A dual-band TR assembly using a profiled bundle connector

By using a dual-band TR assembly with irregularly shaped bundled connectors and ramp microstrip design, the problems of large assembly volume, large channel spacing and cavity breakage risk in the existing TR assembly technology are solved. This enables efficient interconnection of Ku and Ka dual bands, improving system integration and RF signal performance.

CN122131244APending Publication Date: 2026-06-02成都华兴大地科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
成都华兴大地科技有限公司
Filing Date
2026-03-12
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing phased array TR components use a single-band, discrete connector solution, resulting in large assembly volume and large channel spacing, which cannot meet the large-angle scanning requirements of Ku and Ka dual-band phased array antennas, and there is a risk of structural cavity damage caused by the connectors being too close together.

Method used

By employing a non-circular cluster connector, combined with a double-sealed cavity layout and a ramp microstrip design, synchronous transmission of three RF signals is achieved. The non-circular cluster connector integrates a central pin one and two central pins two within a single outer conductor. Combined with laser sealing and gold wire bonding, a highly isolated hermetic package is constructed.

Benefits of technology

Achieving efficient integrated interconnection with limited channel spacing solves the problem of insufficient thickness space, improves system integration and reliability, reduces assembly complexity and cost, and improves the transmission quality and airtightness of radio frequency signals.

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Abstract

This invention discloses a dual-band TR component using a non-circular cluster connector, relating to the field of radio frequency and microwave technology. Specifically, it includes a structural cavity and a non-circular cluster connector. Metal cover plates on both sides of the structural cavity form first and second sealed cavities, each housing a power supply board for one frequency band, a microstrip line, and an RF chip. The non-circular cluster connector includes an outer conductor and an insulator, with one central pin and two central pins fixed inside. Central pin one extends into the first sealed cavity to connect to microstrip line one, and central pins two extend into the second sealed cavity to connect to microstrip line two. This invention enables the simultaneous transmission of three signals using a single non-circular connector, breaking the thickness limitations of double-sided layouts, avoiding the risk of hole breakage due to excessively close connector spacing, and achieving high integration and high isolation with extremely small channel spacing.
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