Anti-displacement chip mounting device for SMT chip mounter
By employing anti-displacement and positioning components on the SMT pick-and-place machine, the front and rear clamping and top surface pressing of the components are achieved, solving the problems of component offset and lifting during the placement process, and improving placement accuracy and yield.
Patent Information
- Application Number
- CN202610400352.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-30
- Publication Date
- 2026-05-29
AI Technical Summary
Existing SMT placement machines lack multi-dimensional fixation during the placement process, which makes the placement components prone to misalignment and lifting, affecting placement accuracy and yield.
It employs anti-displacement and positioning components, and uses a motor-driven double-headed threaded rod to move the clamping plate synchronously. Combined with clamping and top surface flexible extrusion, it achieves front and rear clamping and top surface pressing of the patch, preventing the patch from shifting or lifting during the mounting process.
It achieves omnidirectional fixation of the patch, eliminating the misalignment and lifting of the patch during the placement process, and ensuring placement accuracy and yield.