Foldable electronic device and method of manufacturing the same

Abstract

A foldable electronic device according to an embodiment of the disclosure can include a first housing, a second housing, a hinge device rotatably connecting the first housing and the second housing, a flexible display disposed above the first housing and the second housing and including a folding area, and a digitizer panel disposed below the flexible display and including a curved pattern including a plurality of openings arranged at a designated interval. The digitizer panel can include a circuit unit including at least one wiring layer and at least one insulating layer, a first shell layer disposed on the circuit unit, and a second shell layer disposed below the circuit unit.

Description

Technical Field

[0001] Embodiments of this disclosure relate to a foldable electronic device including a digitizer panel and a method of manufacturing the same. Background Technology

[0002] The electronic device may support a pen input device (e.g., a stylus). Users can, for example, use a pen input device to input data into the electronic device and perform various operations (e.g., writing or drawing) on ​​the screen output to the display of the electronic device.

[0003] Electronic devices can receive various input data, writing, or drawing signals, for example, from electromagnetic resonant (EMR) type pen input devices. In this case, the display of the electronic device may include a digital converter for detecting signals from the pen input device.

[0004] EMR pen input devices include an LC resonant circuit consisting of a coil and a capacitor. The pen input device transmits a signal at the resonant frequency to the digital converter of the electronic device via the LC resonant circuit, and the electronic device detects the signal at the resonant frequency transmitted by the digital converter and performs an operation corresponding to the pen input (e.g., writing or drawing).

[0005] The resonant frequency of the signal transmitted from the pen input device can vary depending on the changes in the inductance of the coil and the capacitance of the capacitor.

[0006] For example, when the pen tip of the pen input device is pressed on the display of the electronic device, the capacitance of the capacitor in the pen input device can increase, and the digital converter identifies the pen input signal by detecting the change in the resonant frequency caused by the increase in capacitance.

[0007] Similar to changes in capacitance, changes in the inductance of the coil in a pen input device can alter the resonant frequency of the signal from the pen input device. For example, if the inductance of the coil in the pen input device decreases due to magnetic field interference caused by magnetic fields generated by magnetic components in the electronic device, the resonant frequency also decreases. In this case, even if actual pen input is present and the capacitance of the capacitor increases, the decrease in the coil inductance may offset this, causing the digitizer to fail to recognize the pen input and potentially malfunction. Summary of the Invention

[0008] Solution to the problem Various embodiments of this disclosure may provide a foldable electronic device including a digitizer panel and a method of manufacturing the same, the digitizer panel including a high-rigidity shell and a curved pattern and including at least one shielding layer.

[0009] A foldable electronic device according to embodiments of the present disclosure may include: a first housing; a second housing; a hinge mechanism rotatably connecting the first housing and the second housing; a flexible display configured to span the first housing and the second housing and including a folding region; and a digitizer panel disposed below the flexible display and including a curved pattern, the curved pattern including a plurality of openings disposed at specified intervals. The digitizer panel may include: a circuit portion including at least one wiring layer and at least one insulating layer; a first shell layer disposed on the upper portion of the circuit portion; and a second shell layer disposed on the lower portion of the circuit portion.

[0010] A method for manufacturing a foldable electronic device according to embodiments of the present disclosure may include: forming a flexible display configured to span a first housing and a second housing and including a folding region; and forming a digitizer panel disposed below the flexible display. The step of forming the digitizer panel may include: forming a circuit portion including at least one wiring layer and at least one insulating layer; forming a first shell layer disposed on an upper portion of the circuit portion and a second shell layer disposed on a lower portion of the circuit portion; and forming a curved pattern including a plurality of openings disposed at specified intervals.

[0011] According to various embodiments of the present disclosure, the foldable electronic device and its manufacturing method according to the present disclosure can minimize circuit disconnection in the folded area of ​​the digitizer panel during folding by including a digitizer panel having a high-rigidity shell and a bending pattern.

[0012] Furthermore, by including a digitizer panel containing at least one shielding layer, the foldable electronic device and its manufacturing method according to this disclosure can prevent corrosion of the shielding layer and enhance the flatness of the display.

[0013] The effects achievable from the exemplary embodiments of this disclosure are not limited to those described above, and other effects not mentioned will clearly derive and be understood by those skilled in the art from the following description. In other words, those skilled in the art can also derive unintended effects from the exemplary embodiments of this disclosure when practicing the embodiments of this disclosure. Attached Figure Description

[0014] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments of the present disclosure.

[0015] Figure 2a and Figure 2b This is a diagram showing the unfolded state of an electronic device as viewed from the front and rear surfaces according to various embodiments of the present disclosure.

[0016] Figure 3a and Figure 3bThis is a diagram showing the folded state of an electronic device as viewed from the front and rear surfaces according to various embodiments of the present disclosure.

[0017] Figure 4 This is an exploded perspective view showing an electronic device according to various embodiments of the present disclosure.

[0018] Figure 5 This is an exploded perspective view showing a first display according to various embodiments of the present disclosure.

[0019] Figure 6 This is a partial cross-sectional view illustrating an electronic device including a digitizer panel according to various embodiments of the present disclosure.

[0020] Figure 7a and Figure 7b This is a cross-sectional view showing the laminated structure of a digitizer panel according to various embodiments of the present disclosure.

[0021] Figure 8 This is a diagram illustrating a curved pattern of a digitizer panel according to various embodiments of the present disclosure.

[0022] Figure 9 This is a partial cross-sectional view showing the folded state of an electronic device according to various embodiments of the present disclosure.

[0023] Figure 10 This is a cross-sectional view showing the internal structure of a digitizer panel according to various embodiments of the present disclosure.

[0024] Figures 11a to 11c This is a cross-sectional view showing the laminated structure of a digitizer panel according to various embodiments of the present disclosure.

[0025] Figure 12 This is a perspective view showing the structure of at least one shielding layer according to various embodiments of the present disclosure.

[0026] Figures 13a to 13d This is a cross-sectional view showing the construction of a shielding layer inside a digitizer panel according to various embodiments of the present disclosure.

[0027] Figure 14a and Figure 14b This is a cross-sectional view showing the construction of a shielding layer inside a digitizer panel according to various embodiments of the present disclosure.

[0028] Figure 15a and Figure 15b This is a cross-sectional view showing the construction of a shielding layer inside a digitizer panel according to various embodiments of the present disclosure.

[0029] Figure 16 This is a cross-sectional view showing the laminated structure of a digitizer panel according to various embodiments of the present disclosure. Detailed Implementation

[0030] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, but rather to include various modifications, equivalents or alternatives to the corresponding embodiments.

[0031] Regarding the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements.

[0032] It should be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to an item may include one or more things.

[0033] In this document, each of the phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C” and “at least one of A, B or C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0034] As used herein, terms such as “first” and “second” or “first” and “second” can be used to simply distinguish the corresponding component from another component without limiting the component in other respects (e.g., importance or order).

[0035] It should be understood that if an element (e.g., the first element) is referred to as "combined" with, "combined into" another element (e.g., the second element), "connected" with, or "attached to" another element (e.g., the second element) in the presence or absence of the terms "operably" or "communically", it means that the element can be combined with the other element directly (e.g., wired), wirelessly, or via a third element.

[0036] It will be further understood that the terms “comprising” and / or “having” as used herein indicate the presence of the stated features, quantities, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, quantities, steps, operations, elements, components and / or groups thereof.

[0037] It will be understood that when a component is referred to as being “connected to” another component, “joined to” another component, “supported on” another component, or “in contact” another component, the components may be directly or via a third component connected to, joined to, supported on, or in contact with each other.

[0038] Throughout the specification, when one component is located "on" another component, the first component may be located directly on the second component, or (one or more) other components may be located between the first and second components.

[0039] The term “and / or” can mean a combination of the listed related components or any one of the listed related components.

[0040] The working principle and embodiments of the present invention are described below with reference to the accompanying drawings.

[0041] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments of the present disclosure.

[0042] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In an embodiment, at least one component (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. According to an embodiment, some components of the assembly (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single assembly (e.g., display module 160).

[0043] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to embodiments, as at least part of the data processing or calculations, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or a coprocessor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, in the case where electronic device 101 includes a main processor 121 and a coprocessor 123, the coprocessor 123 may be adapted to consume less power than the main processor 121, or to be adapted to be dedicated to a specific function. The coprocessor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0044] When the main processor 121 is inactive (e.g., in sleep) state, the coprocessor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the coprocessor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the coprocessor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the coprocessor 123. According to embodiments, the coprocessor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more thereof, but is not limited thereto. The artificial intelligence model may additionally include, or alternatively may include, software structures in addition to hardware structures.

[0045] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0046] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0047] Input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0048] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0049] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force generated by touch.

[0050] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can acquire sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0051] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or external environmental conditions (e.g., user status), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0052] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0053] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0054] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0055] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0056] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0057] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell.

[0058] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199).

[0059] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0060] Antenna module 197 can transmit or receive signals or power to or from an external source (e.g., an external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiator formed using a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other components besides the radiator (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0061] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, an RFIC, and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0062] At least some of the aforementioned components can be interconnected via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)) and signals (e.g., commands or data) can be communicated between them.

[0063] According to an embodiment, instructions or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Electronic device 102 or 104 can be the same type or a different type of device as electronic device 101. According to an embodiment, all or some operations to be performed on electronic device 101 can be performed on one or more of external electronic devices 102, 104, or 108. For example, if electronic device 101 is required to automatically perform a function or service or to perform a function or service in response to a request from a user or another device, electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform the requested at least portion of the function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0064] Figure 2a and Figure 2b This is a diagram showing the unfolded state of an electronic device as viewed from the front and rear surfaces according to various embodiments of the present disclosure. Figure 3a and Figure 3bThis is a diagram showing the folded state of an electronic device as viewed from the front and rear surfaces according to various embodiments of the present disclosure.

[0065] Reference Figures 2a to 3b Electronic device 200 (e.g., Figure 1 The electronic device 101 may include: a pair of housings 210, 220 (e.g., foldable housing structures), connected via a hinge mechanism (e.g., Figure 4 The hinge device 320 (e.g., hinge module) is rotatably coupled relative to the folding axis A so that it is foldable relative to each other; a first display 230 (e.g., flexible display, foldable display or main display) is disposed on a pair of housings 210, 220; and / or a second display 300 (e.g., sub-display) is disposed on the second housing 220.

[0066] According to various embodiments, the hinge device (e.g., Figure 4 At least a portion of the hinge device 320 may be configured to be externally invisible through the first housing 210 and the second housing 220, and may be configured to be externally invisible through the hinge housing 310 covering the foldable portion in the unfolded state. According to an embodiment, the hinge device 320 may include: a hinge module including a gear assembly comprising a plurality of gears and a plurality of hinge cams coupled to a hinge shaft, the hinge shaft rotating via the gear assembly and performing a cam interlocking operation; and a hinge plate connecting the hinge module to the first housing 210 and the second housing 220. In this document, the surface on which the first display 230 is disposed may be defined as the front surface of the electronic device 200, and the surface opposite the front surface may be defined as the rear surface of the electronic device 200. Furthermore, the surface surrounding the space between the front and rear surfaces may be defined as the side surface of the electronic device 200.

[0067] According to various embodiments, the pair of housings 210, 220 may include configurations via a hinge mechanism (e.g., Figure 4 The hinge device 320 is foldable relative to the first housing 210 and the second housing 220. According to an embodiment, the pair of housings 210, 220 are not limited to... Figures 2a to 3b The forms and combinations shown are possible, and can be achieved through combinations and / or combinations of other shapes or components. According to an embodiment, the first housing 210 and the second housing 220 may be positioned on opposite sides relative to the folding axis A and may have a generally symmetrical shape relative to the folding axis A. According to an embodiment, the first housing 210 and the second housing 220 may also be folded asymmetrically relative to the folding axis A. According to an embodiment, the first housing 210 and the second housing 220 may have different angles or distances from each other depending on whether the electronic device 200 is in an unfolded state, a folded state, or an intermediate state.

[0068] According to various embodiments, in the unfolded state of the electronic device 200, the first housing 210 may include: a first surface 211 connected to a hinge mechanism (e.g., Figure 4 The hinge device 320 is configured to face the front surface of the electronic device 200; a second surface 212 facing in the opposite direction to the first surface 211; and / or a first side member 213 surrounding at least a portion of the first space between the first surface 211 and the second surface 212. According to an embodiment, in the deployed state of the electronic device 200, the second housing 220 may include: a third surface 221 connected to the hinge device (e.g., a hinge mechanism 320) and configured to face the front surface of the electronic device 200; a second surface 212 facing in the opposite direction to the first surface 211; and / or a first side member 213 surrounding at least a portion of the first space between the first surface 211 and the second surface 212. Figure 4 The device 200 includes a hinge device 320 and is configured to face the front surface of the electronic device 200; a fourth surface 222 facing in the opposite direction to the third surface 221; and / or a second side member 223 surrounding at least a portion of the second space between the third surface 221 and the fourth surface 222. According to an embodiment, the first surface 211 may face substantially the same direction as the third surface 221 in an unfolded state, and may face at least partially towards the third surface 221 in a folded state. According to an embodiment, the electronic device 200 may also include a recess 201 formed to accommodate the first display 230 through a structural combination of the first housing 210 and the second housing 220. According to an embodiment, the recess 201 may have substantially the same dimensions as the first display 230. According to an embodiment, the first housing 210 may include a first protective frame 213a (e.g., a first decorative member) which is integrated with the first side member 213 and disposed overlapping the edge of the first display 230 when viewed from above, thereby covering the edge of the first display 230 so that it is not visible from the outside. According to an embodiment, the first protective frame 213a may also be integrally formed with the first side member 213. According to an embodiment, the second housing 220 may include a second protective frame 223a (e.g., a second decorative member), which is integrated with the second side member 223 and, when viewed from above, overlaps with the edge of the first display 230, thereby covering the edge of the first display 230 so that it is not visible from the outside. According to an embodiment, the second protective frame 223a may also be integrally formed with the first side member 223. In some embodiments, the first protective frame 213a and the second protective frame 223a may be omitted.

[0069] According to various embodiments, a hinge housing 310 (e.g., a hinge cover) may be disposed between the first housing 210 and the second housing 220, and may be configured to cover the hinge device (e.g., Figure 4The hinge device 320 is a portion (e.g., at least one hinge module) disposed within the hinge housing 310. According to an embodiment, the hinge housing 310 may be covered by a portion of the first housing 210 and the second housing 220, or may be exposed to the outside, depending on whether the electronic device 200 is in an unfolded, folded, or intermediate state. For example, when the electronic device 200 is in an unfolded state, at least a portion of the hinge housing 310 may be covered by the first housing 210 and the second housing 220, and may be substantially unexposed. According to an embodiment, when the electronic device 200 is in a folded state, at least a portion of the hinge housing 310 may be exposed to the outside between the first housing 210 and the second housing 220. According to an embodiment, when the first housing 210 and the second housing 220 are in an intermediate state folded at a predetermined angle, the hinge housing 310 may be at least partially exposed to the outside of the electronic device 200 between the first housing 210 and the second housing 220. For example, the area of ​​the hinge housing 310 exposed to the outside may be smaller than the area in the fully folded state. According to an embodiment, the hinge housing 310 may include a curved surface.

[0070] According to various embodiments, when the electronic device 200 is in an unfolded state (e.g., Figure 1 a and Figure 2b In the unfolded state, the first housing 210 and the second housing 220 form an angle of approximately 180 degrees, and the first region 230a, the second region 230b, and the folded region 230c of the first display 230 form a coplanar plane and can be configured to face substantially the same direction (e.g., the z-axis direction). As another embodiment, when the electronic device 200 is in the unfolded state, the first housing 210 can rotate relative to the second housing 220 at an angle of approximately 360 degrees and can be folded in opposite directions such that the second surface 212 and the fourth surface 222 face each other (outward folding method).

[0071] According to various embodiments, when the electronic device 200 is in a folded state (e.g., Figure 3a and Figure 3bIn the case of the first housing 210 and the second housing 220 being in an unfolded state, the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 can be configured to face each other. In this case, the first region 230a and the second region 230b of the first display 230 can form a narrow angle with each other (e.g., a range of 0 degrees to about 10 degrees) and can be configured to face each other via the folding region 230c. According to an embodiment, at least a portion of the folding region 230c can be deformed into a curved shape with a predetermined curvature. According to an embodiment, when the electronic device 200 is in an intermediate state, the first housing 210 and the second housing 220 can be arranged at a predetermined angle with each other. In this case, the angle formed by the first region 230a and the second region 230b of the first display 230 can be greater than the angle in the folded state and less than the angle in the unfolded state, and the curvature of the folding region 230c can be less than the curvature in the folded state and greater than the curvature in the unfolded state. In some embodiments, the first housing 210 and the second housing 220 can be connected by a hinge device (e.g., Figure 4 The hinge devices 320 form angles at which they can stop between a folded state and an unfolded state at a specified folding angle (free stop function). In some embodiments, the first housing 210 and the second housing 220 can also be connected by hinge devices (e.g., Figure 4 The hinge device 320 operates continuously when pressed relative to a specified deflection angle in the unfolding or folding direction.

[0072] According to various embodiments, the electronic device 200 may include at least one of the following disposed in the first housing 210 and / or the second housing 220: a display 230, 300; an input device 215; a sound output device 227, 228; a sensor module 217a, 217b, 226; a camera module 216a, 216b, 225; a key input device 219; an indicator (not shown); or a connector port 229. In some embodiments, the electronic device 200 may omit at least one of the above components, or may additionally include at least one other component.

[0073] According to various embodiments, at least one display 230, 300 may include: a first display 230 (e.g., a flexible display), configured to extend from a first surface 211 of a first housing 210 via a hinge device (e.g., Figure 4The hinge device 320 is supported to a third surface 221 of the second housing 220; and a second display 300 is configured to be at least partially visible from the outside through a fourth surface 222 within the interior space of the second housing 220. In some embodiments, the second display 300 may also be configured to be visible from the outside through a second surface 212 within the interior space of the first housing 210. According to an embodiment, the first display 230 may be used primarily in the unfolded state of the electronic device 200, and the second display 300 may be used primarily in the folded state of the electronic device 200. According to an embodiment, in an intermediate state, the electronic device 200 may control the availability of the first display 230 and / or the second display 300 based on the folding angle of the first housing 210 and the second housing 220.

[0074] According to various embodiments, a first display 230 may be disposed in a receiving space formed by a pair of housings 210, 220. For example, a first display 200 may be disposed in a recess 201 formed by a pair of housings 210, 220, and in an unfolded state may be configured to occupy substantially most of the front surface of the electronic device 200. According to embodiments, the first display 230 may include a flexible display, at least a portion of which may deform into a flat surface or a curved surface. According to embodiments, the first display 230 may include a first region 230a facing the first housing 210 and a second region 230b facing the second housing 220. According to embodiments, the first display 230 may include a folding region 230c, which, relative to a folding axis A, includes a portion of the first region 230a and a portion of the second region 230b. According to embodiments, at least a portion of the folding region 230c may include a hinge device (e.g., Figure 4 The area corresponding to the hinge device 320. According to an embodiment, the area division of the first display 230 is solely determined by a pair of housings 210, 220 and a hinge device (e.g., hinge device 320). Figure 4 The exemplary physical division of the hinge device 320, and the first display 230 can be achieved through a pair of housings 210, 220 and the hinge device (e.g., Figure 4 The hinge device 320 is essentially displayed as a seamless full screen. According to an embodiment, the first region 230a and the second region 230b may have a generally symmetrical shape with respect to the folded region 230c, or may have a partially asymmetrical shape.

[0075] According to various embodiments, the electronic device 200 may include a first rear cover 240 disposed on a second surface 212 of a first housing 210 and a second rear cover 250 disposed on a fourth surface 222 of a second housing 220. In some embodiments, at least a portion of the first rear cover 240 may also be integrally formed with a first side member 213. In some embodiments, at least a portion of the second rear cover 250 may also be integrally formed with a second side member 223. According to embodiments, at least one of the first rear cover 240 and the second rear cover 250 may be formed using a substantially transparent plate (e.g., a glass plate or polymer plate including various coatings) or an opaque plate. According to embodiments, the first rear cover 240 may be formed of an opaque plate (such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of these materials). According to embodiments, the second rear cover 250 may be formed of a substantially transparent plate (such as, for example, glass or polymer). Therefore, the second display 300 may be configured to be visible from the outside through the second rear cover 250 within the interior space of the second housing 220.

[0076] According to various embodiments, input device 215 may include a microphone. In some embodiments, input device 215 may include a plurality of microphones configured to detect the direction of sound. According to embodiments, sound output devices 227, 228 may include a speaker. According to embodiments, sound output devices 227, 228 may include a receiver 227 for calling disposed through a fourth surface 222 of the second housing 220 and an external speaker 228 disposed through at least a portion of a second side member 223 of the second housing 220. In some embodiments, input device 215, sound output devices 227, 228 and connector port 229 may be disposed in the space of the first housing 210 and / or the second housing 220 and may be exposed to the external environment through at least one hole formed in the first housing 210 and / or the second housing 220. In some embodiments, the hole formed in the first housing 210 and / or the second housing 220 may be used together for input device 215 and sound output devices 227, 228. In some embodiments, the sound output devices 227, 228 may also include a loudspeaker (e.g., a piezoelectric loudspeaker) that operates without holes being formed in the first housing 210 and / or the second housing 220.

[0077] According to various embodiments, camera modules 216a, 216b, and 225 may include a first camera module 216a disposed on a first surface 211 of the first housing 210, a second camera module 216b disposed on a second surface 212 of the first housing 210, and / or a third camera module 225 disposed on a fourth surface 222 of the second housing 220. According to embodiments, the electronic device 200 may include a flash 218 disposed near the second camera module 216b. According to embodiments, the flash 218 may include, for example, a light-emitting diode or a xenon lamp. According to embodiments, camera modules 216a, 216b, and 225 may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, at least one of the camera modules 216a, 216b, and 225 may include two or more lenses (e.g., a wide-angle lens and a telephoto lens) and an image sensor, and may be disposed together on any one surface of the first housing 210 and / or the second housing 220.

[0078] According to various embodiments, sensor modules 217a, 217b, and 226 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 200. According to embodiments, sensor modules 217a, 217b, and 226 may include a first sensor module 217a disposed on a first surface 211 of the first housing 210, a second sensor module 217b disposed on a second surface 212 of the first housing 210, and / or a third sensor module 226 disposed on a fourth surface 222 of the second housing 220. In some embodiments, sensor modules 217a, 217b, and 226 may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, an illuminance sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time-of-flight (TOF) sensor or a light detection and ranging (LiDAR) sensor).

[0079] According to various embodiments, the electronic device 200 may also include at least one of a sensor module (not shown) (e.g., a barometric pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint sensor). In some embodiments, the fingerprint sensor may also be disposed through at least one of the first side member 213 of the first housing 210 and / or the second side member 223 of the second housing 220.

[0080] According to various embodiments, the key input device 219 may be configured to be exposed to the outside through a first side member 213 of the first housing 210. In some embodiments, the key input device 219 may also be configured to be exposed to the outside through a second side member 223 of the second housing 220. In some embodiments, the electronic device 200 may not include some or all of the key input devices 219, and the un-included key input devices 219 may be implemented in another form (such as soft keys) on at least one display 230, 300. As another embodiment, the key input device 219 may be implemented using a pressure sensor included in at least one display 230, 300.

[0081] According to various embodiments, connector port 229 may include a connector (e.g., a USB connector or interface connector port module) for sending power and / or data to / receiving power and / or data from an external electronic device. In some embodiments, connector port 229 may together perform the function of sending / receiving audio signals to / from an external electronic device, or may also include a separate connector port (e.g., a headphone jack) for performing the function of sending / receiving audio signals.

[0082] According to various embodiments, at least one camera module 216a, 225 among camera modules 216a, 216b, 225, at least one sensor module 217a, 226 among sensor modules 217a, 217b, 226, and / or an indicator may be configured to be exposed through at least one display 230, 300. For example, at least one camera module 216a, 225, at least one sensor module 217a, 226, and / or an indicator may be disposed within the interior space of at least one housing 210, 220 and located below the display area of ​​at least one display 230, 300, and may be configured to contact the external environment through a transparent area or an opening perforated to a cover member (e.g., a window layer (not shown) of the first display 230 and / or the second rear cover 250). According to embodiments, the area where at least one display 230, 300 and at least one camera module 216a, 225 face each other may be formed as a transmissive area with a predetermined transmittance, which serves as part of the area for displaying content. According to an embodiment, the transmissive region may be formed to have a transmittance in the range of about 5% to about 20%. This transmissive region may include a region superimposed on the effective area (e.g., viewing angle region) of at least one camera module 216a, 225, through which light for forming an image on an image sensor and generating the image passes. For example, the transmissive region of the display 230, 300 may include a region having a pixel density lower than the pixel density of the surrounding environment. For example, the transmissive region may replace an opening. For example, at least one camera module 216a, 225 may include an under-display camera (UDC) or an under-panel camera (UPC). As another embodiment, some camera modules or sensor modules 217a, 226 may also be configured to perform functions without being visually exposed through the display. For example, the area facing the camera module 216a, 225 and / or sensor module 217a, 226 disposed under the display 230, 300 (e.g., display panel) may not require a perforated opening as an under-display camera (UDC) structure.

[0083] Figure 4 This is an exploded perspective view showing an electronic device 200 according to various embodiments of the present disclosure.

[0084] Reference Figure 4 The electronic device 200 may include a first display 230 (e.g., a flexible display), a second display 300, a hinge device 320, a pair of support members 261, 262, at least one plate 270 (e.g., a printed circuit board (PCB)), a first housing 210, a second housing 220, a first back cover 240 and / or a second back cover 250.

[0085] According to various embodiments, the first display 230 may include a display panel 430 (e.g., a flexible display panel), a support plate 450 disposed below the display panel 430, and a pair of reinforcing plates 461, 462 disposed below the support plate 450. According to embodiments, the display panel 430 may include a first area of ​​the first display 230 (e.g., Figure 2a The first panel area 430a corresponding to the first area 230a, and the second area (e.g., extending from the first panel area 430a and connecting with the first display 230) of the first display 230. Figure 2a The second panel area 430b corresponding to the second region 230b) and the folded area connecting the first panel area 430a and the second panel area 430b and the first display 230 (e.g., Figure 2a The third panel region 430c corresponds to the folded region 230c. According to an embodiment, a support plate 450 may be disposed between the display panel 430 and a pair of support members 261, 262, and may be formed with a material and shape having a flexible structure that provides planar support for the first panel region 430a and the second panel region 430b and provides flexibility for the third panel region 430c. According to an embodiment, the support plate 450 may be formed using a conductive material (e.g., metal) or a non-conductive material (e.g., polymer or fiber-reinforced plastic (FRP)). According to an embodiment, the pair of reinforcing plates 461, 462 may include: a first reinforcing plate 461, disposed between the support plate 450 and the pair of support members 261, 262 to correspond to at least a portion of the first panel region 430a and the third panel region 430c; and a second reinforcing plate 462, configured to correspond to at least a portion of the second panel region 430b and the third panel region 430c. According to an embodiment, a pair of reinforcing plates 461, 462 may be formed using a metallic material (e.g., SUS), thereby contributing to the grounding connection structure and rigidity reinforcement of the first display 230.

[0086] According to various embodiments, the second display 300 may be disposed in the space between the second housing 220 and the second rear cover 250. According to embodiments, the second display 300 may be configured to be visible from the outside through substantially the entire area of ​​the second rear cover 250 in the space between the second housing 220 and the second rear cover 250.

[0087] According to various embodiments, at least a portion of the first support member 261 can be foldably coupled to the second support member 262 via a hinge device 320. According to embodiments, the electronic device 200 may include at least one wiring member 263 (e.g., a flexible printed circuit board (FPCB)) disposed from at least a portion of the first support member 261 across the hinge device 320 to a portion of the second support member 262. According to embodiments, the first support member 261 may be disposed extending from or structurally coupled to the first side member 213. According to embodiments, the electronic device 200 may include a first space (e.g., provided by the first support member 261 and the first rear cover 240) Figure 2a The first space 2101). According to an embodiment, the first housing 210 (e.g., a first housing structure) may be constructed by combining a first side member 213, a first support member 261, and a first rear cover 240. According to an embodiment, the second support member 262 may be provided in a manner that extends from or is structurally coupled to the second side member 223. According to an embodiment, the electronic device 200 may include a second space (e.g., provided by the second support member 262 and the second rear cover 250). Figure 2a The second space 2201). According to an embodiment, the second housing 220 (e.g., the second housing structure) may be constructed by combining the second side member 223, the second support member 262, and the second rear cover 250. According to an embodiment, at least a portion of the hinge device 320 and / or at least one wiring member 263 may be configured to be supported by at least a portion of a pair of support members 261, 262. According to an embodiment, at least one wiring member 263 may be disposed in a direction intersecting the first support member 261 and the second support member 262 (e.g., the x-axis direction). According to an embodiment, at least one wiring member 263 may be disposed substantially perpendicular to the folding axis (e.g., the y-axis or...). Figure 2a In the direction of the folding axis A (e.g., the x-axis direction).

[0088] According to various embodiments, at least one board 270 may include a first board 271 disposed in a first space 2101 and a second board 272 disposed in a second space 2201. According to embodiments, the first board 271 and the second board 272 may include a plurality of electronic components configured to implement various functions of the electronic device 200. According to embodiments, the first board 271 and the second board 272 may be electrically connected via at least one wiring member 263.

[0089] According to various embodiments, the electronic device 200 may include at least one battery 291, 292. According to embodiments, the at least one battery 291, 292 may include a first battery 291 disposed in a first space 2101 of the first housing 210 and electrically connected to a first plate 271, and a second battery disposed in a second space 2201 of the second housing 220 and electrically connected to a second plate 272. According to embodiments, the first support member 261 and the second support member 262 may further include at least one expansion hole for the first battery 291 and the second battery 292.

[0090] According to various embodiments, the first housing 210 may include a first rotary support surface 214, and the second housing 220 may include a second rotary support surface 224 corresponding to the first rotary support surface 214. According to embodiments, the first rotary support surface 214 and the second rotary support surface 224 may include curved surfaces corresponding to (naturally connected to) the curved outer surface of the hinge housing 310. According to embodiments, the first rotary support surface 214 and the second rotary support surface 224 may cover the hinge housing 310, thereby preventing the hinge housing 310 from being exposed to the rear surface of the electronic device 200 or exposing only a portion thereof when the electronic device 200 is in an unfolded state. According to embodiments, when the electronic device 200 is in a folded state, the first rotary support surface 214 and the second rotary support surface 224 may rotate along the curved outer surface of the hinge housing 310, thereby exposing the hinge housing 310 at least partially to the rear surface of the electronic device 200.

[0091] According to various embodiments, the electronic device 200 may include at least one antenna 276 disposed in the first space 2201. According to embodiments, the at least one antenna 276 may be disposed between the first battery 291 and the first back cover 240 in the first space 2201. According to embodiments, the at least one antenna 276 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. According to embodiments, the at least one antenna 276 may, for example, perform short-range communication with an external device or wirelessly send / receive power required for charging. In some embodiments, the antenna structure may be formed by at least a portion of a first side member 213 or a second side member 223 and / or a portion of a first support member 261 and a second support member 262, or a combination thereof.

[0092] According to various embodiments, the electronic device 200 may further include at least one electronic component assembly 274, 275 and / or additional support members 263, 273 disposed in the first space 2101 and / or the second space 2201. For example, the at least one electronic component assembly may include an interface connector port assembly 274 or a speaker assembly 275.

[0093] According to various embodiments, the electronic device 100 may include a first waterproof structure WP1 disposed between a first reinforcing plate 461 and a first supporting member 261, and a second waterproof structure WP2 disposed between a second reinforcing plate 462 and a second supporting member 262. According to an embodiment, the first waterproof structure WP1 may include a first waterproof member 481, configured to form at least one first waterproof space 4811, 4812, 4813 between the first reinforcing plate 461 and the first supporting member 261. According to an embodiment, the second waterproof structure WP2 may include a second waterproof member 482, a third waterproof member 483, and a fourth waterproof member 484, configured to form at least one second waterproof space 4821 between the second reinforcing plate 462 and the second supporting member 262. According to an embodiment, the fourth waterproof member 484 may be configured as a stepped and spaced-apart space connecting the second waterproof member 482 and the third waterproof member 483.

[0094] According to various embodiments, at least one first waterproof space 4811 may be configured to accommodate a through path for an FPCB connector, the through path serving as a wiring structure for connecting electronic components disposed between the first reinforcing plate 461 and the first support member 262 to the first space 2101 via the first waterproof member 481. According to an embodiment, at least one second waterproof space 4821 may be configured to accommodate a through path for an FPCB connector, the through path serving as a wiring structure for connecting electronic components disposed between the second reinforcing plate 462 and the second support member 262 to the second space 2201 via the second waterproof member 482, the third waterproof member 483, and the fourth waterproof member 484. According to an embodiment, at least one first waterproof space 4812, 4813 may accommodate an area corresponding to at least one electronic component (e.g., a camera module or sensor module) supported by the first support member 261. According to an embodiment, at least one second waterproof space 4821 may accommodate a bend folded to the rear surface of the first display 230 (e.g., Figure 5 At least a portion of the bend 432. For example, at least one second waterproof space 4821 may be configured to surround the display panel of the first display 230 (e.g., Figure 5 The display panel 430 extends and folds to at least a portion of the bend 432 on the rear surface. Therefore, the control circuitry (e.g., [missing information]) provided in the bend 432... Figure 5 The control circuit 4321a) and a plurality of electrical components (not shown) may be disposed in at least one second waterproof space 4821, thereby being protected from external moisture and / or foreign matter.

[0095] According to various embodiments, the electronic device 200 may include a waterproof tape 241 disposed between the first rear cover 240 and the first housing 210. According to embodiments, the electronic device 200 may include a connecting member 251 disposed between the second rear cover 250 and the second housing 220. In some embodiments, the connecting member 251 may also be disposed between the second display 300 and the second housing 220. In some embodiments, the waterproof tape 241 may be replaced by the connecting member 251, and the connecting member 251 may be replaced by the waterproof tape 241.

[0096] An electronic device 200 according to an exemplary embodiment of the present disclosure may include at least one waterproof structure WP1, WP2, wherein at least one waterproof member 481, 482, 483, 484 is disposed between the first support member 261 and the first reinforcing plate 461 of the first housing 210 and / or between the second support member 262 and the second reinforcing plate 462 of the second housing 220, thereby reducing the possibility of damage to the first display 230 when it is separated from the housings 210, 220 for maintenance of the electronic device 200, and since at least one waterproof member 481, 482, 483, 484 is configured to avoid the rear surface of the first display 230, external visibility is enhanced and surface quality is helped to be ensured.

[0097] Figure 5 This is an exploded perspective view showing a first display according to various embodiments of the present disclosure. Hereinafter, the first display will be referred to as a "flexible display".

[0098] Flexible displays according to exemplary embodiments of the present disclosure (e.g., Figure 4 The first display 230 may include a durable (UB) type organic light-emitting diode (OLED) display (e.g., a curved display). However, the flexible display is not limited to this, and the flexible display 230 may also include a cell-touch active matrix organic light-emitting diode (OCTA) type flat panel display.

[0099] Reference Figure 5 The flexible display 230 may include a window layer 410, a polarizing layer (POL) 420 (e.g., a polarizing film) sequentially disposed on the rear surface (e.g., in the -z-axis direction) of the window layer 410, a display panel 430, a polymer layer 440, a support plate 450, and reinforcing plates 461, 462. In one embodiment, the flexible display 230 may further include a digitizer panel 470 disposed between the support plate 450 and the reinforcing plates 461, 462. In another embodiment, the digitizer panel 470 may also be disposed between the polymer layer 440 and the support plate 450.

[0100] According to various embodiments, window layer 410 may include a glass layer. According to embodiments, window layer 410 may include ultra-thin glass (UTG). In some embodiments, window layer 410 may also include a polymer. In this case, window layer 410 may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, window layer 410 may also be configured as multiple layers to include a glass layer and a polymer.

[0101] According to various embodiments, the window layer 410, polarization layer 420, display panel 430, polymer layer 440, and support plate 450 may be configured to span across the first housing (e.g., Figure 2a The first surface of the first housing 210 (e.g., Figure 2a The first surface 211) and the second shell (e.g., Figure 2a The third surface of the second housing 220 (e.g., Figure 2a At least a portion of the third surface 221. According to an embodiment, reinforcing plates 461, 462 may include a portion corresponding to the first housing (e.g., Figure 2a The first reinforcing plate 461 of the first housing 210 and the corresponding second housing (e.g., Figure 2a The second reinforcing plate 462 of the second housing 220. According to an embodiment, the reinforcing plates 461, 462 can provide rigidity for the flexible display 230 and can be used as grounding to prevent failure of the flexible display 230. According to an embodiment, the reinforcing plates 461, 462 can be formed using a metallic material. According to an embodiment, the reinforcing plates 461, 462 can be formed using SUS or A1. According to an embodiment, the window layer 410, polarizing layer 420, display panel 430, polymer layer 440, support plate 450 and reinforcing plates 461, 462 can be attached to each other by adhesives P1, P2, P3 (or adhesives). For example, adhesives P1, P2, P3 may include at least one of optically clear adhesive (OCA), pressure-sensitive adhesive (PSA), thermally reactive adhesive, general-purpose adhesive or double-sided tape.

[0102] According to various embodiments, the display panel 430 may include a plurality of pixels and wiring structures (e.g., electrode patterns). According to an embodiment, the polarization layer 420 may selectively allow light generated from a light source of the display panel 430 and vibrating in a predetermined direction to pass through. According to an embodiment, the display panel 430 and the polarization layer 420 may be integrally formed. According to an embodiment, the flexible display 230 may also include a touch panel (not shown).

[0103] According to various embodiments, the polymer layer 440 may be disposed beneath the display panel 430 to provide a dark background for ensuring the visibility of the display panel 430, and may be formed using a cushioning material with a buffering effect. In some embodiments, the polymer layer 440 may be removed or disposed beneath the support plate 450 to make the flexible display 230 waterproof.

[0104] According to various embodiments, the support plate 450 may provide bending characteristics to the flexible display 230. For example, the support plate 450 may be formed using a non-metallic sheet material with rigid properties, such as fiber-reinforced plastic (FRP) (e.g., carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP)), to support the display panel 430. According to embodiments, the support plate 450 may include: a first flat portion 451, which is connected to a first housing (e.g., Figure 2a The first housing 210 corresponds to the second flat portion 452, which corresponds to the second housing (e.g., Figure 2a The second housing 220 corresponds to the first flat portion 451 and the second flat portion 452; and the bend 453 (flexible portion or bend) connects the first flat portion 451 and the second flat portion 452. According to an embodiment, the bend 453 may include a plurality of openings 4531 arranged at specified intervals. According to an embodiment, the bending characteristics of the bend 453 may be determined by at least one of the size, shape or arrangement density of at least some of the plurality of openings 4531. In some embodiments, the support plate 450 may also be formed of a metallic material such as stainless steel (SUS) (e.g., stainless steel (STS)), Cu, Al or a metal cladding (e.g., a laminate in which SUS and Al are alternately arranged). In this case, the support plate 450 may also have a plurality of openings formed over the entire area to induce detection operations of the digitizer panel 470 disposed below. According to an embodiment, the support plate 450 may help enhance the electronic device (e.g., Figure 2a The rigidity of the electronic device 200 can shield surrounding noise and can be used to dissipate heat emitted from surrounding heat-generating components.

[0105] According to various embodiments, the display 230 may include a digitizer panel 470, which serves as a detection member disposed below the support plate 450 and receiving input from an electronic pen (e.g., a stylus). According to embodiments, the digitizer panel 470 may include coil members disposed on a dielectric substrate (e.g., a dielectric film or dielectric sheet) to detect an electromagnetically induced resonant frequency applied from the electronic pen. According to embodiments, the digitizer panel 470 may include a flat region and a folded region, the flat region including a first flat region facing the first housing 210 and a second flat region facing the second housing 220, and the folded region facing the hinge device 320. According to embodiments, the digitizer panel 470 may be electrically connected to an electronic device (e.g., via an FPCB connector). Figure 4 The board of the electronic device 200 (e.g., Figure 4 Boards 271 and 272), thereby performing the function of a digital converter.

[0106] According to various embodiments, the flexible display 230 may further include at least one functional component (not shown) disposed between or below the polymer layer 440 and the support plate 450. According to embodiments, this functional component may include a graphite sheet for heat dissipation, an additional display, a force-sensitive FPCB, a fingerprint sensor FPCB, a communication antenna radiator, or a conductive / non-conductive tape. According to embodiments, if the functional component is not bendable, it may also be disposed separately in the first housing (e.g., Figure 2a The first housing 210) and the second housing (e.g., Figure 2a The second housing 220). According to an embodiment, when the functional component is bendable, the functional component can be extracted from the first housing (e.g., Figure 2a The first housing 210) is connected by a hinge device (e.g., Figure 4 The hinge device 320) is disposed on the second housing (e.g., Figure 2a At least a portion of the second shell 220.

[0107] According to various embodiments, the flexible display 230 may include a bend 432, which is arranged such that it is folded from the display panel 430 to at least a portion of the rear surface of the flexible display 230 (e.g., in the -z-axis direction). According to embodiments, the bend 432 may include: an extension 4321 extending from the display panel 430 and including control circuitry 4321a; and a flexible plate 4322 electrically connected to the extension 4321 and including a plurality of electrical components. According to embodiments, the control circuitry 4321a may include a display driver IC (DDI) or a touch display driver IC (TDDI) mounted on the extension 4321 and having an electrical wiring structure. According to embodiments, the bend 432 may include a chip-on-panel (or chip-on-plastic) structure in which the control circuitry 4321a is directly disposed on the extension 4321. In some embodiments, the bend 432 may also include a chip-on-film (COF) structure in which the control circuitry 4321a is mounted on a separate connecting film (not shown) connecting the extension 4321 and the flexible plate 4322. According to an embodiment, the flexible display 230 may include a plurality of electrical components (not shown) disposed on the flexible plate 4322. According to an embodiment, the flexible display 230 may include electronic devices (e.g., extending from the flexible plate 4322 and electrically connected to them). Figure 4 The board of the electronic device 200 (e.g., Figure 4The second board 272) has an FPCB connection portion 4323. According to an embodiment, multiple electrical components may include passive components such as a touch IC, flash memory for the display, ESD protection diodes, pressure sensors, fingerprint sensors, or decoupling capacitors. As another embodiment, the bending portion 432 is provided on the flexible display 230 facing the first housing (e.g., Figure 2a In the case of the area of ​​the first housing 210), the FPCB connector 4323 can also be electrically connected to an electronic device (e.g., Figure 4 Another board of the electronic device 200 (e.g., Figure 4 The second board 271).

[0108] According to exemplary embodiments of this disclosure, electronic devices (e.g., Figure 4 The electronic device 200 may include a digitizer panel comprising a high-rigidity shell and a curved pattern and including at least one shielding layer. For example, the electronic device may minimize circuit disconnection in the folded area of ​​the digitizer panel during folding by including a digitizer panel with a high-rigidity shell and a curved pattern. For example, the electronic device may prevent corrosion of the shielding layer and enhance the flatness of the display by including a digitizer panel containing at least one shielding layer.

[0109] The digitizer panel 470 included in the electronic device is described in detail below.

[0110] Figure 6 This is a partial cross-sectional view showing an electronic device 200 including a digitizer panel 470 according to various embodiments of the present disclosure. Figure 7a and Figure 7b This is a cross-sectional view showing the laminated structure of the digitizer panel 470 according to various embodiments of the present disclosure. Figure 8 This is a diagram illustrating the curved pattern 4731 of a digitizer panel 470 according to various embodiments of the present disclosure. Figure 9 This is a partial cross-sectional view showing the folded state of an electronic device 200 according to various embodiments of the present disclosure.

[0111] Reference Figure 6 , Figure 7a and Figure 7b The electronic device 200 may include a digitizer panel 470 disposed below the flexible display 230. The digitizer panel 470 may include a flat region and a folding region 230c. The flat region includes a first flat region 230a facing the first housing 210 and a second flat region 230b facing the second housing 220. The folding region 230c faces the hinge device 320. For example, the digitizer panel 470 may be implemented as an integral digitizer panel 470 including the flat region and the folding region 230c.

[0112] According to an embodiment, the integrated digitizer panel 470 may include a curved pattern 4731, which includes at least one opening and / or at least one recess, the opening and / or recess being configured with a specified interval and a specified arrangement density to enhance the flexibility of the flexible display 230. For example, the curved pattern 4731 may include a plurality of openings arranged at specified intervals. For example, the curved pattern 4731 may be formed in at least one region of the flat region and the folded region 230c of the integrated digitizer panel 470.

[0113] According to an embodiment, the digitizer panel 470 may include: a circuit portion 471, including at least one wiring layer and at least one insulating layer; a first shell layer 472 disposed on the upper part of the circuit portion 471; and a second shell layer 473 disposed on the lower part of the circuit portion 471. The circuit portion 471 may include N wiring layers, where N is a natural number equal to or greater than 2. For example, as... Figure 7a As shown, circuit portion 471 may include a first wiring layer 4711, a second wiring layer 4713, a third wiring layer 4715, and a fourth wiring layer 4717. Here, at least one insulating layer (e.g., a first insulating layer 4712, a second insulating layer 4714, and a third insulating layer 4716) may be disposed between the respective wiring layers. For example, as... Figure 7b As shown, circuit portion 471 may include a first wiring layer 4711, a second wiring layer 4713, and a third wiring layer 4715. Here, at least one insulating layer (e.g., a first insulating layer 4712, a second insulating layer 4714) may be disposed between the respective wiring layers.

[0114] A first shell layer 472 may be formed on the upper portion of the circuit portion 471. A second shell layer 473 may be formed on the lower portion of the circuit portion 471. The first shell layer 472 and the second shell layer 473 may be formed using a non-metallic sheet material with rigid properties, such as fiber-reinforced plastic (FRP). For example, the first shell layer 472 and the second shell layer 473 may comprise at least one of carbon fiber reinforced plastic (CFRP) sheets and glass fiber reinforced plastic (GFRP) sheets. For example, as... Figure 9 As shown, by providing a first shell 472 and a second shell 473 with rigid properties in the form of surrounding the circuit portion 471, the digitizer panel 470 can be bent in the folding region 230c when the electronic device 200 is folded, while forming a radius larger than the radius of the flexible display 230. Therefore, during folding, the disconnection of the circuit portion 471 of the digitizer panel 470 can be minimized.

[0115] The folded region 230c of the digitizer panel 470 may include curved sections. Furthermore, the flat regions of the digitizer panel 470 may include reverse curved sections. For example, the first flat region 230a may include a first reverse curved section 230d, and the second flat region 230b may include a second reverse curved section 230e. According to an embodiment, when the flexible display 230 is viewed from above, the curved pattern 4731 of the integral digitizer panel 470 may be formed in the curved sections corresponding to the folded region 230c, such as... Figure 8 As shown in the embodiment, when the flexible display 230 is viewed from above, the curved pattern 4731 of the integrated digitizer panel 470 can be formed in the portions corresponding to the reverse curved sections 230d and 230e of the flat regions 230a and 230b.

[0116] According to an embodiment, the plurality of openings in the bending pattern 4731 may have a shape, arrangement structure, and arrangement density capable of determining the bending characteristics of the flexible display 230. Each of the plurality of openings may be formed as a slit having a predetermined length and width along the folding axis (A-axis) and having a predetermined interval relative to each other. For example, as Figure 8 As shown, the curved section may include a curved pattern 4731, which includes a plurality of openings having a first length H1 along the folding axis, a first width W1 less than the first length H1, and arranged at a first interval D1. For example, a reverse curved section may include a curved pattern 4731, which includes a plurality of openings having a second length along the folding axis, a second width less than the second length, and arranged at a second interval. For example, the second length may be the same as the first length, the second width may be the same as the first width W1, and the second interval may be the same as the first interval.

[0117] According to an embodiment, the digitizer panel 470 can provide elasticity and bending characteristics through a bending pattern 4731, while simultaneously guiding the digitizer panel 470 to detect the wireless signal of an external electronic pen. For example, as Figure 9 As shown, the bending pattern 4731 can be configured to extend along a direction perpendicular to the folding axis A in at least one of the bending section and the reverse bending section of the digitizer panel 470, while having a sawtooth wave shape, thereby helping to enhance the bending characteristics of the flexible display 230. For example, the length of the first length of the plurality of openings can be 15 to 30 times the first interval. For example, the length of the first width W1 of the plurality of openings can be 1.2 to 1.5 times the first interval. However, the shape and size of the bending pattern 4731 are not limited thereto and can vary.

[0118] Figure 10 This is a cross-sectional view showing the internal structure of a digitizer panel 470 according to various embodiments of the present disclosure. Figures 11a to 11cThis is a cross-sectional view showing the laminated structure of the digitizer panel 470 according to various embodiments of the present disclosure. Figure 12 This is a perspective view showing the structure of at least one shielding layer 474 according to various embodiments of the present disclosure.

[0119] Reference Figure 10 The digitizer panel 470 may include a flat area and a folded area 230c. The flat area includes a first flat area 230a facing the first housing 210 and a second flat area 230b facing the second housing 220. The folded area 230c faces the hinge device 320. The digitizer panel 470 may include: a circuit portion 471, including at least one wiring layer and at least one insulating layer; a first shell layer 472 disposed on the upper part of the circuit portion 471; and a second shell layer 473 disposed on the lower part of the circuit portion 471. The at least one wiring layer may include multiple lines. For example, the folded area 230c of the circuit portion 471 may include N wiring layers, where N is a natural number equal to or greater than 2. For example, the flat area of ​​the circuit portion 471 may include M wiring layers and at least one shielding layer 474, where M is a natural number less than N.

[0120] According to the embodiments, such as Figure 11a As shown, the folded region 230c of the circuit portion 471 may include four wiring layers, and the flat region of the circuit portion 471 may include three wiring layers and at least one shielding layer 474. For example, at least one shielding layer 474 of the flat region may be formed in the same layer as the fourth wiring layer 4717 of the folded region 230c. For example, the shielding layer 474 may include a first shielding layer 4741 of a first flat region 230a formed in the same layer as the fourth wiring layer 4717 and a second shielding layer 4742 of a second flat region 230b formed in the same layer as the fourth wiring layer 4717.

[0121] According to the embodiments, such as Figure 11b As shown, the folded region 230c of the circuit portion 471 may include four wiring layers, and the flat region of the circuit portion 471 may include two wiring layers and at least one shielding layer 474. For example, at least one shielding layer 474 of the flat region may be formed in the layer corresponding to the third wiring layer 4715 and the fourth wiring layer 4717 of the folded region 230c. For example, the shielding layer 474 may include a first shielding layer 4741 formed in the layer corresponding to the third wiring layer 4715 and the fourth wiring layer 4717 for a first flat region 230a, and a second shielding layer 4742 formed in the layer corresponding to the second flat region 230b of the layer corresponding to the third wiring layer 4715 and the fourth wiring layer 4717.

[0122] According to the embodiments, such as Figure 11cAs shown, the folded region 230c of the circuit portion 471 may include three wiring layers, and the flat region of the circuit portion 471 may include two wiring layers and at least one shielding layer 474. For example, at least one shielding layer 474 in the flat region may be formed in the same layer as the third wiring layer 4715 of the folded region 230c. For example, the shielding layer 474 may include a first shielding layer 4741 in a first flat region 230a formed in the same layer as the third wiring layer 4715 and a second shielding layer 4742 in a second flat region 230b formed in the same layer as the third wiring layer 4715. By including at least one shielding layer 474 corresponding to the wiring layer of the folded region 230c in the flat region, the digitizer panel 470 of this disclosure can prevent corrosion of the shielding layer 474 and can enhance the flatness of the display.

[0123] Reference Figure 12 The shielding layer 474 may include a predetermined area corresponding to the flexible display 230. The shielding layer 474 may include a plurality of fill holes FHs spaced at constant intervals into which resin is introduced. For example, when the first shell layer 472 and the second shell layer 473 are laminated onto the upper and lower portions of the circuit portion 471, resin is introduced through the plurality of fill holes FHs to securely fix the various components of the digitizer panel 470 and minimize interlayer peeling of the shielding layer 474. For example, the fill holes FH may have a diameter between 0.1 mm and 5 mm to facilitate resin introduction.

[0124] Figures 13a to 13d This is a cross-sectional view showing the construction of the shielding layer 474 inside the digitizer panel 470 according to various embodiments of the present disclosure.

[0125] The digitizer panel 470 may include at least one shielding layer 474 in the flat region. The digitizer panel 470 may include a flat region and a folded region 230c, the flat region including a first flat region 230a facing the first housing 210 and a second flat region 230b facing the second housing 220, the folded region 230c facing the hinge device 320. The first flat region 230a may include a first-1 flat region 230a1 located in the direction opposite to the folded region 230c relative to the first reverse bending segment 230d, and a first-2 flat region 230a2 located between the folded region 230c and the first reverse bending segment 230d. The second flat region 230b may include a second-1 flat region 230b1 located in the direction opposite to the folded region 230c relative to the second reverse bending segment 230e, and a second-2 flat region 230b2 located between the folded region 230c and the second reverse bending segment 230e. At least one shielding layer 474 may include a first shielding layer 4741 disposed in the circuit portion 471 of the first-1 flat region 230a1 and a second shielding layer 4742 disposed in the circuit portion 471 of the second-1 flat region 230b1. For example, the first shielding layer 4741 and the second shielding layer 4742 may include at least one of magnetic shielding material, conductive shielding material and magnetic shielding material.

[0126] Reference Figure 13a The digitizer panel 470 may include a first shielding layer 4741 comprising a magnetic shielding material and a second shielding layer 4742 comprising a magnetic shielding material. The first shielding layer 4741 and the second shielding layer 4742 may be formed in a layer corresponding to at least one wiring layer of the circuit portion 471. For example, the first shielding layer 4741 disposed in the circuit portion 471 in the first-1 flat region 230a1 may include a magnetic shielding material. For example, the second shielding layer 4742 disposed in the circuit portion 471 in the second-1 flat region 230b1 may include a magnetic shielding material.

[0127] Reference Figure 13bThe digitizer panel 470 may include a first shielding layer 4741 and a second shielding layer 4742. The first shielding layer 4741 includes a magnetic shielding material 4741a and a conductive shielding material 4741b, and the second shielding layer 4742 includes a magnetic shielding material 4742a and a conductive shielding material 4742b. The first shielding layer 4741 and the second shielding layer 4742 may be formed in a layer corresponding to at least one wiring layer of the circuit portion 471. In the first shielding layer 4741 and the second shielding layer 4742, the conductive shielding materials 4741b and 4742b may be formed on the lower part of the magnetic shielding materials 4741a and 4742a. ​​For example, the first shielding layer 4741 disposed in the circuit portion 471 of the first-1 flat region 230a1 may include a magnetic shielding material 4741a and a conductive shielding material 4741b formed on the lower part of the magnetic shielding material 4741a. For example, the second shielding layer 4742 disposed in the circuit portion 471 of the 2-1 flat region 230b1 may include a magnetic shielding material 4742a and a conductive shielding material 4742b formed on the lower part of the magnetic shielding material 4742a.

[0128] Reference Figure 13c The digitizer panel 470 may include a first shielding layer 4741 and a second shielding layer 4742. The first shielding layer 4741 includes a magnetic shielding material 4741a, a conductive shielding material 4741b, and a magnetic shielding material 4741c. The second shielding layer 4742 includes a magnetic shielding material 4742a, a conductive shielding material 4742b, and a magnetic shielding material 4742c. The first shielding layer 4741 and the second shielding layer 4742 may be formed in a layer corresponding to at least one wiring layer of the circuit portion 471. The conductive shielding materials 4741b and 4742b may be formed on the lower portion of the magnetic shielding materials 4741a and 4742a. ​​The magnetic shielding materials 4741c and 4742c may be formed on one side of the magnetic shielding materials 4741a and 4742a. For example, the first shielding layer 4741 disposed in the circuit portion 471 of the first-1 flat region 230a1 may include a magnetic shielding material 4741a, a conductive shielding material 4741b formed on the lower part of the magnetic shielding material 4741a, and a magnetic shielding material 4741c formed on one side of the magnetic shielding material 4741a. For example, the second shielding layer 4742 disposed in the circuit portion 471 of the second-1 flat region 230b1 may include a magnetic shielding material 4742a, a conductive shielding material 4742b formed on the lower part of the magnetic shielding material 4742a, and a magnetic shielding material 4742c formed on one side of the magnetic shielding material 4741a.

[0129] Reference Figure 13dThe digitizer panel 470 may include a first shielding layer 4741 and a second shielding layer 4742. The first shielding layer 4741 includes at least one of a magnetic shielding material, a conductive shielding material, and a magnetic shielding material. The second shielding layer 4742 includes at least one of a magnetic shielding material, a conductive shielding material, and a magnetic shielding material. The first shielding layer 4741 and the second shielding layer 4742 may be formed in a layer corresponding to at least one wiring layer of the circuit portion 471. For example, the first shielding layer 4741 and the second shielding layer 4742 may have different configurations. For example, the first shielding layer 4741 disposed in the circuit portion 471 in the first-1 flat region 230a1 may include a magnetic shielding material 4741a. For example, the second shielding layer 4742 disposed in the circuit portion 471 in the second-1 flat region 230b1 may include a magnetic shielding material 4742a, a conductive shielding material 4742b formed on the lower part of the magnetic shielding material 4742a, and a magnetic shielding material 4742c formed on one side of the magnetic shielding material 4742a.

[0130] Figure 14a and Figure 14b This is a cross-sectional view showing the construction of the shielding layer 474 inside the digitizer panel 470 according to various embodiments of the present disclosure.

[0131] The digitizer panel 470 may include at least one shielding layer 474 in the flat region. The digitizer panel 470 may include a flat region and a folded region 230c, the flat region including a first flat region 230a facing the first housing 210 and a second flat region 230b facing the second housing 220, the folded region 230c facing the hinge device 320. The first flat region 230a may include a first-1 flat region 230a1 located in the direction opposite to the folded region 230c relative to the first reverse bending segment 230d, and a first-2 flat region 230a2 located between the folded region 230c and the first reverse bending segment 230d. The second flat region 230b may include a second-1 flat region 230b1 located in the direction opposite to the folded region 230c relative to the second reverse bending segment 230e, and a second-2 flat region 230b2 located between the folded region 230c and the second reverse bending segment 230e.

[0132] In an embodiment, at least one shielding layer 474 may include a first shielding layer 4741 disposed in the circuit portion 471 of the first-1 flat region 230a1 and a second shielding layer 4742 disposed in the circuit portion 471 of the second-1 flat region 230b1. Furthermore, at least one shielding layer 474 may also include a third shielding layer 4743 disposed in the circuit portion 471 of the first-2 flat region 230a2 and a fourth shielding layer 4744 disposed in the circuit portion 471 of the second-2 flat region 230b2. For example, the first shielding layer 4741, the second shielding layer 4742, the third shielding layer 4743, and the fourth shielding layer 4744 may include at least one of a magnetic shielding material, a conductive shielding material, and a magnetic shielding material.

[0133] Reference Figure 14a The digitizer panel 470 may include a first shielding layer 4741 containing magnetic shielding material, a second shielding layer 4742 containing magnetic shielding material, a third shielding layer 4743 containing magnetic shielding material, and a fourth shielding layer 4744 containing magnetic shielding material. The first shielding layer 4741 to the fourth shielding layer 4744 may be formed in layers corresponding to at least one wiring layer of the circuit portion 471. For example, the first shielding layer 4741 disposed in the circuit portion 471 in the first-1 flat region 230a1 may include magnetic shielding material. For example, the second shielding layer 4742 disposed in the circuit portion 471 in the second-1 flat region 230b1 may include magnetic shielding material. The third shielding layer 4743 disposed in the circuit portion 471 in the first-2 flat region 230a2 may include magnetic shielding material. The fourth shielding layer 4744 disposed in the circuit portion 471 in the second-2 flat region 230b2 may include magnetic shielding material.

[0134] Reference Figure 14bThe digitizer panel 470 may include: a first shielding layer 4741, including a magnetic shielding material 4741a and a conductive shielding material 4741b; a second shielding layer 4742, including a magnetic shielding material 4742a and a conductive shielding material 4742b; a third shielding layer 4743, including a magnetic shielding material 4743a and a conductive shielding material 4743b; and a fourth shielding layer 4744, including a magnetic shielding material 4744a and a conductive shielding material 4744b. The first to fourth shielding layers 4741 may be formed in layers corresponding to at least one wiring layer of the circuit portion 471. In the first to fourth shielding layers 4744, the conductive shielding material may be formed on the lower portion of the magnetic shielding material. For example, the first shielding layer 4741 disposed in the circuit portion 471 of the first-1 flat region 230a1 may include a magnetic shielding material 4741a and a conductive shielding material 4741b formed on the lower portion of the magnetic shielding material 4741a. For example, the second shielding layer 4742 disposed in the circuit portion 471 of the 2-1 flat region 230b1 may include a magnetic shielding material 4742a and a conductive shielding material 4742b formed on the lower part of the magnetic shielding material 4742a. ​​For example, the third shielding layer 4743 disposed in the circuit portion 471 of the 1-2 flat region 230a2 may include a magnetic shielding material 4743a and a conductive shielding material 4743b formed on the lower part of the magnetic shielding material 4743a. For example, the fourth shielding layer 4744 disposed in the circuit portion 471 of the 2-2 flat region 230b2 may include a magnetic shielding material 4744a and a conductive shielding material 4744b formed on the lower part of the magnetic shielding material 4744a.

[0135] Figure 15a and Figure 15b This is a cross-sectional view showing the construction of the shielding layer 474 inside the digitizer panel 470 according to various embodiments of the present disclosure.

[0136] The digitizer panel 470 may include at least one shielding layer 474 in the flat region. The digitizer panel 470 may include a flat region and a folded region 230c, the flat region including a first flat region 230a facing the first housing 210 and a second flat region 230b facing the second housing 220, the folded region 230c facing the hinge device 320. The first flat region 230a may include a first-1 flat region 230a1 located in the direction opposite to the folded region 230c relative to the first reverse bending segment 230d, and a first-2 flat region 230a2 located between the folded region 230c and the first reverse bending segment 230d. The second flat region 230b may include a second-1 flat region 230b1 located in the direction opposite to the folded region 230c relative to the second reverse bending segment 230e, and a second-2 flat region 230b2 located between the folded region 230c and the second reverse bending segment 230e.

[0137] Reference Figure 15a The electronic device 200 may further include a shielding sheet 484 disposed below the digitizer panel 470. For example, the digitizer panel 470 may include a first shielding layer 4741 disposed in a circuit portion 471 in a first-1 flat region 230a1, and a second shielding layer 4742 disposed in a circuit portion 471 in a second-1 flat region 230b1. For example, the first shielding layer 4741 and the second shielding layer 4742 may be formed in a layer corresponding to at least one wiring layer of the circuit portion 471. For example, the first shielding layer 4741 disposed in the circuit portion 471 in the first-1 flat region 230a1 may include a magnetic shielding material. For example, the second shielding layer 4742 disposed in the circuit portion 471 in the second-1 flat region 230b1 may include a magnetic shielding material. The shielding sheet 484 disposed below the digitizer panel 470 may include a conductive shielding material. For example, the shielding sheet 484 may include a conductive shielding material 4841 corresponding to the first shielding layer 4741 and a conductive shielding material 4842 corresponding to the second shielding layer 4742.

[0138] Reference Figure 15bThe electronic device 200 may further include a shielding sheet 484 disposed below the digitizer panel 470. For example, the digitizer panel 470 may include a first shielding layer 4741 disposed in the circuit portion 471 of the first-1 flat region 230a1, a second shielding layer 4742 disposed in the circuit portion 471 of the second-1 flat region 230b1, a third shielding layer 4743 disposed in the circuit portion 471 of the first-2 flat region 230a2, and a fourth shielding layer 4744 disposed in the circuit portion 471 of the second-2 flat region 230b2. For example, the first shielding layer 4741 to the fourth shielding layer 4744 may be formed in layers corresponding to at least one wiring layer of the circuit portion 471. For example, the first shielding layer 4741 disposed in the circuit portion 471 of the first-1 flat region 230a1 may include a magnetic shielding material. For example, the second shielding layer 4742 disposed in the circuit portion 471 of the second-1 flat region 230b1 may include a magnetic shielding material. For example, the third shielding layer 4743 disposed in the circuit portion 471 of the first-second flat region 230a2 may include a magnetic shielding material. For example, the fourth shielding layer 4744 disposed in the circuit portion 471 of the second-second flat region 230b2 may include a magnetic shielding material. The shielding sheet 484 disposed below the digitizer panel 470 may include a conductive shielding material. For example, the shielding sheet 484 may include a conductive shielding material 4841 corresponding to the first shielding layer 4741, a conductive shielding material 4842 corresponding to the second shielding layer 4742, a conductive shielding material 4843 corresponding to the third shielding layer 4743, and a conductive shielding material 4844 corresponding to the fourth shielding layer 4744.

[0139] Figure 16 This is a cross-sectional view showing the laminated structure of a digitizer panel 470 according to various embodiments of the present disclosure.

[0140] Reference Figure 16 The digitizer panel 470 may include a flat area and a folded area 230c. The flat area includes a first flat area 230a facing the first housing 210 and a second flat area 230b facing the second housing 220. The folded area 230c faces the hinge device 320. The digitizer panel 470 may include: a circuit portion 471, including at least one wiring layer and at least one insulating layer; a first housing layer 472 disposed on the upper part of the circuit portion 471; and a second housing layer 473 disposed on the lower part of the circuit portion 471. At least one wiring layer may include multiple lines. For example, the folded area 230c of the circuit portion 471 may include N wiring layers, where N is a natural number equal to or greater than 2. For example, the flat area of ​​the circuit portion 471 may include M wiring layers and at least one control IC 475, where M is a natural number less than N.

[0141] According to the embodiments, such as Figure 16 As shown, the folded region 230c of circuit section 471 may include four wiring layers, and the flat region of circuit section 471 may include three wiring layers and at least one control IC 475. For example, at least one control IC in the flat region may be formed in the same layer as the fourth wiring layer 4717 of the folded region 230c. Furthermore, the control IC 475 of the digitizer panel 470 of this disclosure is not limited to... Figure 16 Furthermore, the control IC of this disclosure may be disposed differently within the digitizer panel 470. For example, the control IC 475 may be disposed in at least one of the first flat region 230a and the second flat region 230b. For example, the control IC 475 may be formed in a layer corresponding to the third wiring layer 4715 and the fourth wiring layer 4717 of the folded region 230c.

[0142] As described above, according to various embodiments of the present disclosure, the foldable electronic device 200 and its manufacturing method according to the present disclosure can minimize circuit disconnection in the folding region 230c of the digitizer panel 470 during folding by including a digitizer panel 470 having a high-rigidity shell and a bending pattern 4731. Furthermore, by including a digitizer panel 470 containing at least one shielding layer 474, corrosion of the shielding layer 474 can be prevented in the foldable electronic device 200 and its manufacturing method according to the present disclosure, and the flatness of the display can be enhanced. However, since this has already been described above, a repeating description will not be given.

[0143] A foldable electronic device 200 according to an embodiment of the present disclosure may include: a first housing; a second housing; a hinge mechanism rotatably connecting the first housing and the second housing; a flexible display 230 configured to span the first housing and the second housing and including a folding region 230c; and a digitizer panel 470 disposed below the flexible display 230 and including a bending pattern 4731, the bending pattern 4731 including a plurality of openings disposed at specified intervals. The digitizer panel 470 may include: a circuit portion 471 including at least one wiring layer and at least one insulating layer; a first shell layer 472 disposed on the upper portion of the circuit portion 471; and a second shell layer 473 disposed on the lower portion of the circuit portion 471.

[0144] In one embodiment, the digitizer panel 470 may include a flat region and a folded region 230c. The flat region includes a first flat region 230a facing the first housing and a second flat region 230b facing the second housing. The folded region 230c of the circuit portion 471 may include N wiring layers, where N is a natural number equal to or greater than 2. The flat region of the circuit portion 471 may include M wiring layers and at least one shielding layer 474, where M is a natural number less than N.

[0145] In an embodiment, the first shell 472 and the second shell 473 may include at least one of carbon fiber reinforced plastic (CFRP) sheet and glass fiber reinforced plastic (GFRP) sheet.

[0146] In an embodiment, the folded area 230c of the digitizer panel 470 may include a curved section. The curved section may include a curved pattern 4731, which includes a plurality of openings having a first length along the folding axis, a first width W1 less than the first length, and arranged at a first interval.

[0147] In an embodiment, the length of the first length of the plurality of openings can be 15 to 30 times the length of the first interval. The length of the first width W1 of the plurality of openings can be 1.2 to 1.5 times the length of the first interval.

[0148] In one embodiment, the flat area of ​​the digitizer panel 470 may include a reverse-bending section. The reverse-bending section may include a bending pattern 4731, which includes a plurality of openings having a second length along the fold axis, a second width less than the second length, and arranged at second intervals.

[0149] In one embodiment, the folded region 230c of the circuit portion 471 may include four wiring layers. The flat region of the circuit portion 471 may include three wiring layers and at least one shielding layer 474.

[0150] In one embodiment, the folded region 230c of the circuit portion 471 may include four wiring layers. The flat region of the circuit portion 471 may include two wiring layers and at least one shielding layer 474.

[0151] In one embodiment, the folded region 230c of the circuit portion 471 may include three wiring layers. The flat region of the circuit portion 471 may include two wiring layers and at least one shielding layer 474.

[0152] In one embodiment, at least one shielding layer 474 may include a plurality of filling holes FHs arranged at constant intervals and into which resin is introduced. The filling holes FHs may have a diameter between 0.1 mm and 5 mm.

[0153] In an embodiment, the first flat region 230a may include a first-1 flat region 230a1 located in the direction opposite to the folded region 230c relative to the first reverse bending segment 230d, and a first-2 flat region 230a2 located between the folded region 230c and the first reverse bending segment 230d. The second flat region 230b may include a second-1 flat region 230b1 located in the direction opposite to the folded region 230c relative to the second reverse bending segment 230e, and a second-2 flat region 230b2 located between the folded region 230c and the second reverse bending segment 230e.

[0154] In an embodiment, at least one shielding layer 474 may include a first shielding layer 4741 disposed in the circuit portion 471 of the first-1 flat region 230a1 and a second shielding layer 4742 disposed in the circuit portion 471 of the second-1 flat region 230b1.

[0155] In an embodiment, the first shielding layer 4741 and the second shielding layer 4742 may include at least one of magnetic shielding material, conductive shielding material and magnetic shielding material.

[0156] In an embodiment, at least one shielding layer 474 may further include a third shielding layer 4743 disposed in the circuit portion 471 of the first-2 flat region 230a2 and a fourth shielding layer 4744 disposed in the circuit portion 471 of the second-2 flat region 230b2.

[0157] In the embodiments, the third shielding layer 4743 and the fourth shielding layer 4744 may include at least one of magnetic shielding material, conductive shielding material and magnetic shielding material.

[0158] In one embodiment, the foldable electronic device may further include a shielding layer 484 disposed below the digitizer panel 470. At least one shielding layer 474 may include a magnetic shielding material. The shielding layer may include a conductive shielding material.

[0159] In one embodiment, the digitizer panel 470 may include a flat region and a folded region 230c. The flat region includes a first flat region 230a facing the first housing and a second flat region 230b facing the second housing. The folded region 230c of the circuit section 471 may include N wiring layers, where N is a natural number equal to or greater than 2. The flat regions 230a and 230b of the circuit section 471 may include M wiring layers and at least one control IC 475, where M is a natural number less than N.

[0160] A method for manufacturing a foldable electronic device 200 according to embodiments of the present disclosure may include forming a flexible display 230 configured to span a first housing and a second housing and including a folding region 230c, and forming a digitizer panel 470 disposed below the flexible display 230. The steps of forming the digitizer panel 470 may include: forming a circuit portion 471 including at least one wiring layer and at least one insulating layer; forming a first shell layer 472 disposed on an upper portion of the circuit portion 471 and a second shell layer 473 disposed on a lower portion of the circuit portion 471; and forming a curved pattern 4731 including a plurality of openings disposed at specified intervals.

[0161] In an embodiment, the digitizer panel 470 may include a flat region and a folded region 230c, the flat region including a first flat region 230a facing the first housing and a second flat region 230b facing the second housing. The step of forming the circuit portion 471 may include: forming N wiring layers in the folded region 230c of the circuit portion 471, where N is a natural number equal to or greater than 2; and forming M wiring layers and at least one shielding layer 474 in the flat region of the circuit portion 471, where M is a natural number less than N.

[0162] In an embodiment, the first shell 472 and the second shell 473 may include at least one of carbon fiber reinforced plastic (CFRP) sheet and glass fiber reinforced plastic (GFRP) sheet.

Claims

1. A foldable electronic device, comprising: First shell (210); Second housing (220); A hinge device (320) rotatably connects the first housing (210) and the second housing (220). A flexible display (230) is configured to span across the first housing (210) and the second housing (220) and include a folded region (230c). as well as A digitizer panel (470) is disposed below the flexible display (230) and includes a curved pattern comprising a plurality of openings spaced at specified intervals, wherein the digitizer panel (470) includes: The circuit section (471) includes at least one wiring layer and at least one insulating layer; A first shell layer (472) is disposed on the upper part of the circuit portion; and The second shell (473) is disposed on the lower part of the circuit section.

2. The foldable electronic device according to claim 1, wherein, The digitizer panel includes a flat area and a folded area (230c). The flat area includes a first flat area (230a) facing the first housing and a second flat area (230b) facing the second housing. The circuit portion of the folded area (230c) includes N wiring layers, where N is a natural number equal to or greater than 2. The circuit portion of the flat areas (230a, 230b) includes M wiring layers and at least one shielding layer, where M is a natural number less than N.

3. The foldable electronic device according to claim 2, wherein, The first shell and the second shell comprise at least one of carbon fiber reinforced plastic (CFRP) sheet and glass fiber reinforced plastic (GFRP) sheet.

4. The foldable electronic device according to claim 2 or 3, wherein, The folded area of ​​the digitizer panel includes a curved section, wherein the curved section includes the curved pattern, the curved pattern including the plurality of openings having a first length along the folding axis, a first width less than the first length, and arranged at a first interval.

5. The foldable electronic device according to claim 4, wherein, The length of the first length of the plurality of openings is 15 to 30 times the first interval, and wherein the length of the first width of the plurality of openings is 1.2 to 1.5 times the first interval.

6. The foldable electronic device according to claim 4 or 5, wherein, The flat area of ​​the digitizer panel includes a reverse-bending section, wherein the reverse-bending section includes the bending pattern, the bending pattern including the plurality of openings having a second length along the fold axis, a second width less than the second length, and arranged at a second interval.

7. The foldable electronic device according to any one of claims 2 to 6, wherein, The folded region of the circuit portion includes four wiring layers, and the flat region of the circuit portion includes three wiring layers and the at least one shielding layer.

8. The foldable electronic device according to any one of claims 2 to 6, wherein, The folded region of the circuit portion includes four wiring layers, and the flat region of the circuit portion includes two wiring layers and the at least one shielding layer.

9. The foldable electronic device according to any one of claims 2 to 6, wherein, The folded region of the circuit portion includes three wiring layers, and the flat region of the circuit portion includes two wiring layers and the at least one shielding layer.

10. The foldable electronic device according to any one of claims 2 to 6, wherein, The at least one shielding layer includes a plurality of filling holes arranged at constant intervals, into which resin is introduced, and wherein the filling holes have a diameter between 0.1 mm and 5 mm.

11. The foldable electronic device according to any one of claims 2 to 6, wherein, The first flat region includes a first-1 flat region located in the opposite direction to the folded region relative to the first reverse bending section and a first-2 flat region located between the folded region and the first reverse bending section, wherein the second flat region includes a second-1 flat region located in the opposite direction to the folded region relative to the second reverse bending section and a second-2 flat region located between the folded region and the second reverse bending section.

12. The foldable electronic device according to claim 11, wherein, The at least one shielding layer includes: A first shielding layer is disposed in the circuit portion of the first-1 flat region; and A second shielding layer is disposed in the circuit portion of the 2-1 flat region, wherein the first shielding layer and the second shielding layer comprise at least one of a magnetic shielding material, a conductive shielding material, and a magnetic shielding material.

13. The foldable electronic device according to claim 12, wherein, The at least one shielding layer further includes: A third shielding layer is disposed within the circuit portion of the first-second flat region; and A fourth shielding layer is disposed in the circuit portion of the second-2 flat region, wherein the third and fourth shielding layers comprise at least one of a magnetic shielding material, a conductive shielding material, and a magnetic shielding material.

14. The foldable electronic device according to claim 12, further comprising a shielding sheet (484) disposed below the digitizer panel, wherein, The at least one shielding layer comprises a magnetic shielding material, and The shielding sheet includes a conductive shielding material.

15. A method for manufacturing a foldable electronic device, the method comprising: A flexible display (230) is formed, which is configured to span across the first housing (210) and the second housing (220) and includes a folded region (230c). as well as Forming a digitizer panel (470) disposed below the flexible display (230), wherein the steps of forming the digitizer panel (470) include: A circuit portion (471) comprising at least one wiring layer and at least one insulating layer is formed. A first shell layer (472) is formed on the upper part of the circuit portion and a second shell layer (473) is formed on the lower part of the circuit portion; and A curved pattern is formed, comprising multiple openings spaced at specified intervals.

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