An auxiliary device and method for semiconductor chip packaging

Abstract

This invention belongs to the field of chip packaging technology, specifically an auxiliary device and method for semiconductor chip packaging, including a first rotary disk, a second rotary disk, at least three first loading stations and adsorption clamps installed in the first loading stations, at least three second loading stations and adsorption plates installed in the second loading stations; by the first and second rotary disks rotating synchronously in opposite directions, the independent material flows of the chip and the silicon interposer are deeply coupled in space and time. When the first and second rotary disks rotate 120° in opposite directions at a fixed rhythm, the chip and the silicon interposer are axially intersected at the same and unique bonding station. At the same time, other stations perform loading, pre-processing or unloading preparation in parallel, so that the loading, alignment, bonding and unloading processes form a continuous operation flow. When the bonding station is bonding, adjacent stations can perform loading or pre-processing simultaneously, eliminating the idle waiting between stations in traditional linear or single-disc equipment.

Description

Technical Field

[0001] This invention belongs to the field of chip packaging technology, specifically an auxiliary device and method for semiconductor chip packaging. Background Technology

[0002] Semiconductor chip packaging, especially 2.5D / 3D advanced packaging involving silicon interposers, is a key technology for improving chip integration and performance. In this process, accurately and efficiently mounting the chip onto the silicon interposer is the basic step to achieve high-density interconnection. Currently, the automated mounting equipment commonly used in the industry is mainly divided into two categories: linear production line equipment and single rotary platform equipment.

[0003] Linear assembly line equipment arranges processes such as loading, alignment, bonding, and unloading in a straight line, and moves materials through linear motors or conveyor belts. However, this layout has inherent drawbacks. First, the equipment occupies a large area, which is extremely uneconomical for semiconductor factories with expensive cleanrooms. More importantly, materials need to be transferred sequentially between multiple discrete workstations, and the production cycle is limited by the slowest process. Frequent start-ups, shutdowns, and repositioning lead to low overall efficiency, making it difficult to meet the high-capacity requirements of modern packaging.

[0004] To improve efficiency, single rotary platform equipment has emerged. This type of equipment integrates multiple workstations around a rotary platform. The workpieces are sequentially sent to different workstations for processing through the intermittent rotation of the platform. Although this shortens the material movement distance to some extent, it is still essentially a serial processing. The core problem is that chips and silicon interposers usually need to be loaded and pre-processed at different, fixed workstations, and finally converge at a single mounting workstation. This single-point convergence mode means that the movement path of the material on the platform is not optimal, and there is still a waste of waiting time and space utilization. In addition, the complex material flow also increases the complexity of equipment control.

[0005] More importantly, whether linear or single-rotary platform equipment, in pursuit of high-precision placement, it often relies on complex multi-axis alignment mechanisms and precise independent drive systems to ensure the alignment of the chip with the silicon interposer. These systems are not only costly, but their dynamic response and long-term synchronization stability also pose potential risks to equipment reliability. Existing semiconductor chip packaging and placement equipment generally suffers from low space utilization, non-optimal material flow paths leading to limited production efficiency, and high system complexity and control difficulties in achieving precise alignment.

[0006] Therefore, the present invention provides an auxiliary device and method for semiconductor chip packaging. Summary of the Invention

[0007] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0008] The technical solution adopted by the present invention to solve its technical problem is: the auxiliary device for semiconductor chip packaging of the present invention includes a first rotating disk, a second rotating disk, at least three first loading stations and adsorption clamps installed in the first loading stations, at least three second loading stations and adsorption disks installed in the second loading stations.

[0009] The first loading station is set on the first rotary table, and the three first loading stations are arranged in a circular array on the first rotary table; the second loading station is set on the second rotary table, and the three second loading stations are arranged in a circular array on the second rotary table.

[0010] The first rotary disk has a chip loading station, a bonding station, and a composition unloading station defined sequentially on its circumference; the second rotary disk has a silicon interposer loading station, a silicon interposer pre-processing station, and a bonding station defined sequentially on its circumference.

[0011] The suction gripper on the first loading station is used to carry the chip at the chip loading station and rotates clockwise with the first rotary table; the suction plate on the second loading station is used to carry the silicon interposer at the silicon interposer loading station and rotates counterclockwise with the second rotary table.

[0012] When the adsorption disk carrying the silicon interposer rotates 120° counterclockwise from the silicon interposer pre-processing station to the bonding station, it is axially aligned with the chip carried by the adsorption clamp arm, which rotates 120° clockwise from the chip loading station to the bonding station; the adsorption disk is configured to be liftable at the bonding station to press the silicon interposer and the chip together.

[0013] Preferably, the first rotary disk has at least three first clearance grooves corresponding to the adsorption clamp arm for accommodating the air tube communicating with the adsorption clamp arm; the second rotary disk has at least three second clearance grooves corresponding to the adsorption disk for accommodating the air tube communicating with the adsorption disk.

[0014] Preferably, at least three shrink covers are fixedly connected to the bottom of the second rotating disk, and the adsorption disk is axially slidably connected inside the shrink covers; the shrink covers are provided with connecting parts that engage with the adsorption disk.

[0015] Preferably, the suction cup includes a suction cup, a connecting shaft, a locking arm, a limiting rod, and a sliding abutment; the suction cup is fixedly connected to the top of the connecting shaft, the connecting shaft has a movable groove inside, the locking arm is rotatably connected in the movable groove and engages with the connecting part; the limiting rod is axially slidably connected in the connecting shaft and is hinged to the locking arm through a hinge arm; the sliding abutment is fixedly connected to the bottom of the limiting rod.

[0016] A first spring is provided between the suction cup and the shrink cover to provide elastic force to drive the suction cup upward; when the limiting rod moves upward, the hinge arm drives the locking arm to retract into the movable groove, so that the suction cup is disengaged from the connecting part and lifted.

[0017] Preferably, a second spring is also sleeved on the limiting rod, with both ends of the second spring fixed to the side wall of the movable groove and the middle of the limiting rod, for providing elastic force to drive the limiting rod to slide downward.

[0018] Preferably, the bottom of the first rotating disk is provided with a first base plate, and the bottom of the second rotating disk is provided with a second base plate. The first base plate and the second base plate are arranged alternately. DD motors are fixedly connected to the first base plate and the second base plate respectively, and the two DD motors are used to drive the first rotating disk to rotate clockwise and the second rotating disk to rotate counterclockwise.

[0019] Preferably, a lifting part is fixedly connected to the second rotary disk. When the second rotary disk rotates counterclockwise to the fitting position, the sliding abutment part contacts the lifting part and is lifted up. The clamping arm is driven to retract by the limiting rod and the hinge arm, so that the adsorption disk is separated from the connecting part and lifted upward under the action of the first spring.

[0020] Preferably, a feeding module is also provided at the bottom of the first rotary disk, and an arc-shaped plate is fixedly connected to the bottom of the first rotary disk; when the first rotary disk rotates clockwise to the feeding station, the arc-shaped plate contacts the feeding module and drives the feeding module to radially push out the chip-silicon interposer composition released by the adsorption clamp arm in the feeding module.

[0021] Preferably, the unloading module includes an unloading tray, a push plate, a fixing frame, a fixing plate, and a connecting rod; the fixing plate is fixedly connected to the first base plate, and the unloading tray is connected to the fixing plate via the fixing frame; the push plate is slidably connected to the unloading tray, and the connecting rod is fixedly connected to one side of the push plate; when the arc-shaped plate contacts and pushes the connecting rod, it drives the push plate to slide and push out the chip-silicon interposer composition.

[0022] A partition is fixedly connected to the feeding tray, and the push plate is slidably engaged with the partition. A limiting plate is also slidably connected to the feeding tray. A sliding rod that passes through the partition is fixedly connected to the side of the limiting plate facing the push plate. A third spring for providing the limiting plate with a restoring force is sleeved on the sliding rod.

[0023] An auxiliary method for semiconductor chip packaging, using the auxiliary device according to any one of claims 1-9, includes the following steps:

[0024] S1: Load the chip onto the adsorption clamp arm of the first rotary table at the chip loading station, and load the silicon interposer onto the adsorption plate of the second rotary table at the silicon interposer loading station.

[0025] S2: Start the DD motor to drive the first rotary disk to rotate clockwise intermittently according to a set rhythm and drive the second rotary disk to rotate counterclockwise intermittently according to a set rhythm, and the rotation rhythm is synchronized with the first rotary disk;

[0026] S3: When the adsorption arm carrying the chip rotates 120° clockwise with the first rotary disk to reach the bonding station, and at the same time, the adsorption disk carrying the silicon interposer rotates 120° counterclockwise with the second rotary disk to reach the same bonding station, the first rotary disk and the second rotary disk stop rotating, and the chip and the silicon interposer are axially aligned at the bonding station.

[0027] The sliding contact portion of the adsorption disk comes into contact with the lifting portion and is lifted up, causing the adsorption disk to detach from the connecting portion and be lifted upward under the elastic force of the first spring, pressing the silicon interlayer onto the chip to complete the pre-bonding of the two.

[0028] S4: The pre-bonded chip-silicon interposer composition continues to rotate clockwise with the first rotary table to the unloading station, releasing the chip-silicon interposer composition into the unloading tray. Then, the first rotary table is controlled to rotate clockwise, and the arc plate at the bottom of the first rotary table contacts and pushes the connecting rod of the unloading module, so that the push plate pushes out the chip-silicon interposer composition released on the unloading tray.

[0029] The beneficial effects of this invention are as follows:

[0030] 1. The auxiliary device and method for semiconductor chip packaging described in this invention deeply couples the independent material flows of the chip and the silicon interposer in space and time through a first and second rotating disk that rotate synchronously in opposite directions. When the first and second rotating disks rotate 120° in opposite directions at a fixed pace, the chip and the silicon interposer are axially intersected at the same and unique bonding station. At the same time, other stations perform loading, pre-processing or unloading preparation in parallel, so that the loading, alignment, bonding and unloading processes form a continuous operation flow. When the bonding station is bonding, adjacent stations can perform loading or pre-processing simultaneously, eliminating the idle waiting between stations in traditional linear or single-disc equipment, significantly improving the overall efficiency, and achieving the unity of minimizing equipment footprint and maximizing production cycle time.

[0031] 2. The auxiliary device and method for semiconductor chip packaging described in this invention achieves precise positioning through a mechanical rotation path at a fixed angle, transforming complex dynamic visual alignment into reliable static mechanical positioning. This reduces reliance on expensive and complex external alignment systems. Simultaneously, the bonding action is directly triggered by the rotation of the rotary table to a specific position, powered by the potential energy of a pre-stored first spring. This results in a fast response speed and eliminates the need for additional driving components. It not only simplifies the system structure and reduces manufacturing costs and maintenance complexity but also avoids the risks associated with delays or malfunctions in the electronic control system. This ensures the repeatability, reliability, and safety of the entire bonding process, guaranteeing long-term stability of the packaging yield. Attached Figure Description

[0032] The invention will now be further described with reference to the accompanying drawings.

[0033] Figure 1 This is a top view of the present invention;

[0034] Figure 2 This is a perspective view of the present invention;

[0035] Figure 3 yes Figure 1 Sectional view at point AA;

[0036] Figure 4 yes Figure 1 Sectional view at BB in the middle;

[0037] Figure 5 yes Figure 4 Enlarged schematic diagram of a local structure in the middle;

[0038] Figure 6 This is a diagram showing the interaction between the first rotary table and the feeding module in this invention;

[0039] Figure 7 This is a perspective view of the feeding module in this invention;

[0040] Figure 8 This is a three-dimensional view of the adsorption disk in this invention;

[0041] Figure 9 This is a schematic diagram of the engagement state between the arc-shaped plate and the connecting rod in the first rotating disk of the present invention;

[0042] Figure 10 This is a schematic diagram of the cooperation state between the first and second rotating disks in this invention;

[0043] In the diagram: 1. First rotary table; 11. First loading station; 12. First clearance groove; 13. Arc plate; 2. Second rotary table; 21. Second loading station; 22. Second clearance groove; 23. Shrink cover; 24. First spring; 3. Adsorption plate; 31. Suction cup; 32. Connecting shaft; 33. Movable groove; 34. Clamping arm; 35. Limiting rod; 36. Sliding contact part; 37. Second spring; 4. Adsorption clamping arm; 5. Unloading module; 51. Unloading tray; 52. Divider 53. Plate; 54. Connecting rod; 55. Limiting plate; 56. Sliding rod; 57. Third spring; 58. Fixing plate; 59. Fixing frame; 6. Push plate; 7. First base plate; 8. Second base plate; 9. Lifting part; 10. DD motor; 10. Chip-silicon interposer composition; 10-a. Chip; 10-b. Silicon interposer; N1. Chip loading station; N2. Unloading station; M1. Silicon interposer loading station; M2. Silicon interposer pre-processing station; NM. Bonding station. Detailed Implementation

[0044] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0045] like Figures 1 to 10 As shown in the embodiment of the present invention, an auxiliary device for semiconductor chip packaging includes a first rotating disk 1, a second rotating disk 2, at least three first loading stations 11 and an adsorption clamping arm 4 installed in the first loading station 11, at least three second loading stations 21 and an adsorption disk 3 installed in the second loading station 21.

[0046] The first loading station 11 is set on the first rotary table 1, and the three first loading stations 11 are arranged in a circular array on the first rotary table 1; the second loading station 21 is set on the second rotary table 2, and the three second loading stations 21 are arranged in a circular array on the second rotary table 2.

[0047] The first rotary disk 1 has a chip 10-a loading station, a bonding station NM and a composition unloading station N2 defined sequentially on its circumference; the second rotary disk 2 has a silicon interposer 10-b loading station, a silicon interposer 10-b pre-processing station and a bonding station NM defined sequentially on its circumference.

[0048] The adsorption clamp 4 on the first loading station 11 is used to carry the chip 10-a at the chip 10-a loading station and rotates clockwise with the first rotary table 1; the adsorption disk 3 on the second loading station 21 is used to carry the silicon interposer 10-b at the silicon interposer 10-b loading station and rotates counterclockwise with the second rotary table 2.

[0049] When the adsorption disk 3 carrying the silicon interposer 10-b rotates 120° counterclockwise from the silicon interposer 10-b pre-processing station to the bonding station NM, it is axially aligned with the chip 10-a carried by the adsorption clamp arm 4, which has rotated 120° clockwise from the chip 10-a loading station to the bonding station NM; the adsorption disk 3 is configured to be liftable at the bonding station NM to press the silicon interposer 10-b and the chip 10-a together.

[0050] Based on the bidirectional synchronous motion of the first rotating disk 1 rotating clockwise and the second rotating disk 2 rotating counterclockwise, and the motion mode of the silicon interposer 10-b rotating counterclockwise 120° from the pre-processing station and the chip 10-a rotating clockwise 120° from the loading station and then aligning along the NM axis at the same bonding station, an efficient material flow path is achieved, enabling continuous production, improving efficiency and production cycle time. Through a fixed rotation angle and precise mechanical synchronization, the spatial positional relationship between the chip 10-a and the silicon interposer 10-b is transformed into a deterministic spatiotemporal convergence motion controlled by the rotation cycle time, reducing the dependence on complex independent alignment mechanisms and real-time high-precision servo control. The high repeatability of the mechanical positioning accuracy ensures the alignment accuracy, making the system simpler and more reliable.

[0051] In this embodiment, chip 10-a is first precisely loaded onto the adsorption clamp 4 of the chip 10-a loading station of the first rotary table 1. The adsorption clamp 4 reliably fixes chip 10-a by vacuum adsorption. At the same time, silicon interposer 10-b is loaded onto the adsorption plate 3 of the silicon interposer 10-b loading station of the second rotary table 2. Then, the second rotary table 2 rotates counterclockwise one station to send silicon interposer 10-b to the silicon interposer 10-b pre-processing station. At this station, pre-processing processes such as pad grinding, cleaning, and flux coating can be performed. The loading and pre-processing processes of chip 10-a and silicon interposer 10-b are separated in space and parallel in time, eliminating the waiting time in the traditional serial production line and laying the foundation for high-speed production. In addition, the pre-processing station is directly integrated on the first rotary table 1 and the second rotary table 2, reducing the number of material transfers and reducing positioning errors and contamination risks.

[0052] Under the command of the control system, the first rotary disk 1 and the second rotary disk 2 are driven to rotate intermittently at the same rhythm. The first rotary disk 1 rotates 120° clockwise, moving the chip 10-a from the chip 10-a loading station to the bonding station NM; the second rotary disk 2 rotates 120° counterclockwise, moving the pre-processed silicon interposer 10-b from the silicon interposer 10-b pre-processing station to the same bonding station NM. At this moment, the first rotary disk 1 and the second rotary disk 2 stop rotating. The first rotary disk 1 and the second rotary disk 2 are driven by a high-precision DD motor 9. With the circumferential array station design, it is ensured that when the chip 10-a and the silicon interposer 10-b arrive at the bonding station NM, they have achieved a high degree of axial pre-alignment. The fixed-angle rotation and bidirectional symmetrical motion path ensure that the chip 10-a and the silicon interposer 10-b are aligned. The combination of -b forms a predictable and highly repeatable mechanical motion, rather than relying on complex real-time dynamic adjustments, ensuring the stability and reliability of the system. In addition, the bidirectional rotation design allows the chip 10-a and the silicon interposer 10-b to reach the meeting point with the shortest path and the same amount of time, achieving the theoretical minimum production cycle and increasing equipment throughput. There is no need to design additional complex motion axes for alignment. The control system only needs to synchronize the start and stop of the first rotating disk 1 and the second rotating disk 2, reducing the complexity of the control algorithm and hardware cost. At the bonding station NM, the adsorption disk 3 and the silicon interposer 10-b it carries are raised smoothly upwards and precisely pressed against the chip 10-a fixed by the upper adsorption clamp arm 4. Under the preset pressure, the two complete the precise bonding to form the chip-silicon interposer composition 10.

[0053] After bonding is completed, the adsorption plate 3 descends and is re-secured. At this time, the chip-silicon interposer composition 10 is supported by the adsorption clamp arm 4. The first rotary disk 1 rotates clockwise 120° again to transport the chip-silicon interposer composition 10 from the bonding station NM to the composition unloading station N2.

[0054] In this embodiment, two robotic arms are respectively installed next to the chip 10-a loading station and the silicon interposer 10-b loading station. These robotic arms pick up the slid-out chip 10-a and the diced silicon interposer 10-b from the previous process, and then transfer them to the chip 10-a loading station and the silicon interposer 10-b loading station, respectively. Furthermore, in this embodiment, the chip 10-a loading station and the silicon interposer 10-b loading station are located in two independent positions, making the assembly process of chip 10-a and silicon interposer 10-b more compact and effectively integrating it into the existing chip 10-a packaging process. Figure 9 The arrow shown indicates that the first rotating disk 1 rotates clockwise. Figure 10In this context, M1 represents the silicon interposer 10-b loading station, M2 represents the silicon interposer 10-b pre-processing station, and NM is the bonding station; N1 represents the chip 10-a loading station, and N2 represents the unloading station. Additionally... Figure 10 The arrows shown indicate the rotation directions of the first rotary disk 1 and the second rotary disk 2, respectively; T1 represents the initial state, at least one first loading station 11 and the second loading station 21 correspond to the silicon interposer 10-b loading station and the chip 10-a loading station, respectively; T2 represents the first state after the first rotary disk 1 and the second rotary disk 2 have rotated; T3 represents the second state after the first rotary disk 1 and the second rotary disk 2 have rotated; and T3 to T1 represent the states after the first rotary disk 1 and the second rotary disk 2 have rotated 120°, respectively.

[0055] like Figures 1 to 2 As shown, the first rotary disk 1 has at least three first clearance grooves 12 corresponding to the adsorption clamp arm 4, which are used to accommodate the air tubes connected to the adsorption clamp arm 4; the second rotary disk 2 has at least three second clearance grooves 22 corresponding to the adsorption disk 3, which are used to accommodate the air tubes connected to the adsorption disk 3.

[0056] In one embodiment of the present invention, a static gas path interface for connecting to an external vacuum generator is provided. The static gas path is connected to the gas path inside the rotating first disc 1 and the second disc 2 via a high-precision rotary joint (not shown in the figure). The core function of the first clearance groove 12 and the second clearance groove 22 is to provide a protected and neat wiring channel for the gas pipe. The gas pipe led out from the rotary joint is laid in an orderly manner in the corresponding clearance groove, and then leads to each adsorption clamp arm 4 and adsorption plate 3 respectively. The first clearance groove 12 and the second clearance groove 22 ensure that the gas pipe will not be entangled, pulled or worn with other moving parts when the first disc 1 or the second disc 2 rotates, thereby improving the reliability and life of the equipment, making the equipment look neat, and avoiding the safety hazards and maintenance inconvenience that exposed pipelines may cause.

[0057] When the adsorption disk 3 carrying the silicon interposer 10-b rotates with the second rotary disk 2 to the bonding station NM, the lifting action will be triggered. Just before the lifting action occurs, the control system will send a signal to cut off the vacuum to the specific adsorption disk 3, that is, briefly introduce normal pressure air or release negative pressure into the air tube. It should be noted that the vacuum must be broken before the adsorption disk 3 is lifted and the silicon interposer 10-b comes into contact with the chip 10-a. Otherwise, the vacuum suction will prevent the silicon interposer 10-b from smoothly detaching from the adsorption disk 3, resulting in uneven bonding or damage.

[0058] When the chip-silicon interposer composition 10 that has been bonded is carried by the adsorption clamp arm 4 and rotated with the first rotary table 1 to the unloading station N2, it is ready to be unloaded. Before the push plate 59 moves, the control system will cut off the vacuum to the specific adsorption clamp arm 4, so that the chip-silicon interposer composition 10 will fall smoothly onto the unloading tray 51 under gravity or slight assistance. Then, the arc plate 13 pushes the connecting rod 53, so that the push plate 59 pushes out the chip-silicon interposer composition 10.

[0059] To achieve the above precise control, an independent solenoid valve can be installed in each air path. The controller controls the opening and closing of the corresponding solenoid valve at a specific angle position based on the feedback signal from the encoder of the rotary disc.

[0060] like Figures 1 to 5 As shown, at least three shrink covers 23 are fixedly connected to the bottom of the second rotating disk 2, and the adsorption disk 3 is axially slidably connected inside the shrink cover 23; the shrink cover 23 is provided with a connecting part that engages with the adsorption disk 3.

[0061] In one embodiment of the present invention, the shrink cover 23 is directly fixed to the bottom of the second rotating disk 2, and the adsorption disk 3 is axially slidably connected inside the shrink cover 23. The inner wall of the shrink cover 23 provides guidance for the adsorption disk 3, ensuring that the adsorption disk 3 can only move in the vertical direction without any lateral offset or shaking, thus ensuring the accuracy of subsequent bonding. During rotation and conveying, the adsorption disk 3 forms a snap-fit ​​with the connecting part inside the shrink cover 23 through the clamping arm 34, which can firmly snap the adsorption disk 3 onto the shrink cover 23, overcoming the inertial force or vibration that may be generated during rotation, and ensuring the absolute stability of the silicon interposer 10-b before reaching the bonding station NM. Specifically, from the loading of the silicon interposer 10-b to the pre-processing, until the initial stage of entering the bonding station NM, the adsorption disk 3 is always locked by the clamping arm 34 and the connecting part. At this time, the first spring 24 is in a compressed state, storing elastic potential energy to prepare for lifting.

[0062] When the second rotating disk 2 rotates, causing the adsorption disk 3 to accurately reach the bonding station NM, the fixed lifting part 8 will contact the sliding contact part 36 at the bottom of the adsorption disk 3. The lifting part 8 forces the sliding contact part 36 and the limiting rod 35 to move upward. The upward movement of the limiting rod 35 can drive the locking arm 34 to rotate through the hinge arm, causing it to retract back into the movable groove 33 of the connecting shaft 32, thereby releasing the locking with the connecting part on the shrink cover 23. Once the locking is released, the elastic force of the compressed first spring 24 is released instantly, and the entire adsorption disk 3 is pushed upward quickly and smoothly along with the silicon interposer 10-b along the guide of the shrink cover 23, accurately pressing against the chip 10-a above, completing the bonding.

[0063] Based on the above, the hard contact guide of the shrink cover 23 provides effective anti-torsional and anti-bending stiffness compared to the flexible connecting rod 53 or guide rail, ensuring the absolute verticality of the lifting trajectory and guaranteeing the repeatability of the fitting position from a mechanical principle perspective; the lifting power comes from the instantaneous release of the pre-compressed first spring 24, which is fast and has no delay, avoiding the response lag problem of the motor or cylinder, and has high reliability.

[0064] like Figures 1 to 5 , Figure 8 As shown, the suction cup 3 includes a suction cup 31, a connecting shaft 32, a locking arm 34, a limiting rod 35, and a sliding abutment part 36; the suction cup 31 is fixedly connected to the top of the connecting shaft 32, the connecting shaft 32 has a movable groove 33 inside, the locking arm 34 is rotatably connected in the movable groove 33 and engages with the connecting part; the limiting rod 35 is axially slidably connected in the connecting shaft 32 and is hinged to the locking arm 34 through a hinge arm; the sliding abutment part 36 is fixedly connected to the bottom of the limiting rod 35.

[0065] A first spring 24 is provided between the suction cup 31 and the shrink cover 23 to provide elastic force to drive the suction cup 31 to move upward; when the limiting rod 35 moves upward, the hinge arm drives the locking arm 34 to retract into the movable groove 33, so that the suction cup 3 disengages from the connecting part and is lifted.

[0066] like Figures 1 to 5 , Figure 8 As shown, a second spring 37 is also sleeved on the limiting rod 35. The two ends of the second spring 37 are fixed to the side wall of the movable groove 33 and the middle of the limiting rod 35, and are used to provide elastic force to drive the limiting rod 35 to slide downward.

[0067] In one embodiment of the present invention, the silicon interposer 10-b is picked up by a robot arm from the silicon interposer 10-b loading station and placed onto the suction cup 3. Then, based on vacuum control, the silicon interposer 10-b is firmly fixed onto the suction cup 31. At this time, the clamping arm 34, under the action of a torsion spring (not shown in the figure), extends outward at its end and forms a firm clamping engagement with the connecting part inside the shrink cover 23, locking the suction cup 3 inside the shrink cover 23. At this time, the first spring 24 is compressed between the suction cup 31 and the shrink cover 23 and is in an energy storage state. The limiting rod 35 is held in place on the connecting shaft by the combined force of the push of the second spring 37 and its own weight. Below 32, and it should be noted that in this state, the surface of the chuck 31 is flush with the surface of the second loading station 21. When the second rotary table 2 starts to rotate, the silicon interposer 10-b fixed on the chuck 31 is carried and rotates counterclockwise. It should also be noted that when the silicon interposer 10-b rotates 120° counterclockwise from the silicon interposer 10-b loading station to the silicon interposer 10-b pre-processing station, pre-processing can be performed at this station, such as coating the surface of the silicon interposer 10-b with adhesive. Then the second rotary table 2 rotates another 120° to the bonding station NM, which is clockwise from the chip 10-a loading station. When the chip 10-a is axially aligned after rotating 120°, and simultaneously, when the silicon interposer 10-b reaches this position, the lifting part 8 on the second base plate 7 can contact the sliding abutment part 36 at the bottom of the adsorption disk 3. At this time, the lifting part 8 can lift the sliding abutment part 36 upward, causing the sliding abutment part 36 to drive the limiting rod 35 to overcome the force of the second spring 37 and slide upward within the connecting shaft 32. After the limiting rod 35 moves upward, the hinge arm can pull the clamping arm 34, causing the clamping arm 34 to retract into the shrinkage groove. When the clamping arm 34 retracts, the engagement between the adsorption disk 3 and the connection part on the shrinkage cover 23 is released. At this time, the adsorption disk 3... Under the elastic force of the first spring 24, it can be lifted upward and push the entire suction cup 31 and the silicon interposer 10-b on the suction cup 31 to move vertically upward. After the suction cup 3 drives the silicon interposer 10-b to move upward, it can come into contact with the chip 10-a that has arrived at the bonding station NM. Under the pressure of the first spring 24, the chip 10-a and the silicon interposer 10-b are bonded. At this time, based on the control, the vacuum path is cut off, so that the suction effect of the suction cup 31 on the bonding station NM on the silicon interposer 10-b is canceled, and the bonding of the chip 10-a and the silicon interposer 10-b is completed, forming a chip-silicon interposer composition 10.

[0068] Subsequently, the second rotary disk 2 rotates counterclockwise away from the bonding station NM, the sliding contact part 36 at the bottom of the suction cup 3 separates from the lifting part 8, and the limiting rod 35 returns to its original position downward under the push of the second spring 37. The downward movement of the limiting rod 35 drives the hinge arm to push the clamping arm 34 to reopen. When the second rotary disk 2 rotates to the silicon interposer 10-b loading station, the pressure block (not shown in the figure) on the bottom surface of the first rotary disk 1, during the process of alternating rotation with the second rotary disk 2, squeezes the suction cup 31, and in conjunction with the opened clamping arm 34, re-establishes contact with the suction cup 31. The snap-fit ​​relationship of the connecting part compresses the first spring 24 to prepare for the next cycle. Based on this, it can be ensured that when the silicon interposer 10-b is loaded from the silicon interposer 10-b loading station, the suction cup 31 is flush with the surface of the second loading station 21. At the same time, after the first rotary disk 1 rotates clockwise again, it can carry the chip-silicon interposer composition 10 to the unloading station N2. At this time, the vacuum gas corresponding to the unloading station N2 is cut off, so that the chip-silicon interposer composition 10 can be freely released into the unloading module 5.

[0069] like Figures 1 to 5 As shown, the bottom of the first rotating disk 1 is provided with a first base plate 6, and the bottom of the second rotating disk 2 is provided with a second base plate 7. The first base plate 6 and the second base plate 7 are arranged alternately. DD motors 9 are fixedly connected to the first base plate 6 and the second base plate 7 respectively, and the two DD motors 9 are used to drive the first rotating disk 1 to rotate clockwise and the second rotating disk 2 to rotate counterclockwise.

[0070] In one embodiment of the present invention, the rotors of the two DD motors 9 are directly connected to the flanges of the first rotating disk 1 and the second rotating disk 2, respectively. Based on the main motion controller (not shown in the figure), a unified synchronous pulse signal is generated according to the preset production rhythm and sent to the respective drivers of the two DD motors 9. Since the two drivers receive instructions based on the same time base, they can drive the two DD motors 9 to start, accelerate, maintain a constant speed (pause at the workstation), and restart simultaneously, ensuring that the movement and stopping times of the first rotating disk 1 and the second rotating disk 2 are completely consistent, i.e., equal rhythm. In addition, the rotation direction of the DD motors 9 is determined by the phase of the signal output by the controller, and a fixed rotation direction of one clockwise and one counterclockwise can be achieved by setting it.

[0071] like Figures 1 to 5 As shown, a lifting part 8 is fixedly connected to the second rotary disk 2. When the second rotary disk 2 rotates counterclockwise to the bonding position NM, the sliding abutment part 36 contacts the lifting part 8 and is lifted up. The clamping arm 34 is driven to retract by the limiting rod 35 and the hinge arm, so that the adsorption disk 3 is separated from the connecting part and lifted upward under the action of the first spring 24.

[0072] In one embodiment of the present invention, as the second rotating disk 2, carrying the adsorption disk 3 already bearing the silicon interposer layer 10-b, rotates closer to the bonding station NM, a certain gap exists between the sliding contact portion 36 at the bottom of the adsorption disk 3 and the lifting portion 8 fixed on the second base plate 7. At this time, the locking arm 34 inside the adsorption disk 3 remains open under the action of the second spring 37 through the limiting rod 35 and the hinge arm, and is firmly locked with the connecting portion inside the shrink cover 23. The first spring 24 is in a compressed energy storage state, and the adsorption disk 3 is stably... Locked within the shrink shield 23, ensuring the silicon interposer 10-b does not wobble during high-speed rotation; when the second rotary disk 2, under the high-precision control of the DD motor 9, rotates counterclockwise to the bonding position NM and stops precisely, the sliding abutment part 36 moves precisely to the position directly opposite the lifting part 8. Since the lifting part 8 is fixed on the second base plate 7, it will make contact with the sliding abutment part 36. Furthermore, based on the fact that the lifting part 8 will push the sliding abutment part 36 upward, the rotational motion of the rotary disk is converted into a vertically upward straight motion through the sliding abutment part 36. The push force from the top of the line causes the sliding contact part 36 to be lifted, which in turn drives the limiting rod 35, which is fixed to it, to slide upward within the connecting shaft 32. Based on the linear upward movement of the limiting rod 35, the hinge arm forces the locking arm 34 to rotate inward around its axis of rotation, causing the locking arm 34 to retract completely into the movable groove 33 within the connecting shaft 32, thereby engaging the mechanical lock on the suction cup 3. When the mechanical lock on the suction cup 3 is engaged, the elastic potential energy of the first spring 24 is released instantaneously, pushing the entire suction cup 3 to move vertically upward along the inner wall of the shrink cover 23, causing the suction cup 31 to bear the load. The silicon interposer 10-b can press against the chip 10-a directly above it and complete the assembly. After the bonding is completed, the second rotary disk 2 moves counterclockwise away from the bonding station NM, the sliding contact part 36 separates from the lifting part 8, and under the elastic force of the second spring 37, the limiting rod 35 returns to its original position downwards. Then, the hinge arm makes the locking arm 34 open again. As mentioned above, based on the pressure block at the bottom of the first rotary disk 1, when it slides intermittently with the second rotary disk 2, it can squeeze the suction cup 31 to move downwards and cooperate with the opened locking arm 34 to achieve the re-locking of the suction cup 3.

[0073] like Figures 1 to 5 , Figure 7 As shown, a feeding module 5 is also provided at the bottom of the first rotary disk 1, and an arc plate 13 is fixedly connected to the bottom of the first rotary disk 1. When the first rotary disk 1 rotates clockwise to the feeding station N2, the arc plate 13 contacts the feeding module 5 and drives the feeding module 5 to radially push out the chip-silicon interposer composition 10 released by the adsorption clamp arm 4 in the feeding module 5.

[0074] like Figures 1 to 5 , Figure 7As shown, the unloading module 5 includes an unloading tray 51, a push plate 59, a fixing frame 58, a fixing plate 57, and a connecting rod 53; the fixing plate 57 is fixedly connected to the first base plate 6, and the unloading tray 51 is connected to the fixing plate 57 via the fixing frame 58; the push plate 59 is slidably connected to the unloading tray 51, and the connecting rod 53 is fixedly connected to one side of the push plate 59; when the arc plate 13 contacts and pushes the connecting rod 53, it drives the push plate 59 to slide, pushing out the chip-silicon interposer composition 10;

[0075] A partition 52 is fixedly connected to the feeding tray 51, and the push plate 59 is slidably engaged with the partition 52. A limiting plate 54 is also slidably connected to the feeding tray 51. A sliding rod 55 that passes through the partition 52 is fixedly connected to the side of the limiting plate 54 facing the push plate 59. A third spring 56 for providing the restoring force of the limiting plate 54 is sleeved on the sliding rod 55.

[0076] In one embodiment of the present invention, when the adsorption clamp 4 carrying the chip-silicon interposer composition 10 that has been bonded rotates with the first rotary table 1 to the unloading station N2 and stops, the control system cuts off the vacuum supply to the adsorption clamp 4. Under the action of gravity, the chip-silicon interposer composition 10 smoothly falls to a specific position on the unloading tray 51. At this time, the push plate 59 remains stationary in the initial position, and the unloading module 5 passively receives and gently constrains the chip-silicon interposer composition 10, preparing for the next step of active pushing. At this time, the pushing action has not yet been triggered. When the first rotary table 1 completes the unloading process... After all operations at the secondary station (including releasing the chip-silicon interposer composition 10), the clockwise rotation continues to begin the next work cycle. The arc-shaped plate 13 fixed to the bottom of the first rotary table 1 begins to contact and press the connecting rod 53 of the unloading module 5 as the rotary table rotates. The connecting rod 53 transmits the thrust of the arc-shaped plate 13 to the push plate 59 fixed thereto. Since the push plate 59 and the partition plate 52 are in sliding fit, the thrust forces the push plate 59 to slide smoothly radially outward on the unloading tray 51, away from the center of the first rotary table 1. The sliding push plate 59 pushes the chip-silicon interposer composition 10 from the front, causing it to overcome the third spring 5. The force of 6 pushes the limiting plate 54 to one side. Based on the fiberboard and the push plate 59, the chip-silicon interposer composition 10 is flexibly constrained between them. At this time, the chip-silicon interposer composition 10 is pushed from directly below the unloading station N2 to the outer periphery of the first rotary table 1. Based on the above, the unloading action is naturally triggered by the continuous rotation of the first rotary table 1. The pushing stroke accurately delivers the chip-silicon interposer composition 10 to the preset external gripping point. Another robotic arm is fixedly installed next to the unloading station N2, and the gripping center is aligned with the push plate 59 to push the chip-silicon interposer composition 10 to the final position, i.e., the outer periphery. At the gripping point, when the chip-silicon interposer composition 10 reaches this position, the chip-silicon interposer composition 10 can be picked up by the robot arm and transferred to the next process. Then, the first rotary table 1 continues to rotate, causing the arc plate 13 to disengage from the connecting rod 53. At this time, the external force on the push plate 59 disappears, and the third spring 56, which has been stretched, releases its elastic force, pushing the limit plate 54 to move in the opposite direction. The push plate 59 can also be reset under the force of the fourth spring (not shown in the figure) sleeved on its connecting rod 53, so that the unloading module 5 is completely reset and waits to receive the chip-silicon interposer composition 10 released in the next cycle.

[0077] Based on the above, the unloading action is integrated into the continuous rotation of the first rotary table 1, without the need for an independent drive source. It uses the main motion as the power source, which is highly reliable. The timing is guaranteed by the machine and is absolutely precise. Moreover, the release and pushing are performed in two steps to ensure that the chip-silicon interposer composition 10 is stably placed before pushing is performed. This avoids the risk of forcibly pushing the material before the adsorption gripper 4 is fully released. The action is gentler and protects the product. The chip-silicon interposer composition 10 is pushed to a fixed peripheral position, creating a stable, predictable and unobstructed gripping environment for the external robot arm, which facilitates the automation integration of the production line.

[0078] An auxiliary method for semiconductor chip packaging, using the auxiliary device according to any one of claims 1-9, includes the following steps:

[0079] S1: Load chip 10-a onto the adsorption clamp arm 4 of the first rotary table 1 at the chip 10-a loading station, and load silicon interposer 10-b onto the adsorption disk 3 of the second rotary table 2 at the silicon interposer 10-b loading station.

[0080] S2: Start the DD motor 9 to drive the first disc 1 to rotate clockwise intermittently according to a set rhythm and drive the second disc 2 to rotate counterclockwise intermittently according to a set rhythm, and the rotation rhythm is synchronized with the first disc 1;

[0081] S3: When the adsorption clamping arm 4 carrying chip 10-a rotates 120° clockwise with the first rotating disk 1 to reach the bonding station NM, at the same time, the adsorption disk 3 carrying silicon interposer 10-b rotates 120° counterclockwise with the second rotating disk 2 to reach the same bonding station NM, the first rotating disk 1 and the second rotating disk 2 stop rotating, and chip 10-a and silicon interposer 10-b are axially aligned at the bonding station NM.

[0082] The sliding contact portion 36 of the adsorption disk 3 comes into contact with the lifting portion 8 and is lifted up, causing the adsorption disk 3 to detach from the connecting portion and be lifted upward under the elastic force of the first spring 24, pressing the silicon interposer layer 10-b onto the chip 10-a, thus completing the pre-bonding of the two.

[0083] S4: The pre-bonded chip-silicon interposer composition 10 continues to rotate clockwise with the first rotary table 1 to the unloading station N2, releasing the chip-silicon interposer composition 10 into the unloading tray 51. Then, the first rotary table 1 is controlled to rotate clockwise, and the arc plate 13 at the bottom of the first rotary table 1 contacts and pushes the connecting rod 53 of the unloading module 5, so that the push plate 59 pushes out the chip-silicon interposer composition 10 released on the unloading tray 51.

[0084] Working principle: First, an external robotic arm places chip 10-a on the suction arm 4 of the first rotary table 1 at the chip 10-a loading station and fixes it using vacuum adsorption. Then, the external robotic arm places silicon interposer 10-b on the suction plate 3 of the second rotary table 2 at the silicon interposer 10-b loading station. Subsequently, the second rotary table 2 rotates 120° counterclockwise, delivering silicon interposer 10-b to the silicon interposer 10-b pre-processing station for pre-treatment such as coating and cleaning. Two DD motors 9 receive synchronous pulses from the same controller, driving the first rotary table 1 to rotate clockwise and the second rotary table 2 to rotate counterclockwise by 120° each. After rotation stops, chip 10-a on the first rotary table 1 moves from the chip 10-a loading station to the bonding station NM; the pre-treated silicon interposer 10-b on the second rotary table 2 moves from the silicon interposer 10-b pre-processing station to the same bonding station NM. Axial pre-alignment is achieved; at the bonding station NM, the lifting part 8 contacts the sliding abutment part 36 at the bottom of the adsorption plate 3 and lifts the adsorption plate 3. This force is transmitted through the limiting rod 35 and the hinge arm and converted into a pulling force that causes the clamping arm 34 to retract inward, thereby releasing the adsorption plate 3 from the connection part of the shrink cover 23; at the moment of release, the first spring 24 pre-compressed between the adsorption plate 3 and the shrink cover 23 quickly releases its elastic force, driving the adsorption plate 3 and the silicon interposer 10-b to be lifted vertically and smoothly along the guide, and to complete the pressing with the chip 10-a fixed above. The vacuum of the silicon interposer 10-b is cut off momentarily before lifting by the rotary gas distribution valve or solenoid valve installed on the air circuit of the adsorption plate 3, allowing it to be released smoothly; after bonding, the chip-silicon interposer composition 10 is carried by the adsorption clamping arm 4 of the first rotary disk 1. Based on the first rotary disk 1 rotating 120° clockwise, the composition is transported from the bonding station NM to the unloading station N2;

[0085] At the unloading station N2, the vacuum of the adsorption clamp arm 4 is cut off, and the composition is released onto the unloading tray 51. The first rotary disk 1 continues to rotate, and the arc plate 13 fixed to its bottom begins to contact and push the connecting rod 53 of the unloading module 5, thereby driving the push plate 59 to push the composition radially from directly below the unloading station N2 to the fixed gripping position. The external robot grabs the composition at this position and transfers it to the next process. After unloading is completed, the arc plate 13 disengages from the connecting rod 53, the push plate 59 and the limiting plate 54 reset, the adsorption tray 3 on the second rotary disk 2 descends, the clamp arm 34 reopens and engages with the connecting part again during the rotation return stroke, preparing for the next cycle.

[0086] At this time, the chip 10-a loading station of the first rotary disk 1 returns to the chip 10-a loading position, and the silicon interposer 10-b loading station of the second rotary disk 2 returns to the silicon interposer 10-b loading position, entering the next working cycle.

[0087] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An auxiliary device for semiconductor chip packaging, characterized in that: Includes a first rotary table (1), a second rotary table (2), at least three first loading stations (11) and an adsorption clamp (4) installed in the first loading station (11), at least three second loading stations (21) and an adsorption plate (3) installed in the second loading station (21); The first loading station (11) is set on the first rotary table (1), and the three first loading stations (11) are arranged in a circular array on the first rotary table (1); the second loading station (21) is set on the second rotary table (2), and the three second loading stations (21) are arranged in a circular array on the second rotary table (2); The first rotary disk (1) has a chip (10-a) loading station, a bonding station (NM) and a composition unloading station (N2) defined sequentially on its circumference; the second rotary disk (2) has a silicon interposer (10-b) loading station, a silicon interposer (10-b) pre-processing station and a bonding station (NM) defined sequentially on its circumference. The adsorption clamp (4) on the first loading station (11) is used to carry the chip (10-a) at the chip (10-a) loading station and rotates clockwise with the first rotary table (1); the adsorption disk (3) on the second loading station (21) is used to carry the silicon interposer (10-b) at the silicon interposer (10-b) loading station and rotates counterclockwise with the second rotary table (2); When the adsorption disk (3) carrying the silicon interposer (10-b) rotates 120° counterclockwise from the silicon interposer (10-b) pre-processing station to the bonding station (NM), it axially aligns with the chip (10-a) carried by the adsorption clamp (4) that has rotated 120° clockwise from the chip (10-a) loading station to the bonding station (NM); the adsorption disk (3) is configured to be liftable at the bonding station (NM) to press the silicon interposer (10-b) and the chip (10-a) together.

2. The auxiliary device for semiconductor chip packaging according to claim 1, characterized in that: The first rotary disk (1) has at least three first clearance grooves (12) corresponding to the adsorption clamp (4) for accommodating the air tube connected to the adsorption clamp (4); the second rotary disk (2) has at least three second clearance grooves (22) corresponding to the adsorption disk (3) for accommodating the air tube connected to the adsorption disk (3).

3. The auxiliary device for semiconductor chip packaging according to claim 1, characterized in that: At least three shrink covers (23) are fixed to the bottom of the second rotating disk (2), and the adsorption disk (3) is axially slidably connected inside the shrink cover (23); the shrink cover (23) is provided with a connecting part that engages with the adsorption disk (3).

4. The auxiliary device for semiconductor chip packaging according to claim 1, characterized in that: The suction cup (3) includes a suction cup (31), a connecting shaft (32), a clamping arm (34), a limiting rod (35), and a sliding contact part (36); the suction cup (31) is fixedly connected to the top of the connecting shaft (32), the connecting shaft (32) has a movable groove (33) inside, the clamping arm (34) is rotatably connected in the movable groove (33) and is engaged with the connecting part; the limiting rod (35) is axially slidably connected in the connecting shaft (32) and is hinged to the clamping arm (34) through a hinge arm; the sliding contact part (36) is fixedly connected to the bottom of the limiting rod (35); A first spring (24) is provided between the suction cup (31) and the shrink cover (23) to provide elastic force to drive the suction cup (31) to move upward; when the limiting rod (35) moves upward, the hinge arm drives the locking arm (34) to retract into the movable groove (33), so that the suction cup (3) is disengaged from the connecting part and lifted.

5. The auxiliary device for semiconductor chip packaging according to claim 4, characterized in that: A second spring (37) is also sleeved on the limiting rod (35). The two ends of the second spring (37) are fixed to the side wall of the movable groove (33) and the middle part of the limiting rod (35) to provide elastic force to drive the limiting rod (35) to slide downward.

6. The auxiliary device for semiconductor chip packaging according to claim 1, characterized in that: The bottom of the first rotary disk (1) is provided with a first base plate (6), and the bottom of the second rotary disk (2) is provided with a second base plate (7). The first base plate (6) and the second base plate (7) are arranged alternately. DD motors (9) are fixedly connected to the first base plate (6) and the second base plate (7), and the two DD motors (9) are respectively used to drive the first rotary disk (1) to rotate clockwise and the second rotary disk (2) to rotate counterclockwise.

7. The auxiliary device for semiconductor chip packaging according to claim 5, characterized in that: The second rotary disk (2) is fixed with a lifting part (8). When the second rotary disk (2) rotates counterclockwise to the bonding position (NM), the sliding abutment part (36) contacts the lifting part (8) and is lifted up. The clamping arm (34) is driven to retract by the limiting rod (35) and the hinge arm, so that the adsorption disk (3) is separated from the connecting part and lifted upward under the action of the first spring (24).

8. The auxiliary device for semiconductor chip packaging according to claim 1, characterized in that: The bottom of the first rotary disk (1) is also provided with a feeding module (5), and an arc plate (13) is fixed to the bottom of the first rotary disk (1). When the first rotary disk (1) rotates clockwise to the feeding station (N2), the arc plate (13) contacts the feeding module (5) and drives the feeding module (5) to radially push out the chip-silicon interposer composition (10) released by the adsorption clamp (4) in the feeding module (5).

9. An auxiliary device for semiconductor chip packaging according to claim 8, characterized in that: The feeding module (5) includes a feeding tray (51), a push plate (59), a fixing frame (58), a fixing plate (57), and a connecting rod (53); the fixing plate (57) is fixedly connected to the first base plate (6), and the feeding tray (51) is connected to the fixing plate (57) via the fixing frame (58); the push plate (59) is slidably connected to the feeding tray (51), and the connecting rod (53) is fixedly connected to one side of the push plate (59); when the arc plate (13) contacts and pushes the connecting rod (53), it drives the push plate (59) to slide and push out the chip-silicon interposer composition (10); A partition plate (52) is fixedly connected to the feeding tray (51), and the push plate (59) is slidably engaged with the partition plate (52). A limiting plate (54) is also slidably connected to the feeding tray (51). A sliding rod (55) that passes through the partition plate (52) is fixedly connected to the side of the limiting plate (54) facing the push plate (59). A third spring (56) for providing the restoring force of the limiting plate (54) is sleeved on the sliding rod (55).

10. An auxiliary method for semiconductor chip packaging, using the auxiliary device according to any one of claims 1-9, characterized in that: Includes the following steps: S1: Load the chip (10-a) onto the adsorption clamp (4) of the first rotary table (1) at the chip (10-a) loading station, and load the silicon interposer (10-b) onto the adsorption plate (3) of the second rotary table (2) at the silicon interposer (10-b) loading station. S2: Start the DD motor (9), drive the first disc (1) to rotate clockwise intermittently according to the set rhythm and drive the second disc (2) to rotate counterclockwise intermittently according to the set rhythm, and the rotation rhythm is synchronized with the first disc (1); S3: When the adsorption clamp (4) carrying the chip (10-a) rotates 120° clockwise with the first rotary disk (1) to reach the bonding station (NM), and at the same time, the adsorption disk (3) carrying the silicon interposer (10-b) rotates 120° counterclockwise with the second rotary disk (2) to reach the same bonding station (NM), the first rotary disk (1) and the second rotary disk (2) stop rotating, and the chip (10-a) and the silicon interposer (10-b) are axially aligned at the bonding station (NM); The sliding contact part (36) of the adsorption disk (3) comes into contact with the lifting part (8) and is lifted up, so that the adsorption disk (3) is separated from the connecting part and lifted upward under the elastic force of the first spring (24), pressing the silicon interposer (10-b) against the chip (10-a) to complete the pre-bonding of the two. S4: The pre-bonded chip-silicon interposer composition (10) continues to rotate clockwise with the first rotary table (1) to the unloading station (N2), releasing the chip-silicon interposer composition (10) into the unloading tray (51). Then, the first rotary table (1) is controlled to rotate clockwise, and the arc plate (13) at the bottom of the first rotary table (1) contacts and pushes the connecting rod (53) of the unloading module (5), so that the push plate (59) pushes out the chip-silicon interposer composition (10) released on the unloading tray (51).

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