An antenna array, device, and wireless communication equipment
By regularly arranging the feed positions and irregularly arranging the phase centers in the antenna array, combined with feed lines of equal length and power divider/combiner, the problem of poor beamforming effect of existing antenna arrays in broadband conditions is solved, thereby improving gain and communication performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2020-09-28
- Publication Date
- 2026-06-02
AI Technical Summary
Existing antenna arrays have poor beamforming performance in broadband applications. Inconsistent signal transmission delays lead to phase inhomogeneity, affecting broadband performance. Furthermore, the irregular placement of RFIC chips results in uneven heat distribution and differences in thermal expansion of the feed lines, which degrades the performance of the antenna array.
By regularly arranging the RFIC chip and the subarray feed positions of the antenna array, the length of the feed lines is ensured to be basically equal. The phase center is arranged irregularly to improve the grating lobe suppression capability and gain. At the same time, an equal-length power divider and combiner is designed to connect with the RF integrated circuit chip to reduce the time delay difference.
Effective beamforming under broadband conditions was achieved, which improved the gain and communication capacity of the antenna array, reduced interference to external systems, and optimized the thermal management of the RFIC chip.
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Figure CN122136646A_ABST
Abstract
Description
[0001] This application is a divisional application. The original application has the application number 202080105656.3 and the original application date is September 28, 2020. The entire contents of the original application are incorporated herein by reference. Technical Field
[0002] This application relates to the field of antenna technology, and in particular to an antenna array, device, and wireless communication equipment. Background Technology
[0003] An antenna array is formed by arranging multiple radiating elements in an array. Each radiating element can also be called an array element.
[0004] Phase shifters are generally used to control the phase of radiating elements. When there are many radiating elements in an antenna array, multiple phase shifters are required. To reduce the number of phase shifters and simplify the control circuit, several radiating elements usually share a single phase shifter. Multiple radiating elements sharing a single phase shifter form a subarray.
[0005] Figure 1 The image shows an antenna array where each black dot represents a radiating element. The array comprises 24 (along the X-axis) × 32 (along the Y-axis) radiating elements. Each column of the array along the Y-axis has eight subarrays, including 1-to-2, 1-to-4, 1-to-6, and 1-to-8 subarrays. Specifically, a 1-to-2 subarray represents one phase shifter controlling two radiating elements, a 1-to-4 subarray represents one phase shifter controlling four radiating elements, a 1-to-6 subarray represents one phase shifter controlling six radiating elements, and a 1-to-8 subarray represents one phase shifter controlling eight radiating elements.
[0006] Figure 2 The following is shown Figure 1 A schematic diagram showing the connection between the subarrays of an antenna array and a radio frequency integrated circuit (RFIC) chip. For example, Figure 2 The diagram shows a first RFIC chip 01, a second RFIC chip 02, a third RFIC chip 03, and a fourth RFIC chip 04, each connected to a corresponding subarray. Each subarray has a power supply position M connected to the RFIC chip. It should be noted that... Figure 1 The antenna array shown can also connect to more radio frequency integrated circuit chips. Figure 2 The number and location of the chips shown are for illustrative purposes only.
[0007] Taking the first RFIC chip as an example, Figure 3In the first RFIC chip 01, there are eight RF transceiver channels, each connected one-to-one to one of the eight subarrays via feed lines. For example, as... Figure 3 As shown, an RF transceiver channel in the first RFIC chip is connected to the feed position M of a subarray in the antenna array via feed line 05. The connection relationships between the second RFIC chip 02, the third RFIC chip 03, and the fourth RFIC chip 04 and their corresponding feed positions in the subarray are as follows: Figure 3 Similar to the example shown.
[0008] Depend on Figure 3 It can be seen that the lengths of the feed lines connecting the RFIC chip to the feed positions of multiple subarrays are inconsistent; some feed lines are long, and some are short. Because of the inconsistent lengths of the feed lines connected to the same RFIC chip, the signal transmission delays also differ, resulting in different phases of the signals from the multiple subarrays. This prevents the antenna array from achieving beamforming and degrades its broadband performance. Existing phase calibration compensation can only guarantee narrowband calibration results; in broadband cases, the beamforming effect is poor. Furthermore, as... Figure 2 As shown, the irregular arrangement of the various RFIC chips results in inconsistent power splitter lines connecting the power splitter and combiner to each RFIC chip. This complicates the design of the power splitter lines and further degrades the broadband performance of the antenna array. Furthermore, due to... Figure 2 The irregular arrangement of the multiple RFIC chips shown will result in uneven heat distribution from the RFIC chips in the antenna module of the antenna array. This will cause temperature differences at different locations of the antenna module, as well as differences in the thermal expansion of the feed lines at different locations. The difference in the thermal expansion of the feed lines will also affect the phase of the signal in the subarray. Summary of the Invention
[0009] Embodiments of this application provide an antenna array, apparatus, and wireless communication device, which aim to improve the broadband performance of the antenna array by making the feed lines between the RFIC chip and the feed positions of the subarrays of the antenna array substantially equal in length.
[0010] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, this application provides an antenna array comprising: Multiple subarrays are provided, each subarray having a feed position and at least one radiating element. The multiple subarrays are arranged along a first direction and a second direction, the first direction being perpendicular to the second direction. Along the first direction, the feed positions of the multiple subarrays are located on the same straight line, and along the second direction, the feed positions of the multiple subarrays are located on the same straight line. Along the first direction, the subarrays to which the feed positions located on the same straight line belong are in the same row, and along the second direction, the subarrays to which the feed positions located on the same straight line belong are in the same column. Each subarray has a phase center, and the phase centers of the subarrays in at least one row of the antenna array are not on the same straight line, and / or, the phase centers of the subarrays in at least one column of the antenna array are not on the same straight line.
[0011] The antenna array provided in this application has its feed positions for any row of subarrays and any column of subarrays located on the same straight line. This results in a regular arrangement of feed positions. When a radio frequency integrated circuit chip with at least two radio frequency transceiver channels is connected one-to-one to the feed positions of at least two subarrays via at least two feed wires, the lengths of each pair of feed wires are approximately equal. This avoids the phenomenon where multiple feed wires connected to the same radio frequency integrated circuit chip have different lengths, leading to different phases in multiple subarrays.
[0012] Furthermore, since multiple phase centers in at least one row are not located on the same straight line, and / or multiple phase centers in at least one column are not located on the same straight line, the phase centers of the antenna array are irregularly arranged. This irregular arrangement of phase centers may cause the energy of the grating lobes of the antenna array to be dispersed at multiple angles, which can effectively improve the suppression of grating lobes and thus improve the gain of the antenna array.
[0013] Therefore, the antenna array provided in this application embodiment can effectively improve the suppression of grating lobes and increase the gain of the antenna array, while also realizing the equal-length interconnection between the RFIC chip and the subarray.
[0014] In one possible implementation of the first aspect, the antenna array includes N subarrays, each of which has an equal number of radiating elements. The feed position of at least one of the N subarrays differs from the feed positions of the other subarrays, where N is an integer greater than or equal to 2. By setting different feed positions for the equal number of subarrays, a regular arrangement of the feed positions can be achieved.
[0015] In one possible implementation of the first aspect, the antenna array includes at least two types of similar subarrays, where each subarray has an equal number of radiating elements. That is, the antenna array may include subarrays with two radiating elements, or subarrays with three radiating elements, or subarrays with more than one radiating element.
[0016] In one possible implementation of the first aspect, the antenna array includes at least one first subarray, on which at least two radiating elements are arranged in a straight line; the feed position of the first subarray is located between two adjacent radiating elements; or, the feed position of the first subarray is located on the side of the radiating element at the end of the first subarray that is away from the other radiating elements. That is, when the subarray has at least two radiating elements, the feed position can also have multiple possibilities, and in specific implementation, it can be selected according to the layout of the feed positions of the entire antenna array.
[0017] In one possible implementation of the first aspect, the antenna array includes at least one second subarray with a radiating element arranged on it, and the feed position of the second subframe is located beside the radiating element.
[0018] In one possible implementation of the first aspect, the spacing between the feed positions of every two adjacent subarrays is equal along the first direction, and / or, the spacing between the feed positions of every two adjacent subarrays is equal along the second direction. This facilitates the layout of the feed units.
[0019] In one possible implementation of the first aspect, the antenna array includes dummy elements, which are unfed radiating elements. To ensure that the feed positions of the antenna array are arranged regularly, in some cases, it is necessary to form a grid between two adjacent subarrays that does not require radiating elements. By setting dummy elements within this grid, the radiation patterns of each subarray can be kept consistent, thereby improving the communication capacity of the wireless communication device.
[0020] In the possible implementation of the first aspect, the radiating element is a microstrip patch antenna, a symmetrical dipole, an open waveguide antenna, or a helical antenna, etc.
[0021] In the first possible implementation, the radiating element can be either dual-polarized or single-polarized.
[0022] In the possible implementation of the first aspect, the polarization mode can be ±45° polarization, vertical or horizontal polarization, or right-hand or left-hand circular polarization.
[0023] In the first possible implementation, the feed lines of the subarray are T-type power dividers, Wilkinson power dividers, or series-fed power dividers.
[0024] Secondly, this application provides an apparatus comprising: The antenna array in the first aspect or any implementation thereof; Feeder cable; The circuit board and feed lines are used to feed the subarrays in the antenna array. The antenna array and feed lines are mounted on the circuit board.
[0025] The device provided in this application includes an antenna array in any implementation of the first aspect. Since the feed positions of the antenna array are arranged in a regular manner, when a multi-channel radio frequency integrated circuit chip is connected one-to-one with the feed positions of multiple subarrays through multiple feed wires, the lengths of every two feed wires are basically equal, avoiding the phenomenon that multiple feed wires connected to the same radio frequency integrated circuit chip have different lengths, so that the phases of multiple subarrays are different.
[0026] In addition, since the phase centers of the subarrays of this antenna array are irregularly arranged, the energy of the grating lobes of the antenna array is dispersed to multiple angles, which can effectively improve the suppression of grating lobes, reduce interference to external systems, and also improve the antenna gain to a certain extent.
[0027] In a possible implementation of the second aspect, the device further includes at least one radio frequency integrated circuit chip, which is disposed on a circuit carrier board. The radio frequency integrated circuit chip includes at least two radio frequency transceiver channels, which are used to feed at least two subarrays in the antenna array through feed lines, and the radio frequency transceiver channels are connected one-to-one with the subarrays.
[0028] In a possible implementation of the second aspect, the antenna module includes a power divider / combiner and at least two radio frequency integrated circuit (RFIC) chips. The power divider / combiner is connected to at least two RFIC chips via at least two power dividing lines of equal length, with each power dividing line connected to an RFIC chip one-to-one. This equal-length power dividing line design between the power divider / combiner and the RFIC chips further reduces the time delay difference between the power divider / combiner and different subarrays, thereby further improving broadband performance.
[0029] In a possible implementation of the second aspect, the circuit carrier board is a packaged substrate; the antenna module also includes a printed circuit board, the packaged substrate is disposed on and connected to the printed circuit board, and the power divider / combiner is disposed on the printed circuit board. Typically, the printed circuit board also houses a digital-to-analog converter module and a digital signal processing module, the digital signal processing module is connected to the digital-to-analog converter module, and the digital-to-analog converter module is connected to the power divider / combiner. By placing the antenna array on the packaged substrate and the RF integrated circuit chip on the packaged substrate, and then packaging them as a whole and connecting them to the printed circuit board, an antenna-in-package (AIP) is formed.
[0030] In a possible implementation of the second aspect, the circuit carrier board is a printed circuit board (PCB); the power divider / combiner is mounted on the PCB. Generally, the PCB also houses a digital-to-analog converter (DAC) module and a digital signal processing module, with the DAC module connected to the DAC module and the DAC module connected to the power divider / combiner. The antenna array, RF integrated circuit chip, DAC module, and digital signal processing module are all mounted on the PCB to form an antenna-on-board (AOB).
[0031] In a second possible implementation, the device further includes a heat sink capable of dissipating heat from the radio frequency integrated circuit chip. Dissipating heat from the radio frequency integrated circuit chip via the heat sink improves its performance.
[0032] Thirdly, this application provides an apparatus comprising: The antenna array described in the first aspect above; Feeder cable; At least one radio frequency integrated circuit chip, an antenna array and a feed line are disposed on the package layer of the radio frequency integrated circuit chip, the radio frequency integrated circuit chip includes at least two radio frequency transceiver channels, the at least two radio frequency transceiver channels are used to feed at least two subarrays in the antenna array through the feed line respectively, and the radio frequency transceiver channels are connected one-to-one with the subarrays.
[0033] In the device provided in this application embodiment, the feed line and antenna array are disposed on the radio frequency integrated circuit chip, and the antenna array is the antenna array in any implementation of the first aspect. Therefore, the antenna module provided in this application embodiment and the antenna array of the above technical solution can solve the same technical problem and achieve the same expected effect.
[0034] In a third possible implementation, the device includes a power divider / combiner and at least two radio frequency (RF) integrated circuit (IC) chips. The power divider / combiner is connected to at least two RF IC chips via at least two power dividing lines of equal length, with each power dividing line connected to an RF IC chip in a one-to-one manner. This equal-length power dividing line design between the power divider / combiner and the RF IC chips further reduces the time delay difference between the power divider / combiner and different subarrays, thereby further improving broadband performance.
[0035] In a third possible implementation, the device also includes a printed circuit board (PCB), on which the radio frequency integrated circuit chip and the power divider / combiner are mounted. Typically, the PCB also houses a digital-to-analog converter (DAC) module and a digital signal processing module. The DAC module is connected to the DAC module, and the DAC module is connected to the power divider / combiner. In other words, the antenna array is directly mounted on the radio frequency integrated circuit chip and connected to the PCB to form an antenna-on-chip (AOC).
[0036] Fourthly, this application also provides a wireless communication device, including an antenna array as described in any implementation of the first aspect, or a device as described in any implementation of the second or third aspect.
[0037] The wireless communication device provided in this application includes the antenna array provided in the above embodiments. Therefore, the wireless communication device provided in this application and the antenna array of the above technical solutions can solve the same technical problems and achieve the same expected results. Attached Figure Description
[0038] Figure 1 This is a schematic diagram of the structure of an antenna array in the prior art; Figure 2 for Figure 1 A schematic diagram showing the connection between the subarray of the antenna array and the RFIC chip; Figure 3 for Figure 2 A schematic diagram showing the connection relationship between the first RFIC chip and the power supply location; Figure 4 This is a schematic diagram of the antenna module in an embodiment of this application; Figure 5 This is a schematic diagram of the antenna module in an embodiment of this application; Figure 6 This is a schematic diagram of the antenna module in an embodiment of this application; Figure 7 This is a schematic diagram of the antenna array structure according to an embodiment of this application; Figure 8 for Figure 7 A diagram showing the layout of the feed points for the antenna array; Figure 9 for Figure 8 A schematic diagram showing the connection relationship between the partial feed positions of the antenna array and the RFIC chip; Figure 10 This is a schematic diagram showing the connection relationship between an RFIC chip and its power supply location. Figure 11 A schematic diagram showing the connection relationship between multiple RFIC chips and a power divider / combiner; Figure 12 for Figure 7 The arrangement diagram of the phase centers of the antenna array; Figure 13 This is a schematic diagram of the antenna array structure according to an embodiment of this application; Figure 14 for Figure 13 A diagram showing the layout of the feed points for the antenna array; Figure 15 for Figure 14 A schematic diagram showing the connection relationship between the partial feed positions of the antenna array and the RFIC chip; Figure 16 This is a schematic diagram showing the connection relationship between an RFIC chip and its power supply location. Figure 17 A schematic diagram showing the connection relationship between multiple RFIC chips and a power divider / combiner; Figure 18 for Figure 13 The arrangement diagram of the phase centers of the antenna array; Figure 19 This is a comparison chart of the grating lobe suppression curves of the antenna array of the present application embodiment and existing antenna arrays; Figure 20 This is a comparison chart of the vertical scan envelope gain curves of the antenna array of the present application embodiment and existing antenna arrays; Figure 21 This is a schematic diagram showing the layout of some subarrays of the antenna array in an embodiment of this application; Figure 22 This is a schematic diagram showing the layout of the feed positions of a subarray, including a radiating element, in an antenna array according to an embodiment of this application. Figure 23a This is a schematic diagram showing the layout of the feed positions of a subarray comprising two radiating elements in an antenna array according to an embodiment of this application. Figure 23b This is a schematic diagram showing the layout of the feed positions of a subarray comprising two radiating elements in an antenna array according to an embodiment of this application. Figure 23c This is a schematic diagram showing the layout of the feed positions of a subarray comprising two radiating elements in an antenna array according to an embodiment of this application. Figure 24a This is a schematic diagram showing the layout of the feed positions of a subarray comprising three radiating elements in an antenna array according to an embodiment of this application. Figure 24b This is a schematic diagram showing the layout of the feed positions of a subarray comprising three radiating elements in an antenna array according to an embodiment of this application. Figure 24c This is a schematic diagram showing the layout of the feed positions of a subarray comprising three radiating elements in an antenna array according to an embodiment of this application. Figure 24dThis is a schematic diagram showing the layout of the feed positions of a subarray comprising three radiating elements in an antenna array according to an embodiment of this application. Figure 25 This is a schematic diagram of the antenna array structure according to an embodiment of this application; Figure 26 This is a schematic diagram of the antenna array structure according to an embodiment of this application.
[0039] Figure label: 01-First RFIC chip; 02-Second RFIC chip; 03-Third RFIC chip; 04-Fourth RFIC chip; 05-Feed line; 1-Antenna array; 1A, 1B-Subarray; 11-Radiating element; 111-First radiating element; 112-Second radiating element; 113-Third radiating element; M-Feed position; N-Phase center; 2-Dummy element; 3-RFIC chip; 31-First RFIC chip; 32-Second RFIC chip; 33-Third RFIC chip; 34-Fourth RFIC chip; 35-Fifth RFIC chip; 36-Sixth RFIC chip; 37-Seventh RFIC chip; 38-Eighth RFIC chip; 4-Circuit carrier board; 5-Power divider / combiner; 6-Printed circuit board; 7-Channel; 8-Heat sink; 9-Power divider line; 10-Connection structure. Detailed Implementation
[0040] In wireless communication devices, such as wireless base stations, the millimeter-wave band has been incorporated into 5G (5th Generation Mobile Networks) due to the increasing data communication rates. This places higher demands on antenna array performance, in addition to meeting the protocol requirements for coexistence between 5G high-frequency base stations and satellites. For example, grating lob suppression needs further improvement, and the scanning pattern gain envelope of the antenna array needs to be optimized.
[0041] In the aforementioned wireless communication devices, antenna arrays can be implemented in various ways. For example, Figure 4 , Figure 5 and Figure 6 These are three different load-bearing methods.
[0042] Combination Figure 4 The antenna array 1 is mounted on the circuit carrier board 4, and the feed line 05 is also mounted on the circuit carrier board 4. The feed line 05 can be a metal trace laid on the circuit carrier board. The circuit carrier board 4 in this structure is a package substrate. For example, the package substrate can be a redistribution layer (RDL) or a coreless substrate without a core layer.
[0043] The RFIC chip 3 is connected to the package substrate containing the antenna array 1 and the feed line 05 via the connection structure 10. The package substrate containing the RFIC chip 3 is then connected to the printed circuit board (PCB) 6 via the connection structure 10. This structure can be called an antenna-in-package (AIP).
[0044] Combination Figure 5 Antenna array 1 and feed line 05 are both mounted on RFIC chip 3. RFIC chip 3, which has antenna array 1 and feed line 05 mounted on PCB6 via a connection structure, is also mounted on PCB6. This structure can be called an antenna-on-chip (AOC).
[0045] Combination Figure 6 Antenna array 1 is mounted on a circuit board, and feed line 05 is also mounted on the circuit board. The circuit board in this structure is PCB 6. RFIC chip 3 is connected to PCB 6 through a connection structure. This structure can be called an antenna-on-board (AOB).
[0046] The connection structure 10 described above can be a ball grid array (BGA), but other connection structures can also be selected.
[0047] In the aforementioned AIP, AOC, or AOB configurations, a heatsink 8 is also included. In the AIP, the heatsink 8 is positioned close to the PCB 6 and the RFIC chip 3 to dissipate the heat generated by the PCB 6 and the RFIC chip 3. In the AOC configuration, the heatsink 8 is positioned close to the PCB 6, and the PCB 6 has a through-hole 7, which also helps to dissipate heat from the RFIC chip 3. In the AOB configuration, the heatsink 8 is positioned close to the RFIC chip 3. This application does not impose any special limitations on the structure or arrangement of the heatsink.
[0048] In the aforementioned AIP, AOC, or AOB configurations, PCB6 houses a digital-to-analog converter (DAC), a digital signal processing (DSC) module, and a power splitter / combiner. The DSC module is connected to the DAC module, which in turn is connected to the power splitter / combiner. The power splitter / combiner is connected to the RFIC chip via power splitting lines, which can also be metal traces. In alternative implementations, metal traces on PCB6 can be used to connect the DSC module and the DAC module, as well as to connect the DAC module and the power splitter / combiner.
[0049] The antenna arrays described above can be applied to both analog active phased arrays and digital active phased arrays.
[0050] The above only provides three devices for carrying antenna arrays. In addition, antenna arrays can also be housed in other devices. This application does not impose any special limitations on these devices.
[0051] The antenna array involved in this application includes multiple subarrays, each subarray including at least one radiating element, and the multiple subarrays are arranged along a first direction and a second direction, the first direction being perpendicular to the second direction. That is, the multiple subarrays are arranged horizontally and vertically to form an antenna array.
[0052] In the three structures described above, a power divider / combiner is connected to at least two RFIC chips 3 via at least two power divider lines. Furthermore, since an RFIC chip 3 includes at least two radio frequency transceiver channels, meaning it has at least two radio frequency transceiver ports, an RFIC chip 3 with at least two radio frequency transceiver channels supplies power to at least two subarrays one-to-one via at least two feed lines, enabling the subarrays to transmit and receive signals.
[0053] This can also be understood as follows: the transmission path from the power divider to the subarray includes not only the power dividing path but also the power feeding path. If the transmission paths from one power divider to multiple subarrays are different, the time delay will be different, which will lead to different phases of multiple subarrays. This will degrade the broadband performance of the antenna array.
[0054] To further reduce the time delay difference between different subarrays and further improve broadband performance, this application provides an antenna array that can be applied in the aforementioned AIP, AOC, or AOB, and of course, it can also be applied in other devices that include antenna arrays.
[0055] The antenna array 1 will be explained in detail below.
[0056] Figure 7 The diagram shown is a structural diagram of an antenna array 1, in which radiating elements 11 form multiple subarrays (such as...). Figure 7 In the diagram, 1A represents a subarray, and multiple subarrays form an antenna array.
[0057] like Figure 7 Subarray 1A comprises two radiating elements. Subarrays containing an equal number of radiating elements can be of the same type. In fact, the number of radiating elements in a subarray can be other than, for example... Figure 13 The subarray 1B shown includes three radiating elements. Subarrays including any number of radiating elements are within the scope of protection of this application.
[0058] Each subarray has a feed position M. For example, if the antenna array includes at least three subarrays, then the feed positions M also include at least three. Figure 8 As shown, It should be noted that this application does not limit the polarization mode of the radiating element, such as... Figure 7 The image shows a dual-polarized antenna with ±45° polarization. It can also be a single-polarized antenna, with horizontal or vertical polarization, and left-hand or right-hand circular polarization.
[0059] The arrangement of the feed positions M in the antenna array provided in this application embodiment satisfies the following conditions: Along the first direction X, the feed positions M of the multiple subarrays are located on at least one straight line, and along the second direction Y, the feed positions M of the multiple subarrays are also located on at least one straight line.
[0060] Along the first direction X, multiple subarrays belonging to multiple feed positions M located on the same straight line are in the same row; along the second direction Y, multiple subarrays belonging to multiple feed positions M located on the same straight line are in the same column.
[0061] In this way, combined Figure 8 The multiple feed positions of each row of subarrays are arranged along a straight line, and the multiple feed positions of each column of subarrays are also arranged along a straight line. This makes the feed positions of the antenna array regularly arranged.
[0062] Furthermore, to facilitate the layout of the power supply positions, the spacing between any two adjacent power supply positions in each row is equal. Figure 8 It can be seen that the spacing between any two adjacent feed positions in the first row of the subarray is d, and the spacing between any two adjacent feed positions in the third row of the subarray is also d. Alternatively, the spacing between any two adjacent feed positions in each column is equal. Alternatively, the spacing between any two adjacent feed positions in any column is equal, and the spacing between any two adjacent feed positions in any row is equal.
[0063] When the feed positions of the antenna array are arranged in a regular pattern, the RFIC chip with at least two radio frequency transceiver channels is connected one-to-one with at least two feed positions through at least two feed lines. This makes the multiple feed lines connected to the same RFIC chip basically of equal length, that is, the feed paths are the same. As a result, the time delay difference of multiple subarrays connected to the same RFIC chip will be reduced, so that the phases of multiple subarrays are basically consistent.
[0064] For example, such as Figure 9 and Figure 10As shown, the first RFIC chip 31 is an RFIC chip with eight radio frequency transceiver channels. The first RFIC chip 31 is interconnected with subarrays 1A1, 1A2, 1A3, 1A4, 1A5, 1A6, 1A7 and 1A8. Specifically, the first RF transceiver channel of the first RFIC chip 31 is interconnected with subarray 1A1 via feed line 051; the second RF transceiver channel of the first RFIC chip 31 is interconnected with subarray 1A2 via feed line 052; the third RF transceiver channel of the first RFIC chip 31 is interconnected with subarray 1A3 via feed line 053; the fourth RF transceiver channel of the first RFIC chip 31 is interconnected with subarray 1A4 via feed line 054; the fifth RF transceiver channel of the first RFIC chip 31 is interconnected with subarray 1A5 via feed line 055; the sixth RF transceiver channel of the first RFIC chip 31 is interconnected with subarray 1A6 via feed line 056; the seventh RF transceiver channel of the first RFIC chip 31 is interconnected with subarray 1A7 via feed line 057; and the eighth RF transceiver channel of the first RFIC chip 31 is interconnected with subarray 1A8 via feed line 058.
[0065] It should be noted that this application uses only an RFIC chip with eight radio frequency transceiver channels as one embodiment. RFIC chips with other numbers of radio frequency transceiver channels are also possible.
[0066] Depend on Figure 10 It can be seen that the lengths of feed lines 051, 052, 053, 054, 055, 056, 057, and 058 are basically equal. When the lengths of the feed lines are equal, the phases of subarrays 1A1, 1A2, 1A3, 1A4, 1A5, 1A6, 1A7, and 1A8 can be aligned, thereby improving the broadband performance of the antenna array.
[0067] When the feed positions of the antenna array are arranged in a regular pattern, the arrangement of the multiple RFIC chips in the device is also regular, and the lengths of at least two power splitting lines between a power splitter and at least two RFIC chips are also basically equal, simplifying the design of the power splitting lines. In particular, the power splitting paths from a power splitter and combiner to at least two RFIC chips are also basically the same, which further reduces the time delay difference between each subarray and further improves broadband performance.
[0068] For example, such as Figure 11As shown, the first RFIC chip 31, the second RFIC chip 32, the third RFIC chip 33, and the fourth RFIC chip 34 are all RFIC chips with eight RF transceiver channels. The power splitter / combiner 5 is connected to the first RFIC chip 31, the second RFIC chip 32, the third RFIC chip 33, and the fourth RFIC chip 34 respectively via power splitting lines 9.
[0069] Depend on Figure 11 It can be seen that the first RFIC chip 31, the second RFIC chip 32, the third RFIC chip 33 and the fourth RFIC chip 34 are arranged in a regular pattern, and the power divider line 9 is basically of equal length.
[0070] When the feed positions of the antenna array are arranged in a regular pattern, by Figure 9 As can be seen, the first RFIC chip 31, the second RFIC chip 32, the third RFIC chip 33, and the fourth RFIC chip 34 are arranged in a regular pattern. The heat dissipation of these RFIC chips is also evenly distributed, avoiding the phenomenon of local high temperature and local low temperature, and avoiding the impact on the performance of the entire wireless communication device.
[0071] It should be noted that the above analysis only considers a portion of the RFIC chips and subarrays; the technical effects produced by the remaining RFIC chips and subarrays are the same.
[0072] Based on the above, at least two power splitting lines between a power splitter / combiner 5 and at least two RFIC chips 3 are of approximately equal length, and the feed lines between an RFIC chip 3 and at least two subarrays are of approximately equal length. In this way, the transmission paths from a power splitter / combiner 5 to at least two subarrays are of approximately equal length. Consequently, the time delay difference between different subarrays will be significantly reduced compared to existing technologies, promoting the phase consistency of different subarrays and ultimately improving the broadband performance of the antenna array.
[0073] like Figure 12 As shown, each subarray has a phase center N. For example, when the antenna array includes at least three subarrays, then the phase center N also includes at least three.
[0074] It should be noted that after the electromagnetic waves radiated by the subarray travel a certain distance away from the subarray, their equiphase surface will approximate a sphere. The center of this sphere is the phase center of the subarray, or a region around the center of the sphere can be considered the phase center of the subarray. In practice, for planar subarrays, their phase center can usually be considered to coincide with their geometric center, which is the geometric center of the spherical phase surface of the electromagnetic waves radiated by the subarray.
[0075] The arrangement of the phase centers M in the antenna array provided in this application embodiment satisfies the following conditions: The first type: multiple phase centers in at least one row are not located on the same straight line.
[0076] like Figure 12 In the antenna array shown, the multiple phase centers in the first row are arranged in a straight line, but the multiple phase centers in the second row are arranged in a bent line, that is, the phase centers in the second row are misaligned.
[0077] The second type: multiple phase centers in at least one column are not located on the same straight line.
[0078] The third type: multiple phase centers in at least one row are not located on the same straight line, and multiple phase centers in at least one column are not located on the same straight line.
[0079] When the phase center of the antenna array satisfies any of the above conditions, the phase center of the antenna array is considered to be irregularly arranged.
[0080] The irregular arrangement of the phase center can cause the energy of the grating lobes in the antenna array to no longer be superimposed on a small number of angles during scanning, but to be dispersed to multiple angles. Therefore, the grating lobe suppression capability of the antenna array can be greatly improved.
[0081] Figure 13 Another antenna array structure diagram is given, which includes a subarray 1A with two radiating elements 11 and a subarray 1B with three radiating elements 11.
[0082] Combination Figure 14 The feed positions M in this antenna array also satisfy the following: the feed positions of multiple subarrays in each row are arranged along a straight line, and the feed positions of multiple subarrays in each column are also arranged along a straight line. Therefore, the feed positions of this antenna array are arranged in a regular pattern. For example, the feed positions of multiple subarrays in the first row, and the feed positions of multiple subarrays in the second row adjacent to the first row, are all arranged in a straight line. Similarly, the feed positions of multiple subarrays in the first column, and the feed positions of multiple subarrays in the second column adjacent to the first column, are also arranged in a straight line.
[0083] Figure 15 and Figure 16As shown, the fifth RFIC chip 35 is an RFIC chip with six RF transceiver channels. The fifth RFIC chip 35 is interconnected with subarrays 1B1, 1B2, 1B3, 1B4, 1B5, and 1B6. Specifically, the first RF transceiver channel of the fifth RFIC chip 35 is interconnected with subarray 1B1 via feed line 059; the second RF transceiver channel of the fifth RFIC chip 35 is interconnected with subarray 1B2 via feed line 0510; the third RF transceiver channel of the fifth RFIC chip 35 is interconnected with subarray 1B3 via feed line 0511; the fourth RF transceiver channel of the fifth RFIC chip 35 is interconnected with subarray 1B4 via feed line 0512; the fifth RF transceiver channel of the fifth RFIC chip 35 is interconnected with subarray 1B5 via feed line 0513; and the sixth RF transceiver channel of the fifth RFIC chip 35 is interconnected with subarray 1B6 via feed line 0514.
[0084] Depend on Figure 16 It can be seen that the lengths of feed lines 059 to 0514 are basically equal. When the lengths of the feed lines are equal, the phases of subarrays 1B1, 1B2, 1B3, 1B4, 1B5, and 1B6 can be made basically consistent, thereby improving the broadband performance of the antenna array.
[0085] Figure 17 The diagram shows the connection relationship between the four RFIC chips and the power divider / combiner 5, and the four RFIC chips are the fifth RFIC chip 35, the sixth RFIC chip 36, the seventh RFIC chip 37 and the eighth RFIC chip 38.
[0086] Depend on Figure 17 It can be seen that the fifth RFIC chip 35, the sixth RFIC chip 36, the seventh RFIC chip 37 and the eighth RFIC chip 38 are arranged in a regular pattern, and the power splitting lines from the power splitter to these four RFIC chips are basically of equal length.
[0087] like Figure 18 As shown, the phase centers N in this antenna array are irregularly arranged. For example, the phase centers of multiple subarrays in the first row form a bend, and the phase centers of multiple subarrays in the second row also form a bend. In this way, the irregularity of the phase centers may cause the energy of the grating lobes to no longer be superimposed on a small number of angles during the scanning of the antenna array, but to be dispersed across multiple angles. Therefore, the grating lobe suppression capability of this antenna array can be greatly improved.
[0088] Figure 19This is a comparison of grating lobe suppression curves between an antenna array provided in this application and existing antenna arrays. Curve (1) is the grating lobe suppression curve of the antenna array provided in this application when scanning along the Y-axis (vertical dimension), and curve (2) is the grating lobe suppression curve of an existing antenna array when scanning along the Y-axis (vertical dimension). It is clear from curves (1) and (2) that, within the vertical scanning angle range of -20° to 20°, the grating lobe suppression of this application is significantly higher than that of existing grating lobe suppression methods.
[0089] Figure 20 This is a comparison of the vertical scanning envelope gain curves of an antenna array provided in this application and existing antenna arrays. In this figure, curve ⑾ is the envelope gain curve of the beam scanning pattern of the antenna array provided in this application along the Y-axis direction (vertical dimension), and curve ⑿ is the envelope gain curve of the beam scanning pattern of the existing antenna array along the Y-axis direction (vertical dimension). It can be seen that the antenna array of this application has better gain than the existing antenna array in the -30° to -10° range and the 10° to 30° range, while the gain is basically the same in the -10° to 10° range. In addition, the beam scanning capability is defined as 10dB grating lobe suppression, refer to... Figure 21 The existing antenna array scanning capability is in the range of -10° to 10°, while the scanning capability of this application is greater than ±20°, and the actual capability can reach about ±30°. Figure 20 For example, beam scanning in the Y direction has a similar technical effect in the X direction.
[0090] In alternative implementations, the radiating elements are not limited to being equally spaced within each grid, i.e., as shown in the example below. Figure 21 As shown, radiating elements 11a, 11b, and 11c are arranged sequentially along the same column. The distance between adjacent radiating elements 11a and 11b is d1, and the distance between adjacent radiating elements 11b and 11c is d2. d1 and d2 can be equal, or the absolute value of the difference between d1 and d2 can be less than or equal to 1 / 4 of the wavelength corresponding to the frequency band of the antenna array.
[0091] In alternative implementations, the feed positions of the multiple subarrays along the first direction can be staggered to a certain extent, not limited to being completely on the same straight line. Similarly, the feed positions of the multiple subarrays along the second direction can be staggered to a certain extent, not limited to being completely on the same straight line. Figure 21As shown, feed positions M1, M2, and M3 are arranged along the first direction. Feed positions M2 and M3 are misaligned, and the misalignment distance d3 is less than or equal to 1 / 4 of the wavelength corresponding to the frequency band of the antenna array. When two adjacent feed positions are misaligned, and the misalignment distance is less than or equal to 1 / 4 of the wavelength corresponding to the frequency band of the antenna array, the impact on the equal length design of the feed lines and the equalizing lines is minimal, and the broadband performance of the antenna array can still be improved.
[0092] The above describes the irregular arrangement of feed positions in antenna arrays, meaning that multiple feed positions can occur within the same type of subarray. The following examples illustrate the specific methods for setting the feed positions to achieve this irregular arrangement.
[0093] Figure 22 The given is a subarray consisting of only one radiating element 11, in which the feed position M is located beside the radiating element 11.
[0094] Figure 23a , Figure 23b and Figure 23c The arrangement of the feed positions in a subarray consisting of two radiating elements is given, where the two radiating elements are the first radiating element 111 and the second radiating element 112, respectively.
[0095] First deployment method: Refer to Figure 23a The power supply position M is located between the first radiating element 111 and the second radiating element 112.
[0096] Second deployment location: Refer to Figure 23b The power supply position M is on the side of the first radiating element 111 that is away from the second radiating element 112.
[0097] Third deployment location: Refer to Figure 23c The power supply position M is on the side of the second radiating element 112 that is away from the first radiating element 111.
[0098] Alternatively, the power supply position M can be located below the first radiating element 111 or below the second radiating element 112.
[0099] Of course, when the antenna array includes a subarray with two radiating elements, the feed location includes, but is not limited to, the aforementioned locations.
[0100] Figure 24a , Figure 24b , Figure 24c and Figure 24d The arrangement of the feed positions in a subarray consisting of three radiating elements is given, whereby the three radiating elements are the first radiating element 111, the second radiating element 112, and the third radiating element.
[0101] First deployment location: Refer to Figure 24a The power supply position M is on the side of the first radiating element 111 that is away from the second radiating element 112.
[0102] Second deployment location: Refer to Figure 24b The power supply position M is between the first radiating element 111 and the second radiating element 112.
[0103] Third deployment location: Refer to Figure 24c The power supply position M is between the second radiating element 112 and the third radiating element 113.
[0104] Fourth deployment location: Refer to Figure 24d The power supply position M is located on the side of the third radiating element 113 that is away from the second radiating element 112.
[0105] In addition, the power supply position M can also be below the first radiating unit 111, below the second radiating unit 112, or below the third radiating unit 113.
[0106] Similarly, when the antenna array includes subarrays with three radiating elements, the feed locations include, but are not limited to, the locations described above.
[0107] When the antenna array includes subarrays with more radiating elements, the specific arrangement of the feed position M is similar to the arrangement example above.
[0108] Alternatively, it can be understood that when an antenna array includes a subarray with at least two radiating elements, the feed position is located between two adjacent radiating elements, or the feed position is located on the side of the radiating element at the end that is away from the other radiating elements, or the feed position is located below all the radiating elements in the subarray.
[0109] To achieve an irregular arrangement of phase centers and a regular arrangement of feed positions, there will be empty grids between two adjacent subarrays in some rows and columns, such as... Figure 14 As shown, a dummy element 2 is set in an empty grid. A dummy element refers to a radiating element that is not fed.
[0110] Setting up dummy elements can make the surrounding environment of each subarray of the antenna array consistent, so that the radiation pattern of each subarray is basically consistent, which will ultimately improve the communication capacity of the antenna array.
[0111] The two-dimensional shape formed by the antenna array provided in this application can be... Figure 7 and Figure 13 The provided rectangular array can also be Figure 25The near-circular shape shown can also be a polygonal shape (such as...) Figure 26 (The hexagon shown).
[0112] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0113] In the description of this specification, "multiple" means two or more. For example, "multiple subarrays" may include three or more subarrays, "multiple RF transceiver channels" may include two or more RF transceiver channels, "multiple RFIC chips" may include two or more RFIC chips, and so on.
[0114] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. An antenna array, characterized in that, include: Multiple subarrays, each of which is provided with a feed position and at least one radiating element, are arranged along a first direction and a second direction, the first direction being perpendicular to the second direction. Along the first direction, the feed positions of the multiple subarrays are located on the same straight line, and along the second direction, the feed positions of the multiple subarrays are located on the same straight line. Each of the plurality of subarrays has a phase center, and the phase centers of the subarrays in at least one row of the plurality of subarrays are not on the same straight line, and / or, the phase centers of the subarrays in at least one column of the plurality of subarrays are not on the same straight line.
2. The antenna array according to claim 1, characterized in that, The plurality of subarrays includes N subarrays, each of the N subarrays having an equal number of radiating elements, and the feeding position of at least one of the N subarrays being different from the feeding positions of the other N subarrays, where N is an integer greater than or equal to 2.
3. The antenna array according to claim 1 or 2, characterized in that, The plurality of subarrays includes at least two types of subarrays, wherein the subarrays of one type have an equal number of radiating elements.
4. The antenna array according to any one of claims 1-3, characterized in that, The plurality of subarrays includes at least one first subarray, on which at least two radiating elements are disposed, and the at least two radiating elements are arranged in a straight line. The feed position of the first subarray is located between two radiating elements; or, The feed position of the first subarray is located on the side of the radiating element at the end of the first subarray that is away from the other radiating elements.
5. The antenna array according to any one of claims 1-4, characterized in that, The plurality of subarrays includes at least one second subarray, on which a radiating element is disposed, and the feed position of the second subarray is located beside the radiating element.
6. The antenna array according to any one of claims 1-5, characterized in that, Along the first direction, the spacing between the feed positions of every two adjacent subarrays in the plurality of subarrays is equal, and / or, along the second direction, the spacing between the feed positions of every two adjacent subarrays in the plurality of subarrays is equal.
7. The antenna array according to any one of claims 1-6, characterized in that, The antenna array includes dummy elements, which are unfed radiating elements.
8. An apparatus, characterized in that, include: Antenna array as described in any one of claims 1 to 7, feeder cable, and A circuit carrier board, wherein the feed line is used to feed the subarrays in the antenna array, and the antenna array and the feed line are disposed on the circuit carrier board.
9. The apparatus as claimed in claim 8, characterized in that, Also includes: At least one radio frequency integrated circuit chip is disposed on the circuit carrier board. The radio frequency integrated circuit chip includes at least two radio frequency transceiver channels. The at least two radio frequency transceiver channels are used to feed at least two subarrays in the antenna array through the feed line, and the radio frequency transceiver channels are connected one-to-one with the subarrays.
10. The apparatus according to claim 9, characterized in that, The device includes a power divider and combiner and at least two radio frequency integrated circuit chips; the power divider and combiner is connected to the at least two radio frequency integrated circuit chips respectively through at least two power dividing lines, and the at least two power dividing lines are of equal length, and the power dividing lines are connected to the radio frequency integrated circuit chips one-to-one.
11. The apparatus according to claim 10, characterized in that, The circuit carrier board is a packaging substrate; The device further includes: A printed circuit board, wherein the packaging substrate is disposed on the printed circuit board and connected to the printed circuit board, and the power divider / combiner is disposed on the printed circuit board.
12. The apparatus according to claim 10, characterized in that, The circuit carrier board is a printed circuit board; The power splitter / combiner is mounted on the printed circuit board.
13. An apparatus, characterized in that, include: Antenna array as described in any one of claims 1 to 7; Feeder cable; and At least one radio frequency integrated circuit chip, the antenna array and the feed line are disposed on the package layer of the radio frequency integrated circuit chip, the radio frequency integrated circuit chip includes at least two radio frequency transceiver channels, the at least two radio frequency transceiver channels are used to feed at least two subarrays in the antenna array through the feed line respectively, and the radio frequency transceiver channels are connected one-to-one with the subarrays.
14. The apparatus according to claim 13, characterized in that, The device includes a power divider and combiner and at least two radio frequency integrated circuit chips; The power divider and combiner is connected to the at least two radio frequency integrated circuit chips via at least two power divider lines, and the at least two power divider lines are of equal length, with each power divider line connected to a radio frequency integrated circuit chip in a one-to-one manner.
15. The apparatus according to claim 13 or 14, characterized in that, The device further includes: The printed circuit board, wherein the radio frequency integrated circuit chip and the power divider / combiner are both mounted on the printed circuit board.
16. A wireless communication device, characterized in that, include The antenna array as described in any one of claims 1 to 7, or the apparatus as described in any one of claims 8 to 15.