Heat dissipating driver and electronic device
By designing a vibration system and flow regulation components, and combining them with the use of balance holes, the problem of high airflow velocity but low total flow rate in existing technologies has been solved, thus achieving efficient heat dissipation for electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GOERTEK INC
- Filing Date
- 2026-03-30
- Publication Date
- 2026-06-02
AI Technical Summary
Existing heat dissipation drivers exhibit high airflow velocity but low total flow rate under high load conditions, resulting in obstructed airflow channels, affecting unidirectional sealing performance and heat dissipation stability, and making it difficult to meet the heat dissipation requirements of electronic devices.
A heat dissipation actuator was designed, which includes a vibration system and a flow regulation component. By using the cooperation between the cover plate and the connecting hole, the vibration system generates a pressure difference to control the unidirectional flow of air. A balance hole is set on the cover plate to buffer the air pressure difference, prevent the cover plate from deflecting, and ensure stable airflow.
It achieves stable unidirectional airflow, improves heat dissipation efficiency, maintains a good heat dissipation effect, and adapts to the heat dissipation requirements under high load operation.
Smart Images

Figure CN122138381A_ABST