Semiconductor module manufacturing apparatus and semiconductor module manufacturing method
By using a magnet to attract semiconductor components with a strong magnetic layer in a semiconductor module manufacturing apparatus and then using a punch to join them, the problem of insufficient semiconductor component bonding is solved, resulting in a more robust bonding and better functional performance.
CN122139480APending Publication Date: 2026-06-02ROHM CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ROHM CO LTD
- Filing Date
- 2024-10-23
- Publication Date
- 2026-06-02
AI Technical Summary
Technical Problem
In the prior art, the bonding of semiconductor elements is insufficient, which prevents the semiconductor device from fully realizing its function.
Method used
A semiconductor module manufacturing apparatus is used to attract the strongly magnetic layer of the semiconductor element using a magnet on a carrier, and to achieve solid-phase diffusion or calcination bonding by approaching the support and the semiconductor element from different directions through first and second punches.
Benefits of technology
This improves the bonding strength between semiconductor components and the support, ensures the stable positioning and accurate placement of semiconductor components on the carrier, and enhances the functional performance of the semiconductor module.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122139480A_ABST
Abstract
A semiconductor module manufacturing apparatus includes: a first punch; a second punch; and a carrier for holding a support on which a semiconductor element is placed. The first punch approaches the carrier from a first side in a first direction, and the second punch approaches the carrier from a second side in the first direction, thereby bonding the support and the semiconductor element. The semiconductor element is located on the second side in the first direction relative to the support and has a first strongly magnetic layer. The carrier includes a magnet portion located on the first side in the first direction relative to the support.
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