Display panel, manufacturing method thereof and display device

Abstract

This application relates to the field of display device technology, providing a display panel and its manufacturing method, as well as a display device. The display panel includes: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure enclosing an isolation opening; a light-emitting layer disposed on one side of the substrate, the light-emitting layer including a plurality of light-emitting units spaced apart from each other, the light-emitting units corresponding to the isolation opening; a plurality of first encapsulation units, the first main body portion of the first encapsulation unit covering the side of the light-emitting unit away from the substrate, the first bent portion located on the isolation structure; and a plurality of second encapsulation units, the second main body portion of the second encapsulation unit covering the side of the light-emitting unit away from the substrate, the second bent portion located on the isolation structure, the second bent portion bending at least partially toward the side closer to the second main body portion, and the second bent portion and the first bent portion overlapping each other on the isolation structure to form a closed structure. The display panel of this application has good display effect.

Description

Technical Field

[0001] This application belongs to the field of display device technology, and in particular relates to a display panel and its manufacturing method, and a display device. Background Technology

[0002] With the development of display technology, OLED (Organic Light Emitting Diode) display components have been widely used due to their advantages such as being thinner and lighter, brighter, having lower power consumption, faster response, and higher resolution.

[0003] In the manufacturing process of display panels using related technologies, the manufacturing yield and performance reliability of display panels need to be improved. Summary of the Invention

[0004] In view of this, embodiments of this application provide a display panel, a method for manufacturing the same, and a display device.

[0005] A first aspect of this application provides a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure enclosing an isolation opening; a light-emitting layer disposed on one side of the substrate, the light-emitting layer comprising a plurality of light-emitting units spaced apart from each other, the light-emitting units being correspondingly disposed with respect to the isolation opening; a plurality of first encapsulation units, corresponding to one of two adjacent light-emitting units, the first encapsulation unit comprising a first main body portion and a first bent portion connected to each other, the first main body portion covering the side of the light-emitting unit away from the substrate, the first bent portion being located on the isolation structure; and a plurality of second encapsulation units, corresponding to the other of the two adjacent light-emitting units, the second encapsulation unit comprising a second main body portion and a second bent portion connected to each other, the second main body portion covering the side of the light-emitting unit away from the substrate, the second bent portion being located on the isolation structure, the second bent portion being at least partially bent toward the side closer to the second main body portion, and the second bent portion and the first bent portion overlapping each other on the isolation structure to form a closed structure.

[0006] The aforementioned display panel, by placing the first bent portion of the first encapsulation unit corresponding to one of the two adjacent light-emitting units on the isolation structure, and placing the second bent portion of the second encapsulation unit corresponding to the other of the two adjacent light-emitting units on the isolation structure, with the second bent portion bent at least partially towards the side closer to the second main body, allows the second bent portion and the first bent portion to overlap on the isolation structure to form a closed structure. This makes it difficult for etching solution during processing to penetrate into the light-emitting unit through the overlap between the second bent portion and the first bent portion, thus providing good isolation and protection for the light-emitting unit. This prevents damage to the light-emitting unit due to etching solution intrusion, avoiding the problem of dark spots in the light-emitting unit, and improving the display effect of the display panel.

[0007] In one embodiment, the first bent portion satisfies the following relationship: α ≥ 110°; wherein, the first bent portion has a bent end face, and α is the angle between the bent end face and the plane of the substrate; preferably, α = 125°-160°. By ensuring that the angle α between the bent end face of the first bent portion and the plane of the substrate satisfies the above relationship, it is convenient for the second bent portion and the first bent portion to overlap on the isolation structure to form a closed structure, and it is also convenient to process and manufacture the second bent portion.

[0008] In one embodiment, the first packaging unit and the second packaging unit satisfy the following relationship: 1μm≤L≤2μm; where L is the length of the orthographic projection of the overlapping surfaces of the first and second bending portions on the substrate. By ensuring that the overlapping surfaces of the first and second bending portions satisfy the above condition, the coverage area of ​​the closed structure formed by the overlapping of the second and first bending portions is more reasonable.

[0009] In one embodiment, the light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, with the second and third light-emitting units located on opposite sides of the first light-emitting unit. The first encapsulation unit is correspondingly configured with the first light-emitting unit, and the second encapsulation unit is correspondingly configured with both the second and third light-emitting units; or the first encapsulation unit is correspondingly configured with both the second and third light-emitting units, and the second encapsulation unit is correspondingly configured with both the first and third light-emitting units; or the first encapsulation unit is correspondingly configured with both the second and third light-emitting units and the side of the first light-emitting unit closest to the third light-emitting unit, and the second encapsulation unit is correspondingly configured with both the third and first light-emitting units and the side of the first light-emitting unit closest to the second light-emitting unit; or the first encapsulation unit is correspondingly configured with both the third and first light-emitting units and the side of the first light-emitting unit closest to the third light-emitting unit, and the second encapsulation unit is correspondingly configured with both the second and third light-emitting units and the side of the first light-emitting unit closest to the third light-emitting unit. This configuration allows for multiple different correspondences between the first and second encapsulation units and the first, second, and third light-emitting units, facilitating flexible selection based on actual processing and usage requirements.

[0010] In one embodiment, both the first packaging unit and the second packaging unit include multiple sub-packaging layers stacked sequentially, with different densities among the sub-packaging layers. Preferably, the density of the sub-packaging layer closer to the substrate is less than the density of the sub-packaging layer farther from the substrate. Preferably, both the first packaging unit and the second packaging unit include a first sub-packaging layer, a second sub-packaging layer, and a third sub-packaging layer stacked sequentially, wherein the first sub-packaging layer, the second sub-packaging layer, and the third sub-packaging layer satisfy the following relationship: K1 < K2 < K3, where the density of the first sub-packaging layer is K1, the density of the second sub-packaging layer is K2, and the density of the third sub-packaging layer is K3. Preferably, the first sub-packaging layer comprises silicon nitride, the second sub-packaging layer comprises silicon oxynitride, and the third sub-packaging layer comprises silicon oxide. This design allows the sub-packaging layers with different densities to have different etching rates during processing, facilitating the forming of the first bend in the first packaging unit and the second bend in the second packaging unit.

[0011] In one embodiment, the isolation structure includes an isolator and a blocking portion stacked sequentially, wherein the orthographic projection of the isolator on the substrate lies within the orthographic projection of the blocking portion on the substrate. This arrangement facilitates the fabrication of the isolation structure and allows the light-emitting unit to be fabricated without the need for a mask.

[0012] In one embodiment, the first bend is at least partially spaced from the blocking portion along a direction perpendicular to the substrate surface. This design ensures that the placement of the first bend is not affected or restricted by the blocking portion, thus improving the flexibility of its placement.

[0013] In one embodiment, the first packaging unit further includes a first connecting portion, which connects the first main body portion and the first bending portion; preferably, the first connecting portion at least partially contacts the sidewall of the isolator; preferably, the first connecting portion at least partially contacts the side surface of the blocking portion facing the substrate. By providing the first connecting portion to connect the first main body portion and the first bending portion, a smooth transition effect is achieved between the first main body portion and the first bending portion.

[0014] In one embodiment, one end of the second bend is connected to one side surface of the blocking portion. This design improves the structural stability of the second bend, thereby facilitating the overlap of the second bend and the first bend in the isolation structure to form a closed structure.

[0015] In one embodiment, the second packaging unit further includes a second connecting portion, which connects the second main body portion and the second bent portion. Along a direction perpendicular to the substrate surface, the second connecting portion is at least partially spaced from the blocking portion. Preferably, the second connecting portion at least partially contacts the sidewall of the isolator. Preferably, the second connecting portion at least partially contacts the side surface of the blocking portion facing the substrate. By providing the second connecting portion to connect the second main body portion and the second bent portion, a smooth transition effect is achieved between the second main body portion and the second bent portion.

[0016] In one embodiment, the second packaging unit further includes an extension connected to the side of the second bent portion opposite to the surface of the isolation structure, the extension extending from the second bent portion toward the side opposite to the second main body. The extension provides a certain degree of protection for the second bent portion.

[0017] In one embodiment, the orthographic projection of the overlapping surfaces of the first and second bends on the substrate lies within the orthographic projection of the extension on the substrate. This design allows the extension to provide some protection to the overlapping surfaces of the first and second bends.

[0018] In one embodiment, the extension and the first bend are spaced apart from each other along a direction perpendicular to the surface of the substrate. This design ensures that the arrangement of the extension is not affected or restricted by the first bend, thus improving the flexibility of the extension's arrangement.

[0019] In one embodiment, a light-emitting material layer is provided between the second bend and the isolation structure. This design also prevents etching solution during processing from penetrating the overlap between the second bend and the first bend and entering the light-emitting unit.

[0020] A second aspect of this application provides a method for manufacturing a display panel, comprising: forming an isolation structure on a substrate, the isolation structure enclosing an isolation opening; forming a first light-emitting material layer and a first encapsulation unit material layer on the substrate; etching the first light-emitting material layer and the first encapsulation unit material layer to form a first light-emitting unit and a first encapsulation unit corresponding to the first light-emitting unit, the first encapsulation unit including a first main body portion and a first bent portion connected to each other, the first main body portion covering the side of the first light-emitting unit away from the substrate, the first bent portion being located on the isolation structure; forming a second light-emitting material layer and a second encapsulation unit material layer on the substrate; etching the second light-emitting material layer and the second encapsulation unit material layer... The base material layer is etched to form a second light-emitting unit and a second encapsulation unit corresponding to the second light-emitting unit. The second light-emitting unit is adjacent to the first light-emitting unit. The second encapsulation unit includes a second main body portion and a second bent portion connected to each other. The second main body portion covers the side of the second light-emitting unit away from the substrate. The second bent portion is located on the isolation structure. The second bent portion is bent at least partially toward the side closer to the second main body portion. The second bent portion and the first bent portion overlap each other on the isolation structure to form a closed structure. The first bent portion satisfies the following relationship: α≥110°; the first bent portion has a bent portion end face, where α is the angle between the bent portion end face and the plane where the substrate is located.

[0021] The above-described manufacturing method involves encapsulating the first light-emitting unit with a first encapsulation unit and the second light-emitting unit with a second encapsulation unit. Furthermore, the second bending portion of the second encapsulation unit is bent at least partially towards the side closest to the second main body. This allows the second bending portion of the second encapsulation unit and the first bending portion of the first encapsulation unit to overlap on the isolation structure, forming a closed structure. This makes it difficult for etching solution during processing to penetrate the overlap between the second and first bending portions and enter the light-emitting unit. This provides excellent isolation and protection for the light-emitting unit, preventing damage from etching solution intrusion and avoiding dark spots on the light-emitting unit, thus improving the display effect of the display panel.

[0022] In one embodiment, forming the first light-emitting material layer and the first encapsulation unit material layer on the substrate includes: forming the first light-emitting material layer and a multilayer of sub-encapsulation material layers stacked sequentially on the substrate, wherein the density of the different sub-encapsulation material layers is different; preferably, the density of the sub-encapsulation material layer on the side closer to the substrate is less than the density of the sub-encapsulation material layer on the side farther from the substrate; preferably, forming the first light-emitting material layer and the first encapsulation unit material layer on the substrate includes: forming the first light-emitting material layer and a first sub-encapsulation material layer, a second sub-encapsulation material layer and a third sub-encapsulation material layer stacked sequentially on the substrate, wherein the first sub-encapsulation material layer, the second sub-encapsulation material layer and the third sub-encapsulation material layer satisfy the following relationship: K1 < K2 < K3, wherein the density of the first sub-encapsulation material layer is K1, the density of the second sub-encapsulation material layer is K2, and the density of the third sub-encapsulation material layer is K3; preferably, the first sub-encapsulation material layer includes silicon nitride, the second sub-encapsulation material layer includes silicon oxynitride, and the third sub-encapsulation material layer includes silicon oxide. With this configuration, the etching rates of the sub-encapsulation material layers with different densities are different during processing, which facilitates the processing and forming of the first bending portion in the first encapsulation unit and the second bending portion in the second encapsulation unit.

[0023] In one embodiment, the material layer of the second packaging unit is formed by chemical vapor deposition. Forming it by chemical vapor deposition facilitates the fabrication of the second bend in the second packaging unit.

[0024] A third aspect of this application provides a display device, including a display panel as described in the first aspect; or a display panel prepared by the method for manufacturing a display panel as described in the second aspect. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a top view of a display panel provided in one embodiment of this application;

[0027] Figure 2 This is a cross-sectional structural diagram of a display panel provided in one embodiment of this application;

[0028] Figure 3This is a partial enlarged schematic diagram of the isolation structure and encapsulation unit in a display panel provided in one embodiment of this application;

[0029] Figure 4 This is a flowchart of a method for manufacturing a display panel according to one embodiment of this application;

[0030] Figure 5 This is a structural schematic diagram of the manufacturing process of a display panel provided in one embodiment of this application;

[0031] Figure 6 This is a structural schematic diagram of the manufacturing process of a display panel provided in another embodiment of this application;

[0032] Figure 7 This is a schematic diagram of the overall structure of a display device provided in one embodiment of this application.

[0033] Icon labels:

[0034] 10. Display device;

[0035] 100. Display panel;

[0036] 110. Substrate;

[0037] 120. Isolation structure; 121. Isolation opening; 122. Isolation body; 123. Barrier part; 124. Base;

[0038] 130, Light-emitting layer; 131, Light-emitting unit; 1311, Anode; 1312, Light-emitting functional layer; 1313, Cathode; 131A, First light-emitting unit; 131B, Second light-emitting unit; 131C, Third light-emitting unit.

[0039] 140. First packaging unit; 141. First main body; 142. First bending part; 143. First connecting part; 1441. First sub-packaging layer; 1442. Second sub-packaging layer; 1443. Third sub-packaging layer.

[0040] 150. Second packaging unit; 151. Second main body; 152. Second bending portion; 153. Second connecting portion; 154. Extension portion; 1551. First sub-packaging layer; 1552. Second sub-packaging layer; 1553. Third sub-packaging layer.

[0041] 160. Second encapsulation layer;

[0042] 170. Third encapsulation layer;

[0043] 180. Pixel limiting layer; 181. Pixel opening;

[0044] 190. Drive circuit;

[0045] 200. Luminescent material layer. Detailed Implementation

[0046] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0047] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0048] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0049] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0050] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0051] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. "A plurality" means two or more.

[0052] See Figures 1 to 3 As shown, this application embodiment provides a display panel 100, which includes a substrate 110, an isolation structure 120, a light-emitting layer 130, a plurality of first packaging units 140 and a plurality of second packaging units 150.

[0053] An isolation structure 120 is disposed on one side of the substrate 110, and the isolation structure 120 encloses an isolation opening 121. A light-emitting layer 130 is disposed on one side of the substrate 110, and the light-emitting layer 130 includes a plurality of light-emitting units 131 arranged at intervals between each other, and the light-emitting units 131 are correspondingly arranged with respect to the isolation opening 121.

[0054] The isolation structure 120 can enclose an isolation opening 121 for at least partially accommodating the light-emitting unit 131, so that the light-emitting unit 131 can be formed without the aid of a mask. That is, in the light-emitting layer 130, an isolation structure 120 is provided between a portion of two adjacent light-emitting units 131, or an isolation structure 120 is provided between every two adjacent light-emitting units 131. The specific structural form of the isolation structure 120 is not limited, as long as it can serve to separate the two light-emitting units 131.

[0055] The composition and preparation of the isolation structure 120 are detailed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, and CN. Further descriptions are provided in CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0056] The light-emitting layer 130 includes a plurality of light-emitting units 131 spaced apart from each other. Each light-emitting unit 131 corresponds to an isolation opening 121. For example, the light-emitting unit 131 can be a red light-emitting unit for emitting red light, a green light-emitting unit for emitting green light, a blue light-emitting unit for emitting blue light, or a white light-emitting unit for emitting white light, etc. The number of different types of light-emitting units 131, the arrangement of the plurality of light-emitting units 131, and the spacing between adjacent light-emitting units 131 can be flexibly set and are not limited here. The light-emitting unit 131 can emit light under the driving action of the driving circuit; specifically, the light-emitting material in the light-emitting unit 131 can emit light under the action of an electric field. In some embodiments, a pixel circuit for controlling the light-emitting unit 131 to emit light at the correct time may be provided on the substrate 110, and a driving circuit 190 for driving the light-emitting unit 131 to emit light may also be provided. The light-emitting unit 131 may include an anode 1311, a light-emitting functional layer 1312 and a cathode 1313 stacked in sequence. The anode 1311 and the cathode 1313 are opposite to each other and spaced apart. The light-emitting functional layer 1312 is disposed between the anode 1311 and the cathode 1313. After the anode 1311 and the cathode 1313 are energized respectively, an electric field can be generated between the anode 1311 and the cathode 1313, thereby enabling the light-emitting functional layer 1312 to emit light under the drive of the electric field.

[0057] Multiple first encapsulation units 140 can encapsulate and protect a portion of the light-emitting units 131 in the light-emitting layer 130, and multiple second encapsulation units 150 can encapsulate and protect another portion of the light-emitting units 131 in the light-emitting layer 130. The first encapsulation units 140 and the second encapsulation units 150 can be single-layer structures made of inorganic or organic materials, or they can be stacked structures made of at least one of inorganic or organic materials. No limitation is made here.

[0058] The first encapsulation unit 140 is disposed corresponding to one of the two adjacent light-emitting units 131. The first encapsulation unit 140 includes a first main body portion 141 and a first bending portion 142 connected to each other. The first main body portion 141 covers the side of the light-emitting unit 131 away from the substrate 110, and the first bending portion 142 is located on the isolation structure 120.

[0059] The second encapsulation unit 150 is correspondingly disposed with the other of the two adjacent light-emitting units 131. The second encapsulation unit 150 includes a second main body portion 151 and a second bending portion 152 connected to each other. The second main body portion 151 covers the side of the light-emitting unit 131 away from the substrate 110. The second bending portion 152 is located on the isolation structure 120. The second bending portion 152 is bent at least partially toward the side close to the second main body portion 151. The second bending portion 152 and the first bending portion 142 overlap each other on the isolation structure 120 to form a closed structure.

[0060] The first main body 141 and the first bending part 142 are different blocks on the first packaging unit 140 according to their respective positions and functions. The second main body 151 and the second bending part 152 are different blocks on the second packaging unit 150 according to their respective positions and functions. In the actual product, there may not be a clear boundary line on the first packaging unit 140 and the second packaging unit 150 to distinguish them.

[0061] The second bend 152 is located on the isolation structure 120, and at least partially bends towards the side closer to the second main body 151. The angle between the bend end face of the first bend 142 and the plane containing the substrate 110 is an obtuse angle, greater than 90°. Thus, between two adjacent first packaging units 140 and second packaging units 150, the second bend 152 of the second packaging unit 150 and the first bend 142 of the first packaging unit 140 overlap on the isolation structure 120 to form a closed structure. Because the second bend 152 is at least partially bent towards the side closer to the second main body 151, the etching solution during processing is less likely to penetrate into the light-emitting unit 131 through the overlap between the second bend 152 and the first bend 142.

[0062] The display panel 100 of this application embodiment has a first bent portion 142 of a first encapsulation unit 140 corresponding to one of the two adjacent light-emitting units 131 located on an isolation structure 120, and a second bent portion 152 of a second encapsulation unit 150 corresponding to the other of the two adjacent light-emitting units 131 located on the isolation structure 120. The second bent portion 152 is bent at least partially toward the side closer to the second main body portion 151. In this way, the second bent portion 152 and the first bent portion 142 can overlap each other on the isolation structure 120 to form a closed structure, making it difficult for the etching liquid during the processing to penetrate through the overlap of the second bent portion 152 and the first bent portion 142 into the light-emitting unit 131. This can provide good isolation and protection for the light-emitting unit 131, avoid damage to the light-emitting unit 131 due to the intrusion of etching liquid, and prevent the light-emitting unit 131 from having dark spots, thereby improving the display effect of the display panel 100.

[0063] As described above, the second bent portion 152 is bent at least partially toward the side closer to the second main body portion 151. The angle between the bent end face of the first bent portion 142 and the plane where the substrate 110 is located is an obtuse angle, which is greater than 90°. In some embodiments, the first bent portion 142 optionally satisfies the following relationship: α ≥ 110°; wherein, the first bent portion 142 has a bent end face, and α is the angle between the bent end face and the plane where the substrate 110 is located.

[0064] It should be noted that the end face of the bent portion is not necessarily a plane, but its surface may have a relative concave and convex structure; when the end face of the bent portion has a concave and convex structure, the angle between the common tangent plane of a set of adjacent / non-adjacent protrusions and the plane on which the substrate is located can be taken as the angle between the end face of the bent portion and the plane on which the substrate is located.

[0065] The plane on which the substrate 110 is located refers to a plane parallel to the surface of the substrate 110, such as the surface of the isolation structure 120 facing away from the substrate 110. In some specific embodiments, the included angle α between the end face of the bent portion and the plane on which the substrate 110 is located can be 110°, 115°, 120°, 123°, 135°, 140°, 150°, etc. The above are only examples of the included angle α between the end face of the bent portion and the plane on which the substrate 110 is located. In actual embodiments, the included angle α between the end face of the bent portion and the plane on which the substrate 110 is located can also be other angle values ​​that satisfy the above range.

[0066] Based on the above embodiment, the first bent portion 142 further satisfies the following relationship: α = 125°-160°. That is, the angle α between the end face of the bent portion and the plane where the substrate 110 is located can be any angle value within the range of 125°-160°. By making the angle α between the end face of the first bent portion 142 and the plane where the substrate 110 is located satisfy the above relationship, it is convenient for the second bent portion 152 and the first bent portion 142 to overlap each other on the isolation structure 120 to form a closed structure.

[0067] In some embodiments, optionally, the first packaging unit 140 and the second packaging unit 150 satisfy the following relationship: 1μm≤L≤2μm; where L is the length of the orthographic projection of the overlapping surfaces of the first bending portion 142 and the second bending portion 152 on the substrate 110. By ensuring that the overlapping surfaces of the first bending portion 142 and the second bending portion 152 satisfy the above condition, the coverage of the closed structure formed by the overlapping of the second bending portion 152 and the first bending portion 142 is more reasonable.

[0068] In some specific embodiments, the length L of the orthographic projection pattern of the overlapping surfaces of the first bending portion 142 and the second bending portion 152 on the substrate 110 can be 1μm, 1.2μm, 1.4μm, 1.5μm, 1.9μm, 2μm, etc. These are merely examples of the length L of the orthographic projection pattern of the overlapping surfaces of the first bending portion 142 and the second bending portion 152 on the substrate 110. In actual embodiments, the length L of the orthographic projection pattern of the overlapping surfaces of the first bending portion 142 and the second bending portion 152 on the substrate 110 can also be other distance values ​​within the above range. By setting the length L of the orthographic projection pattern of the overlapping surfaces of the first bending portion 142 and the second bending portion 152 on the substrate 110 to satisfy the above conditions, it is possible to facilitate the overlap between the first bending portion 142 and the second bending portion 152 while ensuring the packaging effect of the first packaging unit 140 and the second packaging unit 150.

[0069] As described above, the first encapsulation unit 140 is correspondingly configured with one of the two adjacent light-emitting units 131, and the second encapsulation unit 150 is correspondingly configured with the other of the two adjacent light-emitting units 131. In some embodiments, optionally, the light-emitting unit 131 includes a first light-emitting unit 131A, a second light-emitting unit 131B, and a third light-emitting unit 131C. The first light-emitting unit 131A, the second light-emitting unit 131B, and the third light-emitting unit 131C can have different light-emitting colors. The second light-emitting unit 131B and the third light-emitting unit 131C are respectively located on opposite sides of the first light-emitting unit 131A. Based on this, as... Figure 2As shown, the first packaging unit 140 may be configured to correspond with the first light-emitting unit 131A, and the second packaging unit 150 may be configured to correspond with the second light-emitting unit 131B and the third light-emitting unit 131C.

[0070] In other embodiments, the first encapsulation unit 140 may be correspondingly configured with the second light-emitting unit 131B and the third light-emitting unit 131C, and the second encapsulation unit 150 may be correspondingly configured with the first light-emitting unit 131A. Alternatively, the first encapsulation unit 140 may be correspondingly configured with the side of the second light-emitting unit 131B and the first light-emitting unit 131A closest to the third light-emitting unit 131C, and the second encapsulation unit 150 may be correspondingly configured with the side of the third light-emitting unit 131C and the first light-emitting unit 131A closest to the second light-emitting unit 131B. Or, the first encapsulation unit 140 may be correspondingly configured with the side of the third light-emitting unit 131C and the first light-emitting unit 131A closest to the second light-emitting unit 131B, and the second encapsulation unit 150 may be correspondingly configured with the side of the second light-emitting unit 131B and the first light-emitting unit 131A closest to the third light-emitting unit 131C.

[0071] In other words, the first encapsulation unit 140 and the second encapsulation unit 150 can be respectively configured to correspond to one or more light-emitting units 131, or they can be configured to correspond to one side of a certain light-emitting unit 131, as long as the second bending portion 152 of the second encapsulation unit 150 and the first bending portion 142 of the first encapsulation unit 140 can overlap each other on the isolation structure 120 to form a closed structure. With this configuration, there are multiple different ways to correspond between the first encapsulation unit 140 and the second encapsulation unit 150 and the first light-emitting unit 131A, the second light-emitting unit 131B and the third light-emitting unit 131C, which is convenient for flexible selection according to actual processing and use requirements.

[0072] like Figure 2 As shown, the display panel 100 may further include a second encapsulation layer 160 disposed on the side of the first encapsulation unit 140 and the second encapsulation unit 150 away from the substrate 110, and a third encapsulation layer 170 stacked on the side of the second encapsulation layer 160 away from the substrate 110. The second encapsulation layer 160 and the third encapsulation layer 170 are both integral layers, covering multiple light-emitting units 131, multiple first encapsulation units 140 and multiple second encapsulation units 150.

[0073] To facilitate the structural forming of the first bending portion 142 and the second bending portion 152, in one embodiment, both the first packaging unit 140 and the second packaging unit 150 include multiple sub-packaging layers stacked sequentially, with different densities among the sub-packaging layers. This design allows for different etching rates during processing of the sub-packaging layers with varying densities, facilitating the forming of the first bending portion 142 in the first packaging unit 140 and the second bending portion 152 in the second packaging unit 150.

[0074] Specifically, the density of the sub-encapsulation layer closer to the substrate 110 is less than that of the sub-encapsulation layer farther from the substrate 110. As a result, the etching rate of the sub-encapsulation layer closer to the substrate 110 is relatively fast, while the etching rate of the sub-encapsulation layer farther from the substrate 110 is relatively slow, allowing the second bending portion 152 to be successfully fabricated.

[0075] Furthermore, both the first packaging unit 140 and the second packaging unit 150 include a first sub-packaging layer 1441 / 1551, a second sub-packaging layer 1442 / 1552, and a third sub-packaging layer 1443 / 1553 stacked sequentially. The first sub-packaging layer 1441 / 1551, the second sub-packaging layer 1442 / 1552, and the third sub-packaging layer 1443 / 1553 satisfy the following relationship: K1 < K2 < K3, where the density of the first sub-packaging layer 1441 / 1551 is K1, the density of the second sub-packaging layer 1442 / 1552 is K2, and the density of the third sub-packaging layer 1443 / 1553 is K3. Using three sub-packaging layers facilitates the structural forming of the first bending portion 142 and the second bending portion 152, and also prevents the processing steps from becoming overly complex.

[0076] The specific materials used to manufacture the first sub-encapsulation layer 1441 / 1551, the second sub-encapsulation layer 1442 / 1552, and the third sub-encapsulation layer 1443 / 1553 are not limited, as long as the density conditions described above are met. For example, the first sub-encapsulation layer 1441 / 1551 includes silicon nitride, the second sub-encapsulation layer 1442 / 1552 includes silicon oxynitride, and the third sub-encapsulation layer 1443 / 1553 includes silicon oxide.

[0077] The specific structural form of the isolation structure 120 is not limited, such as Figure 3 As shown, in some embodiments, optionally, the isolation structure 120 includes an isolation body 122 and a blocking portion 123 stacked sequentially, and the orthographic projection of the isolation body 122 on the substrate 110 is located within the orthographic projection of the blocking portion 123 on the substrate 110.

[0078] In other words, the isolation structure 120 includes a relatively independent isolator 122 and a blocking portion 123. The isolator 122 is located on the substrate 110, and the blocking portion 123 is located on the side of the isolator 122 facing away from the substrate 110. Furthermore, the orthographic projection of the isolator 122 onto the substrate 110 lies within the orthographic projection of the blocking portion 123 onto the substrate 110. That is, the area covered by the orthographic projection of the blocking portion 123 onto the substrate 110 is relatively large, while the area covered by the orthographic projection of the isolator 122 onto the substrate 110 is relatively small, allowing the orthographic projection of the blocking portion 123 onto the substrate 110 to cover the orthographic projection of the isolator 122 onto the substrate 110. This configuration facilitates the fabrication of the isolation structure 120 and also enables the fabrication of the light-emitting unit 131 without the need for a mask.

[0079] In some embodiments, the isolation structure 120 may optionally include a base 124 located on the side of the isolation body 122 close to the substrate 110; the orthographic projection of the isolation body 122 on the substrate 110 is located within the orthographic projection of the base 124 on the substrate 110.

[0080] Similarly, the area covered by the orthographic projection of the base 124 on the substrate 110 is relatively large, while the area covered by the orthographic projection of the insulator 122 on the substrate 110 is relatively small, so that the orthographic projection of the base 124 on the substrate 110 can cover the orthographic projection of the insulator 122 on the substrate 110. This design facilitates the fabrication and molding of the isolation structure 120.

[0081] In some embodiments, optionally, the first bending portion 142 is at least partially spaced from the blocking portion 123 along a direction perpendicular to the surface of the substrate 110. This design ensures that the arrangement of the first bending portion 142 is not affected or restricted by the blocking portion 123, thereby improving the flexibility of the arrangement of the first bending portion 142.

[0082] The first bending portion 142 is connected to one side of the first main body portion 141. The first bending portion 142 can be directly connected to the first main body portion 141, or it can be connected to the first main body portion 141 by means of other structures. In one embodiment, the first packaging unit 140 further includes a first connecting portion 143, which is connected to the first main body portion 141 and the first bending portion 142. By providing the first connecting portion 143 to connect the first main body portion 141 and the first bending portion 142, a smooth transition effect is achieved between the first main body portion 141 and the first bending portion 142.

[0083] Based on the above embodiments, preferably, the first connecting portion 143 is at least partially in contact with the sidewall of the isolator 122; preferably, the first connecting portion 143 is at least partially in contact with the side surface of the blocking portion 123 facing the substrate 110. In this way, the connection tightness between the first packaging unit 140 and the isolation structure 120 can be improved by means of the first connecting portion 143, thereby improving the packaging effect of the first packaging unit 140.

[0084] Unlike the first bend 142, in some embodiments, one end of the second bend 152 is connected to one side surface of the blocking portion 123. This design improves the structural stability of the second bend 152, thereby facilitating the overlap of the second bend 152 and the first bend 142 on the isolation structure 120 to form a closed structure.

[0085] The second bending portion 152 is connected to one side of the second main body portion 151. The second bending portion 152 can be directly connected to the second main body portion 151, or it can be connected to the second main body portion 151 by means of other structures. In one embodiment, the second packaging unit 150 further includes a second connecting portion 153, which is connected to the second main body portion 151 and the second bending portion 152. Along a direction perpendicular to the surface of the substrate 110, the second connecting portion 153 is at least partially spaced from the blocking portion 123. By providing the second connecting portion 153, the second main body portion 151 and the second bending portion 152 are connected, achieving a smooth transition effect between the second main body portion 151 and the second bending portion 152.

[0086] Based on the above embodiments, preferably, the second connecting portion 153 is at least partially in contact with the sidewall of the isolator 122; preferably, the second connecting portion 153 is at least partially in contact with the side surface of the blocking portion 123 facing the substrate 110. In this way, the connection tightness between the second packaging unit 150 and the isolation structure 120 can be improved by means of the second connecting portion 153, thereby improving the packaging effect of the second packaging unit 150.

[0087] Please continue reading. Figure 3 In some embodiments, the second packaging unit 150 may optionally include an extension 154, which is connected to the side of the second bent portion 152 away from the surface of the isolation structure 120. The extension 154 extends from the second bent portion 152 toward the side away from the second main body portion 151. By providing the extension 154, the second bent portion 152 can be provided with a certain degree of protection.

[0088] In some embodiments, optionally, the orthographic projection of the overlapping surfaces of the first bend 142 and the second bend 152 on the substrate 110 lies within the orthographic projection of the extension 154 on the substrate 110. With this design, the extension 154 can provide a certain degree of protection for the overlapping surfaces of the first bend 142 and the second bend 152.

[0089] In some embodiments, optionally, the extension 154 and the first bending portion 142 are spaced apart from each other along a direction perpendicular to the surface of the substrate 110. This design ensures that the arrangement of the extension 154 is not affected or restricted by the first bending portion 142, thereby improving the flexibility of the arrangement of the extension 154.

[0090] To further avoid signal crosstalk between adjacent light-emitting units 131, in some embodiments, the display panel 100 may optionally include a pixel defining layer 180. The pixel defining layer 180 is disposed on one side of the substrate 110 and defines a plurality of pixel openings 181 spaced apart from each other. Each light-emitting unit 131 is correspondingly disposed with respect to each pixel opening 181. An isolation structure 120 is disposed on the side of the pixel defining layer 180 away from the substrate 110 and is located between at least two partially adjacent pixel openings 181. By setting the pixel defining layer 180 and the pixel openings 181 defined by the pixel defining layer 180, the light-emitting units 131 are correspondingly disposed with respect to each pixel opening 181, and the isolation structure 120 is disposed on the pixel defining layer 180, which facilitates the setting and shaping of the light-emitting units 131 and the isolation structure 120.

[0091] In one embodiment, a light-emitting material layer 200 is provided between the second bend 152 and the isolation structure 120. With this design, the light-emitting material layer 200 between the second bend 152 and the isolation structure 120 also makes it difficult for the etching solution during the processing to penetrate into the light-emitting unit 131 through the overlap between the second bend 152 and the first bend 142.

[0092] Please combine Figures 1 to 3 And see Figures 4 to 6 This application embodiment also provides a method for manufacturing a display panel 100, which includes the following steps:

[0093] S102. An isolation structure 120 is formed on the substrate 110, and the isolation structure 120 encloses an isolation opening 121.

[0094] S104. A first light-emitting material layer and a first encapsulation unit material layer are formed on the substrate 110.

[0095] S106. The first light-emitting material layer and the first packaging unit material layer are etched to form the first light-emitting unit 131 and the first packaging unit 140 corresponding to the first light-emitting unit 131. The first packaging unit 140 includes a first main body portion 141 and a first bending portion 142 connected to each other. The first main body portion 141 covers the side of the first light-emitting unit 131A away from the substrate 110, and the first bending portion 142 is located on the isolation structure 120.

[0096] After step S106 is completed, the structure of the display panel is as follows: Figure 5 As shown.

[0097] S108. A second light-emitting material layer and a second encapsulation unit material layer are formed on the substrate 110.

[0098] S110. The second light-emitting material layer and the second encapsulation unit material layer are etched to form the second light-emitting unit 131B and the second encapsulation unit 150 corresponding to the second light-emitting unit 131B. The second light-emitting unit 131B is adjacent to the first light-emitting unit 131A. The second encapsulation unit 150 includes a second main body portion 151 and a second bent portion 152 connected to each other. The second main body portion 151 covers the side of the second light-emitting unit 131B away from the substrate 110. The second bent portion 152 is located on the isolation structure 120. The second bent portion 152 is bent at least partially toward the side closer to the second main body portion 151, and the second bent portion 152 and the first bent portion 142 overlap each other on the isolation structure 120 to form a closed structure. The first bent portion 142 satisfies the following relationship: α≥110°; the first bent portion 142 has a bent portion end face, where α is the angle between the bent portion end face and the plane where the substrate 110 is located.

[0099] After step S108 is completed, the structure of the display panel 100 is as follows: Figure 6 As shown.

[0100] The manufacturing method of this application embodiment encapsulates the first light-emitting unit 131A with a first encapsulation unit 140 and the second light-emitting unit 131B with a second encapsulation unit 150. Furthermore, the second bending portion 152 of the second encapsulation unit 150 is bent at least partially towards the side closer to the second main body portion 151. Thus, the second bending portion 152 of the second encapsulation unit 150 and the first bending portion 142 of the first encapsulation unit 140 can overlap on the isolation structure 120 to form a closed structure. This makes it difficult for etching solution during processing to penetrate the overlap between the second bending portion 152 and the first bending portion 142 and invade the light-emitting unit 131. This provides good isolation and protection for the light-emitting unit 131, preventing damage caused by etching solution intrusion and avoiding the occurrence of dark spots in the light-emitting unit 131, thereby improving the display effect of the display panel 100.

[0101] In some embodiments, step S104 may optionally include: forming a first light-emitting material layer and a multilayer sub-encapsulation material layer sequentially stacked on the substrate 110, wherein the density of the different sub-encapsulation material layers is different.

[0102] Sub-encapsulation layers with different densities are etched at different rates during processing, facilitating the forming of the first bending portion 142 in the first encapsulation unit 140 and the second bending portion 152 in the second encapsulation unit 150. Specifically, the density of the sub-encapsulation material layer closer to the substrate 110 is lower than that of the sub-encapsulation material layer farther from the substrate 110. Thus, the etching rate of the sub-encapsulation layer closer to the substrate 110 is relatively faster, while the etching rate of the sub-encapsulation layer farther from the substrate 110 is relatively slower, allowing the second bending portion 152 to be successfully formed.

[0103] Further, step S104 includes: forming a first light-emitting material layer and a first sub-encapsulation material layer, a second sub-encapsulation material layer, and a third sub-encapsulation material layer sequentially stacked on the substrate 110. The first sub-encapsulation material layer, the second sub-encapsulation material layer, and the third sub-encapsulation material layer satisfy the following relationship: K1 < K2 < K3, wherein the density of the first sub-encapsulation material layer is K1, the density of the second sub-encapsulation material layer is K2, and the density of the third sub-encapsulation material layer is K3. By using three sub-encapsulation layers to fabricate the first encapsulation unit, the end face of the first bent portion 142 can be formed into a bent portion end face that meets the angle requirements through an etching process.

[0104] Similarly, step S108 includes: forming a second light-emitting material layer and a multilayer sub-encapsulation material layer stacked sequentially on the substrate 110, wherein the density of the different sub-encapsulation material layers is different.

[0105] Further, step S108 includes: forming a second light-emitting material layer and a first sub-encapsulation material layer, a second sub-encapsulation material layer and a third sub-encapsulation material layer sequentially stacked on the substrate 110, wherein the first sub-encapsulation material layer, the second sub-encapsulation material layer and the third sub-encapsulation material layer satisfy the following relationship: K1 < K2 < K3, wherein the density of the first sub-encapsulation material layer is K1, the density of the second sub-encapsulation material layer is K2 and the density of the third sub-encapsulation material layer is K3.

[0106] The sub-encapsulation material layer used to fabricate the first encapsulation unit may use the same film layer as the sub-encapsulation material layer used to fabricate the second encapsulation unit, wherein the first sub-encapsulation material layer includes silicon nitride, the second sub-encapsulation material layer includes silicon oxynitride, and the third sub-encapsulation material layer includes silicon oxide.

[0107] In one embodiment, the material layer of the second encapsulation unit is formed by chemical vapor deposition (CVD). CVD refers to the process of introducing vapors of gaseous or liquid reactants containing the elements constituting the thin film, along with other gases required for the reaction, to form a thin film on the surface of an object. It has advantages such as low deposition temperature, easy control of film composition and thickness, film thickness proportional to deposition time, good uniformity and repeatability, good step coverage, and convenient operation. Therefore, CVD facilitates the fabrication of the second bend 152 in the second encapsulation unit 150.

[0108] Please combine Figures 1 to 6 And see Figure 7 This application also provides a display device 10, which includes a display panel 100 as described in any of the above embodiments, or a display panel prepared by the manufacturing method of the display panel 100 in any of the above embodiments.

[0109] The display panel 100 disclosed in this application embodiment is applied in the display device 10 to provide the function of displaying a screen. The display device 10 can be any product or component with display function, including but not limited to mobile phones, tablets, laptops, e-readers, wearable devices, remote controls, televisions, desktop computers, vehicle equipment, etc. By employing the display panel 100 in any of the above embodiments, by placing the first bent portion 142 of the first encapsulation unit 140, which is correspondingly disposed to one of the two adjacent light-emitting units 131, on the isolation structure 120, and placing the second bent portion 152 of the second encapsulation unit 150, which is correspondingly disposed to the other of the two adjacent light-emitting units 131, on the isolation structure 120, the second bent portion 152 is bent at least partially toward the side closer to the second main body portion 151. In this way, the second bent portion 152 and the first bent portion 142 can overlap each other on the isolation structure 120 to form a closed structure, making it difficult for the etching solution during the processing to penetrate through the overlap of the second bent portion 152 and the first bent portion 142 and invade into the light-emitting unit 131. This can provide good isolation and protection for the light-emitting unit 131, avoiding damage to the light-emitting unit 131 due to the intrusion of etching solution, thus preventing the light-emitting unit 131 from having dark spots, and improving the display effect of the display panel 100.

[0110] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0111] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate, and the isolation structure encloses an isolation opening; A light-emitting layer is disposed on one side of the substrate, the light-emitting layer comprising a plurality of light-emitting units spaced apart from each other, the light-emitting units being disposed corresponding to the isolation opening; Multiple first packaging units are disposed corresponding to one of two adjacent light-emitting units. Each first packaging unit includes a first main body portion and a first bent portion connected to each other. The first main body portion covers the side of the light-emitting unit away from the substrate, and the first bent portion is located on the isolation structure. as well as A plurality of second encapsulation units are disposed corresponding to another of the two adjacent light-emitting units. Each second encapsulation unit includes a second main body portion and a second bent portion connected to each other. The second main body portion covers the side of the light-emitting unit away from the substrate. The second bent portion is located on the isolation structure. The second bent portion is bent at least partially toward the side closer to the second main body portion, and the second bent portion and the first bent portion overlap each other on the isolation structure to form a closed structure.

2. The display panel as described in claim 1, characterized in that, The first bend satisfies the following relationship: α ≥ 110°; Wherein, the first bending portion has a bending portion end face, and α is the angle between the bending portion end face and the plane where the substrate is located; Preferably, α = 125°-160°.

3. The display panel as described in claim 1, characterized in that, The first packaging unit and the second packaging unit satisfy the following relationship: 1μm≤L≤2μm; Wherein, L is the length of the orthographic projection of the overlapping surfaces of the first and second bent portions on the substrate.

4. The display panel as described in claim 1, characterized in that, The light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, wherein the second light-emitting unit and the third light-emitting unit are respectively located on opposite sides of the first light-emitting unit; The first encapsulation unit is configured correspondingly to the first light-emitting unit, and the second encapsulation unit is configured correspondingly to the second light-emitting unit and the third light-emitting unit; or The first encapsulation unit is correspondingly configured with the second light-emitting unit and the third light-emitting unit, and the second encapsulation unit is correspondingly configured with the first light-emitting unit; or The first encapsulation unit is correspondingly disposed with the second light-emitting unit and the side of the first light-emitting unit closest to the third light-emitting unit; the second encapsulation unit is correspondingly disposed with the third light-emitting unit and the side of the first light-emitting unit closest to the second light-emitting unit; or The first packaging unit is disposed corresponding to the third light-emitting unit and the side of the first light-emitting unit closer to the second light-emitting unit, and the second packaging unit is disposed corresponding to the second light-emitting unit and the side of the first light-emitting unit closer to the third light-emitting unit.

5. The display panel as described in claim 1, characterized in that, Both the first packaging unit and the second packaging unit include multiple sub-packaging layers stacked sequentially, and the density of different sub-packaging layers is different; Preferably, the density of the sub-encapsulation layer on the side closer to the substrate is less than the density of the sub-encapsulation layer on the side farther from the substrate; Preferably, both the first packaging unit and the second packaging unit include a first sub-packaging layer, a second sub-packaging layer and a third sub-packaging layer stacked sequentially, wherein the first sub-packaging layer, the second sub-packaging layer and the third sub-packaging layer satisfy the following relationship: K1 < K2 < K3, wherein the density of the first sub-packaging layer is K1, the density of the second sub-packaging layer is K2 and the density of the third sub-packaging layer is K3. Preferably, the first sub-encapsulation layer comprises silicon nitride, the second sub-encapsulation layer comprises silicon oxynitride, and the third sub-encapsulation layer comprises silicon oxide.

6. The display panel as described in claim 1, characterized in that, The isolation structure includes an isolation body and a blocking part arranged in sequence, wherein the orthographic projection of the isolation body on the substrate is located within the orthographic projection of the blocking part on the substrate.

7. The display panel as described in claim 6, characterized in that, Along a direction perpendicular to the surface of the substrate, the first bent portion is at least partially spaced apart from the blocking portion.

8. The display panel as described in claim 7, characterized in that, The first packaging unit further includes a first connecting portion, which is connected to the first main body portion and the first bending portion; Preferably, the first connecting portion is at least partially in contact with the sidewall of the insulator; preferably, the first connecting portion is at least partially in contact with the side surface of the blocking portion facing the substrate.

9. The display panel as described in claim 6, characterized in that, One end of the second bend is connected to one side surface of the blocking part.

10. The display panel as claimed in claim 9, characterized in that, The second packaging unit further includes a second connecting portion, which is connected to the second main body portion and the second bending portion. Along a direction perpendicular to the surface of the substrate, the second connecting portion is at least partially spaced apart from the blocking portion. Preferably, the second connecting portion is at least partially in contact with the sidewall of the insulator; Preferably, the second connecting portion is at least partially in contact with the side surface of the blocking portion facing the substrate.

11. The display panel as claimed in claim 1, characterized in that, The second packaging unit further includes an extension connected to the side of the second bend portion away from the surface of the isolation structure, the extension extending from the second bend portion toward the side away from the second main body portion.

12. The display panel as claimed in claim 11, characterized in that, The orthographic projection of the overlapping surfaces of the first bend and the second bend on the substrate is located within the orthographic projection of the extension on the substrate.

13. The display panel as claimed in claim 11, characterized in that, Along a direction perpendicular to the surface of the substrate, the extension portion and the first bent portion are spaced apart from each other.

14. The display panel as claimed in claim 1, characterized in that, A luminescent material layer is provided between the second bending portion and the isolation structure.

15. A method for manufacturing a display panel, characterized in that, include: An isolation structure is formed on a substrate, the isolation structure enclosing an isolation opening; A first light-emitting material layer and a first encapsulation unit material layer are formed on the substrate; The first light-emitting material layer and the first encapsulation unit material layer are etched to form a first light-emitting unit and a first encapsulation unit corresponding to the first light-emitting unit. The first encapsulation unit includes a first main body portion and a first bending portion connected to each other. The first main body portion covers the side of the first light-emitting unit away from the substrate, and the first bending portion is located on the isolation structure. A second light-emitting material layer and a second encapsulation unit material layer are formed on the substrate; The second light-emitting material layer and the second encapsulation unit material layer are etched to form a second light-emitting unit and a second encapsulation unit corresponding to the second light-emitting unit. The second light-emitting unit is adjacent to the first light-emitting unit. The second encapsulation unit includes a second main body portion and a second bent portion connected to each other. The second main body portion covers the side of the second light-emitting unit away from the substrate. The second bent portion is located on the isolation structure. The second bent portion is bent at least partially toward the side closer to the second main body portion. The second bent portion and the first bent portion overlap each other on the isolation structure to form a closed structure. The first bent portion satisfies the following relationship: α≥110°; the first bent portion has a bent portion end face, and α is the angle between the bent portion end face and the plane where the substrate is located.

16. The manufacturing method as described in claim 15, characterized in that, The formation of the first light-emitting material layer and the first encapsulation unit material layer on the substrate includes: A first light-emitting material layer and multiple sub-encapsulation material layers are formed on the substrate, and the density of the different sub-encapsulation material layers is different. Preferably, the density of the sub-encapsulation material layer on the side closer to the substrate is less than the density of the sub-encapsulation material layer on the side farther from the substrate; Preferably, forming the first light-emitting material layer and the first encapsulation unit material layer on the substrate includes: A first light-emitting material layer and a first sub-encapsulation material layer, a second sub-encapsulation material layer, and a third sub-encapsulation material layer are formed on the substrate in sequence. The first sub-encapsulation material layer, the second sub-encapsulation material layer, and the third sub-encapsulation material layer satisfy the following relationship: K1 < K2 < K3, wherein the density of the first sub-encapsulation material layer is K1, the density of the second sub-encapsulation material layer is K2, and the density of the third sub-encapsulation material layer is K3. Preferably, the first sub-encapsulation material layer comprises silicon nitride, the second sub-encapsulation material layer comprises silicon oxynitride, and the third sub-encapsulation material layer comprises silicon oxide.

17. The manufacturing method as described in claim 15, characterized in that, The material layer of the second packaging unit is formed by chemical vapor deposition.

18. A display device, characterized in that, include: The display panel as described in any one of claims 1 to 14; or A display panel prepared by the method of manufacturing a display panel according to any one of claims 15 to 17.

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