Lspc molded floor

Abstract

The application relates to the technical field of LSPC (Laminated Stone Plastic Composite) floor pressing technology, in particular to a LSPC floor, which comprises a floor body, the floor body comprises a middle foaming structure layer, a surface layer body and a bottom layer body, the middle foaming structure layer, the surface layer body and the bottom layer body are co-extruded together, the performance of the floor body is obviously improved, the bottom of the floor body is provided with a high-silence mechanism, and the surface of the floor body is provided with a waterproof protection mechanism. The application solves the problems that the current SPC (Stone Plastic Composite) floor has large density, heavy weight and high transportation cost; moreover, the application can greatly reduce the density of the SPC floor by improving a novel foaming system, optimizing the proportion of resin powder and calcium carbonate and improving a pressing mold; therefore, the application has the advantages of SPC and realizes material lightening, the product is pressed on the basis of lightening, and the product is endowed with higher commercial value.

Description

Technical Field

[0001] This invention relates to the field of LSPC molded flooring technology, specifically to an LSPC molded flooring. Background Technology

[0002] LSPC molded flooring, also known as lightweight stone crystal flooring, is based on the original SPC stone crystal flooring. Through innovative technology, the ABA co-extruded layer is structurally upgraded, making it lighter. It has the characteristics of lighter weight, high stability and excellent performance. However, the existing LSPC molded flooring still has some shortcomings in use. In order to meet the needs of the market, there is a need for a new type of LSPC molded flooring.

[0003] Currently, SPC flooring has a high density and weight, resulting in high transportation costs. Moreover, existing LSPC molded flooring does not provide sufficient waterproof protection during use, failing to prevent water intrusion and offering inadequate protection for the flooring structure. In addition, existing LSPC molded flooring does not provide adequate sound insulation, thus failing to effectively absorb noise and provide a quieter user environment. Summary of the Invention

[0004] The purpose of this invention is to provide an LSPC molded flooring that solves the problems mentioned in the background art, such as insufficient waterproof protection and poor sound insulation performance of LSPC molded flooring.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an LSPC molded floor, comprising a floor body, the floor body comprising an intermediate foamed structural layer, a surface layer and a bottom layer, wherein the intermediate foamed structural layer, the surface layer and the bottom layer are co-extruded together, significantly improving the performance of the floor body, the bottom of the floor body is provided with a high-quietness mechanism, and the surface of the floor body is provided with a waterproof protection mechanism.

[0006] Preferably, the waterproof protection mechanism consists of a first waterproof layer, a second waterproof layer, an upper waterproof layer, and a bottom waterproof layer, and the first waterproof layer is molded onto one side of the floor body through a molding process.

[0007] Preferably, the surface of the floor body away from the first waterproof layer is further molded with a second waterproof layer through a molding process. The second waterproof layer and the first waterproof layer work together to improve the waterproof performance of the floor body during assembly and use.

[0008] Preferably, an upper waterproof layer is molded on the surface at the bottom of the floor body, and a lower waterproof layer is molded on the surface at the bottom of the upper waterproof layer.

[0009] Preferably, the high noise reduction mechanism includes a noise reduction pad layer and an upper lightweight foam layer, wherein the upper lightweight foam layer and the floor body are extruded together, and the noise reduction pad layer and the floor body are extruded together.

[0010] Preferably, a sound-absorbing pad is provided below the upper lightweight foam layer, and a silent base pad is provided below the sound-absorbing pad. The silent pad layer, sound insulation pad, sound-absorbing pad and silent base pad are pressed into the surface of the bottom waterproof layer at the bottom of the floor body in one go by a mold.

[0011] The intermediate foamed structural layer (11) is made of LSPC lightweight foamed substrate. The specific processing method is as follows: 65.0-75.0% calcium carbonate, 18.0-25.0% polyvinyl chloride resin, 2.2-3.0% foaming regulator, 2.5-3.3% stabilizer, 0.10-0.20% plasticizer, 0.10-0.15% external lubricant, 0.1-0.40% ADC foaming agent, and 0.5-1.0% NC foaming agent are mixed evenly to obtain LSPC substrate mixture; the LSPC substrate mixture is placed in a mixing mill and mixed at a mixing temperature of 120℃ for a mixing time of 10-50 minutes to obtain LSPC substrate mixed rubber compound; finally, the LSPC substrate mixed rubber compound is placed in an extruder and the extrusion temperature is adjusted to 130℃-200℃ to obtain the intermediate foamed structural layer (11) by extrusion molding.

[0012] Compared with the prior art, the beneficial effects of the present invention are: the LSPC molded floor not only makes the LSPC molded floor more waterproof during use, preventing water intrusion and protecting the floor structure, but also effectively absorbs noise and provides a quieter use environment; By incorporating a waterproof protection mechanism, the molding process applies waterproof layer one and waterproof layer two to the surfaces of both sides of the flooring body, forming a unified structure. This ensures a tighter bond between the various layers of the waterproof protection mechanism and the flooring body. When the flooring body is assembled, the surfaces of waterproof layer two and waterproof layer one are in close contact, ensuring the waterproof performance of the flooring body during use. This effectively prevents water penetration, protects the flooring from water erosion, and improves the overall stability and lifespan of the flooring. The combined action of the upper and lower waterproof layers waterproofs the bottom of the flooring body, better protecting the flooring structure. This achieves the waterproof protection function of LSPC molded flooring, resulting in higher waterproof performance during use, preventing water intrusion and protecting the flooring structure. By incorporating a highly silent mechanism, LSPC molded flooring effectively absorbs noise from daily activities such as footsteps in apartment buildings and duplexes, which can be transmitted through the flooring and affect downstairs residents. The sound-absorbing pad and the upper lightweight foam layer work together to ensure the flooring's sound insulation while also improving its elasticity and cushioning, resulting in a more comfortable feel underfoot and reduced noise transmission. This effectively absorbs footstep sounds, preventing noise-related conflicts between neighbors and creating a quiet living environment. LSPC molded flooring achieves this high-silence function, allowing it to effectively absorb noise and provide a quieter environment. The weight is reduced by 20-30%, making handling easier, reducing the physical effort required for installation, and reducing the load-bearing requirements of the ground base; It has strong construction adaptability, is suitable for underfloor heating environments, has good thermal stability, and is not easily deformed or arched.

[0013] Therefore, this invention solves the problems of high density, heavy weight, and high transportation costs of current SPC flooring. At the same time, by improving the new foaming system, optimizing the ratio of resin powder and calcium carbonate, and improving the molding die, this invention can greatly reduce the density of SPC flooring. Thus, this invention has both the advantages of SPC and makes the material lighter. On the basis of lightweight, the product is molded, giving it higher commercial value. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the front cross-sectional structure of the present invention; Figure 3 This is a partially enlarged structural diagram of the assembled and used state of the present invention; Figure 4 This is a partial enlarged cross-sectional structural diagram of the surface layer of the present invention.

[0015] In the diagram: 1. Floor body; 11. Intermediate foam structure layer; 12. Surface layer; 13. Bottom layer; 2. Waterproof protection mechanism; 21. Waterproof layer one; 22. Waterproof layer two; 23. Upper waterproof layer; 24. Bottom waterproof layer; 3. High noise reduction mechanism; 31. Sound insulation pad; 32. Upper lightweight foam layer. Detailed Implementation

[0016] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention. Example

[0017] The present invention provides a structure for an LSPC molded floor, as follows: Figures 1 to 3 As shown, the floor body 1 includes an intermediate foamed structural layer 11, a surface layer 12, and a bottom layer 13. The intermediate foamed structural layer 11, the surface layer 12, and the bottom layer 13 are co-extruded together, which significantly improves the performance of the floor body 1.

[0018] Furthermore, such as Figure 3 As shown, a high-quietness mechanism 3 is provided at the bottom of the floor body 1. The high-quietness mechanism 3 includes a sound-absorbing pad 31 and an upper lightweight foam layer 32. The upper lightweight foam layer 32 and the floor body 1 are extruded, and the sound-absorbing pad 31 and the floor body 1 are extruded.

[0019] In practice, in residential environments such as apartment buildings and duplexes, noise such as footsteps generated by people's daily activities will be transmitted through the floor body 1, affecting downstairs residents. With the combined effect of the sound-absorbing pad 31 and the upper lightweight foam layer 32, the sound insulation effect of the floor body 1 can be guaranteed. It may also affect the elasticity and cushioning performance of the floor body 1 to a certain extent, making the foot feel more comfortable. At the same time, it reduces noise transmission and can effectively absorb the sound of footsteps when walking, avoid conflicts between neighbors due to noise, and create a quiet living environment, so as to achieve the high sound-absorbing function of LSPC molded floor.

[0020] Furthermore, such as Figure 2 and Figure 3 As shown, the surface of the floor body 1 is provided with a waterproof protection mechanism 2, which consists of a first waterproof layer 21, a second waterproof layer 22, an upper waterproof layer 23, and a bottom waterproof layer 24. The first waterproof layer 21 is molded on one side of the floor body 1 through a molding process, and the second waterproof layer 22 is also molded on the side of the floor body 1 away from the first waterproof layer 21 through a molding process. The second waterproof layer 22 and the first waterproof layer 21 work together to improve the waterproof performance of the floor body 1 when it is assembled and used. The upper waterproof layer 23 is molded on the surface at the bottom of the floor body 1, and the bottom waterproof layer 24 is molded on the surface at the bottom of the upper waterproof layer 23.

[0021] During implementation, the molding process molds waterproof layer 21 and waterproof layer 22 onto the surfaces of both sides of the floor body 1, making waterproof layer 21, waterproof layer 22 and the floor body 1 form an integral structure. This makes the bonding between the various layers of the waterproof protection mechanism 2 and the floor body 1 tighter. When the floor body 1 is assembled and used, the surfaces of waterproof layer 22 and waterproof layer 21 are in close contact, ensuring the waterproof performance of the floor body 1 during use. This effectively prevents water penetration, protects the floor from water erosion, and improves the overall stability and service life of the floor. With the combined action of the upper waterproof layer 23 and the lower waterproof layer 24, the bottom of the floor body 1 can be waterproofed, better protecting the floor structure and realizing the waterproof protection function of LSPC molded flooring. Example

[0022] This invention solves the problems of high density, heavy weight, and high transportation costs of current SPC flooring. At the same time, by improving the new foaming system, optimizing the ratio of resin powder and calcium carbonate, and improving the molding die, this invention can greatly reduce the density of SPC flooring. Therefore, this invention has both the advantages of SPC and makes the material lighter. On the basis of lightweight, the product is molded, giving it higher commercial value.

[0023] Specifically, the ratio of resin powder and calcium carbonate is optimized. The intermediate foamed structural layer (11) uses LSPC lightweight foamed substrate. The specific processing method is as follows: 65.0-75.0% calcium carbonate, 18.0-25.0% polyvinyl chloride resin, 2.2-3.0% foaming regulator, 2.5-3.3% stabilizer, 0.10-0.20% plasticizer, 0.10-0.15% external lubricant, 0.1-0.40% ADC foaming agent, and 0.5-1.0% NC foaming agent are mixed evenly by weight percentage to obtain LSPC substrate mixture; the LSPC substrate mixture is placed in a mixer for mixing at a mixing temperature of 120℃ for a mixing time of 10-50 minutes to obtain LSPC substrate mixed rubber; finally, LSPC... The substrate mixture is put into an extruder, and the extrusion temperature is adjusted to 130℃~200℃. The intermediate foamed structure layer (11) is obtained by extrusion molding. The optimized LSPC substrate can greatly reduce the density of SPC flooring, reduce the weight by 20-30%, make handling easier, reduce the physical labor consumption of installation, and reduce the load requirements of the ground base; it has strong construction adaptability, is suitable for underfloor heating environment, has good thermal stability, and is not easy to deform and arch.

[0024] Working principle: In use, the floor body 1 is first placed in the designated position. The molding process molds the first waterproof layer 21 and the second waterproof layer 22 onto the surfaces of both sides of the floor body 1, making the first waterproof layer 21, the second waterproof layer 22 and the floor body 1 form an integral structure. This makes the bonding between the various layers of the waterproof protection mechanism 2 and the floor body 1 tighter. When the floor body 1 is assembled and in use, the surfaces of the second waterproof layer 22 and the first waterproof layer 21 are in close contact, ensuring the waterproof performance of the floor body 1 during use. This effectively prevents water penetration, protects the floor from water erosion, and improves the overall stability and service life of the floor. With the combined action of the upper waterproof layer 23 and the lower waterproof layer 24, the bottom of the floor body 1 is waterproofed, better protecting the floor structure. This achieves the waterproof protection function of the LSPC molded floor, resulting in higher waterproof performance during use, preventing water intrusion and protecting the floor structure.

[0025] The surface layer 12 and the bottom layer 13 provide the floor body 1 with resistance to deformation and stability. The intermediate foamed structural layer 11 reduces the weight of the floor body 1, making it easier to transport and install. The intermediate foamed structural layer 11, the surface layer 12 and the bottom layer 13 enable the floor body 1 to remain stable under different environmental conditions, reduce deformation, better adapt to the underfloor heating environment, and ensure stable performance when the temperature changes.

[0026] The floor body 1 has a stable intermediate foam structure layer 11, which makes the floor body 1 lighter. It is an indispensable flooring material for high-rise buildings. The foam structure can reduce the weight of the floor and reduce the building load. The floor body 1 is lighter due to the intermediate foam structure layer 11, which makes it easier to handle and install, saves manpower and time costs, and can also reduce transportation costs. The surface body 12, intermediate foam structure layer 11 and bottom body 13 of the floor body 1 are pressed into bevels by one-time molding technology, which changes the shortcomings of ordinary laminate flooring splicing joints that are easy to wear, deform and warp. It also changes the problems of easy peeling, expansion and wear resistance of the edges and corners of simulated solid wood flooring, enhances the three-dimensional effect and has a realistic solid wood laying effect.

[0027] Subsequently, in residential environments such as apartment buildings and duplexes, noise such as footsteps generated by people's daily activities will be transmitted through the floor body 1, affecting downstairs residents. With the combined effect of the sound-absorbing pad 31 and the upper lightweight foam layer 32, the sound insulation effect of the floor body 1 can be guaranteed. It may also affect the elasticity and cushioning performance of the floor body 1 to a certain extent, making the foot feel more comfortable. At the same time, it reduces noise transmission and can effectively absorb the sound of footsteps when walking, avoiding conflicts between neighbors due to noise, creating a quiet living environment, so as to achieve the high sound-absorbing function of LSPC molded flooring. Thus, when using LSPC molded flooring, it can effectively absorb noise and provide a quieter use environment, ultimately completing the use of LSPC molded flooring and completing the short-term use.

[0028] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An LSPC molded floor, comprising a floor body (1), characterized in that: The floor body (1) includes an intermediate foam structure layer (11), a surface layer (12) and a bottom layer (13). The intermediate foam structure layer (11), the surface layer (12) and the bottom layer (13) are co-extruded together, which significantly improves the performance of the floor body (1). The bottom of the floor body (1) is provided with a high-quietness mechanism (3), and the surface of the floor body (1) is provided with a waterproof protection mechanism (2).

2. The LSPC molded flooring according to claim 1, characterized in that: The waterproof protection mechanism (2) consists of a first waterproof layer (21), a second waterproof layer (22), an upper waterproof layer (23), and a bottom waterproof layer (24). The first waterproof layer (21) is molded on one side of the floor body (1) by a molding process.

3. The LSPC molded flooring according to claim 1, characterized in that: The surface of the floor body (1) away from the first waterproof layer (21) is also molded with a second waterproof layer (22) by a molding process. The second waterproof layer (22) and the first waterproof layer (21) work together to improve the waterproof performance of the floor body (1) when it is assembled and used.

4. The LSPC molded flooring according to claim 1, characterized in that: The bottom surface of the floor body (1) is molded with an upper waterproof layer (23), and the bottom surface of the upper waterproof layer (23) is molded with a lower waterproof layer (24).

5. The LSPC molded flooring according to claim 1, characterized in that: The high-quietness mechanism (3) includes a sound-absorbing pad (31) and an upper lightweight foam layer (32). The upper lightweight foam layer (32) and the floor body (1) are extruded together. The sound-absorbing pad (31) and the floor body (1) are extruded together.

6. The LSPC molded flooring according to claim 4, characterized in that: A sound-absorbing pad (33) is provided below the upper lightweight foam layer (32), and a silent bottom pad (34) is provided below the sound-absorbing pad (33). The silent pad layer (31), sound insulation pad (32), sound-absorbing pad (33) and silent bottom pad (34) are pressed onto the surface of the bottom waterproof layer (24) at the bottom of the floor body (1) in one go by a mold.

7. The LSPC molded flooring according to claim 4, characterized in that: The intermediate foamed structural layer (11) is made of LSPC lightweight foamed substrate, and the specific processing method is as follows: Step 1: Mix 65.0-75.0% calcium carbonate, 18.0-25.0% polyvinyl chloride resin, 2.2-3.0% foaming regulator, 2.5-3.3% stabilizer, 0.10-0.20% plasticizer, 0.10-0.15% external lubricant, 0.1-0.40% ADC foaming agent, and 0.5-1.0% NC foaming agent evenly according to weight percentage to obtain LSPC substrate mixture; Step 2: Place the LSPC substrate mixture in a mixer and mix to obtain the LSPC substrate compound. Step 3: Finally, the LSPC substrate mixture is put into an extruder and extruded to obtain the intermediate foamed structure layer (11).

8. The LSPC molded flooring according to claim 7, characterized in that: The intermediate foamed structural layer (11) is made of LSPC lightweight foamed substrate. The specific processing method is as follows: the mixing temperature in step two is 120℃ and the mixing time is 10min~50min.

9. The LSPC molded flooring according to claim 7, characterized in that: In step three, the extrusion temperature is adjusted to 130℃~200℃.

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