Display device

Abstract

A display device according to one embodiment of the specification includes a substrate, a thin film transistor provided over the substrate, a protective layer provided over the thin film transistor, a first electrode provided over the protective layer and electrically connected to the thin film transistor, a bank portion provided to span the first electrode and the protective layer and defining a light emitting region exposing the first electrode and a trench exposing the protective layer, wherein the bank portion defining the light emitting region has a positive taper shape, and the bank portion defining the trench has an inverse taper shape.

Description

Technical Field

[0001] This specification relates to a device, and in particular, for example, but not limited to, a display device. Background Technology

[0002] With the development of the information society, the demand for display devices for displaying images is increasing, and various types of display devices are being used, such as liquid crystal display (LCD) devices and organic light-emitting diode (OLED) display devices.

[0003] In display devices, OLED displays offer advantages such as wider viewing angles and higher contrast ratios due to their self-emissive nature. They can also be lighter and thinner than LCD devices and consume less power because they do not require a separate backlight. Furthermore, OLED displays can be driven with low voltage, have fast response times, and are particularly cost-effective to manufacture.

[0004] The descriptions provided in the background section should not be construed as prior art simply because they are mentioned in or associated with that section. The background section may include information describing one or more aspects of the subject matter art, and the descriptions in that section do not limit this disclosure. Summary of the Invention

[0005] This specification aims to provide a display device in which areas with different pixels per inch (PPI) can be formed without changing the fine metal mask (FMM).

[0006] This specification also aims to provide a display device in which the solvent used to remove the organic layer can be suppressed or prevented from spilling into other adjacent areas.

[0007] This specification also aims to provide a display device in which the transmittance of the transmissive portion can be increased.

[0008] The purpose of this specification is not limited to the above-mentioned purposes, and other technical purposes can be deduced from the following embodiments.

[0009] According to one embodiment of this specification, a display device is provided, comprising: a substrate; a thin-film transistor disposed on the substrate; a protective layer disposed on the thin-film transistor; a first electrode disposed on the protective layer and electrically connected to the thin-film transistor; and a dam portion spanning the first electrode and the protective layer, defining a light-emitting area exposing the first electrode and a trench exposing the protective layer, wherein the dam portion defining the light-emitting area has a regular strip shape, and the dam portion defining the trench has an inverted conical shape.

[0010] According to another embodiment of this specification, a display device is provided, comprising: a plurality of pixel regions, wherein a plurality of sub-pixels, including light-emitting regions and non-light-emitting regions, are disposed in the plurality of pixel regions; a plurality of transmissive regions, wherein grooves are disposed in the plurality of transmissive regions; and a dam, wherein the dam is disposed between the plurality of pixel regions and defines the light-emitting regions and the grooves, wherein the plurality of pixel regions and the plurality of transmissive regions extend in a first direction, the pixel regions and the transmissive regions are alternately and repeatedly disposed in a second direction intersecting the first direction, and the transmissive regions have a higher light transmittance than the pixel regions.

[0011] According to the embodiments described in this specification, regions with different pixels per inch (PPI) can be formed without changing the fine metal mask (FMM).

[0012] According to the embodiments described in this specification, the solvent used to remove the organic layer can be suppressed or prevented from spilling into other adjacent areas.

[0013] According to the embodiments described in this specification, the transmittance of the transmissive portion can be increased.

[0014] According to the embodiments described in this specification, the solvent used to remove the organic layer can be suppressed or prevented from spilling into other adjacent areas, thereby optimizing the manufacturing process of the display device and reducing production energy.

[0015] However, the effects available from this specification are not limited to those described above, and based on the following description, those skilled in the art will be able to clearly understand other effects not mentioned.

[0016] Details of other implementation methods are included in the detailed description and accompanying drawings.

[0017] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0018] The accompanying drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure. The drawings are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this application. In the drawings:

[0019] Figures 1 to 4 This is a schematic plan view of a display device according to one embodiment.

[0020] Figure 5 It is a plan view of the first optical region of the display area according to one embodiment.

[0021] Figure 6 It is along Figure 5 A cross-sectional view of line A-A'.

[0022] Figure 7 yes Figure 6 A detailed cross-sectional view of the light-emitting part.

[0023] Figure 8 This is a detailed cross-sectional view of the light-emitting part in the modified example.

[0024] Figure 9 It is based on Figure 6 A cross-sectional view of the touch portion.

[0025] Figure 10 It is along Figure 5 A cross-sectional view of line B-B'.

[0026] Figure 11 yes Figure 10 A magnified view of region Q1 in the image.

[0027] Figures 12 to 14 This is a view illustrating each process of a method for manufacturing a display device according to one embodiment.

[0028] Figure 15 This is a cross-sectional view of a display device according to another embodiment.

[0029] Figure 16 This is a cross-sectional view of a display device according to yet another embodiment. Detailed Implementation

[0030] In the following description, embodiments will be described with reference to the accompanying drawings. In the specification, when a first component (or region, layer, portion, etc.) is described as "on" a second component, "connected" to, or "attached" to a second component, it means that the first component can be directly connected to / attached to the second component, or that a third component can be disposed between the first component and the second component.

[0031] The same reference numerals denote the same parts. Furthermore, in the drawings, the thickness, scale, and dimensions of the parts are exaggerated for the purpose of effectively describing the technical content. The term "and / or" includes all one or more combinations that can be defined by the associated configuration.

[0032] Terms such as "first" and "second" can be used to describe various components, but components are not limited by the terms. These terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the implementation, a first component can be referred to as a second component, and similarly, a second component can be referred to as a first component. Unless the context clearly specifies otherwise, the singular includes the plural.

[0033] Terms such as "below," "on the lower side," "above," and "on the upper side" are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative concepts and are described relative to the direction indicated by the markings in the drawings.

[0034] It should be understood that terms such as “comprising” or “having” are intended to specify the presence of features, quantities, steps, operations, components, parts or combinations thereof described in the specification, and do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts or combinations thereof.

[0035] In the following description, detailed descriptions of well-known functions or configurations relevant to this document are omitted if they are determined to unnecessarily obscure the gist of the inventive concept. The described progression of processing steps and / or operations is exemplary; however, the order of steps and / or operations is not limited to that set forth herein, except that they must occur in a specific order, and can be varied as is known in the art. The same reference numerals always denote the same elements. The names of the elements used in the following description may be chosen solely for convenience of writing the specification and may therefore differ from the names used in actual products.

[0036] In the following description, if a detailed description of a well-known function or configuration relevant to this document is determined to unnecessarily obscure the gist of the inventive concept, such detailed description will be omitted or may be briefly discussed.

[0037] The advantages and features of this disclosure and its implementation methods will be illustrated by the following exemplary embodiments described with reference to the accompanying drawings. However, this disclosure may be implemented in different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided to make this disclosure thorough and complete enough to assist those skilled in the art in fully understanding its scope.

[0038] Any implementation described as an "example" in this document is not necessarily to be construed as preferred or superior to other implementations.

[0039] Furthermore, when referring to any size, relative size, etc., the numerical values ​​or corresponding information of a component or feature (e.g., level, range, etc.) should be considered to include tolerances or error ranges that may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.), even if no relevant description is specified. Additionally, the term "may" fully encompasses all the meanings of the term "able to".

[0040] When describing temporal relationships, discontinuous cases may be included if the temporal order is described as such as “after,” “following,” “next,” and “before,” unless more restrictive terms such as “just,” “immediately,” or “directly” are used.

[0041] The term “at least one” should be understood to include any and all combinations of one or more of the associated listed items. For example, “at least one of the first element, the second element, and the third element” means a combination of all three listed elements, a combination of any two of the three elements, and each individual element, the first element, the second element, or the third element.

[0042] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments pertain. It should also be understood that terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field and should not be interpreted in an idealized or overly formal sense unless explicitly defined herein. For example, the terms “part” or “unit” can be applied to, for example, a single circuit or structure, an integrated circuit, a computational block of a circuit arrangement, or any structure configured to perform the functions described herein that would be understood by one of ordinary skill in the art.

[0043] As will be fully understood by those skilled in the art, the features of the various embodiments of this disclosure may be joined or combined in part or in whole, and may interoperate and be technology-driven in various ways. Embodiments of this disclosure may be performed independently of each other, or may be performed together in an interdependent relationship.

[0044] Figures 1 to 4 This is a schematic plan view of a display device according to one embodiment.

[0045] Reference Figures 1 to 4 According to one embodiment of the present disclosure, the display device 1 may include a display panel 100 for displaying images and one or more optical electronic devices S, S1 and S2. The optical electronic devices S, S1 and S2 may include electronic devices (or light receiving devices) for receiving light, such as cameras or sensors.

[0046] The display panel 100 may include a display area DA and a non-display area NDA disposed around the display area DA. The display area DA is the area on the display panel 100 where an image is displayed. Multiple sub-pixels forming multiple pixels and circuitry for driving the multiple sub-pixels may be disposed in the display area DA.

[0047] The display area DA may include at least one of the normal area NA, the first optical area DA1, and the second optical area DA2, but is not limited thereto.

[0048] The normal region NA, the first optical region DA1, and the second optical region DA2 can be defined on the substrate 101 (see Figure 6 )superior.

[0049] The flat surface shape of the display area DA can be rectangular. However, the embodiments described herein are not limited to this, and the flat surface shape of the display area DA can be square, circular, elliptical, or other polygonal shapes. For example, the display area DA can be a rectangular shape with rounded corners, but is not limited to this, and can also be a rectangular shape with angled corners.

[0050] In the implementation, the first direction DR1 and the second direction DR2 are different directions and intersect each other, for example, perpendicular directions in a plan view. Figure 1 In this embodiment, the first direction DR1 may be substantially the same as the extension direction of the short side of the display panel 100, and the second direction DR2 may be the same as the extension direction of the long side of the display panel 100. However, the directions described in the embodiment should be understood as indicating relative directions, and the embodiment is not limited to the described directions.

[0051] The display area DA may include a short side extending in the first direction DR1 and a long side extending in the second direction DR2.

[0052] The non-display area NDA may surround the display area DA, but is not limited thereto. The non-display area NDA may be located on one side and the other side of the display area DA in the first direction DR1 and on one side and the other side of the display area DA in the second direction DR2.

[0053] The non-display area (NDA) is the area where no image is displayed, and its border area can be defined.

[0054] exist Figures 1 to 4 In this configuration, one or more optical electronic devices S, S1 and S2 are electronic components located below the display panel 100 (on the side opposite to the viewing surface).

[0055] Light can enter the front surface (viewing surface) of the display panel 100, pass through the display panel 100, and be transmitted to one or more optical electronic devices S, S1 and S2 located below the display panel 100 (on the side opposite to the viewing surface).

[0056] One or more optical electronic devices S, S1 and S2 may be devices for receiving light that has been transmitted through the display panel 100 and performing a predetermined function according to the received light.

[0057] For example, the optical electronics S, S1, and S2 may include one or more cameras or proximity sensors.

[0058] As described above, optical electronic devices S, S1, and S2 are devices that require light reception, but they can be located below the display panel 100. That is, optical electronic devices S, S1, and S2 can be located on the side opposite to the viewing surface of the display panel 100. Optical electronic devices S, S1, and S2 are not exposed to the front of the display device 1. Therefore, optical electronic devices S, S1, and S2 are not visible when the user views the front surface of the display device 1.

[0059] For example, the camera located below the display panel 100 is a front-facing camera used to capture forward-facing images and can be considered as a camera lens.

[0060] Optical electronic devices S, S1, and S2 can be configured to overlap with the display area DA of the display panel 100. In other words, optical electronic devices S, S1, and S2 can be located within the display area DA.

[0061] Reference Figures 1 to 4 The display area DA may include a normal area NA and one or more optical areas DA1 and DA2. The normal area NA and one or more optical areas DA1 and DA2 can all be areas where the image is displayed. One or more optical areas DA1 and DA2 may be areas overlapping with one or more optoelectronic devices S, S1, and S2.

[0062] according to Figure 1 For example, the display area DA may include a normal area NA and a first optical area DA1. Here, at least a portion of the first optical area DA1 may also overlap with the optoelectronic device S. Figure 1 A first optical region DA1 with a circular structure is shown, but the shape of the first optical region DA1 according to one embodiment is not limited thereto.

[0063] For example, such as Figure 2 As shown, the shape of the first optical region DA1 can be octagonal, or it can be formed into various polygonal shapes.

[0064] according to Figure 3 For example, the display area DA can include a normal area NA, a first optical area DA1, and a second optical area DA2. Figure 3 In the example, the normal region NA can exist between the first optical region DA1 and the second optical region DA2. Here, at least a portion of the first optical region DA1 can overlap with the first optoelectronic device S1, and at least a portion of the second optical region DA2 can overlap with the second optoelectronic device S2.

[0065] according to Figure 4For example, the display area DA can include a normal area NA, a first optical area DA1, and a second optical area DA2. Figure 4 In the example, there is no normal region NA between the first optical region DA1 and the second optical region DA2. That is, the first optical region DA1 can also contact the second optical region DA2. Here, at least a portion of the first optical region DA1 can overlap with the first optoelectronic device S1, and at least a portion of the second optical region DA2 can overlap with the second optoelectronic device S2.

[0066] Both image display structures and light-transmitting structures need to be formed in one or more optical regions DA1 and DA2. That is, since one or more optical regions DA1 and DA2 are part of the display region DA, sub-pixels for image display need to be set in one or more optical regions DA1 and DA2. Light-transmitting structures for transmitting light through one or more optical electronic devices S, S1, and S2 need to be formed in one or more optical regions DA1 and DA2.

[0067] One or more optical electronic devices S, S1, S2 are devices that need to receive light, but are located behind (below, on the side opposite to the viewing surface) the display panel 100, and receive light transmitted through the display panel 100.

[0068] One or more optical electronic devices S, S1, and S2 are not exposed on the front surface (viewing surface) of the display panel 100. Therefore, when a user views the front surface of the display device 1, the optical electronic devices S, S1, and S2 are not visible to the user.

[0069] For example, the first optical electronic devices S and S1 can be cameras, and the second optical electronic device S2 can be a detection sensor, such as a proximity sensor or an illumination sensor. For example, the detection sensor can be an infrared sensor for detecting infrared light.

[0070] Conversely, the first optical electronic device S1 can be a detection sensor, and the second optical electronic device S2 can be a camera.

[0071] For ease of explanation, the following example illustrates a first optical electronic device S and S1 being a camera, and a second optical electronic device S2 being a detection sensor. Here, the camera can be a camera lens or an image sensor.

[0072] When the first optical electronics S and S1 are cameras, the cameras are located behind (below) the display panel 100, but can be front-facing cameras used to capture forward images of the display panel 100. Therefore, the user can capture images that are not visible on the viewing surface while viewing the viewing surface of the display panel 100.

[0073] The normal area NA and one or more optical areas DA1 and DA2 included in the display area DA are areas in which images can be displayed, but the normal area NA is an area in which a light-transmitting structure does not need to be formed, and one or more optical areas DA1 and DA2 are areas in which a light-transmitting structure needs to be formed.

[0074] Therefore, one or more optical regions DA1 and DA2 need to have a predetermined level or higher transmittance, and the normal region NA may not have light-transmitting properties or may have a low transmittance below the predetermined level.

[0075] For example, one or more optical regions DA1 and DA2 may differ from the normal region NA in terms of resolution, subpixel arrangement structure, number of subpixels per unit area, electrode structure, line structure, electrode arrangement structure, and line arrangement structure.

[0076] For example, the number of subpixels per unit area in one or more optical regions DA1 and DA2 can be less than the number of subpixels per unit area in the normal region NA. That is, the resolution of one or more optical regions DA1 and DA2 can be lower than the resolution of the normal region NA. In this case, the number of subpixels per unit area is a unit used to measure resolution and can be referred to as pixels per inch (PPI), which refers to the number of pixels per inch.

[0077] For example, the number of sub-pixels per unit area in the first optical region DA1 can be less than the number of sub-pixels per unit area in the normal region NA. The number of sub-pixels per unit area in the second optical region DA2 can be greater than or equal to the number of sub-pixels per unit area in the first optical region DA1.

[0078] The first optical region DA1 can have various shapes, such as circular, elliptical, square, hexagonal, octagonal, etc. The second optical region DA2 can have various shapes, such as circular, elliptical, square, hexagonal, octagonal, etc. The first optical region DA1 and the second optical region DA2 can have the same shape or different shapes.

[0079] Reference Figure 3 When the first optical region DA1 comes into contact with the second optical region DA2, the entire optical region including the first optical region DA1 and the second optical region DA2 can also have various shapes, such as circles, ellipses, squares, hexagons, octagons, etc.

[0080] In the following text, for ease of description, examples will be provided where each of the first optical region DA1 and the second optical region DA2 is circular.

[0081] In a display device 1 according to one embodiment, when the first optical electronic devices S and S1, which are not exposed to the outside and are hidden under the display panel 100, are infrared sensors (or near-infrared sensors), the display device 1 according to one embodiment can be referred to as a display using UDIR technology.

[0082] Therefore, in the case of the display device 1 according to one embodiment, since it is not necessary to form a notch or camera hole in the display panel 100 for exposing the camera, the area of ​​the display area DA will not be reduced.

[0083] Therefore, since it is not necessary to form a notch or camera hole in the display panel 100 to expose the camera, the size of the bezel area can be reduced, and since design constraints are eliminated, design freedom can be increased.

[0084] In a display device 1 according to one embodiment, even if one or more optical electronic devices S, S1 and S2 are positioned to be hidden behind the display panel 100, one or more optical electronic devices S, S1 and S2 still need to receive light normally and perform predetermined functions normally.

[0085] Furthermore, in a display device 1 according to one embodiment, even if one or more optical electronic devices S, S1 and S2 are positioned to be hidden behind the display panel 100 and overlap with the display area DA, it is still necessary to display a normal image in one or more optical areas DA1 and DA2 that overlap with one or more optical electronic devices S, S1 and S2 in the display area DA.

[0086] Therefore, the display device 1 according to one embodiment of the present disclosure may have a structure capable of increasing the transmittance of the first optical region DA1 and the second optical region DA2 that overlap with the optical electronic devices S, S1 and S2.

[0087] The following text will mainly describe Figures 1 to 4 In the implementation method Figure 1 The implementation method, but Figure 1 The description of the normal region NA can be applied in essentially the same way. Figures 2 to 4 The normal region NA, and Figure 1 The description of the first optical region DA1 can also be applied in essentially the same way. Figures 2 to 4 The optical regions DA1 and DA2.

[0088] Figure 5 It is a plan view of the first optical region of the display area according to one embodiment. Figure 6 It is along Figure 5A cross-sectional view of line A-A'.

[0089] Figure 5 The arrangement of sub-pixels PX1, PX2, and PX3 of a first optical region DA1 of a display region DA according to one embodiment is shown. Figure 6 The cross-sectional structure of each sub-pixel PX1, PX2, or PX3 in the pixel region PA is shown.

[0090] In the following text, the description of the first optical region DA1 can be applied in essentially the same manner to the second optical region DA2 (see...). Figure 2 ).

[0091] Reference Figure 1 , Figure 5 and Figure 6 The optical electronic device S can be disposed below the display panel 100. The optical electronic device S can be disposed to overlap with the first optical region DA1 of the display panel 100. The first optical region DA1 can have a lower PPI than the normal region NA. For example, the density of sub-pixels PX1, PX2, and PX3 in the first optical region DA1 can be lower than the density of sub-pixels PX1, PX2, and PX3 in the normal region NA.

[0092] The first optical region DA1 may include a pixel region PA in which a plurality of sub-pixels PX1, PX2 and PX3 are disposed, and a transmissive region TA disposed around the pixel region PA. The pixel region PA and the transmissive region TA may be defined on the substrate 101.

[0093] The pixel region PA and the transmissive region TA can have different transmittances. The transmittance of the transmissive region TA can be higher than that of the pixel region PA.

[0094] The transmission region TA is not located in the normal region NA, and the normal region NA can be formed solely by the pixel region PA. Therefore, the normal region NA can have a higher PPI than the first optical region DA1.

[0095] Multiple sub-pixels PX1, PX2, and PX3 can be disposed in the first optical region DA1. The multiple sub-pixels PX1, PX2, and PX3 may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3.

[0096] For example, multiple sub-pixels may include a red sub-pixel (red SP) that emits red light (or the first sub-pixel PX1), a green sub-pixel (green SP) that emits green light (or the second sub-pixel PX2), and a blue sub-pixel (blue SP) that emits blue light (or the third sub-pixel PX3). Figure 5The flat surface shape of the plurality of sub-pixels PX1, PX2 and PX3 is shown to be square or elliptical, but the embodiments of this specification are not limited to this, and the flat surface shape of the plurality of sub-pixels PX1, PX2 and PX3 can be circular.

[0097] Therefore, pixel region PA can include light-emitting region EA. Light-emitting region EA can include multiple light-emitting regions EA1, EA2, and EA3. Light-emitting regions EA1, EA2, and EA3 can be respectively set in sub-pixels PX1, PX2, and PX3. That is, the first sub-pixel PX1 can include the first light-emitting region EA1, the second sub-pixel PX2 can include the second light-emitting region EA2, and the third sub-pixel PX3 can include the third light-emitting region EA3.

[0098] The pixel region PA may also include non-light-emitting regions NEA (NEA1, NEA2, and NEA3) disposed around the light-emitting region EA. The embankment 154 may be disposed in the non-light-emitting region NEA.

[0099] The first sub-pixel PX1 may include a first non-emitting region NEA1, the second sub-pixel PX2 may include a second non-emitting region NEA2, and the third sub-pixel PX3 may include a third non-emitting region NEA3. The first non-emitting region NEA1 may be located around the first emitting region EA1, the second non-emitting region NEA2 may be located around the second emitting region EA2, and the third non-emitting region NEA3 may be located around the third emitting region EA3.

[0100] Each non-luminous region NEA1, NEA2, or NEA3 can correspond to the boundary between adjacent sub-pixels PX1, PX2, and PX3.

[0101] The pixels of the display panel 100 may include multiple sub-pixels PX1, PX2, and PX3. The first sub-pixel PX1 may be a red sub-pixel, the second sub-pixel PX2 may be a green sub-pixel, and the third sub-pixel PX3 may be a blue sub-pixel, but the embodiments described herein are not limited to this. In some embodiments, the pixel may also include a fourth sub-pixel, which may be a white sub-pixel, but the embodiments described herein are not limited to this. In some embodiments, the pixel may include one red sub-pixel, two green sub-pixels, and one blue sub-pixel, but the embodiments described herein are not limited to this. For example, the multiple sub-pixels PX1, PX2, and PX3 may be arranged in a stripe pattern on the first direction DR1, but are not limited to this, and may also be arranged in a pentile pattern.

[0102] A pixel region PA can be set as multiple pixel regions. Each pixel region PA can extend in a first direction DR1 and in a zigzag shape in the first direction DR1, but is not limited thereto. Multiple sub-pixels PX1, PX2, and PX3 can be alternately and repeatedly set in each pixel region PA. Each of the multiple pixel regions PA can be repeatedly set in a second direction DR2.

[0103] The transmission region TA can be set between adjacent pixel regions PA on the second direction DR2. Subpixels PX1, PX2, and PX3 may not be set in the transmission region TA.

[0104] The transmission region TA can be set as multiple transmission regions. Each transmission region TA can extend in a first direction DR1 and in a zigzag shape in the first direction DR1, but is not limited thereto. Each of the multiple transmission regions TA can be repeatedly set in a second direction DR2.

[0105] Each of the multiple transmission regions TA and each of the multiple pixel regions PA can be set across the first optical region DA1 in the first direction DR1, but is not limited thereto.

[0106] The transmission region TA can be a region capable of light transmission, in which light entering from the outside of the display panel 100 can pass through the display panel 100 and be emitted to the outside of the display panel 100. Through the transmission region TA, external light can pass through the display panel 100 and reach the optical electronic device S.

[0107] The transmissive region TA may not overlap with the emitting region EA. Furthermore, a light-shielding layer may be formed in the emitting region EA, but it may not be formed in the transmissive region TA. Metal layers such as those for the transistors 120 and 130 driving the light-emitting portions and the storage capacitor 140, as well as the lines connected thereto, may not be provided in the transmissive region TA. However, embodiments described in this specification are not limited to this, and the metal layers and some lines may be provided in some regions of the transmissive region TA.

[0108] The groove TR defined by the embankment 154 can be provided in the transmission region TA. The groove TR can be formed by recessing the embankment 154 in the thickness direction.

[0109] The flat surface shape of the trench TR can correspond to the flat surface shape of the transmission region TA, but is not limited to this.

[0110] The cross-sectional structure of the pixel region PA will be described below.

[0111] The display panel 100 may include a substrate 101, a first thin-film transistor 120, a second thin-film transistor 130, a storage capacitor 140, a light-emitting portion 150, an encapsulation portion 170, a touch portion 180, a filter insulating layer 114, a black background BM, color filters 191, 192 and 193, and a planarization layer OC.

[0112] The display panel 100 may include at least one panel insulating layer and at least one touch insulating layer located between the substrate 101 and the light-emitting portion 150. The at least one panel insulating layer may include at least one of the following: a buffer layer 102, a first insulating layer 103, a second insulating layer 104, a third-first insulating layer 105-1, a third-second insulating layer 105-2, a fourth insulating layer 106, a fifth insulating layer 108, a sixth insulating layer 109, a first protective layer 111, and a second protective layer 112. The at least one touch insulating layer may include at least one of the following: a touch buffer layer 181, a first touch insulating layer 183, and a second touch insulating layer 184.

[0113] The substrate 101 may include one or more plastic materials. For example, the substrate 101 may be a multi-substrate comprising multiple plastic materials (such as polyimide). For example, the substrate 101 may include a first substrate portion 101a, a second substrate portion 101b, and a third substrate portion 101c, wherein the first substrate portion 101a and the second substrate portion 101b each comprise a plastic material, and the third substrate portion 101c comprises an inorganic insulating material between the first substrate portion 101a and the second substrate portion 101b; however, the embodiments described herein are not limited thereto.

[0114] A buffer layer 102 can be disposed on the substrate 101. The buffer layer 102 can minimize or delay the diffusion of moisture or oxygen permeating the substrate 101. The buffer layer 102 can be formed by applying silicon nitride (SiN). x ) and silicon oxide (SiO) x The components are formed by alternating stacking at least once, but the implementation of this specification is not limited thereto.

[0115] The first light-shielding layer 126 may be disposed on the buffer layer 102. The first light-shielding layer 126 may prevent or at least reduce light transmission through the first semiconductor layer 123 of the first thin-film transistor 120. For example, the first semiconductor layer 123 may be configured to overlap with the first light-shielding layer 126. The first light-shielding layer 126 may be formed of a single layer or multiple layers, which may be formed of one of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but the embodiments described herein are not limited thereto.

[0116] A first insulating layer 103 may be disposed on the buffer layer 102 and the first light-shielding layer 126. The first insulating layer 103 prevents short circuits between components of the first thin-film transistor 120 and the first light-shielding layer 126. The first insulating layer 103 may be formed of the same material as the buffer layer 102, but embodiments described herein are not limited thereto. For example, the first insulating layer 103 may be formed of an inorganic insulating material, such as silicon nitride (SiN). x ) or silicon oxide (SiO) x However, the implementation methods described in this specification are not limited thereto.

[0117] The first thin-film transistor 120 may be disposed on the first insulating layer 103. The first thin-film transistor 120 may include a first source 121, a first gate 122, a first semiconductor layer 123, and a first drain 124.

[0118] The first semiconductor layer 123 may be disposed on the first insulating layer 103. The first semiconductor layer 123 may include metal oxide semiconductors, such as indium gallium zinc oxide (IGZO), and silicon-based semiconductor materials, such as amorphous silicon, polycrystalline silicon, etc., but the embodiments described in this specification are not limited thereto. The first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0119] Because polycrystalline semiconductor layers have higher mobility than amorphous semiconductor layers and oxide semiconductor layers, they can consume less power and offer superior reliability. Therefore, driving transistors can be formed from polycrystalline semiconductor layers.

[0120] The second insulating layer 104 may be disposed on the first semiconductor layer 123. The second insulating layer 104 may be formed of the same material as the first insulating layer 103 and may prevent short circuits between the first semiconductor layer 123 and another component of the first thin-film transistor 120.

[0121] The first gate 122 may be disposed on the second insulating layer 104. The first gate 122 may be disposed on the second insulating layer 104 to overlap with the channel region of the first semiconductor layer 123. The first gate 122 may be formed of a single layer or multiple layers of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or compounds thereof, but the embodiments described herein are not limited thereto. The first gate 122 may be disposed along a gate line.

[0122] The third insulating layers 105-1 and 105-2 can be disposed on the first gate 122. The third insulating layers 105-1 and 105-2 can be disposed on the first gate 122 by alternately stacking silicon nitride (SiN). x ) and silicon oxide (SiO) xThe insulating layer 3-1 may be formed at least once, but the embodiments described herein are not limited thereto. For example, the insulating layer 105-1 may include silicon oxide (SiO2). x Furthermore, the third-second insulating layer 105-2 may include silicon nitride (SiN). x However, the implementation methods described in this specification are not limited thereto.

[0123] The first source 121 and the first drain 124 can be disposed on the third insulating layers 105-1 and 105-2.

[0124] The first source 121 and the first drain 124 can be electrically connected to the first semiconductor layer 123 through contact holes. The first source 121 and the first drain 124 can be formed of a metallic material. For example, the first source 121 and the first drain 124 can be formed of a single layer or multiple layers, which are formed of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu), but the embodiments described in this specification are not limited thereto.

[0125] The first source 121 and the first drain 124 can be disposed together with the data line. For example, the data line can be formed of the same material as the first source 121 and the first drain 124, and formed on the same layer as the first source 121 and the first drain 124, but the embodiments described herein are not limited thereto.

[0126] The storage capacitor 140 may be configured to be spaced apart from the first thin-film transistor 120. The storage capacitor 140 may include a first storage electrode 141 and a second storage electrode 142.

[0127] The first storage electrode 141 may be formed of the same material as the first gate electrode 122 and disposed on the same layer as the first gate electrode 122, but the embodiments described herein are not limited thereto.

[0128] The second storage electrode 142 may be disposed on the first storage electrode 141. The second storage electrode 142 may be disposed on the third insulating layers 105-1 and 105-2, and the third insulating layers 105-1 and 105-2 between the first storage electrode 141 and the second storage electrode 142 may serve as a dielectric to generate capacitance. The second storage electrode 142 may be formed of the same material as the first storage electrode 141, but the embodiments described herein are not limited thereto.

[0129] The second thin-film transistor 130 may be configured to be spaced apart from the first thin-film transistor 120 and the storage capacitor 140. The second thin-film transistor 130 may include a second source 131, a second gate 132, a second semiconductor layer 133, and a second drain 134.

[0130] The second light-shielding layer 136 can be disposed on the same layer as the second storage electrode 142.

[0131] The second light-shielding layer 136 can prevent at least a reduction in light travel to the second semiconductor layer 133, similar to the first light-shielding layer 126, thereby extending the lifetime of the second thin-film transistor 130. For example, the second semiconductor layer 133 can be configured to overlap with the second light-shielding layer 136.

[0132] The fourth insulating layer 106 may be disposed on the second light-shielding layer 136. The fourth insulating layer 106 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, or the third insulating layers 105-1 and 105-2, but the embodiments described herein are not limited thereto.

[0133] The second semiconductor layer 133 may be disposed on the fourth insulating layer 106. The second semiconductor layer 133 may include a source region, a drain region, and a channel region between the source region and the drain region.

[0134] The second semiconductor layer 133 may include metal oxide semiconductors, such as indium gallium zinc oxide (IGZO), and silicon-based semiconductor materials, such as amorphous silicon, polycrystalline silicon, etc., but the embodiments described herein are not limited thereto.

[0135] The fifth insulating layer 108 may be disposed on the second semiconductor layer 133. The fifth insulating layer 108 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layers 105-1 and 105-2 or the fourth insulating layer 106, but the embodiments described herein are not limited thereto.

[0136] The second gate 132 may be disposed on the fifth insulating layer 108. The second gate 132 may be formed of the same material as the first gate 122. For example, the second gate 132 may be formed of a single layer or multiple layers of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd) or compounds thereof, but the embodiments described herein are not limited thereto.

[0137] The sixth insulating layer 109 may be disposed on the second gate 132. The sixth insulating layer 109 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layers 105-1 and 105-2, the fourth insulating layer 106 or the fifth insulating layer 108, but the embodiments described herein are not limited thereto.

[0138] The first source 121, the first drain 124, the second source 131, and the second drain 134 can be disposed on the sixth insulating layer 109.

[0139] The second source 131 and the second drain 134 may be formed of the same material as the first source 121 and the first drain 124, and disposed on the same layer as the first source 121 and the first drain 124, but the embodiments described herein are not limited thereto. For example, the second source 131 and the second drain 134 may be formed of a single layer or multiple layers, wherein the single layer or multiple layers are formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof, but the embodiments described herein are not limited thereto. For example, the second source 131 may be electrically connected to the second storage electrode 142. The second source 131 may pass through the sixth insulating layer 109, the fifth insulating layer 108, and the fourth insulating layer 106, and may be electrically connected to the second storage electrode 142.

[0140] The first thin-film transistor 120 may be a driving transistor, and the second thin-film transistor 130 may be a switching transistor, but the embodiments described herein are not limited thereto.

[0141] The first protective layer 111 can be disposed on the first source 121, the first drain 124, the second source 131, and the second drain 134.

[0142] The first protective layer 111 can planarize the upper portions of the first thin-film transistor 120 and the second thin-film transistor 130 and protect the first thin-film transistor 120 and the second thin-film transistor 130. The first protective layer 111 can be formed of an organic material. For example, the first protective layer 111 can be formed of an organic material comprising acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, but the embodiments described herein are not limited thereto.

[0143] The second protective layer 112 may be disposed on the first protective layer 111. The second protective layer 112 may be formed of the same material as the first protective layer 111, but the embodiments described herein are not limited thereto.

[0144] In some embodiments, a third protective layer may be provided on the upper surface of the second protective layer 112, but the embodiments described herein are not limited thereto.

[0145] The connecting electrode 145 can be disposed between the first protective layer 111 and the second protective layer 112.

[0146] The connecting electrode 145 can electrically connect the first thin-film transistor 120 to the light-emitting part 150. The connecting electrode 145 can be formed of the same material as the first source 121 and the first drain 124, but the embodiments described in this specification are not limited thereto.

[0147] The connecting electrode 145 may be formed of a single layer or multiple layers, which are made of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof, but the embodiments described in this specification are not limited thereto.

[0148] The light-emitting part 150 may be disposed on the second protective layer 112. The light-emitting part 150 may include a first electrode 151, an organic layer 152, and a second electrode 153. The embodiments described in this specification are not limited thereto, but the first electrode 151 may be used as an anode and the second electrode 153 may be used as a cathode.

[0149] The first electrode 151 can be disposed on the second protective layer 112. The first electrode 151 can be electrically connected to the connecting electrode 145 and the first thin-film transistor 120 through contact holes formed in the second protective layer 112.

[0150] The first electrode 151 may be a reflective electrode for reflecting light, but the embodiments described herein are not limited thereto. The first electrode 151 may include a metallic material with high reflectivity, such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and indium tin oxide (ITO) (ITO / Al / ITO), or an APC alloy, and may be formed from a single layer or multiple layers, but the embodiments described herein are not limited thereto.

[0151] The organic layer 152 may be disposed on the first electrode 151. The organic layer 152 may include one or more light-emitting structures (or light-emitting elements or components) stacked on the first electrode 151 in the order of hole transport layer and electron transport layer or in the reverse order.

[0152] For example, a hole transport layer may include a hole transport layer, a hole injection layer, an electron blocking layer, a p-type charge generation layer, etc., but the embodiments described in this specification are not limited to these. For example, an electron transport layer may include an electron transport layer, an electron injection layer, a hole blocking layer, an n-type charge generation layer, etc., but the embodiments described in this specification are not limited to these.

[0153] The organic layer 152 can be an organic light-emitting layer, an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro light-emitting diode, a miniature light-emitting diode, etc., but the embodiments described in this specification are not limited to these.

[0154] For example, the organic layer 152 of the display panel 100 according to one embodiment of this specification may include an organic light-emitting layer. The organic layer 152 may include a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer. The organic layer 152 may be a white light-emitting layer, but the embodiments described herein are not limited thereto. The specific structure of the organic layer 152 according to one embodiment will be described below.

[0155] Figure 7 yes Figure 6 A detailed cross-sectional view of the light-emitting part.

[0156] Reference Figure 7 The light-emitting part 150 can be set across the first sub-pixel PX1, the second sub-pixel PX2 and the third sub-pixel PX3.

[0157] The thickness of the light-emitting portion 150 in each sub-pixel PX1, PX2 or PX3 may be different, but the embodiments described herein are not limited thereto, and the thickness of the light-emitting portion 150 in each sub-pixel PX1, PX2 or PX3 may be the same.

[0158] Organic layer 152 may include a first organic layer 152a disposed in the first sub-pixel PX1, a second organic layer 152b disposed in the second sub-pixel PX2, and a third organic layer 152c disposed in the third sub-pixel PX3. The light-emitting layers EML1, EML2, and EML3 of organic layers 152a, 152b, and 152c may be physically separated, but the lower and upper layers of light-emitting layers EML1, EML2, and EML3 may be integrally formed across sub-pixels PX1, PX2, and PX3. The thickness of each light-emitting layer EML1, EML2, or EML3 may be different. For example, the thickness of the first light-emitting layer EML1 may be the largest, the thickness of the second light-emitting layer EML2 may be the second largest, and the thickness of the third light-emitting layer EML3 may be the smallest, but the embodiments described in this specification are not limited thereto.

[0159] A hole injection layer HIL can be disposed on the first electrode 151. The hole injection layer HIL can be located between the first electrode 151 and the light-emitting layers EML1, EML2, and EML3. The hole injection layer HIL can be integrally formed across sub-pixels PX1, PX2, and PX3. For example, the hole injection layer HIL can be formed of a hole injection material selected from MTDATA, CuPc, TCTA, NPB (NPD), HATCN, TDAPB, PEDOT / PSS, F4TCNQ, N-(biphenyl-4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazol-3-yl)phenyl)-9H-fluorene-2-amine, etc., but the embodiments described in this specification are not limited to this.

[0160] The hole transport layer (HTL) can be disposed on the hole injection layer (HIL). The hole transport layer (HTL) can be located between the hole injection layer (HIL) and the light emission layers (EML1, EML2, and EML3). The hole transport layer (HTL) can be integrally formed across sub-pixels (PX1, PX2, and PX3). The hole transport layer (HTL) can be formed from one or more of the following: aryl amine-based materials, such as NPB (N,N-naphthyl-N,N'-phenylbenzidine), TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine), PPD, TTBND, FFD, p-dmDPS, and TAPC; star-shaped aromatic amine-based materials, such as TCTA, PTDATA, TDAPB, TDBA, 4-a, and TCTA; and spiro and ladder-shaped materials, such as spiro-TPD, spiro-mTTB, and spiro-2, NPD (N,N-dinaphthyl-N,N'-diphenylbenzidine), s-TAD, and MTDATA (4,4',4”-tris(N-3-methylphenyl-N-phenylamino)triphenylamine)-N-phenyl-amino, but the embodiments described herein are not limited thereto.

[0161] The light-emitting layers EML1, EML2, and EML3 can be disposed on the hole transport layer HTL. The first light-emitting layer EML1 can be disposed in the first sub-pixel PX1, the second light-emitting layer EML2 can be disposed in the second sub-pixel PX2, and the third light-emitting layer EML3 can be disposed in the third sub-pixel PX3.

[0162] The thickness of each emitting layer, EML1, EML2, or EML3, can be different. For example, the first emitting layer, EML1, can be 600 angstroms to 800 angstroms (10⁻⁶). -10 The second luminescent layer, EML2, can be formed with a thickness of 300 to 500 angstroms (10 meters). -10 The third luminescent layer, EML3, is formed with a thickness of 100 angstroms to 300 angstroms (10 meters). -10 The thickness is formed to a thickness of (meters), but the embodiments described in this specification are not limited thereto.

[0163] Each of the first luminescent layer EML1, the second luminescent layer EML2, and the third luminescent layer EML3 may include a material that can emit light in the visible light range by receiving holes and electrons and recombinizing them.

[0164] The hole blocking layer (HBL) can be set on each emissive layer EML1, EML2, or EML3. The hole blocking layer (HBL) can also be set uniformly across sub-pixels PX1, PX2, and PX3.

[0165] An electron transport layer (ETL) can be disposed on a hole blocking layer (HBL). The ETL can be integrally disposed across sub-pixels PX1, PX2, and PX3. The ETL can be formed from anthracene derivatives and lithium quinoline (Liq), or from one or more of diazoles, triazoles, phenanthrene, benzo[2]azole, benzo[2]thiazole, or benzimidazole (e.g., 2-[4-(9,10-di-2-naphthyl-2-anthrayl)phenyl]-1-phenyl-1H-benzimidazole), but the embodiments described herein are not limited thereto.

[0166] The second electrode 153 can be disposed on the electron transport layer (ETL).

[0167] Figure 8 This is a detailed cross-sectional view of the light-emitting part in the modified example.

[0168] Reference Figure 7 and Figure 8 The organic layer 152_1 may include a first organic layer 152a_1 disposed in the first sub-pixel PX1, a second organic layer 152b_1 disposed in the second sub-pixel PX2, and a third organic layer 152c_1 disposed in the third sub-pixel PX3.

[0169] The light-emitting layers of each organic layer 152a_1, 152b_1, or 152c_1 can be physically separated, but the lower and upper layers of the light-emitting layers can be integrally formed across sub-pixels PX1, PX2, and PX3. The thickness of each light-emitting layer can be different. For example, the thickness of the first light-emitting layer of the first sub-pixel can be the largest, the thickness of the second light-emitting layer of the second sub-pixel can be the second largest, and the thickness of the third light-emitting layer of the third sub-pixel can be the smallest, but the embodiments described in this specification are not limited to this. Furthermore, the light-emitting layers of each organic layer 152a_1, 152b_1, or 152c_1 can be configured as two or more light-emitting layers.

[0170] A hole injection layer HIL can be disposed on the first electrode 151. The hole injection layer HIL can be located between the first electrode 151 and the light-emitting layers EML1a, EML2a, and EML3a. The hole injection layer HIL can be integrally formed across sub-pixels PX1, PX2, and PX3. For example, the hole injection layer HIL can be formed of a hole injection material selected from MTDATA, CuPc, TCTA, NPB (NPD), HATCN, TDAPB, PEDOT / PSS, F4TCNQ, N-(biphenyl-4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazol-3-yl)phenyl)-9H-fluorene-2-amine, etc., but the embodiments described in this specification are not limited thereto.

[0171] The first hole transport layer HTL1 can be disposed on the hole injection layer HIL. The first hole transport layer HTL1 can be located between the hole injection layer HIL and the light emission layers EML1a, EML2a and EML3a. The first hole transport layer HTL1 can be integrally formed across sub-pixels PX1, PX2 and PX3. The first hole transport layer HTL1 may be formed of one or more of the following: aryl amine-based materials, such as NPB (N,N-naphthyl-N,N'-phenylbenzidine), TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine), PPD, TTBND, FFD, p-dmDPS, and TAPC; star-shaped aromatic amine-based materials, such as TCTA, PTDATA, TDAPB, TDBA, 4-a, and TCTA; and spiro and ladder-shaped materials, such as spiro-TPD, spiro-mTTB, spiro-2, NPD (N,N-dinaphthyl-N,N'-diphenylbenzidine), s-TAD, and MTDATA (4,4',4”-tris(N-3-methylphenyl-N-phenylamino)). However, the embodiments described in this specification are not limited thereto.

[0172] Emitting layers EML1a, EML2a, and EML3a can be disposed on the first hole transport layer HTL1. The first-1 emitting layer EML1a can be disposed in the first sub-pixel PX1, the second-1 emitting layer EML2a can be disposed in the second sub-pixel PX2, and the third-1 emitting layer EML3a can be disposed in the third sub-pixel PX3. Each of the emitting layers EML1a, EML2a, and EML3a can be coupled with… Figure 7 Each of the light-emitting layers EML1, EML2 and EML3 is the same.

[0173] The thickness of each emitting layer EML1a, EML2a, or EML3a can be different. For example, the thickness of the first emitting layer EML1a can be 600 to 800 angstroms (10⁻⁶). -10 The second luminescent layer, EML2a, can be formed with a thickness of 300 to 500 angstroms (10 meters). -10 The third luminescent layer, EML3a, can be formed with a thickness of 100 to 300 angstroms (10 meters). -10 The thickness is formed to a thickness of (meters), but the embodiments described in this specification are not limited thereto.

[0174] The first hole blocking layer HBL1 can be disposed on each emissive layer EML1a, EML2a or EML3a. The first hole blocking layer HBL1 can be integrally formed across sub-pixels PX1, PX2 and PX3.

[0175] The first electron transport layer ETL1 may be disposed on the first hole blocking layer HBL1. The first electron transport layer ETL1 may be integrally formed across sub-pixels PX1, PX2, and PX3. The first electron transport layer ETL1 may be formed from anthracene derivatives and lithium quinoline (Liq), or from one or more of diazoles, triazoles, phenanthrene, benzo[2]azole, benzo[2]thiazole, or benzimidazole (e.g., 2-[4-(9,10-di-2-naphthyl-2-anthrayl)phenyl]-1-phenyl-1H-benzimidazole), but the embodiments described herein are not limited thereto.

[0176] A common charge layer CGL may be disposed on the first electron transport layer ETL1. The common charge layer CGL may be disposed between the first electron transport layer ETL1 and the second hole transport layer HTL2. The common charge layer CGL may include a conductive material, but embodiments of this disclosure are not limited thereto.

[0177] The second hole transport layer HTL2 can be disposed on the common charge layer CGL. The second hole transport layer HTL2 can be disposed between the hole blocking layer HBL and the light-emitting layers EML1b, EML2b, and EML3b. The second hole transport layer HTL2 can be integrally formed across sub-pixels PX1, PX2, and PX3. The material of the second hole transport layer HTL2 can be the same as the material of the first hole transport layer HTL1, but the embodiments described in this specification are not limited thereto.

[0178] Emitting layers EML1b, EML2b, and EML3b can be disposed on the second hole transport layer HTL2. The first-second emitting layer EML1b can be disposed in the first sub-pixel PX1, the second-second emitting layer EML2b can be disposed in the second sub-pixel PX2, and the third-second emitting layer EML3b can be disposed in the third sub-pixel PX3. Each of the emitting layers EML1b, EML2b, and EML3b can be identical to each of the emitting layers EML1a, EML2a, and EML3a.

[0179] The thickness of each emitting layer EML1b, EML2b, or EML3b can be different. For example, the thickness of the first and second emitting layers EML1b can be between 600 angstroms and 800 angstroms (10⁻⁶). -10 The second-second luminescent layer, EML2b, is formed with a thickness of 300 to 500 angstroms (10 meters). -10 The third-second luminescent layer, EML3b, is formed with a thickness of 100 angstroms to 300 angstroms (10 meters). -10 The thickness is formed to a thickness of (meters), but the embodiments described in this specification are not limited thereto.

[0180] The second hole blocking layer HBL2 can be disposed on each emissive layer EML1b, EML2b, or EML3b. The second hole blocking layer HBL2 can be integrally formed across sub-pixels PX1, PX2, and PX3.

[0181] The second electron transport layer ETL2 can be disposed on the second hole blocking layer HBL2. The second electron transport layer ETL2 can be integrally formed across sub-pixels PX1, PX2, and PX3. The second electron transport layer ETL2 can be formed from anthracene derivatives and lithium quinoline (Liq), or from one or more of diazoles, triazoles, phenanthrene, benzo[2]azole, benzo[2]thiazole, or benzimidazole (e.g., 2-[4-(9,10-di-2-naphthyl-2-anthrayl)phenyl]-1-phenyl-1H-benzimidazole), but the embodiments described herein are not limited thereto.

[0182] The second electrode 153 can be disposed on the second electron transport layer ETL2.

[0183] Return to reference Figure 6 The second electrode 153 may be disposed on the organic layer 152. The second electrode 153 may be a transparent electrode that transmits light, but the embodiments described herein are not limited thereto. For example, the second electrode 153 may include a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO), or a metal that transmits visible light, but the embodiments described herein are not limited thereto.

[0184] The embankment 154 can be configured to expose the first electrode 151. The embankment 154 can be configured to define the light-emitting regions EA (EA1, EA2 and EA3) of sub-pixels PX1, PX2 and PX3 and cover the edge portion (or periphery) of the first electrode 151.

[0185] The non-luminous region NEA can be set around the luminous region EA. The embankment 154 can be set in the non-luminous region NEA.

[0186] The light-emitting area EA may include a first light-emitting area EA1, a second light-emitting area EA2, and a third light-emitting area EA3 respectively disposed in sub-pixels PX1, PX2, and PX3. The non-light-emitting area NEA may include a first non-light-emitting area NEA1, a second non-light-emitting area NEA2, and a third non-light-emitting area NEA3 respectively disposed around the light-emitting areas EA1, EA2, and EA3.

[0187] In other words, the first sub-pixel PX1 may include a first luminous region EA1 and a first non-luminous region NEA1 surrounding the first luminous region EA1; the second sub-pixel PX2 may include a second luminous region EA2 and a second non-luminous region NEA2 surrounding the second luminous region EA2; and the third sub-pixel PX3 may include a third luminous region EA3 and a third non-luminous region NEA3 surrounding the third luminous region EA3. That is, each non-luminous region NEA1, NEA2, or NEA3 may correspond to the boundary between adjacent sub-pixels PX1, PX2, and PX3.

[0188] The embankment 154 may include hydrophilic organic materials and / or hydrophobic organic materials.

[0189] For example, the dam portion 154 can be formed of an organic material, such as benzocyclobutene resin, polyimide resin, acrylic resin, photosensitive polymer, etc. However, the embodiments described herein are not limited to this, and the dam portion 154 may also include a black-based material. For example, the dam portion 154 can be formed of a material containing black pigment or an organic material such as benzocyclobutene resin, polyimide resin, acrylic resin, photosensitive polymer, etc., but the embodiments described herein are not limited to this. When the dam portion 154 is formed of a material containing black pigment or black dye, the dam portion 154 can be an opaque dam portion. When the dam portion 154 is formed of a material containing black pigment or black dye, it can shield external light or light reflected from the outside, thereby further improving the brightness of the display device.

[0190] The barrier RAS can be further installed on the embankment 154. For example... Figure 6 As shown, the barrier RAS can be disposed at all boundaries between sub-pixels PX1, PX2, and PX3 (within the non-light-emitting regions NEA (NEA1, NEA2, and NEA3)), but the embodiments described herein are not limited to this. The barrier RAS can be disposed directly on the upper surface of the embankment 154, but the embodiments described herein are not limited to this. The barrier RAS can be used to separate the organic layer 152 from the boundaries of adjacent sub-pixels PX1, PX2, and PX3. In some embodiments, the barrier can be omitted, and grooves can be formed in the embankment 154. The grooves can cause the embankment 154 to be recessed in the thickness direction.

[0191] Spacers 155 may be further disposed on the embankment 154. Spacers 155 may be formed of the same material as the embankment 154, but embodiments described herein are not limited thereto. For example, spacers 155 may be transparent embankments, but are not limited thereto, and spacers 155 may be formed of the same material as the embankment 154. For example, spacers 155 may be disposed on at least one of the boundaries of the first to third sub-pixels PX1, PX2, and PX3, but embodiments described herein are not limited thereto. The embankment 154 and spacers 155 may be formed of the same material and simultaneously formed using a halftone mask, but embodiments described herein are not limited thereto.

[0192] The organic layer 152 can be disposed on the first electrode 151, the embankment 154, and the spacer 155. The second electrode 153 can be disposed on the organic layer 152.

[0193] The encapsulation portion 170 may be disposed on the second electrode 153. The encapsulation portion 170 may include one or more insulating layers. For example, the encapsulation portion 170 may include a first encapsulation layer 171, a second encapsulation layer 172 disposed on the first encapsulation layer 171, and a third encapsulation layer 173 disposed on the second encapsulation layer 172. The encapsulation portion 170 may include one or more inorganic insulating material layers and one or more organic material layers. For example, the first encapsulation layer 171 and the third encapsulation layer 173 may include inorganic insulating materials, and the second encapsulation layer 172 may include organic materials, but the embodiments described herein are not limited thereto.

[0194] The touch portion 180 may be disposed on the encapsulation portion 170. The touch portion 180 may include a touch buffer layer 181, a first touch conductive layer, a first touch insulating layer 183, a second touch insulating layer 184, and a second touch conductive layer. In some embodiments, one or more touch organic layers may also be disposed on the second touch conductive layer, but the embodiments described herein are not limited thereto.

[0195] Figure 9 It is based on Figure 6 A cross-sectional view of the touch portion.

[0196] Reference Figure 6 and Figure 9 The touch buffer layer 181 may be disposed on the encapsulation portion 170. For example, the touch buffer layer 181 may be disposed on the third encapsulation layer 173. The touch buffer layer 181 may be formed of the same material as the buffer layer 102, but the embodiments described herein are not limited thereto.

[0197] A first touch conductive layer may be disposed on the touch buffer layer 181. The first touch conductive layer may include a bridging electrode 182. The bridging electrode 182 and sensor electrode 185, which will be described below, may be disposed at each of the boundaries between adjacent sub-pixels PX1, PX2, and PX3. For example, the bridging electrode 182 and sensor electrode 185 may be disposed in non-light-emitting areas NEA1, NEA2, and NEA3. The bridging electrode 182 and sensor electrode 185 may overlap with the black background BM, which will be described below, in the thickness direction. The black background BM may cover the bridging electrode 182 and sensor electrode 185. Therefore, the visibility of the bridging electrode 182 and sensor electrode 185 from the outside can be prevented or reduced.

[0198] A first touch insulating layer 183 and a second touch insulating layer 184 disposed on the first touch insulating layer 183 can be disposed on the first touch conductive layer. The first touch insulating layer 183 and the second touch insulating layer 184 disposed on the first touch insulating layer 183 can prevent short circuits between the first touch conductive layer and the second touch conductive layer. The first touch insulating layer 183 can be made of silicon oxide (SiO2). x ), silicon nitride (SiN) x The second touch insulating layer 184 may be formed in multiple layers, but the embodiments described herein are not limited thereto. The second touch insulating layer 184 may include an organic insulating material, but the embodiments described herein are not limited thereto, and the second touch insulating layer 184 may include the same material as the first touch insulating layer 183.

[0199] The second touch conductive layer may be disposed on the second touch insulating layer 184. The second touch conductive layer may include a first sensor electrode 185a and a second sensor electrode 185b. The sensor electrode 185a may be disposed in a first direction DR1 (see...). Figure 1 The first sensor electrode 185a extends on the first direction DR1 and in the second direction DR2 (see) which is different from the first direction DR1. Figure 1 The second sensor electrode 185b extends from the top.

[0200] The bridging electrode 182 can be electrically connected to the first sensor electrode 185a through contact holes formed in the first touch insulating layer 183 and the second touch insulating layer 184. For example, the first sensor electrode 185a and the bridging electrode 182 can be connected in the first direction DR1 (see...). Figure 1 Extending upwards.

[0201] The sensor electrode 185 and the bridging electrode 182 may comprise metallic materials. For example, the sensor electrode 185 and the bridging electrode 182 may be formed of titanium (Ti), nickel (Ni), aluminum (Al), or alloys thereof, and may be formed of a three-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti), but the embodiments described herein are not limited thereto.

[0202] Return to reference Figure 6 The filter insulating layer 114 can be disposed on the sensor electrode 185. The filter insulating layer 114 can be formed of an inorganic insulating material, such as silicon nitride (SiN). x ) or silicon oxide (SiO) x However, the implementation methods described in this specification are not limited thereto.

[0203] The black background BM can be disposed on the filter insulating layer 114. The black background BM can include a black base material. For example, the black background BM can include a light-blocking material or a light-absorbing material. For example, the black background BM can be formed of a material including black pigment, black dye, etc. The black background BM can cover the bridging electrode 182 and the sensor electrode 185. Therefore, the bridging electrode 182 and the sensor electrode 185 can be prevented or reduced from being visible from the outside. For example, the width of the black background BM can be smaller than the width of the embankment 154.

[0204] For example, the distance between the end of the black background BM and the boundary between the luminous areas EA1, EA2, and EA3 and the non-luminous areas NEA1, NEA2, and NEA3 can be longer than the distance between the end of the embankment 154 and the boundary between the luminous areas EA1, EA2, and EA3 and the non-luminous areas NEA1, NEA2, and NEA3. The end of the embankment 154 can be aligned with the boundary between the luminous areas EA1, EA2, and EA3 and the non-luminous areas NEA1, NEA2, and NEA3, but the embodiments described in this specification are not limited to this. In the case of the display panel 100 according to one embodiment, since the embankment 154 may include a black base material, and the distance between the end of the black background BM and the boundary between the light-emitting areas EA1, EA2, and EA3 and the non-light-emitting areas NEA1, NEA2, and NEA3 can be longer than the distance between the end of the embankment 154 and the boundary between the light-emitting areas EA1, EA2, and EA3 and the non-light-emitting areas NEA1, NEA2, and NEA3, the light emitted from the light-emitting areas EA1, EA2, and EA3 can be emitted upward at a greater viewing angle than the distance between the end of the black background BM and the boundary between the light-emitting areas EA1, EA2, and EA3 and the non-light-emitting areas NEA1, NEA2, and NEA3. Therefore, the reduction in brightness according to the viewing angle can be minimized or reduced. However, when the distance between the end of the black base BM and the boundary between the light-emitting areas EA1, EA2, and EA3 and the non-light-emitting areas NEA1, NEA2, and NEA3 can be greater than the distance between the end of the dam 154 and the boundary between the light-emitting areas EA1, EA2, and EA3 and the non-light-emitting areas NEA1, NEA2, and NEA3, and the dam 154 is formed only of transparent material, light incident from the outside may be reflected by the dam 154, resulting in visible ring spots. However, in the case of the display panel 100 according to one embodiment, light incident from the outside can be absorbed or blocked by the dam 154, which includes a black base material, thereby preventing or reducing the occurrence of ring spots.

[0205] Color filters 191, 192, and 193 can be disposed on a black background BM. Color filters 191, 192, and 193 can be disposed on the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3, respectively, and can block specific colors of light emitted from the light-emitting areas EA1, EA2, and EA3 of sub-pixels PX1, PX2, and PX3. A first color filter 191 can be provided to block light of colors other than red (R) light. In this case, the first color filter 191 can be configured as a red color filter. A second color filter 192 can be provided to block light of colors other than green (G) light. In this case, the second color filter 192 can be configured as a green color filter. A third color filter 193 disposed in the third sub-pixel PX3 can be configured to block light of colors other than blue (B) light. In this case, the third color filter 193 can be configured as a blue color filter. However, the embodiments described in this specification are not limited to these.

[0206] For example, each color filter 191, 192, or 193 may be in direct contact with the side and top surfaces of the black background BM. For example, each color filter 191, 192, or 193 may be spaced apart from the boundaries of adjacent sub-pixels PX1, PX2, and PX3, but the embodiments described herein are not limited thereto, and color filters 191, 192, and 193 may overlap each other in the thickness direction.

[0207] A planarization layer OC can be disposed on color filters 191, 192, and 193. The planarization layer OC can be used to planarize the steps formed by color filters 191, 192, and 193. For example, the planarization layer OC may include an organic insulating material.

[0208] In the following text, the transmission region TA of the first optical region DA1 will be described. For the description of the transmission region TA, the same reference numerals are given as to the content described in the pixel region PA, and overlapping content may be omitted or briefly described.

[0209] Figure 10 It is along Figure 5 A cross-sectional view of line B-B'. Figure 11 yes Figure 10 A magnified view of region Q1 in the image.

[0210] Reference Figure 5 , Figure 6 , Figure 10 and Figure 11The first thin-film transistor 120, the second thin-film transistor 130, the storage capacitor 140, the light-emitting part 150, and the color filters 191, 192, and 193 may not be disposed in the transmission region TA. The insulating layer disposed between the substrate 101 and the light-emitting part 150, the encapsulation part 170, the touch insulating layer, and the planarization layer OC may be disposed in the transmission region TA.

[0211] A trench TR can be provided in the transmission region TA. The trench TR can be defined by a dam 154. The trench TR can be formed by recessing the dam 154 in the thickness direction. The trench TR can be formed such that the dam 154 is recessed to penetrate in the thickness direction. In this case, the trench TR can expose the second protective layer 112.

[0212] The first electrode 151 and the organic layer 152 of the light-emitting part 150 are not disposed in the transmission region TA, but the second electrode 153 may be disposed therein.

[0213] The embankment 154 may include a first embankment layer BK1 and a second embankment layer BK2 disposed on the first embankment layer BK1, and the first embankment layer BK1 and the second embankment layer BK2 have different properties. The first embankment layer BK1 may include a hydrophilic organic material, and the second embankment layer BK2 may include a hydrophobic organic material.

[0214] For example, the first diaphragm layer BK1 can be formed from organic materials such as polyimide resin, hydrophilic acrylic resin, photosensitive polymer, etc. However, the embodiments described herein are not limited to this, and the first diaphragm layer BK1 may also include a black base material. For example, the first diaphragm layer BK1 can be formed from a material containing black pigment or organic materials such as benzocyclobutene resin, polyimide resin, acrylic resin, photosensitive polymer, etc., but the embodiments described herein are not limited to this. When the first diaphragm layer BK1 is formed from a material containing black pigment, black dye, etc., the first diaphragm layer BK1 can be an opaque diaphragm. When the first diaphragm layer BK1 is formed from a material containing black pigment or black dye, it can shield external light or light reflected from the outside, thereby further improving the brightness of the display device.

[0215] For example, the second dam layer BK2 can be formed of polystyrene, polymethyl methacrylate (PMMA), benzocyclobutene series resins, siloxane resins, silane resins, hydrophobic acrylic resins, etc. The second dam layer BK2 can also include black materials. For example, the second dam layer BK2 can also include black pigments, etc.

[0216] The first embankment layer BK1 can be set across the entire area of ​​the non-emitting region NEA. The first embankment layer BK1 can be set within the pixel region PA.

[0217] The second embankment layer BK2 can be set adjacent to the trench TR around the trench TR. The second embankment layer BK2 can also be set on top of the first embankment layer BK1 around the trench TR.

[0218] The second embankment layer BK2 can be disposed on the first embankment layer BK1, disposed in the non-light-emitting region NEA, and disposed along the boundary between the transmissive region TA and the pixel region PA.

[0219] The height h1 of the upper surface of the second dam layer BK2 can be lower than the height h2 of the upper surface of the spacer 155. Therefore, even when the second dam layer BK2 is disposed on the first dam layer BK1, defects during FMM mask deposition can be suppressed or prevented. Here, the upper surface of the second dam layer BK2 may refer to the surface opposite to the encapsulation portion 170.

[0220] The height h3 of the upper surface of the first embankment layer BK1 in the region where the second embankment layer BK2 is provided may be lower than the height h4 of the upper surface of the first embankment layer BK1 in the region where the second embankment layer BK2 is not provided, but the embodiments described herein are not limited to this.

[0221] Here, each height h1, h2, h3, or h4 can refer to the height from the upper surface of the second protective layer 112. The upper surface of the second protective layer 112 can refer to the surface facing the first embankment layer BK1.

[0222] The embodiments described in this specification are not limited to this, but can be formed by using halftone masks, slits, etc., during the process of forming the first embankment layer BK1 to form the first embankment layer BK1 with different heights.

[0223] The first embankment layer BK1 may include a first sidewall SW1 defining the light-emitting region EA and a second sidewall SW2 defining the trench TR.

[0224] The first sidewall SW1 and the second sidewall SW2 of the first embankment layer BK1 can be disposed between one surface and another surface of the first embankment layer BK1 to connect one surface and the other surface of the first embankment layer BK1. Here, one surface of the first embankment layer BK1 can refer to the surface facing the second protective layer 112, and the other surface of the first embankment layer BK1 can refer to the surface opposite to that one surface. In this case, the second embankment layer BK2 can be disposed on the other surface of the first embankment layer BK1.

[0225] At least a portion of the second embankment layer BK2 can be exposed by the organic layer 152. The portion of the second embankment layer BK2 exposed by the organic layer 152 can be in direct contact with the second electrode 153.

[0226] The first sidewall SW1 of the first embankment layer BK1 can be formed into a positive cone shape, and the second sidewall SW2 can be formed into an inverted cone shape.

[0227] The organic layer 152 and the second electrode 153 can be sequentially disposed on the first sidewall SW1. The first sidewall SW1 can be in direct contact with the organic layer 152. Since the organic layer 152 can be disposed between the first sidewall SW1 and the second electrode 153, the first sidewall SW1 may not be in contact with the second electrode 153.

[0228] The organic residue DM and the second electrode 153 can be disposed on the second sidewall SW2. The second sidewall SW2 can be in direct contact with the organic residue DM and the second electrode 153. The second sidewall SW2 can be in direct contact with the organic residue DM in some areas, and the organic residue DM can be disposed between the second sidewall SW2 and the second electrode 153. The second sidewall SW2 can be in direct contact with the second electrode 153 in other areas.

[0229] The organic residue DM may include the same material as the organic layer 152, and also includes a solvent material. For example, the solvent material may be at least one selected from 4-EGCol, DEGBE, TEGME, DEGEE, TPGME, TEG, EGHE, DPGPE, DEGBME, 1-PH-2-Pol, Carvacrol, 3-MBAol, TEGME, TEGIPE, TTEGME, DEGHE, 3-M-3-MBol, 2,6-DM-3,5-HDone, etc.

[0230] Organic residue DM can be separated from organic layer 152. Organic residue DM can be the residue remaining after organic layer 152 has been removed with a solvent material.

[0231] The organic residue DM can be disposed adjacent to the hydrophilic first embankment layer BK1. The organic residue DM can be disposed adjacent to the second sidewall SW2 of the first embankment layer BK1. The organic residue DM can be disposed between the first embankment layer BK1 and the second protective layer 112.

[0232] Organic residue DM may overlap with the first embankment layer BK1 and the second embankment layer BK2 in the thickness direction, but is not limited thereto.

[0233] At least a portion of the organic residue DM can be disposed in the pixel region PA. Specifically, the entire area of ​​the organic residue DM can be disposed in the pixel region PA, or a portion thereof can be disposed in the pixel region PA, and the remaining area can protrude from the pixel region PA and can be disposed in the transmission region TA.

[0234] By removing the organic layer 152 from the transmission region TA, the light transmittance of the transmission region TA can be increased, thus allowing the optical electronics S to receive external light more smoothly. Furthermore, because the optical electronics S can operate more smoothly, operational defects in the display device 1 can be suppressed or prevented.

[0235] The method of manufacturing the display device described herein will be described below. For components included in the method of manufacturing the display device and referenced herein... Figures 1 to 11 The content described is essentially the same, the same reference numerals are given, and overlapping content may be omitted or briefly described.

[0236] Figures 12 to 14 This is a view illustrating each process of a method for manufacturing a display device according to one embodiment.

[0237] Reference Figure 10 and Figure 12 A first thin-film transistor 120, a second thin-film transistor 130, a storage capacitor 140, and an insulating layer disposed between the substrate 101 and the light-emitting portion 150 are formed on the substrate 101.

[0238] The first electrode 151 is patterned on the second protective layer 112, and the dam 154 is patterned on the first electrode 151. During the process of patterning the dam 154, the first dam layer BK1 and the second dam layer BK2 can be processed separately. After the first dam layer BK1 is patterned, the second dam layer BK2 is patterned.

[0239] During the process of patterning the first embankment layer BK1, the first sidewall SW1 defining the light-emitting region EA can be patterned in a positive cone shape, and the second sidewall SW2 defining the trench TR can be patterned in an inverted cone shape.

[0240] After the embankment 154 is patterned, an organic layer 152 is coated. The organic layer 152 can be coated over the entire area of ​​the substrate 101, but is not limited thereto. In this case, the organic layer 152 can be disposed on the embankment 154 and inside the trench TR and on the first electrode 151 exposed by the light-emitting region EA.

[0241] Solvent material SV can be coated onto organic layer 152 disposed in trench TR. Solvent material SV can melt and remove organic layer 152. Organic layer 152 can be removed from transmission region TA by solvent material SV.

[0242] For example, the solvent material SV can be at least one selected from 4-EGCol, DEGBE, TEGME, DEGEE, TPGME, TEG, EGHE, DPGPE, DEGBME, 1-PH-2-Pol, carvacrol, 3-MBAol, TEGME, TEGIPE, TTEGME, DEGHE, 3-M-3-MBol, 2,6-DM-3,5-HDone, etc.

[0243] The second embankment layer BK2, disposed around the trench TR, can be formed of a hydrophobic material. Therefore, it is possible to suppress or prevent the solvent material SV from overflowing into adjacent areas (e.g., the light-emitting region EA) after the organic layer 152 is removed. Furthermore, it is possible to suppress or prevent light-emitting defects in sub-pixels PX1, PX2, and PX3.

[0244] Additionally, even when using the same FMM without changing the formation of the normal region NA (see... Figure 1 When the FMM of each of the first optical regions DA1 and DA1 is formed, regions with different PPIs can also be created. Furthermore, the manufacturing process of the display device can be optimized, thereby reducing production energy.

[0245] Subsequently, further reference Figure 13 The solvent material SV can be removed by vacuum drying (VCD) or similar methods. Even when the solvent material SV is removed, the organic residue DM remaining after the removal of the organic layer 152 can remain in the trench TR. The organic residue DM can be positioned adjacent to the hydrophilic second sidewall SW2 of the first embankment layer BK1.

[0246] Subsequently, referring to Figure 14 A second electrode 153 can be deposited on the organic layer 152. The second electrode 153 can be disposed across the entire area of ​​the substrate 101. The second electrode 153 can be disposed on the organic layer 152 in the light-emitting region EA, and on the second protective layer 112 exposed by the trench TR in the trench TR. The second electrode 153 can cover the organic residue DM.

[0247] Although not shown, the encapsulation portion 170, the touch portion 180, the filter insulating layer 114, the black base BM, the color filters 191, 192 and 193, and the planarization layer OC can be sequentially disposed on the second electrode 153.

[0248] Other embodiments of this specification will be described below. For components included in other embodiments and referenced... Figures 1 to 14 The content described is essentially the same, the same figure labels are given, and repeated content can be omitted or briefly described.

[0249] Figure 15This is a cross-sectional view of a display device according to another embodiment.

[0250] Reference Figure 15 The display panel 100_2 of the display device according to this embodiment includes a dam 154_2, and the dam 154_2 may also include a third dam layer BK3.

[0251] Specifically, the dike section 154_2 may include a first dike section layer BK1, a second dike section layer BK2, and a third dike section layer BK3. The third dike section layer BK3 may be disposed on the first dike section layer BK1. The third dike section layer BK3 may be disposed on the first dike section layer BK1 exposed by the second dike section layer BK2.

[0252] The third embankment layer BK3 can be disposed on the first embankment layer BK1 in the area where the second embankment layer BK2 is not disposed. The first embankment layer BK1 and the third embankment layer BK3 can form the side surface defining the light-emitting region EA, and the side surface defining the light-emitting region EA can have a positive conical shape.

[0253] The third embankment layer BK3 may include hydrophilic organic materials. The third embankment layer BK3 may include the same materials as the first embankment layer BK1, but is not limited to them.

[0254] In this case, the first embankment layer BK1 can have a constant height throughout the entire area. Since a separate process for forming the first embankment layer BK1 with varying heights is not required, the process can be further simplified.

[0255] Even in this case, the organic layer 152 can be omitted in the transmission region TA, thereby increasing the transmittance of the transmission region TA. Additionally, even when using the same FMM without changing the formation of the normal region NA (see...), the transmittance of the transmission region TA can still be increased. Figure 1 When the FMM of each of the first optical regions DA1 and DA1 is formed, regions with different PPIs can also be created. Furthermore, the manufacturing process of the display device can be optimized, thereby reducing production energy.

[0256] Figure 16 This is a cross-sectional view of a display device according to yet another embodiment.

[0257] Reference Figure 16 The display panel 100_3 of the display device according to this embodiment may also include a trench TR defined by the second electrode 153.

[0258] The second electrode 153 can be disposed in each trench TR, and the second electrode 153 can define an opening COP recessed in each trench TR along the thickness direction.

[0259] The trench TR can be formed to penetrate the embankment in the thickness direction. In this case, the trench TR can expose the second protective layer 112 underneath.

[0260] An opening COP can be set in each trench TR, and its entire area can be set in each trench TR, but the implementation of this specification is not limited thereto.

[0261] The first encapsulation layer 171 may be in direct contact with the second protective layer 112 in the open COP, but is not limited thereto.

[0262] At least a portion of the aperture COP can be disposed in the transmission region TA. Since the aperture COP is disposed in the transmission region TA, the light transmittance of the transmission region TA can be increased. Therefore, the optoelectronic device S can receive external light from the display device 1 more smoothly.

[0263] Even in this case, the organic layer 152 can be omitted in the transmission region TA, thereby increasing the transmittance of the transmission region TA. Additionally, even when using the same FMM without changing the formation of the normal region NA (see...), the transmittance of the transmission region TA can still be increased. Figure 1 When the FMM of each of the first optical regions DA1 and DA1 is formed, regions with different PPIs can also be created. Furthermore, the manufacturing process of the display device can be optimized, thereby reducing production energy.

[0264] The display device according to various embodiments of this specification can be described as follows.

[0265] According to embodiments of this specification, a display device is provided, the display device comprising: a substrate; a thin-film transistor disposed on the substrate; a protective layer disposed on the thin-film transistor; a first electrode disposed on the protective layer and electrically connected to the thin-film transistor; and a dam portion configured to span the first electrode and the protective layer and define a light-emitting area exposing the first electrode and a trench exposing the protective layer, wherein the dam portion defining the light-emitting area has a positive conical shape, and the dam portion defining the trench has an inverted conical shape.

[0266] The display device according to various embodiments of this specification may further include an organic layer disposed in the light-emitting region, an organic residue disposed in the trench and separated from the organic layer, and a second electrode disposed on the organic layer and the organic residue.

[0267] According to various embodiments of this specification, the organic residue may contain the same material as the organic layer.

[0268] According to various embodiments of this specification, the organic residue may also contain solvent materials.

[0269] According to various embodiments of this specification, the embankment may include: a first embankment layer comprising a hydrophilic organic material; and a second embankment layer disposed on the first embankment layer and comprising a hydrophobic organic material.

[0270] According to various embodiments of this specification, the first embankment layer may include a first sidewall defining a light-emitting area and a second sidewall defining a groove. The first sidewall may have a positive cone shape and the second sidewall may have an inverted cone shape.

[0271] According to various embodiments of this specification, the substrate may include a pixel region in which a light-emitting region is disposed and a transmissive region in which a trench is disposed, and a second embankment layer may be disposed around the trench and along the boundary between the pixel region and the transmissive region.

[0272] According to various embodiments of this specification, the transmittance of the transmissive region can be higher than that of the pixel region.

[0273] According to various embodiments of this specification, the embankment may further include spacers disposed on the embankment, and the height of the second embankment layer may be lower than the height of the spacers.

[0274] According to various embodiments of this specification, the embankment may further include a third embankment layer comprising a hydrophilic organic material, and the third embankment layer may be disposed on the first embankment layer exposed by the second embankment layer.

[0275] According to various embodiments of this specification, the substrate may define a transmission region and a pixel region with different light transmittances, the thin film transistor, the first electrode and the light-emitting region may be disposed in the pixel region, and the trench may be disposed in the transmission region.

[0276] According to various embodiments of this specification, each of the pixel region and the transmission region can be configured as multiple regions, the multiple pixel regions and the multiple transmission regions can have a Z-shaped shape and extend in a first direction, and the pixel regions and the transmission regions can be alternately and repeatedly configured in a second direction intersecting the first direction.

[0277] According to various embodiments of this specification, the substrate may also include a display area and a non-display area. The display area includes a normal area and an optical area. The non-display area is disposed around the display area. The display area may include a normal area and an optical area with a PPI lower than that of the normal area. The optical area may include a transmission area and a pixel area.

[0278] The display device according to various embodiments of this specification may further include an optical electronic device configured to overlap with the optical region below the substrate.

[0279] The display device according to various embodiments of this specification may further include an organic layer disposed in a pixel region and a second electrode disposed across a transmissive region and a pixel region, wherein the organic layer may be disposed on a first electrode exposed by a dam, and the second electrode may be disposed on the organic layer and a protective layer exposed by the dam.

[0280] According to embodiments of this specification, a display device is provided, comprising: a plurality of pixel regions, wherein a plurality of sub-pixels, including light-emitting regions and non-light-emitting regions, are disposed in the plurality of pixel regions; a plurality of transmissive regions, wherein grooves are disposed in the plurality of transmissive regions; and a dam, wherein the dam is disposed between the plurality of pixel regions and defines the light-emitting regions and the grooves, wherein the plurality of pixel regions and the plurality of transmissive regions extend in a first direction, the pixel regions and the transmissive regions are alternately and repeatedly disposed in a second direction intersecting the first direction, and the transmissive regions have a higher light transmittance than the pixel regions.

[0281] The display device according to various embodiments of this specification may further include: a display area including a normal area and an optical area; and a non-display area disposed around the display area, wherein the display area may include a normal area and an optical area having a lower PPI than the normal area, and the optical area may include a transmissive area and a pixel area.

[0282] According to various embodiments of this specification, the optical electronic device may be further configured to overlap with the optical region.

[0283] According to various embodiments of this specification, the embankment defining the light-emitting area may have a positive cone shape, and the embankment defining the trench may have an inverted cone shape.

[0284] The display device according to various embodiments of this specification may further include an organic layer disposed in the light-emitting region, and an organic residue disposed in the trench and separated from the organic layer, wherein the organic residue may include the same material and solvent material as the organic layer.

[0285] Although embodiments have been described above with reference to the accompanying drawings, those skilled in the art will understand that the above-described technical configurations can be implemented in other specific forms without altering their technical concept or essential characteristics. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and not restrictive. Furthermore, the scope of the embodiments is determined by the appended claims rather than the detailed description. Moreover, the meaning and scope of the claims, as well as all changes or modifications derived from their equivalents, should be interpreted as being included within the scope of the embodiments.

[0286] Explanation of reference numerals in the attached figures

[0287] 101: Substrate

[0288] 120: First Thin Film Transistor

[0289] 130: Second thin-film transistor

[0290] 140: Storage capacitor

[0291] 150: Light-emitting part

[0292] 151: First electrode

[0293] 152: Organic layer

[0294] EML: Emissive Layer

[0295] 153: Second electrode

[0296] 154: Embankment

[0297] BK: Embankment layer

[0298] 170: Packaging Department

[0299] EA: Emitting area

[0300] NEA: Non-luminescent area

[0301] TR: Trench

[0302] TA: Transmission area

[0303] PA: Pixel area

[0304] NA: Normal region

[0305] DA1, DA2: Optical regions

[0306] COP: Opening

[0307] S: Optical and electronic devices

[0308] Cross-references to related applications

[0309] This application claims priority to Korean Patent Application No. 10-2024-0173297, filed on November 28, 2024, the entire contents of which are incorporated herein by reference for all purposes.

Claims

1. A display device, the display device comprising: substrate; A thin-film transistor disposed on the substrate; A protective layer is disposed on the thin-film transistor; A first electrode is disposed on the protective layer and electrically connected to the thin-film transistor; as well as A dam portion is provided across the first electrode and the protective layer, and defines a light-emitting area exposing the first electrode and a trench exposing the protective layer. The embankment defining the luminescent area has a positive conical shape, and the embankment defining the trench has an inverted conical shape.

2. The display device according to claim 1, further comprising: An organic layer is disposed in the light-emitting region; Organic residue, which is disposed in the trench and separated from the organic layer; as well as The second electrode is disposed on the organic layer and the organic residue.

3. The display device according to claim 2, wherein, The organic residue includes the same material as the organic layer.

4. The display device according to claim 3, wherein, The organic residues also include solvent materials.

5. The display device according to claim 1, wherein, The embankment includes: a first embankment layer, the first embankment layer comprising a hydrophilic organic material; and A second embankment layer is disposed on the first embankment layer and includes a hydrophobic organic material.

6. The display device according to claim 5, wherein, The first embankment layer includes a first sidewall defining the light-emitting area and a second sidewall defining the trench, and The first sidewall has a positive cone shape, and the second sidewall includes an inverted cone shape.

7. The display device according to claim 6, wherein, The substrate includes a pixel region having the light-emitting region and a transmissive region having the trench. The second embankment layer is disposed around the trench and along the boundary between the pixel region and the transmission region.

8. The display device according to claim 7, wherein, The transmittance of the transmission region is higher than that of the pixel region.

9. The display device according to claim 5, further comprising a spacer disposed on the embankment, wherein, The height of the second embankment is lower than the height of the spacer.

10. The display device according to claim 5, wherein, The embankment also includes a third embankment layer, which comprises a hydrophilic organic material, and The third embankment layer is disposed on the first embankment layer exposed by the second embankment layer.

11. The display device according to claim 1, wherein, The substrate defines transmission regions and pixel regions with different light transmittances, and The thin-film transistor, the first electrode, and the light-emitting region are disposed in the pixel region, and the trench is disposed in the transmission region.

12. The display device according to claim 11, wherein, Both the pixel region and the transmission region are configured as multiple regions. Both the multiple regions of the pixel region and the multiple regions of the transmission region have a Z-shaped shape and extend in a first direction, and The pixel region and the transmissive region are alternately and repeatedly arranged in a second direction that intersects the first direction.

13. The display device according to claim 12, wherein, The substrate further includes a display area and a non-display area. The display area includes a normal area and an optical area, and the non-display area is disposed around the display area. The display area includes the normal area and the optical area having a lower pixel per inch (PPI) than the normal area. The optical region includes the transmission region and the pixel region.

14. The display device according to claim 13, further comprising an optical electronic device disposed below the substrate and overlapping the optical region.

15. The display device according to claim 11, further comprising: An organic layer, wherein the organic layer is disposed in the pixel region; And a second electrode, which is disposed across the transmission region and the pixel region. The organic layer is disposed on the first electrode exposed by the embankment, and The second electrode is disposed on the organic layer and the protective layer exposed by the dike.

16. A display device, the display device comprising: Multiple pixel regions, wherein multiple sub-pixels are provided in the multiple pixel regions; Multiple transmission regions, with grooves provided in the multiple transmission regions; as well as A dam portion is disposed between the plurality of pixel regions and defines a light-emitting area and the groove included in each of the plurality of pixel regions. The plurality of pixel regions and the plurality of transmissive regions extend in a first direction. The pixel region and the transmissive region are alternately and repeatedly arranged in a second direction intersecting the first direction, and The transmission region has a higher transmittance than the pixel region.

17. The display device according to claim 16, further comprising: The display area includes a normal area and an optical area; and a non-display area, which is disposed around the display area. The display area includes the normal area and the optical area having a lower pixel per inch (PPI) than the normal area. The optical region includes the transmission region and the pixel region.

18. The display device according to claim 17, further comprising an optical electronic device configured to overlap with the optical region.

19. The display device according to claim 16, wherein, The embankment defining the luminescent area has a positive conical shape, and the embankment defining the trench has an inverted conical shape.

20. The display device according to claim 16, further comprising: An organic layer is disposed in the light-emitting region; Organic residues, which are disposed in the trench and separated from the organic layer. The organic residue includes solvent materials and materials identical to those in the organic layer.

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