A power supply circuit board and a manufacturing method thereof

Abstract

The application discloses a power supply circuit board and a manufacturing method thereof, and relates to the technical field of circuit boards. The manufacturing method comprises the following steps: manufacturing an inner layer circuit on a production board after cutting and processing, then performing inner layer punching, and then sequentially performing brown oxidation, pressing, edge forming, mechanical drilling, deburring, deslagging, copper sinking and copper plating to obtain a copper layer containing plate; performing sand blasting treatment on the copper layer containing plate, then printing conductive copper paste into the holes to fill the holes, and then performing solidification treatment; grinding the plate after the solidification treatment, then manufacturing an outer layer circuit, and then performing solder mask treatment to obtain the power supply circuit board. The manufacturing method simplifies the process flow, reduces the plating time and frequency, saves copper ball and other logistics resources, uses the conductive copper paste as a through hole current channel, increases the current carrying capacity of a single through hole, reduces the number of through holes required per unit area, saves wiring space, and reduces the manufacturing cost of the circuit board.

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