A combination valve for use in the semiconductor field
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 先微精艺(苏州)科技有限公司
- Filing Date
- 2026-03-09
- Publication Date
- 2026-06-02
Smart Images
Figure CN122129568A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of valve technology, and in particular to a combination valve for use in the semiconductor field. Background Technology
[0002] In semiconductor manufacturing equipment, the pipelines used to supply liquids such as reagents to semiconductor wafers are equipped with on / off valves. In addition, to prevent residual liquid from dripping from the end of the pipeline after the liquid supply is stopped, a backflow valve is often required to draw back the liquid in the pipeline. As a backflow valve, it generally has a reciprocating device similar to a piston and a sealed space to house the piston. The reciprocating device moves by the supply and discharge of external power. Through the elastic deformation of the diaphragm connected to the piston, the volume of the backflow chamber connected to the pipeline increases or decreases, thereby drawing back the liquid in the pipeline.
[0003] Currently, ordinary back suction valves can only be used in conjunction with on / off valves and need to be installed downstream of the on / off valve. Back suction occurs only after the flow channel is closed. Flow channel closure and back suction of the liquid cannot occur simultaneously; the back suction process has a certain lag compared to flow channel closure, resulting in imprecise control of the liquid back suction process. Furthermore, the back suction valve needs to be installed separately from the on / off valve, which is not conducive to saving installation space.
[0004] Therefore, there is an urgent need to design a technical solution that can more precisely control the liquid reabsorption process while reducing the volume and saving installation space. Summary of the Invention
[0005] The purpose of this invention is to provide a combination valve for use in the semiconductor field to solve the problems existing in the prior art, enabling more precise control of the liquid backflow process, while reducing the size and saving installation space.
[0006] To achieve the above objectives, the present invention provides the following solution: This invention provides a combination valve for use in the semiconductor field, comprising: The main body of the mechanism has an inlet at one end and an outlet at the other end, and the inlet and outlet are connected by a flow channel; A fluid flow control mechanism is provided on the upper part of the main body of the mechanism and located at one end near the inlet; the fluid flow control mechanism can close or open the flow channel; A back suction mechanism is provided on the upper part of the main body of the mechanism and located at the end near the outlet. When the flow channel is closed, the back suction mechanism can synchronously expand the flow cross section of the flow channel near the outlet and maintain the expanded state. When the flow channel is open, it can synchronously reduce the flow cross section of the flow channel near the outlet and maintain the reduced state.
[0007] Preferably, the main body of the mechanism has two through holes at its top that communicate with the flow channel. The fluid on / off mechanism includes a pneumatic valve actuator body, which has a pneumatic valve cavity. The bottom of the pneumatic valve cavity is sealed and communicated with one of the through holes, and the communication position is separated by a thermo-pressure diaphragm. The back suction mechanism includes a back suction valve actuator body, which has a back suction valve cavity. The bottom of the back suction valve cavity is sealed and communicated with the other through hole, and the communication position is separated by a thermo-pressure diaphragm. The pneumatic valve actuator of the pneumatic valve actuator body can drive the corresponding thermo-pressure diaphragm to deform to close or open the flow channel. The back suction valve actuator of the back suction valve actuator body can drive the corresponding thermo-pressure diaphragm to deform to expand or reduce the flow cross-section of the flow channel.
[0008] Preferably, the upper inner wall of the through hole is provided with a first connecting rib, and the bottom of the inner wall of the pneumatic valve cavity and the bottom of the inner wall of the back suction valve cavity are both provided with a second connecting rib, and the outer edge of the hot-pressed diaphragm is fixedly pressed between the first connecting rib and the corresponding second connecting rib.
[0009] Preferably, a pneumatic valve actuator top cover is fixedly and sealed to the top of the pneumatic valve actuator body. A pneumatic valve actuator top cover cavity communicating with the inner cavity of the pneumatic valve is opened inside the pneumatic valve actuator top cover. The pneumatic valve actuator is movably disposed between the inner cavity of the pneumatic valve and the pneumatic valve actuator top cover cavity. A first air inlet is opened on one side of the pneumatic valve actuator body. A power source is connected to the first air inlet. The power source can drive the pneumatic actuator to move up and down through the first air inlet.
[0010] Preferably, a top cover for the back suction valve actuator is fixedly and sealed to the top of the actuator body. The top cover for the back suction valve actuator has a cavity that communicates with the inner cavity of the back suction valve. The back suction valve actuator is movably disposed between the inner cavity of the back suction valve and the cavity of the back suction valve top cover. A second air inlet is provided on one side of the top cover for the back suction valve actuator. The second air inlet is connected to a power source, and the power source can drive the back suction actuator to move up and down through the second air inlet.
[0011] Preferably, the pneumatic valve actuator body includes a pneumatic valve actuator shaft, the bottom of which is connected to a corresponding thermo-pressure diaphragm. A pneumatic piston is fixedly mounted on the side wall of the pneumatic valve actuator shaft, and the pneumatic piston can make sealing contact with the inner cavity of the pneumatic valve. A pneumatic valve spring is sleeved on the upper part of the pneumatic valve actuator shaft, the bottom of which abuts against the pneumatic piston, and the top of which abuts against the top of the pneumatic valve top cover cavity. The space between the pneumatic piston and the corresponding thermo-pressure diaphragm is connected to the first air inlet.
[0012] Preferably, the back suction valve actuator body includes a back suction valve actuator shaft, the bottom of which is connected to a corresponding thermo-pressurized diaphragm. A back suction piston is fixedly provided on the side wall of the back suction valve actuator shaft, and the back suction piston can make sealing contact with the inner cavity of the back suction valve. A back suction valve spring is sleeved on the lower part of the back suction valve actuator shaft, the bottom of which abuts against the bottom of the back suction valve actuator body, and the top of which abuts against the bottom of the back suction piston. The sealed space between the upper part of the back suction piston and the cavity of the back suction valve top cover is connected to the second air inlet.
[0013] Preferably, it further includes a limiting device, the limiting device including an upper actuator shaft, a connecting hole is provided on the top of the back suction valve cover, the upper actuator shaft passes through the connecting hole, and the side wall of the upper actuator shaft is in sealing contact with the inner side wall of the connecting hole, the bottom of the upper actuator shaft can abut against the top of the back suction valve actuator shaft, and the axial position of the upper actuator shaft can be adjusted.
[0014] Preferably, the limiting device further includes a limiter located on the top of the back suction valve cover, the limiter having a movably mounted knob, the upper side wall of the upper actuator shaft having an external thread, and the upper part of the upper actuator shaft passing through the limiter and threadedly connected to the knob.
[0015] Preferably, it also includes a valve base plate, which is fixedly connected to the bottom of the main body of the mechanism.
[0016] The present invention achieves the following technical effects compared to the prior art: This invention integrates the fluid on / off mechanism and the back-suction mechanism, reducing the size of the combined valve used in the semiconductor field and saving installation space. Furthermore, the on / off control of the flow channel by the fluid on / off mechanism and the control of the cross-sectional area of the flow channel near the outlet by the back-suction mechanism are performed synchronously. When the flow channel is open, the cross-sectional area near the outlet shrinks synchronously, allowing the liquid to flow out smoothly. When the flow channel is closed, the cross-sectional area near the outlet expands synchronously. The negative pressure generated during this process achieves the back-suction of the liquid at the outlet while closing the flow channel, enabling more precise control of the back-suction process. This invention enables the simultaneous back-suction of liquid at the outlet after the liquid flow is stopped when supplying liquid to semiconductor wafers in semiconductor manufacturing equipment, preventing liquid from dripping from the end of the pipeline. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of a combination valve used in the semiconductor field in one or more embodiments of the present invention; Figure 2 This is a schematic diagram of the main body of the mechanism in one or more embodiments of the present invention; Figure 3 This is a comparison diagram before and after the flow channel is cut off in one or more embodiments of the present invention; Figure 4 This is a partial cross-sectional schematic diagram in one or more embodiments of the present invention; Figure 5 This is a schematic diagram of bolt installation in one or more embodiments of the present invention; Figure 6 This is an exploded view of a combination valve assembly used in the semiconductor field in one or more embodiments of the present invention.
[0019] In the diagram: 1-Main body of the mechanism, 2-Top cover of the pneumatic valve actuator, 3-Top cover of the back suction valve actuator, 4-Pneumatic valve actuator body, 5-Back suction valve actuator body, 6-Valve base plate, 7-Hot-pressed diaphragm, 8-Pneumatic valve actuator shaft, 9-Back suction valve actuator shaft, 10-Upper actuator shaft, 11-Knob, 12-Limiter, 13-Pneumatic valve spring, 14-Back suction valve spring, 15-First bolt, 16-Flat washer, 17-Spring washer, 18-Nut, 19-First O-ring seal, 20-Third O-ring seal, 21-Second O-ring seal, 22-Rubber cap, 23-Second bolt, 24-Cylindrical platform hole, 25-Inlet, 26-Outlet, 27-Flow channel, 28-First air inlet, 29-Second air inlet, 30-First return air port, 31-Second return air port. Detailed Implementation
[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0021] The purpose of this invention is to provide a combination valve for use in the semiconductor field to solve the problems existing in the prior art, enabling more precise control of the liquid backflow process, while reducing the size and saving installation space.
[0022] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0023] Currently, ordinary backflow valves can only be used in conjunction with on / off valves and need to be installed downstream of the on / off valve. Backflow occurs only after the flow channel is closed. Flow channel closure and backflow of the liquid cannot occur simultaneously; the backflow process has a certain lag compared to flow channel closure, resulting in imprecise control of the liquid backflow process. Furthermore, the backflow valve needs to be installed separately from the on / off valve, which is not conducive to saving installation space. To solve this problem, this invention provides a combined valve for the semiconductor field, see reference [reference]. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the device includes a main body 1, with an inlet 25 at one end and an outlet 26 at the other end, connected by a flow channel 27. A fluid switching mechanism is located on the upper part of the main body 1, near the inlet 25. The fluid switching mechanism can close or open the flow channel 27. A back suction mechanism is located on the upper part of the main body 1, near the outlet 26. When the flow channel 27 is closed, the back suction mechanism can simultaneously expand the flow cross-section of the flow channel 27 near the outlet 26 and maintain the expanded state. When the flow channel 27 is open, the back suction mechanism can simultaneously reduce the flow cross-section of the flow channel 27 near the outlet 26 and maintain the reduced state. This invention reduces the size of the combined valve used in the semiconductor field by integrating the fluid on / off mechanism and the back suction mechanism, thus saving installation space. Furthermore, the on / off control of the flow channel 27 by the fluid on / off mechanism and the control of the cross-sectional area of the flow channel 27 near the outlet 26 by the back suction mechanism are performed synchronously. When the flow channel 27 is open, the cross-sectional area of the flow channel 27 near the outlet 26 decreases synchronously, allowing the liquid to flow out smoothly. When the flow channel 27 is closed, the cross-sectional area of the flow channel 27 near the outlet 26 increases synchronously. Under the negative pressure generated during the process of the cross-sectional area of the flow channel 27 increasing, the back suction process of the liquid at the outlet 26 is achieved simultaneously with the closure of the flow channel 27, allowing for more precise control of the liquid back suction process.
[0024] In one embodiment, both the fluid switching mechanism and the back suction mechanism are controlled by pneumatic structures. Specifically, in this embodiment, the top of the mechanism body 1 has two through holes communicating with the flow channel 27. The fluid switching mechanism includes a pneumatic valve actuator body 4, which has a pneumatic valve cavity. The bottom of the pneumatic valve cavity is sealed and connected to one of the through holes, and the connection position is separated by a thermo-pressure diaphragm 7. The thermo-pressure diaphragm 7 is elastic and can deform up and down under the action of elastic force. The back suction mechanism includes a back suction valve actuator body 5, which has a back suction valve cavity. The bottom of the back suction valve cavity is sealed and connected to the other through hole. The flow path is open, and a thermostatic diaphragm 7 separates the flow path 27 at the connection point. When gas is introduced into different positions within the pneumatic valve actuator body 4, it moves downward or upward, thereby driving the corresponding thermostatic diaphragm 7 to deform downward or upward, either closing the flow path 27 or opening it. The back suction valve actuator body 5 can drive the corresponding thermostatic diaphragm 7 to deform, with the deformation principle being the same as the pneumatic valve actuator described above. However, the thermostatic diaphragm 7 at the back suction valve will not completely close the flow path 27 regardless of whether it deforms upward or downward; it can only deform to the extent that the flow cross-section of the flow path 27 expands or decreases. When fluid flows, the thermostatic diaphragm 7 corresponding to the fluid on / off mechanism moves upward, opening the flow path 27, while the thermostatic diaphragm 7 corresponding to the back suction mechanism moves downward. The thermostatic diaphragms 7 of the fluid on / off mechanism and the back suction mechanism move simultaneously, but the thermostatic diaphragm 7 of the back suction mechanism does not cut off the flow path 27. At this time, the flow path 27 is unobstructed, and the fluid flows out. When the flow channel 27 is closed, the thermo-pressure diaphragm 7 of the fluid switching mechanism moves downward and presses against the cut surface of the flow channel 27, thus closing the flow channel 27. At the same time, the thermo-pressure diaphragm 7 of the back suction mechanism moves upward. At this time, when the flow channel 27 is flowing and being cut off, after the flow channel 27 is cut off, the volume of the flow channel 27 at the position of the thermo-pressure diaphragm 7 of the back suction mechanism is greater than the volume of the flow channel 27 when the fluid is flowing. At this time, the volume of the flow channel 27 increases, generating negative pressure, thereby realizing the back suction of the liquid medicine.
[0025] In one embodiment, the flow channel 27 adopts a V-shaped flow channel, which is used to connect the inner cavity of the pneumatic valve and the inner cavity of the suction valve in the middle of the main body 1. The upper inner wall of the through hole is provided with a first connecting rib, and the bottom of the inner wall of the pneumatic valve and the bottom of the inner wall of the suction valve are both provided with a second connecting rib. The outer edge of the hot-pressed diaphragm 7 is fixedly pressed between the first connecting rib and the corresponding second connecting rib. Due to the presence of the first connecting rib and the second connecting rib, the edge of the hot-pressed diaphragm 7 is elastically deformed. That is, the first connecting rib and the second connecting rib squeeze the corresponding edge of the hot-pressed diaphragm 7 to deform, thereby realizing the connection of the hot-pressed diaphragm 7, and the connection position is sealed.
[0026] To achieve precise control over the deformation of the hot-pressed diaphragm 7, in one embodiment, a pneumatic valve actuator top cover 2 is fixedly and sealed to the top of the pneumatic valve actuator body 4. A first O-ring 19 is provided at the connection position to achieve a seal at the connection position. A pneumatic valve actuator top cover cavity communicating with the inner cavity of the pneumatic valve is opened inside the pneumatic valve actuator top cover 2. The pneumatic valve actuator is movably disposed between the inner cavity of the pneumatic valve and the pneumatic valve actuator top cover cavity. A first air inlet 28 is opened on one side of the pneumatic valve actuator body 4. The first air inlet 28 is connected to an external power source, which can be an air pump or a hydraulic pump, etc. In this embodiment, the pneumatic valve actuator body 4 includes a pneumatic valve actuator shaft 8. The bottom of the pneumatic valve actuator shaft 8 is connected to the corresponding thermo-pressure diaphragm 7. A pneumatic piston is fixedly mounted on the side wall of the pneumatic valve actuator shaft 8. A second O-ring 21 is provided on the outer ring of the pneumatic piston, so that it can make sealing contact with the side wall of the pneumatic valve cavity. A pneumatic valve spring 13 is sleeved on the upper part of the pneumatic valve actuator shaft 8. The bottom of the pneumatic valve spring 13 abuts against the pneumatic piston, and the top of the pneumatic valve spring 13 abuts against the top of the pneumatic valve top cover cavity. The space between the pneumatic piston and the corresponding thermo-pressure diaphragm 7 is connected to the first air inlet 28. Because of the elasticity of the pneumatic valve spring 13, the pneumatic valve actuator shaft 8 moves downward, and drives the corresponding thermo-pressure diaphragm 7 to deform downward, sealing the flow channel 27. During flow, gas at a certain pressure is introduced through the first air inlet 28 on the pneumatic valve actuator body 4. When the gas pressure in the space connected to the first air inlet 28 is greater than the elastic force of the pneumatic valve spring 13, the pneumatic piston is driven by the gas pressure to move the pneumatic valve actuator shaft 8 upward and squeeze the pneumatic valve spring 13. At the same time, the upward movement of the pneumatic valve actuator shaft 8 drives the thermostatic diaphragm 7 to move upward, opening the flow channel 27, and the fluid flows. When the power source draws the gas back, the pressure in the space connected to the first air inlet 28 decreases, and under the elastic force of the pneumatic valve spring 13, the pneumatic valve actuator shaft 8 moves downward and re-closes the flow channel 27.
[0027] In a preferred embodiment, a circular hole is formed at the top of the pneumatic valve top cover cavity. A coaxial cylindrical truncated hole 24 is sealed at the bottom of the circular hole. The main purpose of the circular hole is to allow the pneumatic valve actuator shaft 8 to move up and down. At the same time, in order to ensure the sealing performance of the cavity, a third O-ring 20 is provided between the inner wall of the cylindrical truncated hole 24 and the pneumatic valve actuator shaft 8. This allows the top of the pneumatic valve actuator shaft 8 to pass through the cylindrical truncated hole 24 and the circular hole in sequence, and to maintain a movable seal with the cylindrical truncated hole 24. Meanwhile, the upper part of the pneumatic valve spring 13 is sleeved on the outer wall of the cylindrical truncated hole 24, which can play a certain limiting role for the pneumatic valve spring 13 and prevent the pneumatic valve spring 13 from deflecting. In the initial state, due to the elasticity of the pneumatic valve spring 13, the pneumatic valve actuator shaft 8 moves downward, and the actuator shaft drives the heat-pressed diaphragm 7 to close the flow channel 27. To prevent the gas from directly affecting the thermo-pressure diaphragm 7, in this embodiment, a circular hole is also opened at the bottom of the pneumatic valve actuator body 4. A coaxial cylindrical truncated hole 24 is fixedly and sealed inside the circular hole. The bottom of the pneumatic valve actuator shaft 8 passes through the cylindrical truncated hole 24 and the circular hole on the pneumatic valve actuator body 4 in sequence and connects with the corresponding thermo-pressure diaphragm 7. The lower side wall of the pneumatic valve actuator shaft 8 is sealed with the inner wall of the corresponding cylindrical truncated hole 24 by a third O-ring seal 20, so that the gas introduced into the pneumatic valve cavity will not come into contact with the corresponding thermo-pressure diaphragm 7. The pneumatic valve actuator shaft 8 can move up and down in the corresponding cylindrical truncated hole 24, but always remains sealed, similar to a piston structure.
[0028] Similarly, the top of the back suction valve actuator body 5 is fixedly and sealed with a back suction valve actuator top cover 3. The back suction valve actuator top cover 3 has a back suction valve top cover cavity that communicates with the inner cavity of the back suction valve. The back suction valve actuator is movably located between the inner cavity of the back suction valve and the back suction valve top cover cavity. A second air inlet 29 is provided on one side of the back suction valve actuator top cover 3. The second air inlet 29 is connected to a power source such as an air pump or a hydraulic pump. The back suction valve actuator body 5 includes a back suction valve actuator shaft 9. The bottom of the back suction valve actuator shaft 9 is connected to the corresponding hot-pressed diaphragm 7. A back suction piston is fixedly provided on the side wall of the back suction valve actuator shaft 9. The back suction piston can make sealing contact with the inner cavity of the back suction valve. A back suction valve spring 14 is sleeved on the lower part of the back suction valve actuator shaft 9. The bottom of the back suction valve spring 14 abuts against the bottom of the back suction valve actuator body 5, and the top of the back suction valve spring 14 abuts against the bottom of the back suction piston. The sealed space between the upper part of the back suction piston and the back suction valve top cover cavity is connected to the second air inlet 29.
[0029] In this embodiment, the power source for the first air inlet 28 and the second air inlet 29 is a well-known and mature air compressor. The high-pressure gas is generated by the air compressor. The high-pressure air compressed by the air compressor is connected to the first air inlet 28 and the second air inlet respectively through a pipeline system. The pipeline system includes a well-known and mature PLC controller, a solenoid valve and a combination valve used in the semiconductor field. The solenoid valve is controlled by an existing preset PLC program to ensure the synchronization of air intake between the first air inlet 28 and the second air inlet 29.
[0030] In a preferred embodiment, a circular hole is formed at the top of the cavity of the back suction valve top cover. A coaxial cylindrical truncated hole 24 is sealed to the bottom of this circular hole. To ensure sealing performance within the cavity, a third O-ring 20 is provided between the inner wall of the cylindrical truncated hole 24 and the shaft 9 of the back suction valve actuator. This allows the top of the shaft 9 of the back suction valve actuator to pass sequentially through the cylindrical truncated hole 24 and the circular hole, maintaining a movable seal with the cylindrical truncated hole 24. In this embodiment, a circular hole is also formed at the bottom of the body 5 of the back suction valve actuator. A coaxial cylindrical truncated hole 24 is fixedly sealed inside the circular hole. The shaft 9 of the back suction valve actuator... After passing through the cylindrical platform hole 24 and the round hole on the back suction valve actuator body 5, the bottom part of the shaft 9 is connected to the corresponding hot-pressed diaphragm 7. The lower side wall of the back suction valve actuator shaft 9 is sealed to the inner wall of the corresponding cylindrical platform hole 24 by a third O-ring seal 20. The back suction valve actuator shaft 9 can move up and down in the corresponding cylindrical platform hole 24, but always remains sealed, similar to a piston structure. In this embodiment, the lower part of the back suction valve spring 14 is sleeved on the cylindrical platform hole 24 of the back suction valve actuator body 5, which will give the back suction valve actuator shaft 9 an elastic force, causing the back suction valve actuator shaft 9 to move upward in the initial stage.
[0031] In a preferred embodiment, a second return air port 31 communicating with the lower space of the return air piston is provided on the body 5 of the back suction valve actuator, and a first return air port 30 communicating with the upper space of the pneumatic piston is provided on the top cover of the pneumatic valve. Thus, the first return air port 30 and the first air inlet 28 are respectively connected to an external air pump to achieve alternating or synchronous operation. When the first return air port 30 is inlet, the first air inlet 28 stops inlet or exhausts air, and when the first return air port 30 stops inlet or exhausts air, the first air inlet 28 is inlet, thereby achieving precise control of the up and down movement of the pneumatic piston. Similarly, the second air inlet 29 and the second return air port 31 can also operate alternately or synchronously, which will not be elaborated here.
[0032] In one embodiment, a limiting device is designed to adjust the back suction capacity. The limiting device includes an upper actuator shaft 10. A connecting hole is provided on the top of the back suction valve cover; this connecting hole is the circular hole and cylindrical platform hole 24 on the top of the back suction valve cover. The upper actuator shaft 10 passes through the connecting hole, and its sidewall is in sealed contact with the inner sidewall of the connecting hole. The bottom of the upper actuator shaft 10 can abut against the top of the back suction valve actuator shaft 9. The axial position of the upper actuator shaft 10 can be adjusted. In another embodiment, the limiting device further includes a limiter 12 located on the top outer surface of the back suction valve cover. A knob 11 is movably mounted on the limiter 12. The upper sidewall of the upper actuator shaft 10 has external threads, and the upper part of the upper actuator shaft 10 passes through the limiter 12 and is threadedly connected to the knob 11. The upper actuator shaft 10 is moved up and down by knob 11. Knob 11 and limiter 12 are connected to the upper actuator shaft 10 by second bolt 23, spring washer 17 and flat washer 16. Second bolt 23 is an M3-10 bolt. Knob 11 controls the position of the upper actuator shaft 10, thereby controlling the stroke of the back suction valve actuator shaft 9, and then controlling the size of the cross-section of the flow channel 27 near the outlet 26, thereby controlling the range of its volume change, realizing dynamic changes in negative pressure, and realizing back suction of different amounts of medicine.
[0033] To make the overall structure of the present invention more compact and the connection more robust, in one embodiment, a valve base plate 6 is designed. The valve base plate 6 is fixedly connected to the bottom of the main body 1. The valve base plate 6, the main body 1, the back suction valve actuator body 5, and the back suction valve actuator top cover 3 are fixedly assembled using a first bolt 15, a nut 18, a spring washer 17, and a flat washer 16. The first bolt 15 is an M3-50 bolt. After assembly, the bolt holes of the M3-50 bolt are sealed with a rubber cap 22. Similarly, the valve base plate 6, the main body 1, the pneumatic valve actuator body 4, and the pneumatic valve actuator top cover 2 are also fixedly assembled using M3-50 bolts, nuts 18, spring washers 17, and flat washers 16. After assembly, the bolt holes of the M3-50 bolts are sealed with a rubber cap 22.
[0034] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.
Claims
1. A combination valve for use in the semiconductor field, characterized in that: include: The main body of the mechanism has an inlet at one end and an outlet at the other end, and the inlet and outlet are connected by a flow channel; A fluid flow control mechanism is provided on the upper part of the main body of the mechanism and located at one end near the inlet; the fluid flow control mechanism can close or open the flow channel; A back suction mechanism is provided on the upper part of the main body of the mechanism and located at the end near the outlet. When the flow channel is closed, the back suction mechanism can synchronously expand the flow cross section of the flow channel near the outlet and maintain the expanded state. When the flow channel is open, it can synchronously reduce the flow cross section of the flow channel near the outlet and maintain the reduced state.
2. The combination valve for use in the semiconductor field according to claim 1, characterized in that: The main body of the mechanism has two through holes at its top that communicate with the flow channel. The fluid on / off mechanism includes a pneumatic valve actuator body, which has a pneumatic valve cavity. The bottom of the pneumatic valve cavity is sealed and communicated with one of the through holes, and the communication position is separated by a thermo-pressure diaphragm. The back suction mechanism includes a back suction valve actuator body, which has a back suction valve cavity. The bottom of the back suction valve cavity is sealed and communicated with the other through hole, and the communication position is separated by a thermo-pressure diaphragm. The pneumatic valve actuator of the pneumatic valve actuator body can drive the corresponding thermo-pressure diaphragm to deform to close or open the flow channel. The back suction valve actuator of the back suction valve actuator body can drive the corresponding thermo-pressure diaphragm to deform to expand or reduce the flow cross-section of the flow channel.
3. The combination valve for use in the semiconductor field according to claim 2, characterized in that: The upper inner wall of the through hole is provided with a first connecting rib, and the bottom of the inner wall of the pneumatic valve cavity and the bottom of the inner wall of the back suction valve cavity are both provided with a second connecting rib. The outer edge of the hot-pressed diaphragm is fixedly pressed between the first connecting rib and the corresponding second connecting rib.
4. The combination valve for use in the semiconductor field according to claim 2, characterized in that: The pneumatic valve actuator body is fixedly and sealed to the top of a pneumatic valve actuator top cover. The pneumatic valve actuator top cover has a cavity that communicates with the inner cavity of the pneumatic valve. The pneumatic valve actuator is movably disposed between the inner cavity of the pneumatic valve and the pneumatic valve actuator top cover cavity. A first air inlet is provided on one side of the pneumatic valve actuator body. The first air inlet is connected to a power source, and the power source can drive the pneumatic actuator to move up and down through the first air inlet.
5. The combination valve for use in the semiconductor field according to claim 2, characterized in that: The top of the back suction valve actuator body is fixedly and sealed with a back suction valve actuator top cover. The back suction valve actuator top cover has a back suction valve top cover cavity that communicates with the inner cavity of the back suction valve. The back suction valve actuator is movably disposed between the inner cavity of the back suction valve and the back suction valve top cover cavity. A second air inlet is provided on one side of the back suction valve actuator top cover. The second air inlet is connected to a power source. The power source can drive the back suction actuator to move up and down through the second air inlet.
6. The combination valve for use in the semiconductor field according to claim 4, characterized in that: The pneumatic valve actuator body includes a pneumatic valve actuator shaft. The bottom of the pneumatic valve actuator shaft is connected to a corresponding thermo-pressurized diaphragm. A pneumatic piston is fixedly installed on the side wall of the pneumatic valve actuator shaft, and the pneumatic piston can make sealing contact with the inner cavity of the pneumatic valve. A pneumatic valve spring is sleeved on the upper part of the pneumatic valve actuator shaft. The bottom of the pneumatic valve spring abuts against the pneumatic piston, and the top of the pneumatic valve spring abuts against the top of the pneumatic valve top cover cavity. The space between the pneumatic piston and the corresponding thermo-pressurized diaphragm is connected to the first air inlet.
7. The combination valve for use in the semiconductor field according to claim 5, characterized in that: The back suction valve actuator body includes a back suction valve actuator shaft. The bottom of the back suction valve actuator shaft is connected to a corresponding thermo-pressurized diaphragm. A back suction piston is fixedly provided on the side wall of the back suction valve actuator shaft. The back suction piston can be in sealing contact with the inner cavity of the back suction valve. A back suction valve spring is sleeved on the lower part of the back suction valve actuator shaft. The bottom of the back suction valve spring abuts against the bottom of the back suction valve actuator body, and the top of the back suction valve spring abuts against the bottom of the back suction piston. The sealed space between the upper part of the back suction piston and the back suction valve top cover cavity is connected to the second air inlet.
8. The combination valve for use in the semiconductor field according to claim 7, characterized in that: It also includes a limiting device, which includes an upper actuator shaft. A connecting hole is provided on the top of the back suction valve cover. The upper actuator shaft passes through the connecting hole, and the side wall of the upper actuator shaft is in sealed contact with the inner side wall of the connecting hole. The bottom of the upper actuator shaft can abut against the top of the back suction valve actuator shaft, and the axial position of the upper actuator shaft can be adjusted.
9. The combination valve for use in the semiconductor field according to claim 8, characterized in that: The limiting device also includes a limiter located on the top of the back suction valve cover. A knob is movably mounted on the limiter. An external thread is provided on the upper side wall of the upper actuator shaft. The upper part of the upper actuator shaft passes through the limiter and is threadedly connected to the knob.
10. The combination valve for use in the semiconductor field according to claim 1, characterized in that: It also includes a valve base plate, which is fixedly connected to the bottom of the main body of the mechanism.