Light emitting diode and method of manufacturing the same

By reducing the number of photomasks and adopting novel semiconductor stack-up and electrode structures, the problems of high cost and low brightness in existing LED manufacturing have been solved, achieving more efficient current distribution and light output.

CN122138532APending Publication Date: 2026-06-02ENNOSTAR CORP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ENNOSTAR CORP
Filing Date
2020-05-19
Publication Date
2026-06-02

Smart Images

  • Figure CN122138532A_ABST
    Figure CN122138532A_ABST
Patent Text Reader

Abstract

This invention discloses a light-emitting diode (LED) and a method for manufacturing the same. The LED comprises: a semiconductor stack including a first semiconductor layer, a light-emitting layer, a second semiconductor layer, and a first through-well located in the semiconductor stack, wherein the first through-well includes sidewalls and a bottom, wherein the sidewalls include the sidewalls of the second semiconductor layer, the sidewalls of the light-emitting layer, and a portion of the sidewalls of the first semiconductor layer, and the bottom includes the upper surface of the first semiconductor layer; a conductive layer formed on the semiconductor stack and electrically connected to the second semiconductor layer; an insulating layer formed on the conductive layer, including a first opening and a first blocking island, wherein the first blocking island covers the first through-well; a first electrode layer formed on the insulating layer and electrically connected to the first semiconductor layer; and a second electrode layer formed on the insulating layer and contacting the conductive layer through the first opening; wherein, in a top view, the first opening surrounds the first through-well and the first blocking island.
Need to check novelty before this filing date? Find Prior Art