Modular thermoelectric refrigeration system based on thermal management array and method thereof

Abstract

This invention relates to a modular thermoelectric refrigeration system and method based on a thermal control array. The system includes at least one thermoelectric refrigeration module and a control module. The thermoelectric refrigeration module includes n cold-end heat exchange channels stacked along the thickness direction, 2n thermal control array layers, and n+1 hot-end heat dissipation channels. Each thermal control array layer is composed of several independently controllable minimum control units arranged in a planar array. The control module is used to determine the target number of minimum control units to be activated in each thermal control array layer according to the heat load, and selects the corresponding target number of minimum control units from the thermal control array layers for activation according to a spatial uniform distribution strategy, while shutting down the remaining minimum control units; and controls all activated minimum control units to operate at their rated operating points. This system has high refrigeration efficiency and achieves fine-grained and linear adjustment of the refrigeration capacity with extremely high control precision.

Description

Technical Field

[0001] This invention relates to the field of thermoelectric refrigeration and temperature control technology, and in particular to a modular thermoelectric refrigeration system and method based on a thermal control array. Background Technology

[0002] Thermoelectric cooling technology, based on the Peltier effect, enables the direct transfer of electrical energy to heat energy. It is a solid-state heat pump technology with advantages such as no moving parts, no noise, fast response, and compact structure. However, existing thermoelectric cooling technologies suffer from three core problems: First, the "efficiency-load" contradiction exists. Under partial load conditions, adjusting the cooling capacity by regulating the current of all thermoelectric elements causes the thermoelectric elements to deviate from their most efficient design operating points, leading to a sharp drop in the overall system efficiency ratio. Second, there are issues with control precision and uniformity. Traditional group control methods have coarse control granularity, failing to achieve precise temperature regulation and easily resulting in uneven cooling surface temperatures. Finally, high-power thermoelectric systems suffer from insufficient "power density." If the simple array approach used in low-power systems is applied, laying out a large number of thermoelectric elements in a two-dimensional plane results in a bulky and loosely structured system, making it difficult to achieve compact, modular, high-power integration. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a modular thermoelectric refrigeration system and its control method based on a thermal control array with high efficiency, high precision and high power density, which is especially suitable for application scenarios with strict requirements for noise, vibration and temperature control accuracy.

[0004] In a first aspect, the technical solution adopted by the present invention is a modular thermoelectric refrigeration system based on a thermal control array, comprising: At least one thermoelectric cooling module; the thermoelectric cooling module includes n cold-end heat exchange channels, 2n thermal control array layers and n+1 hot-end heat dissipation channels, where n is an integer greater than or equal to 1; the n cold-end heat exchange channels, 2n thermal control array layers and n+1 hot-end heat dissipation channels are stacked along the thickness direction; The stack's starting and ending ends both utilize the hot-end heat dissipation channel, and each cold-end heat exchange channel is adjacent to a thermal control array layer on both sides. Each thermal control array layer has one side adjacent to a cold-end heat exchange channel or a hot-end heat dissipation channel, and the other side adjacent to a hot-end heat dissipation channel or a cold-end heat exchange channel. Each of the thermal control array layers is composed of several independently controllable minimum control units arranged in an array. And, a control module; the control module is used to determine the total number of minimum control units to be activated based on the thermal load, determine the target number of minimum control units to be activated for each thermal control array layer based on the target number of minimum control units to be activated and the number of thermal control array layers, and select the corresponding target number of minimum control units from each thermal control array layer to activate according to the spatial uniform distribution strategy, while shutting down the remaining minimum control units; and control all activated minimum control units to work at their rated operating points.

[0005] The beneficial effects of this invention are as follows: The modular thermoelectric refrigeration system based on a thermal control array, employing a "thermal control array" control strategy, ensures that all operating thermoelectric elements always run at their rated optimal performance point through on / off control rather than current simulation regulation. This fundamentally solves the problem of drastic energy efficiency decline in traditional thermoelectric air conditioners under varying operating conditions, resulting in a high overall system energy efficiency ratio (COP). The system achieves precise and linear adjustment of cooling capacity through independent control of numerous minimum control units, resulting in extremely high control accuracy. Simultaneously, the "spatial uniform distribution" strategy ensures a highly uniform temperature field on the cooling / heat dissipation surfaces, greatly improving heat exchange efficiency and user experience. The system's unique "n+(n+1)" modular stacking architecture achieves an extremely compact design through channel sharing, significantly improving the system's power density. This modular architecture allows for flexible and linear power expansion from kilowatts to hundreds of kilowatts through simple module combinations, making it highly feasible for engineering implementation. The system's control circuit consists only of on / off switches (enabling or disabling), making it simpler and more reliable than complex PWM voltage regulation circuits. The system has no moving parts such as compressors, which fundamentally eliminates the source of vibration and results in extremely low operating noise. It is particularly suitable for scenarios with stringent requirements for noise and vibration (such as underwater equipment and precision laboratories).

[0006] Preferably, the minimum control unit includes N thermoelectric cooling elements, where N ≥ 1; the N thermoelectric cooling elements are arranged in an array and connected in series; the control module includes an on / off control circuit connected to the N thermoelectric cooling elements, the on / off control circuit being used to control the current flowing to the N thermoelectric cooling elements.

[0007] This structure allows each minimum control unit to operate independently near its optimal efficiency point. By controlling the on / off state, the total cooling capacity can be further precisely adjusted, ensuring a uniform temperature field. At the same time, the circuit is simple and reliable, and the system is vibration-free and noise-free.

[0008] Preferably, the thermoelectric cooling chip includes a cold end face and a hot end face, wherein the cold end face is thermally coupled to the cold end heat exchange channel, and the hot end face is thermally coupled to the hot end heat dissipation channel.

[0009] This structure ensures efficient thermal coupling between the cold and hot ends of the thermoelectric element and the corresponding channels, improving the system's effective cooling capacity and overall energy efficiency. The structure is compact and reliable.

[0010] Preferably, the cold end heat exchange channel is a fluid channel with an integrated heat exchange structure, and the heat exchange structure is an air-cooled fin or a liquid-cooled plate flow channel.

[0011] This structure provides efficient heat exchange and a compact design. The air-cooled fins enhance air turbulence, while the liquid-cooled plate channels enable rapid and uniform cooling, improving the overall thermal management performance of the system.

[0012] Preferably, the hot end heat dissipation channel is a fluid channel with an integrated heat dissipation structure, and the heat dissipation structure is a liquid cooling plate channel.

[0013] This structure provides efficient heat dissipation and a compact design. The liquid cooling plate channel enables rapid and uniform cooling, improving the overall thermal management performance of the system.

[0014] Preferably, a thermally conductive interface material is provided between the cold end heat exchange channel and the thermal control array layer, and a thermally conductive interface material is provided between the hot end heat exchange channel and the thermal control array layer.

[0015] This structure reduces contact thermal resistance, improves heat transfer efficiency between the cold and hot ends, enhances the overall energy efficiency ratio and temperature control uniformity of the system, thereby improving the long-term reliability of the system.

[0016] Preferably, when there are multiple thermoelectric cooling modules, the cold end heat exchange channels of each thermoelectric cooling module are fluidly connected, and the hot end heat dissipation channels of each thermoelectric cooling module are fluidly connected.

[0017] This structure enables modular and flexible expansion of the system, allowing modules to be added or removed according to cooling needs. It facilitates installation, maintenance, and thermal management, while optimizing the overall energy efficiency and space utilization of the system through unified fluid connections.

[0018] Preferably, the control module is configured to linearly adjust the total cooling capacity of the system by adjusting the number of the minimum number of activated control units, and to always keep each activated thermoelectric cooler operating at its rated current or rated voltage.

[0019] By using this configuration, different numbers of minimum control units are switched on and off, ensuring that all working thermoelectric coolers always operate at their optimal efficiency point, thus solving the core problem of the sharp decline in energy efficiency of traditional thermoelectric systems under variable loads.

[0020] Preferably, the system is configured such that: the minimum power adjustment step size of the system is the rated cooling power of a single minimum control unit; the relative adjustment resolution of the system is the ratio of the minimum power adjustment step size to the total rated cooling power of the system. Since the cooling power is proportional to the number of activated thermoelectric coolers, the relative adjustment resolution is also equal to the ratio of the number of thermoelectric coolers in a single minimum control unit to the total number of all thermoelectric coolers in the system; different power adjustment steps are set by configuring the number of thermoelectric coolers in the minimum control unit.

[0021] This configuration allows for the reverse derivation of the minimum number of control units required to meet specific user temperature control accuracy needs, thereby determining the total number of thermoelectric elements and the array size. For extremely high precision requirements, finer control granularity can be achieved by using smaller, miniaturized thermoelectric elements.

[0022] Secondly, a modular thermoelectric refrigeration method based on a thermal control array, comprising the following steps: Acquire the temperature signal of the target space; Based on the deviation between the temperature signal and the set value, determine the target number of minimum control units that need to be activated for each thermal control array layer; Based on the spatial uniform distribution strategy, the specific locations of the minimum control units in the thermal control array layer are determined. The minimum control unit at the specific location is selected on the thermal control array layer and powered on, while other minimum control units are turned off. The thermoelectric coolers in all the smallest energized control units are controlled to operate at their rated operating points.

[0023] The modular thermoelectric refrigeration method based on thermal control array described above achieves precise and linear adjustment of refrigeration capacity with extremely high control accuracy.

[0024] Preferably, the method further includes: dynamically adjusting the number and distribution of the minimum control units activated in the thermal control array layer according to changes in thermal load.

[0025] This dynamic adjustment method achieves real-time and precise matching between cooling capacity and load, ensuring that the system always operates efficiently. At the same time, it maintains a highly uniform temperature field by optimizing the distribution of the minimum control unit and balances the workload of each unit, thereby improving the overall reliability of the system. Attached Figure Description

[0026] Figure 1 This is a side view of a thermoelectric refrigeration module in a modular thermoelectric refrigeration system based on a thermal control array according to the present invention. Figure 2 This is a schematic diagram of the structure of a thermal control array layer in a modular thermoelectric refrigeration system based on a thermal control array according to the present invention. Figure 3 This is a schematic diagram of the structure of the thermoelectric cooling cells arranged in a 2 × 2 configuration in the system of the present invention; Figure 4 This is a schematic diagram of a thermoelectric refrigeration system composed of multiple thermoelectric refrigeration modules in this invention; Figure 5 This is a schematic diagram of the application of the present invention to an underwater vertical conformal thermoelectric air conditioner; Figure 6 This is a schematic diagram of the electrothermal transport principle of a modular thermoelectric refrigeration system based on a thermal control array according to the present invention. Figure 7 This is a schematic diagram illustrating the high-efficiency operation principle of the thermal control array in this invention; Figure 8 This is a flowchart of a modular thermoelectric refrigeration method based on a thermal control array according to the present invention; As shown in the figure: 1. Minimum control unit; 2. Cold end heat exchange channel; 3. Thermal control array layer; 4. Hot end heat dissipation channel; 5. Thermoelectric cooling chip; 6. Structural frame; 7. Liquid cooling plate; 8. Liquid collection pipe; 9. Liquid supply pipe; 10. Thermoelectric cooling module. Detailed Implementation

[0027] The invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can implement it based on the description. The scope of protection of the invention is not limited to these specific embodiments.

[0028] Those skilled in the art should understand that, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting this invention.

[0029] Furthermore, the terms "first," "second," and "third" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0030] In the description of the embodiments of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] This invention relates to a modular thermoelectric refrigeration system based on a thermal control array, comprising: At least one thermoelectric cooling module 10; such as Figure 1 As shown, the thermoelectric cooling module 10 includes n cold-end heat exchange channels 2, 2n thermal control array layers 3, and n+1 hot-end heat dissipation channels 4, where n is an integer greater than or equal to 1; the n cold-end heat exchange channels 2, 2n thermal control array layers 3, and n+1 hot-end heat dissipation channels 4 form a stacked structure along the thickness direction. The stacked structure uses the hot end heat dissipation channel 4 at both the beginning and end. Each cold end heat exchange channel 2 is adjacent to a thermal control array layer 3 on both sides. Each thermal control array layer 3 is adjacent to a cold end heat exchange channel 2 or a hot end heat dissipation channel 4 on one side and to a hot end heat dissipation channel 4 or a cold end heat exchange channel 2 on the other side. Each of the thermal control array layers 3 is composed of several independently controllable minimum control units 1 arranged in an array. And, a control module; the control module is used to determine the total number of minimum control units 1 to be activated based on the thermal load, and to determine the target number of minimum control units 1 to be activated for each thermal control array layer based on the total number of minimum control units 1 to be activated and the number of thermal control array layers, that is: the target number of minimum control units 1 to be activated for each thermal control array layer = the total number of minimum control units 1 to be activated / the number of thermal control array layers; the value of the target number of minimum control units 1 to be activated for each thermal control array layer is rounded; and according to the spatial uniform distribution strategy, the corresponding target number of minimum control units 1 is selected from each of the thermal control array layers 3 for activation, while the remaining minimum control units 1 are turned off; and all activated minimum control units 1 are controlled to work at their rated operating points.

[0032] Figure 1 In the stacked structure, the first hot end heat dissipation channel 4 is the starting end, and the stacking unit is repeated n times periodically. The stacking unit includes a thermal control array layer 3, a cold end heat exchange channel 2, a thermal control array layer 3, and a hot end heat dissipation channel 4; and the last hot end heat dissipation channel 4 is the ending end.

[0033] This invention proposes an "n+(n+1)" modular stacking architecture. Through the alternating stacking of thermal control array layers 3 and fluid channels, a compact thermoelectric cooling module 10 is formed. Flexible expansion of system power is achieved through fluid interconnection of multiple modules, fundamentally improving system power density and scalability. The "n+(n+1)" structure is named according to the number of fluid channels; that is, 2n thermal control array layers 3 require "n+(n+1)" fluid channels to serve them.

[0034] This invention proposes a thermal control array control strategy, which divides each thermal control array layer 3 into multiple minimum control units 1, and makes them work at the rated operating point through on / off control. At the same time, the units in the array are started and stopped uniformly according to the changes in thermal load, thereby achieving both high-efficiency operation of the system and high-precision, high-uniformity temperature control.

[0035] Specifically, the minimum control unit includes N thermoelectric cooling elements 5, where N≥1; the N thermoelectric cooling elements 5 are arranged in a planar array and connected in series; the control module includes an on / off control circuit connected to the N thermoelectric cooling elements 5, the on / off control circuit being used to control the on / off of the current flowing to the N thermoelectric cooling elements 5.

[0036] like Figure 3 As shown, the thermoelectric cooling elements 5 are arranged in a 2 × 2 configuration. The thermoelectric cooling elements 5 include P-type and N-type semiconductor pairs, which generate a temperature difference between the hot and cold surfaces through the action of electric current.

[0037] The cold end heat exchange channel 2 is a finned air heat exchanger that is thermally coupled to the cold end face of the thermoelectric element and removes the cooling capacity through air convection; the hot end heat dissipation channel 4 is a microchannel liquid cooling plate 7 that is thermally coupled to the hot end face of the thermoelectric element and uses circulating fresh water as the cooling medium to remove heat.

[0038] The cold-end heat exchange channel 2 and the thermal control array layer 3 are provided with a thermally conductive interface material, and the hot-end heat exchange channel and the thermal control array layer 3 are also provided with a thermally conductive interface material. The thermally conductive interface material (TIM) is filled between the thermoelectric element and the heat exchanger / liquid cooling plate 7 to reduce contact thermal resistance.

[0039] The on / off control circuit includes a power MOSFET switch, a temperature sensing element, and a drive interface, which are used to realize independent on / off control of the unit.

[0040] When the on / off control circuit is closed, current flows through the thermoelectric cooling element 5 in a set direction, forming both hot and cold sides. The cold side absorbs heat and exchanges heat with the air through the cold-end fins to achieve cooling, while the hot side dissipates heat through the liquid cooling plate 7. The cooling power of a single element is approximately 10W (ΔT≈30K), with a response time of less than 1 second. Due to the use of an independent control circuit, this unit can be started, stopped, or reversed independently, enabling rapid adjustment of the micro-area temperature. Its modular interface design facilitates subsequent array assembly. The thermoelectric element operates at its rated operating point, achieving a high-efficiency heat pump function.

[0041] like Figure 2As shown, the thermal control array layer 3 is composed of multiple minimum control units 1 arranged in an a × b matrix. The electrical control interface of each minimum control unit 1 is connected to the control module. The control module is configured to: determine the target number of minimum control units 1 in each thermal control array layer based on the overall cooling demand, and set the number of minimum control units 1 in a single control array layer to N1. According to a preset spatial uniform distribution strategy, N1 minimum control units are selected from the array and energized, while the remaining minimum control units 1 are de-energized. During this process, the thermoelectric elements in all energized units operate at their rated current / voltage, thereby ensuring the system operates at high efficiency.

[0042] exist Figure 2 In the process, cooling water enters through the liquid supply pipe 9 and then enters the liquid cooling plate 7 (hot end heat dissipation channel 4) through various branch pipes. There are several pairs of branch pipes on the liquid cooling plate 7. Cooling water enters and exits the liquid cooling plate 7 through these branch pipes, carrying away the heat from the hot end of the thermoelectric cooling chip 5. Finally, all the cooling water flowing through the hot end of the cooling chip merges through the branch pipes and enters the liquid collection pipe 8, flowing out of the thermoelectric cooling system.

[0043] Among them, the spatial uniform distribution strategy can adopt a two-dimensional polling algorithm or a maximum dispersion algorithm.

[0044] The two-dimensional polling algorithm is a cyclic activation method based on a fixed order. In this invention, the two-dimensional polling algorithm is implemented as follows: the thermal control array layer 3 is abstracted as a two-dimensional coordinate grid. The control module selects the next minimum control unit 1 to be activated in sequence according to a preset path that traverses the entire grid (e.g., a serpentine order from left to right, from top to bottom, or a spiral order radiating outward from the center), so that all the selected minimum control units 1 are uniformly distributed in space.

[0045] The maximum dispersion algorithm is a real-time calculation strategy based on geometric distance optimization. In this invention, the maximum dispersion algorithm is implemented as follows: within each control cycle, a group of units whose spatial locations are as far apart as possible are dynamically selected from all inactive minimum control units 1, thereby maximizing the "dispersion" of all currently active units on the two-dimensional plane, ultimately ensuring that all selected minimum control units 1 are evenly distributed in space.

[0046] Specifically, the thermal control array layer 3 comprises 16×16 array units, totaling 256 minimum control units 1. Each minimum control unit 1 consists of 4 thermoelectric plates (arranged in a 2×2 pattern), with a unit spacing of 1mm~2mm, used for wiring and insulation. The total cooling power of the array plane is approximately 10kW, and the overall thickness is less than 40mm; the array surface temperature uniformity is better than ±1.5 K; the system control accuracy can reach one-thousandth (based on a single 10W plate).

[0047] This array plane can serve as the basic unit for module stacking, and its control logic can be extended to the module level to achieve multi-layer collaborative temperature control.

[0048] like Figure 1 As shown, the thermoelectric cooling module 10 adopts an n+(n+1) stacking method, consisting of alternating stacks of thermal control array layer 3 and cold / hot channel layers, including: n layers of cold-end heat exchange channels 2, 2n layers of thermal control array layer 3, and (n+1) layers of hot-end heat dissipation channels 4. The cold-end heat exchange channel 2 is a liquid-cooled plate 7 or an air-cooled fin, and the hot-end heat dissipation channel 4 is a liquid-cooled plate 7. The heat exchange / dissipation channels are sealed and fixed by a modular frame to form a compact whole. This architecture significantly improves the cooling power (power density) per unit volume.

[0049] exist Figure 1 In the middle, the leftmost and rightmost sides of the thermoelectric cooling module 10 are both equipped with hot end heat dissipation channels 4. Each cold end heat exchange channel 2 is adjacent to a thermal control array layer 3 on both sides. Each thermal control array layer 3 is adjacent to a cold end heat exchange channel 2 or a hot end heat dissipation channel 4 on one side and to a hot end heat dissipation channel 4 or a cold end heat exchange channel 2 on the other side.

[0050] exist Figure 1 In this system, each thermal control array layer 3 is independently connected to a control module to achieve on / off control and power regulation. Air flows in the cold-end channel layer, absorbing cold energy before entering the cabin space; fresh water flows in the hot-end channel layer, dissipating heat outside the submarine or to the heat dissipation system. Heat is transferred between the layers within the module to form a cascaded heat transfer network, thereby significantly improving the cooling capacity per unit volume.

[0051] Specifically, the fluid in the cold end channel is air, and the fluid in the hot end channel is fresh water. In this case, the module can be called a thermoelectric air conditioner.

[0052] Specifically, the thermoelectric cooling modules 10 are stacked in a “3+4” configuration, with a total cooling power of approximately 60kW.

[0053] This module serves as a basic component of the system and can operate independently or be further integrated into a higher-power modular thermoelectric refrigeration system.

[0054] like Figure 4As shown, the thermoelectric refrigeration system is composed of multiple thermoelectric refrigeration modules 10 connected by their fluid channels. Specifically, the cold-end heat exchange channels 2 of each thermoelectric refrigeration module 10 are fluidly connected, and the hot-end heat dissipation channels 4 of each thermoelectric refrigeration module 10 are fluidly connected. The cold-end channels of each module converge into a main cooling capacity pipe, and the hot-end channels converge into a main heat dissipation pipe. The control module manages all refrigeration modules collaboratively, achieving precise and linear adjustment of the total system cooling capacity by adjusting the total number of activated units within each module. This system can achieve cooling capacities ranging from tens of kilowatts to hundreds of kilowatts.

[0055] Thermoelectric cooling module array of 10: Each module has an independent cold-end fluid channel and a hot-end liquid-cooling channel. The modules are arranged in parallel along the spatial direction to form a modular array structure. The number of modules can be configured according to requirements; for example, 5 modules can form a system of approximately 300 kW.

[0056] Hot-end liquid cooling circuit: The hot-end liquid cooling channels of multiple modules are connected in parallel to the common heat exchange manifold. The liquid medium (fresh water, etc.) is driven by the circulation pump and the heat is discharged to the outside through the main cooling system.

[0057] Cold end fluid channel: Each module is equipped with a cooling channel at the cold end, such as a finned heat sink and air duct structure for air conditioning, or a flat plate heat exchanger and flow channel structure for liquid cooling. The pump delivers the fluid through the cold end channel into the target space to achieve space cooling.

[0058] Specifically, the cooling capacity of a single module is approximately 60 kW, with 5 modules in total, resulting in a total cooling power of approximately 300 kW; system control resolution: 256 units per module × 5 modules = 1280 control channels; control accuracy: 0.1% level (based on a resolution of 10W per unit).

[0059] This system uses modules as the basic expansion unit, enabling flexible capacity expansion while maintaining high overall efficiency and reliability. For the first time in similar thermoelectric systems, this structure achieves continuous power scalability from kilowatts to hundreds of kilowatts, realizing high COP and high control precision.

[0060] The present invention provides a temperature control device (vertical conformal thermoelectric air conditioner) for underwater equipment cabin space, which is manufactured based on the above-mentioned thermoelectric refrigeration system and is used for temperature regulation in enclosed spaces such as submersibles or deep-sea cabins.

[0061] like Figure 5 As shown, this device includes: The main body of the thermoelectric refrigeration system: It consists of several modular thermoelectric refrigeration systems described in this invention. The whole system is arranged vertically and forms a conformal installation structure along the inner side of the cabin wall to fit the curved surface of the cabin.

[0062] Air circulation and heat exchange channels: The air inside the cabin enters the cold end fins of the thermal control array through the lower air supply channel, and after being cooled, it is evenly sent into the cabin from the top to achieve uniform regulation of the air temperature in the space.

[0063] Liquid cooling system: The hot-end liquid cooling channel transfers heat through the onboard freshwater cooling system. The freshwater circulation flow rate is controlled by the onboard heat exchange station to ensure stable operation of the system under different operating conditions.

[0064] Intelligent control interface: The device is connected to the shipboard monitoring system via a bus to realize temperature feedback, load prediction and cascaded start-stop of thermal control array.

[0065] The control module has diagnostic and fault-tolerant capabilities, and can automatically isolate abnormal units to ensure continuous system operation.

[0066] Cooling mode: The current direction directs the cold end face toward the cabin air, and heat is expelled outside the submarine through the liquid cooling system; Heating mode: The current is reversed, and the hot and cold surfaces are interchanged. Rapid heating is achieved by switching the direction of the current. Intelligent energy-saving mode: The control module automatically adjusts the number of start-stop units based on the temperature distribution and heat load changes inside the cabin to achieve energy-saving operation.

[0067] Through the above design, this system achieves high-power thermal control while maintaining optimal energy efficiency, thus achieving a balance between high power and high energy efficiency.

[0068] like Figure 6 As shown, the thermoelectric refrigeration system of this invention is based on the principle of electrothermal transport, achieving the direct conversion of electrical energy into heat energy through the Peltier effect. The direction of the current determines the position of the hot and cold surfaces, realizing reversible cooling and heating functions. The system employs distributed current on / off control at the array level, giving the heat flow distribution spatial resolution.

[0069] like Figure 7 As shown, the control module ensures that all activated thermoelectric units operate at the rated current point corresponding to the maximum coefficient of performance (COPmax). When the heat load changes, the number of units is adjusted by switching them on and off rather than the current amplitude, ensuring that the system as a whole operates in the high-efficiency range and avoiding the efficiency loss caused by traditional continuous flow control.

[0070] The system is configured such that: the minimum power adjustment step size of the system is the rated cooling power of a single minimum control unit 1; correspondingly, the theoretical relative adjustment resolution of the system is the ratio of the minimum power adjustment step size to the total rated cooling power of the system. Since the cooling power is proportional to the number of activated thermoelectric cooling elements 5, the relative adjustment resolution is also equal to the ratio of the number of thermoelectric cooling elements 5 contained in a single minimum control unit 1 to the total number of all thermoelectric cooling elements 5 in the system; different power adjustment steps are set by configuring the number of thermoelectric cooling elements 5 in the minimum control unit 1.

[0071] Based on the system theory control accuracy expression: Theoretical control accuracy of the system = Cooling capacity of a single minimum control unit 1 / Total cooling capacity of the system Under the concept of thermal control array layer 3 in this invention, the cooling capacity is linearly related to the number of devices, and the above expression can be further written as: Theoretical control accuracy of the system = Number of thermoelectric coolers in a single minimum control unit 1 / Total number of thermoelectric coolers in the system Therefore, based on the user's specific temperature control accuracy requirements, the minimum number of control units 1 needed can be derived in reverse, thereby determining the total number of thermoelectric elements and the array size. For extremely high precision requirements, finer control granularity can be achieved by using smaller, miniaturized thermoelectric elements. This demonstrates that the system architecture of this invention has good backward compatibility and technological foresight.

[0072] This invention also relates to a modular thermoelectric cooling method based on a thermal control array, such as... Figure 8 As shown, the method includes the following steps: Acquire the temperature signal of the target space; Based on the deviation between the temperature signal and the set value, the target number of minimum control units 1 that need to be activated in each thermal control array layer 3 is determined; Based on the target number of minimum control units 1 to be activated, the specific positions of the minimum control units 1 in the thermal control array layer 3 are determined according to the spatial uniform distribution strategy. The minimum control unit 1 at the specific position is selected on the thermal control array layer 3 and powered on, while other minimum control units 1 are turned off. The thermoelectric cooling element 5 in the smallest control unit 1 that controls all energized components operates at its rated operating point.

[0073] The above method also includes: dynamically adjusting the number and distribution position of the minimum control units 1 that are activated in the thermal control array layer 3 according to the changes in thermal load.

[0074] In the above method, the control accuracy of the system is defined by the ratio of the cooling capacity of a single minimum control unit 1 to the total cooling capacity of the system. The control accuracy can be customized by adjusting the size of the minimum control unit 1.

Claims

1. A modular thermoelectric refrigeration system based on a thermal control array, characterized in that, include: At least one thermoelectric cooling module (10); the thermoelectric cooling module (10) includes n cold-end heat exchange channels (2), 2n thermal control array layers (3) and n+1 hot-end heat dissipation channels (4), where n is an integer greater than or equal to 1; the n cold-end heat exchange channels (2), 2n thermal control array layers (3) and n+1 hot-end heat dissipation channels (4) are stacked along the thickness direction; The stacked structure uses the hot end heat dissipation channel (4) at both the beginning and end. Each cold end heat exchange channel (2) is adjacent to a thermal control array layer (3) on both sides. Each thermal control array layer (3) is adjacent to a cold end heat exchange channel (2) or a hot end heat dissipation channel (4) on one side and to a hot end heat dissipation channel (4) or a cold end heat exchange channel (2) on the other side. Each of the thermal control array layers (3) is composed of several independently controllable minimum control units (1) in an array form; And, a control module; the control module is used to determine the total number of minimum control units (1) to be activated according to the thermal load, determine the target number of minimum control units (1) to be activated for each thermal control array layer according to the target number of minimum control units (1) to be activated and the number of thermal control array layers, and select the corresponding target number of minimum control units (1) from each thermal control array layer (3) to be activated according to the spatial uniform distribution strategy, while turning off the remaining minimum control units (1); and control all activated minimum control units (1) to work at their rated operating points.

2. The modular thermoelectric refrigeration system based on a thermal control array according to claim 1, characterized in that, The minimum control unit (1) includes N thermoelectric cooling elements (5), where N≥1; the N thermoelectric cooling elements (5) are arranged in an array and connected in series; the control module includes an on / off control circuit connected to the N thermoelectric cooling elements (5), which is used to control the on / off of the current flowing to the N thermoelectric cooling elements (5).

3. The modular thermoelectric refrigeration system based on a thermal control array according to claim 2, characterized in that, The thermoelectric cooling chip (5) includes a cold end face and a hot end face. The cold end face is thermally coupled to the cold end heat exchange channel (2), and the hot end face is thermally coupled to the hot end heat dissipation channel (4).

4. A modular thermoelectric refrigeration system based on a thermal control array according to claim 1 or 3, characterized in that, The cold end heat exchange channel (2) is a fluid channel with an integrated heat exchange structure, which is an air-cooled fin or liquid-cooled plate flow channel (7).

5. A modular thermoelectric refrigeration system based on a thermal control array according to claim 4, characterized in that, The hot end heat dissipation channel (4) is a fluid channel with an integrated heat dissipation structure, and the heat dissipation structure is a liquid cooling plate channel (7).

6. A modular thermoelectric refrigeration system based on a thermal control array according to claim 1 or 5, characterized in that, A thermally conductive interface material is provided between the cold end heat exchange channel (2) and the thermal control array layer (3), and a thermally conductive interface material is provided between the hot end heat exchange channel (4) and the thermal control array layer (3).

7. A modular thermoelectric refrigeration system based on a thermal control array according to claim 4, characterized in that, The control module is configured to linearly adjust the total cooling capacity of the system by adjusting the number of activated minimum control units (1), and to always keep each activated thermoelectric cooler (5) operating at its rated current or rated voltage.

8. A modular thermoelectric refrigeration system based on a thermal control array according to claim 7, characterized in that, The system is configured such that: the minimum power adjustment step size of the system is the rated cooling power of a single minimum control unit; the theoretical relative adjustment resolution of the system is the ratio of the minimum power adjustment step size to the total rated cooling power of the system; and the relative adjustment resolution is equal to the ratio of the number of thermoelectric coolers contained in a single minimum control unit to the total number of thermoelectric coolers in the system; different power adjustment steps are set by configuring the number of thermoelectric coolers in the minimum control unit.

9. A modular thermoelectric refrigeration system based on a thermal control array according to claim 8, characterized in that, When there are multiple thermoelectric cooling modules (10), the cold end heat exchange channel (2) of each thermoelectric cooling module (10) is fluidly connected, and the hot end heat dissipation channel (4) of each thermoelectric cooling module (10) is fluidly connected.

10. A modular thermoelectric refrigeration method based on a thermal control array, characterized in that, The method, implemented using the thermoelectric refrigeration system according to any one of claims 1 to 9, comprises the following steps: Acquire the temperature signal of the target space; Based on the deviation between the temperature signal and the set value, determine the target number of minimum control units (1) that need to be activated for each thermal control array layer (3); Based on the spatial uniform distribution strategy, the specific location of the minimum control unit (1) in the thermal control array layer (3) is determined. The minimum control unit (1) at the specific location is selected on the thermal control array layer (3) and powered on, while other minimum control units (1) are turned off. The thermoelectric cooling element (5) in the smallest control unit (1) that is powered on is controlled to operate at its rated operating point.

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