Heat sink and its heat dissipation method, display device and its heat dissipation method

Abstract

A heat sink and its heat dissipation method, and a display device and its heat dissipation method are disclosed. The heat sink includes a diaphragm layer, a support layer, and a driving structure. The support layer and the driving structure are located on opposite sides of the diaphragm layer and are respectively connected to the diaphragm layer. The orthographic projection of the support layer on the diaphragm layer is annular. A heat source component is disposed on the side of the support layer away from the diaphragm layer, and a cavity can be formed between the support layer, the heat source component, and the diaphragm layer. The orthographic projection of the driving structure on the diaphragm layer is located within the orthographic projection area of ​​the cavity on the diaphragm layer. The driving structure is used to drive the diaphragm layer to vibrate in directions away from and towards the heat source component. A first opening is provided in the diaphragm layer. The first opening is located within the orthographic projection area of ​​the cavity on the diaphragm layer, and the first opening does not overlap with the orthographic projection of the driving structure on the diaphragm layer.

Description

Heat dissipation member and heat dissipation method thereof, display device and heat dissipation method thereof TECHNICAL FIELD

[0001] The embodiments of the present disclosure belong to the technical field of heat dissipation, and particularly relate to a heat dissipation member and a heat dissipation method thereof, and a display device and a heat dissipation method thereof. BACKGROUND

[0002] Synthetic jet has made great progress in the field of active flow control and fluid transmission due to its superior characteristics such as no pipeline and no rotating parts, such as flow separation control, aerodynamic force control, jet vector control, mixing enhancement control, micro-pump, etc. In particular, the periodic blowing / suction and vortex structure enhanced convection mass transfer characteristics have very broad prospects in the field of heat and mass transfer enhancement.

[0003] SUMMARY

[0004] In a first aspect, the present disclosure provides a heat dissipation member, comprising a diaphragm layer, a support layer and a driving structure,

[0005] The support layer and the driving structure are respectively located on opposite sides of the diaphragm layer and are respectively connected with the diaphragm layer.

[0006] The support layer has a ring-shaped orthographic projection shape on the diaphragm layer, and a side of the support layer away from the diaphragm layer is used for arranging a heat source member, and a cavity can be formed among the support layer, the heat source member and the diaphragm layer.

[0007] The orthographic projection of the driving structure on the diaphragm layer is located in the orthographic projection area of the cavity on the diaphragm layer, and the driving structure is used for driving the diaphragm layer to vibrate in a direction away from and close to the heat source member.

[0008] The diaphragm layer is provided with a first opening, the first opening is located in the orthographic projection area of the cavity on the diaphragm layer, and the first opening and the orthographic projection of the driving structure on the diaphragm layer are not overlapped.

[0009] In some embodiments, the orthographic projection of the driving structure on the diaphragm layer has a ring shape,

[0010] The number of the first openings is at least one.

[0011] At least part of the first openings are located in a ring-shaped area surrounded by the orthographic projection of the driving structure on the diaphragm layer.

[0012] In some embodiments, at least part of the first openings are located outside the ring-shaped area surrounded by the orthographic projection of the driving structure on the diaphragm layer.

[0013] In some embodiments, a positive projection of the driving structure on the diaphragm layer covers a central region of the diaphragm layer;

[0014] The number of the first openings is at least one;

[0015] The first openings are located at a periphery of a positive projection of the driving structure on the diaphragm layer.

[0016] In some embodiments, a center of an annular region enclosed by a positive projection of the driving structure on the diaphragm layer coincides with a center of a positive projection of the cavity on the diaphragm layer;

[0017] The first openings are uniformly distributed within an annular region enclosed by a positive projection of the driving structure on the diaphragm layer.

[0018] In some embodiments, the first openings are uniformly distributed at a periphery of a positive projection of the driving structure on the diaphragm layer.

[0019] In some embodiments, further comprising a bottom plate located at a side of the support layer facing away from the diaphragm layer and connected with the support layer,

[0020] The bottom plate, the support layer and the diaphragm layer enclose the cavity;

[0021] A side surface of the bottom plate facing away from the support layer is used to contact with the heat source member.

[0022] In some embodiments, a side surface of the bottom plate close to the support layer is distributed with a plurality of first micro-groove structures;

[0023] And / or, a side surface of the bottom plate facing away from the support layer is distributed with a plurality of the first micro-groove structures;

[0024] The plurality of first micro-groove structures are distributed at intervals;

[0025] The bottom plate is adapted to the shape of the surface of the heat source member in contact.

[0026] In some embodiments, a plurality of second openings are provided in the support layer, and the plurality of second openings are uniformly distributed in the support layer;

[0027] The second openings extend from inside the cavity to outside the cavity, and the second openings pass through the inside of the cavity and the outside of the cavity.

[0028] In some embodiments, in a direction from the inside of the cavity to the outside of the cavity, the caliber of the second openings gradually increases.

[0029] In some embodiments, the driving structure comprises a first electrode, a piezoelectric material layer and a second electrode,

[0030] The first electrode, the piezoelectric material layer and the second electrode are stacked in sequence in a direction away from the diaphragm layer, and the orthographic projections of the first electrode, the piezoelectric material layer and the second electrode on the diaphragm layer at least partially overlap.

[0031] In some embodiments, the driving structure further comprises a substrate between the first electrode and the piezoelectric material layer, and the orthographic projections of the substrate and the piezoelectric material layer on the diaphragm layer overlap.

[0032] In some embodiments, the material of the diaphragm layer comprises a metal material.

[0033] The diaphragm layer is multiplexed as the first electrode.

[0034] In some embodiments, the material of the diaphragm layer comprises a flexible insulating material.

[0035] The flexible insulating material comprises polyimide, polyethylene terephthalate or polycarbonate.

[0036] In some embodiments, the material of the substrate comprises a metal material or a ceramic material.

[0037] The material of the piezoelectric material layer comprises lead zirconate titanate or aluminum nitride.

[0038] In some embodiments, the thickness of the diaphragm layer ranges from 10 to 500 μm.

[0039] The thickness of the piezoelectric material layer ranges from 10 to 500 μm.

[0040] The thickness of the substrate ranges from 10 to 500 μm.

[0041] In some embodiments, the orthographic projection shape of the support layer on the diaphragm layer comprises a circular ring, a rectangular ring or a regular polygonal ring.

[0042] In a second aspect, the embodiments of the present disclosure provide a display device, comprising a heat source member, and further comprising the heat dissipation member.

[0043] The heat dissipation member is arranged on the heat generating surface of the heat source member.

[0044] In some embodiments, the first opening in the diaphragm layer of the heat dissipation member faces and communicates with the external environment.

[0045] In some embodiments, the number of the heat dissipation members is multiple.

[0046] The multiple heat dissipation members are arranged in an array, and the multiple heat dissipation members cover at least part of the heat generating surface of the heat source member.

[0047] In some embodiments, the heat-emitting surface of the heat source member is provided with a plurality of second micro-groove structures,

[0048] The plurality of second micro-groove structures are distributed at intervals.

[0049] In a third aspect, the embodiments of the present disclosure further provide a heat dissipation method of a heat dissipation member, wherein the heat dissipation member comprises a diaphragm layer, a support layer and a driving structure,

[0050] The support layer and the driving structure are respectively located on opposite sides of the diaphragm layer and are respectively connected with the diaphragm layer;

[0051] The support layer is provided with a heat source member on a side thereof away from the diaphragm layer, and the support layer, the heat source member and the diaphragm layer can surround a cavity.

[0052] The driving structure is projected on the diaphragm layer within a projection area of the cavity on the diaphragm layer, and the driving structure is used to drive the diaphragm layer to vibrate towards a direction away from or close to the heat source member;

[0053] A first opening is formed in the diaphragm layer, the first opening is located within the projection area of the cavity on the diaphragm layer, and the first opening does not overlap with the projection of the driving structure on the diaphragm layer;

[0054] The heat dissipation method comprises: when the driving structure drives the diaphragm layer to vibrate towards the direction close to the heat source member, the diaphragm layer compresses air in the cavity, and the air in the cavity forms a jet outflow through the first opening to outside of the cavity; the jet outflow forms a vortex around the first opening, and the vortex maintains the speed of the jet outflow;

[0055] When the driving structure drives the diaphragm layer to vibrate towards the direction away from the heat source member, the diaphragm layer deforms towards the direction away from the heat source member, and the cavity inhales air outside the vortex around the first opening.

[0056] In some embodiments, the diaphragm layer vibrates to reach a resonance frequency higher than 20 KHz.

[0057] In a fourth aspect, the embodiments of the present disclosure further provide a heat dissipation method of a display device, wherein the display device comprises a heat source member, and further comprises the heat dissipation member described above,

[0058] The heat dissipation member is arranged on a heat-emitting surface of the heat source member;

[0059] The heat dissipation method comprises: detecting a temperature value of the heat source member in real time;

[0060] determining whether the temperature value exceeds a set temperature;

[0061] if yes, turning on a set number of the heat dissipation pieces;

[0062] real-time detecting whether the heat dissipation pieces reach an optimal resonance state;

[0063] if no, adjusting an input frequency of the heat dissipation pieces, so that the heat dissipation pieces reach the optimal resonance state.

[0064] In some embodiments, further comprising: real-time detecting whether the heat source piece reaches a required temperature value;

[0065] if yes, keeping part of the heat dissipation pieces turned on and turning off part of the heat dissipation pieces.

[0066] The heat dissipation piece provided by the embodiment of the present disclosure, by opening the first opening in the diaphragm layer, in the process of cavity blowing and sucking air caused by diaphragm layer vibration, the cold air sucked into the cavity can directly contact the heat generating surface of the heat source piece and exchange heat, thereby reducing the thermal resistance and improving the heat dissipation efficiency of the heat source piece; at the same time, compared with the piezoelectric jet fan in the related art, the distance for the piezoelectric jet fan to directly blow the heat source piece does not need to be reserved, so that the thickness of the heat dissipation piece can be reduced as a whole, the volume of the heat dissipation piece is reduced, and then it is more conducive to integrating the heat dissipation piece into the heat source piece, thereby expanding the application scenarios of the heat dissipation piece.

[0067] The display device provided by the embodiment of the present disclosure improves the heat dissipation efficiency of the heat source piece in the display device by using the above heat dissipation piece; and because the volume of the heat dissipation piece is small, the heat dissipation distance does not need to be reserved, so the heat dissipation piece can be directly integrated into the surface of the heat source piece in the display device, without increasing the volume of the display device, and the display device can also ensure the appearance in the case of ensuring the efficient heat dissipation of the heat source piece in the display device. BRIEF DESCRIPTION OF DRAWINGS

[0068] The accompanying drawings are included to provide a further understanding of the embodiments of the present disclosure, and constitute a part of the specification, which are used to explain the present disclosure together with the embodiments of the present disclosure, and do not constitute a limitation of the present disclosure. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of the specific example embodiments with reference to the accompanying drawings, in which:

[0069] FIG. 1a is a structural top view of a heat dissipation piece in an embodiment of the present disclosure.

[0070] FIG. 1b is a structural cross-sectional view along the AA' section line in FIG. 1a.

[0071] FIG. 1c is a structural top view of another heat dissipation piece in an embodiment of the present disclosure.

[0072] Fig. 1d is a structural sectional view along the section line BB' in Fig. 1c.

[0073] Fig. 1e is a structural top view of still another heat dissipating member in the embodiments of the present disclosure.

[0074] Fig. 1f is a structural sectional view along the section line CC' in Fig. 1e.

[0075] Fig. 1g is a structural top view of yet another heat dissipating member in the embodiments of the present disclosure.

[0076] Fig. 1h is a structural sectional view along the section line DD' in Fig. 1g.

[0077] Fig. 1i is another structural sectional view along the section line AA' in Fig. 1a.

[0078] Fig. 1j is still another structural sectional view along the section line AA' in Fig. 1a.

[0079] Fig. 1k is yet another structural sectional view along the section line AA' in Fig. 1a.

[0080] Fig. 1l is still another structural sectional view along the section line AA' in Fig. 1a.

[0081] Fig. 2a is a schematic view of air flow around a heat dissipating member when air is discharged through a first opening in the embodiments of the present disclosure.

[0082] Fig. 2b is a schematic view of air flow around a heat dissipating member when air is drawn through a first opening in the embodiments of the present disclosure.

[0083] Fig. 3a is a structural top view of still another heat dissipating member in the embodiments of the present disclosure.

[0084] Fig. 3b is a structural sectional view along the section line EE' in Fig. 3a.

[0085] Fig. 4 is a structural top view of yet another heat dissipating member in the embodiments of the present disclosure.

[0086] Fig. 5 is a diagram of distribution of resonant frequency when a diaphragm layer is made of flexible insulating material in the embodiments of the present disclosure.

[0087] Fig. 6a is a top view of one arrangement of a heat dissipating member in the embodiments of the present disclosure.

[0088] Fig. 6b is a top view of another arrangement of a heat dissipating member in the embodiments of the present disclosure.

[0089] Fig. 6c is a schematic view of a heat dissipating member provided in the embodiments of the present disclosure attached to a surface of a notebook keyboard.

[0090] Fig. 6d is a schematic view of a heat dissipating member provided in the embodiments of the present disclosure attached to a surface of a notebook keyboard.

[0091] Figure 7 is a cross-sectional view of the heat sink disposed on the surface of the heat source component in an embodiment of this disclosure. Detailed Implementation

[0092] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the following describes in further detail a heat sink and its heat dissipation method, and a display device and its heat dissipation method provided in the embodiments of this disclosure, in conjunction with the accompanying drawings and specific implementation methods.

[0093] Embodiments of this disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms and should not be construed as limited to the embodiments set forth in this disclosure. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this disclosure.

[0094] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas, but are not intended to be limiting.

[0095] As the performance of electronic products gradually improves, so does their power consumption, which involves improvements in computing power and display quality. A related issue is heat dissipation, as most energy is ultimately dissipated as heat. However, since the size of electronic products cannot be increased, with a fixed heat dissipation area, removing more heat can only be achieved through the heat transfer coefficient or by increasing the temperature difference within the product itself. Increasing the temperature difference, however, leads to an increase in the product's own temperature, which severely impacts its lifespan. Therefore, improving the heat transfer coefficient has become the primary convection cooling solution.

[0096] In related technologies, many electronic products still rely primarily on natural convection heat transfer for heat dissipation. However, natural convection heat transfer has very low efficiency, removing only a limited amount of heat. Mainstream natural convection heat transfer solutions, such as air cooling, dissipate heat by adding fans. However, in many cases, such as mobile phones or televisions, conventional fans are too thick and noisy, making them unsuitable for integration into ultra-thin products, thus preventing the use of fans for heat dissipation.

[0097] There is an urgent need for an ultra-thin and quiet heat dissipation device. Piezoelectric jet fans in related technologies all use a direct-blowing method to dissipate heat from the device surface. However, this direct-blowing method requires a sufficient distance to form the jet, which is difficult to achieve for most electronic products, hindering the widespread application of piezoelectric jet fans.

[0098] To solve the above problems in the related art, in a first aspect, the present disclosure provides a heat dissipation device, referring to FIG. 1a and FIG. 1b, FIG. 1a is a schematic view of the structure of a heat dissipation device in an embodiment of the present disclosure; FIG. 1b is a structural cross-sectional view along the AA' section line in FIG. 1a; wherein the heat dissipation device comprises a diaphragm layer 1, a support layer 2 and a driving structure 3, the support layer 2 and the driving structure 3 are respectively located on the opposite sides of the diaphragm layer 1 and are respectively connected with the diaphragm layer 1; the support layer 2 is projected on the diaphragm layer 1 in a ring shape, and the side of the support layer 2 away from the diaphragm layer 1 is used to set a heat source 4, and the support layer 2, the heat source 4 and the diaphragm layer 1 can form a cavity 5; the driving structure 3 is projected on the diaphragm layer 1 in the projection area of the cavity 5 on the diaphragm layer 1, and the driving structure 3 is used to drive the diaphragm layer 1 to vibrate in the direction away from and close to the heat source 4; a first opening 10 is formed in the diaphragm layer 1, the first opening 10 is located in the projection area of the cavity 5 on the diaphragm layer 1, and the first opening 10 does not overlap with the projection of the driving structure 3 on the diaphragm layer 1.

[0099] Wherein, referring to FIG. 2a and FIG. 2b, FIG. 2a is a schematic view of the air flow around the heat dissipation device when the first opening exhausts; FIG. 2b is a schematic view of the air flow around the heat dissipation device when the first opening inhales; when the driving structure 3 drives the diaphragm layer 1 to vibrate in the direction close to the heat source 4, the diaphragm layer 1 compresses the air in the cavity 5 (the hot air after heat exchange with the heat source 4), and the air in the cavity 5 forms a high-pressure jet flow out of the cavity 5 through the first opening 10; due to the fast exhaust speed, the jet flow forms a vortex around the first opening 10, and the vortex maintains the speed of the jet flow; when the driving structure 3 drives the diaphragm layer 1 to vibrate in the direction away from the heat source 4, the diaphragm layer 1 deforms in the direction away from the heat source 4, and the cavity 5 inhales, inhaling the air (cold air outside) around the vortex of the first opening 10, that is, the vortex keeps the part of the air (hot air) previously exhausted at a certain speed from being sucked back, while the air (cold air) on both sides of the first opening 10 is sucked into the cavity 5; such circulation, the heat dissipation device realizes the inhaling of the cold air outside the cavity 5 and the blowing of the hot air in the cavity 5 and the heat source 4 after heat exchange, thereby realizing the heat dissipation of the heat source 4.

[0100] In this embodiment, by forming the first opening 10 in the diaphragm layer 1, during the vibration of the diaphragm layer 1 for the cavity 5 to blow and inhale, the cold air sucked into the cavity 5 can directly contact and exchange heat with the heating surface of the heat source 4, thereby reducing the thermal resistance and improving the heat dissipation efficiency of the heat source 4; at the same time, compared with the piezoelectric jet fan in the related art, there is no need to reserve the distance between the piezoelectric jet fan and the heat source 4, thereby the thickness of the heat dissipation device can be reduced as a whole, the volume of the heat dissipation device is reduced, and the heat dissipation device is more conducive to being integrated into the heat source 4, thereby expanding the application scenarios of the heat dissipation device.

[0101] In some embodiments, the shape of the orthographic projection of the driving structure 3 on the diaphragm layer 1 is a ring, and the number of the first openings 10 is at least one; at least part of the first openings 10 is located within the ring-shaped region enclosed by the orthographic projection of the driving structure 3 on the diaphragm layer 1.

[0102] In some embodiments, referring to FIG. 1a and FIG. 1b, the number of the first openings 10 is one.

[0103] In some embodiments, referring to FIG. 1a and FIG. 1b, the center O of the ring-shaped region enclosed by the orthographic projection of the driving structure 3 on the diaphragm layer 1 coincides with the center O' of the orthographic projection of the cavity 5 on the diaphragm layer 1; the center P of the first opening 10 coincides with the center O of the ring-shaped region enclosed by the orthographic projection of the driving structure 3 on the diaphragm layer 1.

[0104] In some embodiments, referring to FIG. 1c and FIG. 1d, FIG. 1c is a top view of another structure of the heat dissipation member in the embodiments of the present disclosure; FIG. 1d is a sectional view along the BB' section line in FIG. 1c; the number of the first openings 10 is multiple.

[0105] In some embodiments, referring to FIG. 1c, the center O of the ring-shaped region enclosed by the orthographic projection of the driving structure 3 on the diaphragm layer 1 coincides with the center O' of the orthographic projection of the cavity 5 on the diaphragm layer 1; the first openings 10 are uniformly distributed within the ring-shaped region enclosed by the orthographic projection of the driving structure 3 on the diaphragm layer 1.

[0106] In some embodiments, referring to FIG. 1e and FIG. 1f, FIG. 1e is a top view of still another structure of the heat dissipation member in the embodiments of the present disclosure; FIG. 1f is a sectional view along the CC' section line in FIG. 1e; the orthographic projection of the driving structure 3 on the diaphragm layer 1 covers the central region of the diaphragm layer 1; the number of the first openings 10 is at least one; the first openings 10 are located at the periphery of the orthographic projection of the driving structure 3 on the diaphragm layer 1.

[0107] In some embodiments, the central region of the diaphragm layer 1 refers to the center of the diaphragm layer 1 and the region surrounding the center and not overlapping with the support layer 2. The orthographic projection of the central region of the diaphragm layer 1 on the heat source member 4 is located within the orthographic projection region of the cavity 5 on the heat source member 4.

[0108] In some embodiments, referring to FIG. 1e and FIG. 1f, the number of the first openings 10 is multiple, and the first openings 10 are uniformly distributed at the periphery of the orthographic projection of the driving structure 3 on the diaphragm layer 1.

[0109] In some embodiments, referring to FIG. 1g and FIG. 1h, FIG. 1g is a top view of another structure of the heat dissipation member in the embodiments of the present disclosure; and FIG. 1h is a sectional view along the DD' section line in FIG. 1g; the number of the first openings 10 is multiple; based on the structure of the heat dissipation member in FIG. 1a and FIG. 1b, at least part of the first openings 10 are located outside the annular region formed by the orthographic projection of the driving structure 3 on the diaphragm layer 1, and the first openings 10 are uniformly distributed on the periphery of the orthographic projection of the driving structure 3 on the diaphragm layer 1.

[0110] In some embodiments, referring to FIG. 1i, which is another sectional view along the AA' section line in FIG. 1a; the heat dissipation member further comprises a bottom plate 6 located on the side of the support layer 2 away from the diaphragm layer 1 and connected with the support layer 2, and the bottom plate 6, the support layer 2 and the diaphragm layer 1 form the cavity 5; the surface of the side of the bottom plate 6 away from the support layer 2 is used to contact with the heat source member 4.

[0111] In some embodiments, the bottom plate 6 can be made of a material with good heat conduction performance, such as a metal material, so as to facilitate the dissipation of the heat on the surface of the heat source member 4 through the blowing and suction air of the cavity 5.

[0112] In some embodiments, the bottom plate 6 and the heat source member 4 are pasted together through a heat-conducting adhesive, so as to facilitate the dissipation of the heat on the surface of the heat source member 4 through the blowing and suction air of the cavity 5.

[0113] In some embodiments, referring to FIG. 1j, which is another sectional view along the AA' section line in FIG. 1a; and FIG. 1k, which is another sectional view along the AA' section line in FIG. 1a; the surface of the side of the bottom plate 6 close to the support layer 2 is distributed with a plurality of first micro-groove structures 60; and / or, the surface of the side of the bottom plate 6 away from the support layer 2 is distributed with a plurality of first micro-groove structures 60; the plurality of first micro-groove structures 60 are distributed at intervals; and the surface of the bottom plate 6 in contact with the heat source member 4 is adapted to the shape of the surface of the heat source member 4.

[0114] In some embodiments, the surface of the bottom plate 6 in contact with the heat source member 4 is adapted to the shape of the surface of the heat source member 4, that is, the surface of the heat source member 4 in contact with the bottom plate 6 is provided with a plurality of first micro-protrusion structures 40, the first micro-protrusion structures 40 are located in the first micro-groove structures 60, and the first micro-protrusion structures 40 and the first micro-groove structures 60 are matched in size and complementary in shape.

[0115] The first micro-groove structures 60 can increase the area of the surface of the side of the bottom plate 6 close to the support layer 2, thereby increasing the heat dissipation area of the bottom plate 6, and further facilitating the dissipation of the heat on the surface of the heat source member 4 through the blowing and suction air of the cavity 5; and the first micro-groove structures 60 can increase the area of the surface of the side of the bottom plate 6 away from the support layer 2, thereby increasing the contact area of the bottom plate 6 with the heat source member 4, and further facilitating the dissipation of the heat on the surface of the heat source member 4 through the blowing and suction air of the cavity 5.

[0116] In some embodiments, the first micro-groove structure 60 is obtained by roughening the surface of the bottom plate 6, which includes preparing a microstructure on the surface of the bottom plate 6 by using a patterning process, roughening the surface of the bottom plate 6 by sandblasting, or opening a micro-channel on the surface of the bottom plate 6. The first micro-protrusion structure 40 on the surface of the heat source 4 is also obtained by the roughening methods described above.

[0117] In some embodiments, referring to FIG. 3a and FIG. 3b, FIG. 3a is a top view of another structure of a heat dissipation member according to an embodiment of the present disclosure, and FIG. 3b is a sectional view along the EE' cutting line in FIG. 3a. A plurality of second openings 20 are opened in the support layer 2, and the plurality of second openings 20 are uniformly distributed in the support layer 2. The second openings 20 extend from the inside of the cavity 5 to the outside of the cavity 5, and the second openings 20 make the inside of the cavity 5 and the outside of the cavity 5 communicate.

[0118] In some embodiments, the caliber of the second opening 20 gradually increases in the direction from the inside of the cavity 5 to the outside of the cavity 5.

[0119] In some embodiments, by opening a plurality of second openings 20 with narrow inside (the caliber of the second opening 20 near the inside of the cavity 5 is smaller) and wide outside (the caliber of the second opening 20 near the outside of the cavity 5 is larger) in the support layer 2, when the inside of the cavity 5 is under low pressure, air from the outside can not only enter the inside of the cavity 5 from the first opening 10, but also enter the inside of the cavity 5 from the second opening 20, so that the upper layer of gas far from the heat source 4 entering from the first opening 10 and the lower layer of gas close to the heat source 4 entering from the second opening 20 can be fully mixed, and then the air close to the heat source 4 can transmit heat to the first opening 10 and the second opening 20 more quickly, improving the heat dissipation efficiency and enhancing the heat dissipation effect of the heat source 4. In addition, since the second opening 20 adopts the form of narrow inside and wide outside, the flow resistance of air flowing into the cavity 5 and flowing out of the cavity 5 is different, so even when the inside of the cavity 5 is under high pressure, there will be no serious air leakage.

[0120] In some embodiments, referring to FIG. 1a-FIG. 1k, FIG. 2a-FIG. 2b, and FIG. 3a-FIG. 3b, the driving structure 3 includes a first electrode 31, a piezoelectric material layer 32, and a second electrode 33, which are sequentially stacked in the direction away from the diaphragm layer 1, and the orthographic projections of the first electrode 31, the piezoelectric material layer 32, and the second electrode 33 on the diaphragm layer 1 at least partially overlap.

[0121] The driving principle of the driving structure 3 driving the diaphragm layer 1 to vibrate in the direction away from and close to the heat source 4 is as follows: based on the piezoelectric effect, when the piezoelectric material layer 32 is subjected to pressure, a voltage will appear between the two end surfaces thereof; when an alternating current is applied to the first electrode 31 and the second electrode 33, due to the inverse piezoelectric effect, the alternating voltage on the first electrode 31 and the second electrode 33 causes the piezoelectric material layer 32 to vibrate mechanically, which in turn generates an alternating voltage on the first electrode 31 and the second electrode 33, thereby affecting the alternating current in the circuit. In the embodiment, the piezoelectric material layer 32 is polarized at the two end surfaces thereof during the vibration process, the polarization direction of the piezoelectric material layer 32 is parallel to the direction of the electric field formed between the first electrode 31 and the second electrode 33, so that the piezoelectric material layer 32 is subjected to the expansion and contraction vibration under the action of the alternating voltage of the first electrode 31 and the second electrode 33, and further drives the diaphragm layer 1 to vibrate in the direction away from and close to the heat source 4.

[0122] In some embodiments, the first electrode 31 and the second electrode 33 are made of conductive metal materials, such as silver, copper and the like. The first electrode 31 and the second electrode 33 can be prepared by plating or patterning process. The first electrode 31 and the second electrode 33 can be electrically connected by means of conductive glue between the piezoelectric material layer 32 and the second electrode 33. The thickness of the first electrode 31 and the second electrode 33 cannot be too large, otherwise it will affect the vibration characteristics of the diaphragm layer 1.

[0123] In some embodiments, referring to FIGS. 1a-1k, 2a-2b and 3a-3b, the driving structure 3 further comprises a substrate 30 located between the first electrode 31 and the piezoelectric material layer 32, and the normal projections of the substrate 30 and the piezoelectric material layer 32 on the diaphragm layer 1 overlap.

[0124] In some embodiments, the material of the substrate 30 includes metal materials or ceramic materials; the metal materials are stainless steel and the like; and the material of the piezoelectric material layer 32 includes lead zirconate titanate or aluminum nitride.

[0125] The substrate 30 is made of high-hardness material, which can enhance the strength of the piezoelectric material layer 32 and avoid the piezoelectric material layer 32 from being broken during the vibration process.

[0126] In some embodiments, referring to FIG. 1l, which is another structural cross-sectional view along the AA' section line in FIG. 1a; the material of the diaphragm layer 1 includes metal materials, such as stainless steel, copper or aluminum and the like, and the diaphragm layer 1 is reused as the first electrode 31.

[0127] In some embodiments, the diaphragm layer 1 and each film layer of the driving structure 3 are integrated together by means of gluing or direct sintering and the like.

[0128] In some embodiments, referring to FIGS. 1a-1k, 2a-2b, and 3a-3b, the material of the diaphragm layer 1 comprises a flexible insulating material, which includes polyimide (PI), polyethylene terephthalate (PET), or polycarbonate (PC).

[0129] In some embodiments, the diaphragm layer 1 is made of a flexible insulating material, which has a smaller hardness. The deformation of the diaphragm layer 1 caused by the vibration of the piezoelectric material layer 32 can be further increased, and thus the vibration amplitude of the diaphragm layer 1 can be further increased. As a result, the volume change of the cavity 5 when air is blown or sucked can be increased, the air volume can be increased, and the heat dissipation efficiency of the heat dissipation device can be improved. In addition, the flexible diaphragm layer 1 can be better adhered to the support layer 2, which helps to prevent air leakage of the cavity 5. In addition, the diaphragm layer 1 cannot be reused as the first electrode 31 of the driving structure 3 because the diaphragm layer 1 is made of a flexible insulating material and needs to be provided with an electrode on the side close to the driving structure 3.

[0130] In some embodiments, the thickness of the diaphragm layer 1 ranges from 10 to 500 μm; the thickness of the piezoelectric material layer 32 ranges from 10 to 500 μm; and the thickness of the substrate 30 ranges from 10 to 500 μm.

[0131] In some embodiments, referring to FIG. 4, which is a top view of another heat dissipation device according to the present disclosure, the shape of the support layer 2 in the orthographic projection on the diaphragm layer 1 comprises a circular ring, a rectangular ring, or a regular polygonal ring.

[0132] In some embodiments, the shape of the support layer 2 in the orthographic projection on the diaphragm layer 1 can be changed to control the shape of the cavity 5, and thus the contact area between the heat-emitting surface of the heat source 4 and the cold air entering the cavity 5 can be controlled, and the heat dissipation efficiency of the heat source 4 can be controlled. In addition, the regular shape of the support layer 2, such as a rectangular ring or a regular polygonal ring, is conducive to the arrangement of multiple heat dissipation devices in an array on the surface of the heat source 4, and conducive to the complete coverage of the entire heat-emitting surface of the heat source 4 by the heat dissipation device array, thereby facilitating the uniform heat dissipation of the entire heat-emitting surface of the heat source 4.

[0133] Based on the above structure of the heat dissipation device, the present disclosure further provides a heat dissipation method of the heat dissipation device, which comprises: when the driving structure 3 drives the diaphragm layer 1 to vibrate towards the heat source 4, the diaphragm layer 1 compresses the air (hot air after heat exchange with the heat source 4) in the cavity 5, and the air in the cavity 5 forms a jet outflow at the first opening 10; the jet outflow forms a vortex around the first opening 10, and the vortex maintains the speed of the jet outflow; when the driving structure 3 drives the diaphragm layer 1 to vibrate away from the heat source 4, the diaphragm layer 1 deforms away from the heat source 4, and the cavity 5 inhales the air (cold air outside) other than the vortex around the first opening 10.

[0134] In the vortex, the part of air (hot air) previously blown out is kept at a certain speed and is not sucked back, while the air (cold air) on both sides of the first opening 10 is sucked into the cavity 5. The air blowing and air sucking cycle is repeated, and the heat dissipation member realizes the sucking of the cold air outside the cavity 5 and the blowing of the hot air after heat exchange with the heat source member 4 from the first opening 10, thereby realizing the heat dissipation of the heat source member 4.

[0135] In some embodiments, the diaphragm layer vibrates to reach a resonance frequency higher than 20 KHz. In this way, the noise generated when the driving structure and the diaphragm layer vibrate can be reduced. In some embodiments, the diaphragm layer can use a third-order or fifth-order resonance frequency point. Referring to FIG. 5, it is a resonance frequency distribution diagram when the diaphragm layer uses a flexible insulating material in the embodiment of the present disclosure.

[0136] The heat dissipation member provided in the embodiment of the present disclosure can directly contact the heat-emitting surface of the heat source member and exchange heat with the heat-emitting surface of the heat source member during the process of the vibration of the diaphragm layer and the cavity air blowing and sucking, thereby reducing the thermal resistance and improving the heat dissipation efficiency of the heat source member. At the same time, compared with the piezoelectric jet fan in the related art, the distance for the piezoelectric jet fan to directly blow the heat source member does not need to be reserved, thereby reducing the thickness of the heat dissipation member as a whole, reducing the volume of the heat dissipation member, and further facilitating the integration of the heat dissipation member into the heat source member, thereby expanding the application scenarios of the heat dissipation member.

[0137] In a second aspect, the embodiment of the present disclosure further provides a display device, which comprises a heat source member and a heat dissipation member as described in the above embodiments, and the heat dissipation member is arranged on the heat-emitting surface of the heat source member.

[0138] In some embodiments, the first opening in the diaphragm layer of the heat dissipation member faces and communicates with the external environment. In this way, the heat on the heat-emitting surface of the heat source member can be dissipated to the external environment through the first opening, thereby improving the heat dissipation effect of the heat source member.

[0139] In some embodiments, referring to FIG. 6a, it is a plan view of an arrangement of the heat dissipation member in the embodiment of the present disclosure; FIG. 6b is another plan view of the arrangement of the heat dissipation member in the embodiment of the present disclosure; the number of the heat dissipation members 7 is multiple, the multiple heat dissipation members 7 are arranged in an array, and the multiple heat dissipation members 7 cover at least part of the heat-emitting surface of the heat source member 4. In this way, the heat dissipation of the heat dissipation member 7 to part or the entire heat-emitting surface of the heat source member 4 can be realized.

[0140] In some embodiments, referring to FIGS. 6b, 6c and 6d, FIG. 6c is a top view of the heat dissipation member attached to the surface of the notebook keyboard according to an embodiment of the present disclosure; and FIG. 6d is a side view of the heat dissipation member attached to the surface of the notebook keyboard according to an embodiment of the present disclosure. The heat dissipation member can be directly attached to the surface of the rear cover of the mobile phone, the non-key position of the keyboard of the notebook computer, or other surfaces requiring heat dissipation.

[0141] In some embodiments, referring to FIGS. 6c and 6d, inside the notebook computer, the heat of the CPU (central processing unit) is conducted to the area outside the keys of the keyboard, for example, the edge area of the keyboard, by the heat pipe 8. In this embodiment, the heat dissipation member 7 is integrated into the surface of the heat pipe 8 in the form of a single-row array, and the air outlet direction of the first opening 10 in the diaphragm layer of the heat dissipation member 7 is upward and communicates with the external environment. In this way, the first opening 10 will not be blocked during use.

[0142] In some embodiments, referring to FIG. 7, it is a structure sectional view of the heat dissipation member arranged on the surface of the heat source member according to an embodiment of the present disclosure. The heat-emitting surface of the heat source member 4 is distributed with a plurality of second micro-groove structures 41, and the plurality of second micro-groove structures 41 are distributed at intervals.

[0143] Among them, the second micro-groove structure 41 can increase the heat dissipation area of the heat-emitting surface of the heat source member 4, and at the same time, the heat exchange of the heat-emitting surface of the heat source member 4 is realized by the air blowing and suction of the heat dissipation member 7, thereby improving the heat dissipation efficiency of the heat-emitting surface of the heat source member 4.

[0144] The display device provided by the embodiment of the present disclosure improves the heat dissipation efficiency of the heat source member in the display device by using the heat dissipation member in the above-mentioned embodiment. Since the heat dissipation member has a small volume and does not need to reserve a heat dissipation distance, the heat dissipation member can be directly integrated into the surface of the heat source member in the display device, without increasing the volume of the display device. In the case of ensuring the efficient heat dissipation of the heat source member in the display device, the display device can also ensure the aesthetic appearance.

[0145] Based on the above structure of the display device, the embodiment of the present disclosure further provides a heat dissipation method of the display device, which comprises: detecting the temperature value of the heat source member in real time.

[0146] Judging whether the temperature value exceeds the set temperature.

[0147] If yes, a set number of heat dissipation members are started.

[0148] Detecting whether the heat dissipation member reaches the optimal resonance state in real time.

[0149] If no, the input frequency of the heat dissipation member is adjusted to make the heat dissipation member reach the optimal resonance state.

[0150] In some embodiments, the heat dissipation method of the display device further comprises: detecting whether the heat source reaches a required temperature value in real time; if yes, keeping part of the heat dissipation devices open and closing part of the heat dissipation devices. In this way, the heat dissipation power consumption of the display device can be reduced.

[0151] For example, after the notebook computer is started, the controller controls whether to open or how many heat dissipation devices to open according to the temperature value measured by the temperature sensor of the heat generating device such as CPU (central processing unit) and the running mode (such as high performance, energy saving or mute mode) set by the user; the heat dissipation device is started at a default frequency, at this time, the built-in sensor detects whether the running condition of the heat dissipation device reaches the optimal resonance state, if not, the controller controls the input frequency of the heat dissipation device to make a small adjustment until the heat dissipation device reaches the optimal resonance state under the current working condition. At the same time, the temperature sensor detects the temperature value of the heat source in real time, if the temperature sensor detects that the temperature of the heat source reaches the required temperature value, the number of open heat dissipation devices will be balanced, such as keeping part of the heat dissipation devices open and closing part of the heat dissipation devices; so as to reduce the heat dissipation power consumption of the notebook computer as much as possible under the premise of meeting the temperature requirement.

[0152] The display device provided by the embodiments of the present disclosure can be an LCD panel, an LCD television, an LCD billboard, an OLED panel, an OLED television, an OLED billboard, an LED panel, a display, a mobile phone, a navigator or any product or component with display function.

[0153] It can be understood that the above embodiments are only exemplary embodiments adopted for illustrating the principles of the present disclosure, however, the present disclosure is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also regarded as the protection scope of the present disclosure.

Claims

1. A heat dissipating member, wherein, The diaphragm layer, the support layer and the driving structure, The support layer and the driving structure are respectively located on opposite sides of the diaphragm layer and are connected with the diaphragm layer respectively; The support layer is annular in shape in orthographic projection on the diaphragm layer, a side of the support layer facing away from the diaphragm layer is used for disposing a heat source member, and the support layer, the heat source member and the diaphragm layer can surround a cavity; The driving structure is located in the orthographic projection area of the cavity on the diaphragm layer, and the driving structure is used for driving the diaphragm layer to vibrate in the direction away from and close to the heat source member; The diaphragm layer is provided with a first opening, the first opening is located in the orthographic projection area of the cavity on the diaphragm layer, and the first opening does not overlap with the orthographic projection of the driving structure on the diaphragm layer.

2. The heat dissipating member according to claim 1, wherein The driving structure is annular in shape in orthographic projection on the diaphragm layer, The number of the first openings is at least one; At least part of the first openings is located in the annular area surrounded by the orthographic projection of the driving structure on the diaphragm layer.

3. The heat dissipating member according to claim 2, wherein At least part of the first openings is located outside the annular area surrounded by the orthographic projection of the driving structure on the diaphragm layer.

4. The heat dissipating member according to claim 1, wherein The orthographic projection of the driving structure on the diaphragm layer covers the central area of the diaphragm layer; The number of the first openings is at least one; The first openings are located in the periphery of the orthographic projection of the driving structure on the diaphragm layer.

5. The heat dissipating member according to claim 2, wherein The center of the annular area surrounded by the orthographic projection of the driving structure on the diaphragm layer coincides with the center of the orthographic projection of the cavity on the diaphragm layer; The first openings are uniformly distributed in the annular area surrounded by the orthographic projection of the driving structure on the diaphragm layer.

6. The heat dissipating member according to claim 3 or 4, wherein The first openings are uniformly distributed in the periphery of the orthographic projection of the driving structure on the diaphragm layer.

7. The heat dissipating member according to claim 1, wherein Further comprising a bottom plate located on a side of the support layer facing away from the diaphragm layer and connected with the support layer, The bottom plate, the support layer and the diaphragm layer surround to form the cavity; The surface of the side of the bottom plate facing away from the support layer is used for contacting the heat source member.

8. The heat dissipating member according to claim 7, wherein The surface of the side of the bottom plate close to the support layer is distributed with a plurality of first micro-groove structures; And / or, the surface of the side of the bottom plate facing away from the support layer is distributed with a plurality of first micro-groove structures; The plurality of first micro-groove structures are distributed at intervals; The surface shape of the bottom plate contacting the heat source member is matched.

9. The heat dissipating member according to any one of claims 1-5, 7-8, wherein, A plurality of second openings are provided in the support layer, and the plurality of second openings are uniformly distributed in the support layer; The second openings extend from the inside of the cavity to the outside of the cavity, and the second openings pass through the inside of the cavity and the outside of the cavity.

10. The heat dissipating member according to claim 9, wherein In the direction from the inside of the cavity to the outside of the cavity, the aperture of the second opening gradually increases.

11. The heat dissipating member according to any one of claims 1 to 5, 7 to 8, wherein The driving structure comprises a first electrode, a piezoelectric material layer and a second electrode, The first electrode, the piezoelectric material layer and the second electrode are sequentially stacked in the direction away from the diaphragm layer, and the orthographic projections of the first electrode, the piezoelectric material layer and the second electrode on the diaphragm layer at least partially overlap.

12. The heat dissipating member according to claim 11, wherein, The driving structure further comprises a substrate between the first electrode and the piezoelectric material layer, and the normal projection of the substrate and the piezoelectric material layer on the diaphragm layer is overlapped.

13. The heat dissipating member according to claim 12, wherein The material of the diaphragm layer comprises a metal material; The diaphragm layer is multiplexed as the first electrode.

14. The heat dissipating member according to claim 12, wherein, The material of the diaphragm layer comprises a flexible insulating material, The flexible insulating material comprises polyimide, polyethylene terephthalate or polycarbonate.

15. The heat dissipating member according to claim 12, wherein, The material of the substrate comprises a metal material or a ceramic material; The material of the piezoelectric material layer comprises lead zirconate titanate or aluminum nitride.

16. The heat dissipating member according to any one of claims 13 to 15, wherein The thickness of the diaphragm layer ranges from 10 to 500 μm; The thickness of the piezoelectric material layer ranges from 10 to 500 μm; The thickness of the substrate ranges from 10 to 500 μm.

17. The heat dissipating member according to claim 1, wherein The normal projection shape of the support layer on the diaphragm layer comprises a circular ring, a rectangular ring or a regular polygonal ring.

18. A display device, wherein, The heat dissipation member comprises a heat source member, and further comprises the heat dissipation member of any one of claims 1-17, The heat dissipation member is arranged on the heat generating surface of the heat source member.

19. The display device of claim 18, wherein, The first opening in the diaphragm layer of the heat dissipation member faces and communicates with the external environment.

20. The display device of claim 19, wherein, The number of the heat dissipation members is multiple, The multiple heat dissipation members are arranged in an array, and the multiple heat dissipation members cover at least part of the heat generating surface of the heat source member.

21. The display device of claim 18, wherein, The heat generating surface of the heat source member is distributed with multiple second micro-groove structures, The multiple second micro-groove structures are distributed at intervals.

22. A heat dissipating method of a heat dissipating member, wherein, The heat dissipation member comprises a diaphragm layer, a support layer and a driving structure, The support layer and the driving structure are respectively located on opposite sides of the diaphragm layer and are connected with the diaphragm layer respectively; The normal projection shape of the support layer on the diaphragm layer is annular, and the side of the support layer away from the diaphragm layer is used for arranging a heat source member, and a cavity can be formed among the support layer, the heat source member and the diaphragm layer; The normal projection of the driving structure on the diaphragm layer is located in the normal projection area of the cavity on the diaphragm layer, and the driving structure is used for driving the diaphragm layer to vibrate in the direction away from or close to the heat source member; A first opening is formed in the diaphragm layer, the first opening is located in the normal projection area of the cavity on the diaphragm layer, and the first opening does not overlap with the normal projection of the driving structure on the diaphragm layer; The heat dissipation method comprises: when the driving structure drives the diaphragm layer to vibrate in the direction close to the heat source member, the diaphragm layer compresses the air in the cavity, and the air in the cavity forms a jet outflow through the first opening to the outside of the cavity; the jet outflow forms a vortex around the first opening, and the vortex maintains the speed of the jet outflow; When the driving structure drives the diaphragm layer to vibrate in the direction away from the heat source member, the diaphragm layer deforms in the direction away from the heat source member, and the cavity inhales the air outside the vortex around the first opening.

23. The heat dissipation method of claim 22, wherein, The diaphragm layer vibrates to reach a resonance frequency higher than 20 KHz.

24. A method of dissipating heat from a display device, wherein, The display device comprises a heat source member, and further comprises the heat dissipation member of any one of claims 1-17, The heat dissipation member is arranged on the heat generating surface of the heat source member; The heat dissipation method comprises the following steps: detecting the temperature value of the heat source in real time; determining whether the temperature value exceeds a set temperature; if yes, starting a set number of the heat dissipation components; detecting whether the heat dissipation components reach an optimal resonance state in real time; if no, adjusting the input frequency of the heat dissipation components so that the heat dissipation components reach the optimal resonance state.

25. The heat dissipation method according to claim 24, wherein, Further comprising: detecting whether the heat source reaches a required temperature value in real time; if yes, keeping part of the heat dissipation components started and closing part of the heat dissipation components.

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