Light-emitting chip mixing and fixing method, display panel and spliced display device

Abstract

The application discloses a light-emitting chip mixed solidification method, a display panel and a spliced display device. The light-emitting chip mixed solidification method comprises the following steps: providing N groups of blue films of different batches, wherein the blue film comprises a light-emitting chip, N is greater than or equal to 3 and is a positive integer; mixing the N groups of blue films of different batches into M groups of mixed groups, each group of mixed groups comprises K blue films from different batches, and at least half of the blue films in the i-th group of mixed groups and the (i+1)-th group of mixed groups are from the same batch, wherein 1 is less than i, i is less than i+1, M is less than 2, K is less than N, i, M and K are positive integers; and the blue films in the M groups of mixed groups are respectively subjected to die bonding, so that the light-emitting chips on the blue films in different mixed groups are fixed on different substrates to form display panels corresponding to the mixed groups one by one. The problem that the spliced display device has uneven brightness under a large viewing angle is solved, the brightness uniformity of the spliced display device is improved, and the display effect of the spliced display device is improved.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a method for solidifying light-emitting chips, a display panel, and a splicing display device. Background Technology

[0002] Mini LED or Micro LED, as a new generation of display technology, has advantages over existing OLED (Organic Light-Emitting Diode) or LCD (Liquid Crystal Display) technologies, such as high resolution, high brightness, ultra-low power consumption, fast response speed, high light emission efficiency, and long lifespan. It is widely used in display fields such as mobile phones, laptops, and televisions.

[0003] During the LED manufacturing process, due to process instability, the light patterns of the light-emitting elements corresponding to different batches of blue film are inconsistent, resulting in the display effect of the splicing display device failing to meet the requirements.

[0004] Therefore, there is an urgent need for a new method for solidifying light-emitting chips, a display panel, and a splicing display device. Summary of the Invention

[0005] This application provides a method for solidifying light-emitting chips, a display panel, and a splicing display device. When splicing the display panels made from the various mixing groups to form a splicing display device, the display panels corresponding to adjacent mixing groups can be arranged adjacently, and there is no problem of brightness jump between the display panels. This solves the problem of uneven brightness in the splicing display device under a large viewing angle, improves the brightness uniformity of the splicing display device, and improves the display effect of the splicing display device.

[0006] This application provides a method for bonding light-emitting chips, comprising the following steps: providing N groups of blue films from different batches, each blue film including a light-emitting chip, wherein N ≥ 3 and is a positive integer; bonding the N groups of blue films from different batches into M mixed groups, each mixed group including K blue films from the different batches, and at least half of the blue films in the i-th mixed group and the (i+1)-th mixed group are from the same batch, wherein 1 ≤ i < i+1 ≤ M, 2 ≤ K < N, and i, M, and K are all positive integers; bonding the blue films in the M mixed groups to fix the light-emitting chips on the blue films in different mixed groups onto different substrates, forming a display panel corresponding one-to-one with each mixed group.

[0007] According to one aspect of this application, in the step of providing N groups of different batches of blue film: N≥7; in the step of mixing the N groups of different batches of blue film into M mixed groups, at least five of the blue films in the i-th mixed group and the (i+1)-th mixed group are from the same batch, 6≤K<N; preferably, K is an even number; preferably, N=10; preferably, K=6.

[0008] According to one aspect of this application, the step of mixing the N groups of different batches of blue film into M mixed groups includes: the i-th mixed group includes the blue film from the i-th batch to the K+i-1-th batch.

[0009] According to one aspect of this application, the step of performing die bonding on the blue films in the M groups of hybrid groups to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates to form a display panel corresponding to each of the hybrid groups includes: performing die bonding on the blue films in the M groups of hybrid groups using a die bonding machine to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates to form a display panel corresponding to each of the hybrid groups.

[0010] According to one aspect of this application, the step of performing die bonding on the blue films in the M groups of hybrid groups to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates to form a display panel corresponding to each of the hybrid groups includes: providing a substrate, the substrate including pixel circuits; performing die bonding on the blue films in the M groups of hybrid groups respectively using a die bonding machine to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates, and electrically connecting the light-emitting chips and the pixel circuits to form a display panel corresponding to each of the hybrid groups.

[0011] According to one aspect of this application, the number of blue films simultaneously mixed by the die bonder is equal to K.

[0012] In another aspect, the present invention provides a display panel prepared using the light-emitting chip solidification method described in any of the above embodiments.

[0013] Another aspect of the present invention provides a splicing display device, comprising a plurality of display panels described in the above embodiments.

[0014] According to another aspect of this application, the splicing display device includes a first display panel splicing group, the first display panel splicing group including display panels corresponding to the first to Mth mixed groups arranged sequentially along a first direction, the first display panel splicing group being arranged along a second direction, the first direction and the second direction intersecting; preferably, the splicing display device further includes a second display panel splicing group, the second display panel splicing group including display panels corresponding to the Mth to 1st mixed groups arranged sequentially along the first direction, the first display panel splicing group and the second display panel splicing group being alternately arranged along the first direction.

[0015] According to another aspect of this application, along the second direction, the display panels corresponding to the same group of the mixed groups are arranged adjacent to each other; preferably, the first direction and the second direction are perpendicular to each other.

[0016] Compared with the prior art, the light-emitting chip mixing method provided in this embodiment of the invention mixes N groups of blue films from different batches into M mixing groups, and limits each mixing group to include K blue films from different batches to ensure a high degree of overlap of blue films in adjacent mixing groups. Different display panels are made using light-emitting chips from blue films in different mixing groups. When the blue films in adjacent mixing groups have a high degree of overlap, the brightness difference of the corresponding display panels is small at a wide viewing angle. When the display panels made from each mixing group are spliced ​​together to form a splicing display device, the display panels corresponding to adjacent mixing groups can be set adjacent to each other, and there is no problem of brightness jump between display panels. This solves the problem of uneven brightness in splicing display devices at wide viewing angles, improves the brightness uniformity of splicing display devices, and improves the display effect of splicing display devices. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart of a method for solidifying a light-emitting chip according to an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the light emission of a splicing display device in the prior art;

[0020] Figure 3 This is a schematic diagram of the light emission of a splicing display device according to an embodiment of the present invention;

[0021] Figure 4This is a schematic diagram of the arrangement of display panels in a splicing display device provided in one embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the arrangement of the display panels in a splicing display device provided in another embodiment of the present invention.

[0023] Explanation of reference numerals in the attached figures:

[0024] P1, First display panel splicing group; P2, Second display panel splicing group; X, First direction; Y, Second direction. Detailed Implementation

[0025] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0027] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0028] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this application can be combined with each other without contradiction.

[0029] This application provides a method for integrating light-emitting chips, a display panel, and a splicing display device. The following will describe these in conjunction with the accompanying drawings. Figures 1 to 5 Various embodiments of the light-emitting chip solidification method, display panel, and splicing display device are described.

[0030] Please see Figure 1 The present application provides a method for solidifying a light-emitting chip, which includes the following steps:

[0031] S110: Provide N sets of blue films from different batches, each blue film including a light-emitting chip, where N≥3 and is a positive integer;

[0032] S120: Mix N different batches of blue film into M mixed groups. Each mixed group includes K blue films from different batches, and at least half of the blue films in the i-th mixed group and the (i+1)-th mixed group come from the same batch, where 1≤i<i+1≤M<N, 2≤K<N, and i, M, and K are all positive integers.

[0033] S130: Perform die bonding on the blue film in each of the M-group hybrid groups to fix the light-emitting chips on the blue film in different hybrid groups onto different substrates, forming a display panel that corresponds to each hybrid group.

[0034] The light-emitting chip mixing method provided in this invention mixes N groups of blue films from different batches into M mixing groups, and limits each mixing group to include K blue films from different batches to ensure a high degree of overlap between the blue films in adjacent mixing groups. Different display panels are made using light-emitting chips from blue films in different mixing groups. When the blue films in adjacent mixing groups have a high degree of overlap, the brightness difference of the corresponding display panels is small at a wide viewing angle. When the display panels made from each mixing group are spliced ​​together to form a splicing display device, the display panels corresponding to adjacent mixing groups can be set adjacent to each other, and there is no problem of brightness jump between display panels. This solves the problem of uneven brightness in the splicing display device at a wide viewing angle, improves the brightness uniformity of the splicing display device, and improves the display effect of the splicing display device.

[0035] In step S110, due to the unstable manufacturing process, the light patterns of the light-emitting chips in different batches of blue film are inconsistent. The difference in light patterns is reflected in the same brightness at a normal viewing angle, but a large difference in brightness at a wide viewing angle. The number of batches of blue film provided is set according to the actual situation. To facilitate subsequent mixing, N≥3 and is a positive integer. For example, when N=10, 10 batches of different batches of blue film are provided, and the light patterns of the light-emitting chips in each batch of blue film are different.

[0036] In step S120, each mixing group can be die-bonded separately using a die bonder. That is, the light-emitting chips of the blue film within a mixing group are used to fabricate a display panel. At least half of the blue films in the i-th and (i+1)-th mixing groups come from the same batch. For example, when i=1, at least half of the blue films in the 1st and 2nd mixing groups come from the same batch; when i=2, at least half of the blue films in the 2nd and 3rd mixing groups come from the same batch, and so on. This ensures that at least half of the blue films in adjacent mixing groups come from the same batch, guaranteeing that at least half of the light-emitting chips used in the corresponding display panels come from the same batch of blue films. Since the light pattern differences between light-emitting chips from the same batch of blue films are small or negligible, by limiting the high overlap of the blue films in adjacent mixing groups, the brightness difference between the two display panels corresponding to the two mixing groups at a wide viewing angle is reduced.

[0037] It should be noted that each mixing group includes K blue films from different batches. The value of K can be determined by the number of blue films that the die bonder can process simultaneously. In some optional embodiments, the number of blue films that the die bonder supports for simultaneous mixing is equal to K. For example, when the die bonder can process a maximum of 6 blue films at the same time, each mixing group can include 6 blue films from different batches to facilitate subsequent die bonding of the blue films in the mixing group.

[0038] Mix N different batches of blue film into M mixed groups. The specific value of M depends on the number of blue films that overlap between the i-th mixed group and the (i+1)-th mixed group, as well as the value of K. As long as it is ensured that the blue films in the two mixed groups do not all come from the same batch, and at least half of the blue films in the two adjacent mixed groups come from the same batch.

[0039] In step S130, a die bonder can be used to bond the blue films in the M mixing groups separately, thereby fixing the light-emitting chips on the blue films in different mixing groups onto different substrates to form display panels corresponding to each mixing group. The die bonder can extract the light-emitting chips from the blue films and fix the light-emitting chips in the same mixing group onto the same substrate, thus forming a display panel. Different display panels use light-emitting chips from different mixing groups. The higher the overlap of the blue films in adjacent mixing groups, the smaller the light emission difference of the corresponding display panels, and the better the display effect.

[0040] The die bonder, also known as a chip mounter, is one of the most critical pieces of equipment in the chip packaging process. Its task is to pick up chips from pre-cut wafers and precisely place them on the corresponding positions on the substrate. This process requires the use of silver paste to bond the chip and the substrate together. The die bonder can place components at high speed and with high precision, completing a series of key steps such as positioning, alignment, flip-chip bonding, and continuous mounting.

[0041] Please see Figures 2 to 3 , Figure 2 The display effect of a splicing display device in the prior art is shown, and it can be seen that it has a significant "brightness block" problem, that is, obvious uneven brightness. Figure 3 The image shows the display effect of a spliced ​​display device made by splicing display panels prepared using the light-emitting chip solidification method of this application. The brightness difference is small and the brightness is uniform at a wide viewing angle, which effectively improves the display effect.

[0042] In some optional embodiments, in the step of providing N different batches of blue film: N≥7; in the step of mixing N different batches of blue film into M mixed groups, at least five blue films in the i-th mixed group and the (i+1)-th mixed group are from the same batch, and 6≤K<N.

[0043] Through research and experimentation, the inventors discovered that when at least five blue films in two adjacent mixed groups come from the same batch, that is, when five blue films overlap, the brightness difference of the corresponding display panel at a wide viewing angle is small, which can improve the uniformity of brightness.

[0044] For example, when K equals 6 and N = 10, the five blue films in the first and second mixed groups come from the same batch. The first mixed group can include blue films from batches 1 to 6, while the second mixed group can include blue films from batches 2 to 7. Both the first and second mixed groups include blue films from batches 2 to 5. That is, the five blue films in the first and second mixed groups come from the same batch. The third mixed group can include blue films from batches 3 to 8, the fourth mixed group can include blue films from batches 4 to 9, and the fifth mixed group can include blue films from batches 5 to 10. That is, M = 5, setting 5 mixed groups, and the five blue films in two adjacent mixed groups come from the same batch.

[0045] Optionally, K is an even number. In the prior art, the number of blue film sheets that a die bonder can process simultaneously is usually set to an even number to facilitate mixed crystal bonding. For example, K can be equal to any of 4, 6, 8, 10, or 12.

[0046] Of course, N and K can also be equal to other values, which can be selected according to the actual situation.

[0047] In some optional embodiments, the step of mixing N different batches of blue film into M mixed groups includes: the i-th mixed group includes blue film from the i-th batch to the K+i-1-th batch.

[0048] It should be noted that, in order to facilitate regular mixing and reduce the difficulty of mixing, the i-th mixing group can be limited to include blue films from the i-th batch to the K+i-1-th batch, so as to improve the regularity of the blue film batches included in the mixing group. For example, when i equals 1 and K = 6, the first mixing group includes blue films from the 1st batch to the 6th batch; when i equals 2, the second mixing group includes blue films from the 2nd batch to the 7th batch, and so on.

[0049] In some optional embodiments, the step of performing die bonding on the blue films in the M groups of hybrid groups to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates and forming a display panel corresponding to each hybrid group includes: providing a substrate, the substrate including pixel circuits; performing die bonding on the blue films in the M groups of hybrid groups respectively using a die bonding machine to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates, and electrically connecting the light-emitting chips and pixel circuits to form a display panel corresponding to each hybrid group.

[0050] Understandably, the light-emitting chip needs to be driven and controlled by the pixel circuit. Therefore, a die bonder is needed to fix the light-emitting chip on the blue film to the substrate, and the electrical connection between the light-emitting chip and the pixel circuit is achieved by welding with gold wire bonding and ball solder or by connecting with conductive adhesive.

[0051] This invention also provides a display panel, which is prepared using the light-emitting chip solidification method described in any of the above embodiments.

[0052] It should be noted that, since there are multiple hybrid groups, each hybrid group corresponds to a different display panel. Subsequently, the display panels need to be arranged according to a certain arrangement rule to form the required splicing display device. For specific arrangement methods, please refer to the relevant instructions in the subsequent splicing display device section.

[0053] This invention also provides a splicing display device, which includes multiple display panels as described in the above embodiments. That is, the splicing display device is formed by splicing together multiple mixed groups of corresponding display panels.

[0054] Please see Figures 2 to 3 , Figure 2 The display effect of a splicing display device in the prior art is shown, and it can be seen that it has a significant "brightness block" problem, that is, obvious uneven brightness. Figure 3The image shows the display effect of a spliced ​​display device made by splicing display panels prepared using the light-emitting chip solidification method of this application. The brightness difference is small and the brightness is uniform at a wide viewing angle, which effectively improves the display effect.

[0055] Please see Figure 4 In some optional embodiments, the splicing display device includes a first display panel splicing group P1, which includes display panels corresponding to the first to the Mth mixed groups arranged sequentially along the first direction X. The first display panel splicing group P1 is arranged along the second direction Y, and the first direction X and the second direction Y intersect.

[0056] It should be noted that, along the first direction X, the first display panel splicing group P1 may include a display panel corresponding to one M mixed groups, or it may include display panels corresponding to multiple M mixed groups, for example, as Figure 4 As shown, Figure 4 In the diagram, "1" represents the display panel corresponding to the first mixed group, "2" represents the display panel corresponding to the second mixed group, "3" represents the display panel corresponding to the third mixed group, "4" represents the display panel corresponding to the fourth mixed group, "5" represents the display panel corresponding to the fifth mixed group, and "6" represents the display panel corresponding to the sixth mixed group.

[0057] When M=6, along the first direction X, the first display panel splicing group P1 may include the display panels corresponding to the first mixed group, the second mixed group, the third mixed group, the fourth mixed group, the fifth mixed group, and the sixth mixed group arranged in sequence. The blue film in the two adjacent mixed groups has a high degree of overlap to reduce the brightness difference between the two display panels corresponding to the two adjacent mixed groups at a large viewing angle in the first direction X.

[0058] Please see Figure 5 Optionally, the splicing display device further includes a second display panel splicing group P2, which includes display panels corresponding to the Mth to the 1st mixed groups arranged sequentially along the first direction X. Along the first direction X, the first display panel splicing group P1 and the second display panel splicing group P2 are alternately arranged.

[0059] For example, along the first direction X, there is a first display panel splicing group P1 consisting of mixed groups from group 1 to group 6, a second display panel splicing group P2 consisting of mixed groups from group 6 to group 1, and so on, to reduce the brightness difference between the two display panels corresponding to two adjacent mixed groups in the first display panel splicing group P1 and the second display panel splicing group P2 at a wide viewing angle, to ensure that the blue film in two adjacent mixed groups in the first display panel splicing group P1 and the second display panel splicing group P2 has a high degree of overlap, and can meet the required size requirements of the splicing display device.

[0060] Please see Figures 4 to 5 In some optional embodiments, along the second direction Y, the display panels corresponding to the same group of mixing are arranged adjacent to each other. For example, when M=6, along the first direction X, the first display panel splicing group P1 may include the display panels corresponding to the first group of mixing, the second group of mixing, the third group of mixing, the fourth group of mixing, the fifth group of mixing, and the sixth group of mixing in sequence. Along the second direction Y, the display panels corresponding to the first group of mixing are arranged adjacent to each other, the display panels corresponding to the second group of mixing are arranged adjacent to each other, and so on, so as to reduce the brightness difference between adjacent display panels along the second direction Y and improve the display uniformity of the splicing display device.

[0061] Optionally, the first direction X and the second direction Y are perpendicular.

[0062] The splicing display device provided in this application embodiment can be applied to any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, vehicle display, medical equipment, industrial control equipment, touch interactive terminal, etc. This application embodiment does not make any special limitations on this.

[0063] The above are merely specific embodiments of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

[0064] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

Claims

1. A method for solidifying a light-emitting chip, characterized in that, Includes the following steps: N sets of different batches of blue film are provided, each blue film comprising a light-emitting chip, wherein N≥3 and is a positive integer; The N groups of different batches of blue film are mixed into M mixed groups. Each mixed group includes K blue films from the different batches. At least half of the blue films in the i-th mixed group and the (i+1)-th mixed group come from the same batch, where 1≤i<i+1≤M, 2≤K<N, and i, M, and K are all positive integers. The blue films in the M-group hybrid groups are solidified to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates, forming a display panel that corresponds one-to-one with each hybrid group.

2. The method for solidifying a light-emitting chip according to claim 1, characterized in that, In the step of providing N different batches of blue film: N≥7; The step of mixing N groups of different batches of blue film into M mixed groups includes: at least five blue films in the i-th mixed group and the (i+1)-th mixed group come from the same batch, where 6 ≤ K < N; Preferably, K is an even number; Preferably, N=10; Preferably, K=6.

3. The method for solidifying a light-emitting chip according to claim 1, characterized in that, The step of mixing N groups of different batches of blue film into M mixed groups includes: The i-th group of the mixture includes the blue film from the i-th batch to the K+i-1-th batch.

4. The method for solidifying a light-emitting chip according to claim 1, characterized in that, The step of performing die bonding on the blue films in the M groups of hybrid groups to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates, forming a display panel corresponding to each of the hybrid groups, includes: The blue films in the M-group hybrid groups are bonded using a die bonder to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates, forming a display panel that corresponds one-to-one with each hybrid group.

5. The method for solidifying a light-emitting chip according to claim 1, characterized in that, The step of performing die bonding on the blue films in the M groups of hybrid groups to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates, forming a display panel corresponding to each of the hybrid groups, includes: A substrate is provided, the substrate including pixel circuitry; The blue films in the M-group hybrid groups are bonded using a die bonder to fix the light-emitting chips on the blue films in different hybrid groups onto different substrates, and to electrically connect the light-emitting chips and the pixel circuits to form a display panel that corresponds to each of the hybrid groups.

6. The method for solidifying a light-emitting chip according to claim 5, characterized in that, The number of blue films that the die bonder supports for simultaneous crystal mixing is less than or equal to K.

7. A display panel, characterized in that, The light-emitting chip is prepared using the solid-liquid mixing method according to any one of claims 1 to 6.

8. A splicing display device, characterized in that, It includes multiple display panels as described in claim 7.

9. The splicing display device according to claim 8, characterized in that, The splicing display device includes a first display panel splicing group, the first display panel splicing group including the display panels corresponding to the first to the Mth mixed groups arranged sequentially along a first direction, the first display panel splicing group being arranged along a second direction, the first direction and the second direction intersecting; Preferably, the splicing display device further includes a second display panel splicing group, the second display panel splicing group including the display panels corresponding to the Mth to the 1st mixed groups arranged sequentially along the first direction, and the first display panel splicing group and the second display panel splicing group are alternately arranged along the first direction.

10. The splicing display device according to claim 9, characterized in that, Along the second direction, the display panels corresponding to the same group of hybrid groups are arranged adjacent to each other; Preferably, the first direction and the second direction are perpendicular.

Images