inductor component
By designing an insulating layer with tilted end faces and columnar wiring connections in the inductor component, the problem of reduced magnetic material volume was solved, the inductance value was improved, and the magnetic flux distribution was optimized.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2026-05-29
AI Technical Summary
Existing inductor components contain a large number of insulating layers, which reduces the volume of magnetic material and affects the improvement of inductance value.
By employing a specific cross-sectional design of a flat interlayer insulation layer and inductor wiring, the end face of the insulation layer is inclined, increasing the volume of the magnetic material. Furthermore, the magnetic flux distribution is optimized by connecting the inductor wiring with columnar wiring.
The inductance value of the inductor component was increased, the possibility of magnetic flux saturation was reduced, and the volume ratio of magnetic material was increased.
Smart Images
Figure CN122122682A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to inductor components. Background Technology
[0002] Patent Document 1 describes an inductor component comprising a blank, a first interlayer insulating layer, a wiring interlayer insulating layer, a second interlayer insulating layer, and a coil. The blank is rectangular in shape and contains a magnetic material. The first interlayer insulating layer is located inside the blank and extends parallel to the main surface of the blank. The wiring interlayer insulating layers extend from the first interlayer insulating layer in a direction orthogonal to the main surface. In a cross-sectional view orthogonal to the main surface, multiple wiring interlayer insulating layers are arranged at intervals. The second interlayer insulating layer is located on the opposite side of the wiring interlayer insulating layer and is connected to the wiring interlayer insulating layer. The second interlayer insulating layer is parallel to the first interlayer insulating layer. The coil is located in the area defined by the first interlayer insulating layer, the wiring interlayer insulating layer, and the second interlayer insulating layer.
[0003] Patent Document 1: Japanese Patent No. 6690386.
[0004] In the invention described in Patent Document 1, the first interlayer insulation layer, the wiring interlayer insulation layer, and the second interlayer insulation layer are located within the blank. If the volume of the inductor components is the same, the volume of magnetic material in the blank can be reduced accordingly due to the inclusion of more insulation layers. Summary of the Invention
[0005] To address the aforementioned issues, one aspect of this disclosure provides an inductor component comprising: a blank having a main surface and containing a magnetic material; a flat interlayer insulating layer extending parallel to the main surface within the blank; and inductor wiring contacting a surface of the interlayer insulating layer parallel to the main surface. When a direction orthogonal to the main surface, from the inductor wiring side toward the interlayer insulating layer, is designated as a positive direction, and a direction opposite to the positive direction is designated as a negative direction, and a surface on the outer surface of the interlayer insulating layer facing the direction parallel to the main surface is designated as an end face, in a specific cross-section orthogonal to the centerline of the inductor wiring, the entire end face is either an inclined surface facing the direction parallel to the main surface and in the negative direction, or an inclined surface facing the direction parallel to the main surface and in the positive direction.
[0006] Based on the above configuration, an increase in the inductance value in the inductor component can be expected. Attached Figure Description
[0007] Figure 1 This is a 3D view of an inductor component.
[0008] Figure 2 This is a perspective side view of the inductor component.
[0009] Figure 3 This is a perspective top view of the inductor component.
[0010] Figure 4 It is along Figure 3 A cross-sectional view of the 4-4 wire inductor component.
[0011] Figure 5 It is a magnified sectional view of a specific section.
[0012] Figure 6 This is a magnified schematic diagram of the area near the surface of the first interlayer insulation layer in a specific cross-section.
[0013] Figure 7 This is an explanatory diagram illustrating the manufacturing method of an inductor component.
[0014] Figure 8 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0015] Figure 9 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0016] Figure 10 This is an explanatory diagram illustrating the manufacturing method of an inductor component.
[0017] Figure 11 This is an explanatory diagram illustrating the manufacturing method of an inductor component.
[0018] Figure 12 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0019] Figure 13 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0020] Figure 14 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0021] Figure 15 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0022] Figure 16 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0023] Figure 17 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0024] Figure 18 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0025] Figure 19 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0026] Figure 20This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0027] Figure 21 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0028] Figure 22 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0029] Figure 23 This is an illustrative diagram illustrating the manufacturing process of an inductor component.
[0030] Figure 24 This is a cross-sectional view of the inductor component in the modified example.
[0031] Figure 25 This is an enlarged section view of a specific cross-section of the inductor component in the modified example. Detailed Implementation
[0032] Hereinafter, one embodiment of the inductor component will be described with reference to the accompanying drawings. Furthermore, the drawings may show enlarged representations of constituent elements for ease of understanding. The dimensional ratios of the constituent elements may sometimes differ from the actual constituent elements or those shown in other drawings.
[0033] <Overall Composition>
[0034] like Figure 1 As shown, the inductor component 10 is generally rectangular in shape. Figure 2 As shown, the inductor component 10 includes a blank 11 and inductor wiring 50.
[0035] like Figure 1 As shown, the blank 11 has six planar outer surfaces. One specific surface among these six outer surfaces is designated as the first main surface 11A. Furthermore, the surface located opposite to and parallel to the first main surface 11A is designated as the second main surface 11B. Both the first main surface 11A and the second main surface 11B are rectangular. In this embodiment, the first main surface 11A is the mounting surface opposite to the substrate when the inductor component 10 is mounted on the substrate.
[0036] Here, the axis orthogonal to the first principal surface 11A is designated as the first axis X. Furthermore, the axis orthogonal to the first axis X and parallel to a specific side of the first principal surface 11A (in this embodiment, the long side of the first principal surface 11A) is designated as the second axis Y. And, the axis orthogonal to both the first axis X and the second axis Y is designated as the third axis Z. Furthermore, the direction in which the first principal surface 11A faces along the first axis X is designated as the first positive direction X1, and the direction opposite to the first positive direction X1 is designated as the first negative direction X2. Furthermore, a specific direction along the second axis Y is designated as the second positive direction Y1, and the direction opposite to the second positive direction Y1 is designated as the second negative direction Y2. And, a specific direction along the third axis Z is designated as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is designated as the third negative direction Z2.
[0037] like Figure 4 As shown, the blank 11, from the first negative direction X2 side, sequentially comprises a first magnetic layer 21, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, and a third magnetic layer 25 as the magnetic layer 20. Furthermore, in Figure 4 In the diagram, the boundaries of each magnetic layer 20 are virtually illustrated using double-dotted lines, but sometimes clear boundaries cannot be observed between these magnetic layers 20. The material of these magnetic layers 20 is an organic resin containing metallic magnetic powder. That is, the blank 11 contains magnetic material. In this embodiment, the metallic magnetic powder is a metallic magnetic powder composed of Fe-based alloys or amorphous alloys. More specifically, the metallic magnetic powder is FeSiCr-based metallic powder containing iron. Furthermore, the metallic magnetic powder is not limited to FeSiCr-based magnetic powder, but can also be FeCo-based, FeSiAr-based, iron oxide-based, and combinations thereof. Additionally, the organic resin can also be epoxy-based, imide-based, liquid crystal polymer-based, acrylic-based, phenol-based, and combinations thereof. Furthermore, in addition to the above-mentioned materials, inorganic fillers can also be mixed into the organic resin.
[0038] like Figure 2 As shown, the inductor wiring 50 is located inside the blank 11. Figure 4 As shown, the inductor wiring 50 is located at the same position as the second magnetic layer 23 in a direction orthogonal to the first main surface 11A. The inductor wiring 50 is made of a conductive material. In this embodiment, the composition of the inductor wiring 50 is, for example, a copper content of 99 wt% or more and a sulfur content of 0.1 wt% or more and 1.0 wt% or less. Furthermore, the inductor wiring 50 is not limited to a conductor with copper as the main component; it can also be a conductor with Ag, Al, or Au as the main components.
[0039] like Figure 3As shown, the inductor wiring 50 is parallel to the first main surface 11A and extends in a spiral shape. That is, the inductor wiring 50 is linear. Figure 4 As shown, the inductor wiring 50 includes a seed layer 51A. The seed layer 51A forms part of the surface on the first negative direction X2 side of the inductor wiring 50. The seed layer 51A is made of copper. As described later, copper is grown on the seed layer 51A by electrolytic copper plating, thereby forming the entire inductor wiring 50. Furthermore, during the process of promoting copper plating growth, the surface on the first positive direction X1 side of the inductor wiring 50 sometimes becomes a curved surface convex toward the first positive direction X1 side.
[0040] like Figure 3 As shown, the inductor wiring 50 has a pair of pad portions 51P and a wiring body 51L. The pair of pad portions 51P are located at both ends of the inductor wiring 50. One of the pair of pad portions 51P is designated as the inner pad portion 51PA. The remaining one of the pair of pad portions 51P is designated as the outer pad portion 51PB. When viewed in the first negative direction X2, the inner pad portion 51PA is located on the side of the second positive direction Y1 relative to the geometric center of the blank 11. When viewed in the first negative direction X2, the inner pad portion 51PA is approximately circular. When viewed in the first negative direction X2, the outer pad portion 51PB is located on the side of the second negative direction Y2 relative to the geometric center of the blank 11. When viewed in the first negative direction X2, the outer pad portion 51PB is approximately quadrilateral.
[0041] The wiring body 51L connects a pair of pad portions 51P. Specifically, when viewing the blank 11 in the first negative direction X2, the wiring body 51L extends counterclockwise from the inner pad portion 51PA to the outer pad portion 51PB, such that the larger the number of turns, the larger the diameter. The inductor wiring 50 has 2.5 turns.
[0042] Furthermore, the number of turns in the inductor wiring 50 is determined based on an imaginary vector. The starting point of the imaginary vector is positioned on the center line of the inductor wiring 50. Moreover, when viewed in the first negative direction X2, if the starting point of the imaginary vector is moved from the first end of the center line to the second end of the center line, and the direction of the imaginary vector is rotated by an angle of 360 degrees, the number of turns is determined to be 1.0 turns. However, in the case of multiple windings, if the direction of the imaginary vector is continuously in the same direction, the number of turns increases.
[0043] Furthermore, the center line of the inductor wiring 50 is determined as follows. When viewed in the first negative direction X2, the shortest line segment drawn from any point on the edge of the inductor wiring 50 to its opposite edge is determined. The line connecting the points passing through the center of this particular line segment is set as the center line of the inductor wiring 50 when viewed in the first negative direction X2.
[0044] like Figure 4 As shown, the inductor component 10 includes a first interlayer insulation layer 31, a wiring interlayer insulation layer 32, and a second interlayer insulation layer 33 as an insulation layer 30.
[0045] The first interlayer insulating layer 31 is flat. The first interlayer insulating layer 31 extends parallel to the first main surface 11A within the blank 11. The first interlayer insulating layer 31 contacts the surface of the first magnetic layer 21 on the first positive direction X1 side. Additionally, the first interlayer insulating layer 31 contacts the surface of the inductor wiring 50 on the first negative direction X2 side. In other words, the inductor wiring 50 extends relative to the first interlayer insulating layer 31 on the first positive direction X1 side. Therefore, the first interlayer insulating layer 31 is located at the same position as the first interlayer magnetic layer 22 in a direction orthogonal to the first main surface 11A.
[0046] The second interlayer insulating layer 33 is flat. It extends parallel to the first main surface 11A within the blank 11. Furthermore, the second interlayer insulating layer 33 contacts the surface of the inductor wiring 50 in the first positive direction X1. That is, the inductor wiring 50 contacts the surface of the second interlayer insulating layer 33 parallel to the first main surface 11A. Additionally, a gap may sometimes be partially formed between the inductor wiring 50 and the second interlayer insulating layer 33. The first positive direction X1 is a direction orthogonal to the first main surface 11A, extending from the inductor wiring 50 towards the second interlayer insulating layer 33. Furthermore, the second interlayer insulating layer 33 contacts the surface of the third magnetic layer 25 in the first negative direction X2. Therefore, the second interlayer insulating layer 33 is located at the same position as the second interlayer magnetic layer 24 in the direction orthogonal to the first main surface 11A.
[0047] When the surface of the inductor wiring 50 facing the direction parallel to the first main surface 11A is designated as a side surface, the inter-wiring insulation layer 32 covers the side surface of the inductor wiring 50. Therefore, the inter-wiring insulation layer 32 has a portion adjacent to the inductor wiring 50 in the direction parallel to the first main surface 11A. In this embodiment, the entire inter-wiring insulation layer 32 is adjacent to the inductor wiring 50 in the direction parallel to the first main surface 11A. The inter-wiring insulation layer 32 extends from the second inter-layer insulation layer 33 in a direction orthogonal to the first main surface 11A, i.e., the first negative direction X2. In other words, the inter-wiring insulation layer 32 extends from the first inter-layer insulation layer 31 in the first positive direction X1. Furthermore, in a specific cross-section orthogonal to the centerline of the inductor wiring 50, the inter-wiring insulation layer 32 has multiple discontinuous portions in the direction along the first main surface 11A. For example, in… Figure 4 In the specific cross-section shown, the inter-wiring insulation layer 32 has seven discontinuous portions along the direction of the first main surface 11A. Furthermore, Figure 4The specific cross-section shown is a plane that passes through the geometric center of the blank 11 and is orthogonal to the second axis Y.
[0048] Here, in a specific cross-section, the portion of each part of the wiring inter-insulation layer 32 that contacts the blank 11 along the direction parallel to the first main surface 11A is designated as the outer insulation layer 32A. Conversely, the portion of each part of the wiring inter-insulation layer 32 in the specific cross-section whose surface along the direction parallel to the first main surface 11A does not contact the blank 11 is designated as the inner insulation layer 32B. For example, in... Figure 4 The specific cross-section shown contains four outer insulating layers 32A. Additionally, three inner insulating layers 32B are present in the same cross-section. Specifically, in this cross-section, two outer insulating layers 32A are located relative to the geometric center of the blank 11 in the third positive direction Z1, and two inner insulating layers 32B are located between these outer insulating layers 32A. Furthermore, the inductor wiring 50 is located between these inter-wiring insulating layers 32. Conversely, two outer insulating layers 32A are located relative to the geometric center of the blank 11 in the third negative direction Z2, and one inner insulating layer 32B is located between these outer insulating layers 32A. Also, the inductor wiring 50 is located between these inter-wiring insulating layers 32. That is, the inductor wiring 50 is located within the area defined by the inter-wiring insulating layers 32.
[0049] like Figure 2 As shown, the inductor component 10 includes two cylindrical wirings 40 and two external electrodes 60. Each cylindrical wiring 40 extends in a direction intersecting the first main surface 11A. In this embodiment, each cylindrical wiring 40 extends in a direction orthogonal to the first main surface 11A. Each cylindrical wiring 40 is located on the first positive direction X1 side relative to the inductor wiring 50. Each cylindrical wiring 40 is electrically connected to the inductor wiring 50.
[0050] Specifically, one of the two columnar wirings 40, namely the first columnar wiring 41, is composed of a first through-hole 41A and a first lead-out wiring 41B. The material of the first columnar wiring 41 is the same as that of the inductor wiring 50. The first through-hole 41A is approximately cylindrical. The first through-hole 41A penetrates the second interlayer insulating layer 33. That is, the first columnar wiring 41 penetrates the second interlayer insulating layer 33. As a result, the first through-hole 41A is located at the same position as the second interlayer insulating layer 33 and the second interlayer magnetic layer 24 in a direction orthogonal to the first main surface 11A. The surface of the first through-hole 41A facing the first negative direction X2 is connected to the inner pad portion 51PA of the inductor wiring 50.
[0051] like Figure 3 As shown, the first lead-out wiring 41B is approximately cylindrical. Figure 2As shown, the diameter of the first lead-out wiring 41B is slightly larger than the diameter of the first through-hole 41A. The surface of the first lead-out wiring 41B facing the first negative direction X2 is connected to the first through-hole 41A. Therefore, the first lead-out wiring 41B is located at the same position as the third magnetic layer 25 in a direction orthogonal to the first main surface 11A. The surface of the first lead-out wiring 41B facing the first positive direction X1 is exposed from the first main surface 11A.
[0052] like Figure 2 As shown, the other of the two columnar wirings 40, namely the second columnar wiring 42, is composed of a second through-hole 42A and a second lead-out wiring 42B. The material of the second columnar wiring 42 is the same as that of the inductor wiring 50. The second columnar wiring 42 is located on the second negative direction Y2 side relative to the first columnar wiring 41. The second through-hole 42A is approximately quadrangular prism-shaped. The second through-hole 42A penetrates the second interlayer insulating layer 33. That is, the second columnar wiring 42 penetrates the second interlayer insulating layer 33. As a result, the second through-hole 42A is located at the same position as the second interlayer insulating layer 33 and the second interlayer magnetic layer 24 in a direction orthogonal to the first main surface 11A. The surface of the second through-hole 42A facing the first negative direction X2 side is connected to the outer pad portion 51PB of the inductor wiring 50.
[0053] like Figure 3 As shown, the second lead-out wiring 42B is approximately square prism-shaped. (See diagram) Figure 2 As shown, the dimensions of each side of the second lead-out wiring 42B are slightly larger than the dimensions of each side of the second through-hole 42A. The surface of the second lead-out wiring 42B facing the first negative direction X2 is connected to the second through-hole 42A. Therefore, the second lead-out wiring 42B is located at the same position as the third magnetic layer 25 in a direction orthogonal to the first main surface 11A. The surface of the second lead-out wiring 42B facing the first positive direction X1 is exposed from the first main surface 11A.
[0054] like Figure 1 As shown, each external electrode 60 is exposed from the blank 11. Specifically, each external electrode 60 is located on the first main surface 11A of the blank 11. That is, each external electrode 60 covers a portion of the outer surface of the blank 11.
[0055] like Figure 2 As shown, one of the two external electrodes 60, namely the first external electrode 61, is located on the first main surface 11A, relative to the geometric center of the first main surface 11A, on the side of the second positive direction Y1. The first external electrode 61 is in contact with the surface of the first lead-out wiring 41B facing the first positive direction X1. The other of the two external electrodes 60, namely the second external electrode 62, is located on the first main surface 11A, relative to the geometric center of the first main surface 11A, on the side of the second negative direction Y2. The second external electrode 62 is in contact with the surface of the second lead-out wiring 42B facing the first positive direction X1.
[0056] The inductor component 10 includes a solder resist 70. The solder resist 70 covers the portion of the blank 11 facing the first positive direction X1, excluding the two external electrodes 60. That is, the first main surface 11A of the blank 11 is covered and not exposed by the external electrodes 60 and the solder resist 70. The solder resist 70 has higher insulation properties than the blank 11.
[0057] <Material of the Insulation Layer>
[0058] The materials of the first interlayer insulation layer 31 and the wiring interlayer insulation layer 32 will be described below. Furthermore, the material of the second interlayer insulation layer 33 is the same as that of the first interlayer insulation layer 31. Therefore, only the material of the first interlayer insulation layer 31 will be described.
[0059] like Figure 6 As shown, the first interlayer insulation layer 31 comprises a photocurable synthetic resin SR and a plurality of fillers FL dispersed within the synthetic resin SR. Here, dispersion means that each filler FL is randomly located within the synthetic resin SR. Therefore, even if a portion of the filler FL agglomerates, as long as the overall arrangement of the filler FLs is random, the filler FLs are said to be dispersed. Furthermore, in Figure 6 In the diagram, only a portion of the filler material FL is labeled with the attached diagram.
[0060] In this embodiment, the synthetic resin SR is an insulating resin. Specifically, the synthetic resin SR is a polyimide-based resin. This synthetic resin SR is a photocurable resin that is cured by ultraviolet light. The volume percentage of the synthetic resin SR in the first interlayer insulating layer 31 is 40 vol% or more and 70 vol% or less. The volume percentage of the synthetic resin SR in the first interlayer insulating layer 31 is calculated, for example, as follows: First, a cross-section of the first interlayer insulating layer 31 with a side length of 500 nm is observed using a scanning electron microscope (SEM). Within this range, the area without filler FL, i.e., the total area of the synthetic resin SR, is calculated by image processing. Furthermore, the area ratio is calculated based on the ratio of the total area of the synthetic resin SR to the area of the observed range. This process is repeated three or more times in different cross-sections of the first interlayer insulating layer 31 to calculate the area ratio of each range. Furthermore, the average value of the calculated area ratio is calculated, and this calculation result is set as the volume percentage.
[0061] The filler FL is a non-magnetic inorganic insulating compound. In this embodiment, the filler FL is silicon dioxide. That is, in this embodiment, multiple fillers FL are non-magnetic inorganic oxides.
[0062] Furthermore, the wiring interlayer insulation layer 32 contains an insulating synthetic resin SR but does not contain the aforementioned filler FL. In this embodiment, the synthetic resin SR of the wiring interlayer insulation layer 32 is made of the same material as the synthetic resin SR of the first interlayer insulation layer 31. That is, the synthetic resin SR of the wiring interlayer insulation layer 32 is made of a polyimide resin.
[0063] <Shape of the second interlayer insulation>
[0064] like Figure 5 As shown, the surface on the outer surface of the second interlayer insulating layer 33 that faces the direction parallel to the first main surface 11A is designated as end face ED. In this embodiment, the end face ED is planar in shape. Figure 4 As shown, in a specific cross-section, for a given location, the second interlayer insulation layer 33 has two end faces ED. For example... Figure 5 As shown, in a specific cross-section, the end face ED as a whole becomes an inclined surface oriented in a direction parallel to the first main face 11A and in the first negative direction X2. Figure 5 In the example shown, the end face ED faces the third positive direction Z1 and the first negative direction X2. Thus, the end face ED of the second interlayer insulating layer 33 is a surface inclined relative to an imaginary axis orthogonal to the first main surface 11A. Figure 5 In this case, the imaginary axis coincides with the boundary BD. Furthermore, if the end face ED is an inclined surface facing the direction described above in a specific cross-section orthogonal to the center line of the inductor wiring 50, then in different cross-sections, the end face ED may not be an inclined surface facing the direction described above.
[0065] Here, in a specific cross-section, the outermost edge of the end face ED of the second interlayer insulating layer 33 is designated as the outermost edge EO. In this embodiment, the outermost edge EO is the outer edge of the surface of the second interlayer insulating layer 33 facing the first positive direction X1. In other words, the outermost edge EO is the edge on the side of the end face ED facing the first positive direction X1. Moreover, the outer edge of the surface of the second interlayer insulating layer 33 facing the first negative direction X2 is located inside the outermost edge EO. In other words, the entire end face ED of the second interlayer insulating layer 33 has a shape that is concave relative to the outermost edge EO.
[0066] In addition, such as Figure 3 As shown, when viewing the inductor component 10 in a direction orthogonal to the first main surface 11A, the outermost edge EO of the end face ED is located on the boundary BD between the blank 11 and the outer insulating layer 32A. That is, as Figure 5As shown, in a specific cross-section, the outermost edge EO of the end face ED of the second interlayer insulating layer 33 lies on an imaginary line VL extending the boundary BD between the blank 11 and the outer insulating layer 32A along a direction orthogonal to the first main surface 11A. Furthermore, in this embodiment, the end of the end face ED of the second interlayer insulating layer 33 on the first negative direction X2 side lies on the surface of the outer insulating layer 32A on the first positive direction X1 side.
[0067] <Manufacturing Method>
[0068] Next, the manufacturing method of the inductor component 10 will be described.
[0069] like Figure 7 As shown, firstly, a base preparation process is performed. Specifically, a plate-shaped base component 101 is prepared. The base component 101 is made of ceramic. When viewed towards the first negative direction X2, the base component 101 has a quadrilateral shape. The dimensions of each side of the base component 101 are the dimensions for accommodating multiple inductor components 10. Next, a dummy insulating layer 102 is applied to the entire upper surface of the base component 101 on the first positive direction X1 side. Furthermore, in Figure 7 In the diagram, a fictitious insulating layer 102 is shown using thick lines.
[0070] Next, as Figure 8 As shown, a first insulating layer processing step is performed to form a first interlayer insulating layer 31. The first interlayer insulating layer 31 is formed on the surface of the base member 101 in the first positive direction X1. Specifically, the first interlayer insulating layer 31 is patterned. The pattern is formed over an area slightly larger than the area where the inductor wiring 50 is disposed. Specifically, the first interlayer insulating layer 31, comprising filler FL and photocurable synthetic resin SR, is formed by photolithography. That is, the synthetic resin SR contained in the first interlayer insulating layer 31 is cured by ultraviolet light.
[0071] Next, as Figure 9 As shown, a seed formation process is performed to form a seed layer 51A. Specifically, a copper seed portion 103 is formed on the surface of the first interlayer insulating layer 31 and the dummy insulating layer 102 in the first positive direction X1 by sputtering.
[0072] Next, as Figure 10 As shown, a photocurable photoresist 104 is laminated onto the upper surface of the seed portion 103. Furthermore, exposure is performed only on the area of the seed layer 51A forming the inductor wiring 50 on the upper surface of the seed portion 103. The exposed portion of the photoresist 104 is cured. This cured portion is formed as a coating portion 105. Then, the uncured portion of the photoresist 104, i.e., the portion other than the coating portion 105, is removed.
[0073] Next, as Figure 11As shown, the seed portion 103 is etched. This removes the seed portion 103 that is exposed from the covering portion 105.
[0074] Then, as Figure 12 As shown, the coating portion 105 is wet-etched using a chemical agent. This causes the coating portion 105 to peel off. As a result, a seed layer 51A is formed.
[0075] Then, as Figure 13 As shown, a second insulating layer processing step is performed to form the inter-wiring insulating layer 32. Specifically, firstly, a photopolymerizable permanent resist 106 is applied to the surface of the dummy insulating layer 102, the seed layer 51A, and the first inter-layer insulating layer 31 on the first positive direction X1 side. Next, the area where the inter-wiring insulating layer 32 is formed, i.e., the portion located on both sides of the seed layer 51A, is exposed.
[0076] Next, as Figure 14 As shown, the uncured portion of the permanent resist 106 is removed by peeling with a chemical solution. This forms an inter-wiring insulation layer 32. Furthermore, the permanent resist 106 is composed solely of synthetic resin SR.
[0077] Next, as Figure 15 As shown, a first wiring formation step for forming inductor wiring 50 is performed. Specifically, electrolytic copper plating is performed, and copper grows on the surface of the first interlayer insulating layer 31 on the first positive direction X1 side, at the portion exposed from the seed layer 51A. This forms the entire inductor wiring 50. Furthermore, during the process of promoting copper plating growth, the surface of the inductor wiring 50 on the first positive direction X1 side sometimes becomes a curved surface convex towards the first positive direction X1 side.
[0078] Next, as Figure 16As shown, a third insulating layer processing step is performed to form the second interlayer insulating layer 33. The area where the second interlayer insulating layer 33 is formed is the area on the surface of the inductor wiring 50 and the inter-wiring insulating layer 32 in the first positive direction X1, excluding the areas where the first through-hole 41A and the second through-hole 42A are formed. Within this area, the second interlayer insulating layer 33 is formed by photolithography using the same method as for forming the first interlayer insulating layer 31. Furthermore, when forming the second interlayer insulating layer 33 by photolithography, the exposure is adjusted so that the first positive direction X1 side of the formed second interlayer insulating layer 33 receives more exposure than the first negative direction X2 side. For example, ultraviolet light is irradiated onto the uncured second interlayer insulating layer 33 from the first positive direction X1 side. At this time, the ultraviolet light is gradually attenuated as it travels through the second interlayer insulating layer 33 and is blocked or scattered by the filler FL. Therefore, at the end of the second interlayer insulating layer 33 in the first negative direction X2 side, ultraviolet light is irradiated with an intensity that allows only a very small amount of light to reach, thereby enabling the aforementioned adjustment of the exposure amount. Furthermore, the aforementioned exposure adjustment can also be achieved, for example, by adjusting the angle of ultraviolet radiation. By adjusting the exposure in this way, curing is promoted on the first positive direction X1 side compared to the first negative direction X2 side, and the end face ED of the second interlayer insulating layer 33 is formed to be inclined towards the first negative direction X2 side. Additionally, when viewed towards the first negative direction X2, the outermost edge EO of the end face ED of the second interlayer insulating layer 33 coincides with the outermost edge of the wiring interlayer insulating layer 32. Furthermore, in Figure 16 The diagram only includes the outermost edge (EO) of a portion of the figure.
[0079] Next, as Figure 17 As shown, a second wiring formation process is performed to form columnar wiring 40. The area where columnar wiring 40 is formed includes the portion where inductor wiring 50 is exposed from the second interlayer insulating layer 33. First, similar to the seed formation process described above, a columnar seed layer 107 is formed in the aforementioned area. Furthermore, in Figure 2 , Figure 3 The illustration of the columnar seed layer 107 is omitted. Furthermore, photolithography, using the same method as the first insulating layer processing step, exposes the resist in the areas outside the aforementioned range. Then, a process identical to the first wiring formation step is performed, forming the columnar wiring 40 by copper plating. The resist is then removed. As a result, the first columnar wiring 41 and the second columnar wiring 42 are formed.
[0080] Next, as Figure 18As shown, a first magnetic body forming process is performed to form a magnetic layer 20 other than the first magnetic layer 21. First, a resin containing the material of the magnetic layer 20, namely magnetic powder, is coated onto the dummy insulating layer 102 on the first positive direction X1 side. At this time, the resin containing magnetic powder is coated so that it also covers the surface of each columnar wiring 40 on the first positive direction X1 side. Next, by performing a stamping process and curing the resin containing magnetic powder, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, and a third magnetic layer 25 are formed on the surface of the dummy insulating layer 102 on the first positive direction X1 side.
[0081] Furthermore, the portion of the third magnetic layer 25 on the first positive direction X1 side is cut until the surface of each columnar wiring 40 on the first positive direction X1 side is exposed. Additionally, in Figure 18 In the diagram, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are indistinguishably represented as magnetic layer 20.
[0082] Next, as Figure 19 As shown, a base component cutting process is performed. Specifically, the base component 101 and the dummy insulating layer 102 are completely removed by cutting. Furthermore, the result of completely cutting the base component 101 and the dummy insulating layer 102 is that sometimes a portion of the first negative direction X2 side of the first interlayer insulating layer 31 is removed, but the inductor wiring 50 is not removed.
[0083] Next, as Figure 20 As shown, a second magnetic body forming process for forming the first magnetic layer 21 is performed. Specifically, firstly, a resin containing the material of the first magnetic layer 21, namely magnetic powder, is coated on the surface of the first interlayer insulating layer 31 and the first interlayer magnetic layer 22 on the first negative direction X2 side. Then, the resin containing magnetic powder is cured by stamping. Next, a portion of the resin on the first negative direction X2 side is cut. For example, the portion of the resin on the first negative direction X2 side is cut so that the dimension of the inductor component 10 along the first axis X becomes a desired value. Thus, the first magnetic layer 21 is formed on the surface of the first interlayer insulating layer 31 and the first interlayer magnetic layer 22 on the first negative direction X2 side. Furthermore, in Figure 20 In the diagram, the first magnetic layer 21, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are indistinguishably represented as magnetic layer 20.
[0084] Next, as Figure 21As shown, a main surface processing step for forming solder resist 70 is performed. Specifically, the insulator is patterned by photolithography on the surface of the third magnetic layer 25 in the first positive direction X1 and on the surface of each columnar wiring 40 in the first positive direction X1, where the external electrodes 60 are not formed. Solder resist 70 is thus formed.
[0085] Next, as Figure 22 As shown, an electrode processing step is performed to form an external electrode 60. The area where the external electrode 60 is formed is the area not covered by solder resist 70 on the surface of the third magnetic layer 25 in the first positive direction X1 and the surface of each columnar wiring 40 in the first positive direction X1. Copper, nickel, and gold are electroless plated in this area, respectively. As a result, a first external electrode 61 and a second external electrode 62 are formed. Furthermore, in Figure 22 In the diagram, the layers of copper, nickel, and gold are not distinguished. Alternatively, it can be shown as follows: Figure 22 As shown, a portion of the external electrode 60 covers a portion of the surface of the solder resist 70 on the first positive direction X1 side. Next, as... Figure 23 As shown, a single-piece processing step is performed. Specifically, the piece is cut at the break line DL to obtain a single piece. This yields the inductor component 10.
[0086] <Effects of this implementation method>
[0087] (1) In the above embodiment, the end face ED is an inclined surface oriented in a direction parallel to the first main surface 11A and in the first negative direction X2. That is, the end face ED of the second interlayer insulating layer 33 is recessed relative to the outermost edge EO of the surface of the second interlayer insulating layer 33 facing the first positive direction X1. Since the blank 11 can be present in the recessed part of the end face ED, the volume of the blank 11 can be increased accordingly. That is, according to the above configuration, when the inductor component 10 is viewed in a direction orthogonal to the first main surface 11A, the volume of the magnetic material can be increased compared to the case where the end face ED of the second interlayer insulating layer 33 is located on the boundary BD. As a result, an increase in the inductance value of the inductor component 10 can be expected.
[0088] (2) In the above embodiment, the columnar wiring 40 penetrates the second interlayer insulation layer 33 in the direction intersecting with the first main surface 11A and is connected to the inductor wiring 50. In other words, the distance between the second interlayer insulation layer 33, which has an inclined end face ED, and the columnar wiring 40 becomes closer. Near the columnar wiring 40 connected to the inductor wiring 50 in the blank 11, magnetic flux may concentrate when current flows. In such a location where magnetic flux is easily concentrated, the shape of the end face ED ensures the volume of the magnetic material, thus preventing magnetic flux saturation from easily occurring in the inductor component 10.
[0089] (3) In the above embodiment, in a specific cross-section, the outermost edge EO of the end face ED of the second interlayer insulating layer 33 is located on an imaginary line VL extending the boundary BD between the blank 11 and the outer insulating layer 32A in a direction orthogonal to the first main surface 11A. That is, when the inductor component 10 is viewed in a direction orthogonal to the first main surface 11A, the size of the second interlayer insulating layer 33 is such that it can cover the wiring interlayer insulating layer 32 and the first interlayer insulating layer 31 to a minimum. Since the volume of the blank 11 can be further increased by the above-described configuration of the end face ED, the proportion of the blank 11 relative to the minimum size of the second interlayer insulating layer 33 can be increased.
[0090] (4) In the above embodiment, the second interlayer insulating layer 33 comprises a photocurable synthetic resin SR and a plurality of fillers FL dispersed within the synthetic resin SR. In this configuration, when the second interlayer insulating layer 33 is formed, light is blocked or scattered by the fillers FL, so it is not easy to promote the curing of the synthetic resin SR on the side opposite to the side that is irradiated. Therefore, the dimension in the surface direction tends to be larger on the side that promotes curing compared to the side that does not promote curing. Therefore, according to this configuration, it is preferable to make the end face ED an inclined surface.
[0091] <Example of Change>
[0092] The above-described embodiments and the following modifications can be implemented in combination with each other within the scope of technical inconsistency.
[0093] In the above embodiment, the inductor component 10 may also not have an external electrode 60. In this case, the portion of the columnar wiring 40 exposed from the first main surface 11A can be used as an electrode.
[0094] In the above embodiment, each columnar wiring 40 is not limited to the direction orthogonal to the first main surface 11A, but can extend in the direction intersecting the first main surface 11A.
[0095] In the above embodiment, the columnar wiring 40 may also be located on the first negative direction X2 side relative to the inductor wiring 50. Similarly, the external electrode 60 may also be exposed from the second main surface 11B. In other words, the mounting surface of the inductor component 10 may also be the second main surface 11B.
[0096] In the above embodiments, the shape of each columnar wire 40 when viewed in a direction orthogonal to the first main surface 11A is not limited to the examples of the above embodiments. For example, the shape of each columnar wire 40 when viewed in a direction orthogonal to the first main surface 11A may all be the same.
[0097] In the above embodiments, the number of turns and shape of the inductor wiring 50 are not limited to the examples described above. For example, the inductor wiring 50 may also be a straight line with zero turns.
[0098] In the above embodiment, a portion of the inductor wiring 50 may not be covered by the insulating layer 30 and may be in contact with the magnetic layer 20.
[0099] In the above embodiments, the inductor component 10 may also include multiple inductor wirings 50. For example, the inductor wirings 50 in the above embodiments may be designated as the first inductor wirings 50, the wiring inter-insulation layer 32 may be designated as the first wiring inter-insulation layer 32, and the outer insulation layer 32A may be designated as the first outer insulation layer 32A. Figure 24 In the example shown, the inductor component 10 also includes a second inductor wiring 52, a second wiring inter-insulation layer 34, and a third inter-layer insulation layer 35. Figure 24 In the example shown, the second inter-wiring insulation layer 34 extends from the second inter-layer insulation layer 33 in the first positive direction X1. The second inductor wiring 52 extends relative to the second inter-layer insulation layer 33 in the first positive direction X1 side within the area defined by the second inter-wiring insulation layer 34. The third inter-layer insulation layer 35 extends on the surface of both the second inductor wiring 52 and the second inter-wiring insulation layer 34 on the surface in the first positive direction X1 side. That is, the second inductor wiring 52 contacts the surface of the third inter-layer insulation layer 35 that is parallel to the first main surface 11A. Furthermore, the third inter-layer insulation layer 35 is flat. The third inter-layer insulation layer 35 extends parallel to the first main surface 11A. In this example, the first positive direction X1 is the direction from the second inductor wiring 52 side toward the third inter-layer insulation layer 35. Additionally, in Figure 24 In the example shown, the columnar wiring 40 is connected to the second inductor wiring 52.
[0100] exist Figure 24 In the example shown, similar to the first inter-wiring insulation layer 32, in a specific cross-section, the second inter-wiring insulation layer 34 has seven discontinuous portions along the direction of the first main surface 11A. Furthermore, in Figure 24 The diagram shows the second wiring interlayer insulation layer 34 at four of the seven locations. Similarly, the first wiring interlayer insulation layer 32 is also shown. The portion of each location of the second wiring interlayer insulation layer 34 in a specific cross-section where the surface facing the direction parallel to the first main surface 11A contacts the blank 11 is designated as the second outer insulation layer 34A. In this example, the boundary BD of the second outer insulation layer 34 of the second wiring interlayer insulation layer 34 with the blank 11 and the boundary BD of the first outer insulation layer 32 of the first wiring interlayer insulation layer 32 with the blank 11 are aligned.
[0101] Here, the surface on the outer surface of the third interlayer insulation layer 35 that faces the direction parallel to the first main surface 11A is designated as end face ED. In a specific cross-section, there are two end faces ED in one location of the third interlayer insulation layer 35. In each end face ED, the entire end face ED is an inclined surface facing the direction parallel to the first main surface 11A and in the first negative direction X2. In this example, the inclined surface is planar.
[0102] In addition, Figure 24 As shown in the example, in a specific cross-section, the outermost edge EO of the end face ED of the third interlayer insulation layer 35 is located on an imaginary line VL extending along a direction orthogonal to the first main face 11A, which connects the blank 11 and the second wiring interlayer insulation layer 34 to the boundary BD of the second outer insulation layer 34A.
[0103] In addition, Figure 24 In the example shown, further, the entire surface of the second interlayer insulating layer 33 facing the direction parallel to the first main surface 11A, i.e., the end face ED, can be an inclined surface facing the direction parallel to the first main surface 11A and in the first negative direction X2. The same applies to the surface of the first interlayer insulating layer 31 facing the direction parallel to the first main surface 11A, i.e., the end face ED. Furthermore, in Figure 24 In the figure, only one end face ED, the outermost edge EO, and the boundary BD are labeled.
[0104] In the above embodiments, the end face ED is not limited to an inclined surface facing a direction parallel to the first main face 11A and in the first negative direction X2. For example, the entire end face ED can be an inclined surface facing a direction parallel to the first main face 11A and in the first positive direction X1.
[0105] In the above embodiments, the end face ED is not limited to a planar shape. For example, the end face ED can be a curved surface convex in the first negative direction X2 or in the first positive direction X1. Furthermore, as long as the end face ED is oriented in a direction parallel to the first main surface 11A and in the first negative direction X2, its curvature can be changed midway. For example, the end face ED can be planar, or it can be a curved surface with a chamfered radius (R) in the first positive direction X1.
[0106] In the above embodiment, as long as at least one of the multiple end faces ED in a specific cross section is an inclined surface facing the direction parallel to the first main surface 11A and the first negative direction X2.
[0107] In the above embodiment, the entire end face of the outer surface of the first interlayer insulating layer 31 facing the direction parallel to the first main surface 11A can be an inclined surface. In this case, it is sufficient to define the direction orthogonal to the first main surface 11A from the inductor wiring 50 side toward the first interlayer insulating layer 31 side as the first positive direction X1, and the direction opposite to the first positive direction X1 as the first negative direction X2. In this definition, the entire end face of the first interlayer insulating layer 31 can also be an inclined surface facing the direction parallel to the first main surface 11A and the first negative direction X2, or it can be an inclined surface facing the direction parallel to the first main surface 11A and the first positive direction X1. Furthermore, in the configuration where the entire end face of the first interlayer insulating layer 31 is an inclined surface facing either of the above directions, the entire end face ED of the second interlayer insulating layer 33 can also be an inclined surface facing either of the above directions.
[0108] In the above embodiments, the position of the outermost edge EO of the end face ED is not limited to the examples of the above embodiments. For example, in a specific cross-section, the outermost edge EO of the end face ED of the second interlayer insulating layer 33 may be located on the side of the outer insulating layer 32A relative to the imaginary line VL that connects the blank 11 and the outer insulating layer 32A along a direction orthogonal to the first main surface 11A. Additionally, for example in... Figure 25 In the example shown, in a specific cross-section, the outermost edge EO of the end face ED of the second interlayer insulating layer 33 is located on the side of the blank 11 relative to the imaginary line VL extending along the boundary BD between the blank 11 and the outer insulating layer 32A in a direction orthogonal to the first main surface 11A. That is, when viewed in a direction orthogonal to the first main surface 11A, the outermost edge EO of the end face ED of the second interlayer insulating layer 33 is located outside the area surrounded by the boundary BD between the blank 11 and the outer insulating layer 32A. Based on this configuration, the volume of the magnetic layer 20 is enlarged, and the connection between the second interlayer insulating layer 33 and the wiring interlayer insulating layer 32 is ensured. Furthermore, in Figure 25 In the example shown, the end of the end face ED on the first negative direction X2 side is also located closer to the outside than the imaginary line VL, but the end face ED can also be located on the imaginary line VL or closer to the inside than the imaginary line VL.
[0109] In the above embodiment, when viewed from a direction orthogonal to the first main surface 11A, the outermost edge EO of the end face ED of the second interlayer insulating layer 33 may not be located entirely within the area enclosed by the boundary BD between the blank 11 and the outer insulating layer 32A. That is, it is sufficient that the outermost edge EO of the end face ED of the second interlayer insulating layer 33 is located on an imaginary line VL extending the boundary BD between the blank 11 and the outer insulating layer 32A in a direction orthogonal to the first main surface 11A, or on a specific cross-section located on the side of the outer insulating layer 32A relative to the imaginary line VL.
[0110] In the above embodiments, the dimension of the second interlayer insulating layer 33 along the first axis X may not be constant. For example, in Figure 25 In the example shown, the second interlayer insulating layer 33 has a recess 80 in its surface facing the first positive direction X1, recessed towards the first negative direction X2. In this example, the recess 80 is as described in the above embodiment. Figure 16 In the state shown, the recess 80 is formed by irradiating the surface of the second interlayer insulating layer 33 facing the first positive direction X1 with a laser or the like. The outer surface of the recess 80 in this example is curved. According to this configuration, compared to the case where a second interlayer insulating layer 33 with approximately constant thickness and no recess 80 is used, the volume of the magnetic material can be further increased. Furthermore, the recess 80 can also be applied to the first interlayer insulating layer 31.
[0111] In the above embodiments, the synthetic resin SR is not limited to the material of the above embodiments as long as it has insulating properties. Furthermore, as long as the synthetic resin SR is a photosensitive synthetic resin, it can be manufactured by the manufacturing method of the above embodiments. Similarly, the material of the filler FL is not limited to the examples of the above embodiments. For example, the material of the filler FL can also be alumina or carbon black.
[0112] In the above embodiments, the first interlayer insulation layer 31 and the second interlayer insulation layer 33 may not contain filler FL. That is, the first interlayer insulation layer 31 and the second interlayer insulation layer 33 may be composed solely of synthetic resin SR. Additionally, the wiring interlayer insulation layer 32 may also contain filler FL.
[0113] In the above embodiments, the material of the base component 101 is not limited to the examples of the above embodiments. For example, the material of the base component 101 may also be glass epoxy resin, glass, etc.
[0114] In the wiring formation process of the above embodiment, sometimes a dummy wiring connected to the inductor wiring 50 is formed. For example, the dummy wiring can be used as a power supply wiring during the formation of copper plating.
[0115] <Postscript>
[0116] The following describes the technical concepts derived from the above-described implementation methods and their variations.
[0117] [1] An inductor component comprising: a blank having a main surface and containing a magnetic material; a flat interlayer insulating layer extending parallel to the main surface within the blank; and an inductor wiring contacting a surface of the interlayer insulating layer parallel to the main surface, wherein, when a direction orthogonal to the main surface is defined as a positive direction from the inductor wiring side toward the interlayer insulating layer side, and a direction opposite to the positive direction is defined as a negative direction, and a surface of the outer surface of the interlayer insulating layer facing the direction parallel to the main surface is defined as an end face, in a specific cross-section orthogonal to the centerline of the inductor wiring, the end face is either an inclined surface facing the direction parallel to the main surface and in the negative direction, or an inclined surface facing the direction parallel to the main surface and in the positive direction.
[0118] [2] According to the inductor component described in [1], it further includes columnar wiring that penetrates the interlayer insulation layer in a direction intersecting the main surface and is connected to the inductor wiring.
[0119] [3] According to the inductor component described in [1] or [2], the interlayer insulating layer has a recessed portion in the face facing the positive direction.
[0120] [4] According to any one of [1] to [3], the inductor component further includes a wiring insulation layer that extends from the interlayer insulation layer in a direction orthogonal to the main surface and has a portion adjacent to the inductor wiring in a direction parallel to the main surface. In the specific cross-section, the wiring insulation layer has multiple discontinuous portions in the direction along the main surface. When the portion of the wiring insulation layer that contacts the blank in the direction parallel to the main surface is designated as the outer insulation layer, in the specific cross-section, the outermost edge of the end face of the interlayer insulation layer is located on an imaginary line extending the boundary between the blank and the outer insulation layer in a direction orthogonal to the main surface, or is located on the outer insulation layer side relative to the imaginary line.
[0121] [5] According to any one of [1] to [4], the interlayer insulating layer comprises a photocurable synthetic resin and a plurality of fillers dispersed in the synthetic resin.
[0122] Explanation of reference numerals in the attached figures
[0123] BD…boundary; ED…end face; EO…outermost edge; FL…filler; X1…first positive direction; X2…first negative direction; 10…inductor component; 11…bulk; 11A…first main surface; 20…magnetic layer; 31…first interlayer insulation layer; 32…inter-wiring insulation layer; 32A…outer insulation layer; 33…second interlayer insulation layer; 40…columnar wiring; 50…inductor wiring; 80…recess.
Claims
1. An inductor component, wherein, have: The blank has a main surface and contains magnetic material; A flat interlayer insulating layer extends parallel to the main surface within the aforementioned blank; and The inductor wiring contacts the surface of the interlayer insulation layer that is parallel to the main surface. When the direction orthogonal to the main surface, from the inductor wiring side towards the interlayer insulation layer side, is defined as the positive direction, and the direction opposite to the positive direction is defined as the negative direction, and the surface on the outer surface of the interlayer insulation layer facing the direction parallel to the main surface is defined as the end face, In a specific cross-section orthogonal to the centerline of the inductor wiring, the entire end face is an inclined surface oriented in the negative direction parallel to the main surface, or the entire end face is an inclined surface oriented in the positive direction parallel to the main surface.
2. The inductor component according to claim 1, wherein, It also has columnar wiring that penetrates the interlayer insulation layer in a direction intersecting with the main surface and is connected to the inductor wiring.
3. The inductor component according to claim 1 or 2, wherein, The interlayer insulation layer has a recessed portion on the side facing the positive direction that is recessed in the negative direction.
4. The inductor component according to any one of claims 1 to 3, wherein, It also includes a wiring insulation layer that extends from the interlayer insulation layer in a direction orthogonal to the main surface, and has a portion adjacent to the inductor wiring in a direction parallel to the main surface. In the aforementioned specific cross-section, the insulation layer between the wiring terminals exists in multiple discontinuous locations along the direction of the main surface. When the portion of the above-mentioned wiring inter-insulation layer that contacts the blank body in a direction parallel to the main surface is designated as the outer insulation layer, In the aforementioned specific cross-section, the outermost edge of the aforementioned end face of the aforementioned interlayer insulation layer is located on an imaginary line or on the side of the outer insulation layer relative to the imaginary line, wherein the imaginary line is an imaginary line extending the boundary between the aforementioned blank and the aforementioned outer insulation layer in a direction orthogonal to the aforementioned main surface.
5. The inductor component according to any one of claims 1 to 4, wherein, The aforementioned interlayer insulation layer comprises a photocurable synthetic resin and a plurality of fillers dispersed within the synthetic resin.