Battery device, power-consuming device, and method for manufacturing battery device

Abstract

This application discloses a battery device, an electrical device, and a method for manufacturing the battery device, relating to the field of flexible circuit board technology. The battery device includes a housing, a battery cell, and a flexible circuit board assembly. The battery cell is housed within the housing. The flexible circuit board assembly includes a target flexible circuit board and a flexible circuit board protective structure. The target flexible circuit board is electrically connected to the battery cell. The flexible circuit board protective structure is attached to the target flexible circuit board. The flexible circuit board protective structure includes a carbon fiber layer, a thermal expansion coefficient control layer, and a first flexible buffer layer. The thermal expansion coefficient control layer is disposed on the carbon fiber layer and is made of a thermosetting polymer material or a thermosetting inorganic reinforced composite material. The first flexible buffer layer is disposed on the carbon fiber layer and is made of an elastic material. This solution can reduce the warping of the flexible circuit board and improve its flatness and reliability.

Description

Technical Field

[0001] This application relates to the field of flexible circuit board technology, specifically to a battery device, an electrical device, and a method for manufacturing the battery device. Background Technology

[0002] Flexible printed circuit boards (FPCs) are made of flexible materials, making them lighter than traditional rigid boards. They can be bent, rolled, and folded freely, making them well-suited for complex assembly environments with limited space. As a result, they are widely used in electronic products.

[0003] However, existing flexible circuit boards are prone to warping after long-term use or when there are significant changes in temperature and humidity in the environment, which will reduce the stability of the circuit connection and even cause electrical failures. Summary of the Invention

[0004] The main objective of this application is to provide a battery device that reduces warping of flexible circuit boards and improves the flatness and reliability of the flexible circuit boards.

[0005] To achieve the above objectives, the battery device proposed in this application includes:

[0006] Box;

[0007] A battery cell, wherein the battery cell is housed within the casing;

[0008] A flexible circuit board assembly, comprising a target flexible circuit board and a flexible circuit board protection structure, wherein the target flexible circuit board is electrically connected to the battery cell, and the flexible circuit board protection structure is attached to the target flexible circuit board, and the flexible circuit board protection structure includes:

[0009] carbon fiber layer;

[0010] A thermal expansion coefficient control layer is disposed on the carbon fiber layer; the thermal expansion coefficient control layer is made of a thermosetting polymer material or a thermosetting inorganic reinforced composite material.

[0011] A first flexible buffer layer is disposed on the carbon fiber layer; the first flexible buffer layer is made of an elastic material.

[0012] The battery device provided in this embodiment adopts a composite design of multiple functional material layers for its flexible circuit board protection structure. The rigidity of the carbon fiber layer as the core layer can complement the flexibility of the thermal expansion coefficient control layer and the first flexible buffer layer, so that the overall structure has high strength while effectively suppressing warping. By attaching this flexible circuit board protection structure to the surface of the target flexible circuit board, the warping problem of the target flexible circuit board during use can be effectively reduced, and the flatness and durability of the target flexible circuit board can be improved.

[0013] In some embodiments, the flexible circuit board protection structure further includes a protective layer disposed on the carbon fiber layer, the protective layer serving to form a barrier effect.

[0014] The protective layer can form a barrier between the carbon fiber layer, the thermal expansion coefficient control layer, the first flexible buffer layer and the outside, preventing external solid impurities, liquid impurities or gaseous impurities from entering the flexible circuit board protection structure, thus playing a protective role and preventing damage to the relevant functional material layers in the flexible circuit board protection structure, thereby improving the overall durability and reliability of the flexible circuit board protection structure.

[0015] In some embodiments, the protective layer includes at least one of abrasion-resistant coating, moisture-proof coating, corrosion-resistant coating, and antistatic coating.

[0016] In this embodiment, the protective layer can be used to enhance the durability, abrasion resistance, moisture resistance, and corrosion resistance of the flexible circuit board protection structure. For example, if the protective layer includes a moisture-proof coating, the moisture-proof coating can effectively reduce moisture penetration, keeping the entire flexible circuit board protection structure dry and flat. Simultaneously, the moisture-proof coating also provides protection, preventing damage to other functional material layers in the flexible circuit board protection structure due to changes in environmental humidity, thereby improving the overall durability and reliability of the flexible circuit board protection structure.

[0017] In some embodiments, the carbon fiber layer is attached to the target flexible circuit board, the thermal expansion coefficient control layer is stacked on one side of the carbon fiber layer facing away from the target flexible circuit board, and the first flexible buffer layer is stacked on one side of the thermal expansion coefficient control layer facing away from the carbon fiber layer.

[0018] In this embodiment, the functional material layers are stacked in the following order: carbon fiber layer, thermal expansion coefficient control layer, and first flexible buffer layer, thus achieving optimal results. Specifically, the carbon fiber layer directly supports the target flexible circuit board, thereby improving anti-warping performance; the first flexible buffer layer is positioned between the thermal expansion coefficient control layer and the protective layer, which can more effectively absorb stress and reduce the probability of damage to the target flexible circuit board; the thermal expansion coefficient control layer is positioned between the carbon fiber layer and the first flexible buffer layer, thus achieving optimal durability and environmental adaptability.

[0019] Based on the aforementioned stacking order of the carbon fiber layer, the thermal expansion coefficient control layer, and the first flexible buffer layer, the overall balance of the flexible circuit board protection structure and the stability of the target flexible circuit board in use can be ensured.

[0020] In some embodiments, the carbon fiber layer is attached to the target flexible circuit board, the thermal expansion coefficient control layer is superimposed on the side of the carbon fiber layer facing away from the target flexible circuit board, the first flexible buffer layer is superimposed on the side of the thermal expansion coefficient control layer facing away from the carbon fiber layer, and the protective layer is superimposed on the side of the first flexible buffer layer facing away from the thermal expansion coefficient control layer.

[0021] In this embodiment, the functional material layers are stacked in the following order: carbon fiber layer, thermal expansion coefficient control layer, first flexible buffer layer, and protective layer, thus achieving optimal results. Specifically, the carbon fiber layer directly supports the target flexible circuit board, thereby improving anti-warping performance; the first flexible buffer layer is positioned between the thermal expansion coefficient control layer and the protective layer, which can more effectively absorb stress and reduce the probability of damage to the target flexible circuit board; the thermal expansion coefficient control layer is positioned between the carbon fiber layer and the first flexible buffer layer, and the protective layer is positioned on the outermost side furthest from the target flexible circuit board, thus achieving optimal durability and environmental adaptability.

[0022] Based on the above-mentioned stacking order of carbon fiber layer, thermal expansion coefficient control layer, first flexible buffer layer and protective layer, the overall balance of the flexible circuit board protection structure and the stability of the target flexible circuit board in use can be ensured.

[0023] In some embodiments, the flexible circuit board protection structure further includes a second flexible buffer layer, which is made of an elastic material;

[0024] The second flexible buffer layer is sandwiched between the carbon fiber layer and the target flexible circuit board, and / or the second flexible buffer layer is sandwiched between the carbon fiber layer and the thermal expansion coefficient control layer.

[0025] This embodiment provides additional shock resistance and vibration damping by adding a second flexible buffer layer to at least one side of the carbon fiber layer, which helps to cope with extreme mechanical stress, making the target flexible circuit board applicable to environments with large vibrations or impacts, such as automotive electronics or industrial equipment.

[0026] In some embodiments, the flexible circuit board protection structure further includes a heat-resistant material layer sandwiched between the carbon fiber layer and the thermal expansion coefficient control layer.

[0027] This embodiment enhances the thermal expansion resistance of the flexible circuit board protection structure by adding a heat-resistant material layer between the carbon fiber layer and the thermal expansion coefficient control layer. Furthermore, this refinement of the layered structure can further reduce the impact of temperature differences on the target flexible circuit board and the flexible circuit board protection structure, helping to ensure dimensional stability under extreme temperatures. This allows the target flexible circuit board to be applied in extreme temperature variation scenarios involved in aerospace or special industrial equipment.

[0028] In some embodiments, the flexible circuit board protection structure further includes a waterproof material layer sandwiched between the thermal expansion coefficient control layer and the first flexible buffer layer.

[0029] This embodiment improves the resistance of the flexible circuit board protection structure to external water or moisture by adding a waterproof material layer between the thermal expansion coefficient control layer and the first flexible buffer layer. This prevents the relevant functional material layers from getting damp, ensuring the stability of the target flexible circuit board and the flexible circuit board protection structure. This allows the target flexible circuit board to be used in high humidity environments, such as outdoor electronic devices.

[0030] In some embodiments, the protective layer comprises at least two layers of the moisture-proof coating and / or at least two layers of the anti-corrosion coating.

[0031] This embodiment improves resistance to moisture and chemical corrosion by setting multiple layers of moisture-proof coating and / or multiple layers of anti-corrosion coating, ensuring the stability of the target flexible circuit board and the flexible circuit board protection structure, so that the target flexible circuit board can be used in high humidity or corrosive environments.

[0032] In some embodiments, the first flexible buffer layer is made of polyurethane or silicone rubber.

[0033] In some embodiments, the thickness of the first flexible buffer layer is 25–35 μm.

[0034] In some embodiments, the second flexible buffer layer is made of polyurethane or silicone rubber.

[0035] In some embodiments, the thickness of the second flexible buffer layer is 25–35 μm.

[0036] By controlling the thickness of the first flexible buffer layer and the second flexible buffer layer to 25-35μm, the best flexible buffer performance can be obtained while achieving lightweight design and avoiding excessive overall thickness of the flexible circuit board protection structure.

[0037] In some embodiments, the flexible circuit board protection structure is attached to the end of the target flexible circuit board.

[0038] The ends of the target flexible circuit board usually lack connection points, making them more prone to warping. In this embodiment, the flexible circuit board protection structure is attached to the ends of the target flexible circuit board, which can more effectively protect the parts of the target flexible circuit board that are prone to warping.

[0039] In some embodiments, the flexible circuit board assembly further includes a flexible circuit board connector connected to an end of the target flexible circuit board, and the flexible circuit board protection structure is attached to the end of the target flexible circuit board near the flexible circuit board connector.

[0040] By attaching the flexible circuit board protective structure to the target flexible circuit board near the flexible circuit board connector, the connection position between the target flexible circuit board and the flexible circuit board connector can be more effectively protected, which can effectively prevent warping at the connection position and thus prevent connection problems, ensuring normal signal transmission.

[0041] This application also proposes an electrical device, which includes the battery device as described above.

[0042] The flexible circuit board protection structure in the battery device adopts a composite design of multiple functional material layers. The rigidity of the carbon fiber layer, as the core layer, complements the flexibility of the thermal expansion coefficient control layer and the first flexible buffer layer, enabling the overall structure to possess high strength while effectively suppressing warping. By attaching this flexible circuit board protection structure to the surface of the target flexible circuit board, warping during use can be effectively reduced, improving the flatness and durability of the target flexible circuit board. This application also proposes a method for manufacturing a battery device, providing a housing, a battery cell, and a target flexible circuit board; the method for manufacturing the battery device includes the following steps:

[0043] The first flexible buffer layer, the thermal expansion coefficient control layer, and the carbon fiber layer are stacked in sequence to obtain a semi-finished protective structure.

[0044] The protective structure semi-finished product is heated, and during the heating process, the protective structure semi-finished product is pressed together;

[0045] The semi-finished protective structure is cooled down, and during the cooling process, the semi-finished protective structure is depressurized to obtain a flexible circuit board protective structure.

[0046] The flexible circuit board protection structure is attached to the target flexible circuit board.

[0047] In this embodiment, the flexible circuit board protection structure is fabricated through a thermosetting process. Specifically, the stacked first flexible buffer layer, thermal expansion coefficient control layer, and carbon fiber layer are softened by high-temperature heating until they reach a semi-solid or viscous state. Then, the softened functional material layers are bonded together under pressure through a pressing operation. Once the functional material layers have been fully bonded and fixed, the temperature can be lowered to room temperature and the pressing operation can be stopped to obtain the finished flexible circuit board protection structure.

[0048] Based on the thermosetting process of this embodiment, it is possible to ensure that all functional material layers achieve optimal strength and stability after bonding, without the need for UV curing, and is more suitable for curing deep adhesive layers in multilayer structures.

[0049] In some embodiments, the step of sequentially stacking the first flexible buffer layer, the thermal expansion coefficient control layer, and the carbon fiber layer to obtain a protective structure semi-finished product includes:

[0050] The protective layer, the first flexible buffer layer, the thermal expansion coefficient control layer, and the carbon fiber layer are stacked sequentially to obtain the semi-finished protective structure.

[0051] In this embodiment, the flexible circuit board protection structure is fabricated using a thermosetting process. This involves heating the stacked protective layer, first flexible buffer layer, thermal expansion coefficient control layer, and carbon fiber layer at high temperatures until they soften to a semi-solid or viscous state. Then, a pressing operation is performed to bond the softened functional material layers together under pressure. Once the functional material layers are fully bonded and fixed, the temperature can be lowered to room temperature and the pressing operation can be stopped to obtain the finished flexible circuit board protection structure.

[0052] Protective layers can be used to enhance the durability, abrasion resistance, moisture resistance, and corrosion resistance of flexible circuit board protective structures. Taking a moisture-proof coating as an example, the moisture-proof coating effectively reduces moisture penetration, keeping the entire flexible circuit board protective structure dry and flat. Simultaneously, the moisture-proof coating also protects other functional material layers within the flexible circuit board protective structure from damage due to changes in environmental humidity, thereby improving the overall durability and reliability of the flexible circuit board protective structure.

[0053] In some embodiments, the step of heating the protective structure semi-finished product includes:

[0054] The protective structure semi-finished product is heated to a first initial temperature range and held at that temperature for a preset time.

[0055] The semi-finished protective structure is heated to the next higher preset temperature range and held at that temperature for a preset time.

[0056] Repeat the steps described above to heat the semi-finished protective structure to the next higher preset temperature range and maintain it at that temperature for a preset time, until the semi-finished protective structure is heated to the first critical temperature range and maintained at that temperature for a preset time.

[0057] In some embodiments, the step of pressing the protective structure semi-finished product during the heating operation includes:

[0058] When the protective structure semi-finished product is heated to the first initial temperature range, a first initial compressive force is applied to the protective structure semi-finished product and held for a preset time;

[0059] When the protective structure semi-finished product is heated to the next higher preset temperature range, the compressive force on the protective structure semi-finished product is increased and maintained for a preset time;

[0060] Repeat the steps described above, which involve increasing the compressive force on the semi-finished protective structure and maintaining it for a preset time when the semi-finished protective structure is heated to the next higher preset temperature range, until the semi-finished protective structure is heated to the first critical temperature range.

[0061] The compressive force applied to the semi-finished protective structure is increased to the first critical compressive force and maintained for a preset time.

[0062] The gradual heating process in this embodiment is carried out in stages. By maintaining each temperature range for a period of time, the temperature uniformity in the laminated structure can be improved, and the concentration of thermal stress can be reduced. The staged increase in compressive force not only enhances the fluidity of each functional material layer and promotes tight bonding between them, but also works in conjunction with the staged heating process to gradually release the internal stress of each functional material layer. This staged heating and curing process effectively reduces the internal stress of the flexible circuit board's protective structure, further improving the anti-warping performance of the target flexible circuit board in practical applications.

[0063] In some embodiments, the step of cooling the semi-finished protective structure includes:

[0064] The protective structure semi-finished product is cooled to the second initial temperature range and maintained at that temperature for a preset time;

[0065] The protective structure semi-finished product is cooled to the next lower preset temperature range and held at that temperature for a preset time;

[0066] Repeat the steps described above to cool the semi-finished protective structure to the next lower preset temperature range and maintain it at that temperature for a preset time, until the semi-finished protective structure is cooled to the second critical temperature range and maintained at that temperature for a preset time.

[0067] In some embodiments, the step of depressurizing the protective structure semi-finished product during the cooling operation includes:

[0068] When the protective structure semi-finished product is cooled to the second initial temperature range, the compressive force applied to the protective structure semi-finished product is reduced to the second initial compressive force and maintained for a preset time;

[0069] When the protective structure semi-finished product is cooled to the next lower preset temperature range, the compressive force on the protective structure semi-finished product is reduced and maintained for a preset time.

[0070] Repeat the steps described above: when the protective structure semi-finished product is cooled to the next lower preset temperature range, reduce the compressive force on the protective structure semi-finished product and maintain it for a preset time, until the protective structure semi-finished product is cooled to the second critical temperature range.

[0071] The compressive force applied to the semi-finished protective structure is reduced to the second critical compressive force and maintained for a preset time.

[0072] After the curing operation in the above embodiments is completed, the temperature and compressive force can be gradually reduced in the manner described in this embodiment to complete the cooling operation of the protective structure semi-finished product and finally obtain the finished flexible circuit board protective structure. Since the temperature reduction and compressive force reduction during this cooling operation are also carried out in stages, stress caused by sudden temperature changes in the material can be effectively avoided, thereby ensuring the flatness and structural stability of the finished product.

[0073] In some embodiments, after the step of sequentially stacking the first flexible buffer layer, the thermal expansion coefficient control layer, and the carbon fiber layer to obtain a protective structure semi-finished product, the method for manufacturing the battery device further includes the following steps:

[0074] The semi-finished protective structure is pre-pressed.

[0075] After all the functional material layers are stacked, before the heating and curing operation, the stacked protective structure semi-finished product can be pre-pressed to ensure that the initial adhesion between the functional material layers is stable.

[0076] In some embodiments, the battery device is manufactured in a vacuum environment.

[0077] Vacuum forming technology can effectively reduce the generation of bubbles and impurities, ensure material uniformity, and make the bonding between functional material layers tighter. Attached Figure Description

[0078] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0079] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the battery device of this application;

[0080] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0081] Figure 3 This is a top view of an embodiment of the battery device of this application;

[0082] Figure 4 This is an exploded view of the flexible circuit board protection structure in one embodiment of the battery device of this application.

[0083] Figure 5 This is a schematic flowchart of an embodiment of the method for manufacturing the battery device of this application.

[0084] Explanation of icon numbers:

[0085] 100. Housing; 200. Battery cell; 300. Target flexible circuit board; 400. Flexible circuit board protection structure; 500. Flexible circuit board connector;

[0086] 1. Carbon fiber layer; 2. Thermal expansion coefficient control layer; 3. First flexible buffer layer; 4. Protective layer. The realization of the purpose, functional characteristics, and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. Detailed Implementation

[0087] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0088] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0089] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0090] Flexible printed circuit boards (FPCs) are made of flexible materials, making them lighter than traditional rigid boards. They can be bent, rolled, and folded freely, making them well-suited for complex assembly environments with limited space. As a result, they are widely used in electronic products.

[0091] However, existing flexible circuit boards are prone to warping after long-term use or when there are significant changes in temperature and humidity in the environment, which will reduce the stability of the circuit connection and even cause electrical failures.

[0092] To address the aforementioned issues and reduce warping of flexible circuit boards, thereby improving their flatness and reliability, this application provides a battery device. Please refer to [link to relevant documentation]. Figures 1 to 4 The battery device includes:

[0093] Box 100;

[0094] Battery cell 200, the battery cell 200 is housed in the casing 100;

[0095] A flexible circuit board assembly includes a target flexible circuit board 300 and a flexible circuit board protection structure 400. The target flexible circuit board 300 is electrically connected to a battery cell 200. The flexible circuit board protection structure 400 is attached to the target flexible circuit board 300 and includes:

[0096] Carbon fiber layer 1;

[0097] Thermal expansion coefficient control layer 2 is disposed on carbon fiber layer 1; thermal expansion coefficient control layer 2 is made of thermosetting polymer material or thermosetting inorganic reinforced composite material;

[0098] The first flexible buffer layer 3 is disposed on the carbon fiber layer 1; the first flexible buffer layer 3 is made of an elastic material.

[0099] The battery apparatus mentioned in the embodiments of this application may include one or more battery cell assemblies for providing voltage and capacity. A battery cell assembly may include multiple battery cells 200, which are connected in series, parallel, or mixed connections via busbars.

[0100] In some embodiments, a battery cell assembly is typically formed by arranging multiple battery cells 200; as an example, a battery cell assembly can be a battery module, which is formed by arranging and fixing multiple battery cells 200 together to form a single module. As an example, a battery module can be formed by bundling multiple battery cells 200 together with cable ties.

[0101] In some embodiments, the battery device may be a battery pack, which includes a housing 100 and one or more individual battery cells housed within the housing 100.

[0102] As an example, the battery cell assembly can be a battery module, and the battery cell assembly can be housed in the housing 100 by fixing the battery module in the housing 100.

[0103] As an example, the battery cell assembly can also be housed in the housing 100 by directly fixing multiple battery cells 200 to the housing 100.

[0104] As an example, the housing 100 may include a first housing and a second housing. The first housing and the second housing are fastened together to form a closed space inside the housing 100 to house the battery cell assembly. Here, "closed" refers to covering or closing, and can be either sealed or unsealed. The first housing may be a top cover or a bottom plate.

[0105] As an example, the housing 100 may include a top cover, a frame, and a bottom plate. The top cover and the bottom plate are respectively connected to the frame, so that the interior of the housing 100 forms an enclosed space to accommodate the battery cell assembly.

[0106] As an example, the housing 100 can be part of the vehicle's chassis structure. For instance, the top cover of the housing 100 can be at least part of the vehicle's floor, or the frame of the housing 100 can be at least part of the vehicle's crossbeams and longitudinal beams.

[0107] In some embodiments, the battery device refers to an energy storage device, which includes a housing 100, and at least one side of the housing 100 has a door. The energy storage device includes energy storage containers, energy storage cabinets, etc.

[0108] The technical solutions described in the embodiments of this application are applicable to various electrical devices that use battery cells 200 and battery devices, such as mobile phones, portable devices, laptops, electric vehicles, electric toys, power tools, vehicles, ships and spacecraft, etc. For example, spacecraft include airplanes, rockets, space shuttles and spacecraft.

[0109] In this embodiment, the carbon fiber layer 1, the thermal expansion coefficient control layer 2, and the first flexible buffer layer 3 are collectively referred to as the functional material layers of the flexible circuit board protection structure 400. The flexible circuit board protection structure 400 can be attached to the outer layer of the target flexible circuit board 300 as an additional thin sheet structure, for example, it can be attached to the back of the target flexible circuit board 300, so that the functions of each functional material layer can provide support for the target flexible circuit board 300, protect the flexible structure of the target flexible circuit board 300, and protect the components on the target flexible circuit board 300.

[0110] The thermal expansion coefficient control layer 2 and the first flexible buffer layer 3 can be disposed on the carbon fiber layer 1 by direct or indirect connection. For example, the first flexible buffer layer 3 can be directly attached to the carbon fiber layer 1, or it can be attached to the thermal expansion coefficient control layer 2 which is in contact with the carbon fiber layer 1. No limitation is made here.

[0111] Carbon fiber possesses advantages such as high strength, lightweight, and low coefficient of thermal expansion. The carbon fiber layer 1 can serve as a supporting structure for the target flexible circuit board 300, providing additional mechanical support, enhancing the overall structural strength and rigidity of the target flexible circuit board 300, and reducing the risk of deformation under mechanical impact or stress conditions. Furthermore, as a lightweight material, carbon fiber improves the mechanical properties of the target flexible circuit board 300 without significantly affecting its overall weight.

[0112] The thermal expansion coefficient control layer 2 is made of thermosetting polymer materials (such as polyimide) or thermosetting inorganic reinforcing composite materials (such as glass fiber). It has a low thermal expansion coefficient, and its thermal expansion coefficient is close to that of the target flexible circuit board 300. This can alleviate the stress caused by temperature changes, reduce warping caused by thermal stress differences, effectively reduce the warping problem of the target flexible circuit board 300, and enable the flexible circuit board protection structure 400 to maintain good flatness under high temperature and low temperature conditions.

[0113] The first flexible buffer layer 3 can be made of highly elastic materials such as polyurethane or silicone rubber. This layer provides flexible buffering when the target flexible circuit board 300 is subjected to external stress or temperature fluctuations, absorbing internal stress, reducing stress concentration, further suppressing warping of the target flexible circuit board 300, and preventing cracking or deformation of the flexible circuit board protection structure 400. The thickness of the first flexible buffer layer 3 should be adjusted according to the specific requirements of the target flexible circuit board 300 to ensure that the flexible circuit board protection structure 400 remains flat even under significant temperature fluctuations or high humidity environments.

[0114] Therefore, the battery device provided in this embodiment adopts a composite design of multiple functional material layers in its flexible circuit board protection structure 400. The rigidity of the carbon fiber layer 1, which serves as the core layer, can complement the flexibility of the thermal expansion coefficient control layer 2 and the first flexible buffer layer 3, so that the overall structure has high strength while effectively suppressing warping. By attaching the flexible circuit board protection structure 400 to the surface of the target flexible circuit board 300, the warping problem of the target flexible circuit board 300 during use can be effectively reduced, and the flatness and durability of the target flexible circuit board 300 can be improved.

[0115] In some embodiments, refer to Figures 1 to 4 The flexible circuit board protection structure 400 also includes a protective layer 4, which is disposed on the carbon fiber layer 1 and serves to form a barrier.

[0116] The protective layer 4 can be disposed on the carbon fiber layer 1 by direct or indirect connection. For example, the protective layer 4 can be directly attached to the carbon fiber layer 1, or the protective layer 4 can be attached to the first flexible buffer layer 3 that is in direct or indirect contact with the carbon fiber layer 1. No limitation is made here.

[0117] The protective layer 4 can form a barrier between the carbon fiber layer 1, the thermal expansion coefficient control layer 2, the first flexible buffer layer 3 and the outside, preventing external solid impurities, liquid impurities or gaseous impurities from entering the flexible circuit board protection structure 400, thus playing a protective role and preventing damage to the relevant functional material layers in the flexible circuit board protection structure 400, thereby improving the overall durability and reliability of the flexible circuit board protection structure 400.

[0118] In some embodiments, refer to Figures 1 to 4 The protective layer 4 includes at least one of the following: a wear-resistant coating, a moisture-proof coating, an anti-corrosion coating, and an antistatic coating.

[0119] In this embodiment, the protective layer 4 can be used to enhance the durability, wear resistance, moisture resistance, and corrosion resistance of the flexible circuit board protection structure 400. For example, if the protective layer 4 includes a moisture-proof coating, the moisture-proof coating can effectively reduce moisture penetration, keeping the entire flexible circuit board protection structure 400 dry and flat. Simultaneously, the moisture-proof coating also provides protection, preventing damage to other functional material layers in the flexible circuit board protection structure 400 due to changes in environmental humidity, thereby improving the overall durability and reliability of the flexible circuit board protection structure 400.

[0120] In some embodiments, refer to Figures 1 to 4 Carbon fiber layer 1 is attached to the target flexible circuit board 300, thermal expansion coefficient control layer 2 is superimposed on the side of carbon fiber layer 1 facing away from the target flexible circuit board 300, and first flexible buffer layer 3 is superimposed on the side of thermal expansion coefficient control layer 2 facing away from carbon fiber layer 1.

[0121] In this embodiment, the functional material layers are stacked in the following order: carbon fiber layer 1, thermal expansion coefficient control layer 2, and first flexible buffer layer 3, thus achieving optimal results. Specifically, carbon fiber layer 1 directly supports the target flexible circuit board 300, thereby improving anti-warping performance; the first flexible buffer layer 3 is disposed between thermal expansion coefficient control layer 2 and protective layer 4, which can more effectively absorb stress and reduce the probability of damage to the target flexible circuit board 300; thermal expansion coefficient control layer 2 is disposed between carbon fiber layer 1 and first flexible buffer layer 3, thus achieving optimal durability and environmental adaptability.

[0122] Based on the above-mentioned stacking order of carbon fiber layer 1, thermal expansion coefficient control layer 2, and first flexible buffer layer 3, the overall balance of the flexible circuit board protection structure 400 and the stability of the target flexible circuit board 300 in use can be ensured.

[0123] In some embodiments, refer to Figures 1 to 4 Carbon fiber layer 1 is attached to the target flexible circuit board 300, thermal expansion coefficient control layer 2 is superimposed on the side of carbon fiber layer 1 facing away from the target flexible circuit board 300, first flexible buffer layer 3 is superimposed on the side of thermal expansion coefficient control layer 2 facing away from carbon fiber layer 1, and protective layer 4 is superimposed on the side of first flexible buffer layer 3 facing away from thermal expansion coefficient control layer 2.

[0124] In this embodiment, the functional material layers are stacked in the following order: carbon fiber layer 1, thermal expansion coefficient control layer 2, first flexible buffer layer 3, and protective layer 4, thus achieving optimal results. Specifically, the carbon fiber layer 1 directly supports the target flexible circuit board 300, thereby improving its anti-warping effect; the first flexible buffer layer 3 is disposed between the thermal expansion coefficient control layer 2 and the protective layer 4, which can more effectively absorb stress and reduce the probability of damage to the target flexible circuit board 300; the thermal expansion coefficient control layer 2 is disposed between the carbon fiber layer 1 and the first flexible buffer layer 3, and the protective layer 4 is disposed on the outermost side away from the target flexible circuit board, thus achieving optimal durability and environmental adaptability.

[0125] Based on the above-mentioned stacking order of carbon fiber layer 1, thermal expansion coefficient control layer 2, first flexible buffer layer 3, and protective layer 4, the overall balance of the flexible circuit board protection structure 400 and the stability of the target flexible circuit board 300 in use can be ensured.

[0126] In some embodiments, refer to Figures 1 to 4 The flexible circuit board protection structure 400 also includes a second flexible buffer layer, which is made of an elastic material;

[0127] The second flexible buffer layer is sandwiched between the carbon fiber layer 1 and the target flexible circuit board 300, and / or, the second flexible buffer layer is sandwiched between the carbon fiber layer 1 and the thermal expansion coefficient control layer 2.

[0128] This embodiment provides additional impact resistance and shock absorption by adding a second flexible buffer layer to at least one side of the carbon fiber layer 1, which helps to cope with extreme mechanical stress, so that the target flexible circuit board 300 can be applied to environments with large vibration or impact, such as automotive electronics or industrial equipment.

[0129] The second flexible buffer layer can be made of highly elastic materials such as polyurethane and silicone rubber. The second flexible buffer layer can provide flexible buffering, absorb internal stress, and reduce stress concentration. It can further suppress the warping phenomenon of the target flexible circuit board 300 and prevent the flexible circuit board protection structure 400 from cracking or deforming.

[0130] In some embodiments, refer to Figures 1 to 4 The flexible circuit board protection structure 400 also includes a heat-resistant material layer sandwiched between the carbon fiber layer 1 and the thermal expansion coefficient control layer 2.

[0131] This embodiment enhances the thermal expansion resistance of the flexible circuit board protection structure 400 by adding a heat-resistant material layer between the carbon fiber layer 1 and the thermal expansion coefficient control layer 2. Furthermore, this refinement of the layered structure can further reduce the impact of temperature differences on the target flexible circuit board 300 and the flexible circuit board protection structure 400, helping to ensure dimensional stability under extreme temperatures. This allows the target flexible circuit board 300 to be applied in extreme temperature change scenarios involved in aerospace or special industrial equipment.

[0132] The heat-resistant material layer can be made of materials with a low coefficient of thermal expansion, such as polyimide and glass fiber, and there is no limitation here.

[0133] In some embodiments, refer to Figures 1 to 4 The flexible circuit board protection structure 400 also includes a waterproof material layer sandwiched between the thermal expansion coefficient control layer 2 and the first flexible buffer layer 3.

[0134] This embodiment improves the resistance of the flexible circuit board protection structure 400 to external water or moisture by adding a waterproof material layer between the thermal expansion coefficient control layer 2 and the first flexible buffer layer 3. It can prevent the relevant functional material layers from getting damp, ensure the stability of the target flexible circuit board 300 and the flexible circuit board protection structure 400, and make the target flexible circuit board 300 applicable in high humidity environments, such as outdoor electronic devices.

[0135] The waterproof material layer is a general term for materials with functions such as anti-penetration, anti-leakage, and anti-erosion. The waterproof material layer is mainly for protecting against liquid water, while the moisture-proof coating in the protective layer 4 is mainly for protecting against gaseous water.

[0136] In some embodiments, refer to Figures 1 to 4 The protective layer 4 includes at least two moisture-proof coatings and / or at least two corrosion-resistant coatings.

[0137] This embodiment improves resistance to moisture and chemical corrosion by setting multiple layers of moisture-proof coating and / or multiple layers of anti-corrosion coating, ensuring the stability of the target flexible circuit board 300 and the flexible circuit board protection structure 400, so that the target flexible circuit board 300 can be used in high humidity or corrosive environments.

[0138] In some embodiments, refer to Figures 1 to 4 The thickness of the first flexible buffer layer 3 is 25-35 μm.

[0139] In some embodiments, refer to Figures 1 to 4 The thickness of the second flexible buffer layer is 25–35 μm.

[0140] By controlling the thickness of the first flexible buffer layer 3 and the second flexible buffer layer to 25-35μm, the best flexible buffer performance can be obtained while achieving lightweight design and avoiding excessive overall thickness of the flexible circuit board protection structure 400.

[0141] In some embodiments, refer to Figures 1 to 4 The flexible circuit board protection structure 400 is attached to the end of the target flexible circuit board 300.

[0142] The ends of the target flexible circuit board 300 usually lack connection points, making them more prone to warping. In this embodiment, the flexible circuit board protection structure 400 is attached to the ends of the target flexible circuit board 300, which can more effectively protect the parts of the target flexible circuit board 300 that are prone to warping.

[0143] In some embodiments, refer to Figures 1 to 4 The flexible circuit board assembly also includes a flexible circuit board connector 500, which is connected to the end of the target flexible circuit board 300, and a flexible circuit board protection structure 400 is attached to the end of the target flexible circuit board 300 near the flexible circuit board connector 500.

[0144] Specifically, such as Figure 4 As shown, the target flexible circuit board 300 can be configured as a long strip extending along a preset direction to pass between multiple arrayed battery cells 200, thereby more conveniently realizing the electrical connection between the multiple battery cells 200 and the target flexible circuit board 300; the flexible circuit board connector 500 is disposed at one end of the target flexible circuit board 300, and the flexible circuit board connector 500 is electrically connected to the multiple battery cells 200 through the target flexible circuit board 300. The flexible circuit board connector 500 is used to realize the signal transmission between the target flexible circuit board 300 and other devices to complete the charging, discharging, data detection and other operations for the multiple battery cells 200.

[0145] By attaching the flexible circuit board protection structure 400 to the target flexible circuit board 300 near the flexible circuit board connector 500, the connection position between the target flexible circuit board 300 and the flexible circuit board connector 500 can be protected more effectively, thus preventing warping at the connection position and ensuring normal signal transmission.

[0146] In some embodiments, refer to Figures 1 to 4The battery device includes a housing 100, battery cells 200, and a flexible circuit board assembly. The battery cells 200 are housed within the housing 100. The flexible circuit board assembly includes a target flexible circuit board 300 and a flexible circuit board protection structure 400. The target flexible circuit board 300 is electrically connected to the battery cells 200. The flexible circuit board protection structure 400 is attached to the target flexible circuit board 300. The flexible circuit board protection structure 400 includes a carbon fiber layer 1, a thermal expansion coefficient control layer 2, and a first flexible buffer layer 3. The thermal expansion coefficient control layer 2 is disposed on the carbon fiber layer 1. The thermal expansion coefficient control layer 2 is made of a thermosetting polymer material or a material with... The flexible circuit board protection structure 400 is made of a thermosetting inorganic reinforced composite material; a first flexible buffer layer 3 is disposed on the carbon fiber layer 1; the first flexible buffer layer 3 is made of an elastic material; the flexible circuit board protection structure 400 further includes a protective layer 4, which is disposed on the carbon fiber layer 1 and serves to form a barrier; the protective layer 4 includes at least one of a wear-resistant coating, a moisture-proof coating, an anti-corrosion coating, and an antistatic coating; the carbon fiber layer 1 is attached to the target flexible circuit board 300, a thermal expansion coefficient control layer 2 is superimposed on the side of the carbon fiber layer 1 facing away from the target flexible circuit board 300, and the first flexible buffer layer 3 is superimposed on the side of the thermal expansion coefficient control layer 2 facing away from the carbon fiber layer 1. On one side of layer 1, protective layer 4 is stacked on the side of the first flexible buffer layer 3 facing away from the thermal expansion coefficient control layer 2; the flexible circuit board protection structure 400 also includes a second flexible buffer layer, which is made of an elastic material; the second flexible buffer layer is sandwiched between carbon fiber layer 1 and the target flexible circuit board 300, and / or, the second flexible buffer layer is sandwiched between carbon fiber layer 1 and thermal expansion coefficient control layer 2; the flexible circuit board protection structure 400 also includes a heat-resistant material layer, which is sandwiched between carbon fiber layer 1 and thermal expansion coefficient control layer 2; the flexible circuit board protection structure 400 also includes a waterproof material layer, which is... The protective layer 4 is sandwiched between the thermal expansion coefficient control layer 2 and the first flexible buffer layer 3; the protective layer 4 includes at least two moisture-proof coatings and / or at least two anti-corrosion coatings; the thickness of the first flexible buffer layer 3 is 25-35 μm; the thickness of the second flexible buffer layer is 25-35 μm; the flexible circuit board protection structure 400 is attached to the end of the target flexible circuit board 300; the flexible circuit board assembly also includes a flexible circuit board connector 500, which is connected to the end of the target flexible circuit board 300, and the flexible circuit board protection structure 400 is attached to the end of the target flexible circuit board 300 near the flexible circuit board connector 500.

[0147] This application also provides an electrical device; please refer to [link / reference]. Figures 1 to 4 The electrical device includes the battery device in any of the above embodiments.

[0148] The technical solutions described in the embodiments of this application are applicable to various electrical devices that use battery cells and battery devices, such as mobile phones, portable devices, laptops, electric vehicles, electric toys, power tools, vehicles, ships and spacecraft, etc. For example, spacecraft include airplanes, rockets, space shuttles and spacecraft.

[0149] Since the electrical device in this embodiment adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments. That is, the flexible circuit board protection structure 400 in the battery device adopts a composite design of multiple functional material layers. The rigidity of the carbon fiber layer 1 as the core layer can complement the flexibility of the thermal expansion coefficient control layer 2 and the first flexible buffer layer 3, so that the overall structure has high strength while effectively suppressing warping. By attaching the flexible circuit board protection structure 400 to the surface of the target flexible circuit board 300, the warping problem of the target flexible circuit board 300 during use can be effectively reduced, and the flatness and durability of the target flexible circuit board 300 can be improved.

[0150] Please see Figures 1 to 5 This application also provides a method for manufacturing a battery device, providing a housing 100, a battery cell 200, and a target flexible circuit board 300. The method for manufacturing the battery device includes the following steps:

[0151] The first flexible buffer layer 3, the thermal expansion coefficient control layer 2, and the carbon fiber layer 1 are stacked in sequence to obtain a protective structure semi-finished product.

[0152] The protective structure semi-finished product is heated, and during the heating process, the protective structure semi-finished product is pressed together;

[0153] The protective structure semi-finished product is cooled down, and the pressure of the protective structure semi-finished product is depressurized during the cooling process to obtain the flexible circuit board protective structure 400.

[0154] The flexible circuit board protection structure 400 is attached to the target flexible circuit board 300.

[0155] In this embodiment, the flexible circuit board protection structure 400 is fabricated through a thermosetting process. Specifically, the stacked first flexible buffer layer 3, thermal expansion coefficient control layer 2, and carbon fiber layer 1 are softened by high-temperature heating to a semi-solid or viscous state. Then, the softened functional material layers are bonded together under pressure through a pressing operation. Once the functional material layers are fully bonded and fixed, the temperature can be lowered to room temperature and the pressing operation can be stopped to obtain the finished flexible circuit board protection structure.

[0156] Based on the thermosetting process of this embodiment, it is possible to ensure that all functional material layers achieve optimal strength and stability after bonding, without the need for UV curing, and is more suitable for curing deep adhesive layers in multilayer structures.

[0157] In some embodiments, refer to Figures 1 to 5 The step of sequentially stacking the first flexible buffer layer 3, the thermal expansion coefficient control layer 2, and the carbon fiber layer 1 to obtain a protective structure semi-finished product includes:

[0158] The protective layer 4, the first flexible buffer layer 3, the thermal expansion coefficient control layer 2, and the carbon fiber layer 1 are stacked in sequence to obtain a semi-finished protective structure.

[0159] In this embodiment, the flexible circuit board protection structure 400 is fabricated through a thermosetting process. Specifically, the stacked protective layer 4, the first flexible buffer layer 3, the thermal expansion coefficient control layer 2, and the carbon fiber layer 1 are softened by high-temperature heating to a semi-solid or viscous state. Then, the softened functional material layers are bonded together under pressure through a pressing operation. Once the functional material layers have been fully bonded and fixed, the temperature can be lowered to room temperature and the pressing operation can be stopped to obtain the finished flexible circuit board protection structure.

[0160] The protective layer 4 can be used to enhance the durability, abrasion resistance, moisture resistance, and corrosion resistance of the flexible circuit board protection structure 400. Taking the moisture-proof coating as an example, the moisture-proof coating effectively reduces moisture penetration, keeping the entire flexible circuit board protection structure 400 dry and flat. Simultaneously, the moisture-proof coating also provides protection, preventing damage to other functional material layers in the flexible circuit board protection structure 400 due to changes in environmental humidity, thereby improving the overall durability and reliability of the flexible circuit board protection structure 400.

[0161] In some embodiments, refer to Figures 1 to 5 The steps for heating the semi-finished protective structure include:

[0162] The protective structure semi-finished product is heated to the first initial temperature range and held at that temperature for a preset time.

[0163] The protective structure semi-finished product is heated to the next higher preset temperature range and held at that temperature for a preset time.

[0164] Repeat the steps described above to heat the semi-finished protective structure to the next higher preset temperature range and maintain it at that temperature for a preset time, until the semi-finished protective structure is heated to the first critical temperature range and maintained at that temperature for a preset time.

[0165] In some embodiments, refer to Figures 1 to 5 The steps involved in pressing the protective structure semi-finished product during the heating process include:

[0166] When the protective structure semi-finished product is heated to the first initial temperature range, a first initial compressive force is applied to the protective structure semi-finished product and held for a preset time;

[0167] When the protective structure semi-finished product is heated to the next higher preset temperature range, the compressive force on the protective structure semi-finished product is increased and maintained for a preset time;

[0168] Repeat the steps described above, which involve increasing the compressive force on the semi-finished protective structure and maintaining it for a preset time when the semi-finished protective structure is heated to the next higher preset temperature range, until the semi-finished protective structure is heated to the first critical temperature range.

[0169] The compressive force applied to the semi-finished protective structure is increased to the first critical compressive force and maintained for a preset time.

[0170] This embodiment employs a gradual heating and segmented curing method to achieve bonding and fixation between the various functional material layers in the flexible circuit board protective structure 400. The gradual heating softens (but does not completely melt) the adhesive layer, transforming it from a solid to a semi-solid or viscous state, thereby promoting tight bonding between the functional material layers and reducing interlayer bubbles or voids. Segmented curing involves holding the entire laminated structure (i.e., the semi-finished protective structure) in stages during the heating process to release internal stress at each temperature stage, achieving ideal structural flatness and anti-warping performance. During each stage, the laminated structure (i.e., the semi-finished protective structure) needs to be kept still under maintained temperature and pressure to stabilize the structure and prevent internal stress from being generated during subsequent cooling.

[0171] In one exemplary embodiment, three temperature ranges are provided: 80–100°C, 120–150°C, and 150–180°C, where 80–100°C is the first initial temperature range and 150–180°C is the first critical temperature range. In the first stage, the protective structure semi-finished product is heated to 80–100°C to initially soften each functional material layer, bringing them to a semi-solid or viscous state. Then, a first initial compressive force (typically 1–5 MPa) is applied to the protective structure semi-finished product, causing the functional material layers to begin bonding under pressure, and this is maintained for a preset time. In the second stage, the temperature is gradually increased to 120–150°C to further soften or activate each functional material layer. Then, the compressive force on the protective structure semi-finished product is increased (typically 1–5 MPa) and maintained for a preset time to achieve full bonding between the functional material layers. In the third stage, the protective structure semi-finished product is heated to 150-180°C, and then the compressive force applied to the protective structure semi-finished product is increased to the first critical compressive force (usually 1-5 MPa) and maintained for a preset time to achieve the final curing of the protective structure semi-finished product.

[0172] The gradual heating process described above is carried out in stages. By maintaining each temperature range for a period of time, the temperature uniformity within the laminated structure can be improved, reducing thermal stress concentration. The staged increase in compressive force not only enhances the fluidity of each functional material layer and promotes tight bonding between them, but also works in conjunction with the staged heating process to gradually release the internal stress of each functional material layer. This staged heating and curing process effectively reduces the internal stress of the flexible circuit board protective structure 400, further improving the anti-warping performance of the target flexible circuit board 300 in practical applications.

[0173] In some embodiments, refer to Figures 1 to 5 The steps for cooling the semi-finished protective structure include:

[0174] Cool the protective structure semi-finished product to the second initial temperature range and maintain it at that temperature for a preset time;

[0175] Cool the semi-finished protective structure to the next lower preset temperature range and maintain it at that temperature for a preset time;

[0176] Repeat the steps described above to cool the semi-finished protective structure to the next lower preset temperature range and maintain it at that temperature for a preset time, until the semi-finished protective structure is cooled to the second critical temperature range and maintained at that temperature for a preset time.

[0177] In some embodiments, refer to Figures 1 to 5 The steps for depressurizing the semi-finished protective structure during the cooling process include:

[0178] When the protective structure semi-finished product is cooled to the second initial temperature range, the compressive force applied to the protective structure semi-finished product is reduced to the second initial compressive force and maintained for a preset time;

[0179] When the protective structure semi-finished product is cooled to the next lower preset temperature range, the compressive force on the protective structure semi-finished product is reduced and maintained for a preset time.

[0180] Repeat the steps described above, whereby the protective structure semi-finished product is cooled to the next lower preset temperature range, the compressive force on the protective structure semi-finished product is reduced, and the pressure is maintained for a preset time, until the protective structure semi-finished product is cooled to the second critical temperature range.

[0181] The compressive force applied to the semi-finished protective structure is reduced to the second critical compressive force and maintained for a preset time.

[0182] After the curing operation in the above embodiments is completed, the temperature and compressive force can be gradually reduced in the manner described in this embodiment to complete the cooling operation of the protective structure semi-finished product and finally obtain the finished flexible circuit board protective structure. Since the temperature reduction and compressive force reduction during this cooling operation are also carried out in stages, stress caused by sudden temperature changes in the material can be effectively avoided, thereby ensuring the flatness and structural stability of the finished product.

[0183] The specific operation process for phased cooling and reducing compressive force can be reversed by referring to the specific operation process for phased heating and increasing compressive force in the above embodiment, and will not be repeated here.

[0184] In some embodiments, refer to Figures 1 to 5 After the step of stacking the first flexible buffer layer 3, the thermal expansion coefficient control layer 2, and the carbon fiber layer 1 in sequence to obtain a protective structure semi-finished product, the battery device manufacturing method further includes the following steps:

[0185] Pre-pressing operation is performed on the semi-finished protective structure.

[0186] After all the functional material layers are stacked, before the heating and curing operation, the stacked protective structure semi-finished product can be pre-pressed to ensure that the initial adhesion between the functional material layers is stable.

[0187] In some embodiments, refer to Figures 1 to 5 The battery device is manufactured in a vacuum environment. Vacuum forming effectively reduces the generation of bubbles and impurities, ensures material uniformity, and makes the bonding between functional material layers tighter.

[0188] In some embodiments, refer to Figures 1 to 5 The battery device is manufactured in a vacuum environment, and the manufacturing method includes the following steps:

[0189] The protective layer 4, the first flexible buffer layer 3, the thermal expansion coefficient control layer 2, and the carbon fiber layer 1 are stacked sequentially to obtain a semi-finished protective structure.

[0190] Pre-pressing operation is performed on the semi-finished protective structure;

[0191] The protective structure semi-finished product is heated to the first initial temperature range and held at that temperature for a preset time.

[0192] When the protective structure semi-finished product is heated to the first initial temperature range, a first initial compressive force is applied to the protective structure semi-finished product and held for a preset time;

[0193] The protective structure semi-finished product is heated to the next higher preset temperature range and held at that temperature for a preset time.

[0194] When the protective structure semi-finished product is heated to the next higher preset temperature range, the compressive force on the protective structure semi-finished product is increased and maintained for a preset time;

[0195] Repeat the steps described above to heat the semi-finished protective structure to the next higher preset temperature range and hold it at that temperature for a preset time, until the semi-finished protective structure is heated to the first critical temperature range and held at that temperature for a preset time;

[0196] Repeat the steps described above, which involve increasing the compressive force on the semi-finished protective structure and maintaining it for a preset time when the semi-finished protective structure is heated to the next higher preset temperature range, until the semi-finished protective structure is heated to the first critical temperature range.

[0197] The compressive force applied to the semi-finished protective structure is increased to the first critical compressive force and maintained for a preset time;

[0198] Cool the protective structure semi-finished product to the second initial temperature range and maintain it at that temperature for a preset time;

[0199] When the protective structure semi-finished product is cooled to the second initial temperature range, the compressive force applied to the protective structure semi-finished product is reduced to the second initial compressive force and maintained for a preset time;

[0200] Cool the semi-finished protective structure to the next lower preset temperature range and maintain it at that temperature for a preset time;

[0201] When the protective structure semi-finished product is cooled to the next lower preset temperature range, the compressive force on the protective structure semi-finished product is reduced and maintained for a preset time.

[0202] Repeat the above steps of cooling the semi-finished protective structure to the next lower preset temperature range and maintaining it at that temperature for a preset time until the semi-finished protective structure is cooled to the second critical temperature range and maintained at that temperature for a preset time.

[0203] Repeat the steps described above, whereby the protective structure semi-finished product is cooled to the next lower preset temperature range, the compressive force on the protective structure semi-finished product is reduced, and the pressure is maintained for a preset time, until the protective structure semi-finished product is cooled to the second critical temperature range.

[0204] The compressive force applied to the semi-finished protective structure is reduced to the second critical compressive force and maintained for a preset time.

[0205] The flexible circuit board protection structure 400 is attached to the target flexible circuit board 300.

[0206] It should be noted that other contents of the battery device, power-consuming device and battery device manufacturing method disclosed in this application can be found in the prior art, and will not be repeated here.

[0207] The above are merely optional embodiments of this application and do not limit the patent scope of this application. All equivalent structural transformations made based on the technical concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A battery device, characterized in that, The battery device includes: Box; A battery cell, wherein the battery cell is housed within the casing; A flexible circuit board assembly, comprising a target flexible circuit board and a flexible circuit board protection structure, wherein the target flexible circuit board is electrically connected to the battery cell, and the flexible circuit board protection structure is attached to the target flexible circuit board, and the flexible circuit board protection structure includes: carbon fiber layer; A thermal expansion coefficient control layer is disposed on the carbon fiber layer; the thermal expansion coefficient control layer is made of a thermosetting polymer material or a thermosetting inorganic reinforced composite material. A first flexible buffer layer is disposed on the carbon fiber layer; the first flexible buffer layer is made of an elastic material.

2. The battery device according to claim 1, characterized in that, The flexible circuit board protection structure also includes a protective layer disposed on the carbon fiber layer, which serves to form a barrier.

3. The battery device according to claim 2, characterized in that, The protective layer includes at least one of the following: wear-resistant coating, moisture-proof coating, corrosion-resistant coating, and antistatic coating.

4. The battery device according to claim 1, characterized in that, The carbon fiber layer is attached to the target flexible circuit board, the thermal expansion coefficient control layer is superimposed on the side of the carbon fiber layer facing away from the target flexible circuit board, and the first flexible buffer layer is superimposed on the side of the thermal expansion coefficient control layer facing away from the carbon fiber layer.

5. The battery device according to claim 2, characterized in that, The carbon fiber layer is attached to the target flexible circuit board, the thermal expansion coefficient control layer is superimposed on the side of the carbon fiber layer facing away from the target flexible circuit board, the first flexible buffer layer is superimposed on the side of the thermal expansion coefficient control layer facing away from the carbon fiber layer, and the protective layer is superimposed on the side of the first flexible buffer layer facing away from the thermal expansion coefficient control layer.

6. The battery device according to claim 4, characterized in that, The flexible circuit board protection structure also includes a second flexible buffer layer, which is made of an elastic material; The second flexible buffer layer is sandwiched between the carbon fiber layer and the target flexible circuit board, and / or the second flexible buffer layer is sandwiched between the carbon fiber layer and the thermal expansion coefficient control layer.

7. The battery device according to claim 4, characterized in that, The flexible circuit board protection structure also includes a heat-resistant material layer sandwiched between the carbon fiber layer and the thermal expansion coefficient control layer.

8. The battery device according to claim 4, characterized in that, The flexible circuit board protection structure also includes a waterproof material layer sandwiched between the thermal expansion coefficient control layer and the first flexible buffer layer.

9. The battery device according to claim 3, characterized in that, The protective layer comprises at least two layers of the moisture-proof coating and / or at least two layers of the anti-corrosion coating.

10. The battery device according to claim 1, characterized in that, The first flexible buffer layer is made of polyurethane or silicone rubber; And / or, the thickness of the first flexible buffer layer is 25 to 35 μm.

11. The battery device according to claim 6, characterized in that, The second flexible buffer layer is made of polyurethane or silicone rubber; And / or, the thickness of the second flexible buffer layer is 25–35 μm.

12. The battery device according to claim 1, characterized in that, The flexible circuit board protection structure is attached to the end of the target flexible circuit board.

13. The battery device according to claim 12, characterized in that, The flexible circuit board assembly also includes a flexible circuit board connector, which is connected to an end of the target flexible circuit board, and the flexible circuit board protective structure is attached to the end of the target flexible circuit board near the flexible circuit board connector.

14. An electrical appliance, characterized in that, The electrical device includes a battery device as described in any one of claims 1 to 13.

15. A method for manufacturing a battery device, characterized in that, The battery device comprises a housing, individual battery cells, and a target flexible circuit board; the method for manufacturing the battery device includes the following steps: The first flexible buffer layer, the thermal expansion coefficient control layer, and the carbon fiber layer are stacked in sequence to obtain a semi-finished protective structure. The protective structure semi-finished product is heated, and during the heating process, the protective structure semi-finished product is pressed together; The semi-finished protective structure is cooled down, and during the cooling process, the semi-finished protective structure is depressurized to obtain a flexible circuit board protective structure. The flexible circuit board protection structure is attached to the target flexible circuit board.

16. The method for manufacturing the battery device according to claim 15, characterized in that, The step of sequentially stacking the first flexible buffer layer, the thermal expansion coefficient control layer, and the carbon fiber layer to obtain a protective structure semi-finished product includes: The protective layer, the first flexible buffer layer, the thermal expansion coefficient control layer, and the carbon fiber layer are stacked sequentially to obtain the semi-finished protective structure.

17. The method for manufacturing the battery device according to claim 15, characterized in that, The step of heating the semi-finished protective structure includes: The protective structure semi-finished product is heated to a first initial temperature range and held at that temperature for a preset time. The semi-finished protective structure is heated to the next higher preset temperature range and held at that temperature for a preset time. Repeat the steps described above to heat the semi-finished protective structure to the next higher preset temperature range and maintain it at that temperature for a preset time, until the semi-finished protective structure is heated to the first critical temperature range and maintained at that temperature for a preset time.

18. The method for manufacturing the battery device according to claim 17, characterized in that, The step of pressing the semi-finished protective structure during the heating process includes: When the protective structure semi-finished product is heated to the first initial temperature range, a first initial compressive force is applied to the protective structure semi-finished product and held for a preset time; When the protective structure semi-finished product is heated to the next higher preset temperature range, the compressive force on the protective structure semi-finished product is increased and maintained for a preset time; Repeat the steps described above, which involve increasing the compressive force on the semi-finished protective structure and maintaining it for a preset time when the semi-finished protective structure is heated to the next higher preset temperature range, until the semi-finished protective structure is heated to the first critical temperature range. The compressive force applied to the semi-finished protective structure is increased to the first critical compressive force and maintained for a preset time.

19. The method for manufacturing the battery device according to claim 15, characterized in that, The step of cooling the semi-finished protective structure includes: The protective structure semi-finished product is cooled to the second initial temperature range and maintained at that temperature for a preset time; The protective structure semi-finished product is cooled to the next lower preset temperature range and held at that temperature for a preset time; Repeat the steps described above to cool the semi-finished protective structure to the next lower preset temperature range and maintain it at that temperature for a preset time, until the semi-finished protective structure is cooled to the second critical temperature range and maintained at that temperature for a preset time.

20. The method for manufacturing the battery device according to claim 19, characterized in that, The step of depressurizing the semi-finished protective structure during the cooling process includes: When the protective structure semi-finished product is cooled to the second initial temperature range, the compressive force applied to the protective structure semi-finished product is reduced to the second initial compressive force and maintained for a preset time; When the protective structure semi-finished product is cooled to the next lower preset temperature range, the compressive force on the protective structure semi-finished product is reduced and maintained for a preset time. Repeat the steps described above: when the protective structure semi-finished product is cooled to the next lower preset temperature range, reduce the compressive force on the protective structure semi-finished product and maintain it for a preset time, until the protective structure semi-finished product is cooled to the second critical temperature range. The compressive force applied to the semi-finished protective structure is reduced to the second critical compressive force and maintained for a preset time.

21. The method for manufacturing the battery device according to claim 15, characterized in that, After the step of sequentially stacking the first flexible buffer layer, the thermal expansion coefficient control layer, and the carbon fiber layer to obtain a protective structure semi-finished product, the method for manufacturing the battery device further includes the following steps: The protective structure semi-finished product is pre-pressed.

22. The method for manufacturing the battery device according to claim 15, characterized in that, The battery device is manufactured in a vacuum environment.

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