Semiconductive adhesive for cable semiconductive shielding tape and method for preparing the same

Abstract

The application discloses a semiconductive glue for a cable semiconductive shielding tape and a preparation method thereof, and relates to the technical field of semiconductive glue.The application discloses a preparation method of the semiconductive glue for the cable semiconductive shielding tape, which comprises the following steps: mixing conductive fillers, KH560 modified SiO2 loaded with Pt, a dynamic crosslinking agent and a moisture scavenger to obtain pre-dispersed materials; blending nitrile rubber, a borate ester end group modified hydroxyl-terminated liquid nitrile rubber and a solvent, dispersing the pre-dispersed materials, blending an interface modifier and an anti-aging agent component, blending self-repairing microcapsules, blending vulcanization components, and obtaining the semiconductive glue; the semiconductive glue prepared by the application has excellent conductive thermal stability, high interface adhesion, good flexibility and aging resistance, and has important significance for improving the comprehensive performance of the wrapped semiconductive shielding tape and prolonging the service life of the cable.

Description

Technical Field

[0001] This invention relates to the field of semiconductive adhesive technology, specifically to a semiconductive adhesive for cable semiconductive shielding tape and its preparation method. Background Technology

[0002] Semiconducting shielding tape is an important component of power cables, especially medium- and high-voltage cross-linked polyethylene (XLPE) insulated cables. It is widely used for shielding the outer layer of cable insulation, controlling joint stress, and homogenizing the electric field in low-voltage cables. Its main function is to eliminate gaps between the insulation layer and the metallic shielding layer, uniformly distribute the electric field, prevent partial discharge, and thus ensure the long-term safe operation of the cable. Currently, the mainstream manufacturing process for wrapped semiconducting shielding tape uses polyester woven or non-woven fabric as the base material, impregnated with semiconducting adhesive, and then dried and vulcanized. The semiconducting adhesive is usually based on nitrile rubber (NBR) or acrylic resin, with added conductive fillers such as conductive carbon black and graphite, supplemented with vulcanizing agents, coupling agents, solvents, and other components. This technical route is mature, cost-effective, and widely used in the field of low-voltage cables and cable accessories.

[0003] However, existing technologies still have several technical problems in practical applications: First, poor thermal stability. Traditional semiconductive adhesives rely on the physical contact of conductive carbon black particles to form a conductive network. During cable operation, the conductor heats up, causing the insulation layer temperature to rise (up to 90°C or even higher). The thermal expansion of the matrix resin increases the spacing between carbon black particles, breaking the conductive path. The volume resistivity rises sharply with increasing temperature, even by orders of magnitude, leading to shielding failure at high temperatures, electric field distortion, and accelerated insulation aging. Second, insufficient interfacial adhesion. Existing semiconductive adhesives rely mainly on physical adsorption with the polyester substrate and cable insulation layer (XLPE), lacking chemical bonding. During long-term operation, under the influence of thermal cycling and mechanical stress, the adhesive layer is prone to peeling from the substrate, resulting in powdering and detachment. The detached conductive powder may embed into the insulation layer surface, becoming a cause of partial discharge. Third, poor flexibility and aging resistance. Traditional nitrile rubber systems are relatively brittle after cross-linking, and microcracks are easily generated at bending points during wrapping construction, weakening the continuity of the shield. Meanwhile, the antioxidant system is singular, and the adhesive layer hardens and cracks after long-term thermal aging, shortening the cable's service life.

[0004] To address the aforementioned issues, several improvements have been proposed in existing technologies. For example, some studies have used carbon nanotubes to replace part of the carbon black, leveraging their high aspect ratio to construct a more stable conductive network, aiming to improve electrical and thermal stability. Other technologies have enhanced the interfacial bonding between inorganic fillers and the organic matrix by adding silane coupling agents or titanate coupling agents, thereby increasing the cohesive strength of the adhesive layer. Furthermore, liquid nitrile rubber or carboxyl-terminated liquid rubber has been used as a toughening component to improve the flexibility of the adhesive layer. However, these improvements still have limitations. While introducing carbon nanotubes alone can improve electrical stability, carbon nanotubes are prone to agglomeration and dispersion in the adhesive compound, and are also costly, offering limited improvement to interfacial adhesion. While using coupling agents alone can enhance filler dispersion, it cannot solve the chemical bonding problem between the matrix resin and the substrate, resulting in limited improvement in peel strength. Although using liquid rubber for toughening can improve flexibility, without synergistic interfacial chemical design, the long-term adhesion reliability between the adhesive layer and the substrate remains insufficient. More importantly, existing improvements struggle to simultaneously enhance electrical and thermal stability, interfacial adhesion, flexibility, and aging resistance, lacking a multi-performance synergistic solution. Therefore, developing a semiconductive adhesive that combines excellent electrical and thermal stability, high interfacial adhesion, good flexibility, and aging resistance is crucial for improving the overall performance of wrap-around semiconductive shielding tapes and extending cable lifespan. Summary of the Invention

[0005] The purpose of this invention is to provide a semi-conductive adhesive for cable semi-conductive shielding tape and its preparation method, thereby solving the following technical problems:

[0006] Existing semiconductive adhesives have problems such as poor electrical and thermal stability, insufficient interfacial adhesion, inadequate flexibility and aging resistance.

[0007] The objective of this invention can be achieved through the following technical solutions:

[0008] A method for preparing semiconductive adhesive for cable semiconductive shielding tape includes the following steps:

[0009] The conductive filler, Pt-loaded KH560 modified SiO2, dynamic crosslinking agent, and moisture scavenger are mixed to obtain a pre-dispersion.

[0010] Nitrile rubber, borate-terminated hydroxyl-terminated liquid nitrile rubber, and solvent are blended, and then dispersed in a pre-dispersant. Interface modifier and anti-aging agent components are blended, self-healing microcapsules are added and blended, and vulcanization components are added and blended to obtain a semi-conductive adhesive.

[0011] The conductive filler is composed of ionic liquid-modified acetylene black and polyaniline-grafted graphene microsheets with a mass ratio of 40-50:15-25.

[0012] The dynamic crosslinking agent is a polyurethane elastomer containing borate esters;

[0013] The self-healing microcapsules are self-healing monomers with polymethyl methacrylate as the wall material and dicyclopentadiene as the encapsulation material.

[0014] As a further embodiment of the present invention: the semiconductive adhesive comprises the following raw materials in parts by weight: 70-85 parts by weight of nitrile rubber, 15-25 parts by weight of borate ester-terminated modified hydroxyl-terminated liquid nitrile rubber, 180-220 parts by weight of solvent, 55-70 parts by weight of conductive filler, 3-5 parts by weight of Pt-loaded KH560 modified SiO2, 2-4 parts by weight of dynamic crosslinking agent, 1-2 parts by weight of moisture scavenger, 1-2 parts by weight of interface modifier, 1.2-1.8 parts by weight of anti-aging agent component, 1.5-3 parts by weight of self-healing microcapsules, and 3-6 parts by weight of vulcanization component.

[0015] As a further aspect of the present invention: the anti-aging agent component is composed of antioxidant 1010 and dilauryl thiodipropionate in a mass ratio of 1.5-2:1;

[0016] The interface modifier consists of KH560 and KH590 in a mass ratio of 3:1;

[0017] The vulcanizing component consists of dicumyl peroxide and triallyl isocyanurate in a mass ratio of 2-4:1-2.

[0018] The moisture scavenger is nano-calcium oxide;

[0019] The solvent consists of cyclohexanone, toluene, and propylene glycol methyl ether acetate in a mass ratio of 100-120:60-80:20-30.

[0020] As a further embodiment of the present invention, the preparation method of borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber includes the following steps: hydroxyl-terminated liquid nitrile butadiene rubber and toluene are added to a reaction vessel and dispersed, the temperature is controlled at 110-120℃, and the mixture is dehydrated and refluxed for 0.5-1h; boric acid and p-toluenesulfonic acid are added, the temperature is controlled at 110-120℃, and the reaction is maintained for 3-6h; saturated sodium bicarbonate solution is added to adjust the pH to neutral; the mixture is washed with water, the organic phase is dried with anhydrous sodium sulfate, filtered, and toluene is removed by vacuum distillation to obtain borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber;

[0021] The addition ratio of hydroxyl-terminated liquid nitrile rubber, toluene, boric acid, and p-toluenesulfonic acid is 100g: 150-250mL: 6-12g: 0.5-1.5g.

[0022] As a further embodiment of the present invention, the preparation method of ionic liquid modified acetylene black includes the following steps: acetylene black and anhydrous ethanol are added to a reaction flask for dispersion, 1-butyl-3-methylimidazolium tetrafluoroborate is added for dispersion, the temperature is controlled at 70-80℃ and the reaction is refluxed for 3-6 hours to obtain ionic liquid modified acetylene black.

[0023] The addition ratio of acetylene black, anhydrous ethanol, and 1-butyl-3-methylimidazolium tetrafluoroborate is 10g: 200-500mL: 0.5-1g.

[0024] As a further embodiment of the present invention, the preparation method of polyaniline-grafted graphene microsheets includes the following steps: graphene microsheets and 1-1.5 mol / L hydrochloric acid aqueous solution are added to a reaction flask for dispersion, KH550 is added for dispersion, the temperature is controlled at 50-60℃ and the reaction is kept at this temperature for 2-4 hours, aniline monomer is added, the temperature is controlled at 0-5℃ and the reaction is kept at this temperature for 1-2 hours, ammonium persulfate is added and the reaction is kept at this temperature for 6-9 hours, and the mixture is filtered, washed, and dried to obtain polyaniline-grafted graphene microsheets;

[0025] The addition ratio of graphene microsheets, 1-1.5 mol / L hydrochloric acid aqueous solution, KH550, aniline monomer, and ammonium persulfate is 10 g: 100-200 mL: 0.5-1 g: 5-8 g: 10-16 g.

[0026] As a further embodiment of the present invention, the preparation method of Pt-loaded KH560 modified SiO2 includes the following steps: nano-SiO2 and anhydrous ethanol are added to a reaction vessel for dispersion, KH560 is added, the pH is adjusted to 4-5, the temperature is controlled at 70-80℃ and the reaction is kept under reflux for 3-6 hours, chloroplatinic acid is added and the reaction is kept under reflux for 1-2 hours, sodium borohydride is mixed with water and then added to the reaction vessel, the temperature is controlled at 40-50℃ and the reaction is kept under reflux for 1-2 hours, centrifuged, washed and dried to obtain Pt-loaded KH560 modified SiO2;

[0027] The addition ratio of nano-SiO2, anhydrous ethanol, KH560, chloroplatinic acid, sodium borohydride, and water is 10g: 50-100mL: 1.5-2.5g: 0.03-0.08g: 0.02-0.05g: 5-10mL.

[0028] As a further aspect of the present invention, the preparation method of the dynamic crosslinking agent includes the following steps:

[0029] In a nitrogen atmosphere, polytetramethylene ether glycol, isophorone diisocyanate, and dibutyltin dilaurate are added to a reactor and dispersed. The temperature is controlled at 70-80℃ and the reaction is maintained for 2-3 hours to obtain a terminal isocyanate prepolymer.

[0030] 2,2-Dimethylolpropionic acid, 1,4-butanediol, and N,N-dimethylformamide were blended and then a terminal isocyanate prepolymer was added. The reaction was carried out at 70-80℃ for 2-3 hours. 4-hydroxyphenylboronic acid was added and the reaction was carried out at 80-90℃ for 3-4 hours. Acetone was added and stirred to reduce viscosity at 40-50℃. Triethylamine was added and the reaction was carried out at 0.5-1 hour. Acetone and N,N-dimethylformamide were removed by rotary evaporation. The mixture was then dried and pulverized to obtain a dynamic crosslinking agent.

[0031] The addition ratio of polytetramethylene ether glycol, isophorone diisocyanate, and dibutyltin dilaurate is 100g: 35-50g: 0.1-0.3g;

[0032] The addition ratio of 2,2-dimethylolpropionic acid, 1,4-butanediol, N,N-dimethylformamide, 4-hydroxyphenylboronic acid, acetone, and triethylamine is 8-12g: 5-8g: 200-300mL: 15-25g: 100-150mL: 6-9g.

[0033] As a further embodiment of the present invention, the preparation method of the self-healing microcapsules includes the following steps: dicyclopentadiene, methyl methacrylate, and benzoyl peroxide are blended to obtain an oil phase; polyvinyl alcohol, sodium dodecyl sulfate, and deionized water are blended to obtain an aqueous phase; under stirring conditions, the oil phase is added to the aqueous phase, emulsified for 0.5-1 h, the temperature is controlled at 70-80℃, and the reaction is stirred for 4-6 h; the mixture is then washed with water, filtered, and dried to obtain the self-healing microcapsules.

[0034] The addition ratio of dicyclopentadiene, methyl methacrylate, and benzoyl peroxide is 100g: 30-50g: 0.5-1.5g;

[0035] The addition ratio of polyvinyl alcohol, sodium dodecyl sulfate, and deionized water is 2-5g: 0.5-1g: 300-500mL.

[0036] The preparation method of the semiconductive adhesive for cable semiconductive shielding tape is made by any one of the above preparation methods.

[0037] As a further aspect of the present invention: the semiconductive adhesive prepared by any of the above preparation methods is applied to the semiconductive shielding tape of a cable.

[0038] As a further aspect of the present invention, the method for preparing the cable semi-conductive shielding tape includes the following steps: using polyester woven fabric or non-woven fabric as the substrate, the substrate is smoothly unwound by a constant tension unwinding device. It enters an impregnation tank, where semi-conductive adhesive submerges the substrate, and pressure rollers ensure that the adhesive fully penetrates into the fiber gaps. The impregnation time is adjusted according to the substrate thickness and absorbency. After the substrate leaves the adhesive tank, the amount of adhesive applied is controlled by roller pressing or a scraper; drying and vulcanization are performed using a multi-stage oven to obtain the cable semi-conductive shielding tape.

[0039] As a further aspect of the present invention: the amount of adhesive applied is controlled to a dry adhesive film thickness of 0.05-0.15 mm.

[0040] As a further aspect of the present invention, the specific process of drying and vulcanization is as follows: preheating zone 60-80℃, drying zone 100-120℃, vulcanization zone 140-160℃.

[0041] The beneficial effects of this invention are:

[0042] (1) Wide temperature range conductivity stability

[0043] The semiconductive adhesive prepared in this application exhibits resistivity fluctuations of less than 15% within the temperature range of -20℃ to 120℃. This application incorporates ionic liquid-modified acetylene black and polyaniline-grafted graphene microsheets as conductive fillers in the semiconductive adhesive. The ionic liquid-modified acetylene black is prepared by adsorbing 1-butyl-3-methylimidazolium tetrafluoroborate onto the surface of acetylene black, forming an ionicly conductive layer. At low temperatures, electronic conductivity dominates; at high temperatures, the thermal expansion of the matrix leads to increased spacing between carbon black particles, partially disrupting the electronic conductivity pathway. However, the ion mobility of the ionic liquid increases with temperature, enhancing ionic conductivity and compensating for the attenuation of electronic conductivity, achieving a negative temperature compensation effect for mixed electronic-ionic conductivity. This application also utilizes polyaniline-modified two-dimensional graphene sheets to form conductive bridges connecting dispersed carbon black particles in the adhesive layer, constructing a three-dimensional conductive network. Even with increased local carbon black spacing, the graphene sheets maintain the continuity of the conductive pathway. Simultaneously, the conductivity of polyaniline itself changes little with temperature, further stabilizing the overall resistivity.

[0044] (2) Dual self-repair capability

[0045] The semiconductive adhesive prepared in this application can self-repair under room temperature or medium temperature conditions after being subjected to mechanical damage, effectively restoring tensile strength. This application adds self-healing microcapsules and Pt-loaded KH560 modified SiO2 to the semiconductive adhesive. The microcapsule wall material of the self-healing microcapsules is polymethyl methacrylate. When cracks propagate to the microcapsules, the capsules rupture, releasing dicyclopentadiene monomers. Under the catalysis of a platinum catalyst in Pt-loaded KH560 modified SiO2, the dicyclopentadiene monomers undergo ring-opening metathesis polymerization to form cross-linked polyDCPD, which fills the cracks and bonds the fracture surface, achieving macroscopic damage repair.

[0046] The semiconductive adhesive prepared in this application also incorporates a dynamic crosslinking agent for boronic acid ester-terminated modified hydroxyl-terminated liquid butadiene-acrylonitrile rubber and boronic acid ester-containing polyurethane elastomers. Boronic acid ester bonds can undergo reversible transesterification reactions at room and medium temperatures. When the adhesive layer is subjected to stress and microcracks are generated, the boronic acid ester bonds at the cracks break, and subsequently, nearby boronic acid ester bonds recombine through transesterification, reconnecting the molecular chains and achieving self-repair at the molecular level without external triggering.

[0047] This application uses microcapsules to repair macroscopic cracks and dynamic bonds to repair microscopic damage. Both methods cover defects at different scales, achieving full-scale self-repair.

[0048] (3) High interfacial peel strength

[0049] The semiconductive adhesive prepared in this application is used in the preparation of semiconductive shielding tape for cables, exhibiting high peel strength between the semiconductive adhesive and the substrate. The semiconductive adhesive prepared in this application incorporates polyaniline-grafted graphene microsheets, Pt-loaded KH560-modified SiO2, and a dynamic crosslinking agent. The polyaniline chain contains abundant amino and imine groups, which can undergo hydrogen bonding with the ester groups on the surface of the polyester substrate, and simultaneously generate dipole-dipole interactions with the polar groups in the rubber matrix, forming molecular anchoring. The Pt-loaded KH560-modified SiO2, due to the presence of epoxy groups in KH560, can undergo ring-opening reactions with the hydroxyl groups on the surface of the polyester substrate under platinum catalysis, forming covalent bonds; simultaneously, SiO2 nanoparticles are embedded in the interfiber gaps of the substrate, generating a mechanical interlocking effect. The borate ester bonds in the dynamic crosslinking agent can undergo transesterification reactions with the hydroxyl groups on the substrate surface, forming chemical bonds, further enhancing interfacial bonding. This application achieves multiple interfacial enhancements through physical adsorption, chemical bonding, and mechanical interlocking.

[0050] (4) Excellent resistance to damp heat aging

[0051] This application incorporates a dynamic crosslinking agent—a hydroxyl-terminated liquid butadiene-acrylonitrile rubber modified with borate ester end groups, and a polyurethane elastomer containing borate esters—into a semiconductive adhesive. Borate ester bonds are sensitive to water and readily hydrolyze to form boric acid and alcohols / phenols. This application adds nano-calcium oxide to the semiconductive adhesive to protect the borate ester bonds from hydrolysis. The Ca(OH)₂ obtained from the reaction of nano-calcium oxide with water is alkaline, which can neutralize protons that may accelerate hydrolysis under acidic conditions, further stabilizing the dynamic bonds.

[0052] The antioxidant components added in this application include antioxidant 1010, which captures free radicals and terminates the oxidation chain reaction. Dilauryl thiodipropionate (an auxiliary antioxidant) decomposes hydrogen peroxide, reducing the source of free radicals. Together, they inhibit the thermo-oxidative aging of the rubber matrix, maintaining the flexibility and adhesion of the adhesive layer.

[0053] (5) Good flexibility and crack resistance

[0054] This application incorporates a borate-terminated, hydroxyl-terminated liquid nitrile butadiene rubber and a borate-containing polyurethane elastomer as a dynamic crosslinking agent into a semiconductive adhesive. The soft segments of the polyurethane elastomer containing borate bonds provide high flexibility, while the hard segments provide strength. The introduced borate bonds not only impart self-healing capabilities but also act as dynamic crosslinking points, enabling reversible fracture and recombination under stress, dissipating stress and preventing cracking caused by stress concentration. The borate-terminated, hydroxyl-terminated liquid nitrile butadiene rubber itself is a liquid rubber, acting as a plasticizer to reduce the system's modulus. The end-borate bonds participate in the dynamic crosslinking network, giving the entire system glass-like properties, allowing topological rearrangement under stress and exhibiting excellent ductility. Attached Figure Description

[0055] The invention will now be further described with reference to the accompanying drawings.

[0056] Figure 1 This is the reaction formula for preparing borate-terminated modified hydroxyl-terminated liquid butadiene-nitrile rubber according to this application;

[0057] Figure 2 This is the reaction formula for preparing polyaniline-grafted graphene microsheets in this application;

[0058] Figure 3 This is the reaction formula for preparing the dynamic crosslinking agent in this application. Detailed Implementation

[0059] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0060] Example 1 Figure 1 As shown, the preparation method of borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber includes the following steps: 100g of hydroxyl-terminated liquid nitrile butadiene rubber (hydroxyl value 1mmol / g) and 150mL of toluene are added to a reaction vessel for dispersion, the temperature is controlled at 110℃, and the mixture is dehydrated and refluxed for 0.5h. 6g of boric acid and 0.5g of p-toluenesulfonic acid are added, the temperature is controlled at 110℃, and the reaction is maintained for 3h. Saturated sodium bicarbonate solution is added to adjust the pH to neutral. The mixture is washed with water, the organic phase is dried with anhydrous sodium sulfate, filtered, and toluene is removed by vacuum distillation to obtain borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber.

[0061] The preparation method of ionic liquid modified acetylene black includes the following steps: 10g of acetylene black (DBP absorbance value 120mL / 100g) and 200mL of anhydrous ethanol are added to a reaction flask for dispersion, 0.5g of 1-butyl-3-methylimidazolium tetrafluoroborate is added for dispersion, the temperature is controlled at 70℃ and the reaction is refluxed for 3h to obtain ionic liquid modified acetylene black.

[0062] like Figure 2 As shown, the preparation method of polyaniline-grafted graphene microsheets includes the following steps: 10g of graphene microsheets (thickness 3nm, diameter 7μm) and 100mL of 1mol / L hydrochloric acid aqueous solution are added to a reaction flask for dispersion, 0.5g of KH550 is added for dispersion, the temperature is controlled at 50℃ and the reaction is maintained for 2h, 5g of aniline monomer is added, the temperature is controlled at 0℃ and the reaction is maintained for 1h, 10g of ammonium persulfate is added, the reaction is maintained for 6h, and the mixture is filtered, washed, and dried to obtain polyaniline-grafted graphene microsheets.

[0063] The preparation method of Pt-loaded KH560 modified SiO2 includes the following steps: 10g of nano-SiO2 and 50mL of anhydrous ethanol are added to a reaction vessel for dispersion, 1.5g of KH560 is added, the pH is adjusted to 4, the temperature is controlled at 70℃ and refluxed for 3h, 0.03g of chloroplatinic acid is added and the reaction is controlled at 1h, 0.02g of sodium borohydride is mixed with 5mL of water and added to the reaction vessel, the temperature is controlled at 40℃ and the reaction is controlled at 1h, centrifuged, washed and dried to obtain Pt-loaded KH560 modified SiO2.

[0064] like Figure 3 As shown, the preparation method of the dynamic crosslinking agent includes the following steps: In a nitrogen atmosphere, 100g of polytetramethylene ether glycol (Mn=1000), 35g of isophorone diisocyanate, and 0.1g of dibutyltin dilaurate are added to a reaction vessel and dispersed. The temperature is controlled at 70℃ and the reaction is maintained for 2h to obtain a prepolymer with terminal isocyanate groups. 8g of 2,2-dimethylolpropionic acid, 5g of 1,4-butanediol, and 200mL of N,N-dimethylformamide are mixed and then added to the prepolymer with terminal isocyanate groups. The temperature is controlled at 70℃ and the reaction is maintained for 2h. 15g of 4-hydroxyphenylboronic acid is added, and the temperature is controlled at 80℃ and the reaction is maintained for 3h. The temperature is controlled at 40℃, 100mL of acetone is added and stirred to reduce viscosity. 6g of triethylamine is added and the reaction is maintained for 0.5h. The acetone and N,N-dimethylformamide are removed by rotary evaporation, and the mixture is dried and pulverized to obtain the dynamic crosslinking agent.

[0065] The preparation method of self-healing microcapsules includes the following steps: 100g of dicyclopentadiene, 30g of methyl methacrylate, and 0.5g of benzoyl peroxide are blended to obtain an oil phase; 2g of polyvinyl alcohol, 0.5g of sodium dodecyl sulfate, and 300mL of deionized water are blended to obtain an aqueous phase; under stirring conditions, the oil phase is added to the aqueous phase, emulsified for 0.5h, the temperature is controlled at 70℃, and the reaction is stirred for 4h; the mixture is then washed with water, filtered, and dried to obtain self-healing microcapsules.

[0066] Example 2 Figure 1 As shown, the preparation method of borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber includes the following steps: 100g of hydroxyl-terminated liquid nitrile butadiene rubber (hydroxyl value 1mmol / g) and 200mL of toluene are added to a reaction vessel for dispersion, the temperature is controlled at 115℃, and the mixture is dehydrated and refluxed for 0.5h. 9g of boric acid and 1g of p-toluenesulfonic acid are added, the temperature is controlled at 115℃, and the reaction is maintained at this temperature for 4.5h. Saturated sodium bicarbonate solution is added to adjust the pH to neutral. The mixture is washed with water, the organic phase is dried with anhydrous sodium sulfate, filtered, and toluene is removed by vacuum distillation to obtain borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber.

[0067] The preparation method of ionic liquid modified acetylene black includes the following steps: 10g of acetylene black (DBP absorbance value 120mL / 100g) and 350mL of anhydrous ethanol are added to a reaction flask for dispersion, 0.7g of 1-butyl-3-methylimidazolium tetrafluoroborate is added for dispersion, the temperature is controlled at 75℃ and the reaction is refluxed for 4.5h to obtain ionic liquid modified acetylene black.

[0068] like Figure 2 As shown, the preparation method of polyaniline-grafted graphene microsheets includes the following steps: 10g of graphene microsheets (thickness 3nm, diameter 7μm) and 150mL of 1mol / L hydrochloric acid aqueous solution are added to a reaction flask for dispersion, 0.7g of KH550 is added for dispersion, the temperature is controlled at 55℃ and the reaction is maintained for 3h, 6.5g of aniline monomer is added, the temperature is controlled at 0℃ and the reaction is maintained for 1.5h, 13g of ammonium persulfate is added, the reaction is maintained for 7.5h, and the mixture is filtered, washed, and dried to obtain polyaniline-grafted graphene microsheets.

[0069] The preparation method of Pt-loaded KH560 modified SiO2 includes the following steps: 10g of nano-SiO2 and 70mL of anhydrous ethanol are added to a reaction vessel for dispersion, 2g of KH560 is added, the pH is adjusted to 4, the temperature is controlled at 75℃ and the reaction is kept under reflux for 4.5h, 0.05g of chloroplatinic acid is added and the reaction is kept under reflux for 1.5h, 0.04g of sodium borohydride is mixed with 5mL of water and then added to the reaction vessel, the temperature is controlled at 45℃ and the reaction is kept under reflux for 1.5h, centrifuged, washed and dried to obtain Pt-loaded KH560 modified SiO2.

[0070] like Figure 3As shown, the preparation method of the dynamic crosslinking agent includes the following steps: In a nitrogen atmosphere, 100g of polytetramethylene ether glycol (Mn=1000), 42g of isophorone diisocyanate, and 0.2g of dibutyltin dilaurate are added to a reaction vessel and dispersed. The temperature is controlled at 75℃ and the reaction is maintained for 2.5h to obtain a terminal isocyanate prepolymer. 10g of 2,2-dimethylolpropionic acid, 6.5g of 1,4-butanediol, and 250mL of N,N-dimethylformamide are mixed and then added to the terminal isocyanate prepolymer. The temperature is controlled at 75℃ and the reaction is maintained for 2.5h. 20g of 4-hydroxyphenylboronic acid is added, and the temperature is controlled at 85℃ and the reaction is maintained for 3.5h. The temperature is controlled at 45℃, 120mL of acetone is added and stirred to reduce viscosity. 7.5g of triethylamine is added and the reaction is maintained for 0.5h. The acetone and N,N-dimethylformamide are removed by rotary evaporation, and the mixture is dried and pulverized to obtain the dynamic crosslinking agent.

[0071] The preparation method of self-healing microcapsules includes the following steps: 100g of dicyclopentadiene, 40g of methyl methacrylate, and 1g of benzoyl peroxide are blended to obtain an oil phase; 3.5g of polyvinyl alcohol, 0.7g of sodium dodecyl sulfate, and 400mL of deionized water are blended to obtain an aqueous phase; under stirring conditions, the oil phase is added to the aqueous phase, emulsified for 0.5h, the temperature is controlled at 75℃, and the reaction is stirred for 5h; the mixture is then washed with water, filtered, and dried to obtain self-healing microcapsules.

[0072] Example 3 Figure 1 As shown, the preparation method of borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber includes the following steps: 100g of hydroxyl-terminated liquid nitrile butadiene rubber (hydroxyl value 1mmol / g) and 250mL of toluene are added to a reaction vessel for dispersion, the temperature is controlled at 120℃, and the mixture is dehydrated and refluxed for 1h. 12g of boric acid and 1.5g of p-toluenesulfonic acid are added, the temperature is controlled at 120℃, and the reaction is maintained for 6h. Saturated sodium bicarbonate solution is added to adjust the pH to neutral. The mixture is washed with water, the organic phase is dried with anhydrous sodium sulfate, filtered, and toluene is removed by vacuum distillation to obtain borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber.

[0073] The preparation method of ionic liquid modified acetylene black includes the following steps: 10g of acetylene black (DBP absorbance value 120mL / 100g) and 500mL of anhydrous ethanol are added to a reaction flask for dispersion, 1g of 1-butyl-3-methylimidazolium tetrafluoroborate is added for dispersion, the temperature is controlled at 80℃ and the reaction is refluxed for 6h to obtain ionic liquid modified acetylene black.

[0074] like Figure 2As shown, the preparation method of polyaniline-grafted graphene microsheets includes the following steps: 10g of graphene microsheets (thickness 3nm, diameter 7μm) and 200mL of 1mol / L hydrochloric acid aqueous solution are added to a reaction flask for dispersion, 1g of KH550 is added for dispersion, the temperature is controlled at 60℃ and the reaction is maintained for 4h, 8g of aniline monomer is added, the temperature is controlled at 5℃ and the reaction is maintained for 2h, 16g of ammonium persulfate is added and the reaction is maintained for 9h, and the mixture is filtered, washed and dried to obtain polyaniline-grafted graphene microsheets.

[0075] The preparation method of Pt-loaded KH560 modified SiO2 includes the following steps: 10g of nano-SiO2 and 100mL of anhydrous ethanol are added to a reaction vessel for dispersion, 2.5g of KH560 is added, the pH is adjusted to 5, the temperature is controlled at 80℃ and refluxed for 6h, 0.08g of chloroplatinic acid is added and the reaction is maintained for 2h, 0.05g of sodium borohydride is mixed with 10mL of water and added to the reaction vessel, the temperature is controlled at 50℃ and the reaction is maintained for 2h, centrifuged, washed and dried to obtain Pt-loaded KH560 modified SiO2.

[0076] like Figure 3 As shown, the preparation method of the dynamic crosslinking agent includes the following steps: In a nitrogen atmosphere, 100g of polytetramethylene ether glycol (Mn=1000), 50g of isophorone diisocyanate, and 0.3g of dibutyltin dilaurate are added to a reaction vessel and dispersed. The temperature is controlled at 80℃ and the reaction is maintained for 3h to obtain a terminal isocyanate prepolymer. 12g of 2,2-dimethylolpropionic acid, 8g of 1,4-butanediol, and 300mL of N,N-dimethylformamide are mixed and then added to the terminal isocyanate prepolymer. The temperature is controlled at 80℃ and the reaction is maintained for 3h. 25g of 4-hydroxyphenylboronic acid is added, and the temperature is controlled at 90℃ and the reaction is maintained for 4h. The temperature is controlled at 50℃, 150mL of acetone is added and stirred to reduce viscosity. 9g of triethylamine is added and the reaction is maintained for 1h. The acetone and N,N-dimethylformamide are removed by rotary evaporation. The mixture is dried and pulverized to obtain the dynamic crosslinking agent.

[0077] The preparation method of self-healing microcapsules includes the following steps: 100g of dicyclopentadiene, 50g of methyl methacrylate, and 1.5g of benzoyl peroxide are blended to obtain an oil phase; 5g of polyvinyl alcohol, 1g of sodium dodecyl sulfate, and 500mL of deionized water are blended to obtain an aqueous phase; under stirring conditions, the oil phase is added to the aqueous phase, emulsified for 1 hour, the temperature is controlled at 80℃, and the reaction is stirred for 6 hours; the mixture is then washed with water, filtered, and dried to obtain self-healing microcapsules.

[0078] Example 4: A method for preparing semiconductive adhesive for cable semiconductive shielding tape, comprising the following steps:

[0079] 45 parts by weight of ionic liquid modified acetylene black prepared in Example 1, 20 parts by weight of polyaniline grafted graphene microsheets prepared in Example 1, 4 parts by weight of Pt-loaded KH560 modified SiO2 prepared in Example 1, 3 parts by weight of dynamic crosslinking agent prepared in Example 1, and 1.5 parts by weight of nano-calcium oxide were mixed to obtain a pre-dispersion.

[0080] 80 parts by weight of nitrile butadiene rubber (NBR, acrylonitrile content 31.24%), 20 parts by weight of the borate-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber prepared in Example 1, 110 parts by weight of cyclohexanone, 70 parts by weight of toluene, and 20 parts by weight of propylene glycol methyl ether acetate were blended and dispersed in a pre-dispersant. 1.2 parts by weight of KH560, 0.4 parts by weight of KH590, 1 part by weight of antioxidant 1010, and 0.5 parts by weight of dilauryl thiodipropionate were blended. 2 parts by weight of the self-healing microcapsules prepared in Example 1 were added and blended. 3 parts by weight of dicumyl peroxide and 1.5 parts by weight of triallyl isocyanurate were added and blended to obtain a semiconductive adhesive.

[0081] Example 5: A method for preparing semiconductive adhesive for cable semiconductive shielding tape, comprising the following steps:

[0082] 45 parts by weight of ionic liquid modified acetylene black prepared in Example 2, 20 parts by weight of polyaniline grafted graphene microsheets prepared in Example 2, 4 parts by weight of Pt-loaded KH560 modified SiO2 prepared in Example 2, 3 parts by weight of dynamic crosslinking agent prepared in Example 2, and 1.5 parts by weight of nano-calcium oxide were mixed to obtain a pre-dispersion.

[0083] 80 parts by weight of nitrile butadiene rubber (NBR, acrylonitrile content 31.24%), 20 parts by weight of the borate-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber prepared in Example 2, 110 parts by weight of cyclohexanone, 70 parts by weight of toluene, and 20 parts by weight of propylene glycol methyl ether acetate were blended and dispersed in a pre-dispersant. 1.2 parts by weight of KH560, 0.4 parts by weight of KH590, 1 part by weight of antioxidant 1010, and 0.5 parts by weight of dilauryl thiodipropionate were blended. 2 parts by weight of the self-healing microcapsules prepared in Example 2 were added and blended. 3 parts by weight of dicumyl peroxide and 1.5 parts by weight of triallyl isocyanurate were added and blended to obtain a semiconductive adhesive.

[0084] Example 6: A method for preparing semiconductive adhesive for cable semiconductive shielding tape, comprising the following steps:

[0085] 45 parts by weight of ionic liquid modified acetylene black prepared in Example 3, 20 parts by weight of polyaniline grafted graphene microsheets prepared in Example 3, 4 parts by weight of Pt-loaded KH560 modified SiO2 prepared in Example 3, 3 parts by weight of dynamic crosslinking agent prepared in Example 3, and 1.5 parts by weight of nano calcium oxide were mixed to obtain a pre-dispersion.

[0086] 80 parts by weight of nitrile butadiene rubber (NBR, acrylonitrile content 31.24%), 20 parts by weight of the borate-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber prepared in Example 3, 110 parts by weight of cyclohexanone, 70 parts by weight of toluene, and 20 parts by weight of propylene glycol methyl ether acetate were blended and dispersed in a pre-dispersant. 1.2 parts by weight of KH560, 0.4 parts by weight of KH590, 1 part by weight of antioxidant 1010, and 0.5 parts by weight of dilauryl thiodipropionate were blended. 2 parts by weight of the self-healing microcapsules prepared in Example 3 were added and blended. 3 parts by weight of dicumyl peroxide and 1.5 parts by weight of triallyl isocyanurate were added and blended to obtain a semiconductive adhesive.

[0087] Comparative Example 1: The preparation method of semiconductive adhesive for cable semiconductive shielding tape is the same as that of Example 5, except that the borate ester end-modified hydroxyl-terminated liquid nitrile rubber added in Example 5 is replaced with an equal amount of hydroxyl-terminated liquid nitrile rubber. The remaining components and preparation methods are completely consistent with those of Example 5.

[0088] Comparative Example 2: Preparation method of semiconductive adhesive for cable semiconductive shielding tape. Compared with Example 5, only the ionic liquid modified acetylene black added in Example 5 was replaced with an equal amount of acetylene black. The remaining components and preparation method were completely the same as in Example 5.

[0089] Comparative Example 3: The preparation method of semiconductive adhesive for cable semiconductive shielding tape is the same as that of Example 5, except that the polyaniline-grafted graphene microsheets added in Example 5 are replaced with graphene microsheets in equal amounts. The remaining components and preparation methods are completely consistent with those of Example 5.

[0090] Comparative Example 4: Preparation method of semiconductive adhesive for cable semiconductive shielding tape. Compared with Example 5, only the KH560 modified SiO2 loaded with Pt added in Example 5 was replaced with an equal amount of KH560 modified SiO2. The remaining components and preparation method were completely the same as in Example 5.

[0091] Comparative Example 5: The preparation method of semiconductive adhesive for cable semiconductive shielding tape is the same as that of Example 5 except that the dynamic crosslinking agent added in Example 5 is deleted. The remaining components and preparation method are completely the same as those of Example 5.

[0092] Comparative Example 6: Preparation method of semiconductive adhesive for cable semiconductive shielding tape. Compared with Example 5, only the self-healing microcapsules added in Example 5 were deleted, and the remaining components and preparation method were completely the same as in Example 5.

[0093] Comparative Example 7: Preparation method of semiconductive adhesive for cable semiconductive shielding tape. Compared with Example 5, only the nano-calcium oxide added in Example 5 was deleted. The remaining components and preparation method are completely the same as in Example 5.

[0094] Performance testing

[0095] (1) Volume resistivity: The volume resistivity was tested according to GB / T 3048.3-2007 "Test methods for electrical properties of wires and cables - Part 3: Volume resistivity test of semiconductive rubber and plastic materials". The test results are shown in Table 1.

[0096] Table 1: Statistical Table of Volume Resistivity Measurement Data

[0097] As shown in Table 1, the resistivity fluctuation of the semiconductive adhesive prepared in this application is less than 15% in the range of -20℃ to 120℃.

[0098] (2) Peel strength: The test was conducted according to GB / T 2792-1995 "Test method for peel strength of adhesives, flexible materials to flexible materials". The test results are shown in Table 2.

[0099] Aging resistance: According to GB / T 2951.12-2008 "Test method for thermal aging of cable insulation and sheath materials", the peel strength of the sample was tested after aging at 105℃ for 1000h and the peel strength retention rate was calculated. The test results are shown in Table 2.

[0100] Resistance to damp heat aging: The peel strength of the samples was tested after aging at 85℃ and 85%RH for 500h, and the peel strength retention rate was calculated. The test results are shown in Table 2.

[0101] Table 2: Statistical Table of Peel Strength and Aging Resistance Test Data

[0102] As shown in Table 2, the semiconductive adhesive prepared in this application has high peel strength when applied to the semiconductive shielding tape of the cable, and it still maintains high peel strength after heat aging treatment.

[0103] (3) Mechanical properties: The test results were conducted in accordance with GB / T 528-2009 "Determination of tensile stress-strain properties of vulcanized rubber or thermoplastic rubber". The test results are shown in Table 3.

[0104] Aging resistance: According to GB / T 2951.12-2008 "Test method for thermal aging of cable insulation and sheath materials", the tensile strength of the sample was tested after aging at 105℃ for 1000h and the tensile strength retention rate was calculated. The test results are shown in Table 3.

[0105] Table 3: Statistical Table of Mechanical Properties and Aging Resistance Test Data

[0106] As shown in Table 3, the semiconductive adhesive prepared in this application has good flexibility and crack resistance when applied to semiconductive shielding tape of cables, and still maintains high mechanical properties after heat aging treatment.

[0107] (4) Self-healing performance: According to GB / T 528, a 50μm crack was artificially formed by cutting and repaired at room temperature for 24 hours. The tensile strength retention rate was tested. The test results are shown in Table 4.

[0108] Table 4: Statistical Table of Self-Healing Performance Test Data

[0109] As shown in Table 4, the semiconductive adhesive prepared in this application exhibits excellent self-healing properties when applied to semiconductive shielding tapes for cables. The above description details one embodiment of the present invention, but this is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of this invention should still fall within the patent coverage of this invention.

Claims

1. A method for preparing semiconductive adhesive for cable semiconductive shielding tape, characterized in that, Includes the following steps: The conductive filler, Pt-loaded KH560 modified SiO2, dynamic crosslinking agent, and moisture scavenger are mixed to obtain a pre-dispersion. Nitrile rubber, borate-terminated hydroxyl-terminated liquid nitrile rubber, and solvent are blended, and then dispersed in a pre-dispersant. Interface modifier and anti-aging agent components are blended, self-healing microcapsules are added and blended, and vulcanization components are added and blended to obtain a semi-conductive adhesive. The conductive filler is composed of ionic liquid modified acetylene black and polyaniline grafted graphene microsheets in a mass ratio of 40-50:15-25. The dynamic crosslinking agent is a borate ester-containing polyurethane elastomer; The self-healing microcapsules are self-healing monomers with polymethyl methacrylate as the wall material and encapsulated dicyclopentadiene.

2. The method for preparing the semi-conductive adhesive for cable semi-conductive shielding tape according to claim 1, characterized in that, The semiconductive adhesive comprises the following raw materials in parts by weight: 70-85 parts by weight of nitrile rubber, 15-25 parts by weight of borate-terminated modified hydroxyl-terminated liquid nitrile rubber, 180-220 parts by weight of solvent, 55-70 parts by weight of conductive filler, 3-5 parts by weight of Pt-loaded KH560 modified SiO2, 2-4 parts by weight of dynamic crosslinking agent, 1-2 parts by weight of moisture scavenger, 1-2 parts by weight of interface modifier, 1.2-1.8 parts by weight of anti-aging agent component, 1.5-3 parts by weight of self-healing microcapsules, and 3-6 parts by weight of vulcanization component.

3. The method for preparing the semi-conductive adhesive for cable semi-conductive shielding tape according to claim 2, characterized in that, The anti-aging agent component consists of antioxidant 1010 and dilaurate thiodipropionate in a mass ratio of 1.5-2:

1. The interface modifier is composed of KH560 and KH590 in a mass ratio of 3:1; The vulcanizing component consists of dicumyl peroxide and triallyl isocyanurate in a mass ratio of 2-4:1-2. The moisture scavenger is nano-calcium oxide; The solvent is composed of cyclohexanone, toluene, and propylene glycol methyl ether acetate in a mass ratio of 100-120:60-80:20-30.

4. The method for preparing the semi-conductive adhesive for cable semi-conductive shielding tape according to claim 1, characterized in that, The preparation method of the borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber includes the following steps: hydroxyl-terminated liquid nitrile butadiene rubber and toluene are added to a reaction vessel and dispersed. The temperature is controlled at 110-120℃ and the mixture is dehydrated and refluxed for 0.5-1h. Boric acid and p-toluenesulfonic acid are added. The temperature is controlled at 110-120℃ and the reaction is maintained for 3-6h. Saturated sodium bicarbonate solution is added to adjust the pH to neutral. The mixture is washed with water, and the organic phase is dried with anhydrous sodium sulfate. The mixture is filtered and the toluene is removed by vacuum distillation to obtain borate ester-terminated modified hydroxyl-terminated liquid nitrile butadiene rubber. The addition ratio of the terminal hydroxyl liquid nitrile rubber, toluene, boric acid, and p-toluenesulfonic acid is 100g: 150-250mL: 6-12g: 0.5-1.5g.

5. The method for preparing the semi-conductive adhesive for cable semi-conductive shielding tape according to claim 1, characterized in that, The preparation method of the ionic liquid modified acetylene black includes the following steps: acetylene black and anhydrous ethanol are added to a reaction flask for dispersion, 1-butyl-3-methylimidazolium tetrafluoroborate is added for dispersion, the temperature is controlled at 70-80℃ and the reaction is refluxed for 3-6 hours to obtain ionic liquid modified acetylene black; The addition ratio of acetylene black, anhydrous ethanol, and 1-butyl-3-methylimidazolium tetrafluoroborate is 10g: 200-500mL: 0.5-1g.

6. The method for preparing the semiconductive adhesive for cable semiconductive shielding tape according to claim 1, characterized in that, The preparation method of the polyaniline-grafted graphene microsheets includes the following steps: graphene microsheets and 1-1.5 mol / L hydrochloric acid aqueous solution are added to a reaction flask for dispersion, KH550 is added for dispersion, the temperature is controlled at 50-60℃ and the reaction is kept at this temperature for 2-4 hours, aniline monomer is added, the temperature is controlled at 0-5℃ and the reaction is kept at this temperature for 1-2 hours, ammonium persulfate is added and the reaction is kept at this temperature for 6-9 hours, and the mixture is filtered, washed, and dried to obtain polyaniline-grafted graphene microsheets; The addition ratio of the graphene microsheets, 1-1.5 mol / L hydrochloric acid aqueous solution, KH550, aniline monomer, and ammonium persulfate is 10 g: 100-200 mL: 0.5-1 g: 5-8 g: 10-16 g.

7. The method for preparing the semiconductive adhesive for cable semiconductive shielding tape according to claim 1, characterized in that, The preparation method of Pt-loaded KH560 modified SiO2 includes the following steps: nano-SiO2 and anhydrous ethanol are added to a reaction vessel for dispersion, KH560 is added, the pH is adjusted to 4-5, the temperature is controlled at 70-80℃ and the reaction is kept under reflux for 3-6 hours, chloroplatinic acid is added and the reaction is kept under reflux for 1-2 hours, sodium borohydride is mixed with water and then added to the reaction vessel, the temperature is controlled at 40-50℃ and the reaction is kept under reflux for 1-2 hours, centrifuged, washed and dried to obtain Pt-loaded KH560 modified SiO2; The addition ratio of nano-SiO2, anhydrous ethanol, KH560, chloroplatinic acid, sodium borohydride, and water is 10g: 50-100mL: 1.5-2.5g: 0.03-0.08g: 0.02-0.05g: 5-10mL.

8. The method for preparing the semiconductive adhesive for cable semiconductive shielding tape according to claim 1, characterized in that, The preparation method of the dynamic crosslinking agent includes the following steps: In a nitrogen atmosphere, polytetramethylene ether glycol, isophorone diisocyanate, and dibutyltin dilaurate are added to a reactor and dispersed. The temperature is controlled at 70-80℃ and the reaction is maintained for 2-3 hours to obtain a terminal isocyanate prepolymer. 2,2-Dimethylolpropionic acid, 1,4-butanediol, and N,N-dimethylformamide were blended and then a terminal isocyanate prepolymer was added. The reaction was carried out at 70-80℃ for 2-3 hours. 4-hydroxyphenylboronic acid was added and the reaction was carried out at 80-90℃ for 3-4 hours. Acetone was added and stirred to reduce viscosity at 40-50℃. Triethylamine was added and the reaction was carried out at 0.5-1 hour. Acetone and N,N-dimethylformamide were removed by rotary evaporation. The mixture was then dried and pulverized to obtain a dynamic crosslinking agent. The addition ratio of polytetramethylene ether diol, isophorone diisocyanate, and dibutyltin dilaurate is 100g: 35-50g: 0.1-0.3g; The addition ratio of 2,2-dimethylolpropionic acid, 1,4-butanediol, N,N-dimethylformamide, 4-hydroxyphenylboronic acid, acetone, and triethylamine is 8-12g: 5-8g: 200-300mL: 15-25g: 100-150mL: 6-9g.

9. The method for preparing the semi-conductive adhesive for cable semi-conductive shielding tape according to claim 1, characterized in that, The preparation method of the self-healing microcapsules includes the following steps: Dicyclopentadiene, methyl methacrylate, and benzoyl peroxide were blended to obtain an oil phase; polyvinyl alcohol, sodium dodecyl sulfate, and deionized water were blended to obtain an aqueous phase; under stirring conditions, the oil phase was added to the aqueous phase, emulsified for 0.5-1 h, and the reaction was carried out at a controlled temperature of 70-80℃ for 4-6 h. After washing with water, filtration, and drying, self-healing microcapsules were obtained. The addition ratio of the dicyclopentadiene, methyl methacrylate, and benzoyl peroxide is 100g: 30-50g: 0.5-1.5g; The addition ratio of polyvinyl alcohol, sodium dodecyl sulfate, and deionized water is 2-5g: 0.5-1g: 300-500mL.

10. A method for preparing semiconductive adhesive for cable semiconductive shielding tape, characterized in that, It is prepared by the preparation method described in any one of claims 1-9.

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