Plating medium, method for producing plating medium, and method for recycling plating medium

Abstract

In one embodiment of the present application, a plating medium is provided, which has a core and a shell provided on the surface of the core, the shell constituting a multilayer body of two or more metal-containing layers.

Description

Technical Field

[0001] This invention relates to a plating medium, a method for manufacturing the plating medium, and a method for reusing the plating medium. Background Technology

[0002] Plating apparatuses using barrel plating methods have long been known. These apparatuses include a barrel, an anode electrode, and a cathode electrode within a plating bath containing a plating solution. The barrel rotates about an axis, and the workpiece to be plated, a conductive plating medium, and the cathode electrode are located inside it. A conductive plating medium is used to improve plating efficiency by allowing current to flow efficiently into the workpiece.

[0003] In this configuration, if current flows between the anode electrode and the cathode electrode, a coating is formed on the surface of the object to be coated and the medium via the coating solution from the coating supply source of the anode electrode.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2010-100920 Summary of the Invention

[0007] Here, from the perspective of efficient utilization, the reuse of the plating medium is anticipated in the plating apparatus. Furthermore, the provision of more suitable conductivity and / or other properties besides conductivity, such as corrosion resistance, is also expected in the plating medium.

[0008] The present invention was made in view of the above circumstances. That is, the object of the present invention is to provide a plating medium, a method for manufacturing the plating medium, and a method for reusing the plating medium, wherein the plating medium can be reused and provides more suitable conductivity and / or other properties other than conductivity such as conductivity and corrosion resistance.

[0009] To achieve the above objectives, in one embodiment of the present invention,

[0010] A plating medium is provided, comprising a core and a shell disposed on the surface of the core.

[0011] The aforementioned shell constitutes a multilayer body with two or more metal layers.

[0012] To achieve the above objectives, in one embodiment of the present invention,

[0013] A method for manufacturing a plating medium is provided, comprising a step of preparing a core and a step of forming a shell having two or more metal layers on the surface of the core.

[0014] To achieve the above objectives, in one embodiment of the present invention,

[0015] A method for reusing a plating medium is provided, comprising a core and a shell disposed on the surface of the core, wherein the shell constitutes a multilayer body containing two or more metal layers.

[0016] After the plating process, the plating material on the surface of the plating medium and at least one metal-containing layer of the plating medium are peeled off.

[0017] According to one embodiment of the present invention, it is possible to reuse the plating medium and provide more suitable conductivity and / or other properties other than conductivity such as conductivity and corrosion resistance. Attached Figure Description

[0018] Figure 1 This is a schematic cross-sectional view of a plating apparatus (before power is applied) having a plating medium according to one embodiment of the present invention.

[0019] Figure 2 This is a schematic cross-sectional view of the plating medium according to the first embodiment of the present invention.

[0020] Figure 3 This is a schematic cross-sectional view of the plating medium according to the second embodiment of the present invention.

[0021] Figure 4 This is a schematic cross-sectional view of the plating medium according to the third embodiment of the present invention.

[0022] Figure 5 This is a cross-sectional view schematically showing the state in which a coating layer is formed on the surface of the coating medium in the first embodiment of the present invention.

[0023] Figure 6 This is a schematic cross-sectional view of the manufacturing process of the plating medium according to the first embodiment of the present invention.

[0024] Figure 7 This is a schematic cross-sectional view of the manufacturing process of the plating medium according to the second embodiment of the present invention.

[0025] Figure 8 This is a schematic cross-sectional view of the manufacturing process of the plating medium according to the third embodiment of the present invention.

[0026] Figure 9 This is a schematic cross-sectional view illustrating the apparatus used for implementing a method for reusing a plating medium according to one embodiment of the present invention. Detailed Implementation

[0027] Hereinafter, embodiments of the present invention will be described in detail using the accompanying drawings. For convenience, embodiments are sometimes distinguished, but different substitutions or combinations of the components shown in the embodiments are possible. Therefore, this disclosure is not explicitly limited to the preferred mode of non-limiting combination of the features under consideration (either alone or in combination with other features). In the embodiments described below, descriptions of matters common to the above are omitted, and only the differences are explained. In particular, the same effects produced by the same configuration will not be repeated in each embodiment.

[0028] In the following embodiments, elements not described in the independent claims may be described as arbitrary elements. Furthermore, the dimensions and aspect ratios of the elements shown in the drawings are not necessarily precise. Additionally, in the figures, substantially identical components are labeled with the same symbols, and sometimes repeated descriptions are omitted or simplified.

[0029] Figure 1 is a schematic cross-sectional view of a plating apparatus having a plating medium according to one embodiment of the present invention.

[0030] like Figure 1 As shown, the plating apparatus 50 includes a drum 3, a cathode electrode 4, an anode electrode 5, and a power supply 7 that electrically connects the electrodes in a plating bath 2 containing a plating solution 1. The drum 3 has the shape of a container that can rotate about an axis, and the object to be plated 6, the conductive medium 10, and the cathode electrode 4 are located inside it.

[0031] From the viewpoint of improving plating efficiency by efficiently allowing current to flow into the plated object 6, a conductive medium 10 can be provided. The cathode electrode 4 can be made of, for example, stainless steel, copper, etc. As the plated object 6, an electronic component having electrodes can be cited as an example. The anode electrode 5 can be made of the same material as the plating layer formed on the plated object, such as the electrode of the electronic component.

[0032] In the above configuration, during use, the drum 3 rotates around its axis, and the object to be plated, housed within the drum 3, is stirred together with the medium 10 in the plating solution 1. Based on this, the driving power supply 7 applies a positive voltage to the anode electrode 5 and a negative voltage to the cathode electrode 4, allowing current to flow between the anode electrode 5 and the cathode electrode 4 through the plating solution 1. Thus, the object to be plated 6 and the cathode electrode 4 can be connected via the medium 10.

[0033] Under the aforementioned energized state, the metal ions that can form a plating film, dissolved from the anode electrode 5 in the plating solution 1, are reduced on the surface of the object to be plated 6, forming a metal plating layer on the surface of the object to be plated 6. At this time, a metal plating layer can also be formed not only on the object to be plated 6, but also on the surface of the medium 10.

[0034] [First Embodiment]

[0035] The following describes the characteristic features of the present invention. The present invention is characterized in that the conductive plating medium 10 used in the plating apparatus 50 is configured as follows.

[0036] The inventors of this application have conducted in-depth research on the composition of a medium 10 that enables reuse from the viewpoint of efficient utilization, provides more appropriate conductivity, and / or provides properties other than conductivity such as conductivity and corrosion resistance. As a result, the inventors of this application have newly developed a medium 10 having the following composition.

[0037] Figure 2 This is a schematic cross-sectional view of the plating medium according to the first embodiment of the present invention.

[0038] like Figure 2 As shown, the plating medium 10 of the first embodiment includes a core 11 and a shell 12 disposed on the surface of the core 11. In this specification, the core 11 may also be referred to as a core material. Furthermore, the medium 10 of the first embodiment is characterized in that the shell 12 constitutes a multilayer body 13 with two metal layers. Figure 2 In the configuration shown, the multilayer body 13 of the shell 12 has a first metal-containing layer 14 in contact with the core 11 and a second metal-containing layer 15 located outside the first metal-containing layer 14. The term "plating medium" as used in this specification refers to an auxiliary medium used to smoothly perform the plating process in the plating apparatus; it may also be called a plating auxiliary component, plating medium, plating catalyst, plating medium, plating tool, or plating fixture.

[0039] While not specifically limited, core 11 may, for example, be at least one selected from ceramics, resins, and glass. The ceramics described above may contain at least one selected from alumina, zirconium oxide, sapphire, yttrium oxide, magnetite, cermet, silicon carbide, silicon nitride, aluminum nitride, talc ceramics, cordierite, and quartz glass. The resins described above may, for example, contain at least one selected from PP, PE, and PTFE.

[0040] Although not specifically limited, the first metal-containing layer 14 may contain at least one element selected from Ni, Cu, Pd, Sn, Ag, Zn, Co, Au, Pt, In, and Bi as a main component. Furthermore, the second metal-containing layer 15 may contain at least one element selected from Sn, Ni, Cu, Pd, Pt, and Au. For example, the first metal-containing layer 14 may be composed of Ni (Ni layer or dispersed Ni) imparted by electroless plating, and the second metal-containing layer 15 may be composed of Ni layer imparted by electrolytic plating. Additionally, the first metal-containing layer 14 may contain additives such as Sn, S, Ni, Co, Fe, C, P, and / or B. In this specification, the term "metal-containing layer" as used for the first metal-containing layer refers not only to a continuous layered form but also to a form in which the metal is discontinuously dispersed or dispersed (e.g., the components of the first metal-containing layer are dispersed or dispersed on the surface of the core 11).

[0041] When the metal layer contains Ni as a metal element, improved corrosion resistance and solderability can be achieved. When the metal layer contains Cu as a metal element, improved electrical conductivity can be achieved. When the metal layer contains Sn as a metal element, improved oxidation resistance and anti-sintering properties can be achieved. When the metal layer contains Pd as a metal element, improved corrosion resistance and wear resistance can be achieved. When the metal layer contains Pt as a metal element, improved corrosion resistance and oxidation resistance can be achieved. When the metal layer contains Au as a metal element, improved corrosion resistance, oxidation resistance, electrical conductivity, and low electrical resistance can be achieved. The properties of these metal elements are the same in the following second and third embodiments.

[0042] The first metal-containing layer 14, containing the aforementioned metallic elements, can be a dry plating layer or a wet plating layer. For a dry plating layer, it can be formed on the surface of the prepared core 11 (equivalent to the core material) using at least one method selected from CVD, sputtering, PVD, vacuum evaporation, melt plating, spraying, and impact electroplating (see reference). Figure 6 It should be noted that, in addition to plating, the first metal layer 14 can also be formed by methods such as coating, sol-gel, electrolytic polymerization and / or electroforming.

[0043] When the first metal layer 14 is a wet plating layer, it can be formed by performing an electroless plating (or electrolytic plating) process on the surface of the prepared core 11 (equivalent to the core material) (see reference). Figure 6 In the absence of electrolytic plating, a catalyst needs to be applied to the surface of the core 11. This catalyst may contain at least one selected from Pd, Ag, and Ni. It should be noted that after the formation of the first metal-containing layer 14, the catalyst may remain in the first metal-containing layer 14 or disappear from the first metal-containing layer 14.

[0044] The catalysts mentioned above can be selected from catalysis, displacement, sensitization, and other methods. At least one of the activation method and the alkaline reduction method (DMAB method) is applied to the surface of core 11. It should be noted that, from the viewpoint of properly applying a catalyst, it is preferable to perform a degreasing process before applying the catalyst.

[0045] The second metal-containing layer 15, containing the aforementioned metallic elements, can be a dry plating layer or a wet plating layer. For a dry plating layer, it can be formed on the surface of the formed first metal-containing layer 14 using at least one method selected from CVD, sputtering, PVD, vacuum evaporation, melt plating, spraying, and impact electroplating (see reference). Figure 6 It should be noted that, in addition to plating, the second metal layer 15 can also be formed by methods such as coating, sol-gel, electrolytic polymerization and / or electroforming.

[0046] Alternatively, if the second metal-containing layer 15 is a wet plating layer, it can be formed by electroless plating or electrolytic plating treatment on the surface of the first metal-containing layer 14 (see reference). Figure 6 In the absence of electrolytic plating, a catalyst can be applied to the surface of the first metal layer 14, which may contain at least one catalyst selected from Pd, Ag, and Ni. It should be noted that, based on both manufacturing and cost efficiency, electrolytic plating, which enables the formation of the plating layer without the use of a catalyst, is preferred.

[0047] As described above, in this embodiment, based on the aforementioned features, the multilayer containing two metal layers can have the same or different properties. This allows for the provision of more suitable conductivity and / or other properties besides conductivity.

[0048] For example, in Figure 2 In the configuration shown, both the first metal-containing layer 14 and the second metal-containing layer 15 can possess conductive properties. This allows for a more appropriate enhancement of the conductivity between the plated object 6 and the cathode electrode 4. In other words, the overall conductivity can be further improved.

[0049] Furthermore, the first metal-containing layer 14 primarily possesses conductive properties, while the outermost second metal-containing layer 15, in addition to conductivity, may also possess other properties such as oxidation resistance. That is, it may also possess the oxidation-resistant properties of the medium 10 itself.

[0050] This is effective for situations where the plating medium 10 is placed in front of the drum of the plating apparatus and stored for a long period of time before the object to be plated is plated. On the other hand, if the medium 10 is not stored for a long period of time, the outermost second metal-containing layer 15 does not necessarily need to have oxidation resistance.

[0051] In addition, a metal plating layer 20 is also formed on the surface of the medium 10, not only on the plated object 6 (see reference). Figure 5 and Figure 6 Afterwards, by peeling off the metal plating layer 20 and at least one metal-containing layer of the shell 12 constituting the medium 10, the medium 10 can be reused. It should be noted that, in Figure 5 In the text, the symbol 10 represents a medium without the metal plating layer 20, and the symbol 30 represents a medium 10 with the metal plating layer 20.

[0052] In one example, such as Figure 6 As shown, the metal plating layer 20 and the two metal-containing layers 14 and 15 constituting the shell of the medium 10 can be peeled off. Therefore, after peeling, the core 11 (equivalent to the core material) in the medium 10 can be reused. The surface roughness of the core at this time can be 0.001 μm to 100 μm. Preferably, it is 0.01 μm to 10 μm, more preferably 0.3 μm to 1.1 μm, and even more preferably 0.4 μm to 0.9 μm. Furthermore, the peeled metal-containing layers can also be reused. The dissolved metal-containing layer components can be recovered in the form of metal by electrodeposition or separated and extracted using an ion exchange column using methods described later for reuse.

[0053] In this case, by performing operations to sequentially form the first metal-containing layer 14 and the second metal-containing layer 15 from the inside of the reusable core 11, a medium 10 with the desired configuration can be remade.

[0054] It should be noted that it is not necessary to peel off all the metal-containing layers that make up the shell of the medium 10. As long as a highly corrosion-resistant material is selected as the constituent element of the first metal-containing layer 14, and the thickness of the first metal-containing layer 14 is relatively thicker than the thickness when the layer is peeled off, the first metal-containing layer 14 can be kept attached to the core, and only the second metal-containing layer 15 can be peeled off.

[0055] In this case, by forming only the second metal-containing layer 15 on the surface of the first metal-containing layer 14 attached to the core, it is possible to recreate the medium 10 with the desired configuration.

[0056] The above-mentioned stripping can be performed, for example, by reverse electrolysis, melting, or chemical abrasion impregnation.

[0057] like Figure 9 As shown, in the reverse electrolysis method, when the... Figure 1 Based on the reversed configuration of the cathode electrode 4 and anode electrode 5 shown, a voltage is applied between the electrodes using a power supply 7a, causing the metal plating layer 20 formed on the surface of the dielectric 10 (see reference) to... Figure 5The metal layer comprising the medium 10 and at least one metal-containing layer dissolves into the electrolyte 1a. After dissolution, the metal component is deposited on the cathode electrode 4 side. The electrolyte 1a can be, for example, dilute nitric acid, dilute sulfuric acid, dilute alkali, or a diluted plating solution.

[0058] In this case, to prevent the components of not only the metal-containing layer constituting the shell of the dielectric 10 but also the core 11 from dissolving out and potentially hindering the reuse of the core 11, the core 11 preferably has an insulating surface. From the viewpoint of improving insulation, it is more preferable that the core 11 is insulating not only on its surface but also inside its interior, and even more preferably that the entire core 11 is insulating. The “insulation” of the core referred to here means a state in which current generated with the applied voltage does not flow into the core or is difficult to flow into it, and thus prevents the components of the core 11 from dissolving from the core surface into the electrolyte.

[0059] In the melt method, using Figure 1 After the plating apparatus shown performs the plating process, the object to be plated 6 with the plating layer and the medium 10 with the plating layer 20 (refer to) are plated together. Figure 5 The medium 10 with the coating 20 is then removed from the drum 3. Afterward, the removed medium 10 with the coating 20 is subjected to heat treatment for melting in a melting furnace, for example at 1700°C.

[0060] In this case, to prevent not only the metal-containing layer constituting the shell of the medium 10 but also the components of the core 11 from melting, which could make it difficult to reuse the core 11, the melting point of the core 11 is preferably higher than that of the metal-containing layer of the multilayer body 13. The ceramic described above can be used as the core 11. Examples of ceramics that can be used include alumina with a melting point of 2070 degrees Celsius and zirconium oxide with a melting point of 2700 degrees Celsius.

[0061] In the chemical grinding and impregnation method, the following methods are used: Figure 1 After the plating apparatus shown performs the plating process, the object to be plated 6 with the plating layer and the medium 10 with the plating layer 20 (refer to) are plated together. Figure 5 The dielectric 10 with the coating layer 20 is then removed from the drum 3. Afterward, the removed dielectric 10 is immersed in a chemical polishing slurry. Examples of chemical polishing slurries include nitric acid, hydrochloric acid, SPS (sodium persulfate), aqueous solutions of sulfuric acid and hydrogen peroxide, and aqueous solutions of phosphoric acid and hydrogen peroxide. The chemical polishing slurry can also be called an etching solution. Alternatively, it can be stripped by performing a reverse electrolytic drum treatment.

[0062] In this case, to prevent not only the metal-containing layer constituting the shell of the medium 10 but also the components of the core 11 from dissolving, which could make the reuse of the core 11 difficult, the core 11 preferably has a reagent-resistant surface. From the viewpoint of improving reagent resistance, the core 11 is more preferably reagent-resistant not only on its surface but also inside its interior, and the core 11 as a whole is even more preferably reagent-resistant. The term "reagent resistance" of the core, broadly speaking, refers to the durability of the core components against reagents such as chemical polishing slurries. Narrowly speaking, the term "reagent resistance" of the core refers to the state in which the core components in the coated medium do not dissolve or are difficult to dissolve when immersed in a chemical polishing slurry.

[0063] The first metal-containing layer 14 can have a thickness of 0.01 μm to 1 μm. By making the thickness 0.01 μm or more, the specified conductivity and the adhesion to the surface of the core 11 can be ensured. As a result, the second metal-containing layer 15 can be prevented from peeling off along with the first metal-containing layer 14. Consequently, the dielectric 10 can function properly, and a coating layer can be appropriately formed on the substrate 6 within the roller 3.

[0064] Furthermore, by making the thickness less than 1 μm, the medium 10 itself becomes heavier, which can suppress the situation where it is difficult to achieve a balance between the substrate 6 and the medium 10. As a result, the substrate 6 and the medium 10 can be uniformly mixed in the drum 3, and the energization can be stabilized, thereby making the thickness of the coating layer formed on the substrate 6 uniform.

[0065] The second metal-containing layer 15 can have a thickness of 0.1 μm to 10 μm. By making the thickness 0.1 μm or more, it is possible to ensure appropriate conductivity and other properties (such as oxidation resistance) as well as to ensure adhesion to the surface of the first metal-containing layer 14. In addition, by making the thickness 10 μm or less, the dielectric 10 itself becomes heavier, which can suppress the situation where it is difficult to achieve a balance between the plated object 6 and the dielectric 10. As a result, the plated object 6 and the dielectric 10 can be uniformly mixed in the drum 3, and the current stabilization can be achieved, making the thickness of the plating layer formed on the plated object 6 uniform.

[0066] The shape of medium 10 is as follows Figure 1 As shown, it can be spherical, or it can be the same shape as the object to be plated (e.g., cuboid). Thus, the mixing state of the object to be plated 6 and the medium 10 can be appropriately changed inside the roller 3, which can increase the precipitation rate of the coating layer on the object to be plated 6 or make the coating layer precipitate uniformly.

[0067] Preferably, the roller 3 further contains granular insulators. The presence of these insulators prevents unwanted bonding between the dielectric 10 and the object to be plated 6 (electronic components, etc.). As a result, the quality of the plating layer on the object to be plated 6 can be improved.

[0068] It should be noted that in electroless plating, if the first metal-containing layer that can serve as the base layer and the second metal-containing layer 15 of other layers both have Ni content, the state of each layer can be determined based on the impurity content and crystallinity in the first metal-containing layer.

[0069] Alternatively, the state of each layer can be confirmed by creating cross-sections of each metal-containing layer and using EDX and WDX for elemental mapping. In electroless plating, the first metal-containing layer, which serves as the substrate, can contain B (boron) and / or P (phosphorus). Therefore, layers containing B and / or P can be used as the substrate layer.

[0070] Furthermore, in the case of forming a metal-containing layer by means other than electroplating, a cross-section can be prepared using FIB-SIM to confirm crystallinity and identify each layer based on the different orientations of the first metal-containing layer 14 and the second metal-containing layer 15.

[0071] [Second Implementation]

[0072] The second embodiment will now be described. The second embodiment differs from the first embodiment in that the multilayer body 13 of the shell 12 has a third metal-containing layer 16 located outside the second metal-containing layer 15.

[0073] Figure 3 This is a schematic cross-sectional view of the plating medium according to the second embodiment of the present invention.

[0074] The third metal-containing layer 16 may contain at least one element selected from Sn, Ni, Cu, Pd, Pt, and Au. The third metal-containing layer 16 containing this metal element may be a dry plating layer or a wet plating layer. Similar to the second metal-containing layer 15, for dry plating layers, at least one method selected from CVD, sputtering, PVD, vacuum evaporation, melt plating, spraying, and shock plating can be used to form the surface of the formed second metal-containing layer 15 (see reference). Figure 7 It should be noted that, in addition to plating, the third metal layer 16 can also be formed by methods such as coating, sol-gel, electrolytic polymerization and / or electroforming.

[0075] Alternatively, if the third metal-containing layer 16 is a wet plating layer, it can be formed by electroless plating or electrolytic plating treatment on the surface of the formed second metal-containing layer 15 (see reference). Figure 7 Without electrolytic plating, a catalyst can be applied to the surface of the second metal layer 15, which may contain at least one catalyst selected from Pd, Ag and Ni.

[0076] Based on the above, in this embodiment, compared to the first embodiment, by having a multilayer body with three (i.e., two or more) metal-containing layers, the three metal-containing layers can have the same or different properties. Therefore, compared to the first embodiment, it is possible to provide more appropriate conductivity and / or other properties besides conductivity.

[0077] For example, in Figure 3 In the configuration shown, the first metal-containing layer 14, the second metal-containing layer 15, and the third metal-containing layer 16 can all possess conductive properties. This allows for more appropriate conduction between the plated object 6 and the cathode electrode 4. Furthermore, while the first metal-containing layer 14 and the second metal-containing layer 15 primarily possess conductive properties, the outermost third metal-containing layer 16 can also possess other properties such as oxidation resistance in addition to conductivity.

[0078] In addition, a metal plating layer 20 is formed not only on the plated object 6, but also on the surface of the medium 10A (see reference). Figure 7 Afterwards, the medium 10A can be reused by peeling off the metal plating layer 20 and peeling off at least two metal-containing layers of the shell 12 constituting the medium 10A.

[0079] In one example, such as Figure 7 As shown, the metal plating layer 20 and the three metal-containing layers 14, 15, and 16 constituting the shell of the medium 10A can be peeled off. Thus, after peeling, the core 11 (equivalent to the core material) in the medium 10A can be reused.

[0080] Furthermore, the third metal-containing layer 16 may also have a thickness of 0.1 μm to 10 μm. By making the thickness 0.1 μm or more, it is possible to ensure appropriate conductivity and other properties mentioned above (such as oxidation resistance), as well as to ensure adhesion to the surface of the second metal-containing layer 15. In addition, by making the thickness 10 μm or less, the dielectric 10A itself becomes heavier, which can suppress the situation where it is difficult to achieve balance between the plated object 6 and the dielectric 10A.

[0081] [Third Implementation]

[0082] The third embodiment will now be described. The third embodiment differs from the second embodiment in that the multilayer body 13 of the shell 12 has a fourth metal-containing layer 17 located outside the third metal-containing layer 16.

[0083] Figure 4 This is a schematic cross-sectional view of the plating medium according to the third embodiment of the present invention.

[0084] The fourth metal-containing layer 17 may contain at least one element selected from Sn, Pd, Pt, and Au. The fourth metal-containing layer 17 containing this metal element can be a dry plating layer or a wet plating layer. Similar to the third metal-containing layer 16, for dry plating layers, at least one method selected from CVD, sputtering, PVD, vacuum evaporation, melt plating, spraying, and impact electroplating can be used to form the surface of the formed third metal-containing layer 16 (see reference). Figure 8 It should be noted that, in addition to plating, the fourth metal layer 17 can also be formed by methods such as coating, sol-gel, electrolytic polymerization and / or electroforming.

[0085] When the fourth metal-containing layer 17 is a wet plating layer, it can be formed by performing electroless plating or electrolytic plating on the surface of the formed third metal-containing layer 16 (see reference). Figure 8 Without electrolytic plating, a catalyst can be applied to the surface of the third metal layer 16, which may contain at least one catalyst selected from Pd, Ag and Ni.

[0086] Based on the above, in this embodiment, compared to the second embodiment, by having a multilayer body with four (i.e., two or more) metal-containing layers, the four metal-containing layers can have the same or different properties. Therefore, compared to the second embodiment, it is possible to provide more appropriate conductivity and / or other properties besides conductivity.

[0087] For example, in Figure 4 In the configuration shown, the first metal-containing layer 14, the second metal-containing layer 15, the third metal-containing layer 16, and the fourth metal-containing layer 17 can all possess conductive properties. This allows for more appropriate conduction between the plated object 6 and the cathode electrode 4. Furthermore, while the first to third metal-containing layers 14 primarily possess conductive properties, the outermost fourth metal-containing layer 17 can also possess other properties such as oxidation resistance in addition to conductivity.

[0088] In addition, a metal plating layer 20 is formed not only on the plated object 6, but also on the surface of the medium 10B (see reference). Figure 8 Afterwards, by peeling off the metal plating layer 20 and at least three metal-containing layers of the shell 12 constituting the medium 10B, the medium 10B can be reused.

[0089] In one example, such as Figure 8 As shown, the metal plating layer 20 and the four metal-containing layers 14 to 17 constituting the shell of the medium 10B can be peeled off. Thus, after peeling, the core 11 (equivalent to the core material) in the medium 10B can be reused.

[0090] The fourth metal-containing layer 17 can also have a thickness of 0.1 μm to 10 μm. By making the thickness 0.1 μm or more, it is possible to ensure the appropriate conductivity and other properties mentioned above (such as oxidation resistance) and to ensure the adhesion to the surface of the third metal-containing layer 16. In addition, by making the thickness 10 μm or less, the dielectric 10B itself becomes heavier, which can suppress the situation where it is difficult to achieve a balance between the plated object 6 and the dielectric 10B.

[0091] It should be noted that the various embodiments and modifications are illustrative, and the present invention is not limited to the various embodiments and modifications. Furthermore, the accompanying drawings are illustrative of constituent elements and are not limited in shape. In addition, different substitutions or combinations of the components shown in the various embodiments and modifications are possible. For example, although the above description is based on the plating medium used in the plating apparatus, it is not limited thereto; any medium having the above-described characteristics and contained in solder materials, etc., may also be included within the scope of the present invention.

[0092] The present invention can be carried out in the following manner.

[0093] <1>

[0094] A plating medium comprising a core and a shell disposed on the surface of the core.

[0095] The aforementioned shell constitutes a multilayer body with two or more metal layers.

[0096] <2>

[0097] According to the plating medium described in <1>, the core has a surface with relatively higher reagent resistance than the multilayer body described above.

[0098] <3>

[0099] According to the plating medium described in <1> or <2>, the core has at least an insulating surface.

[0100] <4>

[0101] According to any one of <1> to <3>, the plating medium has a core with a melting point higher than the metal-containing layer of the multilayer body.

[0102] <5>

[0103] The plating medium according to any one of <1> to <4>, wherein the core is selected from at least one of ceramics, resin and glass.

[0104] <6>

[0105] According to the plating medium described in <5>, the ceramic comprises at least one selected from alumina, zirconium oxide, sapphire, yttrium oxide, magnetite, cermet, silicon carbide, silicon nitride, aluminum nitride, talc porcelain, cordierite, and quartz glass.

[0106] <7>

[0107] According to any one of <1> to <6>, the plating medium comprises a first metal-containing layer in contact with the core, wherein the first metal-containing layer contains at least one element selected from Ni, Cu, Pd, Sn, Ag, Zn, Co, Au, Pt, In and Bi as a main component.

[0108] <8>

[0109] According to the plating medium described in <7>, the first metal-containing layer contains at least one catalyst selected from Pd, Ag and Ni as a catalyst.

[0110] <9>

[0111] According to the plating medium described in <7> or <8>, the first metal-containing layer has a thickness of 0.01 μm to 1 μm.

[0112] <10>

[0113] According to any one of <7> to <9>, the plating medium comprises a second metal-containing layer located outside the first metal-containing layer, the second metal-containing layer containing at least one element selected from Sn, Ni, Cu, Pd, Pt and Au.

[0114] <11>

[0115] According to the plating medium described in <10>, the second metal-containing layer has a thickness of 0.1 μm to 10 μm.

[0116] <12>

[0117] According to the plating medium described in <10> or <11>, the multilayer body includes a third metal-containing layer located outside the second metal-containing layer.

[0118] The aforementioned third metal layer contains at least one element selected from Sn, Ni, Cu, Pd, Pt, and Au.

[0119] <13>

[0120] According to the plating medium described in <12>, the third metal-containing layer has a thickness of 0.1 μm to 10 μm.

[0121] <14>

[0122] A method for manufacturing a plating medium includes a step of preparing a core and a step of forming a shell having two or more metal layers on the surface of the core.

[0123] <15>

[0124] A method for reusing a plating medium is a method for reusing a plating medium comprising a core and a shell disposed on the surface of the core, wherein the shell constitutes a multilayer body containing two or more metal layers.

[0125] After the plating process, the plating on the surface of the medium and at least one metal-containing layer of the medium are peeled off.

[0126] <16>

[0127] According to the method for reusing the plating medium described in <15>, the plating material and the metal-containing layer are stripped by at least one method selected from reverse electrolysis, melting and chemical polishing impregnation.

[0128] Symbol Explanation

[0129] 50 Coating Device

[0130] 17. Fourth metal layer

[0131] 16 Third metal layer

[0132] 15. Second metal layer

[0133] 14 First metal layer

[0134] 13 Multi-layered structures

[0135] 12 shells

[0136] 11 cores (equivalent to core material)

[0137] 10. Conductive plating medium

[0138] 7. 7A power supply

[0139] 6. Coated object

[0140] 5. Anode electrode

[0141] 4. Cathode electrode

[0142] 3 rollers

[0143] 2. Plating bath

[0144] 1. Plating solution

[0145] 1a Electrolyte

Claims

1. A plating medium comprising a core and a shell disposed on the surface of the core, The shell is a multilayer body with two or more metal layers.

2. The plating medium according to claim 1, wherein, The core has a surface with relatively higher reagent resistance than the multilayer.

3. The plating medium according to claim 1 or 2, wherein, The core has at least one insulating surface.

4. The plating medium according to any one of claims 1 to 3, wherein, The melting point of the core is higher than that of the metal-containing layer of the multilayer.

5. The plating medium according to any one of claims 1 to 4, wherein, The core is selected from at least one of ceramics, resins, and glass.

6. The plating medium according to claim 5, wherein, The ceramic comprises at least one selected from alumina, zirconium oxide, sapphire, yttrium oxide, magnetite, cermet, silicon carbide, silicon nitride, aluminum nitride, talc porcelain, cordierite, and quartz glass.

7. The plating medium according to any one of claims 1 to 6, wherein, The multilayer body includes a first metal-containing layer in contact with the core, the first metal-containing layer containing at least one element selected from Ni, Cu, Pd, Sn, Ag, Zn, Co, Au, Pt, In and Bi as a main component.

8. The plating medium according to claim 7, wherein, The first metal-containing layer contains at least one catalyst selected from Pd, Ag and Ni as a catalyst.

9. The plating medium according to claim 7 or 8, wherein, The first metal-containing layer has a thickness of 0.01 μm to 1 μm.

10. The plating medium according to any one of claims 7 to 9, wherein, The multilayer body includes a second metal-containing layer located outside the first metal-containing layer, the second metal-containing layer containing at least one element selected from Sn, Ni, Cu, Pd, Pt and Au.

11. The plating medium according to claim 10, wherein, The second metal-containing layer has a thickness of 0.1 μm to 10 μm.

12. The plating medium according to claim 10 or 11, wherein, The multilayer body includes a third metal-containing layer located outside the second metal-containing layer. The third metal layer contains at least one element selected from Sn, Ni, Cu, Pd, Pt and Au.

13. The plating medium according to claim 12, wherein, The third metal-containing layer has a thickness of 0.1 μm to 10 μm.

14. A method for manufacturing a plating medium, comprising: a step of preparing a core, and a step of forming a shell having two or more metal layers on the surface of the core.

15. A method for reusing a plating medium, the plating medium comprising a core and a shell disposed on the surface of the core, the shell constituting a multilayer body containing two or more metal layers. After the plating process, the plating material on the surface of the medium and at least one metal-containing layer of the medium are peeled off.

16. The method for reusing the plating medium according to claim 15, wherein, The plating and the metal-containing layer are stripped by at least one method selected from reverse electrolysis, melting, and chemical polishing impregnation.

Images