Ultra-thin glass laser chamfering stress self-adaptive control method and system
By combining dual-source stress acquisition and dynamic data processing with stress level determination and adaptive control, a dynamic stress field model is constructed, which solves the problem of insufficient stress coordination in existing technologies. This enables high-precision, low-defect processing of ultra-thin glass laser chamfering, improving product quality and system stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TAIZHOU RUIGUANG TECHNOLOGY CO LTD
- Filing Date
- 2026-04-07
- Publication Date
- 2026-05-29
AI Technical Summary
Existing laser chamfering control systems fail to effectively coordinate the residual stress in the glass with the instantaneous processing stress at the corner, resulting in a high risk of crack propagation and shattering in the corner area. Furthermore, the control response is lagging, making it impossible to achieve integrated adaptation of static residual stress and dynamic directional stress.
By employing a dual-source stress acquisition, dynamic data processing, stress level determination, adaptive control, and closed-loop iterative optimization approach, a dynamic stress field model is constructed through global and local stress collaborative sensing and dynamic adaptive control. This model tracks glass stress changes in real time, generates appropriate processing control strategies, and achieves precise stress relief and high-precision processing.
It achieves high-precision, low-defect, and stable laser chamfering, reducing the risk of cracks and breakage, and improving the product qualification rate and the adaptability of the processing system.
Smart Images

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