Circuit board heat dissipation assembly, preparation method thereof and energy storage system

Abstract

This invention relates to the field of energy storage technology, particularly to circuit board heat dissipation components and their manufacturing methods, as well as energy storage systems. The circuit board heat dissipation component includes a circuit board, a frame, thermally conductive adhesive, and functional components. The circuit board includes a substrate and electronic components, with the substrate having a heat dissipation area. The frame forms a heat dissipation cavity. The functional components and the circuit board respectively seal a first opening and a second opening of the heat dissipation cavity, with the heat dissipation area connected to the heat dissipation cavity. The thermally conductive adhesive is configured to be injected into the heat dissipation cavity through the first or second opening in a liquid state and then solidify, fixing the thermally conductive adhesive to both the heat dissipation area and the functional components. When the substrate thickness is between 1.6 mm and 2.0 mm, the frame hardness is between 38 and 70 degrees, and the frame thickness is not less than 6 mm. Through the arrangement of the frame and the thermally conductive adhesive, a heat conduction path is formed between the circuit board and the functional components, enabling efficient conduction and dissipation of heat generated by the circuit board or functional components, ensuring the operational reliability of the circuit board and functional components.

Description

Technical Field

[0001] This invention relates to the field of energy storage technology, and in particular to circuit board heat dissipation components and their preparation methods, as well as energy storage systems. Background Technology

[0002] Printed Circuit Boards (PCBs) are typically used in energy storage systems for power management and signal control. These PCBs continuously generate heat during high-frequency operation. Insufficient heat dissipation can easily lead to excessive temperature rise, performance degradation, or even thermal failure of the electronic components (such as chips, resistors, and capacitors) mounted on the PCB substrate. Energy storage systems also contain functional components, such as adapters and sensors. These components are usually located close to the PCB and also generate heat during operation. The combined heat from the PCB and functional components results in a significant increase in local heat flux density; therefore, heat dissipation between the PCB and functional components is necessary. Summary of the Invention

[0003] In view of the above problems, embodiments of the present invention provide a circuit board heat dissipation component and its preparation method, and an energy storage system, which overcome the above problems or at least partially solve the above technical problems.

[0004] According to one aspect of the present invention, a circuit board heat dissipation assembly is provided, comprising: a circuit board, a frame, thermally conductive adhesive, and a functional component; the circuit board includes a substrate and electronic components disposed on the substrate, the substrate having a heat dissipation area; the frame forms a heat dissipation cavity; the functional component and the circuit board respectively cover a first opening end and a second opening end of the heat dissipation cavity, the heat dissipation area communicating with the heat dissipation cavity; the thermally conductive adhesive is configured to be injected into the heat dissipation cavity through the first opening end or the second opening end of the heat dissipation cavity in a liquid state and then cured, the thermally conductive adhesive being fixed to the heat dissipation area and the functional component respectively; when the thickness of the substrate is between 1.6 mm and 2.0 mm, the hardness of the frame is between 38 degrees and 70 degrees, and the thickness of the frame is not less than 6 mm.

[0005] In one alternative, the area to be cooled has an overflow hole communicating with the heat dissipation cavity, and the thermally conductive adhesive is configured to be injected into the heat dissipation cavity in a liquid state through the second open end of the heat dissipation cavity and overflow from the overflow hole when the circuit board covers the second open end of the heat dissipation cavity, so that the thermally conductive adhesive at least partially fills the overflow hole.

[0006] In one alternative embodiment, a connection gap is provided between the electronic component and the substrate, and the thermally conductive adhesive is configured to be injected into the heat dissipation cavity in a liquid state through the second opening end of the heat dissipation cavity and overflow from the connection gap when the circuit board covers the second opening end of the heat dissipation cavity, so that a portion of the thermally conductive adhesive is cured on the side of the circuit board opposite to the heat dissipation cavity.

[0007] In one alternative embodiment, the substrate is provided with a connection area surrounding the area to be cooled, and the circuit board is disposed on the frame through the connection area to cover the second opening end of the heat dissipation cavity.

[0008] In one alternative approach, the electronic components are disposed in the area to be cooled.

[0009] In one alternative configuration, the working end of the electronic component is positioned away from the heat dissipation cavity.

[0010] In one alternative embodiment, the circuit board heat dissipation assembly further includes a sealant that seals the connection between the frame and the functional component.

[0011] In one alternative embodiment, the frame is made of one or more of silicone, foamed silicone, and foam.

[0012] According to another aspect of the present invention, a method for preparing a heat dissipation assembly for a circuit board is provided, applied to the heat dissipation assembly for the circuit board, the method comprising: placing the frame on the functional component so that the functional component covers the first opening end of the heat dissipation cavity; injecting liquid thermally conductive adhesive into the heat dissipation cavity from the second opening end of the heat dissipation cavity until the liquid thermally conductive adhesive is flush with the second opening end of the frame; placing the circuit board on the frame so that the area to be dissipated corresponds to the second opening end of the heat dissipation cavity, so that the circuit board covers the second opening end of the heat dissipation cavity; and waiting for the liquid thermally conductive adhesive to cure, forming the thermally conductive adhesive respectively fixed to the area to be dissipated and the functional component.

[0013] According to another aspect of the present invention, an energy storage system is provided, including an energy storage battery and the aforementioned circuit board heat dissipation assembly, wherein the energy storage battery is electrically connected to the circuit board.

[0014] The embodiments of the present invention have the following beneficial effects: (1) By setting a heat dissipation cavity formed by the frame between the circuit board and the functional components, and injecting thermally conductive adhesive to cure it, the heat dissipation area and the functional components are bonded at the same time, a continuous heat conduction path with low thermal resistance is constructed; this structure can efficiently conduct and dissipate the heat generated by the circuit board or functional components, improve the thermal management capability of the system, and ensure the reliability of electronic devices under high load conditions. (2) After the thermally conductive adhesive is injected into the heat dissipation cavity in liquid form, it flows and fills naturally, and the heat dissipation cavity can be fully filled without applying external pressure; the cured thermally conductive adhesive has both bonding and buffering functions, effectively disperses the elastic deformation stress generated by the frame due to compression, and greatly reduces its rebound force on the circuit board; it avoids the local stress concentration caused by the traditional mechanical pressing method, reduces the risk of circuit board warping or deformation, and improves the overall structural stability. (3) The thermally conductive adhesive itself has a certain sealing performance. When used in combination with sealant, it enhances the protection capability of the component against external moisture, dust and other environmental factors, and is suitable for energy storage and power electronics application scenarios with high reliability requirements. Attached Figure Description

[0015] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0016] Figure 1 This is a schematic diagram of one implementation of a heat dissipation component for a circuit board in the prior art.

[0017] Figure 2 This is a schematic diagram of another implementation of heat dissipation components for circuit boards in the prior art.

[0018] Figure 3 This is a schematic diagram of a circuit board heat dissipation assembly provided in an embodiment of the present invention.

[0019] Figure 4 This is an exploded view of the circuit board heat dissipation assembly provided in an embodiment of the present invention, without showing the thermally conductive adhesive.

[0020] Figure 5 The embodiment of the present invention provides the following: Figure 3 Sectional view of AA.

[0021] Figure 6 This is a schematic diagram of the circuit board provided in an embodiment of the present invention.

[0022] Figure 7 This is a schematic diagram of the energy storage system provided in an embodiment of the present invention.

[0023] Figure 8This is a schematic flowchart of the method for preparing a heat dissipation component for a circuit board provided in an embodiment of the present invention.

[0024] Figure 9 This is a schematic diagram of assembling a frame onto a functional component according to an embodiment of the present invention.

[0025] Figure 10 This is a schematic diagram of filling the frame with liquid thermally conductive adhesive according to an embodiment of the present invention.

[0026] Figure 11 This is a schematic diagram of the circuit board corresponding to the frame provided in an embodiment of the present invention.

[0027] The labels in the attached diagram are as follows: 1p, Circuit board in the prior art; 2p, Functional component in the prior art; 3p, Thermal pad in the prior art; 11p, substrate; 12p, electronic component; 31p, extruded interference section; 100. Circuit board heat dissipation assembly; 1. Circuit board; 2. Functional components; 3. Frame; 4. Thermally conductive adhesive; 4a. Liquid thermally conductive adhesive; 5. Sealant; 11. Substrate; 12. Electronic components; g. Connection gap; 111. Area to be cooled; 112. Connection area; 1112. Glue overflow hole; 31. Heat dissipation cavity; 311. First opening end; 312. Second opening end; D1, Axial direction of heat dissipation cavity; 200. Energy storage system; 2001, Energy storage battery; 2002, Inverter; 2003, AC-DC rectifier; 2004, Filter; 2005, Buck-boost converter; K1, First relay; K2, Second relay; 2006, Display panel; 2007, AC load; 2008, DC load. Detailed Implementation

[0028] To facilitate understanding of the present invention, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only.

[0029] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0030] To facilitate the reader's understanding of the design concept of this invention, a prior art solution for heat dissipation between circuit board 1p and functional component 2p is now described. Please refer to [link / reference]. Figure 1 In existing technologies, heat dissipation is typically achieved by placing a thermal pad 3p between the circuit board 1p and the functional component 2p. While the thermal pad 3p can conduct heat and direct the heat between the circuit board 1p and the functional component 2p to external devices, the varying heights of the electronic component 12p along the stacking direction of the circuit board 1p and the functional component 2p, as well as the inconsistent gap sizes between the circuit board 1p (electronic component 12p) and the functional component 2p, necessitate matching with multiple thermal pads 3p of different thicknesses, leading to complex assembly and increased costs.

[0031] Additionally, please combine Figure 1 and Figure 2 In the prior art, in order to ensure a tight fit between the thermal pad 3p and the surfaces of the circuit board 1p and the functional component 2p, the thermal pad 3p is generally compressed during assembly (for example, by pressing the circuit board or functional component with external force to compress the thermal pad 3p). The part of the thermal pad 3p that contacts the electronic component 12p of the circuit board 1p forms a compression interference part 31p. The compressed thermal pad 3p will generate a rebound force F, which acts on the circuit board 1p. There is a high risk of deformation of the substrate 11p of the circuit board 1p, which may lead to reliability problems such as cracking of the solder joints of the circuit board 1p, displacement of the electronic component 12p, damage to the electronic component 12p, or abnormal signal transmission. In extreme cases, it may even damage the circuit board 1p, seriously affecting the long-term stability and operational safety of the energy storage system.

[0032] In the embodiments of the present invention, please refer to the following: Figure 3 , Figure 4 and Figure 5 A circuit board heat dissipation assembly 100 is provided. The circuit board heat dissipation assembly 100 includes a circuit board 1, a frame 3, thermally conductive adhesive 4, a functional component 2, and a sealant 5. The circuit board 1 and the functional component 2 respectively cover both ends of the frame 3. The thermally conductive adhesive 4 fills the frame 3, and the sealant 5 seals the space between the functional component 2 and the frame 3. Through the thermally conductive adhesive 4, a heat conduction path is formed between the circuit board 1 and the functional component 2, which can efficiently conduct and dissipate the heat generated by the circuit board 1 or the functional component 2, ensuring the operational reliability of the circuit board 1 and the functional component 2.

[0033] It is worth noting that in some embodiments, the function of heat dissipation for the circuit board 1 and functional component 2 can be achieved even without the aforementioned sealant 5.

[0034] For the circuit board 1 described above, please refer to some implementation methods. Figure 6 and combination Figure 5 The circuit board 1 includes a substrate 11 and electronic components 12 disposed on the substrate 11. The circuit board 1 has a heat dissipation area 111, which may be located on the substrate 11. The electronic components 12 are disposed in the heat dissipation area 111, which is the area that needs to be cooled. In some embodiments, the substrate 11 also has a connection area 112, which surrounds the heat dissipation area 111. The circuit board 1 is disposed on the frame 3 through the connection area 112, which facilitates the positioning of the circuit board 1 and the frame 3 during assembly.

[0035] In some embodiments, the heat dissipation area 111 has an overflow hole 1112, which is used to expel air from the frame 3 and to allow for overflow of adhesive.

[0036] In some embodiments, there is a connection gap g between the electronic component 12 and the substrate 11, which is also used for adhesive overflow.

[0037] For the aforementioned frame 3, functional component 2, and thermally conductive adhesive 4, please refer to [link / reference]. Figure 4 and Figure 5 The frame 3 has a heat dissipation cavity 31, which has a first opening end 311 and a second opening end 312. Functional components 2 (e.g., adapters, sensors, etc.) cover the first opening end 311 of the heat dissipation cavity 31, and the circuit board 1 covers the second opening end 312 of the heat dissipation cavity 31. The heat dissipation area 111 of the circuit board 1 is connected to the heat dissipation cavity 31. The working end of the electronic component 12 located in the heat dissipation area 111 can be positioned away from the heat dissipation cavity 31 for easy wiring or maintenance. When the substrate 11 of the circuit board 1 has a connection area 112, the circuit board 1 is positioned so that the edge of the second opening end 312 of the frame 3 corresponds to the connection area 112, thereby covering the second opening end 312 of the heat dissipation cavity 31. The thermally conductive adhesive 4 is configured to be injected into the heat dissipation cavity 31 through the first opening end 311 or the second opening end 312 of the heat dissipation cavity 31 in a liquid state (liquid thermally conductive adhesive) and then cured, forming a state where the thermally conductive adhesive 4 is fixed to the heat dissipation area 111 of the circuit board 1 and the functional component 2, respectively.

[0038] Understandably, during the assembly of the circuit board heat dissipation assembly 100, the first opening end 311 of the heat dissipation cavity 31 is pre-sealed by the functional component 2, or the second opening end 312 is pre-sealed by the circuit board 1. When the first opening end 311 of the heat dissipation cavity 31 is pre-sealed by the functional component 2, the second opening end 312 of the heat dissipation cavity 31 is used for injecting liquid thermally conductive adhesive into the heat dissipation cavity 31. Then, the circuit board 1 is placed on the frame 3. After the liquid thermally conductive adhesive cures, thermally conductive adhesive 4 is formed and fixed to the heat dissipation area 111 of the circuit board 1 and the functional component 2, respectively. Similarly, when the second opening end 312 of the heat dissipation cavity 31 is pre-sealed by the circuit board 1, the first opening end 311 of the heat dissipation cavity 31 is used for injecting liquid thermally conductive adhesive into the heat dissipation cavity 31. Then, the functional component 2 is placed on the frame 3. After the liquid thermally conductive adhesive cures, thermally conductive adhesive 4 is formed and fixed to the heat dissipation area 111 of the circuit board 1 and the functional component 2, respectively.

[0039] Preferably, the first opening end 311 of the heat dissipation cavity 31 is first sealed by the functional component 2, and the second opening end 312 of the heat dissipation cavity 31 is used for injecting liquid thermally conductive adhesive into the heat dissipation cavity 31. This arrangement avoids deformation of the circuit board 1 when injecting liquid thermally conductive adhesive. The following uses the example of the second opening end 312 of the heat dissipation cavity 31 being used for injecting liquid thermally conductive adhesive into the heat dissipation cavity 31 to illustrate other beneficial effects of the embodiments of the present invention.

[0040] It is worth noting that in some embodiments, the thermally conductive adhesive 4 is configured to be injected into the heat dissipation cavity 31 through the second opening end 312 of the heat dissipation cavity 31 when it is in liquid state (liquid thermally conductive adhesive), and overflow from the overflow hole 1112 when the circuit board 1 covers the second opening end 312 of the heat dissipation cavity 31. The thermally conductive adhesive 4 formed by the curing of the liquid thermally conductive adhesive forms a state in which at least partially fills the overflow hole 1112, avoiding stress concentration caused by local cavities or the impact on the heat dissipation function between the circuit board 1 and the functional component 2.

[0041] It is understandable that when assembling the circuit board heat dissipation assembly 100, after injecting liquid thermal conductive adhesive into the heat dissipation cavity 31, the circuit board 1 is placed on the frame 3. The liquid thermal conductive adhesive is caused to overflow from the overflow hole 1112 due to the gravity of the circuit board 1.

[0042] Alternatively, in some embodiments, the thermally conductive adhesive 4 is configured to be injected into the heat dissipation cavity 31 through the second opening end 312 of the heat dissipation cavity 31 in a liquid state (liquid thermally conductive adhesive) and overflow from the connection gap g between the electronic component 12 and the substrate 11 when the circuit board 1 covers the second opening end 312 of the heat dissipation cavity 31. The thermally conductive adhesive 4 formed by the curing of the liquid thermally conductive adhesive forms a state in which part of the thermally conductive adhesive 4 is cured on the side of the circuit board 1 facing away from the heat dissipation cavity 31. This not only ensures that the thermally conductive adhesive completely fills the interior of the heat dissipation cavity 31, avoiding stress concentration or the impact on the heat dissipation function between the circuit board 1 and the functional component 2 due to local cavities, but also seals the connection gap g between the electronic component 12 and the substrate 11 through the thermally conductive adhesive 4, thereby enhancing the airtightness and protection level of the overall structure of the circuit board heat dissipation assembly 100.

[0043] It is understandable that when there is a connection gap g between the electronic component 12 and the substrate 11, the circuit board 1 does not need to be provided with an overflow hole 1112.

[0044] It is understandable that when assembling the circuit board heat dissipation assembly 100, after injecting liquid thermal conductive adhesive into the heat dissipation cavity 31, the circuit board 1 is placed on the frame 3. The liquid thermal conductive adhesive is affected by the gravity of the circuit board 1, causing the liquid thermal conductive adhesive to overflow from the connection gap g between the electronic component 12 and the substrate 11.

[0045] In some embodiments, the specific shape of the frame 3 can be reasonably set according to the actual situation, for example, the frame 3 is square. The frame 3 is square, which means that the plane of the frame 3 cut by the plane perpendicular to the axial direction D1 of the heat dissipation cavity 31 is square. As for the material of the frame 3, the frame 3 is preferably made of a soft material (such as one or more of silicone, foamed silicone and foam), which can form a flexible support for the circuit board 1. Compared with a rigid frame 3, it avoids the circuit board 1 from cracking, deforming or the electronic component 12 from being poorly soldered and falling off due to stress concentration caused by rigid contact. At the same time, the frame 3 made of soft material has a certain deformation adaptability, which can better fit the assembly contour of the circuit board 1, improve assembly compatibility and sealing, and reduce assembly gaps.

[0046] The material of the thermally conductive adhesive 4 can be selected according to actual needs. For example, the thermally conductive adhesive 4 can be a silicone-based or epoxy-based composite material with high thermal conductivity, low viscosity, and good wettability. Its thermal conductivity is not less than 3.0 W / (m·K) and its curing shrinkage rate is less than 0.3%, so as to balance the integrity of the filling and the thermal conductivity.

[0047] It is worth noting that, in this embodiment of the invention, the circuit board 1 is supported by the frame 3 and the thermally conductive adhesive 4 through the setting of the frame 3 and the thermally conductive adhesive 4. The deformation of the frame 3 under the pressure of the circuit board 1 is dispersed by the thermally conductive adhesive 4. The rebound force of the frame 3 on the circuit board 1 is small, the risk of deformation of the circuit board 1 is small, the structural stability of the circuit board 1 is significantly improved, and the operational reliability of the circuit board 1 is significantly improved.

[0048] In the process of implementing this invention, the applicant discovered that the deformation of the circuit board 1 is affected by the thickness of the substrate 11, the hardness of the frame 3, and the thickness of the frame 3. In some embodiments, please refer to... Figure 5 In conjunction with Tables 1 and 2 below, the hardness of the frame 3 is limited to between 38 and 70 degrees. For example, the frame 3 is made of foam with a hardness of 38 degrees, specifically EVA (Ethylene-Vinyl Acetate) or PU (Polyurethane) foam; or, for example, the frame 3 is made of silicone, and the hardness of the silicone can be 45-55 degrees or 55-70 degrees. The thickness H of the frame 3 is limited to not less than 6 mm, for example, 6-10 mm, 10-20 mm, or ≥20 mm. The thickness M of the substrate 11 is limited to between 1.6 mm and 2.0 mm, for example, 1.6 mm, 1.8 mm, or 2 mm. The thickness H of the frame 3 refers to the thickness of the frame 3 along the axial direction D1 perpendicular to the heat dissipation cavity 31. Generally, when the circuit board 1 is placed on the frame 3, the substrate 11 is perpendicular to the axial direction D1 of the heat dissipation cavity 31. The thickness M of the substrate 11 refers to the thickness of the substrate 11 along the axial direction D1 of the heat dissipation cavity 31. Studies have shown that, through this limitation, the deformation (compression) of the frame 3 under the gravity of the circuit board 1 is effectively controlled within 15%, and correspondingly, the compression dimension L is effectively controlled within 3mm. This ensures both flexible support for the circuit board 1 and reduces the risk of deformation of the circuit board 1, thus guaranteeing the structural stability of the circuit board 1. The compression dimension L is the original height of the frame 3 along the axial direction D1 of the heat dissipation cavity 31 minus the length of the frame 3 after compression by the circuit board 1; its value directly reflects the degree of deformation of the frame 3. The compression amount is the ratio of the compression dimension L to the original height of the frame 3 along the axial direction D1 of the heat dissipation cavity 31. For ease of understanding, in Tables 1 and 2 below, the original height of the frame 3 along the axial direction D1 of the heat dissipation cavity 31 is consistent with the thickness H of the frame 3.

[0049] Table 1

[0050] Table 2

[0051] For the sealant 5 mentioned above, such as Figure 5As shown, sealant 5 seals the connection between the frame 3 and the functional component 2, thereby fixing the position of the frame 3 when it is placed on the functional component 2. During subsequent injection of liquid thermally conductive adhesive, it effectively prevents the frame 3 from shifting or tilting during the flow of the liquid thermally conductive adhesive, and also prevents the liquid thermally conductive adhesive from overflowing from the gap between the frame 3 and the functional component 2. The sealant 5 can be integrally molded with the frame 3, or it can be separately installed and bonded to the frame 3. The sealant 5 is an adhesive with bonding properties, such as acrylic pressure-sensitive adhesive, silicone pressure-sensitive adhesive, or rubber-based pressure-sensitive adhesive.

[0052] It is understandable that the shape of the sealant 5 is adapted to the outline shape of the first opening end 311 of the heat dissipation cavity 31 of the frame 3, and the sealant 5 is annular to achieve full bonding and fixation between the frame 3 and the functional component 2.

[0053] In the embodiments of the present invention, please refer to Figure 3 , Figure 4 and Figure 5 A circuit board heat dissipation assembly 100 is provided, including a circuit board 1, a frame 3, thermally conductive adhesive 4, and a functional component 2. The circuit board 1 has a heat dissipation area 111. The frame 3 forms a heat dissipation cavity 31. The functional component 2 and the circuit board 1 respectively cover the first opening end 311 and the second opening end 312 of the heat dissipation cavity 31, and the heat dissipation area 111 is connected to the heat dissipation cavity 31. The thermally conductive adhesive 4 is configured to be injected into the heat dissipation cavity 31 through the first opening end 311 or the second opening end 312 of the heat dissipation cavity 31 in a liquid state (liquid thermally conductive adhesive) and then solidify. The thermally conductive adhesive 4 is fixed to the heat dissipation area 111 of the circuit board 1 and the functional component 2. Through the arrangement of the frame 3 and the thermally conductive adhesive 4, a heat conduction path is formed between the circuit board 1 and the functional component 2, which can efficiently conduct and dissipate the heat generated by the circuit board 1 or the functional component 2 through the thermally conductive adhesive 4, ensuring the operational reliability of the circuit board 1 and the functional component 2.

[0054] Furthermore, when the thermally conductive adhesive 4 is in a liquid state (liquid thermally conductive adhesive), the liquid thermally conductive adhesive is injected into the heat dissipation cavity 31 through the first opening end 311 or the second opening end 312. Utilizing the fluidity of the liquid thermally conductive adhesive, it naturally fills the heat dissipation cavity 31. After potting, the circuit board 1 is placed on the frame 3, and the circuit board 1 is pressed onto the liquid thermally conductive adhesive. The liquid thermally conductive adhesive can fully wet the heat dissipation area 111 of the circuit board 1 and the part of the functional component 2 that communicates with the heat dissipation cavity 31 within the heat dissipation cavity 31, thereby solidifying to form the thermally conductive adhesive 4. When setting the thermally conductive adhesive 4, it is not limited by the inconsistent gap size between the circuit board 1 (electronic component 12) and the functional component 2. Only one potting operation is needed to complete the construction of the heat conduction path between the circuit board 1 and the functional component 2, significantly improving the assembly efficiency and consistency of the circuit board heat dissipation assembly 100 and saving costs.

[0055] In addition, the thermally conductive adhesive 4, when in liquid state (liquid thermally conductive adhesive), naturally flows and fills the heat dissipation cavity 31. After the liquid thermally conductive adhesive solidifies, it forms a state where the thermally conductive adhesive 4 is fixed in the heat dissipation area 111 and the functional component 2 respectively. There is no need for external force to squeeze the circuit board 1 or the functional component 2. The rebound force of the circuit board 1 on the frame 3 is small, and the risk of deformation of the circuit board 1 is small. In addition, the circuit board 1 is supported by the frame 3 and the thermally conductive adhesive 4. The deformation of the frame 3 under the pressure of the circuit board 1 is dispersed by the thermally conductive adhesive 4. The rebound force of the frame 3 on the circuit board 1 is small, and the risk of deformation of the circuit board 1 is small. The structural stability of the circuit board 1 is significantly improved, and the operational reliability of the circuit board 1 is significantly improved.

[0056] The present invention also provides an embodiment of an energy storage system 200, please refer to [link / reference]. Figure 7 and combination Figure 5 The energy storage system 200 includes an energy storage battery 2001 and a circuit board heat dissipation assembly 100, with the energy storage battery 2001 connected to the circuit board heat dissipation assembly 100 (specifically, the circuit board 1).

[0057] In some embodiments, the energy storage system 200 further includes an inverter 2002, an AC-DC rectifier 2003, a filter 2004, a step-up / step-down converter 2005, a first relay K1, a second relay K2, and a display panel 2006. The circuit board heat dissipation assembly 100 (specifically circuit board 1) is connected to the AC-DC rectifier 2003. The filter 2004 is connected to the step-up / step-down transformer 2005. The step-up / step-down transformer 2005 is connected to the circuit board heat dissipation assembly 100 (specifically circuit board 1). The step-up / step-down transformer 2005 is connected to the first relay K1. The first relay K1 is connected to the circuit board heat dissipation assembly 100 (specifically circuit board 1) and the energy storage battery 2001, thus connecting the energy storage battery 2001 and the circuit board heat dissipation assembly 100 (specifically circuit board 1). The energy storage battery 2001 is connected to the second relay K2. The second relay K2 is connected to the circuit board heat dissipation assembly 100 (specifically circuit board 1) and the second relay K2 is connected to the inverter 2002. The inverter 2002 supplies power to the AC load 2007 and the DC load 2008. The display panel 2006 is connected to the circuit board heat dissipation assembly 100 (specifically circuit board 1) and can display the output status of the energy storage system 200. For the specific structure and function of the circuit board heat dissipation component 100, please refer to the above embodiments, which will not be repeated here.

[0058] In this embodiment of the invention, AC power is fed into a step-up / step-down converter 2005 via an AC-DC rectifier 2003 and a filter 2004. The step-up / step-down converter 2005 receives a control signal matching voltage from the circuit board heat dissipation assembly 100 (specifically, circuit board 1) and charges the energy storage battery 2001 via a first relay K1. When fully charged, the first relay K1 disconnects. The electrical energy in the energy storage battery 2001 is fed into the inverter 2002 via a second relay K2, which can supply power to the AC load 2007 and the DC load 2008. When the energy storage battery 2001 is undervoltage, the second relay K2 disconnects. The circuit board heat dissipation assembly 100 (specifically, circuit board 1) can control the display panel 2006 to display the output status.

[0059] It is worth noting that in some embodiments, the above-mentioned display panel 2006 may not be provided, and the function of the energy storage system 200 provided in the embodiments of the present invention can still be achieved.

[0060] This invention also provides a method for manufacturing a circuit board heat dissipation assembly 100; please refer to [link to relevant documentation]. Figure 8 and combination Figure 5 The method for manufacturing the circuit board heat dissipation component 100 is applied to the aforementioned circuit board heat dissipation component 100, and the method includes: Step S1: Place the frame 3 on the functional component 2 so that the functional component 2 covers the first opening end 311 of the heat dissipation cavity 31.

[0061] In actual operation, functional component 2 can be placed on the assembly platform, and then as follows: Figure 9 As shown, the frame 3 is placed on the functional component 2, so that the functional component 2 covers the first opening end 311 of the heat dissipation cavity 31 of the frame 3.

[0062] When the heat dissipation assembly 100 of the circuit board is provided with sealant 5, the sealant 5 can be integrally formed with the frame 3, that is, the edge of the first opening end 311 of the frame 3 is provided with sealant 5. Step S1 specifically includes: bonding the sealant 5 to the functional component 2 so that the functional component 2 covers the first opening end 311 of the heat dissipation cavity 31.

[0063] When the heat dissipation assembly 100 of the circuit board is provided with sealant 5, sealant 5 can be separately provided from the frame 3. Step S1 specifically includes: bonding sealant 5 to the functional component 2, and bonding the edge of the first opening end 311 of the heat dissipation cavity 31 of the frame 3 to the sealant 5, so that the functional component 2 covers the first opening end 311 of the heat dissipation cavity 31. The sealant 5 is annular and adapts to the shape of the edge of the first opening end 311 of the heat dissipation cavity 31 of the frame 3.

[0064] For step S2, please refer to [link / reference]. Figure 10Liquid thermal conductive adhesive 4a is injected into the heat dissipation cavity 31 from the second opening end 312 until the liquid thermal conductive adhesive 4a is flush with the second opening end 312 of the frame 3.

[0065] Please see Figure 11 , Figure 5 and Figure 3 In step S3, the heat dissipation area 111 is aligned with the second opening end 312 of the heat dissipation cavity 31, and the circuit board 1 is placed on the frame 3 so that the circuit board 1 covers the second opening end 312 of the heat dissipation cavity 31.

[0066] It is worth noting that no adhesive is needed to seal the circuit board 1 and the frame 3. After the liquid thermally conductive adhesive 4a has cured, the circuit board 1 and the frame 3 can be fixed together.

[0067] When the substrate 11 of the circuit board 1 is provided with the connection area 112, step S2 specifically includes: making the heat dissipation area 111 correspond to the second opening end 312 of the heat dissipation cavity 31, and setting the connection area 112 on the frame 3 so that the circuit board 1 covers the second opening end 312 of the heat dissipation cavity 31.

[0068] In some embodiments, when the substrate 11 of the circuit board 1 is provided with the connection area 112, step S2 may further include: setting the working end of the electronic component 12 away from the heat dissipation cavity 31, so that the heat dissipation area 111 corresponds to the second opening end 312 of the heat dissipation cavity 31, and setting the connection area 112 on the frame 3 so that the circuit board 1 covers the second opening end 312 of the heat dissipation cavity 31. Through this method, the working end of the electronic component 12 is set away from the heat dissipation cavity 31, which facilitates wiring or maintenance of the electronic component 12.

[0069] When the circuit board 1 is provided with an overflow hole 1112, the overflow hole 1112 is used for overflowing adhesive. Specifically, the circuit board 1 is placed on the frame 3, and the liquid thermally conductive adhesive 4a is subjected to the gravity of the circuit board 1, causing the liquid thermally conductive adhesive 4a to overflow from the overflow hole 1112.

[0070] Alternatively, in some embodiments, there is a connection gap g between the electronic component 12 and the substrate 11. The circuit board 1 is placed on the frame 3. The liquid thermal conductive adhesive 4a is subjected to the gravity of the circuit board 1, causing the liquid thermal conductive adhesive 4a to overflow from the connection gap g. Finally, the liquid thermal conductive adhesive 4a solidifies to form a portion of the thermal conductive adhesive 4 that is solidified on the side of the circuit board 1 facing away from the heat dissipation cavity 31. This not only ensures that the thermal conductive adhesive completely fills the interior of the heat dissipation cavity 31, avoiding stress concentration or impact on the heat dissipation function between the circuit board 1 and the functional component 2 due to local cavities, but also seals the connection gap g between the electronic component 12 and the substrate 11 through the thermal conductive adhesive 4, thereby enhancing the airtightness and protection level of the overall structure of the circuit board heat dissipation assembly 100.

[0071] Step S4: Wait for the liquid thermally conductive adhesive 4a to cure, forming thermally conductive adhesive 4 that is fixed to the heat dissipation area 111 and the functional component 2 respectively.

[0072] After the liquid thermally conductive adhesive 4a has cured, please combine... Figure 11 , Figure 3 and Figure 5 This allows the thermally conductive adhesive 4 to be fixed to the heat dissipation area 111 and the functional component 2 respectively, eliminating the need for additional adhesive to connect the frame 3 and the circuit board 1.

[0073] It is worth noting that, through the above-described method for preparing the heat dissipation component 100 of the circuit board, when setting the thermally conductive adhesive 4 during the preparation of the heat dissipation component 100, it is not limited by the inconsistent gap size between the circuit board 1 (electronic component 12) and the functional component 2. Only one potting operation is needed to complete the construction of the heat conduction path between the circuit board 1 and the functional component 2, which significantly improves the assembly efficiency and consistency of the heat dissipation component 100 of the circuit board and saves costs. In addition, the liquid thermally conductive adhesive 4a flows naturally to fill the heat dissipation cavity 31. The liquid thermally conductive adhesive 4a is squeezed by the gravity of the circuit board 1 itself, so that after the liquid thermally conductive adhesive 4a is cured, it forms thermally conductive adhesive 4 which is fixed in the heat dissipation area 111 and the functional component 2 respectively. There is no need for external force to squeeze the circuit board 1 or the functional component 2. The rebound force of the circuit board 1 on the frame 3 is small, and the risk of deformation of the circuit board 1 is small. In addition, the circuit board 1 is supported by the frame 3 and the thermally conductive adhesive 4. The deformation of the frame 3 under the pressure of the circuit board 1 is dispersed by the thermally conductive adhesive 4. The rebound force of the frame 3 on the circuit board 1 is small, the risk of deformation of the circuit board 1 is small, the structural stability of the circuit board 1 is significantly improved, and the operational reliability of the circuit board 1 is significantly improved.

[0074] The specific structure and function of the heat dissipation component 100 prepared by the method described above can be found in the previous text and will not be repeated here.

[0075] It should be noted that while the preferred embodiments of the present invention are given in the specification and accompanying drawings, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of the present invention; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of the present invention. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of the present invention specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A circuit board heat dissipation assembly, characterized in that, include: Circuit board, frame, thermally conductive adhesive, functional components; The circuit board includes a substrate and electronic components disposed on the substrate, the substrate having a heat dissipation area; The frame has a heat dissipation cavity; The functional component and the circuit board respectively cover the first opening end and the second opening end of the heat dissipation cavity, and the area to be dissipated is connected to the heat dissipation cavity. The thermally conductive adhesive is configured to be injected into the heat dissipation cavity through the first opening end or the second opening end of the heat dissipation cavity in a liquid state and then cured. The thermally conductive adhesive is respectively fixed to the area to be dissipated and the functional component. When the thickness of the substrate is between 1.6 mm and 2.0 mm, the hardness of the frame is between 38 degrees and 70 degrees, and the thickness of the frame is not less than 6 mm.

2. The circuit board heat dissipation assembly according to claim 1, characterized in that, The area to be cooled has an overflow hole communicating with the heat dissipation cavity. The thermally conductive adhesive is configured to be injected into the heat dissipation cavity through the second opening end of the heat dissipation cavity in a liquid state and overflow from the overflow hole when the circuit board covers the second opening end of the heat dissipation cavity, so that the thermally conductive adhesive at least partially fills the overflow hole.

3. The circuit board heat dissipation assembly according to claim 1 or 2, characterized in that, There is a connection gap between the electronic component and the substrate. The thermally conductive adhesive is configured to be injected into the heat dissipation cavity through the second opening end of the heat dissipation cavity in a liquid state and overflow from the connection gap when the circuit board covers the second opening end of the heat dissipation cavity, so that a portion of the thermally conductive adhesive is cured on the side of the circuit board opposite to the heat dissipation cavity.

4. The circuit board heat dissipation assembly according to claim 3, characterized in that, The substrate is provided with a connection area, which surrounds the area to be cooled. The circuit board is disposed on the frame through the connection area to cover the second opening end of the heat dissipation cavity.

5. The circuit board heat dissipation assembly according to claim 4, characterized in that, The electronic components are located in the area to be cooled.

6. The circuit board heat dissipation assembly according to claim 1 or 2, characterized in that, The working end of the electronic component is positioned away from the heat dissipation cavity.

7. The circuit board heat dissipation assembly according to claim 1 or 2, characterized in that, The circuit board heat dissipation assembly also includes a sealant, which is used to seal the connection between the frame and the functional component.

8. The circuit board heat dissipation assembly according to claim 1 or 2, characterized in that, The frame is made of one or more of silicone, foamed silicone, and foam.

9. A method for manufacturing a heat dissipation component for a circuit board, characterized in that, The method, applied to the heat dissipation assembly of the circuit board as described in any one of claims 1-8, comprises: The frame is disposed on the functional component so that the functional component covers the first opening end of the heat dissipation cavity; Liquid thermally conductive adhesive is injected into the heat dissipation cavity from the second opening end until the liquid thermally conductive adhesive is flush with the second opening end of the frame. Align the area to be cooled with the second opening of the heat dissipation cavity, and place the circuit board on the frame so that the circuit board covers the second opening of the heat dissipation cavity; Wait for the liquid thermally conductive adhesive to cure, forming thermally conductive adhesive that is respectively fixed to the heat dissipation area and the functional component.

10. An energy storage system, characterized in that, It includes an energy storage battery and a circuit board heat dissipation assembly as described in any one of claims 1-8, wherein the energy storage battery is electrically connected to the circuit board.

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