Display device

Abstract

A display device according to an embodiment of the disclosure can include a substrate, a first light emitting element disposed on the substrate, a second light emitting element disposed on the substrate and adjacent to the first light emitting element, an encapsulation layer disposed on the first light emitting element and the second light emitting element, a planarization layer disposed on the encapsulation layer, a black matrix disposed on the planarization layer and including a first opening and a second opening respectively corresponding to the first light emitting element and the second light emitting element, and a partition wall overlapping the black matrix and disposed on a side surface of at least one of the encapsulation layer and the planarization layer.

Description

Technical Field

[0001] Embodiments of this disclosure relate to a display device, and more specifically, for example, but not limited to, a display device capable of achieving narrow viewing angle characteristics. Background Technology

[0002] The development of a smart society has led to an increased demand for various types of display devices used to display images. For example, display devices are used in a variety of electronic devices such as smartphones, digital cameras, laptops, navigation systems, and smart TVs.

[0003] Display devices should meet the desired viewing angle level depending on the product type or usage scenario. However, achieving the desired viewing angle level is quite difficult for various reasons.

[0004] The descriptions provided in the Background section should not be considered prior art simply because they are mentioned in or associated with the Background section. The Background section may include information that describes one or more aspects of the subject matter. Summary of the Invention

[0005] Embodiments of this disclosure may provide a display device having a structure capable of achieving desired viewing angle characteristics.

[0006] Embodiments of this disclosure may provide a display device having a structure capable of achieving viewing angle characteristics in a display panel without the need to attach a separate film to the display panel for achieving the desired viewing angle characteristics.

[0007] In order to realize these and other aspects of the inventive concept, as implemented and broadly described herein, a display device according to embodiments of the present disclosure may include a substrate, a first light-emitting element disposed on the substrate, a second light-emitting element disposed on the substrate and adjacent to the first light-emitting element, and an encapsulation layer disposed on the first light-emitting element and the second light-emitting element.

[0008] The display device according to embodiments of the present disclosure may further include a planarization layer disposed on the encapsulation layer and a black matrix disposed on the planarization layer and including a first opening and a second opening.

[0009] The display device according to embodiments of the present disclosure may further include a first lens disposed between the encapsulation layer and the planarization layer and overlapping with the first opening.

[0010] The display device according to embodiments of the present disclosure may further include a second lens disposed between the encapsulation layer and the planarization layer and overlapping with a second opening corresponding to the second light-emitting element.

[0011] The display device according to embodiments of the present disclosure may further include a first color filter disposed on the black matrix and overlapping with the first opening, and a second color filter disposed on the black matrix and overlapping with the second opening.

[0012] The display device according to embodiments of the present disclosure may further include a partition wall overlapping the black matrix and disposed on the side surface of at least one of the encapsulation layer and the planarization layer.

[0013] In another aspect, the display device according to the embodiments of the present disclosure may include a substrate, a first light-emitting element disposed on the substrate, a second light-emitting element disposed on the substrate and adjacent to the first light-emitting element, and a dam disposed between the first light-emitting element and the second light-emitting element.

[0014] The display device according to embodiments of the present disclosure may further include a black matrix disposed on a first light-emitting element and a second light-emitting element and including a first opening and a second opening.

[0015] The display device according to embodiments of the present disclosure may further include a first color filter disposed on the black matrix and overlapping with the first opening, and a second color filter disposed on the black matrix and overlapping with the second opening.

[0016] The display device according to embodiments of the present disclosure may further include a first protrusion disposed between the first light-emitting element and the first color filter, overlapping with the first opening, and having a protruding upper surface.

[0017] The display device according to embodiments of the present disclosure may further include a second protrusion disposed between the second light-emitting element and the second color filter, overlapping with the second opening, and having a protruding upper surface.

[0018] The display device according to embodiments of the present disclosure may further include an organic partition wall disposed between the embankment and the black matrix and comprising organic material.

[0019] Additional features and aspects of this disclosure will be set forth in part in the description which follows, and in part will be apparent from the description or may be learned by practicing the inventive concept provided herein. Other features and aspects of the inventive concept may be realized and obtained by means of the structures pointed out in this disclosure (or derived therefrom) and the claims and drawings.

[0020] According to embodiments of the present disclosure, a display device may be provided having a structure capable of achieving desired viewing angle characteristics through a partition wall structure.

[0021] According to embodiments of the present disclosure, a display device may be provided having a structure that further facilitates the realization of desired viewing angle characteristics through a lens structure.

[0022] According to embodiments of the present disclosure, a display device can be provided having a structure capable of achieving viewing angle characteristics in a display panel without the need to attach a separate film to the display panel for achieving the desired viewing angle characteristics.

[0023] According to embodiments of this disclosure, viewing angle characteristics can be controlled in a desired manner without the need for a membrane attachment process, enabling process optimization.

[0024] According to embodiments of this disclosure, since the desired viewing angle characteristics can be achieved without an external film, the flexibility of the display panel can be enhanced, and the thickness can be further reduced.

[0025] It should be understood that both the foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0026] The accompanying drawings may be included to provide a further understanding of the present disclosure and may be incorporated into and constitute a part of the present disclosure. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the various principles of the present disclosure.

[0027] Figure 1 This is a diagram illustrating the system configuration of a display device according to an exemplary embodiment of the present disclosure;

[0028] Figure 2 A display device according to an exemplary embodiment of the present disclosure is illustrated;

[0029] Figure 3 This is a cross-sectional view illustrating a display panel according to an exemplary embodiment of the present disclosure;

[0030] Figure 4 This is a plan view illustrating a display panel according to an exemplary embodiment of the present disclosure;

[0031] Figures 5 to 12 This is a diagram illustrating the cross-sectional structure of a display panel according to an exemplary embodiment of the present disclosure;

[0032] Figures 13 to 16 This is a diagram illustrating the upper partition wall structure and the lower partition wall structure of a display panel according to an exemplary embodiment of the present disclosure;

[0033] Figure 17 This is a graph illustrating an example of a spectrum according to a wavelength band, based on an exemplary embodiment of the present disclosure;

[0034] Figure 18 This is a graph illustrating an example of the spectrum of an application according to the first partition wall in accordance with an exemplary embodiment of the present disclosure;

[0035] Figure 19 This is a graph illustrating an example of the spectrum of the first partition wall before and after application according to an exemplary embodiment of the present disclosure; and

[0036] Figure 20 This is a graph illustrating an example of the cutoff rate based on the viewing angle before and after the application of a first partition wall according to an exemplary embodiment of the present disclosure.

[0037] Throughout the accompanying drawings and detailed description, unless otherwise stated, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustrative purposes, and convenience, the relative dimensions and depictions of these elements may be exaggerated. Detailed Implementation

[0038] In the following description of examples or embodiments of this disclosure, reference will be made to the accompanying drawings, in which specific examples or embodiments that can be implemented are illustrated by way of example, and the same reference numerals and symbols may be used to refer to the same or similar components even in different drawings. Furthermore, in the following description of examples or embodiments of this disclosure, descriptions will be omitted where it is determined that a detailed description of a known function or component incorporated herein might obscure the subject matter of some embodiments of this disclosure. The described progression of processing steps and / or operations is illustrative; however, the order of steps and / or operations is not limited to the order set forth herein and may be varied as is known in the art, except for steps and / or operations that necessarily occur in a particular order. Similar reference numerals refer to similar elements throughout. The names of corresponding elements used in the following description may have been chosen solely for ease of specification and may therefore differ from the names used in actual products.

[0039] The advantages and features of this disclosure, and methods of implementation thereof, will be illustrated by the following exemplary embodiments described with reference to the accompanying drawings. However, this disclosure may be implemented in various forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided to make this disclosure thorough and complete enough to assist those skilled in the art in fully understanding its scope. Furthermore, this disclosure is limited only by the scope of the appended claims.

[0040] The shapes, dimensions, ratios, angles, and quantities of various exemplary embodiments of this disclosure illustrated in the accompanying drawings are given by way of example only. Therefore, this disclosure is not limited to the illustrations in the figures. Throughout this specification, like or similar elements are designated by the same reference numerals unless otherwise stated. Any implementation described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations.

[0041] Terms such as “including,” “having,” “comprising,” “forming,” “composed of,” and “formed by” as used herein are generally intended to allow for the addition of other components, unless these terms are used in conjunction with more restrictive terms such as “only.” As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise.

[0042] In this document, terms such as “first,” “second,” “A,” “B,” “(A),” or “(B)” may be used to describe elements of this disclosure. Each of these terms is not used to define the nature, order, sequence, or number of elements, but only to distinguish the corresponding element from other elements.

[0043] When referring to the first element as "connected to or linked to" or "in contact with or overlaps" the second element, it should be understood that not only can the first element be "directly connected to or linked to" or "directly in contact with or overlaps" the second element, but a third element can also be "inserted" between the first and second elements, or the first and second elements can be "connected to or linked to," "in contact with or overlaps" each other via a fourth element. Here, the second element may be included in at least one of two or more elements that are "connected to or linked to," "in contact with," or "overlap" each other.

[0044] When using time-relative terms such as “after,” “following,” “next,” “before,” etc., to describe the handling or operation of an element or configuration, or a process or step in an operation, handling, or manufacturing method, these terms may be used to describe discontinuous or non-sequential handling or operations unless used with more restrictive terms such as “direct” or “immediate.”

[0045] When describing positional relationships, such as using terms like "on," "above," "below," "above," "under," "below," "near," "close to," "adjacent to," "beside," or "next to" to describe the positional relationship between two components, one or more other components may be placed between the two components unless more restrictive terms such as "immediately," "directly," or "closely" are used. For example, when a structure is described as being "above," "below," "on top," "below," "below," "near," "close to," "adjacent to," "beside," or "next to" another structure, this description should be interpreted to include situations where these structures are in contact with each other and situations where a third structure is placed or inserted between them. Furthermore, the terms "left," "right," "top," "bottom," "down," "up," "upper," "lower," etc., refer to any frame of reference.

[0046] Furthermore, when referring to any size, relative dimensions, etc., even if no explicit description is given, it should be assumed that the numerical values ​​or corresponding information of the component or feature (e.g., level, range, etc.) include the tolerances or error ranges that may be caused by various factors (e.g., process factors, internal or external shocks, noise, etc.). In addition, the term "can" fully encompasses all the meanings of the term "able to".

[0047] Features of the various embodiments of this disclosure may be linked or combined with each other in part or in whole, and may be technically driven and interoperable with each other in various ways, as will be fully understood by those skilled in the art. Embodiments of this disclosure may be implemented independently of each other, or may be implemented together in an interdependent relationship.

[0048] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. It will also be understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent, for example, with their meaning in the context of the relevant field, and shall not be interpreted as having an idealized or overly formal meaning unless expressly defined herein. For example, the terms “component” or “unit” may be applied, for example, to a single circuit or structure, an integrated circuit, a computational block of a circuit arrangement, or any structure configured to perform the described functions as would be understood by one of ordinary skill in the art.

[0049] Various exemplary embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. Furthermore, all components of each display device according to all embodiments of the present disclosure are operatively connected and configured. For ease of description, the scale of each element illustrated in the drawings differs from the actual scale, and therefore, one should not be limited by the scale shown in the drawings.

[0050] Figure 1 This is a diagram illustrating the system configuration of a display device 100 according to an exemplary embodiment of the present disclosure.

[0051] Reference Figure 1 The display device 100 according to embodiments of the present disclosure may include a display panel 110 and a display driving circuit as components for displaying images. The display driving circuit may be a circuit for driving the display panel 110. The display driving circuit may include one or more of a data driving circuit 120, a gating driving circuit 130, and a controller 140, but embodiments of the present disclosure are not limited thereto.

[0052] The display panel 110 may include a substrate 111 and a plurality of sub-pixels SP disposed on the substrate 111.

[0053] The substrate 111 may include a display area DA and a non-display area NDA adjacent to the display area DA.

[0054] The display area DA is the area where images can be displayed, and can also be called the active area. Multiple subpixels SP used for image display can be set within the display area DA. The non-display area NDA is the area where images are not displayed, and can be the area outside the display area DA. The non-display area NDA can also be called the border (or border area). The non-display area NDA may include pad areas.

[0055] For example, the non-display area NDA may include a first non-display area, a second non-display area, a third non-display area, and a fourth non-display area. The first non-display area may be located outside the display area DA in the row direction. The second non-display area may be located outside the display area DA in the row direction and may be positioned opposite to the first non-display area. The third non-display area may be located outside the display area DA in the column direction. The fourth non-display area may be located outside the display area DA in the column direction and may be positioned opposite to the third non-display area.

[0056] Among the first to fourth non-display areas, the fourth non-display area may include a pad area connected, joined (or attached) to a driving circuit, and the first to third non-display areas may have a very small size, but the embodiments of this disclosure are not limited thereto.

[0057] As another example, the portion of the non-display area NDA that is adjacent to the display area DA and is also known as the boundary area or curved area can be curved so that the non-display area NDA can be located below the display area.

[0058] When a user views the display device 100 from the front, the non-display area NDA shown to the user may not change or will hardly change, but the embodiments of this disclosure are not limited thereto.

[0059] The display device 100 according to the embodiments of the present disclosure may be a self-emissive display device in which the display panel 110 emits its own light, but the embodiments of the present disclosure are not limited thereto. When the display device 100 according to the embodiments of the present disclosure is a self-emissive display device, each of the plurality of sub-pixels SP may include a light-emitting element.

[0060] For example, the display device 100 according to an embodiment of the present disclosure may be an organic light-emitting diode (OLED) display in which the light-emitting element is implemented as an organic light-emitting diode (OLED). As another example, the display device 100 according to an embodiment of the present disclosure may be an inorganic light-emitting display device in which the light-emitting element is implemented as a light-emitting diode based on an inorganic material. As another example, the display device 100 according to an embodiment of the present disclosure may be a quantum dot display device in which the light-emitting element is implemented as a quantum dot, a self-emissive semiconductor crystal. As another example, the display device 100 according to an embodiment of the present disclosure may be a micro-LED display device or a mini-LED display device.

[0061] The structure of each of the plurality of sub-pixels SP can vary depending on the type of display device 100. For example, when the display device 100 is a self-emissive display device in which the sub-pixels SP emit their own light, each sub-pixel SP may include a self-emissive light-emitting element, one or more transistors, and one or more capacitors, but the embodiments of this disclosure are not limited thereto.

[0062] Various types of signal lines for driving multiple sub-pixels SP can be disposed on the substrate 111 of the display panel 110. For example, the various types of signal lines may include multiple data lines DL that transmit data signals (also known as data voltages or image signals) to the multiple sub-pixels SP, and multiple gating lines GL that transmit gating signals (also known as scan signals) to the multiple sub-pixels SP.

[0063] Multiple data lines (DL) and multiple gating lines (GL) can intersect each other. Each of the multiple gating lines (GL) can be configured to extend in a first direction (e.g., row or column). Each of the multiple data lines (DL) can be configured to extend in a second direction (e.g., column or row) different from the first direction.

[0064] According to embodiments of this disclosure, for example, the first direction can be a row direction, and the second direction can be a column direction. As another example, the first direction can be a column direction, and the second direction can be a row direction. The row direction and column direction can be relative directions. For example, depending on the viewing angle, the column direction can be the row direction, and depending on the viewing angle, the row direction can be the column direction. For ease of description, an example is described below where each of the plurality of data lines DL is set along the column direction and each of the plurality of gate lines GL is set along the row direction, but embodiments of this disclosure are not limited thereto. In embodiments of this disclosure, the angle between the first direction and the second direction can be 90 degrees, or it can be an angle different from 90 degrees.

[0065] The data driving circuit 120 can be a circuit used to drive multiple data lines DL, and can output data signals to multiple data lines DL.

[0066] The data drive circuit 120 can receive digital image data DATA from the controller 140, and can convert the received image data DATA into analog data signals (or data voltages) and output them to multiple data lines DL.

[0067] For example, the data driving circuit 120 can be connected to the display panel 110 via the tape automatic bonding (TAB) method, or connected to the bonding pads of the display panel 110 via the chip on glass (COG) or chip on panel (COP) method, or implemented and connected to the display panel 110 via the chip on film (COF) method, but the embodiments of this disclosure are not limited thereto.

[0068] The data driving circuit 120 can be connected to one side of the display panel 110 (e.g., the top or bottom side). As another example, depending on the driving scheme or panel design, the data driving circuit 120 can be connected to both sides of the display panel 110 (e.g., the top and bottom sides), or to two or more of the four sides of the display panel 110.

[0069] The data driving circuit 120 can be connected outside the display area DA of the display panel 110, but as another example, the data driving circuit 120 can be set in the display area DA of the display panel 110.

[0070] The gating drive circuit 130 is used to drive multiple gating lines GL and can output gating signals to multiple gating lines GL.

[0071] The gating drive circuit 130 can receive a first gating voltage corresponding to an on-state voltage (or also called an on-state voltage) and a second gating voltage corresponding to an off-state voltage (or also called an off-state voltage) along with various gating drive control signals GCS, generate a gating signal that includes segments with the first gating voltage and segments with the second gating voltage within a predetermined time (e.g., one frame time), and provide the generated gating signal to multiple gating lines GL. For example, the on-state voltage can be a high-level voltage and the off-state voltage can be a low-level voltage. As another example, the on-state voltage can be a low-level voltage and the off-state voltage can be a high-level voltage.

[0072] In the display device 100 according to an embodiment of the present disclosure, the gate driving circuit 130 may be embedded in the display panel 110 in an in-panel gate (GIP) type, but the embodiments of the present disclosure are not limited thereto. When the gate driving circuit 130 is of the in-panel gate type, the gate driving circuit 130 may be formed on the substrate 111 of the display panel 110 during the manufacturing process of the display panel 110. When the gate driving circuit 130 is of the in-panel gate type, the gate driving circuit 130 may be referred to as an in-panel gate circuit (GIPC).

[0073] For example, the gating drive circuit 130 can be disposed in the non-display area NDA of the display panel 110. As another example, the gating drive circuit 130 can be disposed in the display area DA of the display panel 110. For example, the gating drive circuit 130 can be disposed in a first portion of the display area DA (e.g., the left or right side of the display area DA). As another example, the gating drive circuit 130 can be disposed in both a first portion of the display area DA (e.g., the left or right side of the display area DA) and a second portion of the display area DA (e.g., the right or left side of the display area DA). As yet another example, the gating drive circuit 130 can be disposed across the entire display area DA.

[0074] When the gate driving circuit 130 is disposed in the display area DA of the display panel 110, the gate driving circuit 130 may vertically overlap with the sub-pixels SP disposed in the display area DA. For example, the gate driving circuit 130 may vertically overlap with the light-emitting elements and transistors included in the sub-pixels SP disposed in the display area DA. The gate driving circuit 130 may vertically overlap with multiple light-emitting elements and multiple transistors included in multiple sub-pixels SP disposed in the display area DA. The gate driving circuit 130 may include multiple transistors. Each of the multiple transistors included in the gate driving circuit 130 may include an active layer comprising a first semiconductor material, and each of the multiple transistors included in the sub-pixels SP may include an active layer comprising a second semiconductor material. For example, the first semiconductor material and the second semiconductor material may be substantially the same. As another example, the first semiconductor material and the second semiconductor material may be different from each other. For example, the first semiconductor material may be a silicon-based semiconductor material (e.g., low-temperature polycrystalline silicon), and the second semiconductor material may be an oxide semiconductor material. For example, the active layer may be, but is not limited to, a semiconductor layer.

[0075] The controller 140 is a device for controlling the data drive circuit 120 and the gating drive circuit 130, and can control the driving timing for multiple data lines DL and the driving timing for multiple gating lines GL.

[0076] The controller 140 can provide a data drive control signal DCS to the data drive circuit 120 to control the data drive circuit 120, and can provide a gating drive control signal GCS to the gating drive circuit 130 to control the gating drive circuit 130.

[0077] The controller 140 can be implemented as a component separate from the data drive circuit 120, or the controller 140 and the data drive circuit 120 can be integrated into an integrated circuit (IC).

[0078] The controller 140 may be a timing controller used in display technology, a control device capable of performing the functions of a timing controller and other control functions, or a control device other than a timing controller, or it may be a circuit in a control device. The controller 140 may be implemented as various circuits or electronic components, such as integrated circuits (ICs), field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), or processors, but is not limited thereto.

[0079] The controller 140 can be mounted on a printed circuit board or flexible printed circuit and can be electrically connected to the data drive circuit 120 and the gating drive circuit 130 via the printed circuit board or flexible printed circuit.

[0080] The controller 140 can send signals to / receive signals from the data drive circuit 120 according to one or more predetermined interfaces. The interfaces may include, for example, a low-voltage differential signaling (LVDS) interface, an embedded point-to-point clock interface (EPI), and a serial peripheral interface (SPI), but embodiments of this disclosure are not limited thereto.

[0081] The display device 100 according to the embodiments of the present disclosure can not only provide image display function, but also provide touch sensing function to detect whether it is touched by a touch object such as a finger or a pen or to detect the location of the touch.

[0082] The display device 100 according to the embodiments of this disclosure may be a mobile terminal such as a smartphone or tablet, a display for a vehicle or VR, or a monitor or television (TV) of various sizes, but is not limited thereto, and may be a display of various types and sizes capable of displaying information or images.

[0083] The display device 100 according to embodiments of the present disclosure may further include electronic devices such as cameras (image sensors), detection sensors, etc. For example, the detection sensor may be a sensor that detects objects or human bodies by receiving light such as infrared, ultrasonic, or ultraviolet light, but embodiments of the present disclosure are not limited thereto.

[0084] Figure 2A display panel 110 according to an embodiment of the present disclosure is illustrated.

[0085] Reference Figure 2 The display panel 110 according to embodiments of the present disclosure may include a substrate 111 disposed in a plurality of sub-pixels SP, an encapsulation layer 200 on the substrate 111, and a color filter layer 210 on the encapsulation layer 200. The encapsulation layer 200 may also be referred to as an encapsulation substrate or an encapsulation unit.

[0086] Reference Figure 2 When the display device 100 according to the embodiments of the present disclosure is a self-emissive display device, each of the plurality of sub-pixels SP disposed on the substrate 111 may include an emitting element ED and a sub-pixel circuit SPC for driving the emitting element ED.

[0087] Reference Figure 2 The sub-pixel circuit SPC may include a plurality of transistors for driving the light-emitting element ED and at least one capacitor, but embodiments of the present disclosure are not limited thereto. In this disclosure, the sub-pixel circuit SPC can drive the light-emitting element ED by providing a drive current to the light-emitting element ED at a predetermined timing. The light-emitting element ED can be driven by the drive current to emit light.

[0088] The multiple transistors may include a driving transistor DT for driving the light-emitting element ED and a scanning transistor ST that is turned on or off according to the scanning signal SC.

[0089] The driving transistor DT can provide driving current to the light-emitting element ED. The scanning transistor ST can be configured to control the electrical state of the corresponding node in the sub-pixel circuit SPC, or to control the state or operation of the driving transistor DT. At least one capacitor may include a storage capacitor Cst for maintaining a constant voltage during a frame.

[0090] To drive sub-pixel SP, a data signal VDATA as an image signal and a scan signal SC as a gating signal can be applied to sub-pixel SP. Furthermore, to drive sub-pixel SP, a common drive signal including drive voltage VDD and base voltage VSS can be applied to sub-pixel SP.

[0091] The light-emitting element (ED) may include a pixel electrode (PE), an intermediate layer (EL), and a common electrode (CE). The intermediate layer (EL) may be disposed between the pixel electrode (PE) and the common electrode (CE).

[0092] For example, the pixel electrode PE can be an electrode disposed in each sub-pixel SP, while the common electrode CE can be an electrode commonly disposed in all sub-pixels SP. For example, the pixel electrode PE can be an anode, and the common electrode CE can be a cathode. As another example, the pixel electrode PE can be a cathode, and the common electrode CE can be an anode. For ease of description, an example is described where the pixel electrode PE is an anode and the common electrode CE is a cathode.

[0093] When the light-emitting element ED is an organic light-emitting element, the intermediate layer EL may include a light-emitting layer EML, a first common intermediate layer COM1 between the pixel electrode PE and the light-emitting layer EML, and a second common intermediate layer COM2 between the light-emitting layer EML and the common electrode CE. The first common intermediate layer COM1 and the second common intermediate layer COM2 can be collectively referred to as the common intermediate layer EL_COM.

[0094] The emissive layer EML can be set for each sub-pixel SP, or it can be set together across multiple sub-pixel SPs. The common intermediate layer EL_COM can be set together across multiple sub-pixel SPs, but the embodiments disclosed herein are not limited to this.

[0095] In other words, the emissive layer EML can be set for each emissive region or shared across multiple emissive regions. The common intermediate layer EL_COM can be shared across multiple emissive and non-emissive regions, but the embodiments disclosed herein are not limited to this.

[0096] For example, the first common intermediate layer COM1 may include a hole injection layer HIL, an electron blocking layer EBL, and a hole transport layer HTL, but the embodiments of this disclosure are not limited thereto. The second common intermediate layer COM2 may include an electron transport layer ETL, a hole blocking layer HBL, and an electron injection layer EIL, but the embodiments of this disclosure are not limited thereto.

[0097] The hole injection layer (HIL) injects holes from the pixel electrode (PE) into the hole transport layer (HTL), and the HTL then transports the holes to the emissive layer (EML). The electron injection layer (EIL) injects electrons from the common electrode (CE) into the electron transport layer (ETL), and the ETL then transports the electrons to the emissive layer (EML).

[0098] For example, the common electrode CE can be electrically connected to the base voltage line VSSL. A base voltage VSS, serving as a common voltage, can be applied to the common electrode CE via the base voltage line VSSL. The pixel electrode PE can be electrically connected directly or indirectly (via another transistor) to the first node Na of the driving transistor DT of each sub-pixel SP. In this disclosure, the "base voltage VSS" may also be referred to as the first common voltage, the low-potential power supply voltage, or the low-potential voltage, and the "base voltage line VSSL" may also be referred to as the first common voltage line, the low-potential power supply voltage line, or the low-potential voltage line.

[0099] Each light-emitting element (ED) may include the overlapping portion of the pixel electrode (PE), the light-emitting layer (EML) in the intermediate layer (LE), and the common electrode (CE). Each ED may form a predetermined light-emitting region. For example, the light-emitting region of each ED may include the overlapping region of the pixel electrode (PE), the light-emitting layer (EML) in the intermediate layer (EL), and the common electrode (CE).

[0100] For example, the light-emitting element ED can be an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED), a quantum dot light-emitting element, a micro LED, or a mini LED, but the embodiments disclosed herein are not limited thereto. For example, when the light-emitting element ED is an organic light-emitting diode (OLED), the intermediate layer EL of the light-emitting element ED may include an intermediate layer EL containing organic materials.

[0101] The driving transistor DT can be used to provide driving current to the light-emitting element ED. The driving transistor DT can be connected between the driving voltage line VDDL and the light-emitting element ED.

[0102] The driving transistor DT may include a first node Na, a second node Nb, and a third node Nc. The first node Na may be electrically connected to the light-emitting element ED, the second node Nb may receive the data signal VDATA, and the third node Nc may receive a driving voltage VDD as another common voltage from the driving voltage line VDDL. The driving transistor DT may be connected to the first node Na and the third node Nc. In this disclosure, "driving voltage VDD" may also be referred to as the second common voltage, the high-potential power supply voltage, or the high-potential voltage, and "driving voltage line VDDL" may also be referred to as the second common voltage line, the high-potential power supply voltage line, or the high-potential voltage line.

[0103] In the driving transistor DT, the second node Nb can be the gate node, the first node Na can be the source node or the drain node, and the third node Nc can be the drain node or the source node. In the preceding description, for ease of description, an example is described in the driving transistor DT in which the second node Nb is the gate node, the first node Na is the source node, and the third node Nc is the drain node, but the embodiments of this disclosure are not limited thereto.

[0104] Figure 2 The scanning transistor ST included in the sub-pixel circuit SPC shown can be a switching transistor that transmits the data signal VDATA, which is an image signal, to the second node Nb, which is the gate node, of the driving transistor DT.

[0105] The scanning transistor ST can be controlled to be turned on and off by a scan signal SC, which is applied as a gating signal via a scan line SCL, acting as a gating line GL, to control the electrical connection between the second node Nb of the driving transistor DT and the data line DL. The drain or source electrode of the scanning transistor ST can be electrically connected to the data line DL, the source or drain electrode of the scanning transistor ST can be electrically connected to the second node Nb of the driving transistor DT, and the gate electrode of the scanning transistor ST can be electrically connected to the scan line SCL.

[0106] The storage capacitor Cst can be electrically connected between the first node Na and the second node Nb of the driving transistor DT. The storage capacitor Cst can include at least one capacitor electrode electrically connected to the first node Na of the driving transistor DT or corresponding to the first node Na of the driving transistor DT, and at least one capacitor electrode electrically connected to the second node Nb of the driving transistor DT or corresponding to the second node Nb of the driving transistor DT.

[0107] The capacitor Cst may be an external capacitor intentionally designed outside the driving transistor DT, rather than a parasitic capacitor (e.g., Cgs or Cgd) that may exist between the first node Na and the second node Nb of the driving transistor DT, but embodiments of this disclosure are not limited thereto.

[0108] Each of the driving transistor DT and the scanning transistor ST can be an n-type transistor or a p-type transistor, but embodiments of this disclosure are not limited thereto. For example, one of the driving transistor DT and the scanning transistor ST can be an n-type transistor or a p-type transistor.

[0109] The display panel 110 may have a top-emitting structure or a bottom-emitting structure. When the display panel 110 has a top-emitting structure, at least a portion of the sub-pixel circuit SPC may overlap with at least a portion of the light-emitting element ED in the vertical direction. Therefore, the area of ​​the light-emitting region can be increased, and the aperture ratio can be increased. When the display panel 110 has a bottom-emitting structure, the sub-pixel circuit SPC may not overlap with the light-emitting element ED in the vertical direction.

[0110] like Figure 2As shown, the sub-pixel circuit SPC can have a 2T (transistor) 1C (capacitor) structure including two transistors DT and ST and a capacitor Cst. In some cases, the sub-pixel circuit SPC may further include one or more transistors, or may further include one or more capacitors, but the embodiments of this disclosure are not limited thereto.

[0111] For example, the sub-pixel circuit SPC can have a 3T1C structure including 3 transistors and 1 capacitor. For example, the sub-pixel circuit SPC can have an 8T1C structure including 8 transistors and 1 capacitor. As another example, the sub-pixel circuit SPC can have a 6T2C structure including 6 transistors and 2 capacitors. As another example, the sub-pixel circuit SPC can have a 7T1C structure including 7 transistors and 1 capacitor, but the embodiments of this disclosure are not limited to these.

[0112] Depending on the structure of the sub-pixel circuit SPC, the type and number of gating lines or gating signals provided to the sub-pixel SP can vary. Furthermore, depending on the structure of the sub-pixel circuit SPC, the type and number of common driving signals provided to the sub-pixel SP can also vary.

[0113] Since the circuit elements in each sub-pixel SP (e.g., light-emitting elements ED implemented as organic light-emitting diodes (OLEDs) comprising organic materials) are susceptible to external moisture or oxygen, an encapsulation layer 200 can be provided on the display panel 110. The encapsulation layer 200 can prevent or reduce the penetration of external moisture or oxygen into the circuit elements (e.g., light-emitting elements ED). The encapsulation layer 200 can be configured in various ways to prevent the light-emitting elements ED from contacting moisture or oxygen. For example, the encapsulation layer 200 can be composed of two or more layers of alternating organic and inorganic films, but embodiments of this disclosure are not limited thereto.

[0114] Figure 3 This is a cross-sectional view of a display panel 110 according to an embodiment of the present disclosure.

[0115] Reference Figure 3 The display panel 110 according to the embodiments of the present disclosure may include a substrate 111, a transistor unit, a light-emitting element unit and a packaging unit 200, but the embodiments of the present disclosure are not limited thereto.

[0116] The substrate 111 can be a single layer or multiple layers. When the substrate 111 includes multiple layers, it may include a first substrate 301, an intermediate substrate layer 302, and a second substrate 303. The intermediate substrate layer 302 may be located between the first substrate 301 and the second substrate 303. For example, each of the first substrate 301 and the second substrate 303 may be a polyimide (PI) layer, but embodiments of this disclosure are not limited thereto. The intermediate substrate layer 302 may be an inorganic insulating layer, but embodiments of this disclosure are not limited thereto. When charge is applied to the first substrate PI1, which is a polyimide layer, the intermediate substrate layer 302 can prevent or reduce the impact of charge on the transistors disposed on the second substrate 303 through the second substrate 303, which is also a polyimide layer.

[0117] Furthermore, the intermediate substrate layer 302 can prevent or reduce the upward penetration of moisture components through the first substrate 301. For example, the intermediate substrate layer 302 can be formed of a single layer or multiple layers of silicon nitride (SiNx) or silicon oxide (SiOx), or it can be formed of a bilayer of silicon oxide (SiOx) and silicon nitride (SiNx), but is not limited thereto.

[0118] The transistor unit may include insulating layers 311, 312, 313, 314, 315 and 316 on substrate 111, thin film transistor TFT1, storage capacitor Cst and various electrodes or signal lines.

[0119] The transistor unit may include a first thin-film transistor TFT1.

[0120] The first thin-film transistor TFT1 may include a first active layer ACT1, a first electrode E1a, a second electrode E1b, and a third electrode E1c.

[0121] The first electrode E1a can be a gate electrode, the second electrode E1b can be a source electrode or a drain electrode, and the third electrode E1c can be a drain electrode or a source electrode. In the following text, for ease of description, the first electrode E1a is referred to as the first gate electrode E1a, the second electrode E1b is referred to as the first source electrode E1b, and the third electrode E1c is referred to as the first drain electrode E1c, but the embodiments of this disclosure are not limited thereto.

[0122] The first active layer ACT1 may include a first semiconductor material. For example, the first semiconductor material may include oxide semiconductor, amorphous silicon, polycrystalline silicon, or low-temperature polycrystalline silicon (LTPS), but embodiments of this disclosure are not limited thereto. The first thin-film transistor TFT1 may be implemented as a p-channel transistor or an n-channel thin-film transistor, but embodiments of this disclosure are not limited thereto.

[0123] The first active layer ACT1 of the first thin-film transistor TFT1 may have the following types of semiconductor materials.

[0124] For example, the first active layer ACT1 of the first thin-film transistor TFT1 may include an oxide semiconductor material. As another example, the first active layer ACT1 of the first thin-film transistor TFT1 may include a low-temperature polycrystalline silicon semiconductor material.

[0125] The transistors in the display area DA can be operated as follows.

[0126] For example, at least one transistor in each sub-pixel SP can be implemented as a first thin-film transistor TFT1.

[0127] For example, in each sub-pixel SP, the driving transistor DT can be implemented as a first thin-film transistor TFT1.

[0128] In the sub-pixel circuit (SPC), the first light-emitting element ED1 can be connected to a transistor. The first pixel electrode PE1 of the first light-emitting element ED1 can be connected to the source or drain electrode of the transistor. The transistor connected to the first light-emitting element ED1 can be... Figure 3 The first thin-film transistor TFT1 or another transistor. According to Figure 2 For example, the transistor connected to the first light-emitting element ED1 may be a driving transistor DT, or it may be another transistor (e.g., a light-emitting control transistor) connected between the driving transistor DT and the first light-emitting element ED1. Embodiments of this disclosure are not limited thereto.

[0129] The transistors in the non-display area NDA can be operated as follows.

[0130] For example, the active layer of the transistor included in the in-panel gated (GIP) type gate drive circuit 130 can be formed of an oxide semiconductor material. As another example, the active layer of the transistor included in the in-panel gated (GIP) type gate drive circuit 130 can be formed of a low-temperature polycrystalline silicon semiconductor material. As yet another example, in the transistors included in the in-panel gated (GIP) type gate drive circuit 130, some active layers can be formed of a low-temperature polycrystalline silicon semiconductor material, while others can be formed of an oxide semiconductor material.

[0131] The buffer layer 310 may be disposed below the first active layer ACT1 of the first thin-film transistor TFT 1. For example, the first active layer ACT1 of the first thin-film transistor TFT 1 may be located on the buffer layer 310. Embodiments of this disclosure are not limited thereto.

[0132] The storage capacitor Cst can be disposed in various metal layers of the display panel 110. For example, the storage capacitor Cst may include a first capacitor electrode CAPE1 and a second capacitor electrode CAPE2. For example, one of the first capacitor electrode CAPE1 and the second capacitor electrode CAPE2 may be electrically connected to the source electrode of the driving transistor DT, and the other may be electrically connected to the gate electrode of the driving transistor DT.

[0133] The light-emitting element unit may include multiple light-emitting elements ED. Each light-emitting element ED may include a pixel electrode PE, an intermediate layer EL, and a common electrode CE. For example, it may include a first light-emitting element ED1 disposed on the first planarization layer 317. The first light-emitting element ED1 may include a first pixel electrode PE1, a first intermediate layer EL1, and a first common electrode CE1.

[0134] The encapsulation unit may include an encapsulation layer 200 on multiple light-emitting elements (EDs). The encapsulation layer 200 may be a single layer or multiple layers, but the embodiments disclosed herein are not limited thereto.

[0135] In the following text, refer to Figure 3 The structure or vertical structure of the display panel 110 according to embodiments of the present disclosure will be described in more detail.

[0136] Reference Figure 3 The buffer layer 310 can be disposed on the substrate 111. The buffer layer 310 can be a single layer or multiple layers, but the embodiments of this disclosure are not limited thereto. When the buffer layer 310 is multiple layers, the buffer layer 310 may include a lower buffer layer 311, an intermediate buffer layer 312 and an upper buffer layer 313.

[0137] The first active layer ACT1 of the first thin-film transistor TFT1 may be disposed on the buffer layer 310. The first active layer ACT1 may include a channel region forming a channel, a source connection region on one side of the channel region, and a drain connection region on the other side of the channel region.

[0138] The first gate insulating layer 314 can be disposed on the first active layer ACT1 of the first thin-film transistor TFT1. The first gate electrode E1a of the first thin-film transistor TFT1 can be disposed on the first gate insulating layer 314. The first interlayer insulating layer 315 can be disposed on the first gate electrode E1a of the first thin-film transistor TFT1. Here, the metal layer on which the first gate electrode E1a of the first thin-film transistor TFT1 is disposed can be referred to as the gate metal layer.

[0139] The first source electrode E1b and the first drain electrode E1c of the first thin-film transistor TFT1 can be disposed on the second interlayer insulating layer 316.

[0140] The first source electrode E1b and the first drain electrode E1c of the first thin-film transistor TFT1 can be connected to the source connection region and the drain connection region of the first active layer ACT1, respectively, through the holes of the second interlayer insulating layer 316, the first interlayer insulating layer 315 and the first gate insulating layer 314.

[0141] The first source electrode E1b and the first drain electrode E1c of the first thin-film transistor TFT1 may include a first source-drain metal and are disposed in the first source-drain metal layer.

[0142] Reference Figure 3 For example, the storage capacitor Cst can be formed by a first capacitor electrode CAPE1 and a second capacitor electrode CAPE2. In some cases, the storage capacitor Cst can be formed by three or more capacitor electrodes, or it can be in the form of two or more capacitors connected in parallel.

[0143] Each of the first capacitor electrode CAPE1 and the second capacitor electrode CAPE2 can be disposed on various metal layers disposed in the display panel 110.

[0144] For example, the first capacitor electrode CAPE1 may include the same first gate metal as the first gate electrode E1a of the first thin-film transistor TFT1 on the first gate insulating layer 314, and may be disposed in the first gate metal layer, but the embodiments of this disclosure are not limited thereto. For example, the second capacitor electrode CAPE2 may be disposed on the first interlayer insulating layer 315. The embodiments of this disclosure are not limited thereto.

[0145] The first planarization layer 317 can be disposed on the first thin-film transistor TFT1 and can be disposed below the light-emitting element ED. The first planarization layer 317 can be an organic insulating layer including an organic insulating material.

[0146] For example, the first planarization layer 317 may consist of one layer. As another example, the first planarization layer 317 may include two layers. As yet another example, the first planarization layer 317 may include three or more layers, but embodiments of this disclosure are not limited thereto.

[0147] Reference Figure 3 The first planarization layer 317 may be disposed on the first source electrode E1b and the first drain electrode E1c of the first thin-film transistor TFT1. For example, the first planarization layer 317 may be disposed on the first thin-film transistor TFT1. For example, the first planarization layer 317 may be configured to cover the entire first thin-film transistor TFT1, but this disclosure is not limited thereto.

[0148] Reference Figure 3The light-emitting element unit can be disposed on the first planarization layer 317. For example, the first light-emitting element ED1 can be formed on the first planarization layer 317. The first light-emitting element ED1 may include a first pixel electrode PE1, a first intermediate layer EL1, and a first common electrode CE1. The light-emitting region of the first light-emitting element ED1 can be formed in the region where the first pixel electrode PE1, the first intermediate layer EL1, and the first common electrode CE1 overlap and are in contact with each other.

[0149] The embankment 320 can be disposed on the first pixel electrode PE1. The opening of the embankment 320 can expose a portion of the first pixel electrode PE1 to form a light-emitting area. The opening of the embankment 320 can overlap with a portion of the first pixel electrode PE1.

[0150] For example, the dam portion 320 may be formed of a material including black pigment or an organic material such as benzocyclobutene resin, polyimide resin, acrylic resin, or photosensitive polymer, but the embodiments disclosed herein are not limited thereto. When the dam portion 320 is formed of a material including black pigment, black dye, etc., it may be a black dam portion. When the dam portion 320 is formed of a material including black pigment or black dye, it can block light from the outside or block light reflected from the outside, thereby further enhancing the brightness of the display device 100.

[0151] The first intermediate layer EL1 of the first light-emitting element ED1 can be disposed on a portion of the first pixel electrode PE1 and the embankment 320. The first common electrode CE1 can be disposed on the first intermediate layer EL1.

[0152] Reference Figure 3 The encapsulation portion is disposed on the light-emitting element portion and may be located on the first common electrode CE1. The encapsulation portion may include an encapsulation layer 200 formed on the first common electrode CE1.

[0153] The encapsulation layer 200 can prevent or reduce the penetration of moisture or oxygen into the first light-emitting element ED1. For example, the encapsulation layer 200 can prevent or reduce the penetration of moisture or oxygen into the organic material included in the first intermediate layer EL1 of the first light-emitting element ED1. The encapsulation layer 200 can be formed of a single layer or multiple layers, but the embodiments of this disclosure are not limited thereto.

[0154] As an example, the encapsulation layer 200 may include a first inorganic layer 331, a first organic layer 332, a second inorganic layer 333, a second organic layer 334, and a third inorganic layer 335, but embodiments of this disclosure are not limited thereto. For example, although Figure 3 The encapsulation layer 200 is shown to include a structure in which three inorganic layers and two organic layers are stacked alternately, but the embodiments disclosed herein are not limited thereto, and various other structures such as two inorganic layers and one organic layer stacked alternately are also possible.

[0155] For example, the first inorganic layer 331, the second inorganic layer 333 and the third inorganic layer 335 may include inorganic encapsulation layers, and the first organic layer 332 and the second organic layer 334 may include organic encapsulation layers, but the embodiments of this disclosure are not limited thereto.

[0156] Reference Figure 3 The second planarization layer 336 may be disposed on the encapsulation layer 200. The second planarization layer 336 may be an organic insulating layer including an organic insulating material.

[0157] For example, the second planarization layer 336 may consist of a single layer. As another example, the second planarization layer 336 may include two layers. As yet another example, the second planarization layer 336 may include three or more layers, but embodiments of this disclosure are not limited thereto.

[0158] Reference Figure 3 The fourth inorganic layer 337 can be disposed on the second planarization layer 336. The fourth inorganic layer 337 can be an inorganic insulating layer including inorganic insulating material.

[0159] Reference Figure 3 The color filter layer 210 can be disposed on the fourth inorganic layer 337. The color filter layer 210 may include a black matrix 340, a first color filter 341, and a first opening 342.

[0160] The black matrix 340 can be disposed on the fourth inorganic layer 337 and can include the first opening 342.

[0161] For example, the black matrix 340 may be composed of materials including black pigments or organic materials such as benzocyclobutene resin, polyimide resin, acrylic resin, or photosensitive polymers, but the embodiments disclosed herein are not limited thereto. When the black matrix 340 is composed of materials including black pigments or black dyes, it may be a black embankment. When the black matrix 340 is composed of materials including black pigments or black dyes, it may block light from the outside or block light reflected from the outside, and may reflect or absorb light leaking from the inside, thereby enhancing the brightness of the display device 100.

[0162] The first color filter 341 is disposed on the black matrix 340 and may overlap with the first opening 342 and the first light-emitting element ED1. The first color filter 341 allows light of a predetermined wavelength band to pass through the first opening 342.

[0163] For example, a first color filter 341 disposed in the region corresponding to the first light-emitting element ED1 can allow light of at least one wavelength band of red (R), green (G) and blue (B) emitted from the first light-emitting element ED1 to pass through.

[0164] Figure 4 This is a plan view of the display panel 110 according to an embodiment of the present disclosure.

[0165] Reference Figure 4 The display panel 110 according to embodiments of the present disclosure may include a plurality of subpixels SP. The subpixels SP may be disposed in a display area DA for displaying images. Each subpixel SP may include a light-emitting element provided with red (R), green (G) and blue (B).

[0166] Furthermore, for example, the display device 100 according to embodiments of the present disclosure may be a conventional TV or monitor device. As another example, the display device 100 according to embodiments of the present disclosure may be a smartphone, tablet, or wearable electronic device. As yet another example, in embodiments, the display device 100 according to embodiments of the present disclosure may be a vehicle display, a virtual reality (VR) electronic device, or an augmented reality (AR) electronic device.

[0167] Furthermore, the display panel 110 of the display device 100 according to embodiments of the present disclosure may have a structure that achieves desired viewing angle characteristics (viewing angle characteristic enhancement structure). Hereinafter, the viewing angle characteristic enhancement structure according to embodiments of the present disclosure will be described in more detail.

[0168] Figures 5 to 12 This is a diagram illustrating the cross-sectional structure of a display panel 110 according to an embodiment of the present disclosure. Figures 5 to 12 Examples are shown along Figure 4 The cross section intercepted by the cutting line A-A'.

[0169] Reference Figures 5 to 12 According to embodiments of the present disclosure, the display panel may include a first light-emitting element ED1 disposed on the embankment 320 and a second light-emitting element ED2 adjacent to the first light-emitting element ED1.

[0170] For example, the first light-emitting element ED1 and the second light-emitting element ED2 can be organic light-emitting diodes (OLEDs), light-emitting diodes (LEDs) based on inorganic materials, quantum dot light-emitting elements, micro LEDs, or mini LEDs, but the embodiments disclosed herein are not limited thereto.

[0171] The first light-emitting element ED1 can emit first light including a first wavelength band, and the second light-emitting element ED2 can emit second light including a second wavelength band. The wavelength band of the first light may be shorter than that of the second light, but the embodiments of this disclosure are not limited thereto.

[0172] One of the first light and the second light may include one of the colors red (R), green (G), and blue (B), and the other of the first light and the second light may include another color among red (R), green (G), and blue (B). For example, if the first light includes blue (B) light, then the second light may include green (G) light. As another example, if the first light includes blue (B) light, then the second light may include red (R) light. As another example, if the first light includes green (G) light, then the second light may include red (R) light, but the embodiments of this disclosure are not limited thereto.

[0173] Reference Figures 5 to 12 The encapsulation layer 200 can be disposed on the first light-emitting element ED1 and the second light-emitting element ED2. For example, the encapsulation layer 200 can prevent or reduce the penetration of moisture or oxygen into the first light-emitting element ED1 and the second light-emitting element ED2. The encapsulation layer 200 can consist of a single layer or multiple layers, but the embodiments disclosed herein are not limited thereto.

[0174] As an example, the encapsulation layer 200 may include a first inorganic layer 331, a first organic layer 332, a second inorganic layer 333, a second organic layer 334, and a third inorganic layer 335, but the embodiments of this disclosure are not limited thereto.

[0175] For example, the first inorganic layer 331, the second inorganic layer 333 and the third inorganic layer 335 may include inorganic encapsulation layers, and the first organic layer 332 and the second organic layer 334 may include organic encapsulation layers, but the embodiments of this disclosure are not limited thereto.

[0176] Reference Figures 5 to 12 The second planarization layer 336 may be disposed on the encapsulation layer 200. The second planarization layer 336 may be an organic insulating layer including an organic insulating material, but the embodiments of this disclosure are not limited thereto.

[0177] For example, the second planarization layer 336 may consist of a single layer. As another example, the second planarization layer 336 may include two layers. As yet another example, the second planarization layer 336 may include three or more layers, but embodiments of this disclosure are not limited thereto.

[0178] Reference Figures 5 to 12 The fourth inorganic layer 337 may be disposed on the second planarization layer 336. For example, the fourth inorganic layer 337 may be an inorganic insulating layer including inorganic insulating material, but the embodiments of this disclosure are not limited thereto.

[0179] Reference Figures 5 to 12 The color filter layer 210 can be disposed on the fourth inorganic layer 337. The color filter layer 210 may include a black matrix 340, a first color filter 341, a second color filter 541, a first opening 342, a second opening 542, and a support layer 540.

[0180] The black matrix 340 can be disposed on the fourth inorganic layer 337 and can include a first opening 342 and a second opening 542.

[0181] For example, the black matrix 340 may be composed of materials including black pigments or organic materials such as benzocyclobutene resin, polyimide resin, acrylic resin, or photosensitive polymers, but the embodiments disclosed herein are not limited thereto. When the black matrix 340 is composed of materials including black pigments or black dyes, it may be a black embankment. When the black matrix 340 is composed of materials including black pigments or black dyes, it may block light from the outside or block light reflected from the outside, and may reflect or absorb light leaking from the inside, thereby enhancing the brightness of the display device 100.

[0182] Reference Figures 5 to 12 The first color filter 341 and the second color filter 541 can be disposed on the black matrix 340. The first color filter 341 can overlap with the first opening 342 and the first light-emitting element ED1, and the second color filter 541 can overlap with the second opening 542 and the second light-emitting element ED2.

[0183] The first color filter 341 allows light of a predetermined wavelength band to pass through the first opening 342, and the second color filter 541 allows light of a predetermined wavelength band to pass through the second opening 542.

[0184] For example, a first color filter 341 disposed in the region corresponding to the first light-emitting element ED1 can allow light of at least one wavelength band of red (R), green (G) and blue (B) emitted from the first light-emitting element ED1 and the second light-emitting element ED2 to pass through, and a second color filter 541 disposed in the region corresponding to the second light-emitting element ED2 can allow light of at least one wavelength band of red (R), green (G) and blue (B) emitted from the first light-emitting element ED1 and the second light-emitting element ED2 to pass through, but the embodiments of this disclosure are not limited thereto.

[0185] Reference Figures 5 to 12 The support layer 540 may be disposed on the black matrix 340, the first color filter 341, and the second color filter 541. For example, the support layer 540 may include organic materials to protect the black matrix 340, the first color filter 341, and the second color filter 541, but the embodiments of this disclosure are not limited thereto.

[0186] Reference Figures 5 to 12 The display panel according to the embodiments of the present disclosure may include a first lens 520 disposed between the encapsulation layer 200 and the second planarization layer 336, overlapping the first opening 342 and the first light-emitting element ED1, and a second lens 530 overlapping the second opening 542 and the second light-emitting element ED2.

[0187] For example, the height of each of the first lens 520 and the second lens 530 may be less than the height of the second planarization layer 336, and each of the first lens 520 and the second lens 530 may include a flat rear surface (or lower surface) and a convex upper surface, but embodiments of this disclosure are not limited thereto. For example, Figures 5 to 12 The first lens 520 and the second lens 530 are shown to be formed in a semi-circular shape, but the embodiments of this disclosure are not limited thereto, and various other shapes are also possible.

[0188] For example, the first lens 520 and the second lens 530 may be the first protrusion and the second protrusion, respectively, but the embodiments of this disclosure are not limited thereto.

[0189] Reference Figures 5 to 12 The display panel according to embodiments of the present disclosure may include a first partition wall 510 (also referred to as a partition wall) overlapping the black matrix 340 and disposed on a side surface of at least one of the encapsulation layer 200 and the second planarization layer 336. For example, the first partition wall 510 may also be referred to as an organic partition wall, but embodiments of the present disclosure are not limited thereto. It should be noted that the formation location of the first partition wall 510 is not limited to... Figures 5 to 12 The positions shown are as indicated. For example, the first separator 510 may not be formed on the side surface of the second organic layer 334, or the first separator 510 may be further formed on the side surface of the first organic layer 332. In addition, the first lens 520 and the second lens 530 are configured to converge light emitted from each sub-pixel, and may also be omitted if necessary.

[0190] For example, the first partition wall 510 may comprise an organic material containing a light-absorbing material. As another example, the first partition wall 510 may comprise an organic material containing a reflective material, but embodiments of this disclosure are not limited thereto.

[0191] For example, the rear surface of each of the first protrusion and the second protrusion may be located further away from the substrate than the rear surface of the organic separator wall, but the embodiments of this disclosure are not limited thereto.

[0192] Reference Figures 5 to 8The first partition wall 510 may overlap with the black matrix 340 and may be located on the side surface of at least one of the second organic layer 334, the third inorganic layer 335, and the second planarization layer 336. For example, the first partition wall 510, the second organic layer 334, and the second planarization layer 336 may comprise different organic materials, and the third inorganic layer 335 may comprise an inorganic material, but the embodiments of this disclosure are not limited thereto. For example, the first partition wall 510 may separate the second organic layer 334 and / or the second planarization layer 336 into multiple portions spaced apart from each other. Furthermore, the first partition wall 510 may be configured as a light-emitting region surrounding each sub-pixel to obtain desired viewing angle characteristics.

[0193] Reference Figure 5 The first partition wall 510 may be located on the side surface of the second organic layer 334. The rear surface of the first partition wall 510 may contact the upper surface of the second inorganic layer 333, and the upper surface of the first partition wall 510 may contact the rear surface of the third inorganic layer 335. For example, the height of the first partition wall 510 may include a height less than the height of each of the first lens 520 and the second lens 530, but embodiments of this disclosure are not limited thereto.

[0194] Reference Figure 6 The first partition wall 510 may be located on the side surface of at least one of the second organic layer 334, the third inorganic layer 335, and the second planarization layer 336. The rear surface of the first partition wall 510 may contact the upper surface of the second inorganic layer 333, and the second planarization layer 336 may be configured to extend from the side surface of the first partition wall 510 between the upper surface of the first partition wall 510 and the black matrix 340. For example, the height of the first partition wall 510 may include a height less than the height of each of the first lens 520 and the second lens 530, but embodiments of this disclosure are not limited thereto.

[0195] Reference Figure 7 The first partition wall 510 may be located on the side surface of at least one of the second organic layer 334, the third inorganic layer 335, and the second planarization layer 336. The rear surface of the first partition wall 510 may contact the upper surface of the second inorganic layer 333, and the second planarization layer 336 may be configured to extend from the side surface of the first partition wall 510 between the upper surface of the first partition wall 510 and the black matrix 340. For example, the height of the first partition wall 510 may include a height corresponding to the height of each of the first lens 520 and the second lens 530, but embodiments of this disclosure are not limited thereto.

[0196] Reference Figure 8The first partition wall 510 may be located on the side surface of at least one of the second organic layer 334, the third inorganic layer 335, and the second planarization layer 336. The rear surface of the first partition wall 510 may contact the upper surface of the second inorganic layer 333, and the upper surface of the first partition wall 510 may contact the rear surface of the fourth inorganic layer 337. For example, the height of the first partition wall 510 may include a height greater than the height of each of the first lens 520 and the second lens 530, but embodiments of this disclosure are not limited thereto.

[0197] Reference Figures 9 to 12 The first partition wall 510 may include a lower partition wall 900 and an upper partition wall 1000 located at the position overlapping with the black matrix 340. The lower partition wall 900 may be located on the side surface of the second organic layer 334, and the upper partition wall 1000 may be located on the side surface of the second planarization layer 336. The lower partition wall 900, the upper partition wall 1000, the second organic layer 334, and the second planarization layer 336 may include different organic materials. For example, the first partition wall 510, the lower partition wall 900, and the upper partition wall 1000 may also be referred to as organic partition walls, but the embodiments of this disclosure are not limited thereto.

[0198] Reference Figure 9 The lower partition wall 900 may be located on the side surface of the second organic layer 334. The rear surface of the lower partition wall 900 may contact the upper surface of the second inorganic layer 333, and the upper surface of the lower partition wall 900 may contact the rear surface of the third inorganic layer 335. For example, the height of the lower partition wall 900 may include a height less than the height of each of the first lens 520 and the second lens 530, but embodiments of this disclosure are not limited thereto.

[0199] Reference Figure 10 The lower partition wall 900 may be located on the side surface of the second organic layer 334. The rear surface of the lower partition wall 900 may contact the upper surface of the second inorganic layer 333, and the upper surface of the lower partition wall 900 may contact the rear surface of the third inorganic layer 335. The second planarization layer 336 may be configured to extend above the side surface of the upper partition wall 1000 between the upper surface of the upper partition wall 1000 and the black matrix 340. For example, the height of the upper partition wall 1000 may include a height less than the height of each of the first lens 520 and the second lens 530, but embodiments of this disclosure are not limited thereto.

[0200] Reference Figure 11The lower partition wall 900 may be located on the side surface of the second organic layer 334. The rear surface of the lower partition wall 900 may contact the upper surface of the second inorganic layer 333, and the upper surface of the lower partition wall 900 may contact the rear surface of the third inorganic layer 335. The second planarization layer 336 may be configured to extend above the side surface of the upper partition wall 1000 between the upper surface of the upper partition wall 1000 and the black matrix 340. For example, the height of the upper partition wall 1000 may include a height corresponding to the height of each of the first lens 520 and the second lens 530, but embodiments of this disclosure are not limited thereto.

[0201] Reference Figure 12 The lower partition wall 900 may be located on the side surface of the second organic layer 334. The rear surface of the lower partition wall 900 may contact the upper surface of the second inorganic layer 333, and the upper surface of the lower partition wall 900 may contact the rear surface of the third inorganic layer 335. The rear surface of the upper partition wall 1000 may contact the upper surface of the third inorganic layer 335, and the upper surface of the upper partition wall 1000 may contact the rear surface of the fourth inorganic layer 337. For example, the height of the upper partition wall 1000 may include a height greater than the height of each of the first lens 520 and the second lens 530, but embodiments of this disclosure are not limited thereto.

[0202] Reference Figures 5 to 12 The first light can be emitted from the first light-emitting element ED1 at any angle including angles a, b, and c. Angles a, b, and c can include at least one of 30°, 45°, and 60°. For example, angle a can be 30°, angle b can be 45°, and angle c can be 60°, but the embodiments of this disclosure are not limited thereto.

[0203] For example, when first light emitted from the first light-emitting element ED1 at any angle including angles a, b, and c passes through the second color filter 541, wavelength band overlap may occur. For example, the first partition wall 510 may reflect the light of the overlapping wavelength bands. As another example, the first partition wall 510 may absorb the light of the overlapping wavelength bands, but embodiments of this disclosure are not limited thereto.

[0204] When the display device 100 according to the embodiments of this disclosure is implemented as a vehicle display, smartphone, or AR / VR device, a narrow viewing angle can be achieved, ensuring that the image provided to the user is not recognizable by people in the surrounding area. For example, the display device can use a light-controlling film (LCF) including a light-blocking pattern on the upper part of the display panel to limit the direction of light emitted from each light-emitting element. However, using a light-controlling film may lead to an increase in the thickness of the display panel, a decrease in its flexibility, and an increase in manufacturing costs.

[0205] Therefore, according to the viewing angle enhancement structure according to the embodiments of the present disclosure, when the display device 100 is implemented as a vehicle display, smartphone, or AR / VR device, the screen can be clearly seen from the front of the display device 100, but not from the side of the display device 100. In other words, the viewing angle enhancement structure according to the embodiments of the present disclosure can enhance narrow viewing angle characteristics.

[0206] Furthermore, according to the viewing angle enhancement structure of the embodiments of the present disclosure, light emitted from the light-emitting element of each sub-pixel can be emitted to the outside of the display panel 110 without being lost inside the display panel. In other words, the viewing angle enhancement structure according to the embodiments of the present disclosure can enhance light extraction.

[0207] Furthermore, the viewing characteristic enhancement structure according to the embodiments of this disclosure can also help prevent or reduce color mixing between two adjacent sub-pixels by assisting the forward propagation of light emitted by the light-emitting element of each sub-pixel.

[0208] Figures 13 to 16 This is a diagram illustrating the structure of the lower partition wall 900 and the upper partition wall 1000 of a display panel according to an embodiment of the present disclosure.

[0209] Reference Figure 13 The side surfaces of the lower partition wall 900 and the upper partition wall 1000 may include a conical shape. For example, the angle formed by the side surface and the rear surface of the lower partition wall 900 may include an acute angle. As another example, the angle formed by the side surface and the rear surface of the upper partition wall 1000 may include an acute angle, but embodiments of this disclosure are not limited thereto.

[0210] Reference Figure 14 The angle formed by the side surface and rear surface of the lower partition wall 900 and the upper partition wall 1000 may include a right angle. For example, the angle formed by the side surface and rear surface of the lower partition wall 900 may include a right angle. As another example, the angle formed by the side surface and rear surface of the upper partition wall 1000 may include a right angle, but the embodiments of this disclosure are not limited thereto.

[0211] Reference Figure 15 One of the side surfaces of the lower partition wall 900 and the upper partition wall 1000 may include a conical shape, and the other may include a shape different from a conical shape. For example, the angle formed by the side surface and the rear surface of the lower partition wall 900 may include an acute angle. As another example, the angle formed by the side surface and the rear surface of the upper partition wall 1000 may include a right angle, but embodiments of this disclosure are not limited thereto.

[0212] Reference Figure 16One of the side surfaces of the lower partition wall 900 and the upper partition wall 1000 may include a conical shape, and the other may include a shape different from a conical shape. For example, the angle formed between the side surface of the lower partition wall 900 and the rear surface may include a right angle. As another example, the angle formed between the side surface of the upper partition wall 1000 and the rear surface may include an acute angle, but embodiments of this disclosure are not limited thereto.

[0213] Figures 17 to 20 Examples of diagrams illustrating embodiments according to this disclosure are shown. For example, a first light-emitting element may emit first light including a first wavelength band, a second light-emitting element may emit second light including a second wavelength band, and a third light-emitting element may emit third light including a third wavelength band. As another example, the first wavelength band may be shorter than the second wavelength band, and the second wavelength band may be shorter than the third wavelength band, but embodiments of this disclosure are not limited thereto.

[0214] For example, one of the first, second, and third lights can be red (R), green (G), and blue (B), and another can be selected from red (R), green (G), and blue (B), and yet another can include red (R), green (G), and blue (B). For example, if the first light includes blue (B) light, the second light can include green (G) light, and the third light can include red (R) light. Embodiments of this disclosure are not limited thereto.

[0215] Figure 17 This is a graph illustrating an example of a spectrum according to wavelength bands according to an embodiment of the present disclosure. The X-axis represents the wavelength band of light, and the Y-axis represents the spectrum of light. A1 is the emission spectrum of first light emitted from the first light-emitting element, and A2 is the transmission spectrum of the first light as it passes through the first color filter. B1 is the emission spectrum of second light emitted from the second light-emitting element, and B2 is the transmission spectrum of the second light as it passes through the second color filter. C1 is the emission spectrum of third light emitted from the third light-emitting element, and C2 is the transmission spectrum of the third light as it passes through the third color filter.

[0216] Reference Figure 17 It can be identified that optical leakage occurred in wavelength band L1 where A1 and B2 overlap, wavelength band L2 where B1 and A2 overlap, and wavelength band L3 where C1 and B2 overlap.

[0217] Figure 18 This is a graph illustrating an example of the spectrum of an application of the first separator according to an embodiment of the present disclosure. The X-axis represents the wavelength band of light, and the Y-axis represents the spectrum of the first separator (also referred to as light intensity). D1 is the absorption or reflection spectrum of the first separator.

[0218] Reference Figure 18Referring to D1, which applies the structure of the first partition wall according to an embodiment of the present disclosure, the wavelength band corresponding to the overlapping region of the first wavelength band and the second wavelength band (corresponding to...) can be identified. Figure 17 Light in L1 is absorbed (or reflected). Therefore, light leakage in the overlapping region of the first and second wavelength bands can be prevented or reduced.

[0219] Figure 19 This is a graph illustrating an example of the spectrum before and after the application of the first partition wall according to an embodiment of the present disclosure. The X-axis represents the wavelength band of light, and the Y-axis represents the spectrum of leaked light. E1 is the leaked light spectrum according to the wavelength band before the application of the first partition wall, and F1 is the leaked light spectrum according to the wavelength band after the application of the first partition wall.

[0220] Reference Figure 19 E1 and F1 represent the wavelength bands (corresponding to) in the region where the first wavelength band and the second wavelength band overlap before and after the application of the first partition wall according to embodiments of this disclosure. Figure 17 The graph shows the leakage light in L1. It can be identified that the leakage light in F1 is reduced by 75% or more compared to E1.

[0221] Figure 20 This is a graph illustrating an example of the cutoff rate based on the viewing angle before and after applying the first partition according to an embodiment of the present disclosure. The X-axis represents the viewing angle (°), and the Y-axis represents the light intensity. G1 is a graph of light intensity based on the viewing angle before applying the first partition, and H1 and I1 are graphs of light intensity based on the viewing angle after applying the first partition. The cutoff rate represents the maximum value of the ratio of the light intensity to the frontal brightness at a given angle.

[0222] Reference Figure 20 G1 exhibits light leakage at angles of -30° or greater, but structures H1 and I1, which have the first partition wall applied, exhibit enhanced cutoff due to the absorption or blocking of leaked light at all angles by the first partition wall.

[0223] The embodiments of the present disclosure described above are briefly described below.

[0224] The display panel according to the embodiments of the present disclosure may include a substrate and a first light-emitting element disposed on the substrate, and may include a second light-emitting element disposed on the substrate and adjacent to the first light-emitting element.

[0225] The encapsulation layer can be disposed on the first light-emitting element and the second light-emitting element, and the planarization layer can be disposed on the encapsulation layer.

[0226] The black matrix can be set on the planarization layer and can include a first opening and a second opening.

[0227] A first lens overlapping with the first opening can be disposed between the encapsulation layer and the planarization layer, and a second lens overlapping with the second opening can be disposed between the encapsulation layer and the planarization layer.

[0228] The first color filter can be disposed on the black matrix and overlap with the first opening, and the second color filter can be disposed on the black matrix and overlap with the second opening corresponding to the second light-emitting element.

[0229] The partition wall can overlap with the black matrix and can be set on the side surface of at least one of the encapsulation layer and the planarization layer.

[0230] The height of each of the first and second lenses can be less than the height of the planarization layer.

[0231] Each of the first and second lenses may include a flat lower surface and a convex upper surface.

[0232] The encapsulation layer may include a first inorganic layer disposed on the first light-emitting element and the second light-emitting element. A first organic layer may be disposed on the first inorganic layer, a second inorganic layer may be disposed on the first organic layer, a second organic layer may be disposed on the second inorganic layer, and a third inorganic layer may be disposed on the second organic layer.

[0233] The partition wall may be located on the side surface of the second organic layer. The partition wall may include a lower partition wall located on the side surface of the second organic layer and an upper partition wall located on the side surface of the planarization layer (corresponding to the second planarization layer 336 mentioned above).

[0234] The lower surface of the lower partition wall can contact the upper surface of the second inorganic layer, and the upper surface of the lower partition wall can contact the lower surface of the third inorganic layer.

[0235] The lower surface of the upper partition wall can contact the upper surface of the third inorganic layer, and the second planarization layer can be configured to extend from the side surface of the upper partition wall between the upper surface of the upper partition wall and the black matrix.

[0236] The height of the upper partition wall can be less than the height of each of the first and second lenses.

[0237] The height of the upper partition wall can correspond to the height of each of the first and second lenses.

[0238] The height of the upper partition wall can be greater than the height of either the first lens or the second lens.

[0239] The fourth inorganic layer may be further included between the second planarization layer and the black matrix, and the lower surface of the upper partition wall may contact the upper surface of the third inorganic layer, and the upper surface of the upper partition wall may contact the lower surface of the fourth inorganic layer.

[0240] The side surfaces of the lower partition wall and the upper partition wall may include a conical shape.

[0241] One of the side surfaces of the lower partition wall and the upper partition wall may include a conical shape, and the other may include a shape different from a conical shape.

[0242] The angle formed by the side surface and the bottom surface of the partition wall can be acute.

[0243] The angle formed by the side surface and the bottom surface of the partition wall can be a right angle.

[0244] The separator may include an organic material that is different from the organic material included in the encapsulation layer.

[0245] The partition wall may include organic materials containing light-absorbing materials.

[0246] The partition wall may include organic materials containing reflective materials.

[0247] The first light emitted from the first light-emitting element may include a first wavelength band, the second color filter may transmit second light having a second wavelength band longer than the first wavelength band, and the partition wall may absorb light in the wavelength band where the first wavelength band and the second wavelength band overlap.

[0248] The first light emitted from the first light-emitting element may include a first wavelength band, the second color filter may transmit second light having a second wavelength band longer than the first wavelength band, and the partition wall may reflect light in the wavelength band where the first wavelength band and the second wavelength band overlap.

[0249] The partition wall can surround each of the first and second openings.

[0250] The display panel according to the embodiments of the present disclosure may include a substrate and a first light-emitting element disposed on the substrate, and may include a second light-emitting element disposed on the substrate and adjacent to the first light-emitting element.

[0251] It may include a dam disposed between the first light-emitting element and the second light-emitting element, and a black matrix disposed on the first light-emitting element and the second light-emitting element and including a first opening and a second opening.

[0252] It may include a first color filter that overlaps with the first opening, and a second color filter disposed on the black matrix and overlapping with the second opening.

[0253] It may include a first protrusion disposed between the first light-emitting element and the first color filter, overlapping with the first opening and having a protruding upper surface, and a second protrusion disposed between the second light-emitting element and the second color filter, overlapping with the second opening and having a protruding upper surface.

[0254] It may include an organic partition wall, which is provided between the embankment and the black matrix and includes organic material.

[0255] The lower surface of each of the first protrusion and the second protrusion may be located further away from the substrate than the lower surface of the organic separator wall.

[0256] It may also include an encapsulation layer disposed between the first and second light-emitting elements and the first and second color filters, and the encapsulation layer may alternately include multiple organic layers and inorganic layers. The multiple organic layers include a first organic material, and the organic spacers may include a second organic material different from the first organic material.

[0257] The light absorption rate of the second organic material can be higher than that of the first organic material.

[0258] The light reflectance of the second organic material can be higher than that of the first organic material.

[0259] According to the embodiments of the present disclosure described above, a display device can be provided having a structure that enables desired viewing angle characteristics to be achieved through a partition wall structure.

[0260] According to embodiments of the present disclosure, a display device may be provided having a structure that further facilitates the realization of desired viewing angle characteristics through a lens structure.

[0261] According to embodiments of the present disclosure, a display device can be provided having a structure capable of achieving viewing angle characteristics in a display panel without the need to attach a separate film to the display panel for achieving the desired viewing angle characteristics.

[0262] According to embodiments of this disclosure, viewing angle characteristics can be controlled in a desired manner without performing a membrane attachment process, thereby enabling process optimization.

[0263] According to embodiments of this disclosure, the flexibility of the display panel can be enhanced and its thickness can be further reduced because the desired viewing angle characteristics can be achieved without using an external film.

[0264] An organic partition wall can be disposed between the first protrusion and the second protrusion.

[0265] The above description has been presented to enable any person skilled in the art to make and utilize the technical ideas of this disclosure, and has been provided in the context of specific application scenarios and their requirements. Various modifications, additions, and substitutions to the described embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of this disclosure. The above description and accompanying drawings are provided as examples of the technical ideas of this disclosure for illustrative purposes only. For example, the disclosed embodiments are intended to illustrate the scope of the technical ideas of this disclosure.

[0266] Cross-reference to related applications

[0267] This application claims the benefit and priority of Korean Patent Application No. 10-2024-0171742, filed in Korea on November 27, 2024, which is expressly incorporated herein by reference in its entirety for all purposes, as if fully set forth herein.

Claims

1. A display device, the display device comprising: substrate; A first light-emitting element and a second light-emitting element are disposed on the substrate and are adjacent to each other; An encapsulation layer is disposed on the first light-emitting element and the second light-emitting element; A planarization layer is disposed on the encapsulation layer; A black matrix is ​​disposed on the planarization layer and includes a first opening and a second opening respectively corresponding to the first light-emitting element and the second light-emitting element; as well as A partition wall, which overlaps with the black matrix and is disposed on the side surface of at least one of the encapsulation layer and the planarization layer.

2. The display device according to claim 1, further comprising: A first lens is disposed between the encapsulation layer and the planarization layer and overlaps with the first opening; as well as The second lens is disposed between the encapsulation layer and the planarization layer and overlaps with the second opening.

3. The display device according to claim 2, in, The height of each of the first lens and the second lens is less than the height of the planarization layer.

4. The display device according to claim 2, wherein, Each of the first lens and the second lens includes a flat lower surface and a convex upper surface.

5. The display device according to claim 2, wherein, The encapsulation layer includes: A first inorganic layer is disposed on the first light-emitting element and the second light-emitting element; A first organic layer is disposed on the first inorganic layer; A second inorganic layer is disposed on the first organic layer; A second organic layer, wherein the second organic layer is disposed on the second inorganic layer; and A third inorganic layer is disposed on the second organic layer, and The partition wall is located on the side surface of the second organic layer.

6. The display device according to claim 5, wherein, The partition wall includes: The lower partition wall is located on the side surface of the second organic layer; and Upper partition wall, which is located on the side surface of the planarization layer.

7. The display device according to claim 6, wherein, The lower surface of the lower partition wall contacts the upper surface of the second inorganic layer, and the upper surface of the lower partition wall contacts the lower surface of the third inorganic layer.

8. The display device according to claim 6, wherein, The lower surface of the upper partition wall contacts the upper surface of the third inorganic layer, and The planarization layer is configured to extend above the side surface of the upper partition wall between the upper surface of the upper partition wall and the black matrix.

9. The display device according to claim 6, wherein, The height of the upper partition wall is less than the height of each of the first lens and the second lens.

10. The display device according to claim 6, wherein, The height of the upper partition wall corresponds to the height of each of the first lens and the second lens.

11. The display device according to claim 6, wherein, The height of the upper partition wall is greater than the height of each of the first lens and the second lens.

12. The display device according to claim 6, further comprising a fourth inorganic layer between the planarization layer and the black matrix. in, The lower surface of the upper partition wall contacts the upper surface of the third inorganic layer, and The upper surface of the upper partition wall contacts the lower surface of the fourth inorganic layer.

13. The display device according to claim 6, wherein, The side surfaces of the lower partition wall and the upper partition wall have a conical shape.

14. The display device according to claim 6, wherein, One of the side surfaces of the lower partition wall and the upper partition wall has a conical shape, and the other has a shape different from the conical shape.

15. The display device according to claim 1, wherein, The angle formed between the side surface and the lower surface of the partition wall is an acute angle.

16. The display device according to claim 1, wherein, The angle formed between the side surface and the lower surface of the partition wall is a right angle.

17. The display device according to claim 1, wherein, The partition wall comprises an organic material that is different from the organic material included in the encapsulation layer.

18. The display device according to claim 1, wherein, The partition wall comprises an organic material containing light-absorbing material.

19. The display device according to claim 1, wherein, The partition wall comprises an organic material containing reflective material.

20. The display device according to claim 1, further comprising: A first color filter is disposed on the black matrix and overlaps with the first opening; as well as A second color filter is disposed on the black matrix and overlaps with the second opening.

21. The display device according to claim 20, wherein, The first light emitted from the first light-emitting element includes a first wavelength band. The second color filter transmits second light with a second wavelength band longer than the first wavelength band, and The partition wall absorbs light from the wavelength band where the first wavelength band and the second wavelength band overlap.

22. The display device according to claim 20, wherein, The first light emitted from the first light-emitting element includes a first wavelength band. The second color filter transmits second light with a second wavelength band longer than the first wavelength band, and The partition wall reflects light from the overlapping wavelength band of the first and second wavelength bands.

23. The display device according to claim 1, wherein, The partition wall surrounds each of the first opening and the second opening.

24. A display device, the display device comprising: substrate; A first light-emitting element and a second light-emitting element are disposed on the substrate and are adjacent to each other; A dam is disposed between the first light-emitting element and the second light-emitting element; A black matrix, wherein the black matrix is ​​disposed on the first light-emitting element and the second light-emitting element and includes a first opening and a second opening; A first color filter is disposed on the black matrix and overlaps with the first opening; A second color filter is disposed on the black matrix and overlaps with the second opening; The first protrusion is disposed between the first light-emitting element and the first color filter, overlaps with the first opening, and has a protruding upper surface; The second protrusion is disposed between the second light-emitting element and the second color filter, overlaps with the second opening, and has a protruding upper surface; as well as An organic partition wall is disposed between the embankment and the black matrix and comprises organic material.

25. The display device according to claim 24, wherein, The lower surface of each of the first protrusion and the second protrusion is positioned further away from the substrate than the lower surface of the organic separator wall.

26. The display device according to claim 24, further comprising an encapsulation layer disposed between the first light-emitting element and the second light-emitting element and the first color filter and the second color filter, in, The encapsulation layer alternately comprises multiple organic layers and multiple inorganic layers. Wherein, the plurality of organic layers include a first organic material, and The organic separator wall includes a second organic material that is different from the first organic material.

27. The display device according to claim 26, wherein, The light absorption rate of the second organic material is higher than that of the first organic material.

28. The display device according to claim 27, wherein, The light reflectance of the second organic material is higher than that of the first organic material.

29. The display device according to claim 24, wherein, The organic partition wall is disposed between the first protrusion and the second protrusion.

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