Thermal management and electricity collaborative optimization method and system for high-power gallium nitride device

By establishing a correlation between the heat conduction time coefficient and the pulse width modulation period, optimizing the heat sink fin spacing and the switching time, and combining the coordinated control of the cooling medium flow rate and dead time, the time response mismatch problem between the traditional heat dissipation system and the power circuit is solved, achieving efficient thermal management and electrical synergistic optimization, and improving the system's heat dissipation efficiency and stability.

CN122113827APending Publication Date: 2026-05-29ZHONGKE (HEFEI) MICROELECTRONICS RESEARCH INSTITUTE CO LTD
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Patent Information

Application Number
CN202610171447.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-02-06
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Traditional heat dissipation system design and power circuit optimization lack coordinated consideration, resulting in a mismatch between the time response of the heat dissipation system and the power circuit under high-frequency pulse operation mode, causing waste or insufficient heat dissipation resources, and making it difficult to achieve dynamic coordinated adjustment of heat dissipation intensity and power output.

Method used

By establishing a correlation mapping relationship between the heat conduction time coefficient and the pulse width modulation period, the matching between the heat sink fin spacing and the switching transistor conduction time is optimized. Combined with the coordinated control of the cooling medium flow rate and dead time, the time-domain coordination between the heat dissipation system and the power control circuit is realized, ensuring that the rate of change of heat dissipation capacity and the rate of change of output power are within the preset coordination range.

Benefits of technology

It improves heat dissipation efficiency, avoids device overheating, and enhances the thermal stability and reliability of the system. In particular, it achieves real-time matching of heat dissipation and power consumption under power step change conditions, thus extending device life.

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Abstract

The invention provides a high-power gallium nitride device thermal management and electricity collaborative optimization method and system, and relates to the technical field of semiconductors, and the method comprises the steps: building the correlation mapping of a heat conduction time coefficient and a pulse width modulation period; determining the matching relationship between the heat dissipation fin spacing and the switch-on time of the switch tube according to the hot spot temperature gradient; and synchronously adjusting the flow rate and the dead zone time of the cooling medium, and maintaining the ratio of the heat dissipation capability change rate to the output power change rate in a preset interval. Timing sequence collaborative optimization of the heat dissipation system and the power control circuit is achieved, the heat dissipation efficiency of the system is improved, the service life of devices is prolonged, and power consumption is reduced.
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