Sound-absorbing structure and server

Abstract

This application provides a sound-absorbing structure comprising at least one sound-absorbing unit. The sound-absorbing unit includes multiple sub-units arranged in an array and interconnected to form a sound-permeable groove. Each sub-unit includes a connected sound-absorbing chamber and a connecting channel. The sound-absorbing chamber is a polygonal chamber, and the connecting channel is located at a corner of the sound-absorbing chamber. At least one of the sub-units has its sound-absorbing chamber connected to the sound-permeable groove via the connecting channel. This application effectively prevents noise generated by a fan from affecting the storage device.

Description

Technical Field

[0001] This application relates to a sound-absorbing structure and a server. Background Technology

[0002] To cope with the ever-increasing computing demands, server hardware performance is constantly improving, which also brings considerable heat dissipation. As a common solution in cooling systems, the increased cooling efficiency of cooling fans is accompanied by increased fan noise, and noise at certain frequencies can affect the performance of storage devices.

[0003] Currently, most noise reduction methods involve attaching low-cost passive noise-reducing components to the inside of the chassis and the backplate of the storage device to reduce the impact of noise on the performance of the storage device. However, the noise reduction effect of these components is often unsatisfactory and cannot effectively reduce noise in specific frequency bands, especially sensitive frequency bands that can easily affect hard drive read and write performance. Therefore, researchers in this field are currently working to solve the aforementioned problems. Summary of the Invention

[0004] This application provides a sound-absorbing structure and server that can effectively prevent noise generated by the fan from affecting the storage device.

[0005] An embodiment of this application discloses a sound-absorbing structure comprising at least one sound-absorbing unit. The sound-absorbing unit comprises multiple sub-units arranged in an array and interconnected to form a sound-permeable groove. Each sub-unit includes a connected sound-absorbing chamber and a connecting channel. The sound-absorbing chamber is a polygonal chamber, and the connecting channel is located at a corner of the sound-absorbing chamber. At least one of the sub-units has its sound-absorbing chamber connected to the sound-permeable groove via the connecting channel.

[0006] Another embodiment of this application discloses a server comprising a chassis, a hard disk module, a fan module, and a sound-absorbing structure. The chassis includes a hard disk housing area and a fan housing area. The hard disk module is disposed in the hard disk housing area. The fan module is disposed in the fan housing area. The sound-absorbing structure is disposed between the hard disk housing area and the fan housing area and includes at least one sound-absorbing unit. The sound-absorbing unit includes multiple sub-units arranged in an array and interconnected to form a sound-permeable groove. Each sub-unit includes a communicating sound-absorbing chamber and a connecting channel. The sound-absorbing chamber is a polygonal chamber, and the connecting channel is located at a corner of the sound-absorbing chamber. At least one of the sub-units has its sound-absorbing chamber connected to the sound-permeable groove via the connecting channel.

[0007] According to the sound-absorbing structure and server disclosed in the above embodiments, the sound-absorbing structure is disposed between the hard disk storage area and the fan storage area. The sub-units of the sound-absorbing unit of the sound-absorbing structure are arranged in an array and connected to each other to form a sound-permeable groove. The sound-absorbing chamber of each sub-unit is a polygonal chamber. The connecting channel is connected to the sound-absorbing chamber and separated at the corner of the sound-absorbing chamber. The arrangement of at least one of these sub-units having its sound-absorbing chamber connected to the sound-permeable groove through the connecting channel allows the sound generated by the fan module to enter the sound-absorbing chamber through the connecting channel of the sub-unit and dissipate. Therefore, the noise transmitted from the fan module to the hard disk module is effectively reduced to avoid the noise affecting the performance of the hard disk module.

[0008] The above description of the contents of this application and the following description of the embodiments are used to demonstrate and explain the principles of this application, and to provide a further explanation of the scope of this patent application. Attached Figure Description

[0009] Figure 1 This is a plan view of the server disclosed according to the first embodiment of this application.

[0010] Figure 2 for Figure 1 A partial planar schematic diagram of the sound-absorbing structure.

[0011] Figure 3 for Figure 2 A planar schematic diagram of the sound-absorbing unit of the sound-absorbing structure.

[0012] Figure 4 for Figure 3 A planar schematic diagram of the deformation of the sound-absorbing unit.

[0013] Figure 5 This is a plan view of the sound-absorbing unit of the sound-absorbing structure disclosed in the second embodiment of this application.

[0014] Figure 6 for Figure 5 A planar schematic diagram of the deformation of the sound-absorbing unit.

[0015] Component designation explanation

[0016] 1 server

[0017] 10. Chassis

[0018] 11 Hard Disk Capacity Area

[0019] 12 Fan housing area

[0020] 13 Motherboard Compartment

[0021] 14 Power Supply Area

[0022] 20 Hard Disk Modules

[0023] 30 Fan Module

[0024] 40,40a sound-absorbing structure

[0025] 41,41a sound-absorbing unit

[0026] 411,411a subunits

[0027] 4111, 4111a Sound-absorbing chamber

[0028] 4112 Connecting Channel

[0029] 4113 First Surface

[0030] 4114 Second Surface

[0031] 412 Connecting part

[0032] 413, 413a Sound-permeable groove

[0033] 4131 First side

[0034] 4132 Second side

[0035] 4133 Third side

[0036] 4134 Fourth side

[0037] 4135 end

[0038] 4136 Central Department

[0039] 50 motherboards

[0040] 60 Power Supply Module

[0041] L (length direction)

[0042] H (height direction)

[0043] Width of W1, W2

[0044] T thickness Detailed Implementation

[0045] Please see Figure 1 and Figure 2 , Figure 1 This is a plan view of the server disclosed according to the first embodiment of this application. Figure 2 for Figure 1 A partial planar schematic diagram of the sound-absorbing structure.

[0046] In this embodiment, server 1 includes a chassis 10, at least one hard disk module 20, a fan module 30, and a sound-absorbing structure 40. Furthermore, server 1 may also include, for example but not limited to, a motherboard 50 and a power supply module 60.

[0047] The chassis 10 includes a hard drive housing 11, a fan housing 12, a motherboard housing 13, and a power supply housing 14. The hard drive housing 11, fan housing 12, motherboard housing 13, and power supply housing 14 are arranged sequentially along the length of the chassis 10. The hard drive module 20, fan module 30, motherboard 50, and power supply module 60 are respectively disposed in the hard drive housing 11, fan housing 12, motherboard housing 13, and power supply housing 14. A sound-absorbing structure 40 is disposed within the chassis 10 and located between the hard drive housing 11 and the fan housing 12.

[0048] The sound-absorbing structure 40, for example, is a monolithic planar auxetic metamaterial. Through precisely designed microstructures, rather than relying on the chemical composition of ordinary materials, it enables the material to possess special physical properties (such as negative mass density, negative Poisson's ratio, and negative refractive index) to block sound waves of specific frequencies. The sound-absorbing structure 40, for example, can elastically deform along its length direction L and height direction H, and its thickness T is, for example, greater than or equal to 5 mm and less than or equal to 10 mm. The sound-absorbing structure 40 comprises multiple sound-absorbing units 41, which are arranged in a matrix and connected to each other. This design allows the sound-absorbing structure 40 to adjust its sound absorption performance by applying different strains, effectively reducing noise at different frequencies. Since these sound-absorbing units 41 have the same structure, only one will be described in detail below.

[0049] Next, please refer to the following: Figure 2 and Figure 3 . Figure 3 for Figure 2 A planar schematic diagram of the sound-absorbing unit of the sound-absorbing structure.

[0050] The sound-absorbing unit 41 includes multiple sub-units 411 and multiple connecting portions 412. These sub-units 411 are arranged in an array and connected to each other through the connecting portions 412 to form a sound-permeable groove 413. For example, the sound-permeable groove 413 is rectangular and includes a first side 4131, a second side 4132, a third side 4133, a fourth side 4134, two ends 4135, and a central portion 4136. The first side 4131 and the second side 4132 are opposite to each other, and the third side 4133 and the fourth side 4134 are opposite to each other. The two ends 4135 and the central portion 4136 are located between the third side 4133 and the fourth side 4134, and the central portion 4136 is located between the two ends 4135. The sound-absorbing unit 41 is, for example, a 20mm × 20mm cube and includes four sub-units 411 and four connecting portions 412. The four sub-units 411 are arranged in a 2×2 array. Two of the four sub-units 411 and one of the four connecting parts 412 are located on the first side 4131 of the sound-permeable groove 413, the other two of the four sub-units 411 and the other of the four connecting parts 412 are located on the second side 4132 of the sound-permeable groove 413, and the remaining two of the four connecting parts 412 are located on the third side 4133 and the fourth side 4134 of the sound-permeable groove 413, respectively.

[0051] Each of these sub-units 411 includes a connected sound-absorbing chamber 4111 and a connecting channel 4112, wherein the sound-absorbing chamber 4111 is a polygonal chamber, and the width W1 of the sound-absorbing chamber 4111 is greater than the width W2 of the connecting channel 4112. Taking a sub-unit 411 as an example, the sub-unit 411 is a hollow cube surrounding a square sound-absorbing chamber 4111. The sub-unit 411 includes a first surface 4113 and a second surface 4114 facing each other. The first surface 4113 faces the sound-permeable groove 413, and the second surface 4114 faces away from the sound-permeable groove 413 and towards the sound-absorbing chamber 4111. A connecting channel 4112 is located on one side of the sound-absorbing chamber 4111 and is separated from two corners of that side. The connecting channel 4112 maintains the same distance from the two corners of that side of the sound-absorbing chamber 4111, and extends from the second surface 4114 to the first surface 4113. One of the connecting channels 4112 on the first side 4131 and one of the connecting channels 4112 on the second side 4132 open towards each other. The sound-absorbing chambers 4111 of all sub-units 411 are connected to opposite ends 4135 of the same sound-permeable groove 413 via connecting channels 4112. These sub-units 411 are, for example, Helmholtz resonators. When sound waves pass through the sound-permeable groove 413 and enter the sound-absorbing chambers 4111 via the connecting channels 4112, the sound waves will resonate at a specific frequency, thereby absorbing and dissipating sound energy.

[0052] In this embodiment, a sound-absorbing structure 40 is disposed between the hard disk storage area 11 and the fan storage area 12. The sub-units 411 of the sound-absorbing unit 41 of the sound-absorbing structure 40 are arranged in an array and connected to each other to form a sound-permeable groove 413. The sound-absorbing chamber 4111 of each sub-unit 411 is a polygonal chamber. The connecting channel 4112 is connected to the sound-absorbing chamber 4111 and separated at the corner of the sound-absorbing chamber 4111. The sound-absorbing chamber 4111 of at least one of these sub-units 411 is connected to the sound-permeable groove 413 through the connecting channel 4112. When the sound generated by the fan module 30 enters the sound-absorbing chamber 4111 through the connecting channel 4112 of the sub-unit 411, the sound wave causes resonance in the sound-absorbing chamber 4111 and converts the sound energy into heat energy through resonance, thereby dissipating the sound. Therefore, the noise transmitted from the fan module 30 to the hard disk module 20 can be effectively reduced to avoid the noise affecting the performance of the hard disk module 20.

[0053] Furthermore, by configuring one of the connecting channels 4112 on the first side 4131 and one of the connecting channels 4112 on the second side 4132 opposite to each other, the resonant frequency decreases and the range of resonant frequency that can be adjusted increases under different strains, thereby increasing the resonant frequency adjustment capability.

[0054] Furthermore, the connecting channel 4112 is located on one side of the sound-permeable groove 413, and the sound-absorbing chamber 4111 is designed as a square chamber, which can improve noise reduction capability. Moreover, the square chamber design of the sound-absorbing chamber 4111 can increase the utilization rate of structural space.

[0055] Previous studies observed that the performance of the hard drive module 20 decreased most significantly at a noise level of 3000Hz. This is likely because noise at this frequency causes resonance within the hard drive, thus affecting its read / write performance. In the first embodiment of this application, the sound-absorbing structure 40, in its original, undeformed state, achieves noise reduction for sounds with a frequency of approximately 2980Hz, resulting in a sound transmission loss (STL) greater than 5dB, with a frequency bandwidth of 59Hz. Furthermore, by utilizing the negative Poisson's ratio characteristic of planar tensile metamaterials, different strains are applied to cause elastic deformation of the sound-absorbing structure 40. Under different conditions of tension or compression, the applicable sound frequency of the sound-absorbing structure 40 can be adjusted. For example, please refer to [further details omitted]. Figure 2 and Figure 4 , Figure 4 for Figure 3A planar schematic diagram of the deformation of the sound-absorbing unit is shown. Applying a strain of -0.1 to the sound-absorbing structure 40 compresses and deforms the shape of the sound-permeable groove 413 of the sound-absorbing unit 41, allowing the sound-absorbing structure 40 to reduce noise for sounds with a frequency of approximately 2890Hz, achieving an STL greater than 5dB, while reducing its frequency bandwidth to 28Hz. Applying a strain of 0.1 to the sound-absorbing structure 40 stretches and deforms the shape of the sound-permeable groove 413 of the sound-absorbing unit 41, allowing the sound-absorbing structure 40 to reduce noise for sounds with a frequency of approximately 2890Hz, achieving an STL greater than 5dB, while maintaining its frequency bandwidth at 59Hz. Specifically, the noise reduction performance of the sound-absorbing structure 40 changes after applying different strains. Applying a positive strain shifts the resonant frequency of the sound-absorbing structure to lower frequencies, while applying a negative strain reduces the effective frequency range of the sound-absorbing structure. The sound-absorbing structure 40 can be configured to elastically deform along its length (L) and height (H). After compression deformation, the sound-absorbing structure 40 can concentrate noise reduction within a narrow frequency range for lower-frequency (2900Hz) sounds. After stretching deformation, the sound-absorbing structure 40 can also reduce noise for lower-frequency (2900Hz) sounds, while maintaining a stable noise reduction effect (STL). This flexibility allows the sound-absorbing structure 40 to adjust its noise reduction performance according to specific needs, thereby providing optimal noise reduction effects in different application scenarios.

[0056] In this embodiment, the design of the sound-absorbing structure 40 is performed using theoretical methods and verified by numerical simulation. This allows for the rapid design of a suitable sound-absorbing structure 40, thus reducing costs. In this embodiment, the sound-absorbing structure 40 utilizes a planar tensile metamaterial combined with a Helmholtz resonator, offering several advantages over conventional sound-absorbing structures, including resonant frequency modulation capabilities, adjustable noise reduction bandwidth, and equivalent stress required for strain. Furthermore, the sound-absorbing structure 40 is a monolithic structure, simplifying assembly and further reducing costs.

[0057] In this embodiment, the sub-units 411 are configured to combine Helmholtz resonant units with planar tensile metamaterials with negative Poisson's ratio. The planar tensile metamaterials have the advantage of being more easily deformable than general structures, and their structure allows for adjustment of ventilation rate. Furthermore, the thickness of the structure is not affected by deformation, making it more suitable for use in the internal space of servers.

[0058] Next, please refer to Figure 5 . Figure 5 This is a plan view of the sound-absorbing unit of the sound-absorbing structure disclosed in the second embodiment of this application.

[0059] The sound-absorbing structure 40a in this embodiment is similar to the sound-absorbing structure 40 in the previous embodiment. The following mainly describes the differences between the two, while the similarities will not be repeated.

[0060] The size of the sound-absorbing chamber 4111a of the sub-units 411a of the sound-absorbing unit 41a in this embodiment is larger than the size of the sound-absorbing chamber 4111 of the sub-units 411 of the sound-absorbing unit 41 in the previous embodiment, and the sound-permeable groove 413a surrounded by the sub-units 411a of the sound-absorbing unit 41a in this embodiment is smaller than the sound-permeable groove 413 surrounded by the sub-units 411 of the sound-absorbing unit 41 in the previous embodiment.

[0061] In the second embodiment of this application, the sound-absorbing structure 40a, in its original, undeformed state, achieves noise reduction for sounds with a frequency of approximately 3070 Hz, resulting in a sound transmission loss (STL) greater than 5 dB and a frequency bandwidth of 133 Hz. Furthermore, by utilizing the negative Poisson's ratio characteristic of planar tensile metamaterials, different strains are applied to cause elastic deformation of the sound-absorbing structure 40a. Under different conditions of tension or compression, the applicable sound frequency of the sound-absorbing structure 40a can be adjusted. For example, please refer to... Figure 6 , Figure 6 for Figure 5 A planar schematic diagram of the deformation of the sound-absorbing unit. Applying a strain of -0.1 to the sound-absorbing structure 40a compresses and deforms the shape of the sound-permeable groove 413a of the sound-absorbing unit 41a, allowing the sound-absorbing structure 40a to reduce noise for sounds with a frequency of approximately 2980Hz, achieving an STL greater than 5dB, and extending its frequency bandwidth to 256Hz. Applying a strain of 0.1 to the sound-absorbing structure 40a stretches and deforms the shape of the sound-permeable groove 413a of the sound-absorbing unit 41a, allowing the sound-absorbing structure 40a to reduce noise for sounds with a frequency of approximately 3020Hz, achieving an STL greater than 5dB, and reducing its frequency bandwidth to 97Hz. The sound-absorbing structure 40a can be configured to elastically deform along its length and height. Specifically, applying different strains can drive the sound-absorbing structure 40a to move towards lower frequencies; negative strain expands the effective frequency range of the sound-absorbing structure, while positive strain reduces the effective frequency range. Furthermore, observing the second embodiment from the first embodiment, it can be clearly seen that by increasing the size of the sound-absorbing chamber 4111a, the frequency bandwidth of the sound-absorbing structure 40a is significantly increased regardless of its original state, tensile condition, or compressed condition. In other words, the sound-absorbing structure 40a of the second embodiment can respond to signals of different frequencies in a wider frequency range and has better noise reduction capability.

[0062] It should be noted that the sound-absorbing structures 40 and 40a in the above embodiments are not limited to being elastically deformable. In other embodiments, the sound-absorbing structure may be a non-deformable structure.

[0063] On the other hand, in the above embodiments, the sound-absorbing chambers 4111 and 4111a of the subunits 411 and 411a of the sound-absorbing units 41 and 41a are connected to the same sound-permeable grooves 413 and 413a, but this is not a limitation. In other embodiments, the sound-absorbing chambers of the subunits of the sound-absorbing unit may be connected to different sound-permeable grooves respectively.

[0064] Furthermore, the shapes of the sound-absorbing units 41 and 41a of the sound-absorbing structures 40 and 40a in the above embodiments are not intended to limit this application, but can be adjusted according to needs.

[0065] According to the sound-absorbing structure and server disclosed in the above embodiments, the sound-absorbing structure is disposed between the hard disk storage area and the fan storage area. The sub-units of the sound-absorbing unit of the sound-absorbing structure are arranged in an array and connected to each other to form a sound-permeable groove. The sound-absorbing chamber of each sub-unit is a polygonal chamber, and the connecting channel is connected to the sound-absorbing chamber and separated at the corner of the sound-absorbing chamber. The arrangement of at least one of these sub-units having its sound-absorbing chamber connected to the sound-permeable groove through the connecting channel allows the sound generated by the fan module to enter the sound-absorbing chamber through the connecting channel of the sub-unit and dissipate. Therefore, the noise transmitted from the fan module to the hard disk module is effectively reduced to avoid the noise affecting the performance of the hard disk module.

[0066] Furthermore, the sound-absorbing structure can be configured to elastically deform along both the length and height directions, allowing it to provide noise reduction for sounds of different frequencies.

[0067] Furthermore, the design of the sound-absorbing structure utilizes theoretical calculations combined with numerical simulations for verification, enabling the rapid design of a suitable sound-absorbing structure and reducing costs. Additionally, the monolithic nature of the sound-absorbing structure facilitates assembly, further minimizing costs.

[0068] In one embodiment of this application, the server can be used for artificial intelligence (AI) computing, edge computing, or as a 5G server, cloud server, or vehicle networking server.

[0069] Although this application discloses the preferred embodiments as described above, it is not intended to limit this application. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of this application. Therefore, the scope of patent protection of this application shall be determined by the scope of the claims attached to this specification.

Claims

1. A sound-absorbing structure, characterized in that, Include: At least one sound-absorbing unit, comprising multiple sub-units, wherein the multiple sub-units are arranged in an array and connected to each other to form a sound-transmitting groove; Each of the plurality of sub-units includes a connected sound-absorbing chamber and a connecting channel. The sound-absorbing chamber is a polygonal chamber, and the connecting channel is located at a corner of the sound-absorbing chamber. The sound-absorbing chamber of at least one of the plurality of sub-units is connected to the sound-permeable groove through the connecting channel.

2. The sound-absorbing structure according to claim 1, characterized in that, The multiple sound-absorbing chambers of all the multiple sub-units are respectively connected to the sound-permeable groove through multiple connecting channels.

3. The sound-absorbing structure according to claim 2, characterized in that, The number of the plurality of sub-units is four, the four sub-units are arranged in a 2×2 array, two of the four sub-units are located on one side of the sound-permeable groove, and the other two sub-units are located on the other side of the sound-permeable groove.

4. The sound-absorbing structure according to claim 3, characterized in that, The multiple sound-absorbing chambers of the four sub-units are connected to the opposite ends of the sound-permeable groove through multiple connecting channels.

5. The sound-absorbing structure according to claim 3, characterized in that, Each of the four sub-units includes a first surface and a second surface facing each other, the first surface facing the sound-permeable groove, the second surface facing away from the sound-permeable groove and facing the sound-absorbing chamber, and the connecting channel extending from the second surface to the first surface.

6. The sound-absorbing structure according to claim 1, characterized in that, The multiple sub-units mentioned therein are Helmholtz resonance units.

7. The sound-absorbing structure according to claim 1, characterized in that, The sound-absorbing structure described herein can elastically deform along both the length and height directions.

8. The sound-absorbing structure according to claim 1, characterized in that, The sound-absorbing chamber is a square chamber.

9. The sound-absorbing structure according to claim 8, characterized in that, The connecting channel is located on one side of the sound-absorbing chamber and is at the same distance from the two corners of the side of the sound-absorbing chamber.

10. A server, characterized in that, Include: A chassis, comprising a hard drive storage area and a fan storage area; A hard disk module is disposed in the hard disk accommodating area; A fan module is disposed in the fan receiving area; and A sound-absorbing structure is disposed between the hard disk accommodating area and the fan accommodating area, and includes: At least one sound-absorbing unit, comprising multiple sub-units, wherein the multiple sub-units are arranged in an array and connected to each other to form a sound-transmitting groove; Each of the plurality of sub-units includes a connected sound-absorbing chamber and a connecting channel. The sound-absorbing chamber is a polygonal chamber, and the connecting channel is located at a corner of the sound-absorbing chamber. The sound-absorbing chamber of at least one of the plurality of sub-units is connected to the sound-permeable groove through the connecting channel.

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