Wafer reliability parallel test apparatus

Abstract

The application discloses a wafer reliability parallel test device and relates to the technical field of semiconductor testing. The wafer reliability parallel test device comprises a box body, a damping assembly, a plurality of first test stations and at least one first microscope. The damping assembly is arranged on the box body and is used for damping the box body. The plurality of first test stations are arranged in the box body and are used for performing parallel reliability tests on a plurality of dies obtained by dividing a whole wafer. The at least one first microscope is arranged on the box body and is used for observing the plurality of dies on the plurality of first test stations. The wafer reliability parallel test device performs parallel reliability tests on the plurality of dies through the plurality of first test stations, and thus the test efficiency is remarkably improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and more specifically, to a parallel testing device for wafer reliability. Background Technology

[0002] Semiconductor wafers are the carriers of integrated circuits. Their manufacturing process is complex, and even minor deviations in any step can introduce potential defects into the wafer, ultimately affecting the performance and reliability of the chip product. Therefore, in applications with high reliability requirements such as automotive electronics and aerospace, wafer-level reliability testing (such as high-temperature aging testing) has become a critical step in ensuring the long-term stable operation of chips. Through this testing, defective chips can be screened out before packaging, ensuring the performance and safety of the end product.

[0003] Currently, mainstream wafer reliability testing employs a serial mode, where a single probe stage sequentially tests each die on the wafer. During testing, a probe is positioned and contacts a die, power is applied, test conditions (such as high temperature or voltage stress) are applied, electrical parameters are monitored and recorded, and then the probe is lifted before moving to the next die and repeating the process. Since testing a single die can take hours to tens of hours, and a single wafer contains hundreds to thousands of dies, the overall testing cycle increases exponentially, resulting in extremely low efficiency and hindering semiconductor production capacity improvement and cost control. Summary of the Invention

[0004] The purpose of this application is to provide a parallel wafer reliability testing device that significantly improves testing efficiency by setting up multiple first test stations to perform parallel reliability testing on multiple dies.

[0005] The embodiments of this application are implemented as follows: A first aspect of this application provides a parallel wafer reliability testing device, including a housing, a vibration damping assembly, multiple first test stations, and at least one first microscope. The vibration damping assembly is disposed on the housing for vibration damping. The multiple first test stations are disposed within the housing for performing parallel reliability testing on multiple dies obtained by dividing a whole wafer. At least one first microscope is disposed on the housing for observing the multiple dies at the multiple first test stations. This parallel wafer reliability testing device significantly improves testing efficiency by setting up multiple first test stations to perform parallel reliability testing on multiple dies.

[0006] As one possible implementation, multiple first test stations are arranged in a stepped manner.

[0007] As one possible implementation, it further includes at least one second test station and at least one second microscope. The at least one second test station is disposed in the housing for performing reliability testing on the entire wafer, and the at least one second microscope is disposed on the housing for observing the entire wafer at the at least one second test station.

[0008] In one possible implementation, multiple first test stations are staggered in a vertical direction perpendicular to the plane where the second test station is located and / or in a horizontal direction parallel to the plane where the second test station is located.

[0009] In one possible implementation, the housing includes a first housing and a second housing disposed on the first housing, with a portion of the second testing station disposed within the first housing and another portion disposed within the second housing, and the first testing station disposed within the second housing.

[0010] As one possible implementation, each of the first test stations includes a needle station body with a first opening at the front end. The needle station body is provided with a horizontal displacement adjustment component, a horizontal angle adjustment component, a vertical displacement adjustment component, a heating component, and a retractable storage component stacked sequentially from bottom to top in the vertical direction. The retractable storage component is used to carry the die. The top of the needle station body is provided with at least one second opening and at least one needle holder. The position of the second opening corresponds to the position of the retractable storage component. The probe of the needle holder passes through the second opening and is positioned towards the side close to the retractable storage component.

[0011] As one possible implementation, multiple first test stations are arranged coplanarly.

[0012] In one possible implementation, each of the first test stations includes a first tray for carrying the die, a first triaxial adjustment device for driving the first tray to move, and a first probe assembly for testing the die.

[0013] As one possible implementation, multiple first test stations are distributed on opposite sides of the second test station; or, multiple first test stations are distributed on the same side of the second test station.

[0014] In one possible implementation, the second test station includes a second tray for carrying the entire wafer, a second three-axis adjustment device for driving the second tray to move, and a second probe assembly for testing the entire wafer.

[0015] The beneficial effects of the embodiments of this application include: This parallel wafer reliability testing equipment includes a housing, vibration damping components, multiple first test stations, and at least one first microscope. The vibration damping components are mounted on the housing to reduce vibration. The multiple first test stations are located inside the housing and are used to perform parallel reliability testing on multiple dies obtained from a single wafer. At least one first microscope is mounted on the housing to observe the multiple dies at the multiple first test stations. This parallel wafer reliability testing equipment achieves parallel and synchronous testing of multiple dies through multiple first test stations, breaking the traditional die-by-die testing mode, significantly shortening the overall wafer testing cycle and increasing semiconductor production capacity. By using vibration damping components to reduce vibration in the housing, vibration interference generated when multiple first test stations are working simultaneously is effectively suppressed, ensuring the stability of the testing process and the accuracy of the test results. By integrating multiple first test stations and at least one first microscope into the housing, centralized observation of multiple dies is achieved, improving operational convenience. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is one of the structural schematic diagrams of the parallel wafer reliability testing equipment provided in the first embodiment of this application; Figure 2 A second schematic diagram of the structure of the parallel wafer reliability testing equipment provided in the first embodiment of this application; Figure 3 for Figure 2 The front view; Figure 4 for Figure 3 The left view; Figure 5 This is a schematic diagram of the structure of the first test station and the second test station provided in the first embodiment of this application; Figure 6 This is a schematic diagram of the structure of the first test station and the second test station provided in the second embodiment of this application; Figure 7 This is a schematic diagram of the structure of the first test station and the second test station provided in the third embodiment of this application; Figure 8 This is a schematic diagram of the structure of the first test station and the second test station provided in the fourth embodiment of this application; Figure 9 This is one of the structural schematic diagrams of the first test station provided in the embodiments of this application; Figure 10 This is the second schematic diagram of the structure of the first test station provided in the embodiments of this application; Figure 11 This is a schematic diagram of the structure of the second test station provided in an embodiment of this application.

[0018] Icons: 100 - Parallel wafer reliability testing equipment; 10 - Second testing station; 11 - Second storage tray; 12 - Second three-axis adjustment device; 13 - Second probe assembly; 20 - First testing station; 201 - Probe station body; 2001 - Base; 2002 - Platform; 2003 - Column; 2004 - First opening; 2005 - Second opening; 202 - Horizontal displacement adjustment assembly; 203 - Horizontal angle adjustment assembly; 204 - Vertical displacement adjustment assembly; 205 - Heating assembly; 206 - Retractable storage assembly; 207 - Probe holder; 2071 - Probe; 21 - First storage tray; 22 - First three-axis adjustment device; 23 - First probe assembly; 30 - First housing; 40 - Second housing; 51 - Second microscope; 52 - First microscope; 60 - Shock absorption assembly; x - Horizontal direction; z - Vertical direction. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.

[0020] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Please refer to the reference. Figures 1 to 7This application provides a parallel wafer reliability testing device 100, including a housing, a vibration damping assembly 60, multiple first test stations 20, and at least one first microscope 52. The vibration damping assembly 60 is disposed on the housing for vibration damping. The multiple first test stations 20 are disposed inside the housing for performing parallel reliability testing on multiple dies obtained by dividing a whole wafer. At least one first microscope 52 is disposed on the housing for observing the multiple dies on the multiple first test stations 20. This parallel wafer reliability testing device 100 significantly improves testing efficiency by setting up multiple first test stations 20 to perform parallel reliability testing on multiple dies.

[0023] It should be noted that, as Figures 1 to 5 As shown, the wafer reliability parallel testing equipment 100 includes a housing, a vibration damping component 60, multiple first testing stations 20, and at least one first microscope 52. The multiple first testing stations 20 serve as the "core of parallel die testing," simultaneously undertaking the reliability testing of multiple dies obtained after wafer dicing. This breaks the traditional serial testing mode of testing multiple dies one by one, enabling simultaneous testing of multiple dies and significantly improving testing efficiency. By setting up the vibration damping component 60 to dampen the housing, vibration interference generated when multiple first testing stations 20 work simultaneously is effectively suppressed, ensuring the stability of the testing process and the accuracy of the test results. For example, the vibration damping component 60 can be set around the bottom of the housing, and can be a vibration damping pad or vibration damping casters, etc. By integrating multiple first testing stations 20 and at least one first microscope 52 into the housing, centralized observation of multiple dies is achieved, improving operational convenience.

[0024] As one possible implementation, the wafer reliability parallel testing equipment 100 further includes at least one second test station 10 and at least one second microscope 51. The at least one second test station 10 is disposed in the housing and is used to perform reliability testing on the entire wafer. The at least one second microscope 51 is disposed on the housing and is used to observe the entire wafer on the at least one second test station 10.

[0025] It should be noted that, as Figures 1 to 5 As shown, the parallel wafer reliability testing equipment 100 also includes at least one second testing station 10 and at least one second microscope 51. The second testing station 10, as the "whole wafer testing core", is responsible for the reliability testing of the whole wafer, adapts to the overall testing needs before the wafer is diced, and can ensure wafer-level reliability testing. By integrating at least one second testing station 10 and at least one second microscope 51 into the housing, the observation of the whole wafer is also realized at the same time, which improves the convenience of operation.

[0026] The microscope is a high-magnification observation component capable of high-definition magnified observation of the entire wafer at the second testing station 10 and multiple dies at the first testing station 20. It can achieve the following functions: First, it assists in the precise alignment of the probe assembly with the test points on the wafer or die, improving the accuracy of the testing operation; second, it monitors the state of the wafer or die in real time during the testing process, promptly detecting anomalies such as die breakage or probe misalignment, allowing for immediate stopping and handling of the test to prevent the escalation of anomalies and the invalidation of test results; third, it records visual information during the testing process, facilitating subsequent traceability of test results and improving the efficiency of troubleshooting and the traceability of the testing process. The microscope can be designed with multiple lenses (e.g., the number of microscopes corresponds one-to-one with the number of stations) or movable lenses (e.g., the microscope is mounted on a support frame that can move along three axes) to achieve full coverage observation of all testing stations, allowing for both fixed observation of a specific station and roving observation of all stations, adapting to different layouts and testing requirements.

[0027] This application adopts an integrated design, integrating two different testing functions into the same device. It abandons the traditional mode of requiring multiple devices to complete wafer-wide testing and individual die testing separately. It can realize the multi-functionality of "whole wafer testing - multi-die parallel testing" and avoid the problems of space occupation and testing equipment cost caused by equipment dispersion. This helps to improve testing efficiency, simplify the testing process, and solve the technical problems of long cycle and limited production capacity of traditional serial testing.

[0028] The wafer reliability parallel testing equipment 100 provided in this application realizes parallel synchronous testing of multiple dies through multiple first testing stations 20, changing the traditional multi-die sequential testing mode, significantly shortening the overall testing cycle of a single wafer, effectively improving semiconductor production capacity, and solving the problem of capacity constraints in the testing process. On this basis, this application adopts a single device that combines whole wafer testing and multi-die parallel testing functions, which can simultaneously meet the needs of whole wafer testing and multi-die testing. One integrated testing device replaces the traditional multiple dedicated testing devices, greatly reducing equipment procurement investment. At the same time, the integrated layout avoids the dispersed occupation of multiple devices, saves space in the semiconductor production line, and reduces equipment operation and maintenance and site usage costs. In this way, the wafer reliability parallel testing equipment 100 can retain wafer-level testing of whole wafers to ensure overall performance screening before packaging, and can also realize parallel testing of dies to accurately screen unqualified dies, meeting the requirements of high reliability fields such as automotive electronics and aerospace for full-process wafer testing, and ensuring the performance and safety of terminal chip products.

[0029] As one possible implementation method, such as Figures 1 to 5 As shown, in some embodiments, multiple first test stations 20 are arranged in a stepped manner.

[0030] It should be noted that the multiple first test stations 20 are arranged in a stepped manner, meaning that the multiple first test stations 20 are distributed in a staggered, stepped manner along the vertical z-direction or the inclined direction. This creates a height difference between the first test stations 20, avoiding the problems of mutual obstruction and overlapping operating spaces that would occur if they were arranged on the same plane. The core is to achieve a more reasonable layout of the first test stations 20 within the limited internal space of the equipment, increasing the station density. The stepped arrangement ensures that each first test station 20 is independent, preventing interference between testing operations and material loading / unloading due to dense arrangement, while maximizing the use of space in the vertical z-direction or inclined direction of the equipment. More first test stations 20 can be added according to testing needs, further improving the scale and efficiency of parallel testing.

[0031] The wafer reliability parallel testing equipment 100 provided in this application arranges multiple first test stations 20 in a stepped manner, utilizing the space in the vertical z-direction or inclined direction of the equipment to replace a single planar space. Without increasing the overall size of the equipment, more first test stations 20 can be arranged, supporting more dies to be tested simultaneously, further improving testing efficiency. Moreover, the first test stations 20 are arranged at different heights, without mutual obstruction of planar space. Each first test station 20 has an independent operation and testing space, which can ensure that the loading and unloading of dies, probe contact, test monitoring and other operations do not interfere with each other, ensuring the smooth progress of parallel testing. In addition, the stepped arrangement allows operators to clearly observe the testing status of each first test station 20 without frequently adjusting the observation angle, which is conducive to real-time monitoring of the testing process and timely handling of test anomalies, improving the convenience of operation and maintenance. Furthermore, the number of stations, height difference and spacing of the stepped arrangement can be flexibly adjusted according to the number and specifications of dies tested, adapting to the testing needs of dies after wafer dicing of different sizes, improving the adaptability of the equipment.

[0032] For example, such as Figures 1 to 4 As shown, in this embodiment, multiple first test stations 20 are divided into multiple rows (e.g., four rows) along a vertical direction z perpendicular to the plane where the second test station 10 is located. The first row of first test stations 20 can be directly set on a support platform inside the housing, and the support platform is provided with a stepped structure. The second row of first test stations 20, the third row of first test stations 20, and the fourth row of first test stations 20 are respectively set on three steps of the stepped structure. Alternatively, in other embodiments, the support platform as a whole can be a stepped structure with multiple steps, and the multiple rows of first test stations 20 can be respectively set on multiple steps of the stepped structure, so that the multiple first test stations 20 are arranged in a stepped layout, thereby arranging more first test stations 20 in a limited space.

[0033] Along the vertical direction z, the height of the multiple rows of first test stations 20 is roughly distributed within the height range that a user can reach when their arms are extended upwards and downwards while standing. The height difference (i.e., step height) between two adjacent first test stations 20 must ensure that the operability of each first test station 20 is not affected. For example, the height difference between two adjacent first test stations 20 is at least half the overall height of a single first test station 20. For instance, if the overall height of a single first test station 20 is 160mm, the height difference between two adjacent first test stations 20 is at least 80mm, so that the user can reach into the rear row of first test stations 20 through the gap between two adjacent first test stations 20 to operate.

[0034] As one possible implementation method, such as Figures 5 to 7 As shown, multiple first test stations 20 are staggered in the vertical direction z, which is perpendicular to the plane where the second test station 10 is located, and / or in the horizontal direction x, which is parallel to the plane where the second test station 10 is located.

[0035] It should be noted that in some embodiments, such as Figure 5 As shown, multiple first test stations 20 are staggered in the vertical direction z, which is perpendicular to the plane where the second test station 10 is located, so that the first test stations 20 have virtually no projection overlap in the vertical direction z, thus minimizing longitudinal obstruction; in other embodiments, such as Figure 6 As shown, multiple first test stations 20 are staggered in the horizontal direction x, parallel to the plane where the second test station 10 is located. This staggered distribution of the first test stations 20 on the plane of the second test station 10 utilizes the space between the stations. Along the horizontal direction x, the distance difference between two adjacent first test stations 20 must ensure that the operability of each first test station 20 is not affected. For example, the operating knobs of the adjustment devices of each first test station 20 need to be exposed. Figure 7 As shown, the two can also be implemented in combination. The core is to further rationalize the internal three-dimensional space of the equipment based on the stepped layout, so as to achieve a high-density, interference-free layout of the workstations.

[0036] The staggered arrangement of multiple first test stations 20 in the vertical z-direction and / or horizontal x-direction fully utilizes the three-dimensional space of the equipment, allowing for more first test stations 20 to be arranged within the same equipment volume, supporting larger-scale parallel die testing and further improving testing efficiency. Furthermore, the staggered design in the vertical z-direction and horizontal x-direction ensures that the first test stations 20 do not obstruct each other in any direction, allowing operators to observe the testing status of each first test station 20 from all angles. Operations such as probe contact and die placement have no blind spots, facilitating precise operation and anomaly troubleshooting. In addition, the staggered layout makes the airflow and temperature field distribution inside the equipment more uniform, avoiding problems such as excessively high local temperatures and poor airflow caused by densely packed stations, ensuring consistent testing conditions at each station, and improving the accuracy and stability of reliability testing.

[0037] As one possible implementation method, such as Figures 1 to 5 As shown, for the stepped layout, the box includes a first box 30 and a second box 40 disposed on the first box 30. A part of the second test station 10 is disposed inside the first box 30 and another part is disposed inside the second box 40. The first test station 20 is disposed inside the second box 40.

[0038] It should be noted that the enclosure includes a first enclosure 30 and a second enclosure 40. The first enclosure 30 serves as the non-test functional enclosure of the equipment, used to house the non-test core components of the second test station 10 (such as drive, transmission, control, and power supply components), and undertakes the functions of power output and command control of the equipment, which is the basis for the operation of the equipment. The second enclosure 40 is stacked on top of the first enclosure 30 and serves as the core test enclosure of the equipment. It is the main working space for reliability testing, which not only houses the test core components of the second test station 10 (such as the second probe assembly 13), but also integrates all the stepped arrangement of the first test stations 20, providing a sealed and controllable test environment (temperature, humidity, vacuum, etc.) for the reliability testing of wafers and chips, and isolating them from external environmental interference.

[0039] For the stepped layout, a hierarchical box structure is adopted. The core is to maximize the use of the vertical space (z) of the equipment, replacing the planar structural layout. Without increasing the horizontal footprint of the equipment, sufficient three-dimensional space is reserved for the first test station 20 in the stepped arrangement to meet the compact space requirements of the semiconductor production line. At the same time, the second test station 10 is divided into cross-box partitions with "non-test components placed in the first box 30 and test components placed in the second box 40". This allows the second box 40 to focus on testing work, realizing functional zoning and spatial layering. It avoids interference from non-test components to the test environment and test operations, thereby improving the stability and purity of the test environment and ensuring the accuracy of test results.

[0040] Furthermore, by placing all the first test stations 20 arranged in a stepped manner within the second enclosure 40, the three-dimensional space of the second enclosure 40 can be fully utilized to achieve a staggered layout, avoiding mutual obstruction and interference between multiple first test stations 20, and adapting to the structure of the upper and lower enclosures. At the same time, the airtightness of the second enclosure 40 allows all first test stations 20 to be in the same controllable test environment, ensuring the consistency of conditions for multi-die parallel testing. Moreover, by precisely controlling the test conditions such as temperature and humidity inside the second enclosure 40, the entire wafer test and multi-die parallel testing are conducted in the same test environment, avoiding test result deviations caused by environmental differences and improving the consistency and comparability of test data.

[0041] As one possible implementation method, such as Figure 9 and Figure 10 As shown, for the stepped layout, each first test station 20 includes a needle station body 201 with a first opening 2004 at the front end. The needle station body 201 is provided with a horizontal displacement adjustment component 202, a horizontal angle adjustment component 203, a vertical displacement adjustment component 204, a heating component 205 and a retractable storage component 206 arranged in sequence from bottom to top in the vertical direction. The retractable storage component 206 is used to carry the die. The top of the needle station body 201 is provided with at least one second opening 2005 and at least one needle holder 207. The position of the second opening 2005 corresponds to the position of the retractable storage component 206. The probe 2071 of the needle holder 207 passes through the second opening 2005 and is positioned towards the side close to the retractable storage component 206.

[0042] It should be noted that the needle station body 201, as the main body for bearing and protecting the entire first test station 20, can be in the form of a frame structure. For example, the needle station body 201 includes a base 2001, a platform 2002, and a column 2003 connecting the base 2001 and the platform 2002. The base 2001, platform 2002, and column 2003 together form a certain degree of enclosed space, which can play a role in dust prevention, interference prevention, and physical protection for the internal precision adjustment components, heating components 205, and transmission structure, ensuring the stability and reliability of the test process.

[0043] The needle station body 201 has a first opening 2004 at its front end. On the one hand, it provides a movement channel for the extension and retraction of the retractable storage component 206, making it convenient for users to pick up and put down the crystals, ensuring sufficient operating space and smooth picking up and putting down. On the other hand, it reserves operating space for the adjustment knobs, operating levers and other exposed operating structures of the horizontal displacement adjustment component 202, the horizontal angle adjustment component 203 and the vertical displacement adjustment component 204. Users can complete multi-dimensional precise adjustments without disassembling the outer shell or increasing the overall volume, taking into account both operational convenience and structural compactness.

[0044] like Figure 9and Figure 10 As shown, the needle station body 201 adopts a vertically stacked layout. The horizontal displacement adjustment component 202, the horizontal angle adjustment component 203, the vertical displacement adjustment component 204, the heating component 205, and the retractable storage component 206 are stacked sequentially on the base 2001 from bottom to top. Each functional component is arranged vertically to minimize the horizontal space occupied, fundamentally reducing the overall footprint of the needle station. This stacked arrangement creates a nested and compact structure between the components, reducing ineffective space and redundant dimensions, and achieving a miniaturized and thinner design for the needle station. It is particularly suitable for the dense arrangement of multiple needle stations in high-density parallel testing equipment.

[0045] like Figure 10 As shown, platform 2002 serves as the top support structure of probe station body 201. On one hand, it fixes the probe holder 207, providing a stable mounting reference for probe 2071, reducing intermediate transition structures, ensuring the relative positional accuracy between probe 2071 and the die, improving the positional stability and repeatability of probe 2071, and ensuring consistent test results. On the other hand, it encloses the upper part of probe station body 201, forming a complete frame structure. At least one second opening 2005 is provided on platform 2002. The second opening 2005 corresponds vertically to the retractable storage component 206, providing clearance for probe 2071 to contact the die downwards, allowing probe 2071 to directly contact the die surface for electrical signal transmission and reliability testing. It also provides a channel for heat transfer from heating component 205 and visual alignment observation by first microscope 52. The size and position of the second opening 2005 are precisely designed to minimize the opening area while ensuring clearance requirements, thereby improving the overall rigidity and dustproof effect of probe station body 201.

[0046] As one possible implementation, in other embodiments, such as Figure 8 As shown, multiple first test stations 20 are arranged in a coplanar manner.

[0047] It should be noted that the multiple first test stations 20 are arranged coplanarly, meaning that all the first test stations 20 are set up in the same horizontal plane, with a uniform spacing between them. The core design logic is to pursue the regularity of the station layout and the consistency of operation, adapting to scenarios such as batch loading and unloading, and automated operation, and facilitating the use of robotic arms, production lines, and other automated equipment to complete the die loading and unloading and testing operations. The regular coplanar layout ensures that the operating height and test condition adjustment benchmarks of each first test station 20 are completely consistent, eliminating the need to adjust the operating or equipment parameters for different first test stations 20. At the same time, it provides convenience for the motion path design of automated equipment, which can effectively improve the automation level of die loading and unloading and testing, and further improve testing efficiency.

[0048] The wafer reliability parallel testing equipment 100 provided in this application can also arrange multiple first test stations 20 in a coplanar manner, so that each first test station 20 is on the same plane with uniform spacing. This facilitates standardized path design for equipment such as robotic arms and automated loading and unloading devices, enabling full automation of die loading and unloading and testing operations. This significantly improves the automation level and operational efficiency of testing, making it suitable for large-scale mass production testing scenarios. Furthermore, the operating height and adjustment reference of all first test stations 20 are exactly the same, so operators do not need to adjust their operating posture or equipment parameters for different first test stations 20. Equipment debugging only requires one basic setup. Precise calibration can adapt to all first test stations 20, reducing the difficulty of equipment debugging and daily operation; in addition, the coplanar arrangement of each first test station 20 is well-organized, and the installation position of the test components is uniformly high. Daily maintenance, component replacement, and troubleshooting of the equipment can be carried out according to a unified standard procedure, without the need for special operations for stations of different heights, thus improving the efficiency of equipment operation and maintenance; and the distribution of environmental conditions such as temperature field, airflow, and electric field within the same plane is more uniform, and the test environment of each first test station 20 is minimally different, which can effectively ensure the consistency of test conditions when testing multiple chips in parallel, further improving the accuracy and comparability of test results.

[0049] As one possible implementation method, such as Figure 8 As shown, for the coplanar layout, the housing includes a first housing 30 and a second housing 40 disposed on the first housing 30. A portion of the second test station 10 is disposed inside the first housing 30 and another portion is disposed inside the second housing 40. A portion of the first test station 20 is disposed inside the first housing 30 and another portion is disposed inside the second housing 40.

[0050] It should be noted that the enclosure includes a first enclosure 30 and a second enclosure 40. The first enclosure 30 serves as the non-testing functional enclosure of the equipment, undertaking non-testing functions such as power, drive, and control. The second enclosure 40 is stacked on top of the first enclosure 30 and serves as the core test enclosure of the equipment, providing a controllable test working environment and accommodating the core test components of the second test station 10 and the first test station 20.

[0051] Similar to the aforementioned embodiments, the second test station 10 is divided into cross-box partitions where "non-test components are placed in the first box 30 and test components are placed in the second box 40". This allows the second box 40 to focus on testing, achieving functional zoning and spatial layering. This avoids non-test components from interfering with the test environment and test operations, thereby improving the stability and purity of the test environment and ensuring the accuracy of test results.

[0052] Unlike the previous embodiments, the core testing components of the first test stations 20 arranged in a coplanar manner are concentrated in the second housing 40, ensuring that all first test stations 20 are on the same horizontal testing plane, meeting the benchmark uniformity requirement for automated operation; the non-testing components of the first test stations 20 are placed in the first housing 30, avoiding interference from the transmission and drive components to the testing plane of the second housing 40, making the spacing design of the coplanar first test stations 20 more flexible and the layout more regular, forming a synergy with the automation adaptation requirements of coplanar arrangement.

[0053] For the coplanar layout, on the one hand, all non-test components such as the drive, transmission, and power supply of the second test station 10 and the first test station 20 are concentrated in the first housing 30, which completely simplifies the internal structure of the second housing 40. This allows the second housing 40 to retain only the core test components, ensuring the regularity of the coplanar arrangement of the first test station 20 and preventing non-test components from occupying test plane space. On the other hand, all the core test components of the dual-station (such as probe assemblies) are placed in the second housing 40, ensuring that the coplanar arrangement of the first test stations 20 is in the same test plane and the same controllable environment, adapting to the benchmark unification requirements of automated testing. Thirdly, a hierarchical housing structure is adopted, continuing the design that utilizes the vertical z-space, to achieve a high degree of integration of the dual stations within a compact structure, improving the space utilization of the equipment.

[0054] As one possible implementation method, such as Figure 8 As shown, for the coplanar layout, the first test station 20 includes a first tray 21 for carrying the die, a first triaxial adjustment device 22 for driving the first tray 21 to move, and a first probe assembly 23 for testing the die.

[0055] It should be noted that the first test station 20 includes a first placement tray 21, a first three-axis adjustment device 22, and a first probe assembly 23. The first placement tray 21 and the first three-axis adjustment device 22 of each first test station 20 can be shared, allowing simultaneous adjustment of the position and test parameters of each first test station 20 according to the testing requirements of the die, thereby improving adjustment and testing efficiency. The first placement tray 21 serves as the core support for the die, adapting to the size of multiple dies and providing a stable placement base to ensure the die's position is fixed during testing. The first three-axis adjustment device 22 serves as the core of position adjustment, driving the first placement tray 21 to move precisely in the X, Y, and Z axes, achieving fine-tuning of the die's position and enabling the first probe assembly 23 to accurately contact the test points of the die. The first probe assembly 23 serves as the core of test execution, achieving power-on, signal acquisition, parameter monitoring, and other test operations through physical contact between the probe and the test points of the die, making it a key component for completing reliability testing. A heating element can also be integrated into the first placement tray 21 to provide the required temperature environment for high-temperature aging testing.

[0056] As one possible implementation method, such as Figures 1 to 5 As shown, in some embodiments, multiple first test stations 20 are distributed on opposite sides of the second test station 10.

[0057] It should be noted that multiple first test stations 20 are evenly or as needed distributed to the left and right sides of the second test station 10. This utilizes the space on both sides of the second test station 10 to achieve the station layout, avoiding the equipment's center of gravity shift caused by a single-sided arrangement. It also makes the station distribution more symmetrical, improving equipment operational stability and increasing the number of first test stations 20, further enhancing testing efficiency and adapting to the needs of large-scale die testing. This distribution method can be arbitrarily combined with a stepped or coplanar layout; that is, the first test stations 20 on both sides of the second test station 10 can adopt either a stepped or coplanar layout, flexibly adapting to the equipment's space size and testing quantity requirements, further enhancing the flexibility of the solution.

[0058] As one possible implementation method, such as Figure 8 As shown, in some other embodiments, multiple first test stations 20 are distributed on the same side of the second test station 10.

[0059] It should be noted that all first test stations 20 are concentrated on one side (e.g., left or right) of the second test station 10, which is beneficial for the compactness of the equipment layout and the concentration of operations. This is suitable for scenarios with limited production line space and a relatively small number of test chips, while also allowing operators to complete all test operations on a single operating surface, improving operational convenience. This distribution method can be combined with a stepped layout or a coplanar layout. Depending on the space available, a stepped layout (utilizing the vertical z-space) or a coplanar layout (utilizing the horizontal x-space) can be selected to achieve a reasonable parallel test layout within a compact space.

[0060] As one possible implementation method, such as Figure 11 As shown, whether it is a stepped layout or a coplanar layout, the second test station 10 includes a second tray 11 for carrying the entire wafer, a second three-axis adjustment device 12 for driving the second tray 11 to move, and a second probe assembly 13 for testing the entire wafer.

[0061] It should be noted that the second test station 10 is equipped with an independent second placement tray 11, a second three-axis adjustment device 12, and a second probe assembly 13. The test operations of the second test station 10 and the first test station 20 are independent of each other. The position and test parameters can be adjusted individually according to the test requirements of the wafer or die, ensuring the independence and accuracy of parallel testing. The second placement tray 11, as the core of wafer support, adapts to the size of the entire wafer, providing a stable placement base and ensuring the wafer's position is fixed during testing. The second three-axis adjustment device 12, as the core of position adjustment, can drive the second placement tray 11 to move precisely in the X, Y, and Z axes, achieving fine-tuning of the wafer's position and enabling the second probe assembly 13 to accurately contact the test points on the wafer. The second probe assembly 13, as the core of test execution, achieves test operations such as power-on, signal acquisition, and parameter monitoring through physical contact between the probes and the test points on the wafer, and is a key component for completing reliability testing. A heating element can also be integrated on the second placement tray 11 to provide the required temperature environment for high-temperature aging tests.

[0062] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0063] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A parallel testing device for wafer reliability, characterized in that, The device includes a housing, a shock-absorbing assembly, multiple first test stations, and at least one first microscope. The shock-absorbing assembly is disposed on the housing for shock absorption. The multiple first test stations are disposed inside the housing for parallel reliability testing of multiple dies obtained by dividing a whole wafer. At least one first microscope is disposed on the housing for observing the multiple dies on the multiple first test stations.

2. The parallel wafer reliability testing equipment according to claim 1, characterized in that, Multiple first test stations are arranged in a stepped manner.

3. The parallel wafer reliability testing equipment according to claim 2, characterized in that, It also includes at least one second test station and at least one second microscope. The at least one second test station is disposed in the housing and is used to perform reliability testing on the entire wafer. The at least one second microscope is disposed on the housing and is used to observe the entire wafer at the at least one second test station.

4. The parallel wafer reliability testing equipment according to claim 3, characterized in that, Multiple first test stations are staggered in a vertical direction perpendicular to the plane where the second test station is located and / or in a horizontal direction parallel to the plane where the second test station is located.

5. The parallel wafer reliability testing equipment according to claim 3, characterized in that, The enclosure includes a first enclosure and a second enclosure disposed on the first enclosure. A portion of the second testing station is disposed within the first enclosure and another portion is disposed within the second enclosure. The first testing station is disposed within the second enclosure.

6. The parallel wafer reliability testing equipment according to claim 1, characterized in that, Each of the first test stations includes a needle station body with a first opening at the front end. The needle station body is provided with a horizontal displacement adjustment component, a horizontal angle adjustment component, a vertical displacement adjustment component, a heating component, and a retractable storage component stacked sequentially from bottom to top in the vertical direction. The retractable storage component is used to carry the die. The top of the needle station body is provided with at least one second opening and at least one needle holder. The position of the second opening corresponds to the position of the retractable storage component. The probe of the needle holder passes through the second opening and is positioned towards the side close to the retractable storage component.

7. The parallel wafer reliability testing equipment according to claim 1, characterized in that, Multiple first test stations are arranged in a coplanar manner.

8. The parallel wafer reliability testing equipment according to claim 7, characterized in that, Each of the first test stations includes a first tray for carrying the die, a first triaxial adjustment device for driving the first tray to move, and a first probe assembly for testing the die.

9. The parallel wafer reliability testing equipment according to claim 3, characterized in that, Multiple first test stations are distributed on opposite sides of the second test station; or, multiple first test stations are distributed on the same side of the second test station.

10. The parallel wafer reliability testing equipment according to claim 3, characterized in that, The second test station includes a second tray for supporting the entire wafer, a second three-axis adjustment device for driving the second tray to move, and a second probe assembly for testing the entire wafer.

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