An open circuit failure type transient voltage suppression diode
By integrating a fuse within the TVS diode package, the problem of requiring an additional series fuse in existing TVS diode technologies is solved, achieving device integration and improved reliability, and simplifying circuit design.
CN122121670APending Publication Date: 2026-05-29CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
- Filing Date
- 2026-01-22
- Publication Date
- 2026-05-29
AI Technical Summary
Technical Problem
Existing TVS diodes require an additional series fuse to achieve open-circuit failure functionality, which increases the difficulty of PCB design and reliability issues.
Method used
The fuse is integrated into the TVS tube package, and the fuse and TVS chip are integrated by connecting them with solder pads and solder, making use of the internal space of the package to replace the traditional bonding wire connection.
Benefits of technology
It reduces PCB area requirements, simplifies circuit design, avoids reliability issues associated with traditional bonding wires, and achieves integration of fuses and TVS.
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Smart Images
Figure CN122121670A_ABST
Abstract
The application discloses an open-circuit failure type transient voltage suppression diode, which comprises an SMD-0.3 tube seat; a lower electrode sheet, a TVS chip and an upper electrode sheet are fixed on the large electrode of the tube seat through welding sheets; the small electrode of the tube seat and the top of the upper electrode sheet are connected through a fuse; the fuse is used to replace the bonding wire in the traditional transient voltage suppression diode packaging structure, and the negative electrode of the TVS chip is connected with the corresponding electrode of the packaging structure. The packaging structure realizes the integration of the fuse and the TVS, fully utilizes the internal space size of the packaging, reduces the PCB area of the protection device in the electronic system, and reduces the design workload of the circuit design engineer for the protection system; on the other hand, the fuse replaces the bonding wire in the traditional packaging scheme, and the leadless bonding avoids the reliability problem caused by the traditional bonding wire.
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