A flexible circuit board SMT reflow soldering process

Abstract

This invention provides a flexible circuit board SMT reflow soldering process, relating to the field of SMT reflow soldering fixture technology. The flexible circuit board SMT reflow soldering process is based on a flexible circuit board SMT reflow soldering fixture, which includes a carrier plate, air holes, a first baffle, and a second baffle. The carrier plate has an air cavity with multiple air holes evenly distributed at its upper end. When the air cavity is under negative pressure, the air holes generate suction force to fix the circuit board. The first and second baffles are movably mounted on the carrier plate to adaptively and elastically clamp circuit boards of different sizes, and after movement, they block the air holes on the carrier plate not covered by the circuit board. This invention, through the combination of air hole suction and elastic clamping, ensures that the circuit board remains flat and stable during SMT reflow soldering, ensuring soldering quality. The structure of the first and second baffles adaptively and elastically clamping and closing useless air holes is applicable to circuit boards of different sizes, eliminating the need to create different fixtures for each size, thus saving costs.

Description

Technical Field

[0001] This invention relates to the field of SMT reflow soldering fixture technology, and more particularly to a flexible circuit board SMT reflow soldering process. Background Technology

[0002] In the current production process of flexible circuit board surface mount technology, reflow soldering is a key process that has a decisive impact on soldering quality and product yield. Due to the physical properties of the circuit board material itself, such as softness, easy deformation, and high heat sensitivity, it is prone to defects such as warping, slippage, or delamination in high-temperature environments. Therefore, it is necessary to use a special fixture to achieve stable fixation before it enters the reflow oven.

[0003] Existing fixtures use carrier plates with micropore arrays to adsorb and position circuit boards through a vacuum system. However, the carrier plates lack adaptive adjustment capabilities and cannot be compatible with circuit boards of different thicknesses or sizes. For multi-specification product mixed-line production scenarios, enterprises often need to prepare a large number of special fixtures, which not only occupy storage space but also significantly increase the complexity of production management and equipment investment costs. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a flexible circuit board SMT reflow soldering process.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A flexible circuit board SMT reflow soldering process is disclosed. The flexible circuit board SMT reflow soldering process is based on a flexible circuit board SMT reflow soldering fixture. The flexible circuit board SMT reflow soldering fixture includes a carrier plate, air holes, a first baffle, and a second baffle. The carrier plate has an air cavity. A plurality of air holes are evenly opened on the upper end surface of the carrier plate. The air holes connect the air cavity to the outside. When the air cavity is under negative pressure, the air holes generate an adsorption force to fix the circuit board. The first baffle and the second baffle are movably disposed on the carrier plate to adaptively and elastically clamp circuit boards of different sizes and to block the air holes on the carrier plate that are not covered by the circuit board after movement. The flexible circuit board SMT reflow soldering process includes the following steps: S1: Place the flexible circuit board to be welded on the upper surface of the carrier plate, and use the first baffle and the second baffle to adaptively and elastically clamp the flexible circuit board. At this time, the first baffle and the second baffle block the air holes on the carrier plate that are not covered by the flexible circuit board. S2: Vacuum the air cavity inside the carrier plate to create a negative pressure state, and generate an adsorption force through the air hole connected to the air cavity to fix the flexible circuit board to the upper surface of the carrier plate. S3: Send the carrier board with the flexible circuit board fixed into the reflow oven, complete the reflow soldering according to the preset temperature curve, release the negative pressure state of the air chamber after the soldering is completed, and remove the flexible circuit board.

[0006] Preferably, two first baffles are symmetrically arranged on both sides of the upper end face of the carrying plate, the bottom end face of the first baffle is slidably connected to the upper end face of the carrying plate, and first connecting plates are symmetrically fixed on both sides of the bottom edge of the first baffle. A first fixing rod is slidably connected inside the first connecting plate, the end of the first fixing rod is fixedly connected to the side of the carrying plate, and a first spring is wrapped around the outside of the first fixing rod. The first spring is fastened between the first connecting plate and the side of the carrying plate.

[0007] Preferably, a first mounting plate is fixedly connected to the end of the first fixing rod, a first bolt is threadedly connected to the inside of the first mounting plate, and a first threaded hole is opened on the side of the first connecting plate corresponding to the first mounting plate, and the first threaded hole and the first bolt are threadedly connected to each other.

[0008] Preferably, the side of the carrying plate is provided with a first sliding groove, which is connected to the air cavity of the carrying plate. The second baffle is slidably connected to the inner surface of the first sliding groove. The upper end face of the second baffle is slidably connected to the inner top surface of the air cavity of the carrying plate. The bottom edge of the second baffle is symmetrically provided with second connecting plates on both sides. The interior of the second connecting plate is slidably connected with a second fixing rod. The end of the second fixing rod is fixedly connected to the side of the carrying plate. The outer side of the second fixing rod is covered with a second spring. The second spring is fastened between the second connecting plate and the side of the carrying plate. The upper surface of the carrying plate is provided with a second sliding groove connected to the air cavity in the middle. The upper edge of the second baffle is provided with a sliding plate in the middle. The end of the sliding plate is provided with a clamping plate. The sliding plate is slidably connected to the inner side of the second sliding groove. The bottom end of the clamping plate is slidably connected to the upper surface of the carrying plate.

[0009] Preferably, when the clamping plate is not limited, the second baffle completely covers the inner top surface of the air cavity of the carrying plate under the push of the second spring, and the sides of the clamping plate, the sliding plate and the second baffle are located on the same vertical plane.

[0010] Preferably, a second mounting plate is fixed to the end of the second fixing rod, a second bolt is internally threaded onto the second mounting plate, and a second threaded hole is opened on the side of the second connecting plate corresponding to the second mounting plate, and the second threaded hole and the second bolt are threadedly connected to each other.

[0011] Preferably, a limiting plate is fixedly connected to the middle of the upper edge of the carrier plate, and the limiting plate is located outside the air hole.

[0012] Preferably, the air chamber sidewall of the loading plate is fixedly connected to a first pipe, and a one-way valve is fixedly installed on the first pipe. The loading plate can be placed on a belt conveyor.

[0013] Preferably, a second pipe is fixedly connected to the upper side wall of the first pipe, a limiting ring is fixedly provided on the outer periphery of the second pipe, a sealing ring is attached to the surface of the limiting ring, a locking cap is threaded to the outer side of the opening end of the second pipe, and the second pipe is located between the air chamber of the loading plate and the one-way valve.

[0014] Compared with the prior art, the beneficial effects of the present invention are: by adsorbing and fixing the air holes and combining the elastic clamping of the first baffle and the second baffle, the flexible circuit board is ensured to remain flat and completely stable during the SMT reflow soldering process, which greatly reduces the probability of defects such as soldering misalignment and warping deformation, and ensures soldering quality; the structure of the first baffle and the second baffle adaptively elastically clamping and closing useless air holes can be applied to a variety of flexible circuit boards of different sizes and models, without the need to make different tooling for each size, saving equipment costs. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the flexible circuit board SMT reflow soldering process according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the side structure of the carrier board in the SMT reflow soldering process of the flexible circuit board according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the internal structure of the carrier board in the SMT reflow soldering process of the flexible circuit board according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the second baffle structure in the SMT reflow soldering process of a flexible circuit board according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the first groove structure in the SMT reflow soldering process of a flexible circuit board according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the position of the first groove in the SMT reflow soldering process of a flexible circuit board according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the carrier board in the clamping state during the SMT reflow soldering process of the flexible circuit board according to an embodiment of the present invention; Figure 8 for Figure 3 Enlarged view of the structure at point A in the image.

[0016] In the diagram: 100, loading plate; 101, air vent; 102, first pipe; 103, one-way valve; 200, second pipe; 201, limiting ring; 202, sealing ring; 203, locking cover; 300, first baffle; 301, first connecting plate; 302, first fixing rod; 303, first spring; 304, first mounting plate; 305, first bolt; 306, first threaded hole; 400, first slide groove; 401, second baffle; 402, second slide groove; 403, sliding plate; 404, clamping plate; 405, second connecting plate; 406, second fixing rod; 407, second spring; 408, second mounting plate; 409, second bolt; 410, second threaded hole; 500, limiting plate. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0018] The terms used in this invention, such as "upper," "lower," "left," "right," "middle," and "one," are merely for clarity of description and are not intended to limit the scope of the invention. Any changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0019] like Figures 1-8 As shown, this embodiment of the invention provides a flexible circuit board SMT reflow soldering process. The flexible circuit board SMT reflow soldering process is based on a flexible circuit board SMT reflow soldering fixture. The flexible circuit board SMT reflow soldering fixture includes a carrier plate 100, air holes 101, a first baffle 300, and a second baffle 401. The carrier plate 100 has an air cavity. Multiple air holes 101 are evenly opened on the upper end surface of the carrier plate 100. The air holes 101 connect the air cavity to the outside. When the air cavity is in a negative pressure state, the air holes 101 generate an adsorption force to fix the circuit board. The first baffle 300 and the second baffle 401 are movably disposed on the carrier plate 100 to adaptively and elastically clamp circuit boards of different sizes, and after moving, they block the air holes 101 on the carrier plate 100 that are not covered by the circuit board. The SMT reflow soldering process for flexible circuit boards includes the following steps: S1: Place the flexible circuit board to be welded on the upper surface of the carrier plate 100, and use the first baffle 300 and the second baffle 401 to adaptively and elastically clamp the flexible circuit board. At this time, the first baffle 300 and the second baffle 401 cover the air holes 101 on the carrier plate 100 that are not covered by the flexible circuit board. S2: Vacuum the air cavity inside the carrier plate 100 to form a negative pressure state, and generate an adsorption force through the air hole 101 connected to the air cavity to fix the flexible circuit board to the upper surface of the carrier plate 100. S3: Send the carrier plate 100 with the flexible circuit board fixed into the reflow oven, complete the reflow soldering according to the preset temperature curve, release the negative pressure state of the air chamber after the soldering is completed, and remove the flexible circuit board.

[0020] In this embodiment, when the external vacuum system is activated, a negative pressure state is formed in the air chamber. The air holes 101 apply a uniform adsorption force to the flexible circuit board placed on the upper surface of the carrier plate 100 through vacuum adsorption, so that it is tightly adsorbed on the carrier surface. The uniform distribution of the air holes 101 ensures the balanced transmission of adsorption force and avoids deformation of the flexible circuit board due to uneven force during heating. In use, flexible circuit boards of different sizes are placed on the carrier plate 100. The first baffle 300 and the second baffle 401 automatically fit the edge of the circuit board under the action of elastic force and apply a certain clamping force to achieve an adaptive elastic clamping effect, ensuring the initial positioning and fixation of the circuit board in subsequent processing. The first baffle 300 and the second baffle 401 are not only used to clamp the edge of the circuit board, but also have the ability to selectively close the air holes 101 not covered by the circuit board. In practice, since the size of the flexible circuit board is often smaller than the total area of ​​the upper surface of the carrier plate 100, the pores 101 not covered by the circuit board will be exposed to the external environment. When the first baffle 300 and the second baffle 401 move to be close to the edge of the circuit board, the structure of the first baffle 300 and the second baffle 401 themselves will seal the pores 101 in that area. When the air cavity inside the carrier plate 100 is evacuated, the pores 101 generate adsorption force. However, if the unblocked pores 101 are exposed to the air, it will cause vacuum failure or insufficient adsorption force. By adjusting the position of the first baffle 300 and the second baffle 401, all the pores 101 not covered by the circuit board itself are blocked, thereby forming an adsorption area that matches the shape and size of the circuit board. Therefore, the vacuum adsorption force will be concentrated in the area covered by the circuit board, maximizing the fixing effect on the circuit board, while avoiding vacuum leakage and reducing the possibility of external dust being sucked into the fixture. By using the adsorption and fixation of the vent 101 and the elastic clamping combination of the first baffle 300 and the second baffle 401, the flexible circuit board is ensured to remain flat and completely stable during the SMT reflow soldering process, which greatly reduces the probability of defects such as soldering misalignment and warping deformation, and ensures soldering quality. The structure of the first baffle 300 and the second baffle 401 adaptively and elastically closing the useless vent 101 can be applied to a variety of flexible circuit boards of different sizes and models, without the need to make different tooling for each size, thus saving equipment costs.

[0021] like Figure 1 and Figure 2As shown, optionally, two first baffles 300 are symmetrically arranged on both sides of the upper end face of the carrying plate 100. The bottom end face of the first baffle 300 is slidably connected to the upper end face of the carrying plate 100. A first connecting plate 301 is symmetrically fixed on both sides of the bottom edge of the first baffle 300. A first fixing rod 302 is slidably connected inside the first connecting plate 301. The end of the first fixing rod 302 is fixedly connected to the side of the carrying plate 100. A first spring 303 is wrapped around the outside of the first fixing rod 302. The first spring 303 is fastened between the first connecting plate 301 and the side of the carrying plate 100.

[0022] In this embodiment, the guiding and limiting function of the first fixing rod 302 ensures that the first baffles 300 on both sides can only move horizontally in a straight line on both sides of the upper end of the carrier plate 100. Under the elastic force of the first spring 303, the first baffles 300 on both sides can move towards each other and adaptively clamp the flexible circuit board on both sides, which is suitable for different flexible circuit board clamping and positioning. While elastically clamping the flexible circuit board, the first baffles 300 also cover the uncovered air holes 101 on both sides of the flexible circuit board. When the first baffles 300 are attached to the edge of the flexible circuit board, the bottom surface of the first baffles 300 will be tightly attached to the upper surface of the carrier plate 100, thereby completely covering the air holes 101 located on the outer edge of the flexible circuit board.

[0023] like Figure 1 and Figure 2 As shown, optionally, the end of the first fixing rod 302 is fixedly connected to a first mounting plate 304, the first mounting plate 304 is internally threaded with a first bolt 305, and the side of the first connecting plate 301 corresponding to the first mounting plate 304 is provided with a first threaded hole 306, and the first threaded hole 306 and the first bolt 305 are threadedly connected to each other.

[0024] In this embodiment, the first baffle 300 is moved away from the center of the carrier plate 100, and then connected to the first bolt 305 through the first threaded hole 306, so that the position of the first baffle 300 relative to the carrier plate 100 is fixed, so that the flexible circuit board can be placed on the upper surface of the carrier plate 100. Then the first bolt 305 is rotated out, and the first baffle 300 moves in the opposite direction and is clamped on the outside of the flexible circuit board under the pull of the first spring 303 after its deformation is restored.

[0025] like Figures 1-7As shown, optionally, a first groove 400 is provided on the side of the carrying plate 100, the first groove 400 is connected to the air cavity of the carrying plate 100, a second baffle 401 is slidably connected to the inner surface of the first groove 400, the upper end surface of the second baffle 401 is slidably connected to the inner top surface of the air cavity of the carrying plate 100, and a second connecting plate 405 is symmetrically fixed on both sides of the bottom edge of the second baffle 401. A second fixing rod 406 is slidably connected inside the second connecting plate 405, and the end of the second fixing rod 406 is fixedly connected to the carrying plate 100. On the side of the 0, the outer side of the second fixing rod 406 is covered with a second spring 407. The second spring 407 is fastened between the second connecting plate 405 and the side of the carrying plate 100. The upper end face of the carrying plate 100 is provided with a second sliding groove 402 that communicates with the air cavity. The upper end face edge of the second baffle 401 is fixed with a sliding plate 403. The end of the sliding plate 403 is fixed with a clamping plate 404. The sliding plate 403 is slidably connected to the inner side of the second sliding groove 402. The bottom end of the clamping plate 404 is slidably connected to the upper end face of the carrying plate 100.

[0026] In this embodiment, the guiding and limiting functions of the second fixing rod 406 and the first sliding groove 400 ensure that the second baffle 401 can only slide back and forth in a straight line along the inner top surface of the air cavity of the carrier plate 100. Under the elastic force of the second spring 407, the clamping plate 404 is adaptively clamped to the side of the flexible circuit board by the second baffle 401. When the clamping plate 404 elastically clamps the flexible circuit board, the upper end surface of the second baffle 401 will be tightly attached to the inner top surface of the air cavity of the carrier plate 100. 1. The air holes 101 not covered on the outside of the flexible circuit board are blocked. That is, when the flexible circuit board is clamped and positioned, the air holes 101 not covered on the outside of the flexible circuit board are blocked by the cooperation of the first baffle 300 and the second baffle 401, thereby forming an adsorption area that matches the shape and size of the circuit board. This allows the vacuum adsorption force to be concentrated in the area covered by the circuit board, maximizing the fixing effect of the circuit board, while avoiding vacuum leakage and reducing the possibility of external dust being sucked into the fixture.

[0027] like Figures 1-7 As shown, optionally, when the clamping plate 404 is not limited, the second baffle 401 completely covers the inner top surface of the air cavity of the carrier plate 100 under the push of the second spring 407, and the sides of the clamping plate 404, the slide plate 403 and the second baffle 401 are located on the same vertical plane.

[0028] In this embodiment, when the clamping plate 404 is not clamping the flexible circuit board, the second baffle 401 completely covers the inner top surface of the air cavity of the carrier plate 100 under the push of the second spring 407. This ensures that the second baffle 401 can cover the air holes 101 on the outside of the circuit board when the clamping plate 404 clamps different circuit boards. Only when the sides of the clamping plate 404, the slide plate 403, and the second baffle 401 are located on the same vertical plane can the second baffle 401 completely cover the air holes 101 on the outside of the circuit board when the clamping plate 404 clamps the circuit board.

[0029] like Figure 2 and Figure 3 As shown, optionally, a second mounting plate 408 is fixed to the end of the second fixing rod 406, and a second bolt 409 is internally threaded to the second mounting plate 408. A second threaded hole 410 is opened on the side of the second connecting plate 405 corresponding to the second mounting plate 408, and the second threaded hole 410 and the second bolt 409 are threadedly connected to each other.

[0030] In this embodiment, the second baffle 401 is moved away from the carrier plate 100, and then connected to the second bolt 409 through the second threaded hole 410, so that the position of the second baffle 401 relative to the carrier plate 100 is fixed, so that the flexible circuit board can be placed on the upper surface of the carrier plate 100. Then, the second bolt 409 is rotated out, and the clamping plate 404 and the second baffle 401 move in opposite directions under the pull of the second spring 407 after its deformation is restored. The clamping plate 404 clamps the side of the flexible circuit board, while the second baffle 401 blocks the air hole 101 on the outside of the circuit board.

[0031] like Figure 1 As shown, optionally, a limiting plate 500 is fixedly connected to the middle of the upper edge of the carrier plate 100, and the limiting plate 500 is located outside the air hole 101.

[0032] In this embodiment, the side of the flexible circuit board is attached to the side of the limiting plate 500, and then the circuit board is clamped by the clamping plate 404 for initial positioning. Then, the first baffles 300 on both sides clamp and position the circuit board. Since the limiting plate 500 is located outside the air hole 101, the air hole 101 on the outside of the circuit board can be completely blocked and covered after the circuit board is limited.

[0033] like Figure 1 As shown, optionally, the air chamber sidewall of the loading plate 100 is fixedly connected to a first pipe 102, and a one-way valve 103 is fixedly installed on the first pipe 102. The loading plate 100 can be placed on a belt conveyor.

[0034] In this embodiment, when the carrier plate 100 is conveyed on the belt conveyor, air is drawn out by an air pump, so that the air in the air chamber of the carrier plate 100 is discharged to the outside through the first pipe 102, while the one-way valve 103 prevents the outside air from entering. Therefore, the air chamber of the carrier plate 100 is in a negative pressure state, and can then be adsorbed to the bottom of the circuit board through the air hole 101. The carrier plate 100 can be placed on the belt conveyor or other suitable conveying device to realize the automated conveying and processing of flexible circuit boards in the SMT reflow soldering process. Since the above structure is the prior art, its specific structure and working principle will not be described in detail here.

[0035] like Figure 3 and Figure 8 As shown, optionally, the upper end of the side wall of the first pipe 102 is fixedly connected to the second pipe 200, the outer periphery of the second pipe 200 is fixedly provided with a limiting ring 201, the surface of the limiting ring 201 is attached with a sealing ring 202, the outer side of the opening end of the second pipe 200 is threadedly connected with a locking cap 203, and the second pipe 200 is located between the air chamber of the carrier plate 100 and the one-way valve 103.

[0036] In this embodiment, the locking cover 203 opens and closes the opening end of the second pipe 200. When evacuating, the locking cover 203 closes the opening end of the second pipe 200, and external air cannot enter the air chamber of the carrier plate 100 when evacuation is completed. When releasing air, the locking cover 203 is removed from the opening end of the second pipe 200, and external air can enter the air chamber of the carrier plate 100. The sealing ring 202 is used to improve airtightness to ensure that the negative pressure environment inside the air chamber of the carrier plate 100 is not affected.

[0037] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A flexible circuit board SMT reflow soldering process, characterized in that, The flexible circuit board SMT reflow soldering process is based on a flexible circuit board SMT reflow soldering fixture. The flexible circuit board SMT reflow soldering fixture includes a carrier plate (100), air holes (101), a first baffle (300), and a second baffle (401). The carrier plate (100) has an air cavity. A plurality of air holes (101) are evenly opened on the upper end surface of the carrier plate (100). The air holes (101) connect the air cavity to the outside. When the air cavity is in a negative pressure state, the air holes (101) generate an adsorption force to fix the circuit board. The first baffle (300) and the second baffle (401) are movably disposed on the carrier plate (100) for adaptively and elastically clamping circuit boards of different sizes, and after moving, blocking the air holes (101) on the carrier plate (100) that are not covered by the circuit board. The flexible circuit board SMT reflow soldering process includes the following steps: S1: Place the flexible circuit board to be welded on the upper surface of the carrier plate (100), and use the first baffle (300) and the second baffle (401) to adaptively and elastically clamp the flexible circuit board. At this time, the first baffle (300) and the second baffle (401) cover the air holes (101) on the carrier plate (100) that are not covered by the flexible circuit board. S2: Vacuum the air cavity inside the carrier plate (100) to form a negative pressure state, and generate an adsorption force through the air hole (101) connected to the air cavity to fix the flexible circuit board to the upper surface of the carrier plate (100). S3: Send the carrier plate (100) with the flexible circuit board fixed into the reflow oven, complete the reflow soldering according to the preset temperature curve, release the negative pressure state of the air chamber after the soldering is completed, and remove the flexible circuit board.

2. The flexible circuit board SMT reflow soldering process according to claim 1, characterized in that, Two first baffles (300) are symmetrically arranged on both sides of the upper end face of the carrier plate (100). The bottom end face of the first baffle (300) is slidably connected to the upper end face of the carrier plate (100). The bottom edge of the first baffle (300) is symmetrically fixed with first connecting plates (301) on both sides. The first connecting plate (301) is slidably connected with a first fixing rod (302). The end of the first fixing rod (302) is fixedly connected to the side of the carrier plate (100). The outside of the first fixing rod (302) is covered with a first spring (303). The first spring (303) is fastened between the first connecting plate (301) and the side of the carrier plate (100).

3. The flexible circuit board SMT reflow soldering process according to claim 2, characterized in that, The first mounting plate (304) is fixedly connected to the end of the first fixing rod (302). The first mounting plate (304) is internally threaded with a first bolt (305). The side of the first connecting plate (301) corresponding to the first mounting plate (304) is provided with a first threaded hole (306). The first threaded hole (306) and the first bolt (305) are threadedly connected to each other.

4. The flexible circuit board SMT reflow soldering process according to claim 1, characterized in that, The side of the loading plate (100) is provided with a first groove (400), which is connected to the air cavity of the loading plate (100). The second baffle (401) is slidably connected to the inner surface of the first groove (400). The upper end face of the second baffle (401) is slidably connected to the inner top surface of the air cavity of the loading plate (100). The bottom edge of the second baffle (401) is symmetrically fixed with second connecting plates (405) on both sides. The interior of the second connecting plate (405) is slidably connected with a second fixing rod (406). The end of the second fixing rod (406) is fixedly connected to the side of the loading plate (100). The second fixing rod (406) is covered with a second spring (407) on the outside. The second spring (407) is fastened between the second connecting plate (405) and the side of the carrying plate (100). The upper end face of the carrying plate (100) is provided with a second sliding groove (402) that communicates with the air cavity. The upper end face edge of the second baffle (401) is fixed with a sliding plate (403). The end of the sliding plate (403) is fixed with a clamping plate (404). The sliding plate (403) is slidably connected to the inner side of the second sliding groove (402). The bottom end of the clamping plate (404) is slidably connected to the upper end face of the carrying plate (100).

5. The flexible circuit board SMT reflow soldering process according to claim 4, characterized in that, When the clamping plate (404) is not limited, the second baffle (401) completely covers the inner top surface of the air cavity of the carrier plate (100) under the push of the second spring (407), and the sides of the clamping plate (404), the slide plate (403) and the second baffle (401) are located on the same vertical plane.

6. The flexible circuit board SMT reflow soldering process according to claim 4, characterized in that, The end of the second fixing rod (406) is fixed with a second mounting plate (408), and the second mounting plate (408) is internally threaded with a second bolt (409). The side of the second connecting plate (405) corresponding to the second mounting plate (408) is provided with a second threaded hole (410), and the second threaded hole (410) and the second bolt (409) are threadedly connected to each other.

7. The flexible circuit board SMT reflow soldering process according to claim 1, characterized in that, A limiting plate (500) is fixedly connected to the middle of the upper edge of the carrier plate (100), and the limiting plate (500) is located outside the air hole (101).

8. The flexible circuit board SMT reflow soldering process according to claim 1, characterized in that, The air chamber sidewall of the loading plate (100) is fixedly connected to a first pipe (102), and a one-way valve (103) is fixedly installed on the first pipe (102). The loading plate (100) can be placed on a belt conveyor.

9. The flexible circuit board SMT reflow soldering process according to claim 8, characterized in that, The upper end of the side wall of the first pipe (102) is fixedly connected to the second pipe (200). The outer periphery of the second pipe (200) is fixedly provided with a limiting ring (201). A sealing ring (202) is attached to the surface of the limiting ring (201). A locking cap (203) is threadedly connected to the outer side of the opening end of the second pipe (200). The second pipe (200) is located between the air chamber of the carrier plate (100) and the one-way valve (103).

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