Apparatus and method for preventing wafer misplacement in a semiconductor processing apparatus

Abstract

The application discloses a device and method for preventing wafer reverse in a semiconductor processing equipment. The device for preventing wafer reverse comprises a detection mark arranged on a wafer assembly and a detection device arranged in a transmission cavity. The detection mark is arranged on the wafer assembly, and the detection device arranged in the transmission cavity is used to detect the detection mark before the wafer assembly is transmitted to a subsequent processing equipment to perform a subsequent process, so that the front and back of the wafer on the wafer assembly can be accurately judged, product damage caused by wafer reverse can be prevented, product quality and yield can be effectively improved, and device reliability can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a device and method for preventing wafers from being placed in reverse in a semiconductor processing apparatus. Background Technology

[0002] In the wafer manufacturing process, different processes require different processing equipment. When a wafer is transferred from the front-end equipment to the back-end equipment, if the wafer is placed in reverse, it may cause a variety of problems, including reduced yield, decreased device performance and reliability, increased risk of cracks and fractures, slip defects, bubble defects, and electrostatic control problems. These problems can seriously affect the quality and yield of semiconductor products.

[0003] The statements herein provide only background information in relation to this invention and do not necessarily constitute prior art. Summary of the Invention

[0004] The purpose of this invention is to provide a device and method for preventing wafer reversal in a semiconductor processing equipment, which can accurately determine the orientation of the wafer to prevent product damage caused by wafer reversal, effectively improve product quality and yield, and enhance device reliability.

[0005] To achieve the above objectives, the present invention provides a device for preventing wafer reversal, used to detect the orientation of a wafer assembly in a semiconductor processing apparatus. The wafer assembly includes a wafer protection device and a wafer disposed on the wafer protection device. The device for preventing wafer reversal includes:

[0006] A detection mark is set on the wafer protection device;

[0007] The detection device, which is installed within the semiconductor processing equipment, is used to detect the detection mark, thereby accurately determining the front and back of the wafer.

[0008] The detection marker is a barcode or a QR code.

[0009] The detection device includes a barcode scanner for reading the detection mark.

[0010] Optionally, the detection device further includes a fixing device for fixing the barcode scanner.

[0011] Optionally, the detection device further includes: a driving device connected to the barcode scanner for driving the barcode scanner to move.

[0012] The wafer protection device includes a support ring and an adhesive film. The support ring is disposed around the adhesive film. The inner diameter of the support ring is larger than the size of the wafer. The back side of the wafer is attached to the adhesive film. The front side of the wafer is the front side of the support ring and the front side of the adhesive film.

[0013] The detection mark is set on the front side of the support ring or the front side of the adhesive film.

[0014] The present invention also provides a semiconductor processing apparatus, comprising: a transmission cavity, and a front-end processing device and a back-end processing device respectively connected to the transmission cavity, wherein the device for preventing wafer reversal is provided in the transmission cavity.

[0015] The transmission cavity includes:

[0016] At least one detection position, the detection position being located below the detection device, wherein the detection device detects the detection mark when the wafer assembly is located at the detection position;

[0017] At the pickup position, when the wafer assembly is located, it awaits to be transferred to the subsequent processing device.

[0018] The transmission cavity further includes:

[0019] A first robotic arm is used to remove the wafer assembly from the front-end processing equipment and move the wafer assembly to the detection position and the pickup position;

[0020] The second robotic arm is used to transfer the inspected wafer assembly from the pick-up position to the post-processing equipment.

[0021] The transmission cavity further includes: a guide rail for supporting the wafer assembly and providing guidance for the wafer assembly, the guide rail including: at least one first position and at least one second position;

[0022] The detection location is configured as the first location;

[0023] The pickup position is configured as the second position.

[0024] Optionally, the pre-processing equipment is a wafer loading and unloading device.

[0025] Optionally, the post-processing equipment is a wafer cleaning device or a wafer dicing device.

[0026] The present invention also provides a method for preventing wafers from being placed in reverse. A wafer assembly is taken out from a front-end processing device and transferred to the transfer cavity. A detection device detects a detection mark on the wafer assembly. If the detection device detects the detection mark, it indicates that the wafer assembly is placed in the correct orientation. The wafer assembly is transferred from the transfer cavity to the back-end processing device after the detection is completed.

[0027] The first robotic arm retrieves the wafer assembly from the front-end processing equipment and moves it to the detection position. After the wafer assembly passes the detection, the first robotic arm continues to move the wafer assembly to the pickup position, and the second robotic arm transfers the wafer assembly from the pickup position to the back-end processing equipment.

[0028] The method for detecting the front and back of a wafer further includes setting the detection mark on the wafer protection device before transferring the wafer assembly to the front-end processing equipment.

[0029] Optionally, the method for the detection device to detect the detection mark on the wafer assembly includes: placing the wafer assembly on a guide rail in a transmission cavity, the guide rail including: at least one first position and at least one second position, the detection position being configured as the first position, and the pickup position being configured as the second position;

[0030] The first robotic arm moves the wafer assembly along the guide rail, causing the wafer assembly to move to a first position on the guide rail. At this time, the detection mark on the wafer assembly is located below the barcode scanner in the detection device, and the barcode scanner scans the detection mark.

[0031] The first robotic arm continues to move the detected wafer assembly to a second position on the guide rail.

[0032] Optionally, the method for the detection device to detect the detection mark on the wafer assembly includes: placing the wafer assembly on a guide rail in a transmission cavity, the guide rail including: at least one first position and at least one second position, the detection position being configured as the first position, and the pickup position being configured as the second position;

[0033] The first robotic arm places the wafer assembly at a first position on the guide rail, and the driving device in the detection equipment drives the barcode scanner to move until the barcode scanner is above the detection mark on the wafer assembly, and the barcode scanner scans the detection mark.

[0034] The first robotic arm continues to move the detected wafer assembly to a second position on the guide rail.

[0035] If the detection equipment fails to detect the detection mark, it indicates that the wafer assembly is placed in the wrong orientation, the wafer assembly fails the detection, and the machine is stopped and an alarm is triggered.

[0036] This invention sets detection marks on wafer assemblies and uses a detection device located in the transfer cavity to detect the detection marks before the wafer assemblies are transferred to the subsequent processing equipment for subsequent processes. This accurately determines the orientation of the wafer on the wafer assembly, preventing product damage caused by reversed wafer placement, effectively improving product quality and yield, and enhancing device reliability. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the wafer assembly structure.

[0038] Figure 2 This is a schematic diagram of the structure of a semiconductor processing device provided by the present invention.

[0039] Figure 3a and Figure 3b This is a schematic diagram of the detection mark provided by the present invention.

[0040] Figure 4 This is a top view of the first and second positions on the guide rail in the processing cavity.

[0041] Figure 5a This is a schematic diagram of the detection device detecting the detection mark in one embodiment of the present invention.

[0042] Figure 5b This is a schematic diagram of the detection device detecting the detection mark in another embodiment of the present invention. Detailed Implementation

[0043] The following is based on Figure 1 Figure 5 illustrates a preferred embodiment of the present invention.

[0044] Chip manufacturing is a complex process involving multiple precision steps, including silicon wafer fabrication, photolithography, etching, doping, thin film deposition, chemical mechanical polishing, inspection, and packaging. Cleaning and dicing are two particularly critical stages. Wafer cleaning aims to remove various contaminants from the wafer surface, ensuring subsequent processing steps can be performed on a clean surface. After wafer fabrication, dicing is required to separate the chips from the wafer for final packaging. If the wafer is placed upside down during cleaning or dicing due to mishandling, it will lead to a series of serious consequences. First, the cleaning effect will be affected because the front and back sides of the wafer require cleaning for different contaminants; upside down may result in incomplete contaminant removal, affecting device performance and reliability. Second, the front and back sides of the wafer may be contaminated to varying degrees during cleaning; upside down increases the risk of this contamination, leading to a decrease in yield. Furthermore, upside-down wafer placement during dicing may cause inaccurate dicing lines, affecting chip size and shape, and even potentially causing unnecessary damage to the wafer. Finally, after dicing, the wafer needs cleaning to remove abrasive debris and cutting flux generated during the dicing process; upside down may prevent the effective removal of these impurities, affecting subsequent processes. In conclusion, reverse polarity during wafer cleaning and dicing can severely impact the quality and efficiency of semiconductor manufacturing, increase production costs, and reduce product performance.

[0045] Based on this, the present invention provides a device for preventing wafers from being placed in reverse, which is installed in a semiconductor processing device for detecting the orientation of the wafer assembly 1 in the semiconductor processing device.

[0046] like Figure 1 As shown, the wafer assembly 1 includes a wafer protection device and a wafer W disposed on the wafer protection device. The wafer protection device includes a support ring 101 and an adhesive film 102. The support ring 101 is disposed around the adhesive film 102, and the inner diameter of the support ring 101 is larger than the size of the wafer W. The back side of the wafer W is adhered to the adhesive film 102, and the front side of the wafer W serves as the front side of the support ring 101 and the front side of the adhesive film 102. The support ring 101 is used to support and fix the wafer W, especially during the handling, dicing, and packaging of the wafer W. The support ring 101 can provide physical support to prevent the wafer W from deforming or being damaged during processing. The adhesive film 102 protects the surface of the wafer W during wafer dicing, maintaining the integrity of the wafer W during the dicing process, reducing problems such as chipping, displacement, and falling during dicing, and preventing scratches and contamination.

[0047] like Figure 2As shown, the semiconductor processing equipment includes: a transmission cavity 2, a front-end processing device 3 and a back-end processing device 4 respectively connected to the transmission cavity 2, and a device disposed in the transmission cavity 2 to prevent the wafer from being placed in reverse.

[0048] The device for preventing wafer reversal includes a detection mark 5 and a detection device 6. The detection mark 5 is disposed on the wafer protection device and will not obstruct or damage the wafer W, such as... Figure 3a As shown, the detection mark 5 can be pre-set on the front side of the support ring 101, such as... Figure 3b As shown, the detection mark 5 can also be pre-set on the front side of the adhesive film 102. Figure 2 As shown, the detection device 6 is disposed in the transmission cavity 2. After the wafer protection device carrying the wafer W and the detection mark 5 is transmitted from the front-end processing device 3 to the transmission cavity 2, the detection device 6 is disposed above the wafer W. The detection device 6 detects the detection mark 5 disposed on the wafer protection device. If the detection mark 5 is detected, it indicates that the front side of the wafer W is facing up, and the placement direction of the wafer assembly 1 is correct. The wafer assembly 1 passes the detection and can be transmitted from the transmission cavity 2 to the back-end processing device 4. If the detection mark 5 is not detected, it indicates that the placement direction of the wafer assembly 1 is incorrect, the wafer assembly 1 fails the detection, and the machine stops and alarms. By setting a detection mark 5 on the wafer assembly 1 and using a detection device 6 set in the transfer cavity 2 to detect the detection mark 5 before the wafer assembly 1 is transferred to the subsequent processing equipment 4 for subsequent processes, the orientation of the wafer W can be accurately determined, thereby preventing product damage caused by wafer reversal, effectively improving product quality and yield, and enhancing device reliability.

[0049] The detection device 6 includes a barcode scanner 61. Correspondingly, the detection mark 5 uses a barcode or QR code, or other information carrier that is easily read by the barcode scanner 61. The barcode scanner 61 is mature hardware, with the advantages of high efficiency, accuracy, and convenience, and is easy to integrate into existing systems and devices.

[0050] like Figure 2As shown, the transmission cavity 2 has at least one detection position 201 and one pickup position 202. The detection position 201 is located below the detection device 6. When the wafer assembly 1 is located at the detection position 201, the detection device 6 detects the detection mark 5. When the wafer assembly 1 is located at the pickup position 202, the wafer assembly 1 waits to be transferred to the subsequent processing device 4. The transmission cavity 2 also has a first robotic arm 21 and a second robotic arm 22. The first robotic arm 21 is used to remove the wafer assembly 1 from the pre-processing device 3 and move the wafer assembly 1 to the detection position 201. After the wafer assembly 1 passes the detection, the first robotic arm 21 moves the wafer assembly 1 from the detection position 201 to the pickup position 202. The second robotic arm 22 is used to transfer the detected wafer assembly 1 from the pickup position 202 to the subsequent processing device 4. By setting the detection position 201 and the pickup position 202, the first robotic arm 21 is responsible for transferring the wafer assembly 1 from the front-end processing device 3 to the detection position 201 in the processing cavity 2, and moving the wafer assembly 1 that has passed the detection from the detection position 201 to the pickup position 202. The second robotic arm 22 is responsible for transferring the wafer assembly 1 from the pickup position 202 to the back-end processing device 4. The two robotic arms are responsible for different conveying tasks, with clear division of labor, which improves the operation efficiency.

[0051] like Figure 2 and Figure 4 As shown, the transmission cavity 2 also includes a guide rail 23. The distance between the two tracks 231 of the guide rail 23 matches the diameter of the wafer assembly 1. The first robotic arm 21 places the wafer assembly 1 on the guide rail 23 and moves the wafer assembly 1 along the guide rail 23. The guide rail 23 supports the wafer assembly 1 and provides guidance for the wafer assembly 1. Figure 4As shown, the guide rail 23 has at least one first position 232 and at least one second position 233. The first position 232 is configured as the detection position 201. When the wafer assembly 1 is located at the first position 232 on the guide rail 23, the detection device 6 located above the wafer assembly 1 detects the detection mark 5 on the wafer assembly 1. The second position 233 is configured as the pickup position 202. After the wafer assembly 1 passes the detection, it is moved from the first position 232 to the second position 233, awaiting delivery to the subsequent processing device 4. By using the guide rail 23 to guide the movement of the wafer assembly 1, the range of motion of the wafer assembly 1 is limited, thereby limiting the range of motion of the robotic arm. This reduces the control complexity of the robotic arm, simplifies the control algorithm, improves operational accuracy and system reliability, and reduces costs.

[0052] In one embodiment of the present invention, such as Figure 5a As shown, the testing device 6 includes a fixing device 62. The barcode scanner 61 is mounted in the transmission cavity 2 via the fixing device 62 and is fixed above the guide rail 23. The first robotic arm 21 moves the wafer assembly 1 along the guide rail 23, moving the wafer assembly 1 to a first position on the guide rail 23. At this time, the detection mark 5 on the wafer assembly 1 is located below the barcode scanner 61, and the barcode scanner 61 scans the detection mark 5. By setting the barcode scanner 61 in a fixed position and moving the wafer assembly 1 by the robotic arm to move the detection mark 5 below the barcode scanner 61, the device setup is simplified and the cost is reduced.

[0053] In another embodiment of the invention, such as Figure 5b As shown, the detection device 6 includes a drive unit 63 connected to the barcode scanner 61, used to drive the barcode scanner 61 to move above the guide rail 23. The first robotic arm 21 places the wafer assembly 1 at a first position on the guide rail 23, and the drive unit 63 drives the barcode scanner 61 to move until the barcode scanner 61 is above the detection mark 5 on the wafer assembly 1, whereby the barcode scanner 61 scans the detection mark 5. The drive unit 63 enables the barcode scanner 61 to move, reducing the number of operation steps for the first robotic arm 21, improving measurement mobility, and saving measurement time.

[0054] During the wafer cleaning process, the front-end processing equipment 3 is a wafer loading / unloading device, and the back-end processing equipment 4 is a wafer cleaning device. When the wafer protection device carrying the wafer W and the detection mark 5 is transferred from the wafer loading / unloading device to the transfer cavity 2, the detection device 6 detects the detection mark 5 on the wafer protection device. If the detection mark 5 is detected, it indicates that the front side of the wafer W is facing upwards, and the placement orientation of the wafer assembly 1 is correct. The wafer assembly 1 passes the detection and can be transferred from the transfer cavity 2 to the wafer cleaning device. If the detection mark 5 is not detected, it indicates that the placement orientation of the wafer assembly 1 is incorrect, and the wafer assembly 1 fails the detection, causing the machine to stop and trigger an alarm.

[0055] During the wafer dicing process, the front-end processing equipment 3 is a wafer loading / unloading device, and the back-end processing equipment 4 is a wafer dicing device. When the wafer protection device, carrying the wafer W and the detection mark 5, is transferred from the wafer loading / unloading device to the transfer cavity 2, the detection device 6 detects the detection mark 5 on the wafer protection device. If the detection mark 5 is detected, it indicates that the front side of the wafer W is facing upwards, and the placement orientation of the wafer assembly 1 is correct. The wafer assembly 1 passes the detection and can be transferred from the transfer cavity 2 to the wafer dicing device. If the detection mark 5 is not detected, it indicates that the placement orientation of the wafer assembly 1 is incorrect, the wafer assembly 1 fails the detection, and the machine stops and an alarm sounds.

[0056] This invention sets a detection mark 5 on the wafer assembly 1 and uses a detection device 6 set in the transmission cavity 2 to detect the detection mark 5 before the wafer assembly 1 is transferred to the subsequent processing equipment 4 for subsequent processes. This accurately determines the orientation of the wafer W on the wafer assembly 1, preventing product damage caused by wafer reversal, effectively improving product quality and yield, and enhancing device reliability.

[0057] This invention also provides a method for preventing wafer reversal. A wafer assembly 1 is removed from a front-end processing device 3 and transferred to a transfer cavity 2. A detection device 6, located within the transfer cavity 2, detects a detection mark 5 on the wafer assembly 1. If the detection device 6 detects the detection mark 5, it indicates that the wafer assembly 1 is placed in the correct orientation. The wafer assembly 1 passes the detection and is then transferred from the transfer cavity 2 to the back-end processing device 4. By using the detection device 6 to detect the detection mark 5 on the wafer assembly 1, the orientation of the wafer W on the wafer assembly 1 can be accurately determined, preventing product damage caused by wafer reversal, effectively improving product quality and yield, and enhancing device reliability.

[0058] like Figure 2 , Figure 3a and Figure 3b As shown, the method for preventing wafer reversibility specifically includes the following steps:

[0059] Step S1: Set the detection mark 5 onto the wafer protection device of the wafer assembly 1, wherein the detection mark 5 is set on the front side of the support ring 101 or on the front side of the adhesive film 102.

[0060] Step S2: The wafer assembly 1 carrying the detection mark 5 is transferred to the front-end processing device 3;

[0061] Step S3: The first robotic arm 21 removes the wafer assembly 1 from the front-end processing device 3 and moves the wafer assembly 1 to the detection position 201;

[0062] Step S4: The detection device 6 detects the detection mark 5 on the wafer assembly 1. If the detection mark 5 is detected, proceed to step S5; if the detection mark 5 is not detected, proceed to step S7.

[0063] Step S5: The first robotic arm 21 moves the wafer assembly 1 from the detection position 201 to the pickup position 202;

[0064] Step S6: The second robotic arm 22 transfers the wafer assembly 1 from the pick-up position 202 to the post-processing device 4;

[0065] Step S7: Stop the machine and trigger an alarm.

[0066] By setting detection position 201 and pick-up position 202, the first robotic arm 21 is responsible for transferring wafer assembly 1 from the front-end processing equipment 3 to the detection position 201 in the processing cavity 2, and for moving the detected wafer assembly 1 from the detection position 201 to the pick-up position 202. The second robotic arm 22 is responsible for transferring wafer assembly 1 from the pick-up position 202 to the back-end processing equipment 4. The two robotic arms are responsible for different transport tasks, with clear division of labor, which improves operational efficiency. The detection device 6 set in the transfer cavity 2 is used to detect the detection mark 5, thereby accurately determining the orientation of the wafer W on the wafer assembly 1, preventing product damage caused by reversed wafer placement, effectively improving product quality and yield, and enhancing device reliability.

[0067] like Figure 2 , Figure 4 and Figure 5aAs shown, in one embodiment of the present invention, the detection device 6 includes a barcode scanner 61 and a fixing device 62. A guide rail 23 disposed within the transmission cavity 2 has at least one first position 232 and at least one second position 233. The first position 232 is configured as the detection position 201, and the second position 233 is configured as the pickup position 202. The method by which the detection device 6 detects the detection mark 5 on the wafer assembly 1 includes: a first robotic arm 21 places the wafer assembly 1 onto the guide rail 23 within the transmission cavity 2; the first robotic arm 21 moves the wafer assembly 1 along the guide rail 23, causing the wafer assembly 1 to move to the first position 232 on the guide rail 23. At this time, the detection mark 5 on the wafer assembly 1 is located below the barcode scanner 61 in the detection device 6; the barcode scanner 61 scans the detection mark 5; and the first robotic arm 21 continues to move the detected wafer assembly 1 to the second position 233 on the guide rail 23. By setting the barcode scanner 61 in a fixed position and moving the wafer assembly 1 by the first robotic arm 21, the detection mark 5 is moved below the barcode scanner 61, which simplifies the device setup and reduces costs.

[0068] like Figure 2 , Figure 4 and Figure 5a As shown, in one embodiment of the present invention, the detection device 6 includes a barcode scanner 61 and a driving device 63. The driving device 63 is connected to the barcode scanner 61. The guide rail 23 disposed in the transmission cavity 2 has at least one first position 232 and at least one second position 233. The first position 232 is configured as the detection position 201, and the second position 233 is configured as the pickup position 202. The method by which the detection device 6 detects the detection mark 5 on the wafer assembly 1 includes: a first robotic arm 21 placing the wafer assembly 1 on the first position 232 on the guide rail 23 in the transmission cavity 2; the driving device 63 in the detection device 6 driving the barcode scanner 61 to move until the barcode scanner 61 is above the detection mark 5 on the wafer assembly 1; the barcode scanner 61 scanning the detection mark 5; and the first robotic arm 21 continuing to move the detected wafer assembly 1 to the second position 233 on the guide rail 23. The drive device 63 enables the barcode scanner 61 to be mobile, reducing the number of operation steps of the first robotic arm 21, improving measurement mobility, and saving measurement time.

[0069] This invention sets a detection mark 5 on the wafer assembly 1 and uses a detection device 6 set in the transmission cavity 2 to detect the detection mark 5 before the wafer assembly 1 is transferred to the subsequent processing equipment 4 for subsequent processes. This accurately determines the orientation of the wafer W on the wafer assembly 1, preventing product damage caused by wafer reversal, effectively improving product quality and yield, and enhancing device reliability.

[0070] It should be noted that, in the embodiments of the present invention, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0071] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0072] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described feature, integral, step, operation, element and / or component, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0073] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0074] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0075] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if [described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [described condition or event] is detected," or "in response to detection of [described condition or event]."

[0076] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present invention. After reading the above content, various modifications and substitutions to the present invention will be obvious to those skilled in the art. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A device for preventing wafer reversal, used to detect the orientation of a wafer assembly in a semiconductor processing apparatus, the wafer assembly comprising a wafer protection device and a wafer disposed on the wafer protection device, characterized in that, The device for preventing wafer reversibility includes: A detection mark is set on the wafer protection device; The detection device, which is installed within the semiconductor processing equipment, is used to detect the detection mark, thereby accurately determining the front and back of the wafer.

2. The device for preventing wafer reversibility as described in claim 1, characterized in that, The detection marker is a barcode or a QR code.

3. The device for preventing wafer reversibility as described in claim 2, characterized in that, The detection device includes a barcode scanner for reading the detection mark.

4. The device for preventing wafer reversibility as described in claim 3, characterized in that, The detection device further includes a fixing device for fixing the barcode scanner.

5. The device for preventing wafer reversibility as described in claim 3, characterized in that, The detection device further includes a driving device connected to the barcode scanner for driving the barcode scanner to move.

6. The device for preventing wafer reversibility as described in claim 1, characterized in that, The wafer protection device includes a support ring and an adhesive film. The support ring is disposed around the adhesive film. The inner diameter of the support ring is larger than the size of the wafer. The back side of the wafer is attached to the adhesive film. The front side of the wafer is the front side of the support ring and the front side of the adhesive film. The detection mark is set on the front side of the support ring or the front side of the adhesive film.

7. A semiconductor processing apparatus, characterized in that, It includes: a transmission cavity, and a front-end processing device and a back-end processing device respectively connected to the transmission cavity, wherein the transmission cavity is provided with a device for preventing wafer reversibility as described in any one of claims 1-6.

8. The semiconductor processing apparatus as described in claim 7, characterized in that, The transmission cavity includes: At least one detection position, the detection position being located below the detection device, wherein the detection device detects the detection mark when the wafer assembly is located at the detection position; At the pickup position, when the wafer assembly is located, it awaits to be transferred to the subsequent processing device.

9. The semiconductor processing apparatus as claimed in claim 8, characterized in that, The transmission cavity further includes: A first robotic arm is used to remove the wafer assembly from the front-end processing equipment and move the wafer assembly to the detection position and the pickup position; The second robotic arm is used to transfer the inspected wafer assembly from the pick-up position to the post-processing equipment.

10. The semiconductor processing apparatus as claimed in claim 9, characterized in that, The transmission cavity further includes: a guide rail for supporting the wafer assembly and providing guidance for the wafer assembly, the guide rail including: at least one first position and at least one second position; The detection location is configured as the first location; The pickup position is configured as the second position.

11. The semiconductor processing apparatus as claimed in claim 7, characterized in that, The pre-processing equipment is a wafer loading and unloading device.

12. The semiconductor processing apparatus as claimed in claim 7, characterized in that, The post-processing equipment is a wafer cleaning device or a wafer dicing device.

13. A method for preventing wafer reversal in a semiconductor processing apparatus as described in any one of claims 7-12, characterized in that, A wafer assembly is taken out from the front-end processing equipment and transferred to the transfer cavity. The detection equipment detects the detection mark on the wafer assembly. If the detection equipment detects the detection mark, it indicates that the wafer assembly is placed in the correct orientation. The wafer assembly passes the detection and is then transferred from the transfer cavity to the back-end processing equipment.

14. The method for preventing wafer reversibility as described in claim 13, characterized in that, The first robotic arm retrieves the wafer assembly from the front-end processing equipment and moves it to the detection position. After the wafer assembly passes the detection, the first robotic arm continues to move the wafer assembly to the pickup position, and the second robotic arm transfers the wafer assembly from the pickup position to the back-end processing equipment.

15. The method for preventing wafer reversibility as described in claim 13, characterized in that, The method for detecting the front and back of a wafer further includes setting the detection mark on the wafer protection device before transferring the wafer assembly to the front-end processing equipment.

16. The method for preventing wafer reversibility as described in claim 14, characterized in that, The method for the detection device to detect the detection mark on the wafer assembly includes: placing the wafer assembly on a guide rail in a transmission cavity, the guide rail including: at least one first position and at least one second position, the detection position being configured as the first position, and the pickup position being configured as the second position; The first robotic arm moves the wafer assembly along the guide rail, causing the wafer assembly to move to a first position on the guide rail. At this time, the detection mark on the wafer assembly is located below the barcode scanner in the detection device, and the barcode scanner scans the detection mark. The first robotic arm continues to move the detected wafer assembly to a second position on the guide rail.

17. The method for preventing wafer reversibility as described in claim 14, characterized in that, The method for the detection device to detect the detection mark on the wafer assembly includes: placing the wafer assembly on a guide rail in a transmission cavity, the guide rail including: at least one first position and at least one second position, the detection position being configured as the first position, and the pickup position being configured as the second position; The first robotic arm places the wafer assembly at a first position on the guide rail, and the driving device in the detection equipment drives the barcode scanner to move until the barcode scanner is above the detection mark on the wafer assembly, and the barcode scanner scans the detection mark. The first robotic arm continues to move the detected wafer assembly to a second position on the guide rail.

18. The method for preventing wafer reversibility as described in claim 13, characterized in that, If the detection equipment fails to detect the detection mark, it indicates that the wafer assembly is placed in the wrong orientation, the wafer assembly fails the detection, and the machine is stopped and an alarm is triggered.

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