A nickel plating solution for circuit boards and a method for preparing the same

By employing a specific method for preparing nickel plating solutions, the problems of decreased deposition rate and uneven thickness during the chemical nickel plating process on circuit boards were solved, achieving stability and uniformity of the plating layer and improving the production efficiency and reliability of circuit boards.

CN122128696APending Publication Date: 2026-06-02SHENZHEN DAZHENG RUIDI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN DAZHENG RUIDI TECH CO LTD
Filing Date
2026-03-30
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

In the process of electroless nickel plating of circuit boards, there are problems such as the deposition rate decreasing over time and uneven plating thickness.

Method used

A method for preparing a nickel plating solution includes mixing a boron source, a nickel source, and a complexing agent, controlling the pH to acidic, adding a chloride medium and a copper source for pre-complexation, adding a reducing agent and a deposition control component in batches, and performing filtration and aging treatment to form a stable nickel plating solution.

Benefits of technology

This achieves stable reactivity and ion distribution of the nickel plating solution during the deposition process, improves the uniformity of deposition rate and coating thickness, and ensures efficient production and reliability of circuit boards.

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Abstract

The application provides a nickel plating solution for a circuit board and a preparation method thereof, and steps of the preparation method include the following: mixing a boron source, a nickel source and a complexing agent to obtain a primary mixture, adjusting the pH of the primary mixture to be acidic; adding a chloride medium to the primary mixture, and then adding a copper source to the primary mixture after pre-complexing treatment, and controlling the molar ratio of copper ions to nickel ions to be within a preset range to obtain an intermediate mixture; adding a reducing agent and a deposition regulation component to the intermediate mixture in batches, uniformly mixing under stirring, and then performing filtration and aging treatment to obtain the nickel plating solution for the circuit board. Through the above steps, the nickel plating solution can maintain stable reaction activity and ion distribution during the deposition process, so that the deposition rate and the uniformity of the plating layer thickness are improved.
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