Carrier, semiconductor cleaning apparatus, and method

Abstract

The present disclosure provides a carrier, a semiconductor cleaning device and a method. The carrier comprises a main body configured to carry a piece to be cleaned, and a connecting assembly arranged on the main body. The connecting assembly comprises a guide part configured to be connected with a first guide member arranged on the semiconductor cleaning device to guide the movement of the carrier relative to the first guide member in a first direction and limit the displacement of the carrier in a second direction intersecting the first direction. The carrier completely replaces the high-risk hooking transfer mode in structure by introducing a clamping groove type guide part and a mesa rail support.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more particularly to carriers, semiconductor cleaning equipment and methods. Background Technology

[0002] In the wet cleaning process of semiconductor wafer manufacturing, the cleaning equipment typically employs a multi-tank design to remove impurities from the wafer surface.

[0003] In related technologies, operators need to manually lift the wafer carrier completely from one cleaning tank and move it suspended in the air to the next tank.

[0004] This operating method has significant drawbacks. First, when the carrier is transferred in mid-air, it is highly susceptible to mechanical collisions with the machine, resulting in product defects or breakage, severely impacting yield. Furthermore, this operation not only increases the ergonomic burden on operators but also makes them prone to errors due to slippage or misalignment.

[0005] Therefore, there is an urgent need for an auxiliary transfer mechanism to eliminate the high-risk stage of the vehicle being completely suspended in the air and to achieve a smooth and safe transfer of the load between the robotic arm and the platform support. Summary of the Invention

[0006] The embodiments disclosed herein aim to solve the technical problems of high collision risk, poor operational stability, and uneven load transfer that exist in the related art when semiconductor carriers are transferred between cleaning tanks.

[0007] The technical solution of this disclosure embodiment is implemented as follows: In a first aspect, embodiments of this disclosure provide a carrier suitable for a semiconductor cleaning apparatus. The carrier may include a body and a connecting assembly. The body is used to carry a component to be cleaned. The connecting assembly is disposed on the body. The connecting assembly includes a guide portion. The guide portion is configured to engage with a first guide member disposed on the semiconductor cleaning apparatus to guide movement of the carrier relative to the first guide member in a first direction and limit displacement of the carrier in a second direction intersecting the first direction.

[0008] In a second aspect, embodiments of this disclosure provide a semiconductor cleaning apparatus configured for use in conjunction with a carrier according to the first aspect. The semiconductor cleaning apparatus may include a lifting mechanism and a table. The lifting mechanism is provided with a first guide member. The table is provided with a second guide member. The first and second guide members are configured such that while the carrier engages with the first guide member via its guide portion, an auxiliary guide portion of the carrier engages with the second guide member, thereby allowing the weight of the carrier to be transferred between the lifting mechanism and the table.

[0009] Thirdly, embodiments of this disclosure provide a semiconductor cleaning method. This semiconductor cleaning method utilizes a semiconductor cleaning apparatus according to the second aspect to operate a carrier according to the first aspect. The semiconductor cleaning method includes: Slide the vehicle along the first track section on the platform until the vehicle is aligned with the target cleaning station; The vehicle is moved from the first track section to the second track section corresponding to the target cleaning station; The vehicle slides along the second track section toward the lifting mechanism; As the vehicle slides along the second track section, the guide portion of the vehicle gradually engages with the first guide member on the lifting mechanism; and Drive the vehicle until it is completely detached from the second track section and supported by the first guide member.

[0010] Fourthly, embodiments of this disclosure provide a carrier. This carrier is suitable for semiconductor cleaning equipment. The carrier includes: The main body is used to hold the items to be cleaned; and Connecting components are set on the main body; The connecting component includes a slide groove extending along a first direction. The slide groove has a first limiting wall and a second limiting wall disposed opposite to each other in a second direction intersecting the first direction. The first limiting wall, the second limiting wall, and the side wall connecting the two together define an accommodating space. The chute has a first end and a second end opposite to each other in a first direction, and the first end is provided with an access opening that connects to the receiving space.

[0011] This disclosure provides a carrier, semiconductor cleaning equipment, and method. The carrier includes a guide portion disposed on its main body. The guide portion is configured to engage with a first guide member on the cleaning equipment. Based on this, on the one hand, the carrier can be precisely oriented for smooth movement in a specific direction, such as horizontally, so that the carrier can be pushed into or pulled out of the lifting mechanism of the cleaning equipment; on the other hand, the displacement of the carrier can be strictly limited in another direction. Through this mechanical guiding mechanism, the carrier remains stable when engaging or disengaging from the lifting mechanism, completely eliminating the high-risk state of the clamp being completely suspended and prone to collision in traditional manual operation, thereby significantly improving the reliability, operational accuracy, and product yield of the transfer process. Attached Figure Description

[0012] Figure 1 This is a schematic side view of a card holder for related technologies.

[0013] Figure 2 A schematic perspective view of a semiconductor cleaning apparatus provided for embodiments of this disclosure.

[0014] Figure 3Another schematic perspective view of a semiconductor cleaning apparatus provided for embodiments of this disclosure.

[0015] Figure 4 A schematic side view of a vehicle provided for an embodiment of this disclosure.

[0016] Figure 5 A schematic side view of a semiconductor cleaning apparatus provided for an embodiment of this disclosure.

[0017] Figure 6 Another schematic perspective view of a semiconductor cleaning apparatus provided for embodiments of this disclosure.

[0018] Figure 7 A flowchart of a semiconductor cleaning method provided for embodiments of this disclosure. Detailed Implementation

[0019] The present disclosure will now be described in detail with reference to the accompanying drawings and exemplary embodiments. It should be noted that the following detailed description of the present disclosure is for illustrative purposes only and is not intended to limit the scope of the disclosure.

[0020] Figure 1 A clip 1 from the related art is shown. This clip can be used to carry semiconductor products such as wafers. The transfer of the clip between cleaning tanks often employs a manual hook-and-loop structure. For example... Figure 1 As shown, it relies solely on the hook-shaped part 1A at the top to engage or suspend itself from the cleaning equipment. This engaging or hooking method lacks lateral envelopment and mechanical guidance. The operator must manually lift the clamp completely and transfer it while it is suspended in the air.

[0021] This hook-and-loop connection method introduces potential problems into the cleaning process. Firstly, due to the lack of precise guidance and alignment assistance, the clamps are highly susceptible to mechanical collisions with the machine during transfer and remounting. Furthermore, alignment is difficult. Secondly, operators must bear the full weight of the clamps, posing a high risk of slippage during transfer. These defects directly lead to product damage during transfer, resulting in chips or breakage. This is one of the main human factors affecting semiconductor yield.

[0022] The vehicle provided in this disclosure completely replaces this high-risk hook-and-loop transfer mode by introducing a slot-type guide and a platform rail support.

[0023] See Figure 2Some embodiments of this disclosure provide a carrier 300 suitable for a semiconductor cleaning apparatus 10. It includes a body 310 for carrying items to be cleaned and a connecting assembly disposed on the body 310. The connecting assembly includes a guide portion 320. The guide portion 320 is configured to engage with a first guide member 110 on the semiconductor cleaning apparatus 10 to guide the carrier 300 relative to the first guide member 110 in a first direction, while limiting displacement of the carrier 300 in a second direction intersecting the first direction. It is understood that "intersecting" here means that the first direction and the second direction are not parallel.

[0024] Semiconductor cleaning equipment 10 is, for example, a multi-tank wet processing system. To facilitate defining the relative positions and directions of movement between components, a Cartesian coordinate system is established. The platform 200 of the semiconductor cleaning equipment 10 is defined as the XY plane. The X direction is laterally parallel to the platform 200 and represents the extension direction of the multiple cleaning stations arranged along the length of the equipment; it is also called the lateral movement direction. The Y direction is parallel to the platform 200 and perpendicular to the X direction; it is also the direction in which the carrier 300 is pushed into or pulled out of the lifting mechanism 100 of the semiconductor cleaning equipment 100. The Z direction is defined as perpendicular to the XY plane; in some embodiments, it can be a vertical direction, that is, the direction of movement when the lifting mechanism 100 drives the carrier 300 into and out of the cleaning tank.

[0025] Overall, carrier 300 is an integrated device used to carry and transfer wafers to be cleaned within semiconductor cleaning equipment. It is also the final product unit delivered to operators for manual assistance. Its design features a rectangular frame structure suitable for batch processing of semiconductor wafers. Carrier 300 can be used to immerse, rinse, and transfer wafers in cleaning solution, ensuring physical protection of the wafers during the transfer process.

[0026] In this embodiment, the main movements of the carrier 300 occur in the X, Y, and Z directions. The guide 320 is configured to guide the carrier 300 in the Y direction (the first direction) and restrict its displacement in the Z direction (the second direction). In some embodiments, the Z direction intersects the Y direction perpendicularly. This perpendicular arrangement maximizes the constraint on the vertical degree of freedom of the carrier 300, preventing collisions between the workpiece to be cleaned and equipment or other components due to Z-direction displacement during transfer, thus further improving transfer stability.

[0027] The carrier 300 disclosed herein is adaptable to harsh semiconductor wet cleaning environments. Related cleaning processes typically involve strong acids, strong alkalis, and oxidants, and must operate within specific temperature ranges.

[0028] Specifically, the relevant cleaning processes typically involve strong acids, strong alkalis, and oxidants, and must operate within a specific temperature range. Typical semiconductor cleaning steps include particle removal and metal removal processes. The particle removal process, also known as the SC-1 process, uses a mixed solution of ammonia, hydrogen peroxide, and deionized water. The metal removal process, also known as the SC-2 process, uses a mixed solution of hydrochloric acid, hydrogen peroxide, and deionized water. The operating temperature for these cleaning steps is typically between 25°C and 85°C, and in some scenarios, it can be controlled between 50°C and 70°C, such as 65°C, to improve cleaning efficiency. Considering the production efficiency requirements of semiconductor manufacturing, the cleaning cycle for batch processing is usually short, which can be reduced to less than 15 minutes. The highly corrosive, high-temperature, and frequently transferred operating environments place extremely high demands on the material selection and mechanical precision of the carriers, and carrier transfers must be completed efficiently and with low latency within a short time.

[0029] like Figure 2 As shown, the main body 310 has an open frame structure. The main body 310 has an open top, a design that allows operators to easily insert the parts to be cleaned into the main body 310 from the top, improving the ease of loading. The circumferential sidewalls of the main body 310 feature a perforated design, which, while ensuring the structural strength of the main body 310, allows the cleaning fluid to flow fully across the surface of the parts to be cleaned, ensuring uniform cleaning results for each part.

[0030] Multiple partitions 311 are provided on the relatively inner sidewalls of the main body 310, extending inward from the inner wall of the main body 310. To ensure sufficient contact between the parts to be cleaned and the cleaning fluid while providing stable support, the partitions 311 are arranged in multiple groups, such as... Figure 2 As shown. The separators 311 are not only evenly arranged along the Y direction, but also divided into multiple groups in the Z direction, which can form multi-point support at different diameters and heights of the part to be cleaned, avoiding tilting or damage to the part to be cleaned due to single-point force.

[0031] Multiple sets of spacers 311 are evenly spaced from each other, with precise spacing control. For example, when the carrier 300 is used to accommodate 25 300mm wafers, the spacing between adjacent spacers 311 can be set to the industry standard size of 6mm or 10mm. After the wafer to be cleaned is inserted into the space formed by the spacers 311, it is directly supported by the spacers 311, enabling the main body 310 to achieve the dual functions of batch carrying and precise spacing.

[0032] Through the above structural design, the adjacent parts to be cleaned can maintain a stable predetermined interval distance, effectively avoiding mutual rubbing or direct mechanical contact between the parts to be cleaned during cleaning, lifting or transfer, minimizing surface scratches, gaps and other defects caused by physical contact, and further supporting the technical goal of this invention to improve the yield of semiconductor products.

[0033] During the cleaning process, the main body 310 of the carrier 300 enters the cleaning environment at least partially along with the part to be cleaned. To withstand the highly corrosive environment, the main body 310 is integrally molded from polytetrafluoroethylene (PTFE). PTFE, also known as Teflon, has significant advantages in semiconductor applications due to the following properties.

[0034] First, polytetrafluoroethylene (PTFE) exhibits excellent chemical resistance, tolerating almost all strong acid and alkali solutions, such as hot sulfuric acid, hydrofluoric acid, SC-1 solution, and SC-2 solution. This prevents the carrier from being corroded during the cleaning process. Simultaneously, it does not release ions or particles that contaminate the wafer.

[0035] Furthermore, because PTFE can be used continuously at temperatures up to 260°C, it maintains structural integrity over a wide temperature range. In practical operation, when the carrier is transferred after being immersed in cleaning solutions at 50°C to 70°C, its geometry must remain stable. Unpredictable thermal expansion or creep of the material will directly lead to uncontrolled fit tolerances in the guiding system, resulting in jamming or collisions. PTFE's low coefficient of thermal expansion ensures the geometric accuracy of the carrier under thermal cycling.

[0036] Furthermore, polytetrafluoroethylene has an extremely low coefficient of friction, approximately 0.05 to 0.10. Since vehicle transfer relies on a sliding fit (described in detail below), this characteristic significantly reduces the force required for operators to push or pull the vehicle, making manual assisted transfer easy and smooth.

[0037] The connecting component refers to the collection of all structural features disposed on the main body 310 for mechanical cooperation and functional interaction with external guiding mechanisms on the cleaning equipment, such as the lifting mechanism 100 and the table 200.

[0038] In some embodiments, the connecting components can be integrally formed with the body 310, for example, by injection molding. This results in a compact structure with no additional connection gaps, thereby reducing the risk of corrosive media penetration and improving overall corrosion resistance. Furthermore, it provides greater mechanical stability, preventing loosening of the connections during frequent transfers.

[0039] In some alternative implementations, the connecting components can be molded separately and then fixedly connected to the main body 310 via connectors, such as corrosion-resistant bolts. This method facilitates the replacement of the connecting components individually. When the connecting components wear or are damaged, it is not necessary to replace the entire vehicle body. This reduces maintenance costs and allows for compatibility with different sizes of the main body 310, improving versatility.

[0040] The connecting assembly includes a guide portion 320. This guide portion 320 is configured to engage with a first guide member 110 on the lifting mechanism 100 to achieve suspension, guidance, and limiting of the vehicle 300 on the lifting mechanism 100. See also... Figure 2 and Figure 3 The guide section 320 is located on the upper side wall of the main body 310 to precisely coordinate with the lifting mechanism 100 robotic arm above. The guide section 320 can provide a precise Y-axis translation path and strict Z-axis vertical constraint, and is a direct means to replace the traditional hook-and-loop structure and achieve stable transfer of the vehicle 300.

[0041] The first guide member 110 refers to a structure disposed on the lifting mechanism 100 of the semiconductor cleaning equipment 10 for cooperating with the guide part 320. Specifically, the first guide member 110 may be a rectangular protrusion, a T-shaped protrusion, or a dovetail groove fixed on the robotic arm of the lifting mechanism 100, to adapt to the cooperation requirements in different scenarios.

[0042] For example, the guide portion 320 and the first guide member 110 can constitute a slider-rail mechanism. One of them is a groove, and the other is a protrusion.

[0043] like Figure 2 and Figure 3 As shown, in some specific embodiments, the guide portion 320 is a groove with a cross-section of, for example, C-shaped or U-shaped. This structure can simultaneously hold the protrusion from the side and below, thereby limiting its displacement in the vertical Z-direction when the vehicle 300 is suspended, ensuring the rigidity and stability of the suspension. Correspondingly, the first guide member 110 is configured as a rectangular column or T-shaped protrusion. It can be accommodated within the guide portion 320 and slidably connected thereto.

[0044] The guide 320 can limit the displacement of the vehicle 300 in a second direction that intersects with the first direction. Here, "intersecting" means that the first direction and the second direction are not parallel to each other. The ideal intersection relationship is that the two are at a 90-degree angle, that is, perpendicular to each other, so as to achieve maximum restriction on the direction of gravity and precise guidance on the direction of horizontal movement.

[0045] Specifically, such as Figure 3 As shown, in some examples, the guide portion 320, constructed as a chute structure, extends along the Y-axis, that is, along the first direction. The chute has two opposing walls along the Z-axis, that is, in the second direction, namely a first limiting wall 321A and a second limiting wall 321A. Figure 3 The upper inner wall of the middle slide groove, and the second limiting wall 321B, i.e. Figure 3 The lower inner wall of the chute. These two limiting walls, together with the side wall 321C of the chute, i.e., the bottom of the chute, form a semi-enclosed receiving space 321D. Through this geometry, when the guide component of the external equipment enters this receiving space, the first and second limiting walls clamp or enclose the guide component in the vertical direction, thereby physically restricting the displacement of the vehicle in the Z-axis direction. This restriction ensures that the vehicle can be stably suspended and gripped by the chute even without bottom support.

[0046] In this embodiment, the perpendicular setting of the Z and Y directions is exemplary, and it does not exclude the possibility that the first and second directions intersect at other angles other than 0 degrees and 180 degrees. The mechanism for limiting the displacement of the vehicle 300 in the second direction can eliminate or significantly reduce the accidental movement or swaying of the vehicle 300 at any non-zero angle relative to the first direction. In the case of the vertical direction, it can accurately cope with the gravity load and the lifting and lowering movement of the cleaning tank.

[0047] When the first guide member 110 is fully housed inside the C-shaped guide portion 320, the first limiting wall 321A and the second limiting wall 321B of the guide portion 320 simultaneously apply mechanical constraints to the first guide member 110 to limit displacement in the Z direction. Only a very small Z-axis fit tolerance is maintained between the upper and lower walls of the C-shaped guide portion 320 and the first guide member 110. This rigid fit ensures that the Z-axis degree of freedom of the carrier 300 is almost completely eliminated when it is carried by the robotic arm.

[0048] During the cleaning process, the robotic arm drives the carrier 300 to move up and down in the Z direction, or to perform ultrasonic vibration and liquid agitation in the tank. If there is no rigid constraint in the Z direction, the carrier 300 is very prone to vertical swaying or impact. This Z-direction limiting mechanism can ensure that the carrier 300 always maintains its integrity with the robotic arm during vertical movement, completely eliminating vertical impact loads and fundamentally preventing micro-collisions and damage to the wafer caused by swaying, thus providing a solid guarantee for product yield.

[0049] The guide portion 320 is also used to guide the movement of the carrier 300 relative to the first guide member 110 in a first direction. The guide portion 320 can extend along the first direction, and its inner sidewall forms a precise sliding guide rail with the sidewall of the first guide member 110. Since the lateral tolerance between the guide portion 320 and the first guide member 110 is precisely controlled within an appropriate range, when the operator applies a push or pull force in the Y direction, the sidewall of the guide portion 320 will apply a stable lateral constraint to the first guide member 110, and the movement trajectory of the carrier 300 is forcibly restricted to a single straight line on the Y-axis.

[0050] This design effectively eliminates the risk of lateral collisions common in traditional transfer methods. In hook-and-loop transfers, when operators push or pull the clamps into or out of their fixed positions, slight hand tremors or uneven force can easily cause the clamps to swing laterally, resulting in mechanical collisions with the machine edge or adjacent slots. However, the Y-axis guiding mechanism, by locking all lateral degrees of freedom, ensures that the carrier 300 will not experience any lateral deviation when translating in the Y direction. At the same time, precise Y-axis guidance significantly reduces the alignment accuracy requirements for operators. Operators only need to apply force naturally along the guide force. Even if there is a slight deviation in the pushing force, the carrier 300 can still accurately enter or detach from the robotic arm along the predetermined trajectory, successfully solving the problem of clamps not easily hooking into fixed positions in existing technologies.

[0051] According to some embodiments of this disclosure, the geometry of the guide unit 320 itself also integrates a two-level safety mechanism to further ensure the stability and operational safety of the vehicle 300 during the engagement process with the robotic arm.

[0052] See Figure 3 The guide portion 320 has a first end 320A and a second end 320B, with the first end 320A having an access opening 321E. The geometry and position of the access opening 321E can be precisely designed so that its lateral width can be aligned with and clearance-fitted with the first guide member 110. The edge of the access opening 321E may have a tapered chamfer or bevel, which allows the first guide member 110 to be smoothly inserted into the guide portion 320 along a first direction. The chamfer or bevel feature not only greatly facilitates the alignment operation of the first guide member 110, but also simplifies the operator's alignment action in three-dimensional space to a one-dimensional Y-axis pushing action, effectively compensating for possible operational errors and achieving a low-resistance, high-precision insertion effect.

[0053] The second end 320B, i.e., the rear end of the guide portion 320, is provided with a stop portion 322, such as Figure 4 As shown. The stop part 322 is a structure at the end of the guide part 320 used to physically block the first guide member 110 from moving further after it is in place. It is used to physically prevent the first guide member 110 from detaching from the guide part 320, thus forming the first layer of safety anti-detachment structure of the suspension system.

[0054] For example, the stop portion 322 can be located at the end face of the second end portion 320B and extend perpendicularly to the guide portion 320. When the carrier 300 is pushed along the first guide member 110, the stop portion 322 can eventually abut against the end face of the first guide member 110. Based on this, the stop portion 322 can clearly define the final engagement position of the carrier 300, while preventing the carrier 300 from accidentally sliding inward to the depth of the cleaning tank when encountering vibration or accidental impact while suspended by the robotic arm, thereby fully ensuring the safety of operation and the accuracy of positioning.

[0055] According to the above embodiments, the C-shaped or U-shaped groove structure of the guide part 320, combined with the low-friction characteristics of polytetrafluoroethylene material, not only achieves precise guidance and limiting, but also significantly reduces the force required for operators to push and pull the carrier 300, making manual assisted transfer easy and smooth, while reducing the workload of operators and further reducing the risk of clamp slippage from an ergonomic perspective. The guiding and limiting function of the guide part 320 works in conjunction with the separator 311 structure on the main body 310 to ensure that the carrier 300 is transferred stably while maintaining a predetermined interval between batch wafers, effectively preventing wafers from rubbing against each other or making direct mechanical contact during transfer, lifting, or cleaning, and minimizing defects such as surface scratches and nicks. The convenient alignment function of the access opening 321, combined with the anti-detachment limiting function of the stop part 322, and the locking component on the lifting mechanism 100, forms a multi-layered safety protection system, eliminating the risk of accidental detachment of the carrier 300 during transfer and cleaning.

[0056] From an overall technical perspective, the carrier 300, through the guide unit 320 configured on the main body 310 and its precise cooperation with the first guide component 110, constructs a high-rigidity, low-friction suspension guidance system. This system completely abandons the traditional high-risk manual hook-and-loop transfer mode, transforming it into a mechanically guided manual-assisted translation mode. Through the organic combination of Z-direction rigidity restriction, Y-direction precise guidance, embedded safety mechanisms, high-quality material guarantees, and scientific load-bearing protection, this technical solution significantly improves the stability, safety, and repeatability of the transfer process. It effectively solves many problems existing in traditional transfer methods, such as high collision risk, poor operational stability, and heavy ergonomic burden, directly reducing yield losses caused by operational errors and mechanical collisions. It provides reliable equipment support for the efficient and precise execution of semiconductor cleaning processes, demonstrating significant technological progress and practical value.

[0057] In addition to the guide section 320, the connecting assembly of the vehicle 300 also includes an auxiliary guide section 330. This structure is the key foundation for achieving smooth load transfer.

[0058] The auxiliary guide 330 is provided, for example, at the bottom of the vehicle 300, and is arranged at a distance from the upper guide 320 in the Z-axis direction. See [reference needed] for details. Figure 5 The distance between the two is roughly equivalent to the vertical height of the vehicle 300. This vertical separation layout is an important prerequisite for achieving dual guidance and load transfer.

[0059] In some implementations, the auxiliary guide 330 employs two parallel and spaced-apart grooves specifically configured to cooperate with the second guide member 210 on the platform 200 of the semiconductor cleaning apparatus 10, such as... Figure 5 As shown.

[0060] The double grooves and the double tracks of the second guide member 210 form a precise fit, providing extremely high torsional stiffness. When the carrier 300 is transferred horizontally in the X or Y direction, the two support points effectively limit the pitch motion of the carrier 300 around the X-axis and the yaw motion around the Y-axis, preventing the carrier 300 from tilting or twisting. Especially during the transition of the carrier 300 from the robotic arm-borne state to the platform 200-supported state, this stable support ensures a precise and smooth connection process, completely solving the jamming or tilting problems common in traditional transfers, and laying a solid structural foundation for subsequent gradual load transfer.

[0061] The semiconductor cleaning apparatus 10 of this disclosure, through its precise geometric configuration, achieves a gradual and smooth transfer of the load of the carrier 300 between two support systems: table support and robotic arm suspension.

[0062] Specifically, the first guide member 110 on the lifting mechanism 100 and the second guide member 210 on the platform 200 are vertically spaced apart, and their projections in the XY plane do not coincide. They maintain precise alignment in the X direction, but form a predetermined misalignment in the Y direction. In some embodiments, the lifting mechanism 100 is positioned directly above the cleaning station, i.e., the cleaning tank. This layout allows the lifting mechanism 100 to move the carrier and the items to be cleaned into or out of the cleaning station simply by moving along the Z-axis, without requiring additional horizontal movement. In conjunction with this, the second guide member 210 is arranged on the platform 200 adjacent to the cleaning station. In some cases, it may extend slightly above the cleaning station, but without interfering with the lifting mechanism's ability to lift and lower the carrier and the items to be cleaned.

[0063] To achieve smooth transfer and seamless docking, the distance between the first guide member 110 and the second guide member 210 in the Z direction is precisely configured to be approximately equal to, but slightly larger than, the distance between the guide portion 320 and the auxiliary guide portion 330. This slight difference in distance ensures that when the carrier 300 moves, the two guide members do not simultaneously rigidly lock the upper and lower connecting portions of the carrier 300, thereby preventing the carrier 300 from jamming.

[0064] See Figure 5 The carrier 300 is designed such that when the guide section 320 engages with the first guide member 110, the auxiliary guide section 330 can maintain engagement with the second guide member 210. This moment of synchronous engagement is the critical point for load transfer. The physical mechanism corresponding to this geometric design can fundamentally eliminate the impact risk during the transfer process.

[0065] When the operator pushes the carrier 300 from the platform 200 toward the lifting mechanism 100 robotic arm, the carrier 300 first slides smoothly on the track of the second guide member 210. As the guide part 320 gradually enters the envelope of the first guide member 110, the first guide member 110 does not suddenly bear the full weight of the carrier 300. During the short stroke of the carrier 300 moving along the Y-axis, its weight is gradually and evenly transferred from the support of the platform track at the bottom to the support of the robotic arm at the top. The entire process is shock-free and vibration-free. This gradual transfer completely changes the vertical impact problem caused by sudden hooking and unhooking in traditional hook-and-loop transfer, providing a continuously stable support environment for the wafer.

[0066] To further enhance the safety redundancy of the vehicle 300 when it is fully supported by the robotic arm, a locking mechanism is specially installed on the lifting mechanism 100. This locking mechanism can either replace the stop 322 of the guide 320 to achieve independent limiting, or it can work in conjunction with the stop 322 to form multiple layers of protection, significantly improving the safety level.

[0067] Specifically, in some embodiments, the locking mechanism consists of a first locking part 120 and a second locking part 130 located at both ends of the first guide member 110. This double-end layout can directly replace the single stop part 322. Figure 5 As shown, the first locking part 120 is disposed on one end face of the first guide member 110, and its stop surface is perpendicular to the extending direction of the first guide member 110. When the operator pushes the carrier 300 along the first guide member 110, the carrier 300 will eventually abut against the stop surface, at which point the carrier 300 is precisely positioned. The other end of the first guide member 110 is limited by the second locking part 130. The second locking part 130 can be, for example, a pin or latch structure (see details). Figure 2 , Figure 3 and Figure 5 Through the dual limiting of the locking parts at both ends, after the guide part 320 and the first guide member 110 are fully engaged, a rigid constraint is formed on the carrier 300 from a physical dimension, completely preventing it from detaching from the lifting mechanism 100 in the Y direction. Compared with the single stop part 322 of the guide part 320, this double locking structure constitutes a stronger second layer of safety anti-detachment system. Even if the robotic arm drives the carrier 300 to clean and lift along the Z-axis, the tank generates ultrasonic vibration, or even if the equipment encounters an unexpected power outage or external impact, the double locking parts can still ensure a stable connection between the carrier 300 and the robotic arm, preventing it from accidentally sliding out in the operating direction, and providing the highest level of protection for operational safety.

[0068] In another alternative embodiment, safety anti-detachment can be achieved through the cooperation of the second locking part 130 and the stop part 322 of the guide part 320. For example, a mating structure can be preset on the stop part 322 for the second locking part 130 in the form of a pin or latch to be inserted or penetrated. When the guide part 320 and the first guide member 110 are fully engaged, the second locking part 130 is adjusted to the locked position. The structural engagement of the two can physically prevent the carrier 300 from detaching from the lifting mechanism 100 in the Y direction. This combination method can ensure safety while simplifying the design complexity of a single locking mechanism.

[0069] In some embodiments of this disclosure, the second guide member 210 on the platform 200 of the semiconductor cleaning apparatus 10 adopts a cross-shaped track layout, such as... Figure 6 As shown. This optimized layout allows the carrier 300 to flexibly switch between multiple cleaning stations, efficiently adapting to the needs of high-throughput production scenarios.

[0070] The cross-shaped track consists of two parts with clearly defined functions. The first track section 211 extends along the X direction and is mainly used to guide the carrier 300 to complete lateral translation between different cleaning tank stations. The second track section 212 extends along the Y direction and is perpendicular to the first track section 211. It is set towards the lifting mechanism 100 as a whole and is used for guiding and positioning the carrier 300 when it enters or leaves the lifting mechanism 100.

[0071] In some embodiments, the first track segment 211 does not employ a constant cross-section design; a turning portion 213 is provided at its junction with the second track segment 212. For example... Figure 6 As shown, the steering part 213 is in the shape of a notch, and its size matches the size of the bottom support part of the vehicle 300. This design provides the vehicle 300 with Y-direction passage space, allowing the bottom of the vehicle 300 to pass smoothly through the notch and smoothly complete the Y-direction movement under the guidance of the second track section 212, achieving a seamless connection between X-direction and Y-direction transfer.

[0072] The core advantage of this cross-shaped layout lies in the fact that the auxiliary guide unit 330 of the carrier 300 maintains stable cooperation with the track throughout the entire transfer process, completely changing the problem of the carrier being suspended in mid-air when moving between workstations in traditional transfer methods. Whether it is the lateral transfer to the target workstation, the docking process with the robotic arm, or the transition stage after detaching from the robotic arm, the carrier 300 can obtain continuous and stable support in all flow stages, effectively improving the safety and operational stability of the operation process.

[0073] It should be noted that although the foregoing embodiments describe in detail the application of the carrier 300 in conjunction with a cleaning device having a tabletop track (i.e., the second guide member 210), the carrier 300 of this disclosure is structurally and functionally independent and is not limited to being used in conjunction with a specific tabletop track.

[0074] Due to the unique groove structure design in the carrier 300 connecting assembly, the carrier 300 possesses the ability to maintain suspension stability independently without bottom support. In some alternative applications, such as in automated material handling systems in semiconductor factories, external transfer mechanisms (such as robotic end effectors) only need to be inserted into the groove of the carrier 300 along the first direction. In this case, the carrier 300 can be securely locked in the suspended state by the shape cooperation of the first and second limiting walls in the second direction, without requiring any support from the bottom auxiliary guide 330.

[0075] Furthermore, this structure is also suitable for flexible, non-automated operation scenarios. At cleaning stations or temporary storage racks that are not equipped with dedicated tracks, operators or general-purpose transfer tools can safely grasp and transfer the carrier 300 by cooperating with the chute. This means that the carrier 300 can be circulated and used as an independent product unit; it can be perfectly adapted to existing dual-rail precision cleaning machines as a high-performance component, or it can be adapted to future fully automated suspended conveyor lines as a general-purpose carrier.

[0076] Based on the above structural design, embodiments of this disclosure also provide a semiconductor cleaning method that achieves safe and efficient transfer through the synergy of structure and process. See also Figure 7 The semiconductor cleaning method may include steps S101 to S105.

[0077] In step S101, the carrier 300 is pushed to slide along the first track section 211 on the table 200 until the carrier 300 is aligned with the target cleaning station; In step S102, the carrier is moved from the first track section 211 to the second track section 212 corresponding to the target cleaning station; In step S103, the carrier 300 is pushed to slide along the second track section 212 toward the lifting mechanism 100; In step S104, as the carrier 300 slides along the second track section 212, the guide section 320 of the carrier 300 gradually engages with the first guide member 110 on the lifting mechanism 100. In step S105, the carrier 300 is pushed until it is completely detached from the second track section 212 and is supported by the first guide member 110.

[0078] With the carrier 300 fully supported by the lifting mechanism 100, the first locking part 120 automatically or manually engages to lock it. In this state, the lifting mechanism 100 can drive the carrier 300 to move stably up and down along the Z-axis to complete cleaning processes such as soaking and rinsing of the parts to be cleaned, such as wafers. After cleaning, the first locking part 120 unlocks, and the operator pulls the carrier 300 in the opposite direction. Its weight is then gradually transferred back to the second guide member 210 on the table 200 for support, and the carrier 300 moves along the track to the next workstation or unloading position.

[0079] The entire cleaning method minimizes uncertainties in the human-machine interaction process through precise structural configuration, which not only improves the workload of operators but also ensures the safety of wafers from the process level, effectively solving the yield control problem in the wet cleaning process.

[0080] The scope of protection of this disclosure is not limited to the specific structure described above. Various modified implementations can be formed without deviating from the core design concept. The following are typical variations. Regarding the guiding and mating relationship, in the above embodiment, the guide portion 320 is a groove and the first guide member 110 is a protrusion. Alternatively, the guide portion 320 can be designed as a protrusion, and the first guide member 110 can be configured as a groove. From a practical perspective, the solution of setting a groove on the carrier 300 is more advantageous. C-shaped or U-shaped grooves can form a more comprehensive three-dimensional envelope around the protrusion, providing a more stable support structure and stronger impact resistance in the suspended state, making it particularly suitable for carriers 300 that carry batches of wafers.

[0081] The second locking part 130 can be omitted. Instead, the first locking part 120 and the stop part 322 can cooperate to achieve the engagement of the guide part 320 and the first guide member 110.

[0082] With the second locking part 130 provided, its structure can be flexibly adjusted. In addition to the pin-type design, rotary latches, spring-loaded latches, electromagnetic locks, and other structures can be used. The core requirement is that after the carrier 300 is fully engaged with the first guide member 110, it can physically prevent the carrier 300 from disengaging from the lifting mechanism 100 in the Y direction. Regardless of the form adopted, the second locking part 130 must ensure that during the cleaning process, especially when the carrier 300 moves along the Z-axis or the tank vibrates, the carrier 300 is always securely connected to the lifting mechanism 100, completely eliminating the risk of accidental disengagement.

[0083] The choice of materials for the carrier body 300 310 also offers flexibility; polytetrafluoroethylene (PTFE) is merely an example. In specific scenarios, engineering plastics such as polyetheretherketone (PEEK), polyvinylidene fluoride (PVDF), or ethylene trifluorochloroethylene copolymer can also be used. These materials must meet the cleanliness requirements for semiconductor cleaning, namely low venting and low particle release, while also possessing excellent chemical stability, making them particularly suitable for cleaning temperatures exceeding 200°C or scenarios requiring higher mechanical strength. However, in terms of sliding fit performance, PTFE's inherent low-friction properties remain irreplaceable, minimizing operational resistance and improving transfer smoothness.

[0084] The track cross-section of the second guide member 210 on the platform 200 can be designed as rectangular, V-shaped, or dovetail-shaped according to actual needs, as long as it precisely matches the geometry of the auxiliary guide part 330 at the bottom of the carrier 300. However, regardless of the cross-sectional shape, the dual-track configuration strategy must remain unchanged. The two-point support formed by the dual tracks ensures the torsional stability of the carrier 300 during transfer in the X and Y directions, effectively preventing the carrier 300 from jamming or tilting due to uneven force during manual pushing and pulling, thus ensuring smooth operation.

[0085] It should be noted that the technical solutions described in the embodiments of this disclosure can be combined arbitrarily without conflict.

[0086] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A carrier suitable for semiconductor cleaning equipment, characterized in that, The vehicle includes: The main body, which is used to hold the parts to be cleaned; and A connecting component, the connecting component being disposed on the main body; The connection component includes a guide section. The guide portion is configured to cooperate with a first guide member disposed on a semiconductor cleaning device to guide the movement of the carrier relative to the first guide member in a first direction and limit the displacement of the carrier in a second direction intersecting the first direction.

2. The vehicle according to claim 1, characterized in that, One of the guide portion and the first guide member is a groove, and the other is a protrusion. The protrusion is configured to be accommodated in the groove and slidably connected to the groove.

3. The vehicle according to claim 2, characterized in that, The chute includes a first end and a second end, which are opposite to each other. The first end is provided with an access opening, which is configured to allow the protrusion to enter the chute along the first direction.

4. The vehicle according to claim 3, characterized in that, The second end is provided with a stop to prevent the protrusion from leaving the groove.

5. The vehicle according to claim 1, characterized in that, The connecting component further includes an auxiliary guide portion, which is spaced apart from the guide portion; The auxiliary guide is configured to cooperate with a second guide member disposed on the semiconductor cleaning equipment, so that the carrier can move along the second guide member.

6. The vehicle according to claim 5, characterized in that, The auxiliary guide includes two grooves that are spaced apart from each other and arranged in parallel.

7. The vehicle according to any one of claims 1 to 6, characterized in that, The vehicle also includes a gripping part disposed on the main body.

8. The vehicle according to any one of claims 1 to 6, characterized in that, The main body of the vehicle is integrally molded from polytetrafluoroethylene material.

9. A semiconductor cleaning apparatus configured for use with a carrier according to claim 5 or 6, characterized in that, The semiconductor cleaning equipment includes: A lifting mechanism, wherein the lifting mechanism is provided with a first guide member; and The platform, on which a second guide component is provided, The first guide member and the second guide member are configured such that while the vehicle engages with the first guide member through its guide portion, an auxiliary guide portion of the vehicle engages with the second guide member to allow the weight of the vehicle to be transferred between the lifting mechanism and the platform.

10. The semiconductor cleaning equipment according to claim 9, characterized in that, The second guide member includes a first track section and a second track section; The first track section extends along the arrangement direction of the plurality of cleaning stations in the semiconductor cleaning equipment, and is used to guide the carrier to translate so that it is aligned with the plurality of cleaning stations respectively. The second track section extends toward the lifting mechanism in a direction perpendicular to the first track section. The second track section is configured to communicate with the first track section, so that the vehicle can be translated from the first track section into the second track section and guided to move along the second track section toward the lifting mechanism until the guide portion of the vehicle engages with the first guide member.

11. The semiconductor cleaning equipment according to claim 9, characterized in that, The lifting mechanism is provided with a locking mechanism, which is configured to restrict the vehicle from disengaging from the lifting mechanism in the first direction when the guide part of the vehicle is fully engaged with the first guide member.

12. A semiconductor cleaning method, characterized in that, The semiconductor cleaning method is performed using the semiconductor cleaning apparatus according to claim 10 to operate the carrier according to claim 5 or 6, the semiconductor cleaning method comprising: The carrier is moved along the first track section on the platform until the carrier is aligned with the target cleaning station. The carrier is moved from the first track section to the second track section corresponding to the target cleaning station; The vehicle is moved toward the lifting mechanism along the second track section; As the vehicle slides along the second track section, the guide portion of the vehicle gradually engages with the first guide member on the lifting mechanism; and Drive the vehicle until it is completely detached from the second track section and carried by the first guide member.

13. A carrier suitable for semiconductor cleaning equipment, characterized in that, The vehicle includes: The main body is used to hold the items to be cleaned; and A connecting component is disposed on the main body; The connecting component includes a slide groove extending along a first direction, the slide groove having a first limiting wall and a second limiting wall disposed opposite to each other in a second direction intersecting the first direction, the first limiting wall, the second limiting wall and the side wall connecting the two together defining an accommodating space. The chute has opposite first and second ends in the first direction, and the first end is provided with an access opening that communicates with the receiving space.

14. The vehicle according to claim 13, characterized in that, The second end of the slide is provided with a stop portion, which is configured to prevent the guide member entering the receiving space from disengaging from the slide along the first direction.

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