Multilayer electronic component

Abstract

A multilayer electronic component is provided. The multilayer electronic component can include a main body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; protrusions disposed on the first surface and the second surface; and external electrodes disposed on the third surface and the fourth surface, wherein a width of the main body in the third direction is denoted by W and a width of the protrusions in the third direction is denoted by W1, W1 / W can be greater than or equal to 0.5 and less than or equal to 0.85.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0175512, filed on November 29, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various types of electronic products, such as image display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, and mobile phones, and used to charge or discharge them.

[0004] MLCCs used in high-voltage environments are called high-voltage MLCCs and have a rated voltage of 100V or higher. In high-temperature accelerated evaluation and moisture-proof reliability evaluation, high-voltage MLCCs can be subjected to relatively higher voltages compared to general MLCCs because their rated voltage is significantly higher.

[0005] When a voltage is applied to an MLCC, the volume of the MLCC repeatedly expands and contracts due to the electrostriction of the dielectric layer (a unique characteristic of ferroelectric ceramic materials). Furthermore, due to insufficient bonding force, cracks may appear between the inner electrode and the dielectric layer, which may reduce the reliability of the MLCC.

[0006] Typically, volume expansion / contraction caused by electrostriction is suppressed by the fixing force of a cover portion provided on the capacitor forming section. However, in high-voltage MLCCs, the expansion / contraction rate increases due to the high applied voltage, and the fixing force of the cover portion alone may be insufficient. Therefore, there is a need to develop MLCCs that can suppress volume expansion / contraction caused by electrostriction and increase resistance to deformation caused by electrostriction. Summary of the Invention

[0007] One aspect of this disclosure is to provide a multilayer electronic component with excellent reliability.

[0008] Another aspect of this disclosure is to provide a multilayer electronic component that suppresses the occurrence of cracks.

[0009] Another aspect of this disclosure is to provide a multilayer electronic component with improved resistance to deformation caused by electrostriction.

[0010] However, the purpose of this disclosure is not limited to the foregoing, and can be more readily understood in the process of explaining specific embodiments of this disclosure.

[0011] A multilayer electronic component according to embodiments of the present disclosure may include: a body including a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer in a first direction; the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; a protrusion disposed on the first surface and the second surface; and an outer electrode disposed on the third surface and the fourth surface, wherein the width of the body in the third direction is represented by W, the width of the protrusion in the third direction is represented by W1, and W1 / W may be greater than or equal to 0.5 and less than or equal to 0.85. Attached Figure Description

[0012] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is shown schematically.

[0013] Figure 2 Schematic illustration along Figure 1 A cross-sectional view of a multilayer electronic component taken by line I-I'.

[0014] Figure 3 Schematic illustration along Figure 1 A cross-sectional view of a multilayer electronic component taken from line II-II'.

[0015] Figure 4 The diagram schematically shows the main body and protrusions of the disintegration.

[0016] Figure 5 This is a diagram showing the area of ​​the protrusion based on W1 / W.

[0017] Figure 6 This is a diagram showing the stress based on W1 / W.

[0018] Figure 7 This is a diagram showing the displacement based on W1 / W. Detailed Implementation

[0019] In the following description, embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure are provided to provide a more complete description of the disclosure to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings may be the same elements.

[0020] In the accompanying drawings, for the purpose of clarifying this disclosure, parts irrelevant to the description will be omitted, and thicknesses may be enlarged to clearly show layers and regions. The same reference numerals will be used to indicate components having the same function within the same conceptual scope. Furthermore, throughout the specification, unless explicitly stated otherwise, when an element is referred to as "comprising" or "including" another element, it means that the element may also include other elements, without excluding others.

[0021] In the accompanying drawings, the X direction may represent a first direction, a stacking direction, or a thickness direction; the Y direction may represent a second direction or a length direction; and the Z direction may represent a third direction or a width direction.

[0022] Multilayer electronic components Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is shown schematically.

[0023] Figure 2 Schematic illustration along Figure 1 A cross-sectional view of a multilayer electronic component taken by line I-I'.

[0024] Figure 3 Schematic illustration along Figure 1 A cross-sectional view of a multilayer electronic component taken from line II-II'.

[0025] Figure 4 The diagram schematically shows the main body and protrusions of the disintegration.

[0026] In the following text, reference will be made to Figures 1 to 4 A multilayer electronic assembly 100 according to embodiments of the present disclosure is described in detail. Additionally, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") is described as an example of a multilayer electronic assembly, but the present disclosure is not limited thereto, and is also applicable to various multilayer electronic assemblies using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0027] According to embodiments of this disclosure, a multilayer electronic component 100 may include: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122 alternately disposed with the dielectric layer 111 in a first direction; the body 110 having a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in the third direction; protrusions 141 and 142 respectively disposed on the first surface 1 and the second surface 2; and outer electrodes 131 and 132 respectively disposed on the third surface 3 and the fourth surface 4, wherein the width of the body 110 in the third direction is represented by W and the width of the protrusions 141 and 142 in the third direction is represented by W1, and W1 / W may be greater than or equal to 0.5 and less than or equal to 0.85.

[0028] When a voltage is applied to an MLCC, the volume of the MLCC repeatedly expands and contracts due to the electrostriction of the dielectric layer (a unique characteristic of ferroelectric ceramic materials). Furthermore, due to insufficient bonding force, cracks may appear between the inner electrode and the dielectric layer, which may reduce the reliability of the MLCC.

[0029] To suppress volume expansion / contraction within the capacitor forming section caused by electrostriction, a cover is provided on the capacitor forming section. However, relying solely on the cover to suppress volume expansion / contraction caused by electrostriction may result in insufficient fixing force. Therefore, in this disclosure, protrusions 141 and 142 may be provided on the first surface 1 and the second surface 2 of the main body 110 to suppress volume expansion / contraction caused by electrostriction and increase resistance to deformation caused by electrostriction.

[0030] In the following, each component included in the multilayer electronic assembly 100 according to embodiments of the present disclosure will be described.

[0031] The body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately in the body 110.

[0032] like Figure 1 As shown, the shape of the body 110 is not particularly limited and may have a hexahedral shape or a shape similar to a hexahedron. Since the ceramic powder included in the body 110 may shrink during the sintering process, the body 110 may not have a hexahedral shape with perfectly straight lines. However, the body 110 may have a generally hexahedral shape.

[0033] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0034] Since the edge regions of the dielectric layer 111 on which the inner electrodes 121 and 122 are not disposed are stacked in the first direction, a step difference may occur due to the thickness of the inner electrodes 121 and 122. This causes the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6, and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6, when viewed based on the first surface 1 and / or the second surface 2, to have a shape that tapers towards the center of the body 110 in the first direction. Alternatively, due to shrinkage behavior during the sintering process of the body, the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6, and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6, when viewed based on the first surface 1 and / or the second surface 2, may have a shape that tapers towards the center of the body 110 in the first direction. Optionally, in order to prevent defects such as peeling, each corner of the surface of the connecting body 110 can be rounded by performing an additional process, wherein the corners connecting the first surface 1 with the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 and / or the corners connecting the second surface 2 with the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 can have a rounded shape.

[0035] Furthermore, in order to suppress the step difference caused by the inner electrodes 121 and 122, after stacking ceramic green sheets on which conductive paste for the inner electrodes is printed, the stack is cut so that the inner electrodes are exposed to the two side surfaces of the capacitor forming portion Ac that are opposite to each other in the third direction. Then, when a single dielectric layer or two or more dielectric layers are stacked on the two surfaces of the capacitor forming portion Ac in the third direction (width direction) to form the edge portions 114 and 115, the portion connecting the first surface 1 with the fifth surface 5 and the sixth surface 6 and the portion connecting the second surface 2 with the fifth surface 5 and the sixth surface 6 may not have a contracted shape.

[0036] The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, making it difficult to distinguish their boundaries without a scanning electron microscope (SEM). There is no particular limitation on the number of dielectric layers, and it can be determined taking into account the size of the multilayer electronic assembly. For example, the body can be formed by stacking more than 400 dielectric layers.

[0037] The dielectric layer 111 can be formed by the following method: preparing a ceramic slurry including ceramic powder, an organic solvent, and a binder, coating the ceramic slurry on a carrier film and drying it to prepare a green ceramic sheet, and then sintering the green ceramic sheet. There is no particular limitation on the ceramic powder as long as sufficient electrostatic capacitance can be obtained by using it. For example, a barium titanate (BaTiO3)-based ceramic powder can be used as the ceramic powder. For a more specific example, the barium titanate (BaTiO3)-based ceramic powder can be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0038] There is no particular limitation on the average thickness td of the dielectric layer 111. For example, in the case of a high-voltage MLCC, the average thickness td of the dielectric layer 111 can be 3 μm to 20 μm. However, it is not limited thereto, and the average thickness td of the dielectric layer 111 can be arbitrarily set according to desired characteristics or purposes.

[0039] In this case, the average thickness td of the dielectric layer 111 refers to the dimension in the first direction of the dielectric layer 111 disposed between adjacent inner electrodes 121 and 122. The average thickness td of the dielectric layer 111 can be measured by an image obtained by scanning a cross-section of the main body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average thickness td of the dielectric layer 111 can be measured by the following method: measuring the thicknesses at multiple points (for example, at 30 equally spaced points) in the second direction of one dielectric layer 111, and then taking the average value. The 30 equally spaced points can be specified in the capacitance forming portion Ac to be described later. In addition, when the average value measurement is extended to 10 dielectric layers 111, the average thickness td of the dielectric layer 111 can be more generalized.

[0040] The main body 110 can include: a capacitance forming portion Ac in which the dielectric layer 111 and the inner electrodes 121 and 122 are alternately disposed in the first direction; and covering portions 112 and 113 respectively disposed on the upper and lower portions in the first direction of the capacitance forming portion Ac.

[0041] The capacitor forming part Ac can be disposed inside the main body 110, and a capacitor can be formed by including a first inner electrode 121 and a second inner electrode 122 that are arranged opposite to each other and a dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122.

[0042] In addition, the capacitor forming part Ac is the part that contributes to the capacitor forming, and it can be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 with a dielectric layer 111 between them.

[0043] Cover portions 112 and 113 may include: an upper cover portion 112 disposed on the upper part of the capacitor forming portion Ac in the first direction; and a lower cover portion 113 disposed on the lower part of the capacitor forming portion Ac in the first direction.

[0044] The upper cover portion 112 and the lower cover portion 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming portion Ac in the thickness direction, respectively, and the upper cover portion 112 and the lower cover portion 113 can be mainly used to prevent damage to the internal electrode due to physical stress and / or chemical stress.

[0045] The upper cover 112 and the lower cover 113 do not include internal electrodes and may include the same material as the dielectric layer 111.

[0046] In other words, the upper cover 112 and the lower cover 113 may include ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0047] Furthermore, there are no particular limitations on the thickness of the covers 112 and 113. However, in order to more effectively suppress electrostriction, the thickness tc of the covers 112 and 113 can be from 200 μm to 350 μm.

[0048] The average thickness tc of the covers 112 and 113 can represent the average dimension of each of the covers 112 and 113 in the first direction, and can be the average of the dimensions of the covers 112 and 113 in the first direction measured at 5 equally spaced points in the second direction on the upper and lower surfaces of the capacitor forming part Ac in the first direction.

[0049] Additionally, edge portions 114 and 115 may be provided on the third-direction side surface of the capacitor forming portion Ac. Edge portions 114 and 115 may include a first edge portion 114 provided on one third-direction side surface of the capacitor forming portion Ac and a second edge portion 115 provided on the other third-direction side surface of the capacitor forming portion Ac. That is, edge portions 114 and 115 may be provided on two side surfaces of the capacitor forming portion Ac respectively in the width direction.

[0050] like Figure 3 As shown, the edges 114 and 115 may refer to the region between the two ends of the first inner electrode 121 and the second inner electrode 122 in the third direction and the outer surface of the body 110 in the third direction in the cross section of the body 110 in the width-thickness direction.

[0051] Edges 114 and 115 are primarily used to prevent damage to the internal electrodes due to physical and / or chemical stress.

[0052] Edges 114 and 115 can be formed by applying conductive paste to the ceramic green sheet to form internal electrodes 121 and 122, except for the portion where edges 114 and 115 will be formed.

[0053] In addition, in order to suppress the step difference caused by the inner electrodes 121 and 122, after stacking the ceramic green sheet on which conductive paste for the inner electrodes is printed, the stack can be cut so that the inner electrodes are exposed to the two side surfaces of the capacitor forming part Ac that are opposite to each other in the third direction. Then, a single dielectric layer or two or more dielectric layers can be stacked on the two side surfaces of the capacitor forming part Ac in the third direction (width direction) to form the edge parts 114 and 115.

[0054] Furthermore, there are no particular limitations on the width of the edges 114 and 115. However, in order to more easily achieve miniaturization and high capacitance of multilayer electronic components, the average width of the edges 114 and 115 can be from 180 μm to 350 μm.

[0055] The average width of the edges 114 and 115 can refer to the average size MW1 of the region of the inner electrode spaced apart from the fifth surface in the third direction and the average size MW2 of the region of the inner electrode spaced apart from the sixth surface in the third direction, and can be the average value of the dimensions of the edges 114 and 115 in the third direction measured at 5 equally spaced points in the first direction on the side surface of the capacitor forming part Ac in the third direction.

[0056] Therefore, in the embodiments, the average dimensions MW1 and MW2 of the regions of the inner electrodes 121 and 122 that are spaced apart from the fifth surface 5 and the sixth surface 6 in the third direction can be from 180 μm to 600 μm, respectively.

[0057] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged opposite each other and a dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0058] The first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. The first outer electrode 131 may be disposed on the third surface 3 of the body 110 and connected to the first inner electrode 121, and the second outer electrode 132 may be disposed on the fourth surface 4 of the body 110 and connected to the second inner electrode 122.

[0059] That is, the first inner electrode 121 is connected to the first outer electrode 131 but not to the second outer electrode 132, and the second inner electrode 122 is connected to the second outer electrode 132 but not to the first outer electrode 131. Therefore, the first inner electrode 121 can be formed at a certain distance from the fourth surface 4, and the second inner electrode 122 can be formed at a certain distance from the third surface 3. In addition, each of the first inner electrode 121 and the second inner electrode 122 can be disposed spaced apart from the fifth surface 5 and the sixth surface 6 of the body 110.

[0060] The conductive metal included in the inner electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti and alloys thereof, but this disclosure is not limited thereto.

[0061] There are no particular limitations on the method for forming the internal electrodes 121 and 122. For example, the internal electrodes 121 and 122 can be formed by coating a conductive paste for internal electrodes, comprising a conductive metal, onto a ceramic green sheet and then sintering it. The method for coating the conductive paste for the internal electrodes can be screen printing or gravure printing, but this disclosure is not limited thereto.

[0062] As another example, the internal electrodes 121 and 122 can be formed using sputtering, vapor deposition, and / or chemical vapor deposition.

[0063] The average thickness te of the inner electrodes 121 and 122 is not particularly limited. In this case, the thickness of the inner electrodes 121 and 122 can represent the dimensions of the inner electrodes 121 and 122 in the first direction. For example, the average thickness te of the inner electrodes 121 and 122 can be from 0.8 μm to 1.2 μm.

[0064] In this case, the average thickness te of the inner electrodes 121 and 122 can be measured by scanning the cross-section of the body 110 in the first and second directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness te of the inner electrodes 121 and 122 can be measured by measuring the thickness of one inner electrode 121 or 122 at multiple points in the second direction (e.g., at 30 equally spaced points) and then averaging the results. The 30 equally spaced points can be specified in the capacitor forming section Ac. Furthermore, the average thickness te of the inner electrodes 121 and 122 can be further generalized when the average measurement is extended to 10 inner electrodes 121 and 122.

[0065] Protrusions 141 and 142 may be provided on the first surface 1 and the second surface 2 of the main body 110.

[0066] When a voltage is applied to an MLCC, the volume of the MLCC repeatedly expands and contracts due to the electrostriction of the dielectric layer (a unique characteristic of ferroelectric ceramic materials). This expansion and contraction can also occur in the dielectric layer located in the region where the inner electrodes are stacked (e.g., the capacitor-forming portion Ac). In this case, the outer electrodes provided on the third surface 3 and the fourth surface 4 of the body 110 act as clamps to fix the two ends of the body 110 in the longitudinal direction, and the electrostrictive stress can be concentrated on the first surface 1 and the second surface 2 of the body 110, which are opposite to each other in the stacking direction (first direction, Z direction) of the inner electrodes 121 and 122 and the dielectric layer 111. According to the general structure of an MLCC, when only the covering portion is provided on the upper and lower parts of the capacitor-forming portion Ac in the first direction, the resistance to suppressing deformation caused by electrostriction is small, allowing the first surface 1 and the second surface 2 of the body 110 to have a free expansion structure.

[0067] According to embodiments of this disclosure, since protrusions 141 and 142 can be disposed on the first surface 1 and the second surface 2 of the body 110, resistance can be generated in the direction opposite to the direction of electrostrictive deformation, thereby suppressing deformation caused by electrostriction. Therefore, cracks can be prevented between the inner electrode and the dielectric layer, withstand voltage can be improved, and the failure rate can be improved.

[0068] In addition, protrusions 141 and 142 can increase the moisture penetration path and improve moisture-proof reliability.

[0069] According to embodiments of this disclosure, when the width of the body 110 in the third direction is represented by W and the width of the protrusions 141 and 142 in the third direction is represented by W1, W1 / W can be greater than or equal to 0.5 and less than or equal to 0.85. Therefore, electrostrictive stress can be effectively suppressed to prevent cracks from forming between the inner electrode and the dielectric layer, and the withstand voltage can be improved.

[0070] When W1 / W is less than 0.5, the effect of suppressing electrostrictive stress by the protrusion may be insufficient.

[0071] When W1 / W exceeds 0.85, there is a problem that the electrostrictive stress suppression effect may decrease sharply or the sheet size may increase. Therefore, it is desirable for W1 / W to be less than or equal to 0.85, and to further improve the electrostrictive stress suppression effect, W1 / W may be less than or equal to 0.75. In embodiments, W1 / W may be greater than or equal to 0.5 and less than or equal to 0.75. W1 and W can be measured by scanning electron microscopy (SEM). Other methods and / or other tools understood by those skilled in the art may be used even if not described in this disclosure.

[0072] In an embodiment, when the length of the body 110 in the second direction is represented by L and the length of the protrusions 141 and 142 in the second direction is represented by L1, L1 / L can be greater than or equal to 0.5 and less than or equal to 0.8.

[0073] When L1 / L is less than 0.5, the electrostrictive stress suppression effect achieved by the protrusion may be insufficient, and when L1 / L exceeds 0.8, there may be problems such as the strip of the outer electrode becoming shorter or the sheet size increasing.

[0074] The length L of the body 110 can be the distance from the extension line E3 of the third surface to the extension line E4 of the fourth surface in the second direction. The thickness T of the body 110 can be the distance from the extension line E1 of the first surface to the extension line E2 of the second surface in the first direction. The width W of the body 110 can be the distance from the extension line E5 of the fifth surface to the extension line E6 of the sixth surface in the third direction.

[0075] In the following text, the protrusion 141 provided on the second surface 2 will be mainly described. However, since the protrusion 142 provided on the first surface 1 and the protrusion 141 provided on the second surface 2 are symmetrical with respect to the cross sections taken along the Y and Z directions at the center of the body 110 in the X direction, the description of the protrusion 141 provided on the second surface 2 can also be applied to the protrusion 142 provided on the first surface 1.

[0076] In an embodiment, when the average thickness in the first direction of the protrusions 141 provided on the second surface 2 of the main body 110 is represented by T1, T1 may be greater than or equal to 10 μm. When T1 is less than 10 μm, the electrostrictive stress suppression effect achieved by the protrusions may be insufficient.

[0077] The average thickness T1 of the protrusions 141 in the first direction may be: the average value of the thicknesses of the protrusions 141 in the first direction measured at 10 random points in the second direction in a cross-section of the multilayer electronic component 100 in the first and second directions.

[0078] In another embodiment, the protrusions 141 and 142 and the dielectric layer 111 may include the same main component. Since the protrusions 141 and 142 and the dielectric layer 111 include the same main component, the bonding strength between the main body 110 and the protrusions 141 and 142 can be improved, and the protrusions 141 and 142 and the dielectric layer 111 can be manufactured by co-sintering.

[0079] The main component included in the protrusions 141 and 142 and the dielectric layer 111 may be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1). In this case, the main component may represent the total weight based on all components, and the content of the main component is greater than or equal to 90 wt%.

[0080] However, it is not limited thereto, and the protrusions 141 and 142 may be formed of a material having electrical insulation properties.

[0081] The method of forming the protrusions 141 and 142 is not particularly limited. Referring to Figure 4 Figure 4 schematically shows the main body and the protrusions in a disassembled state. A plurality of dielectric sheets satisfying the width and length of the protrusions may be stacked on the covering portions 112 and 113 to form the protrusions 141 and 142.

[0082] External electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4. External electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and may include a first external electrode 131 and a second external electrode 132 respectively connected to the first internal electrode 121 and the second internal electrode 122. Furthermore, the first external electrode 131 and the second external electrode 132 may be configured to extend into a portion of the first surface 1 and a portion of the second surface 2.

[0083] Additionally, the outer electrodes 131 and 132 may be configured to cover two surfaces of each of the edge portions 114 and 115 in the second direction.

[0084] Furthermore, in the embodiments, a structure is described in which the multilayer electronic component 100 has two external electrodes 131 and 132, but the number or shape of the external electrodes 131 and 132 may be changed depending on the shape of the internal electrodes 121 and 122 or for other purposes.

[0085] Reference Figure 2 External electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132. The first external electrode 131 may include a first connecting portion P1a and a first strip portion P1b. The first connecting portion P1a is disposed on the third surface 3, and the first strip portion P1b extends from the first connecting portion P1a to a portion of the first surface 1 and a portion of the second surface 2. The second external electrode 132 may include a second connecting portion P2a and a second strip portion P2b. The second connecting portion P2a is disposed on the fourth surface 4, and the second strip portion P2b extends from the second connecting portion P2a to a portion of the first surface 1 and a portion of the second surface 2. The ends of external electrodes 131 and 132 do not overlap with protrusions 141 and 142 in a first direction. The end of the first strip portion P1b does not overlap with protrusions 141 and 142 in a first direction.

[0086] In an embodiment, when the maximum thickness of the first strip P1b provided on the second surface 2 in the first direction is represented by Tb1, the maximum thickness of the second strip P2b provided on the second surface 2 in the first direction is represented by Tb2, and the average thickness of the protrusion 141 provided on the second surface 2 in the first direction is represented by T1, T1≤Tb1 and T1≤Tb2 can be satisfied.

[0087] When T1 is larger than Tb1 and / or Tb2, there may be a problem of increased wafer size.

[0088] Tb1 can be the distance in the first direction from the extension line E2 of the second surface 2 to the highest point of the first strip P1b in the first direction, and Tb2 can be the distance in the first direction from the extension line E2 of the second surface 2 to the highest point of the second strip P2b in the first direction. T1, Tb1, and Tb2 can be measured by scanning electron microscopy (SEM). Other methods and / or other tools understood by those skilled in the art may be used even if not described in this disclosure.

[0089] In the embodiment, when the length of the first strip P1b on the second surface 2 in the second direction is represented by BL1, the length of the second strip P2b on the second surface 2 in the second direction is represented by BL2, the length of the protrusion 141 on the second surface 2 in the second direction is represented by L1, and the length of the main body 110 in the second direction is represented by L, L = L1 + BL1 + BL2 can be satisfied. That is, the end of the first strip P1b of the first external electrode 131 can contact one end of the protrusion 141 in the second direction, and the end of the second strip P2b of the second external electrode 132 can contact the other end of the protrusion 141 in the second direction.

[0090] BL1 can be the distance in a second direction from the extension line E3 of the third surface 3 to the end of the first strip P1b disposed on the second surface 2, and BL2 can be the distance in a second direction from the extension line E4 of the fourth surface 4 to the end of the second strip P2b disposed on the second surface 2. L, L1, BL1 and BL2 can be measured by scanning electron microscopy (SEM). Other methods and / or other tools understood by those skilled in the art may be used even if not described in this disclosure.

[0091] In an embodiment, the external electrodes 131 and 132 may include electrode layers 131a and 132a configured to contact the body 110 and plating layers 131b and 132b disposed on the electrode layers 131a and 132a, and the electrode layers 131a and 132a may be configured to directly contact the two surfaces of the protrusions 141 and 142 in a second direction.

[0092] In an embodiment, electrode layers 131a and 132a may be configured to cover a portion of protrusions 141 and 142. That is, electrode layers 131a and 132a may cover a portion of the upper surface of protrusion 141 disposed on the second surface 2 in the first direction and a portion of the lower surface of protrusion 142 disposed on the first surface 1 in the first direction. In this case, electrode layers 131a and 132a may be configured to directly contact the surfaces of protrusions 141 and 142 in the first direction and the surfaces of protrusions 141 and 142 in the second direction.

[0093] In another embodiment, when the width of the body 110 in the third direction is represented by W, the distance from the extension line E5 of the fifth surface of the body 110 to the protrusions 141 and 142 in the third direction is represented by Ws1, and the distance from the extension line E6 of the sixth surface of the body 110 to the protrusions 141 and 142 in the third direction is represented by Ws2, it can be satisfied that Ws1 ≥ 0.075W and Ws2 ≥ 0.075W. Additionally, as... Figure 3 As shown, when the width of the protrusions 141 and 142 in the third direction is represented by W1, W, W1, Ws1 and Ws2 can satisfy W=W1+Ws1+Ws2.

[0094] When Ws1 < 0.075W and / or Ws2 < 0.075W, there is a problem that the electrostrictive stress suppression effect may decrease sharply or the sheet size may increase.

[0095] More preferably, to further enhance the electrostrictive stress suppression effect, W, Ws1, and Ws2 can satisfy Ws1 ≥ 0.125W and Ws2 ≥ 0.125W. W, W1, Ws1, and Ws2 can be measured by scanning electron microscopy (SEM). Other methods and / or other tools understood by those skilled in the art may be used even if not described in this disclosure.

[0096] Furthermore, the external electrodes 131 and 132 can be formed of any material (such as metal) as long as the material is conductive, and the specific material can be determined by taking into account electrical properties, structural stability, etc., and the external electrodes 131 and 132 can also have a multilayer structure.

[0097] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0098] For a more specific example of electrode layers 131a and 132a, electrode layers 131a and 132a may be sintered electrodes comprising a conductive metal and glass, and / or resin-based electrodes comprising a conductive metal and resin. Materials with excellent conductivity may be used as the conductive metals included in electrode layers 131a and 132a, but are not particularly limited thereto. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0099] In the embodiments, the outer electrodes 131 and 132 may contact the inner electrodes 121 and 122, and may include electrode layers 131a and 132a comprising Cu and glass, and plating layers 131b and 132b disposed on the electrode layers 131a and 132a.

[0100] Additionally, electrode layers 131a and 132a may have a form in which sintered electrodes and resin-based electrodes are sequentially formed on the body 110. In embodiments, electrode layers 131a and 132a may contact inner electrodes 121 and 122, and may include a base electrode layer comprising Cu and glass, and a conductive resin layer disposed on the base electrode layer and comprising a conductive metal and resin.

[0101] Alternatively, electrode layers 131a and 132a can be formed by transferring a sheet including a conductive metal onto the body, or by transferring a sheet including a conductive metal onto a sintered electrode.

[0102] Platings 131b and 132b can be used to improve mounting characteristics. There are no particular restrictions on the type of platings 131b and 132b. Platings 131b and 132b can be one or more of Ni, Sn, Pd and their alloys, and can be formed in multiple layers.

[0103] For a more specific example of plating layers 131b and 132b, plating layers 131b and 132b may be Ni plating layers or Sn plating layers, or may be in the form where Ni plating layers and Sn plating layers are sequentially formed on electrode layers 131a and 132a, or may be in the form where Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed on electrode layers 131a and 132a. Additionally, plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers. Furthermore, the ends of plating layers 131b and 132b do not overlap with protrusions 141 and 142 in the first direction.

[0104] The size of the multilayer electronic component 100 does not require special restrictions.

[0105] However, because the volume expansion and contraction caused by electrostriction in medium and high voltage operating environments are increased, the electrostriction stress suppression effect achieved by the protrusion according to this disclosure can be more significant in multilayer electronic components 100 with dimensions of 3216 (length × width, 3.2 mm × 1.6 mm) or larger.

[0106] Therefore, the maximum dimension of the multilayer electronic component 100 in the second direction can be greater than or equal to 3.2 mm, and the maximum dimension of the multilayer electronic component 100 in the third direction can be greater than or equal to 1.6 mm.

[0107] In an embodiment, the rated voltage of the multilayer electronic component 100 may be 100V or higher. Since electrostrictive stress becomes greater at high rated voltages of 100V or higher, the electrostrictive stress suppression effect achieved by the protrusions according to this disclosure can be more effective.

[0108] [Example] To verify the effect of electrostrictive stress suppression based on the width of the protrusion, sample pieces with protrusions of different widths were prepared.

[0109] exist Figures 5 to 7 The diagram shows the protrusion area, stress, and displacement of each sample piece according to W1 / W (width of the protrusion / width of the body).

[0110] Reference Figure 2 and Figure 3 It can manufacture sample pieces such that the length L of the main body is 3mm, the thickness T of the main body is 4mm, the length L1 of the protrusion is 2mm, and the average thickness T1 of the protrusion is 0.1mm.

[0111] exist Figure 6 In this context, stress refers to the magnitude of the force generated by electrostriction when a voltage of 1V is applied to a sample sheet, and it can be measured based on Hooke's law.

[0112] exist Figure 7 In this context, displacement refers to the degree of deformation caused by electrostriction and can be measured based on Hooke's Law.

[0113] Reference Figure 5 It can be confirmed that, since the length L1 of the protrusion and the average thickness T1 of the protrusion are the same for each sample piece, the area of ​​the protrusion (i.e., the area of ​​the surface in the first direction) can increase linearly with the increase of W1 / W (width of the protrusion / width of the body).

[0114] Reference Figure 6 When the protrusion is not provided, the stress can be measured as 22.5 N / m. 2 However, when protrusions are provided, it can be confirmed that, except when W1 / W is 0.90, the stress can be less than or equal to 20.0 N / m. 2 Specifically, when W1 / W as described in this disclosure satisfies a value greater than or equal to 0.5 and less than or equal to 0.85, it can be confirmed that the stress is significantly reduced to 18.0 N / m compared to the case without the protrusion. 2 Or even lower. As the W1 / W ratio of the protrusion increases, the stress decreases. However, when W1 / W is greater than or equal to 0.90, the sheet size may increase, and when W1 / W approaches 0.90, there may be regions where the stress increases sharply. Therefore, it is desirable to satisfy W1 / W to be greater than or equal to 0.5 and less than or equal to 0.85. Furthermore, to reliably control the stress to less than 18.0 N / m... 2 We can expect W1 / W to be greater than or equal to 0.5 and less than or equal to 0.75.

[0115] Reference Figure 7It can be confirmed that as W1 / W (width of the protrusion / width of the main body) increases, the displacement decreases almost linearly.

[0116] As one of the many effects of this disclosure, by providing protrusions on the first and second surfaces of the body, the resistance of multilayer electronic components to deformation caused by electrostriction can be improved.

[0117] Although embodiments of the present disclosure have been described in detail above, the scope of the present disclosure is not limited by the foregoing embodiments and drawings, but is intended to be defined by the appended claims. Therefore, various substitutions, modifications, and alterations will be possible for those skilled in the art within the scope of the technical spirit of the present disclosure described in the claims, and these will also fall within the scope of the present disclosure.

[0118] Furthermore, the expression "one embodiment" as used in this disclosure does not refer to the same embodiment and is provided to emphasize and describe different unique features. However, the one embodiment presented above does not preclude implementation in combination with features of another embodiment. For example, unless there is a description that contradicts or contradicts the content of another embodiment, even if the content described in one particular embodiment is not described in another embodiment, it may be understood as a description related to the other embodiment.

[0119] The terminology used in this disclosure is for describing one embodiment only and is not intended to be limiting. In this context, the singular form includes the plural form as well, unless the context clearly indicates otherwise.

[0120] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction. The body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction. The protrusions are disposed on the first surface and the second surface; as well as External electrodes are disposed on the third surface and the fourth surface. Wherein, the width of the main body in the third direction is represented by W, the width of the protrusion in the third direction is represented by W1, and W1 / W is greater than or equal to 0.5 and less than or equal to 0.

85.

2. The multilayer electronic component according to claim 1, wherein, W1 / W is greater than or equal to 0.5 and less than or equal to 0.

75.

3. The multilayer electronic component according to claim 1, wherein, The length of the main body in the second direction is represented by L, and the length of the protrusion in the second direction is represented by L1, and L1 / L is greater than or equal to 0.5 and less than or equal to 0.

8.

4. The multilayer electronic assembly according to claim 1, wherein, The average thickness of the protrusion disposed on the second surface in the first direction is represented by T1, and T1 is greater than or equal to 10 μm.

5. The multilayer electronic component according to claim 1, wherein, The protrusion and the dielectric layer include the same main component, and the main component is one or more of BaTiO3, (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3, and Ba(Ti 1-y Zr y )O3. Among them, in (Ba 1-x Ca x )TiO3, 0 < x < 1; in Ba(Ti 1-y Ca y )O3, 0 < y < 1; in (Ba 1-x Ca x )(Ti 1-y Zr y )O3, 0 < x < 1, 0 < y < 1; and in Ba(Ti 1-y Zr y )O3, 0 < y < 1.

6. The multilayer electronic assembly according to claim 1, wherein, The external electrode includes a first external electrode and a second external electrode. The first external electrode includes a first connecting portion and a first strip portion. The first connecting portion is disposed on the third surface, and the first strip portion extends from the first connecting portion to a portion of the first surface and a portion of the second surface. The second external electrode includes a second connecting portion and a second strip portion. The second connecting portion is disposed on the fourth surface, and the second strip portion extends from the second connecting portion to a portion of the first surface and a portion of the second surface.

7. The multilayer electronic component according to claim 6, wherein, The maximum thickness of the first strip portion disposed on the second surface in the first direction is represented by Tb1, the maximum thickness of the second strip portion disposed on the second surface in the first direction is represented by Tb2, and the average thickness of the protrusion portion disposed on the second surface in the first direction is represented by T1, satisfying T1≤Tb1 and T1≤Tb2.

8. The multilayer electronic component according to claim 6, wherein, The length of the first strip portion disposed on the second surface in the second direction is represented by BL1, the length of the second strip portion disposed on the second surface in the second direction is represented by BL2, the length of the protrusion disposed on the second surface in the second direction is represented by L1, and the length of the main body in the second direction is represented by L. The expression L = L1 + BL1 + BL2 is satisfied.

9. The multilayer electronic component according to claim 1, wherein, The external electrode includes an electrode layer configured to contact the main body and a plating layer disposed on the electrode layer. The electrode layer is configured to be in direct contact with the surface of the protrusion in the first direction and the surface of the protrusion in the second direction.

10. The multilayer electronic component according to claim 9, wherein, The electrode layer is configured to cover a portion of the protrusion.

11. The multilayer electronic assembly according to claim 9, wherein, The electrode layer comprises conductive metal and glass.

12. The multilayer electronic assembly according to claim 1, wherein, The distance from the extension of the fifth surface to the protrusion in the third direction is represented by Ws1, and the distance from the extension of the sixth surface to the protrusion in the third direction is represented by Ws2. The conditions are met: Ws1≥0.075W and Ws2≥0.075W.

13. The multilayer electronic assembly according to claim 12, wherein, W, Ws1, and Ws2 satisfy Ws1 ≥ 0.125W and Ws2 ≥ 0.125W.

14. The multilayer electronic assembly according to claim 1, wherein, The subject includes: A capacitor forming portion includes the dielectric layer and the inner electrode alternately disposed in the first direction; and A cover portion is disposed on the upper and lower portions of the capacitor forming portion in the first direction.

15. The multilayer electronic assembly according to claim 1, wherein, The rated voltage of the multilayer electronic components is 100V or higher.

16. The multilayer electronic assembly according to claim 1, wherein, The end of the external electrode does not overlap with the protrusion in the first direction.

17. The multilayer electronic assembly according to claim 6, wherein, The end of the first strip does not overlap with the protrusion in the first direction.

18. The multilayer electronic assembly according to claim 1, wherein, The external electrode includes an electrode layer configured to contact the main body and a plating layer disposed on the electrode layer, and The end of the coating does not overlap with the protrusion in the first direction.

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