Electronic device, processing method of middle frame, and assembly method of electronic device

Abstract

This application relates to the field of waterproofing technology for electronic devices, and more particularly to electronic devices, methods for processing a mid-frame, and methods for assembling electronic devices. The electronic device includes a mid-frame, a circuit board, a button assembly, and a connector. The mid-frame has a receiving space, within which the circuit board is disposed. The sidewall of the mid-frame has a receiving groove and a wire-through hole, the wire-through hole connecting the receiving space and the receiving groove. The button assembly includes a sensing element, which is mounted in the receiving groove. One end of the connector is electrically connected to the button assembly, and the other end passes through the wire-through hole and is electrically connected to the circuit board. The wire-through hole is filled with a sealant, which seals the gap between the hole wall and the connector. This application provides a wire-through hole in the mid-frame, allowing the connector to pass through the mid-frame into the receiving space and connect to the circuit board. The wire-through hole is sealed with a sealant, achieving waterproofing. This reduces the structural complexity and sealing costs of the electronic device while ensuring its waterproof performance.

Description

Technical Field

[0001] This application relates to the field of waterproof technology for electronic devices, and in particular to electronic devices, processing methods for mid-frames, and assembly methods for electronic devices. Background Technology

[0002] Electronic devices include button assemblies exposed on the surface of a mid-frame. These buttons are used for powering on / off or adjusting volume. The button assemblies need to be electrically connected to the circuit boards inside the electronic device via flexible circuit boards. However, gaps exist between the button assemblies and the mounting location on the mid-frame, allowing liquid to enter the interior of the electronic device and potentially affecting the safety of internal electronic components such as flexible circuit boards or circuit boards. Summary of the Invention

[0003] This application provides a method for processing an electronic device and a mid-frame, as well as a method for assembling the electronic device, with the aim of improving the sealing and waterproofing effect of the electronic device.

[0004] This application provides an electronic device in a first aspect, the electronic device comprising:

[0005] The middle frame has a receiving space, and the side wall of the middle frame is provided with a receiving groove and a wire passing hole, the wire passing hole connecting the receiving space and the receiving groove;

[0006] A circuit board, wherein the circuit board is disposed within the receiving space;

[0007] A button assembly, the button assembly including a sensing part, the sensing part being mounted in the receiving groove;

[0008] A connector, one end of which is electrically connected to the button assembly, and the other end of which passes through the wire hole and is electrically connected to the circuit board;

[0009] The wire passage hole is filled with a sealant, which seals the gap between the hole wall and the connector.

[0010] In this embodiment, one end of the connector is electrically connected to the sensing unit, and the other end passes through the wire hole into the receiving space enclosed by the middle frame and is electrically connected to the circuit board, thereby realizing the electrical connection between the sensing unit and the circuit board.

[0011] The wire hole is filled with a sealant, which blocks the gap between the hole wall and the connector. This allows the connector to be sealed to the hole wall through the sealant, making the wire hole a sealed hole. This prevents liquid that seeps into the receiving groove from entering the area enclosed by the middle frame of the electronic device, thereby improving the sealing and waterproof performance of the electronic device.

[0012] In one possible design, the sealant is an adhesive, and the connector is bonded to the wall of the wire hole by the adhesive.

[0013] In this embodiment, the sealant can be an adhesive, sealing silicone, or other material capable of sealing the gap between the connector and the hole wall of the wire hole. This embodiment does not limit the scope of the sealant.

[0014] In one possible design, the receiving groove is recessed along the thickness direction of the electronic device, and along the width direction of the electronic device, the receiving groove has an inner sidewall and an outer sidewall disposed opposite to each other, the inner sidewall being located on the side closer to the receiving space, and the wire hole being disposed on the inner sidewall.

[0015] In this embodiment, the receiving groove has an inner sidewall and an outer sidewall that are arranged opposite to each other. The inner sidewall is located on the side closer to the receiving space. The wire hole is provided on the inner sidewall and can penetrate through the middle frame in the width direction and communicate with the area enclosed by the middle frame. This allows the wire hole to connect the receiving groove and the area enclosed by the middle frame, that is, the wire hole connects the receiving space enclosed by the receiving groove and the middle frame, so that part of the structure of the connector located in the receiving groove can enter the receiving space enclosed by the middle frame through the wire hole.

[0016] In one possible design, the inner sidewall has an inner surface and an outer surface that are disposed opposite to each other along the width direction of the electronic device. Along the width direction of the electronic device, the through hole includes a first hole segment and a second hole segment that are connected to each other. The first hole segment penetrates the inner surface, and the second hole segment penetrates the outer surface.

[0017] Along the direction away from the second hole segment, the cross-sectional area of ​​the first hole segment gradually increases, and along the direction away from the first hole segment, the cross-sectional area of ​​the second hole segment gradually increases.

[0018] In this embodiment, the minimum cross-sectional area of ​​the wire-through hole along the width direction is located at the connection position of the first hole segment and the second hole segment. That is, the minimum diameter of the wire-through hole is located at the connection position of the first hole segment and the second hole segment. Compared with the minimum diameter of the wire-through hole being located on the side closer to the receiving end of the wire-through hole, it is beneficial for part of the structure of the connector to pass through the wire-through hole.

[0019] In one possible design, both the sidewalls of the first hole segment and the sidewalls of the second hole segment are arc-shaped.

[0020] In this embodiment of the application, a wire hole is formed by cutting on both sides of the tool, so that the wire hole is formed by two arc-shaped edges on both sides along the length direction.

[0021] In one possible design, the outer wall is provided with a recessed clearance notch along the thickness direction of the electronic device, the clearance notch being used to avoid the connector when it is bent and inserted into the wire hole.

[0022] In this embodiment, by opening an avoidance notch on the side wall of the receiving groove, the avoidance notch is recessed downward along the thickness direction relative to the side wall of the receiving groove, increasing the bending space of the connector, so that the operator can bend the connector and insert it into the wire hole.

[0023] In one possible design, the projection surface of the clearance notch along the width direction of the electronic device covers the projection surface of the through hole, and / or, the depth of the clearance notch is less than the depth of the receiving groove.

[0024] In this embodiment, along the width direction, the projection surface of the clearance notch can cover the projection surface of the through hole, so that the space formed by the clearance notch and the receiving groove satisfies the bending curvature of the connector.

[0025] Along the thickness direction, the depth of the clearance notch is less than the depth of the receiving groove. In other words, the depth of the clearance notch is sufficient for the connector to bend and pass through the wire hole; it does not need to be excessively deep to ensure the structural strength of the mid-frame. Similarly, the width of the clearance notch is sufficient for the connector to bend and pass through the wire hole; it does not need to be excessively wide to ensure the structural strength of the mid-frame.

[0026] In one possible design, the clearance notch has an opening segment whose sidewalls slope outward from the clearance notch.

[0027] In this embodiment, the opening section is tilted toward the side away from the wire hole to further expand the bending space of the connector.

[0028] In one possible design, the button assembly further includes an operating part connected to the sensing part, and the middle frame is also provided with a receiving hole, which is recessed along the width direction of the electronic device, and the operating part is mounted in the receiving hole;

[0029] The receiving hole and the receiving groove are connected through a connecting hole, and a part of the structure of the operating part passes through the connecting hole and is connected to the sensing part.

[0030] In this embodiment, the opening of the receiving hole is located on the circumferential outer surface of the middle frame and extends inward to the middle frame in a direction perpendicular to the circumferential outer surface of the middle frame.

[0031] The receiving hole is connected to the receiving groove through the connecting hole. The operating part is snapped into the receiving hole, and part of the structure of the operating part extends into the connecting hole. The sensing part is installed in the receiving groove, and part of the structure of the operating part is arranged opposite to the sensing part.

[0032] After pressing the operating part, it can directly contact the sensing part. The operating part will transmit pressure to the sensing part through mechanical transmission, causing the sensing part to switch states (from off to on or from on to off). The sensing part is electrically connected to the connector, so that the sensing part can be electrically connected to the circuit board through the connector.

[0033] In a second aspect, this application also provides a method for processing the mid-frame of an electronic device, the method comprising:

[0034] A middle frame with storage space is fabricated;

[0035] A receiving groove is machined into the side wall of the middle frame, which is recessed along the thickness direction of the middle frame, and the receiving groove has an inner side wall and an outer side wall that are arranged opposite to each other along the width direction.

[0036] The inner wall is cut with a cutting tool to form a wire hole.

[0037] In this embodiment, the entire middle frame can be made of metal. A wire-passing hole is formed by cutting the inner wall of the receiving groove on the middle frame with a cutting tool. The wire-passing hole connects the receiving groove and the receiving space enclosed by the middle frame, and allows the connector to pass through and enter the area enclosed by the middle frame to make an electrical connection with the circuit board.

[0038] In addition, the cutting path of the tool can be input on the controller according to the length of the wire hole. The controller controls the drive device to move the tool along the pre-input cutting path to cut a wire hole of a predetermined diameter on the middle frame.

[0039] In one possible design, when cutting the inner sidewall with a tool to form a through hole, the method includes:

[0040] The middle frame is placed at an angle, and the inner sidewall is cut with a first tool to form the wire hole;

[0041] The first cutting tool is a rod-shaped end mill, and the inclination angle of the middle frame is 45° to 85°.

[0042] In this embodiment of the application, in order to avoid accidentally cutting the partition structure when the cutting tool is cutting, the processing tool selected is different and the processing process of the middle frame is different when the position of the wire hole to be processed on the middle frame is close to or far away from the partition structure.

[0043] If there is a partition structure near the location of the through hole to be machined in the middle frame, the first tool can be selected, which can be a bar-shaped end mill.

[0044] The middle frame is tilted, and the first cutter is vertically positioned. The head of the first cutter cuts the middle frame from the inner surface. By tilting the middle frame, the first cutter can cut through the wire hole when it passes the inner surface. That is, the wire hole cut by the first cutter when it passes the inner surface of the inner wall goes through the outer surface, without needing to cut on the outer surface of the inner wall.

[0045] In one possible design, the inner sidewall has an inner surface and an outer surface disposed opposite to each other along the width direction of the electronic device, the inner surface being close to the receiving space;

[0046] When cutting the inner wall with a cutting tool to form a wire hole, the method includes:

[0047] The middle frame is placed horizontally, and the second cutter is used to cut the middle frame from the inner surface and the outer surface respectively to form the wire hole;

[0048] The cutting radius of the second tool is smaller than the width of the through hole.

[0049] In this embodiment of the application, if a partition structure is provided near the location of the wire hole to be processed in the middle frame, a second tool can be selected as the cutting tool, and the second tool can be a T-shaped tool.

[0050] The middle frame is set horizontally, and the second cutter is set vertically. The head of the second cutter is used to cut the side wall of the middle frame to be processed from one side of the inner surface to form the first wire groove. The head of the second cutter is used to cut the side wall of the middle frame to be processed from one side of the outer surface to cut the first wire groove into a through hole structure to form a wire hole.

[0051] In one possible design, the inner sidewall has an inner surface and an outer surface disposed opposite to each other along the width direction of the electronic device, the inner surface being close to the receiving space;

[0052] When cutting the inner wall with a cutting tool to form a wire hole, the method includes:

[0053] The middle frame is placed horizontally, and the middle frame is cut from the inner surface using a third tool to form the wire hole;

[0054] The cutting radius of the third tool is greater than the width of the through hole.

[0055] In this embodiment, if there is no partition structure near the location of the wire hole to be processed on the middle frame, a third tool can be used. This third tool is a T-shaped tool, and its cutting radius is greater than the width of the wire hole.

[0056] The middle frame is placed horizontally, and the third cutter is set vertically. The head of the third cutter is used to cut the middle frame from the inner surface, so that the third cutter can cut through the wire hole when it passes through the inner surface. That is, the wire hole cut by the third cutter when it passes through the inner surface goes through the outer surface to form the wire hole, without the need to cut on the outer surface.

[0057] In one possible design, when a receiving groove recessed along the thickness direction of the middle frame is machined into the side wall of the middle frame, the method further includes:

[0058] A recessed receiving hole is machined into the side wall of the middle frame along the width direction of the middle frame, and the receiving groove is connected to the receiving hole through a connecting hole.

[0059] In this embodiment, the opening of the receiving hole is located on the circumferential outer surface of the middle frame and extends inward into the middle frame in a direction perpendicular to the circumferential outer surface. The receiving hole is used to install the operating part of the button assembly for user operation.

[0060] In a third aspect, this application also provides a method for assembling an electronic device, used to assemble the aforementioned electronic device, the method comprising:

[0061] The sensing part of the button assembly is installed in the receiving slot of the middle frame;

[0062] One end of the connector is electrically connected to the sensing part inside the receiving groove, and the other end of the connector is extended through the wire hole on the inner side wall of the receiving groove into the receiving space enclosed by the middle frame.

[0063] The gap between the connector and the wall of the wire passage hole is sealed by a sealing element;

[0064] The other end of the connector is electrically connected to the circuit board within the receiving space.

[0065] In this embodiment, one end of the connector is electrically connected to the sensing unit, and the other end passes through the wire hole into the receiving space enclosed by the middle frame and is electrically connected to the circuit board, thereby realizing the electrical connection between the sensing unit and the circuit board.

[0066] The wire hole is filled with a sealant, which blocks the gap between the hole wall and the connector. This allows the connector to be sealed to the hole wall through the sealant, making the wire hole a sealed hole. This prevents liquid that seeps into the receiving groove from entering the area enclosed by the middle frame of the electronic device, thereby improving the sealing and waterproof performance of the electronic device.

[0067] In one possible design, the method includes sealing the gap between the connector and the wall of the through hole using the sealant:

[0068] Apply adhesive to the wire hole to bond the connector to the wall of the wire hole.

[0069] In this embodiment, the seal is formed by applying adhesive to enhance the connection strength between the seal and the connector and the wall of the wire hole, thereby reducing the risk of the seal falling out of the wire hole.

[0070] In one possible design, when applying adhesive inside the wire hole to bond the connector to the wall of the wire hole using adhesive, the method includes:

[0071] The other end of the connector is bent downward within the receiving space and makes contact with the circuit board.

[0072] Apply adhesive between the connector and the wall of the wire-passing hole to bond the connector to the wall of the wire-passing hole using the first adhesive.

[0073] The other end of the connector is bent upward within the receiving space to expose the area between the connector and the wall of the wire hole that is not glued.

[0074] Apply adhesive to the un-adhesive area to bond the connector to the wall of the wire hole using a second adhesive.

[0075] The other end of the connector is bent downward within the receiving space and comes into contact with the circuit board.

[0076] In this embodiment, during adhesive application, the end of the connector passing through the wire hole can be bent downwards first. Adhesive is then applied between the connector and the wall of the wire hole, specifically in the area between the upper surface of the connector and the inner top and inner side walls of the wire hole, allowing the connector to bond with the wall of the wire hole using the first adhesive. Then, the connector is bent upwards, leaving no obstruction between the lower surface of the connector and the inner bottom wall of the wire hole, exposing the un-adhesive area between the connector and the wall of the wire hole. Adhesive is then applied in the area between the lower surface of the connector and the inner bottom wall of the wire hole, filling the gap between the connector and the inner side wall of the wire hole with the second adhesive, ensuring a filling effect.

[0077] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0078] Figure 1 This is a schematic diagram of the structure of an electronic device;

[0079] Figure 2 This is a schematic diagram of a portion of the structure of an electronic device in one embodiment;

[0080] Figure 3This is a cross-sectional view of the middle frame;

[0081] Figure 4 This is a schematic diagram showing the connection between the button assembly and the flexible circuit board.

[0082] Figure 5 for Figure 2 A cross-sectional view;

[0083] Figure 6 This is a schematic diagram of a portion of the structure of an electronic device in another embodiment;

[0084] Figure 7 for Figure 6 A diagram from another perspective;

[0085] Figure 8 for Figure 6 A schematic diagram of the middle frame;

[0086] Figure 9 For along Figure 8 A schematic diagram of the cross-section of the first connecting hole (second connecting hole);

[0087] Figure 10 This is a schematic diagram of the first button assembly, the second button assembly, and the flexible circuit board;

[0088] Figure 11 For along Figure 8 A schematic diagram of the cross-section at the connection point between the third mounting slot and the first mounting slot (second mounting slot);

[0089] Figure 12 A schematic diagram of a portion of the structure of the electronic device provided in this application in another embodiment;

[0090] Figure 13 for Figure 12 A diagram showing the removal of the button components;

[0091] Figure 14 For along Figure 13 Schematic diagram of the cross-section of the connecting hole;

[0092] Figure 15 This is a schematic diagram showing the connection between the button assembly and the flexible circuit board.

[0093] Figure 16 for Figure 13 A cross-sectional view;

[0094] Figure 17 This is a partial schematic diagram of an electronic device;

[0095] Figure 18 This is a schematic diagram of applying adhesive inside the wire hole;

[0096] Figure 19This is a schematic cross-sectional view of a wire hole along the thickness direction in one embodiment;

[0097] Figure 20 This is a cross-sectional view of the through hole along the thickness direction in another embodiment;

[0098] Figure 21 This is a schematic diagram illustrating the machining of a wire hole in one embodiment;

[0099] Figure 22 This is a schematic diagram illustrating the machining of a wire hole in another embodiment;

[0100] Figure 23 This is a schematic cross-sectional view of the wire hole along the thickness direction;

[0101] Figure 24 This is a schematic diagram of the machining of a wire hole in another embodiment.

[0102] Figure label:

[0103] 1-Electronic devices;

[0104] 11-Back cover;

[0105] 12-Middle frame, 121-Accommodation hole, 121a-Connection hole, 122-Accommodation groove, 123-Recess, 123a-Seal, 123a-First adhesive, 123b-Second adhesive, 124-Foam, 125-First mounting groove, 125a-First slot, 126-First connection hole, 127-Second mounting groove, 127a-Second slot, 128-Second connection hole, 129-Third mounting groove, 12a-Wire passage hole, 12a1-First hole segment, 12a2-Second hole segment, 12a3-Curved edge, 12b-Avoidance notch, 12b1-Opening segment, 12c-Separation structure, 12d-Inner surface, 12e-Outer surface, 12f-Reception space;

[0106] 13-Button assembly, 131-Operating part, 131a-Snap-fit ​​part, 132-Sensing part, 13a-First button assembly, 13a1-First operating part, 13a1 a-First snap-fit ​​part, 13a1 b-First mating part, 13a2-First sensing part, 13a3-First guide post, 13a4-First sealing ring, 13b-Second button assembly, 13b1-Second operating part, 13b1 a-Second snap-fit ​​part, 13b1 b-Second mating part, 13b2-Second sensing part, 13b3-Second guide post, 13b3-Second sealing ring;

[0107] 14-Connector;

[0108] 15-Fixing clip, 151-First limiting part, 152-Second limiting part;

[0109] 2 - First cutting tool, 3 - Second cutting tool, 4 - Third cutting tool;

[0110] X - width direction, Y - length direction, Z - thickness direction.

[0111] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0112] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0113] In one specific embodiment, the present application will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0114] This embodiment provides an electronic device, including but not limited to mobile phones, foldable phones, tablets, foldable tablets, computers, and wearable devices (such as smartwatches). For ease of explanation, this embodiment uses a mobile phone as an example.

[0115] like Figure 1 The diagram shows the structure of an electronic device, with X, Y, and Z directions. Electronic device 1 can be a cuboid structure, where X, Y, and Z represent its width, length, and thickness, respectively. The length direction represents the direction of maximum size for the cuboid structure, the thickness direction represents the direction of minimum size, and the width direction represents the direction between the maximum and minimum size. The length, width, and thickness directions of the electronic device are mutually perpendicular.

[0116] Please continue to refer to this. Figure 1The electronic device 1 includes a back cover 11, a middle frame 12, a screen (not shown in the figure), and a button assembly 13. The back cover 11 and the screen are connected to both sides of the middle frame 12 along the thickness direction Z. The back cover 11 and the middle frame 12 are fixed together, including but not limited to, by adhesive backing, and the screen is fixed together with the middle frame 12, including but not limited to, by adhesive material. The middle frame 12 forms a receiving space (not shown in the figure) for accommodating the electronic components of the electronic device 1. The back cover 11 has high rigidity, is not easily damaged by external forces, has good wear resistance, and can effectively protect the components within the receiving space of the electronic device 1. The middle frame 12 is the frame part of the electronic device 1, supporting various internal components such as the battery, motherboard, and sensors. The button assembly 13 includes, but is not limited to, volume buttons and power buttons. The button assembly 13 is used for electrical connection with the circuit board inside the electronic device 1 to transmit signals generated by user operation (e.g., pressing) to the circuit board.

[0117] Specifically, the button assembly 13 is mounted on the side end of the middle frame 12 along the width direction X.

[0118] like Figure 1 The electronic device shown may also include other structures such as a camera module. This application does not limit the specific structure of the electronic device.

[0119] like Figure 2 The diagram shown is a partial structural representation of electronic device 1 in one embodiment. Figure 2 It shows Figure 1 A schematic diagram showing the location of the middle frame 12 where the button assembly 13 is installed, and Figure 2 The partial structure of the mid-frame 12 within the receiving space 12f is shown. The electronic device 1 includes the mid-frame 12, a button assembly 13, a connector 14, and a circuit board (not shown). The mid-frame 12 has a receiving hole 121 located on its circumferential outer surface. The circuit board is disposed within the receiving space 12f enclosed by the mid-frame 12, the back cover, and the screen. The button assembly 13 is mounted within the receiving hole 121, specifically on the side end of the mid-frame 12 along the width direction X. The connector 14 has a certain bending shape; one end of the connector 14 is electrically connected to the button assembly 13, and the other end is electrically connected to the circuit board.

[0120] It should be noted that the connector 14 can be a flexible circuit board and wires with a certain bending shape. Alternatively, the connector can be other components that can realize the electrical connection between the button assembly and the circuit board; this embodiment does not specifically limit the specific components.

[0121] Specifically, the connector 14 can transmit the signal generated by the button assembly 13 being operated to the circuit board. For example, the electronic device 1 is a mobile phone, the circuit board is a motherboard, and the button assembly 13 is a power button. When the user presses the button assembly 13, the button assembly 13 switches from an off state to an on state. The switch signal generated by the button assembly 13 being pressed is transmitted to the motherboard via the connector 14, and the processor on the motherboard can realize the operation of turning on the mobile phone.

[0122] Figure 3 The diagram shows the connection between the button assembly 13 and the connector 14. The button assembly 13 includes an operating part 131 and a sensing part 132. When the operating part 131 is pressed, it directly contacts the sensing part 132. The operating part 131 transmits pressure to the sensing part 132 through mechanical transmission, causing the sensing part 132 to switch states (from off to on or from on to off). The sensing part 132 is electrically connected to the connector 14, enabling it to be electrically connected to the circuit board. It should be noted that if the button assembly 13 is for other types of buttons, the working principle of the button assembly 13 can be found in relevant technologies, and will not be described further in this embodiment.

[0123] The operation unit 131 may include a snap-fit ​​part 131a, which is used to define the position of the operation unit 131 after snapping into the middle frame 12.

[0124] Please refer to Figure 4 , Figure 4 The diagram shown is a cross-sectional view of the middle frame 12. Please refer to the reference. Figure 2 and Figure 4 The middle frame 12 is provided with a receiving hole 121, a connecting hole 121a, and a receiving groove 122. The connecting hole 121a connects the receiving hole 121 and the receiving groove 122. One side opening of the receiving hole 121 is located on the circumferential outer surface of the middle frame 12 and extends inward toward the middle frame 12 in a direction perpendicular to the circumferential outer surface of the middle frame 12. The receiving groove 122 is located inside the receiving hole 121, and the opening of the receiving groove 122 faces the side of the middle frame 12 in the thickness direction Z. The receiving hole 121 is used to install the operating part, and the receiving groove 122 is used to install the sensing part.

[0125] like Figure 5 As shown Figure 2 Please refer to the sectional view diagram. Figures 2 to 5 The operating part 131 is engaged in the receiving hole 121 and can move along the width direction X. Parts of the sensing part 132 and the connecting member 14 are installed in the receiving groove 122. Parts of the operating part 131 are connected to the sensing part 132 through the connecting hole 121a.

[0126] In some embodiments, a portion of the operating part 131 may protrude from the opening of the receiving hole 121, exposing a portion of the operating part 131 to the outer surface of the electronic device 1, thereby facilitating operation of the operating part 131. Alternatively, in some embodiments, the outer surface of the operating part 131 may be flush with the edge of the opening of the receiving hole 121 to prevent accidental touches, maintain a clean appearance of the electronic device 1, and improve the user's grip. The positional relationship between the operating part 131 and the receiving hole 121 can be adjusted according to actual needs, and this embodiment does not impose any limitations on this.

[0127] Please continue to refer to the reference. Figure 3 and Figure 5 The operating part 131 can be installed in the receiving hole 121 by snap-fit. Specifically, the operating part 131 includes a snap-fit ​​part 131a (see reference). Figure 3 The snap-fit ​​part 131a can be made of soft plastic. After the snap-fit ​​part 131a is squeezed into the receiving hole 121, it can abut against the outer periphery of the receiving hole 121 to prevent the operating part 131 from disengaging from the receiving hole 121.

[0128] Please continue to refer to this. Figure 5 In this embodiment, one end of the connector 14 is electrically connected to the sensing unit 132, and the other end of the connector 14 needs to cross the middle frame 12 and enter the receiving space 12f enclosed by the middle frame 12 to be electrically connected to the circuit board, thereby realizing the electrical connection between the sensing unit 132 and the circuit board.

[0129] Specifically, please refer to the following: Figure 4 and Figure 5 The upper surface of the middle frame 12 is provided with a recess 123, and part of the structure of the connector 14 overlaps the middle frame 12 and attaches to the recess 123. An adhesive for fixing the connector 14 is provided on the recess 123.

[0130] An adhesive is provided between the bottom wall of the connector 14 and the recess 123 so that the connector 14 is bonded to the recess 123 and the connector 14 is restricted from moving under the action of external force.

[0131] Foam 124 is also provided on the recess 123, covering the connector 14. After the electronic device 1 is assembled, the foam 124 is compressed between the recess 123 of the middle frame 12 and the back cover 11 to seal the gap between the recess 123 of the middle frame 12 and the back cover 11, thereby preventing external impurities from entering the receiving space through the gap between the middle frame 12 and the recess 123.

[0132] However, in this embodiment, in order for the operating part 131 to directly contact the sensing part 132, the receiving hole 121 needs to be directly connected to the receiving groove 122, which allows liquid from the external environment to enter the receiving groove 122 along the gap between the operating part 131 and the receiving hole 121. Since the waterproof effect of the foam 124 is only sufficient for everyday use, liquid may penetrate the foam 124 and enter the interior of the middle frame 12. Furthermore, since the edge portion of the recessed part 123 has a slope along the Y direction, and the compression of the foam 124 is constant, a gap still exists between the back cover 11 and the middle frame 12. Liquid may then enter the interior of the middle frame 12 along this gap, causing damage to the circuit board inside the middle frame 12.

[0133] Please refer to the following for details. Figure 6 ,like Figure 6 The diagram shown is a schematic representation of a portion of the structure of an electronic device in another embodiment, and... Figure 2 The difference between this embodiment and the previous one is that this embodiment has a waterproof sealing structure at the button assembly mounting location to prevent direct communication between the receiving hole and the receiving groove, thereby preventing liquid from entering the receiving groove and thus preventing liquid from entering the interior of the electronic device from the receiving groove. Figure 6 In the illustrated embodiment, the electronic device includes a mid-frame 12 and a first button assembly 13a and a second button assembly 13b mounted on the mid-frame 12.

[0134] Figure 7 for Figure 6 A diagram from another perspective, namely Figure 7 for Figure 6 A view taken from bottom to top along the thickness direction. Please refer to the reference. Figure 6 and Figure 7 The electronic device 1 includes a middle frame 12, at least one button assembly, a connector 14, and a circuit board (not shown in the figure), the circuit board being disposed within the receiving space enclosed by the middle frame 12. Figure 6 In the illustrated embodiment, the button assembly may include a first button assembly 13a and a second button assembly 13b. The first button assembly 13a may be a power button, and the second button assembly 13b may be a volume button. Both the first button assembly 13a and the second button assembly 13b are mounted on the side end of the middle frame 12 along the width direction X. The connector 14 has a certain bending shape. One end of the connector 14 is electrically connected to the first button assembly 13a and the second button assembly 13b, and the other end is electrically connected to the circuit board.

[0135] The middle frame 12 is provided with a third mounting groove 129 that is recessed downward along the thickness direction. The third mounting groove 129 is used to install a fixing component (described in detail below) that fixes the first button assembly 13a and the second button assembly 13b to the middle frame 12.

[0136] It should be noted that the connector 14 can be a flexible circuit board and wires with a certain bending shape. Alternatively, the connector can be other components that can realize the electrical connection between the button assembly and the circuit board; this embodiment does not specifically limit the specific components.

[0137] Specifically, such as Figure 8 The diagram shown is a schematic representation of the middle frame 12, and is a schematic view of the middle frame 12 as seen from the outside of the electronic device. Figure 9 As shown Figure 8 Please refer to the cross-sectional view taken along the length of the electronic device at the location of the first connecting hole (second connecting hole). Figure 8 and Figure 9 The middle frame 12 is provided with a first mounting groove 125, a first connecting hole 126, a receiving groove 122, a second mounting groove 127, and a second connecting hole 128. The openings of the first mounting groove 125 and the second mounting groove 127 are both located on the circumferential outer surface of the middle frame 12. Along the width direction X, the first connecting hole 126 is disposed between the first mounting groove 125 and the receiving groove 122, and connects the first mounting groove 125 and the receiving groove 122. Along the width direction X, the second connecting hole 128 is disposed between the second mounting groove 127 and the receiving groove 122, and connects the second mounting groove 127 and the receiving groove 122.

[0138] The first mounting groove 125 is used to install the first operating part of the first button assembly, the first connecting hole 126 is used to install the first guide post and the first sealing ring of the first button assembly, the second mounting groove 127 is used to install the second operating part of the second button assembly, the second connecting hole 128 is used to install the second guide post and the second sealing ring of the second button assembly, and the receiving groove 122 is used to install the first sensing part of the first button assembly and the second sensing part of the second button assembly.

[0139] like Figure 10 The diagram shown illustrates the connection between the first button assembly 13a, the second button assembly 13b, and the connector 14. Figure 10The middle frame is not shown. Both the first button assembly 13a and the second button assembly 13b are electrically connected to the connector 14. Specifically, the first button assembly 13a includes a first operating part 13a1, a first sensing part 13a2, a first guide post 13a3, and a first sealing ring 13a4. The first sealing ring 13a4 is sleeved on the outer periphery of the first guide post 13a3. One end of the first guide post 13a3 is connected to the first operating part 13a1, and the other end is opposite to the first sensing part 13a2. The first sensing part 13a2 is electrically connected to the connector 14. The second button assembly 13b includes a second operating part 13b1, a second sensing part 13b2, a second guide post 13b3, and a second sealing ring 13b4. The second sealing ring 13b4 is sleeved on the outer periphery of the second guide post 13b3. One end of the second guide post 13b3 is connected to the second operating part 13b1, and the other end is opposite to the second sensing part 13b2. The second sensing part 13b2 is electrically connected to the connector 14.

[0140] Please refer to the following: Figure 8 and Figure 10 The first sensing part 13a2, the second sensing part 13b2, and a portion of the connecting member 14 are all installed in the receiving groove 122, and the first sensing part 13a2 and the second sensing part 13b2 are arranged along the length direction Y. The first operating part 13a1 is engaged in the first mounting groove 125, and the first guide post 13a3 is disposed in the first connecting hole 126 and is disposed opposite to the first sensing part 13a2. The first guide post 13a3 is sealed to the first connecting hole 126 through the first sealing ring 13a4 to prevent liquid from entering the receiving groove 122 along the first connecting hole 126. Under the action of the first operating part 13a1, the first guide post 13a3 can move relative to the first connecting hole 126 to press the first sensing part 13a2.

[0141] The second operating part 13b1 is engaged in the second mounting groove 127, and the second guide post 13b3 is disposed in the second connecting hole 128 and is positioned opposite to the second sensing part 13b2. The second guide post 13b3 is sealed to the second connecting hole 128 by the second sealing ring 13b4 to prevent liquid from entering the receiving groove 122 along the second connecting hole 128. Driven by the second operating part 13b1, the second guide post 13b3 can move along the second connecting hole 128 to press the second sensing part 13b2.

[0142] It should be noted that a portion of the structure of the first operating part 13a1 may protrude from the opening of the first mounting groove 125, or it may be flush with the edge of the opening of the first mounting groove 125. A portion of the structure of the second operating part 13b1 may protrude from the opening of the second mounting groove 127, or it may be flush with the edge of the opening of the second mounting groove 127. For details, please refer to the above description; further details will not be repeated here.

[0143] For more specific details, please refer to Figure 11 , Figure 11 For along Figure 8 Please refer to the cross-sectional view of the section where the third mounting slot and the first mounting slot (second mounting slot) connect. Figure 7 , Figure 8 and Figure 11 The middle frame 12 is also provided with a third mounting groove 129. The groove of the third mounting groove 129 is located on one side of the middle frame 12 along the thickness direction Z, that is, the third mounting groove 129 is recessed along the thickness direction Z. Please refer to the reference. Figure 8 Along the length direction Y, the third mounting groove 129 is located between the first mounting groove 125 and the second mounting groove 127, and connects the first mounting groove 125 and the second mounting groove 127.

[0144] Please continue to refer to this. Figure 8 Along the length direction Y, a first slot 125a is provided on the side of the first mounting groove 125 away from the second mounting groove 127, and a second slot 127a is provided on the side of the second mounting groove 127 away from the first mounting groove 125.

[0145] Please continue to refer to this. Figure 10 Along the length direction Y, the first operating part 13a1 is provided with a first snap-fit ​​part 13a1 a and a first mating part 13a1 b at both ends, and the second operating part 13b1 is provided with a second snap-fit ​​part 13b1 a and a second mating part 13b1 b at both ends.

[0146] The electronic device 1 also includes a fixing card 15. Along the length direction Y, one end of the fixing card 15 is provided with a first limiting part 151 and the other end is provided with a second limiting part 152. The fixing card 15 is used to restrict the first operating part 13a1 in the first mounting groove 125 and to restrict the second operating part 13a2 in the second mounting groove 127.

[0147] Please refer to the reference. Figure 8 , Figure 10 and Figure 11 After the first operating part 13a1 is installed into the first mounting slot 125, the first snap-fit ​​part 13a1a engages with the first snap-fit ​​slot 125a. After the second operating part 13b1 is installed into the second mounting slot 127, the second snap-fit ​​part 13b1a engages with the second snap-fit ​​slot 127a. The fixing clip 15 is installed in the third mounting slot 129, so that the first limiting part 151 engages with the first mating part 13a1b, and the second limiting part 152 engages with the second mating part 13b1b, thereby realizing the installation of the first operating part 13a1 and the second operating part 13b1 on the middle frame 12.

[0148] It should be noted that the first engaging portion 13a1a can be a protrusion protruding outward along the length direction Y of the first operating portion 13a1, and the first mating portion 13a1b can be a groove recessed inward along the length direction Y of the first operating portion 13a1. The second engaging portion 13b1a can be a protrusion protruding outward along the length direction Y of the second operating portion 13b1, and the second mating portion 13b1b can be a groove recessed inward along the length direction Y of the second operating portion 13b1.

[0149] Both the first operating part 13a1 and the second operating part 13b1 are made of hard plastic. When installing the first operating part 13a1 onto the middle frame, the first operating part 13a1 can be tilted first, so that the first snap-fit ​​part 13a1a is inserted into the first snap-fit ​​slot 125a, and then the first operating part 13a1 can be moved so that it is placed flat in the first mounting slot 125. When installing the second operating part 13b1 onto the middle frame, the second operating part 13b1 can be tilted first, so that the second snap-fit ​​part 13b1a is inserted into the second snap-fit ​​slot 127a, and then the second operating part 13b1 can be moved so that it is placed flat in the second mounting slot 127a. Insert the fixing clip 15 into the third mounting slot 129, and engage the first limiting part 151 with the first mating part 13a1b and the second limiting part 152 with the second mating part 13b1b, thereby limiting the first operating part 13a1 in the first mounting slot 125 and the second operating part 13b1 in the second mounting slot 127, thus enabling the first operating part 13a1 and the second operating part 13b1 to be mounted on the middle frame 12.

[0150] It should also be noted that in this embodiment, the connector 14 can be connected to the circuit board inside the electronic device 1 by crossing over the middle frame 12. For details, please refer to the above; this embodiment will not repeat them here.

[0151] In this embodiment, the first operating part 13a1 and the second operating part 13b1 are mounted on the first mounting groove 125 and the second mounting groove 127 by a fixing clip 15. The first operating part 13a1 transmits pressure to the first sensing part 13a2 through the first guide post 13a3, so that the first mounting groove 125 and the receiving groove 122 are not directly connected, and the first guide post 13a3 and the first connecting hole 126 are sealed by the first sealing ring 13a4, preventing liquid from entering the receiving groove 122 through the first connecting hole 126, thereby preventing liquid from entering the interior of the electronic device 1 and ensuring the sealing and waterproof performance of the electronic device 1.

[0152] The second operating unit 13b1 transmits pressure to the second sensing unit 13b2 through the second guide post 13b3, so that the second mounting groove 127 and the receiving groove 122 are not directly connected, and the second guide post 13b3 and the second connecting hole 128 are sealed by the second sealing ring 13b4, preventing liquid from entering the receiving groove 122 through the second connecting hole 128, thereby preventing liquid from entering the interior of the electronic device 1 and ensuring the sealing and waterproof performance of the electronic device 1.

[0153] However, this embodiment uses more components compared to... Figure 2 The embodiment shown adds a first guide post 13a3, a first sealing ring 13a4, a second guide post 13b3, a second sealing ring 13b4, and a fixing clip 15, making the structure of the electronic device more complex and increasing the sealing cost.

[0154] To address the aforementioned technical problems, this embodiment provides an electronic device that seals the location where the connector passes through the mid-frame of the electronic device, achieving waterproofing, reducing the structural complexity of the electronic device, and lowering sealing costs.

[0155] like Figure 12 The diagram shown illustrates a partial structure of an electronic device in another embodiment. The electronic device includes a mid-frame 12, a button assembly 13, a connector 14, and a circuit board (not shown). The circuit board is disposed within the area enclosed by the mid-frame 12, and the button assembly 13 is mounted on the side of the mid-frame 12. The connector 14 has a certain bending shape, with one end electrically connected to the button assembly 13 and the other end electrically connected to the circuit board.

[0156] It should be noted that the connector 14 can be a flexible circuit board and wires with a certain bending shape. Alternatively, the connector can be other components that can realize the electrical connection between the button assembly and the circuit board; this embodiment does not specifically limit the specific components.

[0157] like Figure 13 The diagram shows a partial structural view of the middle frame 12 of the electronic device 1 at the location where the button assembly 13 is installed. Figure 14 As shown Figure 13 Please refer to the cross-sectional view of the middle frame (the cross-sectional view at the location where the connecting hole connects the receiving hole and the receiving groove). Figure 13 and Figure 14 The middle frame 12 is provided with a receiving hole 121, a connecting hole 121a, a receiving groove 122, a wire passing hole 12a and a clearance notch 12b. The receiving hole 121 is connected to the receiving groove 122 through the connecting hole 121a, and the receiving groove 122 is connected to the wire passing hole 12a.

[0158] The accommodating hole 121 has its opening located on the outer circumferential surface of the middle frame 12 and extends inward toward the middle frame 12 in a direction perpendicular to the outer circumferential surface. The accommodating hole 121 is used to install the operating part of the button assembly. The accommodating groove 122 is located inside the accommodating hole 121, with its opening facing the side of the middle frame 12 in the thickness direction Z. That is, the accommodating groove 121 is recessed along the thickness direction Z. The accommodating groove 122 is used to install the sensing part of the button assembly. The receiving groove 122 has an inner sidewall and an outer sidewall that are arranged opposite to each other. The inner sidewall is located on the side closer to the receiving space. The wire through hole is provided on the inner sidewall, that is, the wire through hole 12a is opened on the sidewall of the receiving groove 122 away from the receiving hole 121. The wire through hole 12a can penetrate through the middle frame 12 in the width direction X and communicate with the area enclosed by the middle frame 12. The wire through hole 12a connects the area enclosed by the receiving groove 122 and the middle frame 12, that is, the wire through hole 12a connects the receiving space enclosed by the receiving groove 121 and the middle frame 12, so that part of the structure of the connector 14 located in the receiving groove 122 can enter the receiving space enclosed by the middle frame 12 through the wire through hole 12a. The clearance notch 12b is opened on the sidewall of the receiving groove 122 away from the wire through hole 12a to avoid the connector 14.

[0159] like Figure 15 The diagram shows the connection between the button assembly 13 and the connector 14. The button assembly 13 includes an operating part 131 and a sensing part 132. When the operating part 131 is pressed, it can directly contact the sensing part 132. The operating part 131 transmits pressure to the sensing part 132 through mechanical transmission, causing the sensing part 132 to switch states (from off to on or from on to off). The sensing part 132 is electrically connected to the connector 14, so that the sensing part 132 is electrically connected to the circuit board through the connector 14.

[0160] Please refer to the reference. Figure 13 and Figure 15 The operating part 131 is engaged in the receiving hole 121 and can move along the width direction X. Parts of the sensing part 132 and the connecting member 14 are installed in the receiving groove 122.

[0161] It should be noted that a portion of the structure of the operating part 131 may protrude from the opening of the receiving hole 121, or it may be flush with the edge of the opening of the receiving hole 121. For details, please refer to the above description; this embodiment will not repeat them here.

[0162] In this embodiment, the operating part 131 can be installed in the receiving hole 121 by snap-fit. For details, please refer to [link / reference needed]. Figure 15 The operating part 131 includes a snap-fit ​​part 131a, which can be made of soft plastic. Please refer to the reference. Figure 13After the snap-fit ​​portion 131a is squeezed and extends into the receiving hole 121, it can abut against the outer periphery of the receiving hole 121 to prevent the operating portion 131 from disengaging from the receiving hole 121.

[0163] like Figure 16 The above is Figure 13 The cross-sectional view shows that one end of the connector 14 is electrically connected to the sensing unit 132, and the other end passes through the wire hole 12a into the area enclosed by the middle frame 12 and is electrically connected to the circuit board, thereby realizing the electrical connection between the sensing unit 132 and the circuit board.

[0164] It should be noted that, along the length direction Y, the length of the wire hole 12a is greater than or equal to the maximum width of the part of the structure through which the connector 14 needs to pass, so that the connector 14 can pass smoothly through the wire hole 12a.

[0165] Please continue to refer to this. Figure 16 The wire hole 12a is filled with a seal 123a, which seals the gap between the hole wall of the wire hole 12a and the connector 123a. This allows the connector 14 to be sealed to the hole wall of the wire hole 12a through the seal 123a, making the wire hole 12a a sealed hole. This prevents liquid that seeps into the receiving groove 122 from entering the area enclosed by the middle frame 12 of the electronic device 1, thereby improving the sealing and waterproof performance of the electronic device 1.

[0166] In some embodiments, the seal 123a can be an adhesive, and the connector 14 is bonded to the wall of the wire hole 12a by the adhesive. Alternatively, the seal 123a can be a sealing silicone or similar material. Alternatively, the seal 123a can also be made of other materials capable of sealing the gap between the connector and the wall of the wire hole 12a; this embodiment is not limited thereto. The following description uses an adhesive as an example of the seal 123a.

[0167] Preferably, the seal 123a is formed by applying adhesive to enhance the connection strength between the seal 123a and the wall of the connector 14 and the wire hole 12a, thereby reducing the risk of the seal 123a falling out of the wire hole.

[0168] In some embodiments, the adhesive may be silicone, UV adhesive, etc., and the specific choice can be determined according to the actual situation. This embodiment does not limit the choice.

[0169] In this embodiment, the button assembly 13 is installed via a snap-fit ​​method, reducing the number of components required for fixing the button assembly 13 and thus reducing its manufacturing cost. By creating a wire-passing hole 12a on the middle frame 12, the connector 14 can pass over the middle frame 12 and enter the receiving space enclosed by the middle frame 12. Compared to the connector 14 flipping over the upper surface of the middle frame 12 to enter the receiving space, this embodiment reduces the risk of gaps between the middle frame 12 and the back cover. Furthermore, by filling the wire-passing hole 12a with a sealing element 123a to seal it, this embodiment achieves a waterproof seal while reducing the cost of the button assembly 13.

[0170] It should be noted that the middle frame 12 and the back cover 11 are connected by adhesive backing, achieving a sealed connection in the connection area between them. Furthermore, the connection areas between the middle frame 12 and other components are also sealed; for details, please refer to existing technologies, which will not be elaborated upon here.

[0171] It should also be noted that the outer layer of the connector 14 is made of waterproof material, and the connection between the connector 14 and the sensing unit 132 is sealed with adhesive to achieve a waterproof effect. Therefore, liquid seepage into the receiving groove 122 has no effect on the electrical connection between the connector 14 and the sensing unit 132.

[0172] Please refer to the reference. Figure 13 and Figure 16 After the connector 1 is bent, one end can be inserted into the wire hole 12a. Because the receiving groove 122 is narrow, it is inconvenient for operators to bend the connector 14 within it. In this embodiment, an avoidance notch 12b is provided on the side wall of the receiving groove 122 to allow for bending of the connector 14. Figure 13 It can be seen that the clearance notch 12b is recessed downward along the thickness direction Z relative to the side wall of the receiving groove 122, increasing the bending space of the connector 14, so that the operator can bend the connector 14 and insert it into the wire hole 12a.

[0173] Along the width direction X, the projection surface of the clearance notch 12b can cover the projection surface of the wire hole 12a, so that the space formed by the clearance notch 12b and the receiving groove 122 satisfies the bending curvature of the connector 14. Furthermore, the clearance notch 12b extends towards the opening of the receiving groove 122 to communicate with the external environment, so that the operator's hand (or robotic arm) can enter the receiving groove 122 along the clearance notch 12b, and bend the connector 14 in the space formed by the receiving groove 122 and the clearance notch 12b, so that the connector 14 can be inserted into the wire hole 12a.

[0174] Please continue to refer to this. Figure 16Along the thickness direction Z, the depth of the clearance notch 12b is less than the depth of the receiving groove 122. That is, the depth of the clearance notch 12b is sufficient for the connector 14 to bend and pass through the wire hole 12a; it does not need to be too deep to ensure the structural strength of the middle frame 12. Similarly, the width of the clearance notch 12b is sufficient for the connector 14 to bend and pass through the wire hole 12a; it does not need to be too wide to ensure the structural strength of the middle frame 12.

[0175] Please continue to refer to this. Figure 16 An opening section 12b1 is provided on the side of the notch 12b near the groove of the receiving groove 122. The opening section 12b1 is inclined toward the side away from the wire hole 12a to further expand the bending space of the connector 14.

[0176] Please continue to refer to the reference. Figure 13 and Figure 16 In some embodiments, the middle frame 12 is entirely made of metal and is mainly manufactured by stamping and cutting processes. The receiving hole 121, receiving groove 122, wire through hole 12a, clearance notch 12b, and opening section 12b1 are all formed by cutting with a cutting tool.

[0177] like Figure 17 The image shown is a partial schematic diagram of an electronic device. Figure 17 for Figure 12 This is a view taken from the inside of the containment space outwards. To improve waterproofing, the seal 123a needs to surround the connector 14. That is, the seal 123a is completely filled between the connector 14 and the inner walls of the wire hole 12a, ensuring that there are no gaps between the connector 14 and the inner walls of the wire hole 12a, thus guaranteeing the sealing of the wire hole 12a.

[0178] Therefore, when applying adhesive to the wire passage hole 12a, the adhesive can be applied to one side of the wire passage hole 12a along the width direction X (i.e., the thickness direction of the side wall of the middle frame itself), so that the sealant 123a fills the gap between the connector 14 and the inner side wall of the wire passage hole 12a, without having to fill the entire wire passage hole 12a, thus saving the sealant 123a. Specifically, the adhesive can be applied to the wire passage hole 12a from the inside facing the receiving space, or it can be applied to the wire passage hole 12a from the outside near the receiving groove 122.

[0179] It is preferable to apply adhesive to the inside of the wire hole 12a facing the receiving space to facilitate the flipping of the connector 14, and to fill the space between the connector 14 and each side wall of the wire hole 12a with adhesive 123a.

[0180] Please continue to refer to the following for details. Figure 17During adhesive application, the end of the connector 14 that passes through the wire hole 12a can be bent downwards first. Adhesive is then applied between the connector 14 and the wall of the wire hole 12a, specifically in the area between the upper surface of the connector 14 and the inner top and inner side walls of the wire hole 12a (the shaded area in the wire hole 12a is the area filled with the first adhesive in this application step). This allows the connector 14 to bond to the wall of the wire hole 12a using the first adhesive 123a1. Then, please refer to... Figure 18 ,like Figure 18 The diagram shows the application of adhesive in the wire hole 12a. The connector 14 is bent upwards so that there is no obstruction between the lower end face of the connector 14 and the inner bottom wall of the wire hole 12a, exposing the area between the connector 14 and the wall of the wire hole 12a that has not been adhesiveped. Adhesive is applied to the area between the lower end face of the connector 14 and the inner bottom wall of the wire hole 12a (the shaded area in the wire hole 12a is the area filled by the second adhesive in this application step), so that the second adhesive 123a2 fills the gap between the connector 14 and the inner wall of the wire hole 12a, ensuring the filling effect.

[0181] Alternatively, adhesive can be applied to both sides of the wire hole 12a along the width direction X, so that the wire hole 12a is filled with adhesive 123a, increasing the bonding area, improving the bonding strength, and further enhancing the sealing and waterproofing effect of the wire hole 12a.

[0182] It should be noted that the materials of the first adhesive and the second adhesive can be the same; the only difference between them is the location where they are filled.

[0183] Please continue to refer to this. Figure 17 and Figure 18 In some embodiments, the wire through hole 12a is generally rectangular in shape and includes four hole walls. Since the wire through hole 12a is formed by cutting, the two sides of the wire through hole 12a along the length direction Y are arc-shaped.

[0184] Among them, such as Figure 19 As shown, Figure 19 The diagram shows a cross-sectional view of the wire-through hole 12a in the middle frame 12 along the thickness direction in one embodiment. Both sides of the wire-through hole 12a along the length direction Y can be formed by an arc-shaped edge 12a3. Along the width direction X of the electronic device, and in the direction away from the receiving groove 122, the cross-sectional area of ​​the wire-through hole 12a gradually increases.

[0185] In this embodiment, a wire hole 12a is formed by cutting one side of the tool, so that both sides of the wire hole 12a along the length direction Y are formed by an arc-shaped edge 12a3, which simplifies the cutting process.

[0186] Alternatively, please refer to Figure 20 , Figure 20The diagram shows a cross-sectional view of the through-hole in the middle frame along the thickness direction in another embodiment. Both sides of the through-hole 12a along the length direction Y can be formed by two arc-shaped edges 12a3. Specifically, the sidewall where the through-hole 12a is located has an inner surface 12d and an outer surface 12e disposed along the width direction X of the electronic device. Along the width direction X of the electronic device, the through-hole 12a includes a first segment 12a1 (the portion of the through-hole surrounded by the dashed line in the figure) and a second segment 12a2 (the portion of the through-hole surrounded by the double-dotted line in the figure), which are connected. The first segment 12a1 penetrates the inner surface 12d, and the second segment 12a2 penetrates the outer surface 12e. Along the direction away from the second segment 12a2, the cross-sectional area of ​​the first segment 12a1 gradually increases, and along the direction away from the first segment 12a1, the cross-sectional area of ​​the second segment 12a2 gradually increases.

[0187] In this embodiment, a wire-passing hole 12a is formed by cutting along both sides of the tool, such that both sides of the wire-passing hole 12a along the length direction Y are formed by two arc-shaped edges. Furthermore, in this embodiment, the minimum cross-sectional area of ​​the wire-passing hole 12a along the width direction X is located at the connection point of the first hole segment 12a1 and the second hole segment 12a2, that is, the minimum diameter of the wire-passing hole 12a is located at the connection point of the first hole segment 12a1 and the second hole segment 12a2. This is different from the case where the minimum diameter of the wire-passing hole 12a is located on the side of the wire-passing hole 12a1 closer to the receiving groove 122. Figure 19 (As shown in the embodiment), it is advantageous for a portion of the connector structure to pass through the wire hole 12a.

[0188] Alternatively, in some embodiments, due to different cutting methods, the two sides of the wire hole along the thickness direction can be beveled (described in detail below), and the two sides of the wire hole along the length direction Y are arc-shaped.

[0189] Alternatively, in some embodiments, the through hole can be in the form of a pentagonal or hexagonal structure. The specific design can be determined according to the actual situation, and this embodiment does not impose any limitations.

[0190] Alternatively, in some embodiments, the middle frame includes a frame body and a covering portion surrounding the outer periphery of the frame body. The frame body is mainly manufactured by casting, and the covering portion is injection molded onto the outer periphery of the frame body (the covering portion has clearance holes communicating with the receiving holes). The receiving holes, receiving grooves, wire passage holes, clearance notches, and opening sections are all integrally formed during the casting of the frame body. The remaining details can be found elsewhere. Figure 12 The content of the embodiment shown is not repeated here.

[0191] It should be noted that the receiving holes, receiving grooves, wire passage holes, and clearance notches are all formed during the integral casting of the frame. The receiving holes, receiving grooves, wire passage holes, and clearance notches are all provided with draft angles (not shown in the figure) to facilitate demolding.

[0192] The processing method of the middle frame will be described in detail below with reference to the accompanying drawings. The processing method of the middle frame described in this embodiment is based on the electronic device described in the above embodiment.

[0193] Please refer to Figure 21 ,like Figure 21 The diagram shown illustrates the processing of the middle frame in one embodiment. The processing method for the middle frame includes the following steps:

[0194] S11: Machining a middle frame 12 with a receiving space;

[0195] S12: A receiving groove 122 recessed along the thickness direction of the middle frame 12 is machined on the side wall of the middle frame 12, and the receiving groove 122 has an inner side wall and an outer side wall arranged opposite to each other along the width direction X.

[0196] S13: Use a cutting tool to cut the inner wall to form a wire hole 12a.

[0197] In this embodiment, the middle frame 12 can be made entirely of metal. A wire through hole 12a is formed by cutting the inner wall of the receiving groove 122 on the middle frame 12 with a cutting tool. The wire through hole 12a connects the receiving groove 122 and the receiving space enclosed by the middle frame 12. The wire through hole 12a allows the connector 14 to pass through and enter the area enclosed by the middle frame 12 to make an electrical connection with the circuit board.

[0198] Specifically, step S13 may include: controlling the cutter to move along the length direction Y of the electronic device 1 to cut a distance to form a wire hole 12a.

[0199] In this embodiment, the cutting path of the tool can be input on the controller according to the length of the wire hole 12a. The controller controls the drive device to move the tool along the pre-input cutting path to cut a wire hole 12a of a predetermined diameter on the middle frame 12. The specific settings can be set according to the actual situation, and this embodiment does not limit it.

[0200] Please continue to refer to this. Figure 21 In some embodiments, the middle frame 12 is provided with multiple regions, each region housing different components, and the regions may be separated by a partition structure 12c to prevent adjacent components from contacting each other. As the structure of the electronic device 1 varies, the structure of the middle frame 12 will also change accordingly. The wire hole 12a may be located near or far from the partition structure 12c. To avoid accidentally cutting the partition structure 12c during cutting, the machining process of the middle frame 12 will differ depending on whether the location of the wire hole 12a to be machined on the middle frame 12 is near or far from the partition structure 12c.

[0201] For details, please refer to [link / reference]. Figure 21In some embodiments, if a partition structure 12c is provided near the location of the wire hole 12a to be processed in the middle frame 12, a first tool 2 can be selected as the cutting tool, which can be a bar-shaped end mill. The side wall to be processed in the middle frame 12 includes an inner surface 12d and an outer surface 12e arranged opposite to each other along the width direction X. The inner surface 12d is the surface of the middle frame 12 facing the receiving space of the electronic device, and the outer surface 12e is the surface of the receiving groove 122 away from the receiving space of the electronic device. That is, the inner surface 12d and the outer surface 12e are two surfaces of the side wall to be processed along their own thickness direction.

[0202] Please continue to refer to this. Figure 21 In this embodiment, step S13 specifically involves: placing the middle frame 12 at an angle and using the first tool 2 to cut the middle frame 12 from the inner surface 12d to form a wire hole 12a.

[0203] In this embodiment, when the location of the wire hole 12a on the middle frame 12 is close to other partition structures 12c, the middle frame 12 can be cut using the first tool 2. The cutting radius of the first tool 2 is small, which avoids the first tool 2 accidentally cutting the partition structure 12c during the cutting process.

[0204] More specifically, the middle frame 12 is tilted, and the first cutter 2 is vertically positioned. The head of the first cutter 2 is used to cut the middle frame 12 from the inner surface 12d. By tilting the middle frame 12, the first cutter 2 can cut through the wire hole 12a when it passes through the inner surface 12d. That is, the wire hole 12a cut by the first cutter 2 when it passes through the inner surface 12d penetrates through the outer surface 12e, eliminating the need to cut on the outer surface 12e.

[0205] It should be noted that, due to the inclined setting of the middle frame 12, the two sides of the machined wire hole 12a along the thickness direction Z of the electronic device are inclined.

[0206] When machining the wire holes, the angle at which the middle frame 12 is tilted can be from 45° to 85°. For example, the angle at which the middle frame 12 is tilted can be 45°, 50°, 55°, 62°, 65°, 70°, 75°, 80°, 85°, etc., and can be set according to the actual situation. This embodiment does not limit it here.

[0207] Alternatively, please refer to Figure 22 and Figure 23 , Figure 22 This is a schematic diagram of the machining of the through hole 12a in another embodiment (the solid line in the figure represents the initial position of the tool, and the dashed line represents the position where the tool finishes cutting). Figure 23The diagram shows a cross-sectional view of the wire hole 12a along its thickness direction (the shaded area represents the wire hole 12a). In this embodiment, if a partition structure 12c is provided near the location of the wire hole 12a to be processed in the middle frame 12, a second tool 3 can be selected as the cutting tool. The second tool 3 is a T-shaped tool, and its cutting radius is smaller than the width of the wire hole 12a. The sidewall to be processed in the middle frame 12 includes an inner surface 12d and an outer surface 12e arranged opposite each other along the width direction X. The inner surface 12d is the surface of the middle frame 12 facing the receiving space of the electronic device, and the outer surface 12e is the surface of the receiving groove 122 facing away from the receiving space of the electronic device. That is, the inner surface 12d and the outer surface 12e are two surfaces of the sidewall to be processed along their own thickness direction.

[0208] In this embodiment, step S13 may specifically include: placing the middle frame 12 horizontally, and using the second cutter 3 to cut the middle frame 12 from the inner surface 12d and the outer surface 12e respectively to form a wire hole 12a.

[0209] In this embodiment, when the location of the wire hole 12a on the middle frame 12 is close to other partition structures 12c, the middle frame 12 can be cut with a second tool 3. The cutting radius of the second tool 3 is small, which avoids the second tool 3 accidentally cutting the partition structure 12c during the cutting process.

[0210] More specifically, the middle frame 12 is set horizontally and the second cutter 3 is set vertically. The head of the second cutter 3 is used to cut the side wall of the middle frame 12 to be processed from one side of the inner surface 12d to form a first wire groove. The head of the second cutter 3 is used to cut the side wall of the middle frame 12 to be processed from one side of the outer surface 12e to cut the first wire groove into a through hole structure to form a wire hole 12a.

[0211] Please continue to refer to this. Figure 23 In this embodiment, since the second tool 3 processes the wire hole 12a from the inner surface 12d and the outer surface 12e respectively, both sides of the wire hole 12a along the length direction Y are two connected arc-shaped sides. Specifically, the wire hole 12a includes a first hole segment and a second hole segment that are connected along the thickness direction of the electronic device. Please refer to the above text for details. Figure 20 The content of the illustrated embodiment will not be repeated here.

[0212] Alternatively, please refer to Figure 24 , Figure 24A cross-sectional schematic diagram of the through hole 12a to be processed in another embodiment (the shaded area in the figure represents the through hole 12a). In this embodiment, if there is no partition structure 12c near the location of the through hole 12a to be processed in the middle frame 12, a third tool 4 can be used as the cutting tool. The third tool 4 is a T-shaped tool, and the cutting radius of the third tool 4 is greater than the width of the through hole 12a. The side wall to be processed in the middle frame 12 includes an inner surface 12d and an outer surface 12e arranged opposite to each other along the width direction X. The inner surface 12d is the surface of the middle frame 12 facing the receiving space of the electronic device, and the outer surface 12e is the surface of the receiving groove 122 facing away from the receiving space of the electronic device. That is, the inner surface 12d and the outer surface 12e are two surfaces of the side wall to be processed along their own thickness direction.

[0213] In this embodiment, step S13 may specifically include: placing the middle frame 12 horizontally and using a third tool 4 to cut the middle frame 12 from the inner surface 12d to form a wire hole 12a.

[0214] In this embodiment, when the location of the wire hole 12a on the middle frame 12 is far from other partition structures 12c, a third tool 4 can be used to cut the middle frame 12. The third tool 4 has a large cutting radius and can cut the wire hole 12a in one go, improving processing efficiency.

[0215] More specifically, the middle frame 12 is placed horizontally, and the third cutter 4 is set vertically. The head of the third cutter 4 is used to cut the middle frame 12 from the inner surface 12d, so that when the third cutter 4 passes through the inner surface 12d, it can cut through the wire hole 12a. That is, the wire hole 12a cut by the third cutter 4 when passing through the inner surface 12d penetrates through the outer surface 12e to form the wire hole 12a, without the need to cut on the outer surface 12e.

[0216] Please continue to refer to this. Figure 20 In this embodiment, since the third tool 4 processes the through hole 12a from the inner surface 12d, both sides of the through hole 12a along the length direction Y are arc-shaped edges. For details, please refer to the above text. Figure 19 The content of the illustrated embodiment will not be repeated here.

[0217] In this embodiment, step S12 may specifically include: machining a recessed receiving hole 121 along the width direction X of the middle frame 12 on the side wall of the middle frame 12, and connecting the receiving groove 122 and the receiving hole 121 through a connecting hole 121a. For details, please refer to the above description; this embodiment will not repeat them here.

[0218] In addition, this application also provides a method for assembling an electronic device, used to assemble the electronic device described in any of the above embodiments.

[0219] Please refer to the reference. Figures 13 to 16 The assembly method includes the following steps:

[0220] S21: Install the operation part 131 of the button assembly 13 into the receiving hole 121, and install the sensing part 132 of the button assembly 12 into the receiving groove 122 of the middle frame 12.

[0221] S22: One end of the connector 14 is electrically connected to the sensing part 132 in the receiving groove 122, and the other end of the connector 14 is extended through the wire hole 12a on the inner side wall of the receiving groove 133 into the receiving space enclosed by the middle frame 12.

[0222] S23: The gap between the connector 14 and the wall of the wire hole 12a is sealed by the sealing element 123a;

[0223] S24: Connect the other end of connector 14 to the circuit board.

[0224] Will

[0225] The connector 14 can be electrically connected to the sensing unit by welding, bonding, or other methods. The remaining details are as described above and will not be repeated here.

[0226] Please refer to Figure 17 The above step S23 specifically includes S231.

[0227] S231: Apply adhesive to the wire hole 12a to bond the connector 14 to the wall of the wire hole 12a with adhesive.

[0228] For details, please refer to the above text; this embodiment will not repeat them here.

[0229] Please refer to the reference. Figure 17 and Figure 18 The above step S231 may specifically include the following steps:

[0230] S2311: Bend the other end of connector 14 downward within the receiving space and make it contact the circuit board;

[0231] S2312: Apply adhesive between the connector 14 and the wall of the wire hole 12a, so that the connector 14 and the wall of the wire hole 12a are bonded together by the first adhesive 123a1.

[0232] S2313: Bend the other end of the connector 14 upward within the receiving space to expose the area between the connector 14 and the wall of the wire hole 12a that is not glued.

[0233] S2314: Apply adhesive to the un-adhesive area to bond the connector 14 to the wall of the wire hole 12a using the second adhesive 123a2;

[0234] S2315: Bend the other end of connector 14 downwards and connect it to the circuit board.

[0235] The specific details of this embodiment can be found above, and will not be repeated here.

[0236] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple.

[0237] The above descriptions are merely specific implementations of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. An electronic device, characterized in that, The electronic device includes: The middle frame has a receiving space, and the side wall of the middle frame is provided with a receiving groove and a wire passing hole, the wire passing hole connecting the receiving space and the receiving groove; A circuit board, wherein the circuit board is disposed within the receiving space; A button assembly, the button assembly including a sensing part, the sensing part being mounted in the receiving groove; A connector, one end of which is electrically connected to the button assembly, and the other end of which passes through the wire hole and is electrically connected to the circuit board; The wire passage hole is filled with a sealant, which seals the gap between the hole wall and the connector.

2. The electronic device according to claim 1, characterized in that, The sealing element is an adhesive, and the connector is bonded to the wall of the wire hole by the adhesive.

3. The electronic device according to claim 1 or 2, characterized in that, The receiving groove is recessed along the thickness direction of the electronic device, and along the width direction of the electronic device, the receiving groove has an inner sidewall and an outer sidewall that are disposed opposite to each other. The inner sidewall is located on the side close to the receiving space, and the wire hole is disposed on the inner sidewall.

4. The electronic device according to claim 3, characterized in that, The inner sidewall has an inner surface and an outer surface that are disposed opposite to each other along the width direction of the electronic device. Along the width direction of the electronic device, the wire hole includes a first hole segment and a second hole segment that are connected to each other. The first hole segment penetrates the inner surface, and the second hole segment penetrates the outer surface. Along the direction away from the second hole segment, the cross-sectional area of ​​the first hole segment gradually increases, and along the direction away from the first hole segment, the cross-sectional area of ​​the second hole segment gradually increases.

5. The electronic device according to claim 4, characterized in that, The sidewalls of both the first and second hole segments are arc-shaped.

6. The electronic device according to claim 3, characterized in that, The outer side wall is provided with a recessed clearance notch along the thickness direction of the electronic device. The clearance notch is used to avoid the bending of the connector into the wire hole.

7. The electronic device according to claim 6, characterized in that, The projection surface of the clearance notch along the width direction of the electronic device covers the projection surface of the through hole, and / or the depth of the clearance notch is less than the depth of the receiving groove.

8. The electronic device according to claim 6, characterized in that, The clearance gap has an opening section, the sidewall of which slopes outward from the clearance gap.

9. The electronic device according to any one of claims 1 to 8, characterized in that, The button assembly also includes an operation part connected to the sensing part, and the middle frame is also provided with a receiving hole, which is recessed along the width direction of the electronic device, and the operation part is mounted in the receiving hole; The receiving hole and the receiving groove are connected through a connecting hole, and a part of the structure of the operating part passes through the connecting hole and is connected to the sensing part.

10. A method for processing the mid-frame of an electronic device, characterized in that, The method includes: A middle frame with storage space is fabricated; A receiving groove is machined into the side wall of the middle frame, which is recessed along the thickness direction of the middle frame, and the receiving groove has an inner side wall and an outer side wall that are arranged opposite to each other along the width direction. The inner wall is cut with a cutting tool to form a wire hole.

11. The method for processing the mid-frame of an electronic device according to claim 10, characterized in that, When cutting the inner wall with a cutting tool to form a wire hole, the method includes: The middle frame is placed at an angle, and the inner sidewall is cut with a first tool to form the wire hole; The first cutting tool is a rod-shaped end mill, and the inclination angle of the middle frame is 45° to 85°.

12. The method for processing the mid-frame of an electronic device according to claim 10, characterized in that, The inner wall has an inner surface and an outer surface that are disposed opposite to each other along the width direction of the electronic device, and the inner surface is close to the receiving space; When cutting the inner wall with a cutting tool to form a wire hole, the method includes: The middle frame is placed horizontally, and the second cutter is used to cut the middle frame from the inner surface and the outer surface respectively to form the wire hole; The cutting radius of the second tool is smaller than the width of the through hole.

13. The method for processing the mid-frame of an electronic device according to claim 10, characterized in that, The inner wall has an inner surface and an outer surface that are disposed opposite to each other along the width direction of the electronic device, and the inner surface is close to the receiving space; When cutting the inner wall with a cutting tool to form a wire hole, the method includes: The middle frame is placed horizontally, and the middle frame is cut from the inner surface using a third tool to form the wire hole; The cutting radius of the third tool is greater than the width of the through hole.

14. The method for processing the mid-frame of an electronic device according to claim 10, characterized in that, When machining a recessed receiving groove along the thickness direction of the middle frame into the side wall of the middle frame, the method further includes: A recessed receiving hole is machined into the side wall of the middle frame along the width direction of the middle frame, and the receiving groove is connected to the receiving hole through a connecting hole.

15. A method for assembling an electronic device, used to assemble the electronic device according to any one of claims 1 to 9, characterized in that, The method includes: The sensing part of the button assembly is installed in the receiving slot of the middle frame; One end of the connector is electrically connected to the sensing part inside the receiving groove, and the other end of the connector is extended through the wire hole on the inner side wall of the receiving groove into the receiving space enclosed by the middle frame. The gap between the connector and the wall of the wire passage hole is sealed by a sealing element; The other end of the connector is electrically connected to the circuit board within the receiving space.

16. The assembly method of the electronic device according to claim 15, characterized in that, When sealing the gap between the connector and the wall of the wire passage hole using the sealant, the method includes: Apply adhesive to the wire hole to bond the connector to the wall of the wire hole.

17. The assembly method of the electronic device according to claim 16, characterized in that, When applying adhesive into the wire hole to bond the connector to the wall of the wire hole using adhesive, the method includes: The other end of the connector is bent downward within the receiving space and makes contact with the circuit board. Apply adhesive between the connector and the wall of the wire-passing hole to bond the connector to the wall of the wire-passing hole using the first adhesive. The other end of the connector is bent upward within the receiving space to expose the area between the connector and the wall of the wire hole that is not glued. Apply adhesive to the un-adhesive area to bond the connector to the wall of the wire hole using a second adhesive. The other end of the connector is bent downward within the receiving space and comes into contact with the circuit board.

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