Light-emitting components, display substrates and display devices
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2024-10-30
- Publication Date
- 2026-06-02
AI Technical Summary
Existing Micro LED and Mini LED fabrication processes suffer from complexity and low efficiency, particularly in die bonding, AOI, and bonding processes where efficient device connections and circuit layouts are difficult to achieve.
Design a light-emitting component comprising multiple pixel circuits and conductive parts, and connect the light-emitting device and conductive parts in a specific arrangement, including a first pixel circuit, a second pixel circuit, and a third pixel circuit. A high-efficiency circuit layout is achieved through the cross-arranged conductive parts and signal lines, and an overlapping and staggered signal line design is used to optimize electrical connections.
It improves the fabrication efficiency of Micro LED and Mini LED, simplifies the process flow, enhances the stability and reliability of circuit connections, and reduces production costs.
Smart Images

Figure CN122139469A_ABST