305. The multiple parallel placement platforms 301 are respectively disposed on one side of the insertion back plate 105, the multiple vertical plates 302 are respectively disposed on one side of the multiple parallel placement platforms 301, the multiple embedded rods 303 are respectively disposed inside the multiple vertical plates 302, the multiple displacement blocks 304 are respectively movably sleeved on one end of the multiple embedded rods 303, and one of the support plates 305 is disposed on the top of one of the displacement blocks 304. A straight rack 306 is connected to one of the... One side of the support plate 305 is connected to the other side, and one side of each of the multiple vertical plates 302 is fixedly connected to one side of each of the multiple parallel placement platforms 301. Multiple embedded rods 303 are fixedly installed inside the multiple vertical plates 302. When it is necessary to clean the oxide on the surface of the test probe 209, the operator starts the micro motor 308, which drives the gear 309, which is connected to its output shaft, to rotate. This, in turn, drives the straight rack 306, which meshes with the gear 309, to move. When the gear 309 rotates clockwise, the straight rack 306 moves towards the side closer to the insertion back plate 105. With the connection of the through strip 313, the multiple support plates 305 move synchronously. As the support plate 305 moves, the U-shaped boxes 310 move synchronously, moving them to directly below the test probes 209. Then, the operator starts the servo motor 203. When the lead screw 202 rotates forward, the lifting block 204 moves downward. Connected to the L-shaped plate 205 and the insertion rod 206, it drives the multiple bosses 207 downward, which in turn drives the multiple test probes 209 downward. During this movement, the test probes 209 gradually insert into the anti-displacement cover 312, continuing until they reach the clear... The test probe 209 is inserted into the cleaning putty 311 and then further inserted through the through hole. The anti-displacement cover 312 serves as a guide and limiter. When the test probe 209 is inserted, the anti-displacement cover 312 can guide the test probe 209 to accurately enter the cleaning putty 311 and prevent the cleaning putty 311 from being pulled out when the test probe 209 is pulled out. The through hole is mainly to bring the test probe 209 into the interior of the stepped cleaning component 4 for cleaning again. The cleaning putty 311 peels off the oxides and stains on the surface of the test probe 209 through adhesion. After cleaning is completed, the servo motor 203 is driven to lift the test probe 209 and remove it from the cleaning putty 311.
[0028] It should be noted that during the pin testing of the DC-DC converter, the wave softening cleaning component 3 is located on the right side of the plug-in backplate 105, and there is a distance between the two. After the micro motor 308 is started, it drives the entire U-shaped box 310 to move closer to the plug-in backplate 105.
[0029] Preferably, the specific working process of the wave softening cleaning component 3 is as follows: Figure 7, Figure 8 and Figure 9 As shown, the wave softening cleaning assembly 3 also includes a shelf 307, a micro motor 308, multiple U-shaped boxes 310, and a through strip 313. The shelf 307 is located on one side of the plug-in back plate 105, and the micro motor 308 is located on the top of the shelf 307. The output shaft of the micro motor 308 is connected to the top of the gear 309. The multiple U-shaped boxes 310 are respectively located on one side of multiple support plates 305, and the multiple support plates 305 are connected to each other by the through strip 313. Multiple cleaning putty 311 is respectively filled inside the multiple U-shaped boxes 310, and multiple through holes are opened on the surface of each U-shaped box 310 for multiple test probes 209 to be inserted into the interior of the stepped cleaning assembly 4 through the through holes for deep cleaning. The top of each U-shaped box 310 is provided with an anti-shift cover 312, and the shelf 307 is fixed. A micro motor 308 is fixedly mounted on the top of a shelf 307 on one side of a plug-in back plate 105. One side of a straight rack 306 is fixedly connected to one side of one of the support plates 305. Multiple U-shaped boxes 310 are fixed to one side of multiple support plates 305 respectively. Multiple anti-shift covers 312 are fixedly installed on the top of multiple U-shaped boxes 310 respectively. Multiple cleaning putty 311 are filled on the surface of the U-shaped boxes 310 respectively. The micro motor 308 rotates in the opposite direction, and the transmission mechanism pulls the U-shaped boxes 310 horizontally back to the initial standby position. The equipment returns to its original state and waits for the next test and cleaning. By setting the wave softening cleaning component 3, the cleaning putty 311 in the U-shaped box 310 is moved laterally, which continues to move multiple test probes 209 vertically, causing them to fall into the cleaning putty 311 for softening and cleaning.
[0030] To address the issue that the adhesion of the cleaning putty 311 alone is often insufficient to remove tightly adhered oxides from the surface of the test probe 209, a miniature ultrasonic transducer 403 is used to drive the cleaning putty 311 to vibrate. The high-frequency vibration transmits the cleaning fluid 407 to the surface of the test probe 209, generating a cavitation effect that breaks down and peels off stubborn oxides and carbides.
[0031] Preferably, the specific working process of the stepped cleaning component 4 is as follows: Figure 10 and Figure 11As shown, the stepped cleaning assembly 4 also includes multiple processing boxes 401, multiple auxiliary shells 402, and cleaning fluid 407. The multiple processing boxes 401 are respectively disposed at the bottom of multiple U-shaped boxes 310. The multiple auxiliary shells 402 are movable inside the multiple processing boxes 401. Each auxiliary shell 402 is filled with cleaning putty 311. Multiple miniature ultrasonic transducers 403 are respectively disposed at the bottom of the multiple processing boxes 401, used to drive the cleaning fluid 407 and the cleaning putty 311 inside to vibrate. The stepped cleaning assembly 4 also includes multiple pull plates 408, which are respectively disposed on one side of the multiple auxiliary shells 402, used to remove the auxiliary shells 402 from the inside of the processing boxes 401 for replacing the cleaning putty 311. The miniature ultrasonic transducers 403 serve as a power source, responsible for generating high-frequency vibrations and activating the miniature ultrasonic transducers. When the ultrasonic cleaner 403 is activated, the cleaning putty 311 inside the auxiliary shell 402 and the cleaning putty 311 inside the U-shaped box 310 both vibrate at high frequency. The cleaning fluid 407, being a liquid medium, is responsible for transmitting the vibration and generating a cavitation effect. The stepped pore membrane setup of the upper large-pore membrane 404, the middle medium-pore membrane 405, and the lower small-pore membrane 406 is responsible for physically scraping off oxides and isolating them. The test probe 209 first passes through the upper large-pore membrane 404, the middle medium-pore membrane 405, and the lower small-pore membrane 406, and then enters the ultrasonic cleaning fluid 407 for deep cleaning. When it is lifted, the residue is scraped off by the upper large-pore membrane 404, the middle medium-pore membrane 405, and the lower small-pore membrane 406. The entire process is accompanied by high-frequency vibration, achieving physical peeling. Before the operation begins, the auxiliary shell 402 is already filled with cleaning putty 311. At the same time, the processing box 401... The auxiliary housing 402 contains an appropriate amount of cleaning fluid 407. When the test probe 209 is inserted into the auxiliary housing 402 through the through-hole, the miniature ultrasonic transducer 403 is activated, generating high-frequency vibrations. These vibrations are transmitted to the cleaning fluid 407 through the bottom of the processing box 401. The test probe 209 continues to move downwards, first inserting into the upper large-pore membrane 404, then into the middle medium-pore membrane 405, and finally into the lower small-pore membrane 406. The upper large-pore membrane 404 initially scrapes away large, loose dirt. The test probe 209 continues downwards, passing through the middle medium-pore membrane 405. The probe 209, along with the lower small-pore membrane 406, is finally immersed in the cleaning solution 407 inside the treatment box 401. At this time, the high-frequency vibration generated by the micro ultrasonic transducer 403 induces cavitation in the cleaning solution 407, creating vacuum bubbles that burst instantly and release impact force. This impact force can shatter and peel off stubborn oxides and carbides attached to the surface and crevices of the test probe 209. After cleaning, the test probe 209 begins to rise under the movement of the lifting block 204, first passing through the tightest lower small-pore membrane 406. This membrane acts like a scraper, removing most of the residual liquid and loosened but still attached dirt from the surface of the test probe 209.The test probe 209 continues upward, passing through the middle-layer medium-pore membrane 405 for further cleaning of the middle section, and finally passing through the upper-layer large-pore membrane 404. A final wipe is performed on the base of the test probe 209 to ensure it is relatively dry and clean when it leaves the stepped cleaning assembly 4. After multiple cleaning cycles, the cleaning putty 311 inside the auxiliary housing 402 will become saturated. At this point, maintenance personnel can grasp the pull plate 408 and pull the entire auxiliary housing 402 out of the processing box 401 for replacement. The new cleaning putty 311, through its stepped design of an upper large-pore membrane 404, a middle medium-pore membrane 405, and a lower small-pore membrane 406, achieves progressive scraping. This ensures cleaning effectiveness while avoiding excessive resistance or damage to the test probe 209 caused by excessively small pore sizes in a single membrane. The activation of the miniature ultrasonic transducer 403 primarily removes stubborn oxides, while the upper cleaning putty 311 absorbs the dislodged dirt and residual liquid, achieving deep cleaning through a combination of vibration and suction.
[0032] like Figure 1 , Figure 2 and Figure 3 As shown, a sealed door 101 is provided on one side of the test chamber 100, and a control panel 102 is provided on the other side. Multiple heat dissipation slots 106 are provided on one side of the test chamber 100, and multiple storage platforms 103 are provided on one side of the insertion back plate 105. Multiple insertion slots 104 are provided on one side of the insertion back plate 105. One side of the sealed door 101 is hinged to one side of the test chamber 100, allowing it to be opened by flipping the sealed door 101, facilitating the insertion of the DC-DC converter into the test chamber 100. A fan is installed inside the test chamber 100; by activating the control panel 102, the fan is turned on, and the heat inside the test chamber 100 is exhausted to the external environment through the multiple heat dissipation slots 106. For heat dissipation purposes, multiple storage platforms 103 are fixedly installed on one side of the plug-in backplate 105, and multiple parallel placement platforms 301 are fixedly installed on the other side of the plug-in backplate 105. The parallel placement platforms 301 and the storage platforms 103 are on the same horizontal plane, and are used to place the DC-DC converter on the top of the storage platform 103. The pins of the DC-DC converter fall into the surface of the parallel placement platform 301. Subsequently, using the automatic alignment component 2, during the descent of the test probe 209, the test probe 209 contacts the pins to perform subsequent automatic aging tests. After the DC-DC converter is placed on the surface of the storage platform 103, one side of it continues to be inserted into the interior of the plug-in slot 104, and the pins extend out through the plug-in slot 104 and are then placed on the surface of the parallel placement platform 301.
[0033] Working Principle: The automatic aging test equipment for DC-DC converters is an industrial automation device specifically designed for verifying and screening the quality of DC-DC voltage converters. It simulates a high-temperature working environment while simultaneously operating the DC-DC converter at full load for a period of time to detect any malfunctions or performance degradation. During the aging process, the equipment automatically monitors input voltage, output voltage, current, power, and ripple parameters to determine product qualification. For smaller modular power supplies, multiple DC-DC converters are typically first inserted into a dedicated aging test board, and then the entire board is inserted into the test slots of the equipment, similar to plugging and unplugging a circuit board. The probes on the test rack automatically rise and fall, precisely contacting the DC-DC converter. The input and output pins of the DC-DC converter are wired in this way, eliminating the need for manual wiring, avoiding wiring errors, and reducing contact resistance. The internal heating element activates, raising the temperature of the test area to the set aging temperature. A temperature sensor monitors this in real time, and the temperature control system controls the heater to stabilize the temperature within the set range. If the temperature is too high, a fan intervenes to cool it down. In the DC-DC converter aging test environment, because the metal surface of the probes is gold-plated, and this gold plating contains pores, it reacts chemically with oxygen, moisture, and residual flux on the converter pins in the air to form an oxide film. Under the mechanical stress of repeated probe insertion and removal, these oxides peel off from the surface, forming debris. Since oxides are insulating, this leads to increased contact resistance. Unstable contact resistance introduces additional noise, causing the measured ripple and noise values to be inaccurate. As contact resistance increases, the internal temperature of the testing equipment also rises, potentially melting the solder on the DC-DC converter pins and damaging the device. Some equipment uses rough pads to repeatedly rub against the probes during probe idle periods to physically scrape off the oxide layer; however, this process easily damages the gold plating on the probe surface, shortening probe lifespan. With a large number of probes, multiple cleanings are time-consuming and labor-intensive. Some equipment uses adhesive putty for static cleaning. When the probe is embedded in the adhesive putty, the vertical positive pressure is primarily used to wrap the probe. For very tightly adhered oxides, the adhesive force alone is often insufficient to remove them from the probe surface. Next, after opening the test chamber 100, multiple DC-DC converters are manually placed inside. The entire DC-DC converter is inserted into the connector slot 104. By activating the automatic alignment component 2, the test probes 209 automatically rise and fall, precisely contacting the input and output pins of the DC-DC converter. The heating device inside the test chamber 100 starts working, raising the temperature of the test area to the set aging temperature. The temperature sensor monitors in real time, and the temperature control system controls the heater to stabilize the temperature within the set range. If the temperature is too high, the fan will intervene to cool it down. The test chamber 100 prepares to provide input voltage to the DC-DC converters according to the preset values. The test chamber 100 simultaneously powers on all the DC-DC converters under test.The electronic load inside the test chamber 100 begins operation, simulating an actual circuit and consuming the electrical energy output by the DC-DC converter. The load periodically jumps between light and heavy loads to simulate drastic current changes during real-world use. The test chamber 100 monitors the input current and power for abnormalities. It also collects output voltage, output current, and ripple noise. If the DC-DC converter burns out at high temperatures, causing an open or short circuit, the test chamber 100 will instantly cut off the power supply to that channel to prevent fire or damage to the test equipment. After the DC-DC converter pins fall onto the top of the parallel placement platform 301, the servo motor 203 is activated, driving the lead screw 202, which is connected to its output shaft, to rotate. Due to the outer surface of the lifting block 204 and the alignment frame... The inner wall of the alignment bracket 201 is tightly fitted, and the lead screw 202 rotates in place inside the alignment bracket 201. During this process, the lifting block 204 moves up and down at one end of the lead screw 202. When the lead screw 202 rotates in the forward direction, the lifting block 204 moves downward. Under the connection between the L-shaped plate 205 and the insertion rod 206, it drives multiple bosses 207 to move downward, which in turn drives multiple test probes 209 to move downward. During their movement, they gradually approach the pins of the DC-DC converter. After the two come into contact with each other, the spring is compressed, generating contact pressure. Then, the electrical signal is transmitted to the data acquisition and control system through the first wire 210 and the second wire 211. The test box 100 supplies power to the converter and applies a load, while continuing to monitor its output voltage and current. By analyzing changes in parameters such as voltage drop, ripple increase, or slowed response, it is determined whether the internal components have aged or failed. After the DC-DC converter aging test is completed, the servo motor 203 is started, driving the lead screw 202 to rotate in the reverse direction, which in turn causes the lifting block 204 to move upward at one end of the lead screw 202. With the connection of the L-shaped plate 205 and the penetration rod 206, multiple test probes 209 are moved upward. Through the upward movement of the test probes 209, they gradually move away from the pins of the DC-DC converter. Then, the wave softening cleaning component 3 is started to clean the oxides left on the surface of the test probes 209 after testing. When it is necessary to clean the oxides on the surface of the test probes 209, the staff... The micro motor 308 is started, driving the gear 309, which is connected to its output shaft, to rotate. This, in turn, moves the straight rack 306, which meshes with the gear 309. When the gear 309 rotates clockwise, the straight rack 306 moves towards the side closer to the insertion back plate 105. With the connection of the through bar 313, multiple support plates 305 move synchronously, and multiple displacement blocks 304 move at one end of the corresponding embedding rod 303. As the support plates 305 move, the U-shaped boxes 310 move synchronously, moving the multiple U-shaped boxes 310 directly below the test probe 209. Then, the operator starts the servo motor 203. When the lead screw 202 rotates clockwise, the lifting block 204 moves downward. With the connection of the L-shaped plate 205 and the insertion rod 206...The downward movement of multiple protrusions 207 causes multiple test probes 209 to move downwards. During this movement, the test probes 209 gradually insert into the anti-displacement cover 312, then into the cleaning putty 311, and finally through the through hole. The anti-displacement cover 312 serves as a guide and limiter, ensuring that the test probes 209 accurately enter the cleaning putty 311 when they are inserted and preventing the putty from being pulled out when the test probes 209 are withdrawn. The through hole is provided. The main function is to bring the test probe 209 into the interior of the stepped cleaning component 4 for further cleaning. The cleaning putty 311 uses adhesion to peel off the oxides and stains on the surface of the test probe 209. After cleaning, the servo motor 203 lifts the test probe 209, causing it to detach from the cleaning putty 311. The micro motor 308 rotates in the opposite direction, pulling the U-shaped box 310 horizontally back to its initial standby position via the transmission mechanism. The equipment returns to its original state, ready for the next test and cleaning. By setting the undulating softening cleaning component 3, the cleaning inside the U-shaped box 310 is activated. The lateral displacement of the putty 311 continues to drive the vertical movement of multiple test probes 209, causing them to fall into the cleaning putty 311 for softening and cleaning. The miniature ultrasonic transducer 403 serves as the power source, responsible for generating high-frequency vibrations. When the miniature ultrasonic transducer 403 is activated, the cleaning putty 311 in the auxiliary shell 402 and the cleaning putty 311 in the U-shaped box 310 both vibrate at high frequencies. The cleaning fluid 407 is a liquid medium responsible for transmitting vibrations and generating cavitation effects. The upper large-pore membrane 404, the middle medium-pore membrane 405, and the lower small-pore membrane... The stepped pore membrane 406 is responsible for physically scraping away oxides and isolating them. The test probe 209 first passes through the upper large-pore membrane 404, the middle medium-pore membrane 405, and the lower small-pore membrane 406, entering the ultrasonic cleaning solution 407 for deep cleaning. Upon lifting, any residue is scraped away by the upper large-pore membrane 404, the middle medium-pore membrane 405, and the lower small-pore membrane 406. The entire process is accompanied by high-frequency vibration, achieving physical peeling. Before the operation begins, the auxiliary shell 402 is filled with cleaning putty 311. Simultaneously, the processing box 401... The auxiliary housing 402 contains an appropriate amount of cleaning fluid 407. When the test probe 209 is inserted into the auxiliary housing 402 through the through-hole, the miniature ultrasonic transducer 403 is activated, generating high-frequency vibrations. These vibrations are transmitted to the cleaning fluid 407 inside the processing box 401 through the bottom. The test probe 209 continues to move downwards, first inserting into the upper large-pore membrane 404, then into the middle medium-pore membrane 405, and finally into the lower small-pore membrane 406. The upper large-pore membrane 404 initially scrapes away large, loose dirt. The test probe 209 continues downwards, passing through the middle medium-pore membrane 405 and the lower small-pore membrane 406, and finally immerses itself in the cleaning fluid 407 inside the processing box 401.The high-frequency vibration generated by the miniature ultrasonic transducer 403 induces cavitation in the cleaning fluid 407, creating vacuum bubbles that burst instantly and release impact force. This impact force shatters and peels off stubborn oxides and carbides adhering to the surface and crevices of the test probe 209. After cleaning, the test probe 209 is lifted upwards by the movement of the lifting block 204, first passing through the tightest lower small-aperture membrane 406. This membrane acts like a scraper, removing most of the residual liquid and loosened but still attached dirt from the surface of the test probe 209. The test probe 209 continues to ascend, passing through... The middle section is further cleaned by passing through the intermediate medium-pore membrane 405, and finally through the upper large-pore membrane 404 to wipe the base of the test probe 209. This ensures that the test probe 209 is relatively dry and clean when it leaves the stepped cleaning assembly 4. After multiple cleaning cycles, the cleaning putty 311 inside the auxiliary shell 402 will become saturated. At this point, maintenance personnel can grasp the pull plate 408 to pull the entire auxiliary shell 402 out of the processing box 401, replace it with new cleaning putty 311, and pass it through the upper large-pore membrane 404, the middle medium-pore membrane 405, and the lower small-pore membrane 406. The stepped design enables progressive scraping, ensuring effective cleaning while avoiding excessive resistance or damage to the test probe 209 caused by excessively small pore size in a single-layer membrane. The activation of the miniature ultrasonic transducer 403 primarily removes stubborn oxides, while the cleaning putty 311 above absorbs the dislodged dirt and residual liquid, achieving a deep cleaning process of vibration followed by suction.
[0034] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. An automatic aging test device for a DC-DC converter with a heat dissipation structure, characterized in that, include: The test chamber (100) has a plug-in backplate (105) inside for plugging in the DC-DC converter to perform automatic aging tests. An automatic alignment component (2) is installed inside the test chamber (100). The automatic alignment component (2) includes a lifting block (204) and multiple test probes (209). The lifting block (204) moves up and down at one end of the lead screw (202) installed in the automatic alignment component (2). The lifting block (204) is used to drive multiple test probes (209) to perform synchronous operation. Each test probe (209) corresponds to a different pin installed on the DC-DC converter. A wave softening cleaning component (3) is disposed inside the test chamber (100). The wave softening cleaning component (3) includes a straight rack (306), a gear (309) and a plurality of cleaning putty (311). The meshing of the straight rack (306) and the gear (309) is used to drive the plurality of cleaning putty (311) to move synchronously to the underside of the plurality of test probes (209) for cleaning oxides. A stepped cleaning component (4) is disposed inside the wave softening cleaning component (3). The stepped cleaning component (4) includes multiple micro ultrasonic transducers (403), multiple upper large-pore membranes (404), multiple middle medium-pore membranes (405), and multiple lower small-pore membranes (406). The pore sizes of the upper large-pore membranes (404), the middle medium-pore membranes (405), and the lower small-pore membranes (406) decrease sequentially from top to bottom, and the three are respectively opened on the surface of the cleaning putty (311). The tip of the test probe (209) is inserted into the upper large-pore membrane (404), the middle medium-pore membrane (405), and the lower small-pore membrane (406) in sequence. Through the frictional contact between the stepped pore membrane and the test probe (209), the oxide softened on the surface of the test probe (209) is scraped off.
2. The automatic aging test equipment for DC-DC converters with a heat dissipation structure according to claim 1, characterized in that: The automatic alignment assembly (2) also includes an alignment frame (201), a servo motor (203), an L-shaped plate (205), a penetration rod (206), and multiple bosses (207). The alignment frame (201) is located on one side of the plug-in back plate (105). The servo motor (203) is located on the top of the alignment frame (201). The output shaft of the servo motor (203) is connected to one end of the lead screw (202) for driving the lifting block (204) to move up and down. The L-shaped plate (205) is located on one side of the lifting block (204). Multiple bosses (207) are respectively inserted into multiple test probes (209). The penetration rod (206) is respectively connected to multiple bosses (207).
3. The automatic aging test equipment for DC-DC converters with a heat dissipation structure according to claim 2, characterized in that: The automatic alignment component (2) also includes multiple detection shells (208), multiple first wires (210), and a second wire (211). The multiple detection shells (208) are respectively disposed on the top of multiple bosses (207). The multiple first wires (210) are respectively inserted and connected to one side of the multiple detection shells (208). The multiple first wires (210) are connected to each other. The second wire (211) is connected to one of the first wires (210).
4. The automatic aging test equipment for DC-DC converters with heat dissipation structure according to claim 1, characterized in that: The wave softening cleaning component (3) further includes multiple parallel placement platforms (301), multiple vertical plates (302), multiple embedded rods (303), multiple displacement blocks (304), and multiple support plates (305). The multiple parallel placement platforms (301) are respectively disposed on one side of the plug-in back plate (105), the multiple vertical plates (302) are respectively disposed on one side of the multiple parallel placement platforms (301), the multiple embedded rods (303) are respectively disposed inside the multiple vertical plates (302), and the multiple displacement blocks (304) are respectively movably sleeved on one end of the multiple embedded rods (303).
5. The automatic aging test equipment for a DC-DC converter with a heat dissipation structure according to claim 4, characterized in that: One of the support plates (305) is disposed on top of one of the displacement blocks (304), and the straight rack (306) is connected to one side of one of the support plates (305).
6. The automatic aging test equipment for a DC-DC converter with a heat dissipation structure according to claim 5, characterized in that: The wave softening cleaning assembly (3) also includes a shelf (307), a micro motor (308), multiple U-shaped boxes (310) and a through strip (313). The shelf (307) is located on one side of the plug-in back plate (105), and the micro motor (308) is located on the top of the shelf (307). The output shaft of the micro motor (308) is connected to the top of the gear (309) for transmission.
7. The automatic aging test equipment for a DC-DC converter with a heat dissipation structure according to claim 6, characterized in that: Multiple U-shaped boxes (310) are respectively disposed on one side of multiple support plates (305), and the multiple support plates (305) are connected to each other by a through strip (313). Multiple cleaning putty (311) is respectively filled inside the multiple U-shaped boxes (310), and multiple through holes are opened on the surface of the multiple U-shaped boxes (310) for multiple test probes (209) to be inserted into the interior of the stepped cleaning component (4) through the through holes for deep cleaning. The top of the multiple U-shaped boxes (310) is provided with an anti-shift cover (312).
8. The automatic aging test equipment for DC-DC converters with heat dissipation structure according to claim 1, characterized in that: The stepped cleaning assembly (4) also includes multiple processing boxes (401), multiple auxiliary shells (402), and cleaning fluid (407). The multiple processing boxes (401) are respectively disposed at the bottom of multiple U-shaped boxes (310). The multiple auxiliary shells (402) are respectively movable inside the multiple processing boxes (401). The interior of the multiple auxiliary shells (402) is filled with cleaning putty (311). The multiple micro ultrasonic transducers (403) are respectively disposed at the bottom of the multiple processing boxes (401) for driving the cleaning fluid (407) and the cleaning putty (311) filled inside to vibrate.
9. The automatic aging test equipment for a DC-DC converter with a heat dissipation structure according to claim 8, characterized in that: The stepped cleaning assembly (4) also includes multiple pull plates (408), which are respectively disposed on one side of multiple auxiliary shells (402) for the auxiliary shells (402) to be pulled out from the inside of the processing box (401) to replace the cleaning putty (311).
10. The automatic aging test equipment for a DC-DC converter with a heat dissipation structure according to claim 1, characterized in that: A sealed door (101) is provided on one side of the test chamber (100), and a control panel (102) is provided on the other side of the test chamber (100). Multiple heat dissipation slots (106) are provided on one side of the test chamber (100), and multiple storage platforms (103) are provided on one side of the plug-in back plate (105). Multiple plug-in slots (104) are provided on one side of the plug-in back plate (105).